JP6520143B2 - Laminate, method of manufacturing conductive substrate using the same, method of manufacturing electronic device, and transfer tool - Google Patents

Description

  The present invention relates to a laminate having a porous conductive layer, a method of producing a conductive substrate using the same, a method of producing an electronic device, and a transfer tool used for the method of producing a conductive substrate.

  Conventionally, as a method of forming a metal layer as a conductive layer or a decoration layer on a substrate, for example, a method using a transfer sheet is known (see Patent Documents 1 to 5).

  Patent Document 1 proposes a method of forming an antenna terminal portion using a metal deposition layer transfer sheet in which a protective layer, a metal deposition layer, and an adhesive layer are laminated on a base material. In the case of the metal deposition layer as described in Patent Document 1, heat resistance is required for the underlayer of the metal deposition layer. Therefore, when an inexpensive general-purpose plastic film such as a PET film is used as the substrate, there is a problem that the film forming process, the metal type, the film thickness, etc. are limited because the heat resistance is low. The heat resistance is secured by forming an. On the other hand, although a highly heat resistant substrate such as a polyimide film, a PEN film, or a glass film can be used as a substrate, these substrates are expensive and suitable as a substrate of a transfer sheet to be peeled and removed. It can not be said that

  Patent Document 2 has a release sheet as a substrate, an insulator layer provided on the release sheet, and a metal foil disposed in contact with the insulator layer, and the metal foil is used for the release sheet. A metal foil sheet for transfer is proposed which is attached by the attraction of static electricity generated between it and the insulator layer. In the case of the metal foil as in Patent Document 2, there is a problem that the adhesion with the substrate is low, and the adhesion is secured by forming a resin layer such as an insulator layer on the substrate.

  Patent Document 3 further uses a thermal transfer film having a resin film, a metal foil provided on the surface of the resin film via an adhesive, and a thermosetting adhesive applied on the metal foil. Production of a metal foil fuse in which a metal foil is transferred onto an insulating substrate via a thermosetting adhesive using a transfer mold having a convex fuse element pattern, into a pattern shape of the transfer mold fuse element The law is proposed. Also in this case, the adhesion of the resin film and the metal foil is secured by providing the metal foil on the surface of the resin film via an adhesive.

  By the way, the foil cutting property is also required for the transfer sheet. However, since the metal deposition layer and the metal foil are ductile, burrs are generated at the time of transfer, and there is a problem that the foil cutting property is poor. In addition, in the metal deposition layer, crystal grains may grow large, and in such a case, the foil-breakability naturally deteriorates. Although a method has been proposed in which the transfer sheet is sandwiched between molds having asperities, stressed and cut, and then transfer is performed in order to improve foil breakage, the process becomes complicated.

  In general, metal has a high thermal conductivity, so heat is easily diffused in a metal vapor deposition layer or metal foil, energy required for transfer tends to be large, and the shape of the transfer sheet may be distorted.

  Also, when transferring a transfer sheet to a transfer target, in order to adhere the metal deposition layer or metal foil to the transfer target, for example, when using a heat seal agent such as a thermoplastic resin as an adhesive layer, thermoplasticity It heats above the glass transition temperature of resin. At this time, the adhesion between the transfer target and the metal deposition layer or metal foil is larger than the adhesion between the base material and the metal deposition layer or metal foil, whereby thermal transfer is realized. In this case, since there is a limit in adjusting the above-mentioned adhesion with the heat sealing agent alone, the adhesion between the material to be transferred and the metal deposition layer or metal foil is determined by the adhesion of the substrate to the metal deposition layer or metal foil Although it has been proposed to form fine irregularities such as roughening the contact surface of the metal deposition layer or the metal foil with the adhesive layer in order to increase the force, for example, the process becomes complicated.

  In Patent Document 4, using a donor element in which a light absorption layer and a metal nanoparticle layer are laminated on a donor substrate as a base material, the donor element and the receiving substrate are disposed in contact, and a laser is irradiated from the donor element side. A method has been proposed to form a pattern of electrical conductors on a receiving substrate by annealing and transferring the metal nanoparticle layer. However, because this method uses metal nanoparticles as the conductive material, the electrical resistance at the interface between particles is a problem, and in order to achieve the desired conductivity, annealing the metal nanoparticles at high temperature is necessary. Therefore, the substrate needs to withstand the high heat of laser annealing, the substrate is limited, and it becomes difficult to use inexpensive general-purpose plastic films. In addition, it is necessary to use a highly heat-resistant and expensive base material as the base material to be peeled and removed, which increases the cost.

On the other hand, according to Patent Document 5, using a transfer sheet in which a sintered body layer of metal ultrafine particles is formed on a base material, the metal ultrafine particles are baked on each other on a transfer substrate having an adhesive layer formed on the surface. A method has been proposed for forming a wiring pattern consisting of a body layer. In this method, by using metal ultrafine particles, sintering can be performed even at a relatively low temperature.
However, the conductivity may be lowered by oxidation of the metal ultrafine particles, and the conductivity may be lowered when transferring the sintered body layer of the metal ultrafine particles to the transfer substrate.

  As described above, in the method of forming a metal layer using a transfer sheet, the transfer step is complicated, and there is a concern that the conductivity of the metal layer may be lowered by the heat at the time of transfer, and the transfer sheet may be distorted. Therefore, there is a need for a transfer sheet capable of forming a metal layer exhibiting good conductivity by a simple method.

Although it is not invention regarding a transfer sheet, in patent document 6, the invention arrange | positioned on a circuit board by heating a tape-like adhesive using a transfer tool is disclosed. Further, Patent Document 6 discloses that, when a plurality of circuit boards are attached to each other by dispersing conductive particles in the above-mentioned adhesive, the wirings are conducted. However, the adhesive of Patent Document 6 has high resistance, and it is difficult to transfer the adhesive to a transferee and use it as a conductive layer such as wiring.
Moreover, although it is not invention regarding a transfer sheet, in patent document 7, in the transfer tool used for a correction tape, it replaces with a correction tape and applies an anisotropic conductive tape to a circuit board, and anisotropic conduction is carried out on a circuit board. An invention for forming a film is disclosed. However, the anisotropic conductive film in Patent Document 7 exhibits conductivity by, for example, thermocompression bonding of a pair of circuit substrates via the anisotropic conductive film, and is formed on the circuit substrate. It is difficult to use the anisotropic conductive film itself as a conductive layer such as wiring in a circuit board.
Therefore, Patent Documents 6 and 7 disclose nothing about forming a pattern of a conductive layer using a transfer tool.

JP, 2007-324641, A Japanese Patent Application Laid-Open No. 7-101198 Unexamined-Japanese-Patent No. 5-314888 JP 2008-541481 gazette JP 2004-247572 A Unexamined-Japanese-Patent No. 2004-210524 JP, 2009-238676, A

  The present invention has been made in view of the above problems, and is a laminate capable of transferring a porous conductive layer excellent in foil severability and transferability and having good conductivity, and a conductive substrate using the same. A main object of the present invention is to provide a transfer tool used in a manufacturing method, a method of manufacturing an electronic device, and a method of manufacturing the conductive substrate.

  In order to achieve the above object, the present invention is characterized by having a substrate, a porous conductive layer formed on the substrate, and a pressure-sensitive adhesive layer formed on the porous conductive layer. To provide a laminate.

In the present invention, the resin contained in the pressure sensitive adhesive layer can be introduced into the pores of the porous conductive layer. Therefore, the adhesiveness of a porous conductive layer and a pressure sensitive adhesive layer can be improved, and the outstanding transferability can be obtained.
Further, in the present invention, since a pressure sensitive adhesive can be used as the pressure sensitive adhesive layer, no heating is required when transferring the laminate onto the substrate to be transferred, and the porous conductive layer is oxidized. It is possible to suppress the decrease in conductivity, distortion of the laminate, and the like.
Further, in the present invention, since the porous conductive layer is provided, brittleness is imparted, and excellent foil breakage and resolution can be obtained. In addition, since the porous conductive layer can be formed by sintering metal particles at a low temperature, it is less likely to damage the base material, and it is not necessary to use a base material having high heat resistance, and a base having low heat resistance Materials can also be used.
Moreover, an electroconductive base material can be easily produced by using the laminated body of this invention.

  In the said invention, it is preferable that the said base material is a resin base material. As described above, in the present invention, a substrate with low heat resistance can also be used, and it is very useful in that an inexpensive general purpose plastic resin substrate can be used.

  In the said invention, it is preferable that the said porous conductive layer contains a metal. This is because metal particles can be used to sinter at a lower temperature to form a porous conductive layer.

  In the above-mentioned invention, a protective layer may be formed between the above-mentioned substrate and the above-mentioned porous conductive layer. After transfer, the porous conductive layer can be protected by a protective layer. In addition, the porous conductive layer can be insulated by providing the insulating protective layer.

  In the said invention, it is preferable that the form of the said laminated body is strip | belt shape. This is because the pattern of the pressure sensitive adhesive layer and the porous conductive layer can be easily formed on the transferred substrate.

  The present invention is characterized by having a preparation step of preparing the above-mentioned laminate, and a transfer step of pressing and transferring the pressure-sensitive adhesive layer and the porous conductive layer of the above-mentioned laminate on the substrate to be transferred. Provided is a method of producing a conductive substrate.

  In the present invention, since the above-mentioned laminate is used, it is excellent in foil breakage, resolution and transferability. In addition, it is possible to obtain a porous conductive layer having good conductivity even after transfer. Furthermore, the conductive substrate can be easily produced.

  In the above invention, in the transfer step, it is preferable that the pattern of the pressure-sensitive adhesive layer and the porous conductive layer be pressed and transferred onto the transferred substrate using the strip-like laminate. A conductive substrate having a pattern of a porous conductive layer for a transferred substrate can be easily produced.

