JP2016135562A - Laminate, production method of conductive substrate using the same, production method of electronic device, and transfer tool - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a laminate capable of transferring a porous conductive layer excellent in foil breakage resistance and transferability, and having excellent conductivity; and to provide a production method of a conductive substrate using the same, and a production method of an electronic device.SOLUTION: There is provided a laminate having a substrate, a porous conductive layer formed on the substrate, and a pressure-sensitive adhesion layer formed on the porous conductive layer.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a laminate having a porous conductive layer, a method for producing a conductive substrate using the laminate, a method for producing an electronic device, and a transfer tool used in the method for producing the conductive substrate.

  Conventionally, as a method for forming a metal layer as a conductive layer or a decorative layer on a substrate, for example, a method using a transfer sheet is known (see Patent Documents 1 to 5).

  Patent Document 1 proposes a method for forming an antenna terminal portion using a metal vapor-deposited layer transfer sheet in which a protective layer, a metal vapor-deposited layer and an adhesive layer are laminated on a substrate. In the case of a metal vapor deposition layer like patent document 1, heat resistance is calculated | required by the base layer of a metal vapor deposition layer. Therefore, when an inexpensive general-purpose plastic film such as a PET film is used as a base material, there is a problem that the film forming process, metal type, film thickness, etc. are limited because of low heat resistance, and a protective layer is formed on the base material. The heat resistance is ensured by forming etc. On the other hand, a substrate having high heat resistance such as a polyimide film, a PEN film, or a glass film can be used as the substrate, but these substrates are expensive and suitable for the substrate of the transfer sheet to be peeled and removed. I can't say.

  Patent Document 2 includes a release sheet that is a base material, an insulator layer provided on the release sheet, and a metal foil disposed in contact with the insulator layer, and the metal foil is disposed on the release sheet. There has been proposed a metal foil sheet for transfer that is adhered by electrostatic attraction generated between the insulating layer and the insulator layer. In the case of the metal foil as in Patent Document 2, there is a problem that the adhesion to the substrate is low, and the adhesion is ensured by forming a resin layer such as an insulator layer on the substrate.

  Patent Document 3 uses a thermal transfer film having a resin film, a metal foil provided on the surface of the resin film via an adhesive, and a thermosetting adhesive coated on the metal foil. Manufacture of a metal foil fuse that uses a transfer mold having a convex fuse element pattern to transfer a metal foil onto an insulating substrate via a thermosetting adhesive to the pattern shape of the fuse element of the transfer mold A law has been proposed. Also in this case, the adhesion of the resin film and the metal foil is ensured by providing the metal foil on the surface of the resin film via an adhesive.

  By the way, the transfer sheet is also required to have a foil cutting property. However, since the metal vapor-deposited layer and the metal foil are ductile, there is a problem that burrs are generated during transfer and the foil breakability is poor. Moreover, in a metal vapor deposition layer, a crystal grain may grow large, In that case, of course, foil cutting property worsens. In addition, in order to improve the foil cutting property, a method has also been proposed in which a transfer sheet is sandwiched between rugged molds, and the transfer is performed after applying stress, but the process becomes complicated.

  In general, since metal has a high thermal conductivity, heat tends to diffuse in a metal vapor deposition layer or a metal foil, and energy required for transfer tends to increase, and the shape of the transfer sheet may be distorted.

  In addition, when transferring a transfer sheet to a transfer object, for example, when a heat sealant such as a thermoplastic resin is used as an adhesive layer in order to adhere the metal vapor deposition layer or metal foil to the transfer object, thermoplasticity Heat above the glass transition temperature of the resin. At this time, thermal transfer is realized by the fact that the adhesion force between the transfer target and the metal vapor deposition layer or the metal foil is larger than the adhesion force between the substrate and the metal vapor deposition layer or the metal foil. In this case, since there is a limit to adjusting the above adhesion force only with the heat sealant, the adhesion force between the transfer target and the metal vapor deposition layer or the metal foil is determined based on the adhesion between the substrate and the metal vapor deposition layer or the metal foil. In order to make it larger than the force, it has been proposed to form fine irregularities such as roughening the contact surface with the metal vapor deposition layer or the metal foil adhesive layer, but the process becomes complicated.