  In the above invention, in the transfer step, the first pressure-sensitive adhesive layer and the first pressure-sensitive adhesive layer and the first pressure-sensitive adhesive layer are transferred by pressing and transferring the pressure-sensitive adhesive layer and the porous conductive layer of the laminate on the transfer target substrate. Forming a laminated portion in which the porous conductive layer and the second pressure-sensitive adhesive layer and the second porous conductive layer are laminated, and further performing at least one of heat treatment and pressure treatment on the laminated portion The method may further include a connecting step of electrically connecting the first porous conductive layer and the second porous conductive layer. Since the first porous conductive layer and the second porous conductive layer in the region pressurized in the above-mentioned stacked portion can be electrically connected, the stacked porous conductive layers in the conductive substrate can be easily made to each other Can be conducted in the following manner.

  The present invention provides a method for producing an electronic device, comprising the step of producing a conductive substrate by the method of producing a conductive substrate described above.

  In the present invention, since the conductive substrate is produced by the method for producing a conductive substrate described above, a porous conductive layer having good conductivity can be formed. Further, for example, in the case of forming a pattern of a porous conductive layer, a pattern of high resolution can be formed. Moreover, when a strip-shaped laminate is used, the pattern of the porous conductive layer can be easily formed.

  The present invention is a transfer tool used for pressing and transferring the pressure-sensitive adhesive layer and the porous conductive layer of the strip-like laminate on a substrate to be transferred, using the above-mentioned laminate. An unrolling reel for unwinding the laminate with the pressure-sensitive adhesive layer of the laminate facing outside, the pressure-sensitive adhesive layer of the laminate and the porous conductive layer extracted from the unwinding reel A transfer head for transferring by pressure onto the transfer target substrate, a take-up reel for taking up the pressure-sensitive adhesive layer and the substrate after transfer of the porous conductive layer, the take-up reel and the take-up reel And an interlocking mechanism for interlockingly rotating the same.

  In the present invention, by using the transfer tool of the present invention, a pattern of a porous conductive layer can be easily formed on the above-mentioned transfer base using the strip-like laminate in the above-mentioned method of manufacturing a conductive base. can do.

  The laminate of the present invention is excellent in foil-breakability and transferability, and exhibits the effect of being able to transfer a porous conductive layer with good conductivity.

It is a schematic sectional drawing which shows an example of the laminated body of this invention. It is process drawing which shows an example of the manufacturing method of the electroconductive base material of this invention. It is process drawing which shows the other example of the manufacturing method of the electroconductive base material of this invention. It is process drawing which shows the other example of the manufacturing method of the electroconductive base material of this invention. It is a schematic sectional drawing which shows the laminated body of this invention, and the other example of a conductive base material. It is a schematic sectional drawing which shows the laminated body of this invention, and the other example of a conductive base material. It is process drawing which shows the other example of the manufacturing method of the electroconductive base material of this invention. It is a schematic sectional drawing which shows the laminated body of this invention, and the other example of a conductive base material. It is process drawing which shows the other example of the manufacturing method of the electroconductive base material of this invention. It is a figure explaining the pattern of the porous conductive layer in the transcription | transfer material of Example 5 and Example 6. FIG.

  The details of the laminate, the method of producing a conductive substrate, the method of producing an electronic device, and the transfer tool of the present invention will be described below.

A. Laminate The laminate of the present invention is characterized by having a substrate, a porous conductive layer formed on the substrate, and a pressure-sensitive adhesive layer formed on the porous conductive layer. It is.

The laminate of the present invention will be described with reference to the drawings.
FIG. 1 is a schematic cross-sectional view showing an example of the laminate of the present invention. As illustrated in FIG. 1, the laminate 1 includes a substrate 2, a porous conductive layer 3 formed on the substrate 2, and a pressure-sensitive adhesive layer 4 formed on the porous conductive layer 3. Have.

  FIGS. 2 (a) to 2 (c) are process drawings showing an example of a method for producing a conductive substrate using the laminate of the present invention, which is an example using the laminate illustrated in FIG. First, as shown to Fig.2 (a), the laminated body 1 and the to-be-transferred base material 11 are prepared. Next, as shown in FIG. 2B, the pressure-sensitive adhesive layer 4 of the laminate 1 and the transfer receiving substrate 11 are disposed in contact with each other, and pressure bonding is performed from the laminate 1 side. Thereafter, as shown in FIG. 2 (c), the base material 2 is peeled off. As a result, in the pressure-bonded area, the pressure-sensitive adhesive layer 4 and the porous conductive layer 3 are transferred to the transferred substrate 11, and the conductive substrate 10 is obtained.

  Fig.3 (a)-(c) is process drawing which shows the other example of the manufacturing method of the electroconductive base material which used the laminated body of this invention, and is an example using the laminated body shown in FIG. First, as shown to Fig.3 (a), the laminated body 1 and the to-be-transferred base material 11 are prepared. Next, as shown in FIG. 3 (b), the pressure-sensitive adhesive layer 4 of the laminate 1 and the transferred substrate 11 are disposed in contact with each other, and pressure bonding is performed from the laminate 1 side. At this time, partial pressing is performed by the uneven plate 12 or the like. Thereafter, as shown in FIG. 3C, the substrate 2 side is peeled off. Thereby, in the pressure-bonded area, the pressure sensitive adhesive layer 4 and the porous conductive layer 3 are transferred to the transferred substrate 11, and the conductive substrate 10 having the pattern of the pressure sensitive adhesive layer 4 and the porous conductive layer 3 can get.

Fig.4 (a), (b) is process drawing which shows the other example of the manufacturing method of the electroconductive base material which used the laminated body of this invention. 4A and 4B show an example using a transfer tool having a strip-shaped laminate. Moreover, FIG.4 (b) is the schematic plan view which looked at A part of Fig.4 (a) from the porous conductive layer 3 side. First, as shown to Fig.4 (a), the strip | belt-shaped laminated body 1 and the to-be-transferred base material 11 are prepared. Next, the transfer tool 20 is used to place the pressure-sensitive adhesive layer 4 of the laminate 1 in contact with the transferred substrate 11 and move the transfer tool 20 in a predetermined direction while pressing from the laminate 1 side. Do. At this time, the pressure sensitive adhesive layer 4 and the porous conductive layer 3 are transferred onto the transferred substrate 11 along the moving direction of the transfer tool 20, and the substrate 2 is peeled off. Thereby, as shown to FIG. 4 (a), (b), the pattern of the pressure sensitive adhesive layer 4 and the porous conductive layer 3 can be transcribe | transferred on the to-be-transferred base material 11. FIG.
The transfer tool 20 will be described later.

  In the present invention, since the resin contained in the pressure-sensitive adhesive layer can be introduced into the pores of the porous conductive layer, not only the surface area to which the porous conductive layer and the pressure-sensitive adhesive layer adhere is increased. The anchor effect can enhance the adhesion of the porous conductive layer and the pressure sensitive adhesive layer. Therefore, when the laminate of the present invention is transferred to a transfer-receiving substrate, the pressure-sensitive adhesive layer and the porous conductive layer can be transferred well onto the transfer-receiving substrate, and excellent transferability can be obtained. it can.

  Further, as described later, in the porous conductive layer, the metal particles are sintered and fused to each other, so that the region in which the component derived from the adhesive layer is intruded in the pores of the porous conductive layer is also conductive. Contribute to Therefore, the adhesion to the adhesive layer can be enhanced without reducing the conductivity.

  In the present invention, since a pressure-sensitive adhesive can be used as the pressure-sensitive adhesive layer, heating is not necessary when transferring the laminate onto the substrate to be transferred. It is possible to suppress a decrease in conductivity due to oxidation, distortion of the laminate, and the like.

  Further, in the present invention, since the porous conductive layer is porous and therefore provided with brittleness, unlike the conventional vapor deposition layer, the occurrence of burrs during transfer is small and large crystal grains are not included. Therefore, good foil breakage can be obtained. Furthermore, as illustrated in FIGS. 3 (a) to 3 (c), when the pattern of the pressure-sensitive adhesive layer and the porous conductive layer of the laminate of the present invention is transferred to a transfer substrate, the transfer is performed with high resolution. be able to.

  Here, it is known that metal particles sinter at a low temperature when their particle diameter is reduced. In the present invention, the porous conductive layer is formed by sintering metal particles at a low temperature by utilizing such a property that when such metal particles are nanoparticulated, they are sintered at a temperature significantly lower than the melting point of the metal particles. It can be formed. Therefore, there is no need to use a highly heat-resistant substrate with little damage to the substrate, and a low heat-resistant substrate can also be used. In particular, it is very useful in that inexpensive general-purpose plastic resin substrates such as polyethylene terephthalate can be used.

  In the present invention, the porous conductive layer can be formed, for example, by applying a metal particle dispersion containing metal particles on a substrate and baking it, and it has a good adhesion to the substrate. A conductive layer can be obtained. Therefore, it is not necessary to form another layer on the substrate or to apply a surface treatment to improve the adhesion.

  In addition, since the porous conductive layer can be formed on the transferred substrate by transferring the laminate of the present invention to the transferred substrate, a porous conductive layer is conventionally formed as the transferred substrate. Substrates that have been difficult to do can also be used. Therefore, it is possible to obtain an inexpensive general-purpose plastic resin substrate such as polyethylene terephthalate or a conductive substrate in which a porous conductive layer is formed on a paper substrate or the like. Furthermore, it is also possible to form a porous conductive layer on a three-dimensional object to be transferred.

  Moreover, since the porous conductive layer in the present invention is porous, it can exhibit high resistance to bending. Therefore, when a base material has flexibility, it can be transferred to a receiving base material, giving a high curvature to a layered product.

  Hereinafter, each structure in the laminated body of this invention is demonstrated.

1. Porous Conductive Layer The porous conductive layer in the present invention is formed on a substrate.

  Here, the porous conductive layer refers to a conductive layer having a large number of pores, and the surface area is larger than that of a non-porous conductive layer having the same volume.

As a conductive material which comprises a porous conductive layer, a metal and a metal oxide can be mentioned, for example. The conductive material constituting the porous conductive layer may be one type or two or more types.
Among them, metals are preferred. This is because metal particles can be sintered at lower temperatures to form a porous conductive layer.