  In Patent Document 4, a donor element in which a light absorption layer and a metal nanoparticle layer are laminated on a donor substrate as a base material is used, the donor element and the receiving substrate are arranged in contact with each other, and laser is irradiated from the donor element side. Then, a method of forming an electric conductor pattern on a receiving substrate by annealing and transferring the metal nanoparticle layer has been proposed. However, in this method, since metal nanoparticles are used as the conductive material, the electrical resistance at the interface between the particles is a problem. To achieve the desired conductivity, it is necessary to anneal the metal nanoparticles at a high temperature. is necessary. Therefore, the base material needs to withstand the high heat of laser annealing, the base material is limited, and it is difficult to use an inexpensive general-purpose plastic film. Moreover, an expensive base material with high heat resistance must be used as the base material to be peeled and removed, resulting in high cost.

On the other hand, in Patent Document 5, a transfer sheet in which a sintered body layer of metal ultrafine particles is formed on a base material is used, and a metal ultrafine particle is sintered on a transfer substrate having an adhesive layer formed on the surface. There has been proposed a method for forming a wiring pattern made of a binder layer. In this method, by using metal ultrafine particles, sintering can be performed even at a relatively low temperature.
However, the ultrafine metal particles may be oxidized to lower the conductivity, and the conductivity may be lowered when the sintered body of the ultrafine metal particles is transferred to the substrate to be transferred.

  As described above, in the method for forming a metal layer using a transfer sheet, the transfer process is complicated, and there is a concern that the conductivity of the metal layer is reduced due to heating during transfer and the transfer sheet is distorted. Therefore, there is a demand for a transfer sheet that can form a metal layer exhibiting good conductivity by a simple method.

Although not an invention relating to a transfer sheet, Patent Document 6 discloses an invention in which a tape-like adhesive is heated and placed on a circuit board using a transfer tool. Patent Document 6 discloses that when a plurality of circuit boards are bonded together by dispersing conductive particles in the adhesive, the wirings are made conductive. However, the adhesive of Patent Document 6 has high resistance, and it is difficult to transfer it to a transfer target and use it as a conductive layer such as wiring.
Further, although not an invention relating to a transfer sheet, Patent Document 7 discloses that an anisotropic conductive tape is applied on a circuit board by applying an anisotropic conductive tape instead of the correction tape in a transfer tool used for the correction tape. An invention for forming a film is disclosed. However, the anisotropic conductive film in Patent Document 7 exhibits conductivity by, for example, thermocompression bonding between a pair of circuit boards via an anisotropic conductive film, and is formed on the circuit board. It is difficult to use the anisotropic conductive film itself as a conductive layer such as a wiring in a circuit board.
Therefore, Patent Documents 6 and 7 disclose nothing about forming the pattern of the conductive layer using the transfer tool.

JP 2007-324641 A Japanese Unexamined Patent Publication No. 7-101198 JP-A-5-314888 JP-T 2008-554181 JP 2004-247572 A JP 2004-210524 A JP 2009-238676 A

  The present invention has been made in view of the above problems, and is a laminate capable of transferring a porous conductive layer having excellent foil cutting property and transferability and good conductivity, and a conductive substrate using the laminate. It is a main object to provide a transfer tool used in a manufacturing method, a manufacturing method of an electronic device, and a manufacturing method of the conductive substrate.

  In order to achieve the above object, the present invention has a base material, a porous conductive layer formed on the base material, and a pressure-sensitive adhesive layer formed on the porous conductive layer. A laminate is provided.

In the present invention, the resin contained in the pressure-sensitive adhesive layer can be introduced into the pores of the porous conductive layer. Therefore, the adhesion between the porous conductive layer and the pressure-sensitive adhesive layer can be enhanced, and excellent transferability can be obtained.
In the present invention, since a pressure-sensitive adhesive can be used as the pressure-sensitive adhesive layer, when the laminate is transferred onto the substrate to be transferred, heating is not required, and the porous conductive layer is oxidized. It is possible to suppress a decrease in conductivity, distortion of the stacked body, and the like.
Moreover, in this invention, since it has a porous conductive layer, brittleness is provided and favorable foil tearability and resolution can be obtained. In addition, since the porous conductive layer can be formed by sintering metal particles at a low temperature, the substrate is less likely to be damaged, and it is not necessary to use a substrate having high heat resistance. Materials can also be used.
Moreover, an electroconductive base material can be easily produced by using the laminated body of this invention.

  In the said invention, it is preferable that the said base material is a resin base material. As described above, in the present invention, a substrate having low heat resistance can be used, which is very useful in that an inexpensive general-purpose plastic resin substrate can be used.

  In the said invention, it is preferable that the said porous conductive layer contains a metal. This is because the porous conductive layer can be formed by sintering at a lower temperature using metal particles.

  In the said invention, the protective layer may be formed between the said base material and the said porous conductive layer. After the transfer, the porous conductive layer can be protected by the protective layer. Moreover, a porous conductive layer can be insulated by setting it as the protective layer which has insulation.

  In the said invention, it is preferable that the form of the said laminated body is strip | belt shape. This is because the pattern of the pressure-sensitive adhesive layer and the porous conductive layer can be easily formed on the transfer substrate.

  The present invention includes a preparation step of preparing the above-described laminate, and a transfer step of pressing and transferring the pressure-sensitive adhesive layer and the porous conductive layer of the laminate on the substrate to be transferred. A method for producing a conductive substrate is provided.

  In this invention, since the above-mentioned laminated body is used, it is excellent in foil cutting property, resolution, and transferability. Moreover, a porous conductive layer having good conductivity can be obtained even after transfer. Furthermore, an electroconductive base material can be produced easily.

  In the above-mentioned invention, it is preferable that in the transfer step, the pattern of the pressure-sensitive adhesive layer and the porous conductive layer is transferred onto the substrate to be transferred using the band-shaped laminate. A conductive substrate having a pattern of a porous conductive layer for a transfer substrate can be easily produced.

  In the above invention, in the transfer step, the pressure-sensitive adhesive layer and the porous conductive layer of the laminate are pressed and transferred onto the substrate to be transferred, whereby the first pressure-sensitive adhesive layer and the first Forming a porous conductive layer and a laminated portion in which the second pressure-sensitive adhesive layer and the second porous conductive layer are laminated, and further subjecting the laminated portion to at least one of heat treatment and pressure treatment; Thus, a connecting step of electrically connecting the first porous conductive layer and the second porous conductive layer may be included. Since the first porous conductive layer and the second porous conductive layer in the pressurized area in the laminated portion can be electrically connected, the laminated porous conductive layers in the conductive substrate can be easily connected to each other. Can be conducted in a simple manner.

  This invention provides the manufacturing method of an electronic device characterized by having the electroconductive base material preparation process which produces an electroconductive base material with the manufacturing method of the above-mentioned electroconductive base material.

  In the present invention, since the conductive substrate is produced by the above-described method for producing a conductive substrate, a porous conductive layer having good conductivity can be formed. For example, when forming a pattern of a porous conductive layer, a high-resolution pattern can be formed. Moreover, when a strip-shaped laminate is used, the pattern of the porous conductive layer can be easily formed.

  The present invention is a transfer tool used to press and transfer the pressure-sensitive adhesive layer and the porous conductive layer of the laminate in the form of a strip on the substrate to be transferred using the laminate described above. The laminate, the unwinding reel that is unwound with the pressure-sensitive adhesive layer of the laminate outside, and the pressure-sensitive adhesive layer and the porous conductive layer of the laminate that are drawn from the unwinding reel. A transfer head that pressurizes and transfers onto the substrate to be transferred, a take-up reel that winds up the substrate after transfer of the pressure-sensitive adhesive layer and the porous conductive layer, the unwind reel, and the take-up reel The transfer tool is characterized by having an interlocking mechanism that rotates the interlockingly.