Examples of the metal include gold, silver, copper, nickel, platinum, palladium, molybdenum, aluminum, antimony, tin, chromium, indium, gallium, germanium, zinc, titanium, lead and the like. Among them, silver and copper are preferable in terms of conductivity and cost. The metal may be one type or two or more types.
Examples of metal oxides include indium tin oxide and antimony-doped tin oxide.

  The shape of the pores in the porous conductive layer is not particularly limited as long as the component derived from the adhesive layer can be introduced into at least a part of the pores. It is preferable that at least the surface on the adhesive layer side of the porous conductive layer has a communicating hole in which a large number of holes are connected to each other.

The porosity of the porous conductive layer is not particularly limited as long as conductivity and adhesion can be appropriately adjusted to a compatible range. Specifically, the porosity of the porous conductive layer is preferably in the range of 5% to 50%, and more preferably in the range of 10% to 45%, and particularly preferably 15% to 40%. It is preferable to be within the range of If the porosity is too large, the adhesion between the porous conductive layer and the substrate may be reduced. Moreover, when the porosity is too small, the above-mentioned effect by the component derived from an adhesion layer getting into the inside of the hole of a porous conductive layer may not fully be acquired.
In addition, the porosity of a porous conductive layer represents the part in which the material which comprises a porous conductive layer does not exist, and the part in which the component derived from an adhesive layer is mixed is also contained.

The porosity can be confirmed from a scanning electron microscope (SEM) image of the cross section of the porous conductive layer before the formation of the adhesive layer. Specifically, the area of the hole and the area of the porous conductive layer are respectively calculated from the obtained SEM image, and the area of the hole is divided by the area of the porous conductive layer to obtain the porosity in the above cross section. be able to. In addition, the porosity is calculated from the porous conductive layer excluding the substrate, and the pores at the interface between the substrate and the porous conductive layer are included toward the porous conductive layer.
The porosity can also be confirmed from a scanning electron microscope (SEM) image of the cross section of the laminate. Specifically, the area of the hole, the area of the component derived from the adhesive layer, and the area of the porous conductive layer are calculated from the obtained SEM image, and the area of the pore and the area of the component derived from the adhesive layer are calculated. The porosity in the cross section can be determined by dividing the total by the area of the porous conductive layer.
According to the size of the laminate, the porosity is appropriately determined similarly for a plurality of cross sections, and the average value is taken as the porosity of the porous conductive layer.
The porosity can be appropriately adjusted according to the particle diameter of the metal particles used in the metal particle dispersion, the type of the dispersing agent, the firing conditions, and the like in the formation method of the porous conductive layer described later.

  The porous conductive layer 3 may be formed on the entire surface of the substrate 2 as illustrated in FIG. 1 and is formed in a pattern on the substrate 2 as illustrated in FIG. 5A. It is also good. When the porous conductive layer 3 is formed in a pattern on the substrate 2 as illustrated in FIG. 5 (a), the laminate 1 is not partially transferred, as shown in FIG. 5 (b). The pattern of the porous conductive layer 3 can be transferred onto the transfer substrate 11 as illustrated.

  The thickness of the porous conductive layer is about 0.01 μm to 50 μm, preferably in the range of 0.05 μm to 10 μm, and particularly preferably in the range of 0.1 μm to 5 μm.

As a method of forming the porous conductive layer, a method of coating a metal particle dispersion containing metal particles on a substrate and baking it is used.
In the specification of the present application, metal particles include particles in an alloy state, particles of a metal compound, and the like in addition to particles in a metal state.

As a metal particle, it can select suitably from metal particles which produce conductivity after calcination, and can be used.
As a metal which comprises metal particle, gold, silver, copper, nickel, platinum, palladium, molybdenum, aluminum, antimony, tin, chromium, indium, gallium, germanium, zinc, titanium, lead etc. are mentioned, for example. Among them, silver and copper are preferable in terms of conductivity and cost. The metal constituting the metal particles may be one type or two or more types. Moreover, you may use that by which 2 or more types of metals form the core-shell structure, and the thing in which the surface of the particle | grains of a metal state is oxidized or nitrided etc are used. The metal particles may be oxidized at the surface or oxidized to the inside.
Moreover, as a metal compound which comprises the particle | grains of a metal compound, a metal oxide, a metal nitride, a metal hydride, a metal hydroxide, an organic metal compound etc. are mentioned, for example. It is preferable that these metal compounds are decomposed at the time of firing to be in a metal state. For example, particles of metal compounds which exhibit conductivity by reduction, specifically particles of metal compounds such as cuprous oxide, cupric oxide, silver oxide, copper nitride, copper hydride and the like can be mentioned. Moreover, as a metal oxide, an indium tin oxide, an antimony dope tin oxide, etc. are mentioned, for example.
The metal particles may be used alone or in combination of two or more.
Among them, particles in the metallic state are preferred. This is because particles in the metallic state can be sintered at lower temperatures to form a porous conductive layer.

  The metal particles are preferably metal nanoparticles. That is, the porous conductive layer is preferably a sintered body of metal nanoparticles. When a metal particle dispersion containing metal nanoparticles is applied and fired to form a porous conductive layer, the pore diameter and the crystal grain size can be controlled to a range suitable for foil breakage. .

The average particle diameter of the metal particles is preferably in the range of 1 nm to 200 nm, and more preferably in the range of 2 nm to 150 nm, particularly preferably in the range of 2 nm to 100 nm. When the average particle diameter is in the above range, the dispersion stability of the metal particle dispersion used when forming the porous conductive layer is good, and the conductivity when forming the porous conductive layer is good, In addition, the melting point is maintained low, sufficient sintering is possible, and high conductivity is obtained.
Here, the average particle size of the metal particles is the average primary particle size of metal particles in the metal particle dispersion described later, and can be measured from an observation image by a transmission electron microscope.

  As a method of preparing metal particles, for example, physical methods obtained by grinding metal powder or metal oxide powder by mechanochemical method etc .; such as CVD method, vapor deposition method, sputtering method, thermal plasma method, laser method Chemical dry methods include thermal decomposition methods, chemical reduction methods, electrolytic methods, ultrasonic methods, laser ablation methods, supercritical fluid methods, chemical wet methods such as microwave synthesis methods and the like.

  The resulting metal particles are converted to a metal particle dispersion, so that the metal particles may be treated with a water-soluble polymer compound such as polyvinyl pyrrolidone or a protective agent such as a graft copolymer compound, a surfactant, a metal or metal oxide. It is preferable to coat with a compound having a thiol group, an amino group, a hydroxyl group or a carboxyl group which interacts with the substance. Further, depending on the method of synthesizing metal particles, the thermal decomposition product or oxide of the raw material may protect the particle surface and contribute to the dispersibility. In the case of a wet method such as a thermal decomposition method or a chemical reduction method, a reducing agent or the like may act as a protective agent for metal particles as it is. Also, in order to enhance the dispersion stability of the metal particle dispersion, the surface treatment of the metal particles is carried out, or a dispersant comprising a polymer compound, an ionic compound, a surfactant, etc. is added to the metal particle dispersion. May be

  The dispersion medium used for the metal particle dispersion is not particularly limited as long as the metal particles can be dispersed, and, for example, water or an organic solvent can be used. Examples of the organic solvent include alcohols, ketones, esters, ethers, aliphatic hydrocarbons, alicyclic hydrocarbons, aromatic hydrocarbons and the like.

  Further, if necessary, a viscosity modifier, a surface tension modifier, a stabilizer or the like may be added to the metal particle dispersion.

  The solid content concentration of the metal particle dispersion is preferably in the range of 5% by mass to 95% by mass, and more preferably in the range of 10% by mass to 90% by mass, particularly in the range of 15% by mass to 85% by mass Is preferred. When the solid concentration is in the above range, sufficient conductivity is obtained, the viscosity is sufficiently low, and application of the metal particle dispersion to a substrate is easy.

When applying the metal particle dispersion onto the substrate, the metal particle dispersion may be applied over the entire surface of the substrate, or the metal particle dispersion may be applied in a pattern on the substrate.
As a method of applying the metal particle dispersion onto the substrate, for example, gravure printing, screen printing, spray coating, spin coating, comma coating, bar coating, knife coating, die coating, offset printing, flexographic printing, inkjet printing, dispenser Printing etc. can be mentioned. In the case of applying the metal particle dispersion in a pattern on the substrate, gravure printing, flexographic printing, screen printing, and inkjet printing are preferable from the viewpoint that fine patterning can be performed.

  After application of the metal particle dispersion, drying may be performed by a conventional method. For example, the drying method which heats at about 80 to 140 degreeC temperature for about 0.1 to 20 minutes using a common oven etc. is mentioned. The thickness of the coated film after drying can be controlled by adjusting the coating amount, the average particle diameter of the metal particles, etc., but is usually about 0.01 μm to 100 μm, preferably 0.1 μm to 50 μm. It is in the range.

As a method of baking the coating film of the metal particle dispersion liquid, any method that can sinter metal particles may be used, and a general baking method can be applied. For example, methods using heat treatment, light treatment, plasma treatment, and the like can be mentioned. By firing the coating, a porous conductive layer made of a sintered body of metal particles is obtained.
Examples of the heat treatment include hot plate heating, hot air heating, and a hot press method using a heat plate or a heat roll.
Examples of the light processing include laser processing, ultraviolet lamp processing, infrared lamp processing, far infrared lamp processing, flash light lamp processing and the like.
Plasma treatment is a treatment that ionizes a gas such as hydrogen, carbon monoxide, ammonia, or alcohol that exhibits reducibility to form a plasma state, and generates a highly reactive active species. For example, electron cyclotron resonance (ECR) plasma And capacitively coupled plasma, inductively coupled plasma, atmospheric pressure plasma, microwave plasma, surface wave plasma generated by application of microwave energy, and the like. Among them, surface wave plasma treatment is preferable.
In addition, said baking method can be used combining 2 or more types.