  In the present invention, by using the transfer tool of the present invention, a porous conductive layer pattern can be easily formed on the substrate to be transferred using the strip-shaped laminate in the method for producing a conductive substrate. can do.

  The laminate of the present invention is excellent in foil breakability and transferability, and has the effect of being able to transfer a porous conductive layer having good conductivity.

It is a schematic sectional drawing which shows an example of the laminated body of this invention. It is process drawing which shows an example of the manufacturing method of the electroconductive base material of this invention. It is process drawing which shows the other example of the manufacturing method of the electroconductive base material of this invention. It is process drawing which shows the other example of the manufacturing method of the electroconductive base material of this invention. It is a schematic sectional drawing which shows the other example of the laminated body of this invention, and an electroconductive base material. It is a schematic sectional drawing which shows the other example of the laminated body of this invention, and an electroconductive base material. It is process drawing which shows the other example of the manufacturing method of the electroconductive base material of this invention. It is a schematic sectional drawing which shows the other example of the laminated body of this invention, and an electroconductive base material. It is process drawing which shows the other example of the manufacturing method of the electroconductive base material of this invention. It is a figure explaining the pattern of the porous conductive layer in the transcription | transfer material of Example 5 and Example 6. FIG.

  Hereinafter, the laminated body of this invention, the manufacturing method of an electroconductive base material, the manufacturing method of an electronic device, and the detail of a transfer tool are demonstrated.

A. Laminate The laminate of the present invention has a base material, a porous conductive layer formed on the base material, and a pressure-sensitive adhesive layer formed on the porous conductive layer. It is.

The laminated body of this invention is demonstrated with reference to drawings.
FIG. 1 is a schematic cross-sectional view showing an example of the laminate of the present invention. As illustrated in FIG. 1, the laminate 1 includes a base material 2, a porous conductive layer 3 formed on the base material 2, and a pressure-sensitive adhesive layer 4 formed on the porous conductive layer 3. Have.

  2A to 2C are process diagrams showing an example of a method for producing a conductive base material using the laminate of the present invention, which is an example using the laminate exemplified in FIG. First, as shown in FIG. 2A, the laminate 1 and the substrate to be transferred 11 are prepared. Next, as shown in FIG. 2 (b), the pressure-sensitive adhesive layer 4 of the laminate 1 and the transferred substrate 11 are arranged so as to be in contact with each other and pressed from the laminate 1 side. Then, as shown in FIG.2 (c), the base material 2 is peeled. As a result, the pressure-sensitive adhesive layer 4 and the porous conductive layer 3 are transferred to the transfer substrate 11 in the pressure-bonded region, and the conductive substrate 10 is obtained.

  3A to 3C are process diagrams showing another example of a method for producing a conductive substrate using the laminate of the present invention, and an example using the laminate shown in FIG. First, as shown in FIG. 3A, the laminate 1 and the substrate to be transferred 11 are prepared. Next, as shown in FIG. 3 (b), the pressure-sensitive adhesive layer 4 of the laminate 1 and the transferred substrate 11 are arranged so as to be in contact with each other and pressed from the laminate 1 side. At this time, partial pressing is performed with the uneven plate 12 or the like. Then, as shown in FIG.3 (c), the base material 2 side is peeled. As a result, the pressure-sensitive adhesive layer 4 and the porous conductive layer 3 are transferred to the transferred substrate 11 in the pressed region, and the conductive substrate 10 having a pattern of the pressure-sensitive adhesive layer 4 and the porous conductive layer 3 is formed. can get.

4A and 4B are process diagrams showing another example of a method for producing a conductive substrate using the laminate of the present invention. FIGS. 4A and 4B are examples using a transfer tool having a belt-like laminate. FIG. 4B is a schematic plan view of the portion A of FIG. 4A viewed from the porous conductive layer 3 side. First, as shown in FIG. 4A, a belt-like laminate 1 and a substrate to be transferred 11 are prepared. Next, the transfer tool 20 is used so that the pressure-sensitive adhesive layer 4 of the laminate 1 and the transfer target substrate 11 are in contact with each other, and the transfer tool 20 is moved in a predetermined direction while applying pressure from the laminate 1 side. To do. At this time, the pressure-sensitive adhesive layer 4 and the porous conductive layer 3 are transferred onto the transfer target substrate 11 along the moving direction of the transfer tool 20, and the substrate 2 is peeled off. Thereby, the patterns of the pressure-sensitive adhesive layer 4 and the porous conductive layer 3 can be transferred onto the transfer substrate 11 as shown in FIGS.
The transfer tool 20 will be described later.

  In the present invention, since the resin contained in the pressure-sensitive adhesive layer can enter the pores of the porous conductive layer, not only the surface area to which the porous conductive layer and the pressure-sensitive adhesive layer are bonded increases, The anchor effect can enhance the adhesion between the porous conductive layer and the pressure-sensitive adhesive layer. Therefore, when transferring the laminate of the present invention to a substrate to be transferred, the pressure-sensitive adhesive layer and the porous conductive layer can be satisfactorily transferred to the substrate to be transferred, and excellent transferability can be obtained. it can.

  As will be described later, in the porous conductive layer, the metal particles are sintered and fused together, so that the region where the component derived from the adhesive layer enters the pores of the porous conductive layer is also conductive. Contribute to. Therefore, the adhesiveness with the adhesive layer can be improved without reducing the conductivity.

  In the present invention, since a pressure-sensitive adhesive can be used as the pressure-sensitive adhesive layer, when the laminate is transferred onto the substrate to be transferred, heating is not required. It is possible to suppress a decrease in conductivity due to oxidation, distortion of the stacked body, and the like.

  In the present invention, since the porous conductive layer is porous, brittleness is imparted. Therefore, unlike conventional vapor deposition layers, burrs are hardly generated during transfer, and large crystal grains are not included. Therefore, good foil breakability can be obtained. Furthermore, as illustrated in FIGS. 3A to 3C, when the pressure-sensitive adhesive layer and porous conductive layer pattern of the laminate of the present invention are transferred to a substrate to be transferred, transfer is performed with good resolution. be able to.

  Here, it is known that metal particles are sintered at a low temperature when the particle diameter is reduced. In the present invention, when such metal particles become nanoparticles, the porous conductive layer is formed by sintering the metal particles at a low temperature by utilizing the property of sintering at a temperature much lower than the melting point of the metal particles. Can be formed. Therefore, there is little damage to the substrate, and it is not necessary to use a substrate having high heat resistance, and a substrate having low heat resistance can also be used. In particular, it is very useful in that an inexpensive general-purpose plastic resin substrate such as polyethylene terephthalate can be used.

  In the present invention, the porous conductive layer can be formed by, for example, applying a metal particle dispersion containing metal particles on a base material and baking the porous conductive layer, and has good adhesion to the base material. A conductive layer can be obtained. Therefore, it is not necessary to form another layer on the base material or to perform surface treatment in order to improve adhesion.

  Moreover, since the porous conductive layer can be formed on the substrate to be transferred by transferring the laminate of the present invention to the substrate to be transferred, a porous conductive layer has conventionally been formed as the substrate to be transferred. Substrates that have been difficult to do can also be used. Therefore, an inexpensive general-purpose plastic resin substrate such as polyethylene terephthalate or a conductive substrate having a porous conductive layer formed on a paper substrate or the like can be obtained. Furthermore, it is also possible to form a porous conductive layer on a substrate to be transferred that is a three-dimensional object.

  Moreover, since the porous conductive layer in this invention is porous, it can show high tolerance with respect to a bending. Therefore, when a base material has flexibility, it can transfer to a to-be-transferred base material, giving a high curvature to a laminated body.

  Hereinafter, each structure in the laminated body of this invention is demonstrated.