  The microwave surface wave plasma has characteristics of high plasma density and low electron temperature, and can bake the coating film at a low temperature and in a short time, and form a dense and smooth porous conductive layer. Can. The surface wave plasma is irradiated with plasma having a uniform density in the plane with respect to the surface to be treated. As a result, as compared with other baking methods, non-uniform films are less likely to be formed, such as sintering of metal particles partially progressing in the plane, and grain growth can be prevented. Dense and smooth film is obtained. In addition, since it is not necessary to provide an electrode in the in-plane processing chamber, contamination of impurities derived from the electrode can be prevented, and damage to the processing material due to abnormal discharge can be prevented. Furthermore, when using a resin base material, damage to the resin base material is small, and damage to other layers is also small.

  In addition, microwave surface wave plasma is suitable for enhancing the adhesion of the porous conductive layer to the resin substrate. The reason for this is presumed to be that microwave surface wave plasma is likely to generate polar functional groups such as hydroxyl groups and carboxyl groups at the interface between the base and the porous conductive layer. In particular, when a plasma generated under a reducing gas atmosphere is used for a polyester substrate, the plasma of a gas having a reducing gas reacts with the ester bond of the substrate, and the interface side of the substrate is changed. It is inferred that adhesion occurs at the interface between the porous conductive layer and the substrate due to the occurrence of quality and generation of a large number of highly polar reactive groups. Therefore, as compared with the conventional method in which the substrate surface is roughened by plasma treatment etc. in advance to improve the adhesion to the porous conductive layer as in the prior art, the substrate and the porous conductive film are also electrically conductive. It is excellent in the point with high adhesiveness with a layer.

  In addition, about the conditions of microwave surface wave plasma, the conditions of Unexamined-Japanese-Patent No. 2010-86825 can be applied, for example.

As an atmosphere at the time of baking, it selects suitably according to the kind of conductive material which comprises a porous conductive layer.
When forming the porous conductive layer containing metal, it is preferable to set it as the atmosphere of an inert gas or reducing gas, and it is preferable to set it as a reducing gas especially. In the case of a reducing gas atmosphere, oxides present on the surface of the metal particles can be reduced and removed to form a highly conductive porous conductive layer. Therefore, when forming the porous conductive layer which is a porous layer containing a metal, the metal particle in which the surface is oxidized, and the metal particle in which the inside is oxidized can be used as a metal particle.

As a reducing gas, hydrogen, carbon monoxide, ammonia, and these mixed gas etc. are mentioned, for example. Among them, hydrogen gas is preferable. Hydrogen gas is suitable for the removal of the organic substance adhering to the metal particle surface.
The reducing gas may be mixed with an inert gas such as nitrogen, helium, argon, neon, krypton or xenon. In this case, there are effects such as easy generation of plasma.

  On the other hand, in the case of forming a porous conductive layer containing a metal oxide, an atmosphere containing an inert gas such as nitrogen or argon and oxygen as needed may be used.

Furthermore, in the case of forming a porous conductive layer containing copper, a method using hydrogen plasma or nitrogen plasma is preferable. In particular, by using hydrogen plasma, a specific resistance of about 3 × 10 ⁻⁶ Ω · cm to 3 × 10 ⁻⁵ Ω · cm can be obtained, and a porous conductive layer having good adhesion to a substrate is formed. Because you can do it.

The firing temperature may be any temperature at which the metal particles can be sintered, and is appropriately selected according to the type of the metal particles, the particle diameter, the firing method, and the like. Among them, the firing temperature is preferably equal to or lower than the heat resistance temperature of the substrate, and in the case of using silver particles as an example, the range of 100 ° C. to 150 ° C. is preferable.
The firing time is appropriately selected according to the type of metal particles, the firing method, and the like. For example, when firing silver particles by heat treatment, the firing time is preferably in the range of 10 minutes to 120 minutes, and more preferably in the range of 15 minutes to 40 minutes. Further, for example, when the copper particles are fired by hydrogen plasma, the firing time is preferably in the range of 1 minute to 10 minutes, and more preferably in the range of 2 minutes to 5 minutes.

2. Pressure-Sensitive Adhesive Layer The pressure-sensitive adhesive layer in the present invention is formed on the above-mentioned porous conductive layer. The pressure-sensitive adhesive layer has a function of adhering the porous conductive layer and the transferred substrate when the laminate of the present invention is transferred to the transferred substrate.

  Examples of the material of the pressure-sensitive adhesive layer include a pressure-sensitive adhesive, and a photosensitive resin whose adhesiveness or adhesiveness is reduced by light irradiation.

The pressure-sensitive adhesive is not particularly limited as long as it can bond the porous conductive layer and the transferred substrate, and is appropriately selected according to the type of transferred substrate to which the laminate is transferred. Ru. For example, a common pressure sensitive adhesive used for transfer foil can be used. The pressure-sensitive adhesive may be used alone or in combination of two or more.
As the pressure-sensitive adhesive, any pressure-sensitive adhesive or adhesive may be developed, and a curable resin partially cured or a crosslinked rubber material may be used.
Specific examples of the pressure-sensitive adhesive include acrylic resin, urethane resin, amide resin, epoxy resin, styrene-butadiene copolymer, natural rubber, casein, gelatin, rosin resin, terpene resin, phenol resin, styrene resin, The conventional adhesives such as silicone resin, styrene resin, polyolefin, urethane resin, ionomer resin, vinyl chloride resin, vinyl acetate resin, vinyl chloride-vinyl acetate copolymer resin, polyester resin and polyamide resin can be widely used. . The pressure-sensitive adhesive is preferably one which exhibits no stickiness at room temperature and develops tackiness or adhesiveness by pressure.

  The photosensitive resin whose adhesiveness or adhesiveness is reduced by light irradiation is, for example, one which is cured by irradiation of light of a specific wavelength such as ultraviolet light, visible light, infrared radiation and the like, and the adhesiveness or adhesion is reduced, In a light non-irradiated part, what can adhere | attach a porous conductive layer and a to-be-transferred base material can be used. Specifically, widely known products such as photocurable varnishes in which a photopolymerization initiator is formulated in a polyfunctional (meth) acrylic resin, or photoacid generators or photobase generators in an epoxy resin are widely used. it can. Further, a solvent dilution type, a W / O emulsion type, or a non-solvent type containing no solvent may be used. Such photosensitive resins may be used alone or in combination of two or more.

  In addition to the pressure sensitive adhesive, the pressure sensitive adhesive layer may contain an additive. As an additive, a dispersing agent, a filler, a plasticizer, an antistatic agent etc. can be mentioned, for example.

  When a pressure-sensitive adhesive is used, the pressure-sensitive adhesive layer 4 may be formed on the entire surface of the substrate 2 as illustrated in FIG. 1 and on the substrate 2 as illustrated in FIG. May be formed in a pattern. As shown in FIG. 6 (a), when the pressure-sensitive adhesive layer 4 is formed on the base 2 in a pattern, the laminate 1 is shown in FIG. 6 (c) without being partially transferred. Thus, the pattern of the porous conductive layer 3 can be transferred onto the transferred substrate 11.

Moreover, when using photosensitive resin from which adhesiveness or adhesiveness falls by light irradiation, the contact bonding layer 4 is normally formed in the whole surface on the base material 2 as illustrated to Fig.7 (a).
FIGS. 7 (a) to 7 (d) are process diagrams showing another example of the method for producing a conductive substrate using the laminate of the present invention, wherein the pressure-sensitive adhesive layer 4 is made tacky or adhesive by light irradiation. It is an example using a photosensitive resin which decreases. First, as shown in FIG. 7A, a laminate 1 in which a porous conductive layer 3 and a pressure-sensitive adhesive layer 4 are sequentially laminated on a substrate 2 is prepared, and a photomask 15 is formed on the pressure-sensitive adhesive layer 4. The light 16 is irradiated in a pattern form through the interposition, and the adhesiveness or adhesiveness in the light irradiation part of the pressure-sensitive adhesive layer 4 is reduced to form the low adhesion part 4 b. Next, as shown to FIG.7 (b)-(c), it arrange | positions so that the pressure sensitive adhesive layer 4 of the laminated body 1 and the to-be-transferred base material 11 may contact, and it closely_contact | adheres. Thereafter, as shown in FIG. 7D, the base 2 side is peeled off. The pressure-sensitive adhesive layer 4 has an adhesive portion 4a which is a non-irradiated portion, and a low adhesive portion 4b which is a light-irradiated portion and has reduced adhesiveness or adhesiveness. In the low adhesion portion 4b, the adhesion to the transferred substrate 11 is lowered. Therefore, when peeling the substrate 2 side, the porous conductive layer 3 and the pressure-sensitive adhesive layer 4 are peeled together with the substrate 2 at the low adhesion portion 4b, and the adhesive portion 4a is adhered to the transferred substrate 11 to be porous. Conductive layer 3 is transferred. Thereby, the electroconductive base material 10 which has a pattern of the pressure sensitive adhesive layer 4 and the porous conductive layer 3 is obtained. Also in this case, the pattern of the porous conductive layer 3 can be transferred onto the transferred substrate 11 without partially transferring the laminate 1.

  As a formation method of a pressure sensitive adhesive layer, the method of apply | coating and drying resin compositions, such as a pressure sensitive adhesive and photosensitive resin, on a porous conductive layer, for example is mentioned. As a coating method of a resin composition, it can be selected suitably from general coating methods, and can be applied, for example, gravure, screen printing, spray coating, spin coating, comma coating, bar coating, knife coating, die coating, Offset printing, flexographic printing, inkjet printing, dispenser printing and the like can be mentioned.