1. Porous conductive layer The porous conductive layer in the present invention is formed on a substrate.

  Here, the porous conductive layer refers to a conductive layer having a large number of holes, and has a surface area larger than that of a conductive layer having the same volume and having no holes.

Examples of the conductive material constituting the porous conductive layer include metals and metal oxides. The conductive material constituting the porous conductive layer may be one type or two or more types.
Of these, metals are preferred. This is because the metal particles can be sintered at a lower temperature to form a porous conductive layer.

Examples of the metal include gold, silver, copper, nickel, platinum, palladium, molybdenum, aluminum, antimony, tin, chromium, indium, gallium, germanium, zinc, titanium, and lead. Among these, silver and copper are preferable from the viewpoint of conductivity and cost. 1 type may be sufficient as a metal and 2 or more types may be sufficient as it.
Examples of the metal oxide include indium tin oxide and antimony-doped tin oxide.

  The shape of the hole in the porous conductive layer is not particularly limited as long as the component derived from the adhesive layer can enter at least a part of the holes. It is preferable that at least the surface on the adhesive layer side of the porous conductive layer has communication holes in which a large number of holes are connected to each other.

The porosity of the porous conductive layer is not particularly limited as long as the conductivity and adhesiveness can be adjusted as appropriate. Specifically, the porosity of the porous conductive layer is preferably in the range of 5% to 50%, more preferably in the range of 10% to 45%, in particular 15% to 40%. It is preferable to be within the range. If the porosity is too large, the adhesion between the porous conductive layer and the substrate may be reduced. On the other hand, if the porosity is too small, the above-described effects due to the components derived from the adhesive layer entering the pores of the porous conductive layer may not be sufficiently obtained.
In addition, the porosity of a porous conductive layer represents the part in which the material which comprises a porous conductive layer does not exist, and the part in which the component derived from a contact bonding layer is mixed is also contained.

The porosity can be confirmed from a scanning electron microscope (SEM) image of a cross section of the porous conductive layer before forming the adhesive layer. Specifically, the area of the pores and the area of the porous conductive layer are calculated from the obtained SEM images, and the porosity in the cross section is obtained by dividing the area of the holes by the area of the porous conductive layer. be able to. The porosity is calculated from the porous conductive layer excluding the substrate, and the pores at the interface between the substrate and the porous conductive layer are included in the porous conductive layer.
The porosity can also be confirmed from a scanning electron microscope (SEM) image of the cross section of the laminate. Specifically, the area of the hole, the area of the component derived from the adhesive layer, and the area of the porous conductive layer are calculated from the obtained SEM image, respectively, and the area of the hole and the area of the component derived from the adhesive layer are calculated. The porosity in the cross section can be obtained by dividing the total by the area of the porous conductive layer.
Similarly, the porosity is similarly determined for a plurality of cross sections in accordance with the size of the laminate, and the average value is taken as the porosity of the porous conductive layer.
The porosity can be appropriately adjusted according to the particle diameter of the metal particles used in the metal particle dispersion, the type of the dispersant, the firing conditions, and the like in the method for forming the porous conductive layer described later.

  The porous conductive layer 3 may be formed on the entire surface of the substrate 2 as illustrated in FIG. 1, and is formed in a pattern on the substrate 2 as illustrated in FIG. 5A. Also good. When the porous conductive layer 3 is formed in a pattern on the base material 2 as illustrated in FIG. 5A, the layered body 1 is not partially transferred in FIG. 5B. As illustrated, the pattern of the porous conductive layer 3 can be transferred onto the transfer substrate 11.

  The thickness of the porous conductive layer is about 0.01 μm to 50 μm, preferably within the range of 0.05 μm to 10 μm, and particularly preferably within the range of 0.1 μm to 5 μm.

As a method for forming the porous conductive layer, a method in which a metal particle dispersion containing metal particles is applied on a substrate and fired is used.
In the present specification, the metal particles include alloy particles, metal compound particles, and the like in addition to metal particles.