  The thickness of the pressure-sensitive adhesive layer is not particularly limited as long as the thickness of the pressure-sensitive adhesive layer is such that foil breakage can occur when the laminate of the present invention is transferred to a transfer target substrate. It is appropriately selected according to the type and the like. Specifically, the thickness of the pressure-sensitive adhesive layer is preferably in the range of 0.1 μm to 50 μm, and more preferably in the range of 0.5 μm to 25 μm. If the thickness of the pressure-sensitive adhesive layer is too thin, the adhesion to the transfer substrate may be insufficient. On the other hand, if the thickness is too large, the pressure applied to the pressure-sensitive adhesive layer may be too large when transferring the laminate of the present invention, which may cause damage to the transferred substrate and the like. Further, for example, when the substrate to be transferred is a paper substrate, some types of paper substrate may be difficult to transfer, but in this case the thickness of the pressure-sensitive adhesive layer is in the above range from the viewpoint of transferability. Among them, relatively thick is preferable.

  Moreover, as illustrated in FIG. 6 (b), the non-pressure-sensitive adhesive layer 5 may be formed in a pattern on the pressure-sensitive adhesive layer 4. Also in this case, the pattern of the porous conductive layer 3 can be transferred onto the transferred substrate 11 as shown in FIG. 6C, without partially transferring the laminate 1.

As a material of a non-pressure-sensitive-adhesive layer, the thermoplastic resin which does not fuse | melt, for example with respect to the temperature which an adhesive layer fuses, a thermosetting resin, a photocurable resin etc. are mentioned.
The thickness of the non-pressure-sensitive adhesive layer may be any thickness as long as the pressure-sensitive adhesive layer and the substrate to be transferred can be adhered when the laminate of the present invention is transferred to the substrate to be transferred It is appropriately selected according to the method, the type of the transferred substrate and the like. Specifically, the thickness of the non-pressure-sensitive adhesive layer is preferably in the range of 100 nm to 3 μm.
As a formation method of a non-pressure-sensitive adhesive layer, the method of apply | coating a resin composition in pattern shape on a pressure-sensitive adhesive layer, for example, drying, and hardening as needed is mentioned. As a coating method of a resin composition, it selects suitably from a general coating method, and can be applied.

3. Substrate The substrate used in the present invention is to support the above-mentioned porous conductive layer and pressure-sensitive adhesive layer.
The substrate is not particularly limited as long as it can form the above-mentioned porous conductive layer, and, for example, an inorganic substrate such as a glass substrate or a ceramic substrate, a metal substrate, a resin substrate, a paper base A material etc. can be used.
Among them, the substrate is preferably a resin substrate. In the present invention, as described later, since the metal particles can be sintered at a low temperature to form a porous conductive layer, it is necessary to use a highly heat resistant substrate with less damage to the substrate. However, low heat resistant substrates can also be used. In particular, it is very useful in that inexpensive general-purpose plastic resin substrates such as polyethylene terephthalate can be used.

  As a resin base material, a general resin base material can be used. Preferred specific examples of the resin substrate include polyimide, polyamide, polyamideimide, polyethylene terephthalate, polyethylene naphthalate, polyphenylene sulfide, polyetheretherketone, polyethersulfone, polycarbonate, polyetherimide, epoxy resin, phenol resin, glass -Resin films such as epoxy resins, polyphenylene ethers, acrylic resins, polyolefins such as polyethylene and polypropylene, polycycloolefins such as polynorbornene, and liquid crystalline polymer compounds. Among them, inexpensive general-purpose plastic resin substrates such as polyethylene terephthalate are preferable.

  The base material may have flexibility or may be rigid, and is appropriately selected depending on the method of transferring the laminate of the present invention to a transfer receiving base material and the like. Among them, the substrate preferably has flexibility. The above-mentioned porous conductive layer is porous and exhibits high resistance to bending. Therefore, when the base material has flexibility, it is possible to transfer to the transfer base while giving the laminate a high curvature. Moreover, it is more preferable that it is a resin base material which has flexibility from the above-mentioned reason.

Moreover, the mold release layer may be formed in the surface of a base material, and the mold release process may be given. This is because peeling between the substrate and the porous conductive layer or the protective layer is facilitated.
Examples of the material of the release layer include fluorine-based release agents, silicone-based release agents, and wax-based release agents. Examples of the method for forming the release layer include a method in which a release agent is applied by an application method such as dip coating, spray coating, roll coating, or the like.
Further, examples of the release treatment include surface treatments such as fluorine treatment and silicone treatment.

  The thickness of the substrate is not particularly limited, but in the case of an inorganic substrate, it is usually about 0.1 mm to 10 mm, preferably in the range of 0.5 mm to 5 mm. On the other hand, in the case of a resin substrate, the thickness of the substrate is usually about 1.0 μm to about 1000 μm. When the thickness of the resin substrate is in the above range, deformation of the substrate is suppressed when forming the porous conductive layer, which is preferable in terms of shape stability of the porous conductive layer to be formed, and winding. It is suitable from the point of flexibility when performing continuous processing.

4. Other Configurations The laminate of the present invention may have other configurations as needed, in addition to the above-mentioned substrate, porous conductive layer and pressure-sensitive adhesive layer. For example, an antistatic layer, a heat-resistant protective layer, an abrasion resistant layer, a slippery layer or the like may be provided on the surface of the base opposite to the surface on which the porous conductive layer is formed. In addition, a protective layer may be formed between the substrate and the porous conductive layer. The protective layer is described below.

(Protective layer)
In the present invention, a protective layer 6 may be formed between the substrate 2 and the porous conductive layer 3 as illustrated in FIG. 8 (a). The protective layer 6 becomes the outermost layer of the conductive substrate 10 after the porous conductive layer 3 is transferred from the laminate 1 to the transferred substrate 11 as shown in FIG. The porous conductive layer 3 can be protected from abrasion, light, chemicals and the like. In addition, the porous conductive layer can be insulated by providing the insulating protective layer.

As a material of a protective layer, a porous conductive layer can be protected and what is necessary is just to have insulation, for example, an ultraviolet curable resin, electron beam curable resin, etc. are mentioned. The protective layer may further contain a filler.
In addition, a protective film may be used as the protective layer.

As a formation method of a protective layer, the method of apply | coating and drying curable resin composition on a base material is mentioned, for example. Examples of the method for applying the curable resin composition include gravure coating, roll coating, comma coating, gravure printing, screen printing, and gravure reverse roll coating.
When using a protective film as a protective layer, a base material and a protective film can be bonded together via a weak adhesion layer. When the weak adhesive layer peels the substrate, it is preferable that the weak adhesive layer can be peeled together with the substrate.

  The thickness of the protective layer is preferably in the range of 0.5 μm to 30 μm, and more preferably in the range of 3 μm to 15 μm. When the thickness of the protective layer is in the above range, surface physical properties such as excellent high hardness, scratch resistance, chemical resistance and stain resistance can be obtained, and further excellent formability and shape following property can be obtained. it can.

5. Form The form of the laminate of the present invention is not particularly limited as long as the pressure-sensitive adhesive layer and the porous conductive layer can be transferred onto the substrate to be transferred, and examples thereof include sheet and strip.
Among them, in the present invention, it is preferable that the form of the laminate is a belt shape. This is because the porous conductive layer can be easily formed in a desired wiring pattern on the transferred substrate. Moreover, in this case, it is preferable that the substrate has flexibility.

When the form of the laminate is a band, the line width of the laminate can be appropriately selected according to the application, and is not particularly limited, but it is in the range of 0.5 mm to 50 mm, and more preferably in the range of 1.0 mm to 30 mm Preferably, it is in the range of 1.0 mm to 10 mm.
When the line width is within the above range, a transfer tool of a known correction tape can be applied to the transfer tool of the laminate, and the porous conductive layer can be easily formed into a desired wiring pattern on the transfer substrate. It is because it can be formed.

  The strip-like laminate can be obtained, for example, by forming a pressure-sensitive adhesive layer and a porous conductive layer on a strip-like substrate. Moreover, a strip | belt-shaped laminated body can be obtained by cut | disconnecting a sheet-like laminated body by a predetermined | prescribed line width.

6. The laminate of the present invention can be used for producing a conductive substrate as described later, and for example, printed wiring boards, electromagnetic wave shielding materials, antennas, power semiconductors, noise filters, capacitor electrodes, electrodes for various sensors ( It can be used for touch sensors, biosensors, temperature sensors, gas sensors, light sensors, pressure sensors, flow sensors), electrodes for displays, electrodes for solar cells, IC cards, RFID cards, etc. .
Further, the laminate of the present invention can be used as an electromagnetic wave shielding layer for preventing unauthorized reading of information recorded on a noncontact IC card, and a conductive layer for modulating a resonance frequency. For example, it is possible to apply a porous conductive layer to a part of the card and transport it as unreadable, and to scratch and remove the entire pressure sensitive adhesive layer at the time of use. Since the laminate of the present invention has a porous conductive layer, it can be easily peeled off by scratching by controlling the adhesion of the pressure-sensitive adhesive layer.
The laminate of the present invention can also be used to form designs, designs, and the like that make use of the color and gloss of the porous conductive layer.

B. Method for Producing Conductive Substrate The method for producing a conductive substrate of the present invention comprises the steps of preparing the above-mentioned laminate, the pressure-sensitive adhesive layer of the above-mentioned laminate on the substrate to be transferred, and the above-mentioned porous conductive And C. a transfer step of transferring the pressure by pressing the layer.

  Fig.2 (a)-(c), FIG.3 (a)-(c), FIG.4 (a), (b) is process drawing which shows an example of the manufacturing method of the electroconductive base material of this invention. 2 (a) to 2 (c), 3 (a) to 3 (c), 4 (a) and 4 (b) are described in detail in the above-mentioned "A. laminate", so The description is omitted.

  In the present invention, since the resin contained in the pressure-sensitive adhesive layer can be introduced into the pores of the porous conductive layer, not only the surface area to which the porous conductive layer and the pressure-sensitive adhesive layer adhere is increased. The anchor effect can enhance the adhesion of the porous conductive layer and the pressure sensitive adhesive layer. Therefore, in the transfer step, the pressure-sensitive adhesive layer and the porous conductive layer can be favorably transferred to the transfer substrate, and excellent transferability can be obtained.

  Further, in the present invention, since a pressure sensitive adhesive and a pressure sensitive adhesive can be used as the pressure sensitive adhesive layer, heating is not necessary when transferring the laminate onto the substrate to be transferred, and a porous conductive layer can be used. It is possible to suppress the decrease in conductivity and the distortion of the laminate due to the oxidation of

  Further, in the present invention, since the porous conductive layer is porous and therefore provided with brittleness, unlike the conventional vapor deposition layer, the occurrence of burrs during transfer is small and large crystal grains are not included. Therefore, good foil breakage can be obtained. Furthermore, as illustrated in FIGS. 3A to 3C, in the case of transferring the pattern of the pressure-sensitive adhesive layer and the porous conductive layer of the laminate onto the transfer substrate, the transfer can be performed with high resolution. it can. In addition, by using a strip-shaped laminate as illustrated in FIGS. 4A and 4B, the pattern of the pressure-sensitive adhesive layer and the porous conductive layer can be easily formed on the transferred substrate using the transfer tool. It can be transferred.

  Further, in the present invention, since the metal particles can be sintered at a low temperature to form a porous conductive layer, it is not necessary to use a highly heat resistant substrate as the substrate of the laminate, and the heat resistance is low. Substrates can also be used. In particular, inexpensive general-purpose plastic resin substrates such as polyethylene terephthalate can be used. Therefore, the manufacturing cost can be reduced.

  In addition, since the pressure-sensitive adhesive layer and the porous conductive layer are transferred onto the substrate to be transferred, as the substrate to be transferred, a substrate which was conventionally difficult to form a porous conductive layer can also be used. . Therefore, it is possible to obtain an inexpensive general-purpose plastic resin substrate such as polyethylene terephthalate or a conductive substrate in which a porous conductive layer is formed on a transferred substrate such as a paper substrate. Furthermore, it is also possible to form a porous conductive layer on a three-dimensional object to be transferred. In addition, the conductive substrate can be easily produced only by pressing and transferring the pressure-sensitive adhesive layer and the porous conductive layer on the transfer substrate.

  Hereinafter, each process in the manufacturing method of the electroconductive base material of this invention is demonstrated.

1. Preparation Step The preparation step in the present invention is a step of preparing the above-mentioned laminate.
In addition, about a laminated body, since it described in said "A. laminated body" in detail, description here is abbreviate | omitted.

2. Transfer Step The transfer step in the present invention is a step of pressing and transferring the pressure-sensitive adhesive layer and the porous conductive layer of the above-mentioned laminate on a substrate to be transferred.

  The substrate to be transferred is not particularly limited as long as the porous conductive layer can be pressurized and transferred through the pressure-sensitive adhesive layer, and may be appropriately selected depending on the use of the conductive substrate, etc. It is selected. For example, a resin base, a paper base, a glass base, a ceramic base, a metal base and the like can be mentioned.

  As a method of pressing and transferring the pressure-sensitive adhesive layer and the porous conductive layer of the laminate on the transferred substrate, the pressure-sensitive adhesive layer can be adhered to a predetermined position on the transferred substrate. There is no particular limitation as long as it is present, and examples include a method using a roller or a stamp, a method of pressing, and the like.

  Moreover, as illustrated in FIGS. 3A to 3C, when the pressure-sensitive adhesive layer and the pattern of the porous conductive layer are pressed and transferred onto the transferred substrate, as a transfer method, for example, The method of using a concavo-convex plate, the method of drawing a layered product using projections, such as a needle, etc. can be mentioned.

  When the pressure-sensitive adhesive layer and the porous conductive layer are transferred by pressure onto the substrate to be transferred, the pattern of the pressure-sensitive adhesive layer and the porous conductive layer is transferred by pressure onto the substrate to be transferred. Good. A conductive substrate in which a pattern of a porous conductive layer is formed on a transferred substrate can be obtained.

In the case of pressing and transferring the pattern of the pressure-sensitive adhesive layer and the porous conductive layer onto the substrate to be transferred, as described above, a method using a concavo-convex plate, a needle or the like may be applied. The laminated body 1 in which the pressure sensitive adhesive layer 4 as exemplified in a) is formed in advance in a pattern may be used, and the non-pressure sensitive adhesive on the pressure sensitive adhesive layer 4 as exemplified in FIG. You may use the laminated body 1 in which the layer 5 was formed in pattern shape.
In addition, in the case of pressing and transferring the pattern of the porous conductive layer onto the substrate to be transferred, in addition to the above, a band-shaped laminate may be used as shown in FIG. You may use the laminated body 1 in which the porous conductive layer 3 which is illustrated to 5 (a) was previously formed in pattern shape.

  After adhering the pressure-sensitive adhesive layer of the laminate on the substrate to be transferred, the pressure-sensitive adhesive layer is usually adhered on the substrate to be transferred by physically pulling the laminate away from the substrate side. In the region, the substrate can be peeled off from the porous conductive layer.

  In the present invention, when a flexible base is used as the base of the laminate, the base is peeled from the porous conductive layer by physically pulling the laminate away from the base while bending the base. It is preferable because it can be easily transferred to a three-dimensional object having a complicated shape such as a curved surface or a stepped shape or a cornered shape.

3. Connection Step In the present invention, in the transfer step, as shown in FIG. 9A, the pressure-sensitive adhesive layer and the porous conductive layer of the laminate are transferred by pressing onto the transferred substrate. A laminated portion X in which the pressure sensitive adhesive layer 4c and the first porous conductive layer 3a, and the second pressure sensitive adhesive layer 4d and the second porous conductive layer 3b are laminated is formed, and a pressure P is applied to the laminated portion X Thus, as shown in FIG. 9B, the first porous conductive layer 3a and the second porous conductive layer 3b may be electrically connected.
9 (a) and 9 (b) are process diagrams showing an example of the connecting step in the method for producing a conductive substrate of the present invention. Although not shown, the first porous conductive layer and the second porous conductive layer can also be electrically connected by subjecting the laminated portion to a heat treatment.

  Since the first porous conductive layer and the second porous conductive layer in the region pressurized in the above-mentioned stacked portion can be electrically connected, the stacked porous conductive layers in the conductive substrate can be easily made to each other Can be conducted in the following manner. More specifically, since the first porous conductive layer and the second porous conductive layer are porous, they can be contained in the second pressure-sensitive adhesive layer in the porous membrane by pressing the laminated portion. The first porous conductive layer and the second porous conductive layer can be brought into contact and electrically connected.

  Further, in the present invention, although not shown, the first porous conductive layer and the second porous conductive layer may be electrically connected in the entire area of the above-mentioned laminated portion, as shown in FIG. 9 (b). The first porous conductive layer 3a and the second porous conductive layer 3b may be electrically connected in part of the laminated portion X. In this case, the second pressure-sensitive adhesive layer can be used as the insulating layer of the first porous conductive layer and the second porous conductive layer in the region where no pressure is applied in the laminated portion.

  The first pressure-sensitive adhesive layer and the first porous conductive layer may be formed on the entire area of the substrate to be transferred, and may be formed in a predetermined pattern. In addition, the second pressure-sensitive adhesive layer and the second porous conductive layer may be formed on the entire area of the transferred substrate, or may be formed in a predetermined pattern.

  In the present invention, the first porous conductive layer and the second porous conductive layer can be electrically connected by performing the heat treatment and / or the pressure treatment on the laminated portion. The stacked portion may be subjected to heat treatment, pressure treatment, or both heat treatment and pressure treatment.

  It will not be limited especially if it is a method which can electrically connect the 1st porous conductive layer and the 2nd porous conductive layer as a pressure treatment method of the above-mentioned lamination part, for example, the 2nd porous conductive layer A method of pressing with a predetermined pressure from the side, for example, a method of pressing with a roller, a stamp, a press, a concavo-convex plate, a needle, a pen-like one, may be mentioned. In particular, a method of applying a lateral shear force so as to press with a roller or rub and draw with a needle-like thing is preferable because the pressure sensitive adhesive is softened by the shear force to facilitate transfer.

  Moreover, as a heat processing method of the said lamination | stacking part, heating by electromagnetic waves, such as a heating roller from a 2nd conductive layer side, a hot stamp, a heat press, spot shape heating of needle shape or pen tip shape, infrared rays, a laser, is mentioned.

  Further, as a method of simultaneously performing both the pressure treatment and the heat treatment of the laminated portion, for example, a method of heating by rubbing the surface of the laminated portion when pressurizing the laminated portion can be mentioned.

C. Method of Manufacturing Electronic Device The method of manufacturing an electronic device of the present invention is a manufacturing method characterized by including a conductive substrate manufacturing step of manufacturing a conductive substrate by the above-described method of manufacturing a conductive substrate. .

In the present invention, since the conductive substrate is produced by the method for producing a conductive substrate described above, a porous conductive layer having good conductivity can be formed. Further, for example, in the case of forming a pattern of a porous conductive layer, a pattern of high resolution can be formed.
Further, in the present invention, since the conductive substrate is produced by the method for producing a conductive substrate described above, the production cost can be reduced.

  Hereinafter, steps in the method of manufacturing an electronic device of the present invention will be described.

1. Step of Producing Conductive Substrate The step of producing a conductive substrate in the present invention is a step of producing a conductive substrate by the method of producing a conductive substrate described above.
In addition, about the manufacturing method of a conductive base material, since it described in the said "B. manufacturing method of a conductive base material" in detail, description here is abbreviate | omitted.

2. Other Steps The method for producing an electronic device of the present invention may have other steps as necessary in addition to the conductive substrate preparation step. Other processes are appropriately selected according to the electronic device.

3. Electronic Device Examples of the electronic device in the present invention include printed wiring boards, electromagnetic wave shielding materials, antennas, power semiconductors, noise filters, capacitor electrodes, electrodes for various sensors (touch sensors, biosensors, temperature sensors, gas sensors, optical sensors) , Pressure sensor, flow sensor), display electrode, solar cell electrode, IC card, RFID, etc.
When the electronic device of the present invention is, for example, a noncontact IC card, the porous conductive layer is an electromagnetic wave shielding layer for preventing unauthorized reading of information recorded on the noncontact IC card, resonance frequency Can be used as a conductive layer to modulate Also, in this case, it is possible to temporarily apply a porous conductive layer to the noncontact IC card and to scratch and remove the pressure-sensitive adhesive layer later. Since the noncontact IC card has a porous conductive layer, it can be easily peeled off by scratching by controlling the adhesion of the pressure-sensitive adhesive layer.

D. Transfer Tool The transfer tool of the present invention is used to press and transfer the pressure-sensitive adhesive layer and the porous conductive layer of the strip-like laminate on the substrate to be transferred using the laminate described above. A laminate reel, an unwinding reel for unwinding the pressure-sensitive adhesive layer of the laminate to the outside, the pressure-sensitive adhesive layer of the laminate drawn from the unwinding reel, and the pores of the laminate Head for transferring by pressing the conductive conductive layer onto the transfer receiving substrate, a take-up reel for taking up the base after transfer of the pressure-sensitive adhesive layer and the porous conductive layer, the take-out reel, And an interlocking mechanism for interlockingly rotating the take-up reel.

  The transfer tool of the present invention will be described with reference to the drawings. FIG. 4A is a schematic view showing an example of the transfer tool of the present invention. The transfer tool 20 shown in FIG. 4A includes the laminate 1, the unwinding reel 21 that unwinds with the pressure-sensitive adhesive layer 4 of the laminate 1 on the outside, and the laminate 1 extracted from the unwinding reel 21. Transfer head 22 for transferring pressure-sensitive adhesive layer 4 and porous conductive layer 3 under pressure onto transfer substrate 11 and winding substrate 2 after transfer of pressure-sensitive adhesive layer 4 and porous conductive layer 3 It has a take-up reel 23 and an interlocking mechanism 24 for interlockingly rotating the unwinding reel 21 and the take-up reel 23. The unwinding reel 21 is rotatably supported by a support shaft 25, and the take-up reel 23 is rotatably supported by a support shaft 26. The transfer head 22 is formed of a plate-like member whose front end on the side of the transferred substrate 11 is thin, and has a flange 27 for preventing the stack transfer body 1 from coming off the transfer head. The interlocking mechanism 24 is formed so as to rotate at the same angular velocity as the take-up reel 23, and is engaged with the first gear 24a. And a second gear 24b having a smaller number of teeth than the first gear 24a. The stack 1, the unwinding reel 21, the transfer head 22, the winding reel 23, and the interlocking mechanism 24 are accommodated in a case 28. The case 28 has a guide pin 29 for arranging the laminate 1 at a predetermined position in the case 28.

  In the present invention, by using the transfer tool of the present invention, a pattern of a porous conductive layer can be easily formed on the above-mentioned transfer base using the strip-like laminate in the above-mentioned method of manufacturing a conductive base. can do.

  Hereinafter, the details of the transfer tool used in the present invention will be described.

1. Laminate The laminate used in the present invention is in the form of a band. The details of the laminate can be the same as the contents described in the section “A. Laminate” described above, and thus the description thereof is omitted here.

2. Unwinding reel The unwinding reel used in the present invention is such that the pressure-sensitive adhesive layer of the laminate is outside.
The unwinding reel is not particularly limited as long as the pressure-sensitive adhesive layer side of the laminate can be brought out and unwound, and it can be the same as that used in a general transfer tool, and therefore, the explanation here is Is omitted. Also, the unwinding reel is usually rotatably supported by a support shaft.

3. Transfer Head The transfer head used in the present invention is to press and transfer the pressure-sensitive adhesive layer and the porous conductive layer of the laminate pulled out from the unwinding reel onto the transfer target substrate.

  The transfer head is not particularly limited as long as the pressure-sensitive adhesive layer and the porous conductive layer of the laminate can be pressed and transferred onto the transferred substrate, and, for example, a tapered shape in which the tip on the transferred substrate side becomes gradually thinner And a roller member for pressing. Further, the transfer head may further have a flange for preventing the stack transfer body from coming off the transfer head. The form and material of the transfer head can be the same as the configuration of a general transfer tool. For example, the transfer head described in JP-A-2009-238676 can be used.

4. Take-up reel The take-up reel used in the present invention is to take up the above-mentioned adhesive layer and the base material after transfer of the above-mentioned porous conductive layer.
The take-up reel is not particularly limited as long as it can take up the base after transfer of the pressure-sensitive adhesive layer and the porous conductive layer, and can be similar to those used for general transfer tools. The description here is omitted. Also, the take-up reel is usually rotatably supported by a support shaft.

5. Interlocking Mechanism The interlocking mechanism used in the present invention interlocks and rotates the unwinding reel and the winding reel.

  The interlocking mechanism is not particularly limited as long as the unwinding reel and the take-up reel can be interlocked and rotated so as to have a constant tension so that the stack does not loosen between the unwinding reel and the take-up reel. For example, the first gear, which is formed to rotate at the same angular velocity as the unwinding reel, is formed to rotate at the same angular velocity as the take-up reel, and is engaged with the first gear. An interlocking mechanism having a second gear with a small number of teeth may also be used. In addition, it may be an interlocking mechanism having an unwinding pulley provided coaxially with the unwinding reel, a winding pulley provided coaxially with the winding reel, a belt connecting the unwinding pulley and the winding pulley.

6. Case In the transfer tool of the present invention, usually, the laminate, the unwinding reel, the take-up reel and the interlocking mechanism are disposed in a case. In addition, the case may have a guide pin, a guide roll or the like for arranging the laminate at a predetermined position in the case. The case can be the same as that used in a general transfer tool, and thus the description thereof is omitted.

7. Others In the present invention, the transfer tool may be configured by arranging a laminate instead of the correction tape of a known transfer tool used for a correction tape or the like.

8. The transfer tool of the present invention can be suitably used when transferring the wiring pattern of the pressure-sensitive adhesive layer and the porous conductive layer onto the transferred substrate in the method for producing the conductive substrate described above.

  The present invention is not limited to the above embodiment. The above embodiment is an exemplification, and it has substantially the same configuration as the technical idea described in the claims of the present invention, and any one having the same function and effect can be used. It is included in the technical scope of the invention.

  Hereinafter, the present invention will be described in more detail by way of Examples and Comparative Examples.

Synthesis Example 1: Synthesis of Copper Particles
In a 200 ml three-necked flask, 10.0 g of copper hydroxide (manufactured by Wako Pure Chemical Industries, Ltd.), 34.5 g of decanoic acid (Lunac 10-98 manufactured by Kao), and 18.5 g of propylene glycol monomethyl ether (PGME) were weighed. . The mixture was heated to 100 ° C. with stirring and maintained at that temperature for 20 minutes. Thereafter, 41.3 g of 3-ethoxypropylamine (manufactured by Koei Chemical Industry Co., Ltd.) was added, and the mixture was heated and stirred at 100 ° C. for 10 minutes. The mixture is cooled to 10 ° C. using an ice bath, and a solution of 10.0 g of hydrazine monohydrate in 18.5 g of PGME (manufactured by Kanto Chemical Co., Ltd.) is added in the ice bath for 10 minutes. It stirred. The reaction solution was then heated to 100 ° C. and maintained at that temperature for 10 minutes. After cooling to 30 ° C., 66 g of hexane was added. After centrifugation, the supernatant was removed. The precipitate was washed with hexane to obtain copper particles.
When the obtained copper particles were observed by a transmission electron microscope (TEM), the average primary particle size was 65 nm.

Preparation Example 1: Preparation of Copper Particle Dispersion
40 parts by mass of the copper particles obtained in Synthesis Example 1, 4 parts by mass of Solsperse 41000 (manufactured by Lubrizol) as a polymer dispersant, and 56 parts by mass of propylene glycol monomethyl ether (PGME) are mixed, and paint shaker (manufactured by Asada Iron Works) The dispersion was further dispersed for 1 hour with 2 mm zirconia beads as preliminary dispersion and further for 2 hours with 0.1 mm zirconia beads as main dispersion to obtain a copper particle dispersion.

[Production Example 1: Production of Conductive Film A]
A copper particle dispersion is coated on a PET film (trade name Cosmo Shine A4100, manufactured by Toyobo, film thickness 100 μm) using a bar coater # 4, dried at 80 ° C. for 3 minutes with a warm air dryer, and a film having a red copper gloss I got Thereafter, while introducing hydrogen gas at an introduction pressure of 20 Pa, the porous conductive layer is fired for 240 seconds at a microwave output of 450 W using a microwave surface wave plasma processing apparatus (MSP-1500, manufactured by Micro Electronics Co., Ltd.) The conductive film A which it has was obtained.

[Production Example 2: Production of Conductive Film B]
After diluting nano Ag ink (made by three-star belt trade name MDot CF107) with pentanediol 40%, it is applied to PET film (trade name Cosmo Shine A4100, Toyobo, film thickness 100 μm) using bar coater # 4 and warm It dried and baked at 120 degreeC for 30 minutes with a wind dryer, and it obtained silver conductive film B which has a silver luster and has a porous conductive layer.

[Production Example 3: Production of Conductive Film C]
Copper was deposited on a PET film (trade name: Cosmo Shine A4100, manufactured by Toyobo Co., Ltd., film thickness 100 μm) by a sputtering method to obtain a conductive film C having a conductive layer.

[Evaluation]
(Measurement of sheet resistance value of porous conductive layer and conductive layer)
The conductivity evaluation of the porous conductive layer and the conductive layer was performed by measuring a sheet resistance value by a four-point probe method using a surface resistance meter ("Loresta GP" manufactured by DI Instruments, PSP type probe). The sheet resistance value of the porous conductive layers of the conductive films A and B was 0.20 Ω / □, and the sheet resistance value of the conductive layer of the conductive film C was 0.08 Ω / □.

(Measurement of film thickness of porous conductive layer and conductive layer)
The film thickness of the porous conductive layer and the conductive layer was evaluated as follows. For the prepared conductive films A and B, carbon was deposited sequentially by vacuum evaporation method on the upper part of the porous conductive layer as a protective layer, and platinum by sputtering method, and then FIB (focused ion beam, FB-2100 manufactured by Hitachi High-Tech) After laminating tungsten using, a cross section of the porous conductive layer was made. Thereafter, the cross section of the porous conductive layer was observed in a state where the substrate was inclined 45 ° using an SEM (S-4800 manufactured by Hitachi High-Technologies), and the film thickness was measured from the SEM image. The film thickness was measured at 10 locations in the SEM image measured at a magnification of 30 k to 40 k, the inclination was corrected, and the average value was taken as the film thickness. The film thickness of the conductive layer of the conductive film C was also evaluated in the same manner as in the porous conductive layer. The film thickness of the porous conductive layer of the conductive film A was 400 nm, the film thickness of the porous conductive layer of the conductive film B was 380 nm, and the film thickness of the porous conductive layer of the conductive film C was 400 nm. From this result, it is understood that the volume resistance value of the conductive film A is 8.0 μΩ · cm, the volume resistance value of the conductive film B is 7.6 μΩ · cm, and the volume resistance value of the conductive film C is 3.0 μΩ · cm The

(Measurement of porosity of porous conductive layer and conductive layer)
The porosity measurement of the porous conductive layer and the conductive layer was performed as follows. In the SEM image obtained in the film thickness measurement, the area of the hole and the area of copper are calculated respectively, and the area of the hole is divided by the area of the porous copper layer to obtain the porosity in the cross section. The The porosity of the porous conductive layer of the conductive film A was 35%, the porosity of the porous conductive layer of the conductive film B was 30%, and the porosity of the conductive layer of the conductive film C was 0%.

[Example 1-1: Transfer laminate 1]
A pressure sensitive adhesive (Auroren 200MX manufactured by Nippon Paper Industries Co., Ltd.) was coated on the copper surface of the conductive film A with a bar coater # 4 and dried with a warm air dryer at 90 ° C. for 30 seconds. A pressure-sensitive adhesive layer of about 1.5 μm was formed.

[Example 1-2: Transfer laminate 2]
A procedure similar to that of transfer laminate 1 except that the pressure-sensitive adhesive of transfer laminate 1 is changed to a mixture of Au Loren 200MX and Auroren 350MX manufactured by Nippon Paper Industries in a weight ratio of 1: 2 The laminate 2 for transfer was produced.

Example 1-3 Laminate 3 for Transfer
A transfer laminate 3 was produced in the same manner as the transfer laminate 1 except that the conductive film A of the transfer laminate 1 was changed to a conductive film B.

[Comparative Example 1: Laminate 4 for Transfer]
A transfer laminate 4 was produced in the same manner as the transfer laminate 1 except that the conductive film A of the transfer laminate 1 was changed to a conductive film C.

[Evaluation]
The pressure sensitive adhesive application side was piled up to commercial quality paper about laminations 1-4 for transfer, and it pressed with the resinous spatula from the back side, and exfoliated PET film. The transferability was visually confirmed, and the sheet resistance of the transferred material was measured. The results are shown in Table 1. The transferability in the table is represented by the ratio of the area of the conductive layer transferred to the transfer target to the area of the conductive layer of the transfer laminate or the like before transfer. The conductive layer which was not transferred remained in the transfer laminate.

[Examples 2-1 to 2-3 and Comparative Example 2]
About the laminates 1 to 4 for transfer, the laminate is cut to a width of 5 mm, and a transfer tool including an unwinding reel, a transfer head made of resin, and a take-up reel is prepared. Fixed. Subsequently, the pressure-sensitive adhesive coated surface of the transfer laminate was brought into contact with a commercially available high quality paper, and pressure was applied by a transfer head. The transferability was visually confirmed, and the sheet resistance of the transferred material was measured. The results are shown in Table 2.

[Examples 3-1 to 3-3 and Comparative Example 3]
The transfer laminates 1 to 4 were pressed with a pen point of a ballpoint pen from which the ink was removed so that the pressure sensitive adhesive coated surface of the transfer laminate would come to a commercially available high quality paper, and a continuous pattern was drawn. The transferability was visually confirmed, and both ends of the pattern were measured by a tester to check the presence or absence of conduction. The results are shown in Table 3.

  In Comparative Example 3, the conductive layer in the transfer laminate 4 was partially transferred onto the wood free paper as the transferred substrate, but the conductive layer in the transfer laminate 4 could not be transferred onto the fine paper The

[Examples 4-1 to 4-3]
With respect to the laminates 1 to 3 for transfer, for a package in which commercially available cardboard is assembled in a box shape, a pen of a ballpoint pen from which the ink is removed so that the pressure sensitive adhesive coated surface of the laminate for transfer comes to the package surface. A continuous pattern was drawn so as to press first and make a round on the side of the package. Both ends of the pattern were measured by a tester to check for conduction. The results are shown in Table 4.

[Example 5]
Using the laminate 1 for transfer in Example 2-1, the pressure-sensitive adhesive coated surface of the laminate 1 for transfer is placed on a commercially available wood free paper, and pressure is applied by the transfer head, and the line of the porous conductive layer I transferred the pattern. Furthermore, the porous conductive layer is pressed by the transfer head so that the pressure sensitive adhesive coated surface of the transfer laminate comes to the commercially available high quality paper so as to cross the line pattern of the transferred porous conductive layer. Line pattern was transferred. As shown in FIG. 10, a transfer material in which the line patterns of the porous conductive layers 31 and 32 intersected was produced on wood free paper which is the transfer receiving substrate 11. When a tester was applied to the ends Y and Z of the line patterns of the porous conductive layers 31 and 32, the line patterns of the two porous conductive layers 31 and 32 were confirmed to be conductive.

[Example 6]
About the laminate 2 for transfer in Example 2-2, in the same manner as in Example 5, a transfer product in which the line patterns of the porous conductive layers 31 and 32 shown in FIG. 10 intersected was manufactured. When a tester was applied to the ends Y and Z of the line patterns of the porous conductive layers 31 and 32, the line patterns of the two porous conductive layers 31 and 32 were not conducted.
Furthermore, as shown in FIG. 10, a silicone rubber rod was used to press against the intersection point X of the line patterns of the two porous conductive layers 31 and 32. When a tester was applied to the end portions Y and Z of the line patterns of the two porous conductive layers after pressurization and checked, it was confirmed that the line patterns of the two porous conductive layers 31 and 32 were conducted. did.

[Example 7]
On the conductive film A, an adhesive pattern of two commercially available tape pastes (dot liner petite (heart pattern), dot liner petite (star pattern), KOKUYO S & T) was copied to make a transfer laminate. Subsequently, the adhesive pattern surface of the above-mentioned transfer laminate is superimposed on a commercially available high quality paper as a substrate to be transferred, and pressed with a resin spatula, a copper film is formed in a pattern (heart shape, star shape). It was possible to transcribe.

REFERENCE SIGNS LIST 1 laminate 2 base material 3 porous conductive layer 3 a first porous conductive layer 3 b second porous conductive layer 4 pressure-sensitive adhesive layer 4 c first pressure-sensitive adhesive layer 4 d second pressure-sensitive Adhesive layer 6 ... Protective layer 10 ... Conductive substrate 11 ... Transferred substrate

Claims (7)

A substrate,
A porous conductive layer formed on the substrate;
A pressure sensitive adhesive layer formed on the porous conductive layer;
The porous conductive layer, Ri sintered body der of the metal nanoparticles,
A protective layer is formed between the substrate and the porous conductive layer,
The protective layer has an insulating property, and the porous conductive layer laminate, wherein a layer der Rukoto to protect after the transfer.   The laminate according to claim 1, wherein the substrate is a resin substrate. A preparation step of preparing a laminate according to claim 1 or 2 ;
And a transfer step of pressing and transferring the pressure-sensitive adhesive layer and the porous conductive layer of the laminate on a substrate to be transferred. Claim in the transfer step, said pressure-sensitive adhesive layer on the transfer target substrate using a strip of the laminate, characterized by transferring the porous conductive layer, and the pattern of the protective layer pressurizing The manufacturing method of the electroconductive base material as described in 3 . A substrate, a porous conductive layer formed on the substrate, and a pressure-sensitive adhesive layer formed on the porous conductive layer, wherein the porous conductive layer is formed by firing of metal nanoparticles. A preparing step of preparing a laminated body which is a solid body;
A transfer step of pressing and transferring the pressure-sensitive adhesive layer and the porous conductive layer of the laminate on a substrate to be transferred;
Have and
In the transfer step, the first pressure-sensitive adhesive layer and the first porous conductive layer, and the pressure-sensitive adhesive layer and the porous conductive layer of the laminate are transferred onto the transfer substrate by pressure. Forming a laminated portion in which the second pressure-sensitive adhesive layer and the second porous conductive layer are laminated;
Furthermore, it has a connecting step of electrically connecting the first porous conductive layer and the second porous conductive layer by performing the heat treatment and / or the pressure treatment on the laminated portion. The manufacturing method of the electroconductive base material characterized by the above. A method for producing an electronic device, comprising the step of producing a conductive substrate by the method for producing a conductive substrate according to any one of claims 3 to 5 , wherein the conductive substrate is produced. It has a base material, the porous conductive layer formed on the above-mentioned base material, and the adhesion layer formed on the above-mentioned porous conductive layer, and the above-mentioned porous conductive layer is a sintered compact of metal nanoparticles. It is a transfer tool used for pressing and transferring the pressure-sensitive adhesive layer and the porous conductive layer of the strip- like laminate on a substrate to be transferred, using the laminate as
The laminate;
An unwinding reel for unwinding the pressure-sensitive adhesive layer of the laminate to the outside;
A transfer head for pressing and transferring the pressure-sensitive adhesive layer and the porous conductive layer of the laminate pulled out from the unwinding reel onto the transfer target substrate;
A take-up reel for taking up the pressure-sensitive adhesive layer and the substrate after transfer of the porous conductive layer;
A transfer tool comprising: an interlocking mechanism configured to interlockably rotate the unwinding reel and the take-up reel.

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