As a metal particle, it can select from the metal particle which produces electroconductivity after baking suitably, and can be used.
Examples of the metal constituting the metal particles include gold, silver, copper, nickel, platinum, palladium, molybdenum, aluminum, antimony, tin, chromium, indium, gallium, germanium, zinc, titanium, lead, and the like. Among these, silver and copper are preferable from the viewpoint of conductivity and cost. The metal constituting the metal particles may be one kind or two or more kinds. Further, a metal in which two or more kinds of metals form a core-shell structure, a metal in which the surface of particles in a metal state is oxidized or nitrided, or the like may be used. The surface of the metal particles may be oxidized or may be oxidized to the inside.
Examples of the metal compound constituting the metal compound particles include metal oxides, metal nitrides, metal hydrides, metal hydroxides, and organometallic compounds. These metal compounds are preferably those which are decomposed into a metal state upon firing. For example, particles of a metal compound that exhibits conductivity by reduction, specifically, particles of a metal compound such as cuprous oxide, cupric oxide, silver oxide, copper nitride, copper hydride, and the like can be given. Examples of the metal oxide include indium tin oxide and antimony-doped tin oxide.
A metal particle may be used individually by 1 type and may be used in combination of 2 or more type.
Among these, particles in a metal state are preferable. This is because the metal particles can be sintered at a lower temperature to form a porous conductive layer.

  The metal particles are preferably metal nanoparticles. That is, the porous conductive layer is preferably a sintered body of metal nanoparticles. This is because when a metal particle dispersion containing metal nanoparticles is applied and baked to form a porous conductive layer, the pore size and crystal grain size can be controlled within a range suitable for foil breakability. .

The average particle diameter of the metal particles is preferably in the range of 1 nm to 200 nm, more preferably in the range of 2 nm to 150 nm, and particularly preferably in the range of 2 nm to 100 nm. When the average particle diameter is within the above range, the dispersion stability of the metal particle dispersion used when forming the porous conductive layer is good, and the conductivity when forming the porous conductive layer is good, In addition, the melting point is kept low, sufficient sintering is possible, and high conductivity is obtained.
Here, the average particle diameter of the metal particles is an average primary particle diameter of metal particles in a metal particle dispersion described later, and can be measured from an image observed with a transmission electron microscope.

  As a method for preparing metal particles, for example, a physical method obtained by pulverizing metal powder or metal oxide powder by a mechanochemical method or the like; CVD method, vapor deposition method, sputtering method, thermal plasma method, laser method, etc. A chemical dry method; a method called a chemical wet method using a thermal decomposition method, a chemical reduction method, an electrolysis method, an ultrasonic method, a laser ablation method, a supercritical fluid method, a microwave synthesis method, or the like can be given.

  In order to obtain a metal particle dispersion, the obtained metal particles are obtained by using a protective agent such as a water-soluble polymer compound such as polyvinylpyrrolidone or a graft copolymer polymer compound, a surfactant, a metal or a metal oxide. It is preferable to coat with a compound having a thiol group, amino group, hydroxyl group, or carboxyl group that interacts with the product. Depending on the method of synthesizing the metal particles, the pyrolyzate or oxide of the raw material may protect the particle surface and contribute to dispersibility. In the case of a wet method such as a thermal decomposition method or a chemical reduction method, the reducing agent or the like may act as a protective agent for the metal particles as it is. In addition, in order to improve the dispersion stability of the metal particle dispersion liquid, surface treatment of the metal particles is performed, or a dispersant composed of a polymer compound, an ionic compound, a surfactant or the like is added to the metal particle dispersion liquid. May be.

  The dispersion medium used in the metal particle dispersion is not particularly limited as long as it can disperse metal particles. For example, water or an organic solvent can be used. Examples of the organic solvent include alcohols, ketones, esters, ethers, aliphatic hydrocarbons, alicyclic hydrocarbons, aromatic hydrocarbons, and the like.

  Moreover, you may add a viscosity modifier, a surface tension modifier, a stabilizer, etc. to a metal particle dispersion liquid as needed.

  The metal particle dispersion preferably has a solid content concentration in the range of 5% by mass to 95% by mass, particularly in the range of 10% by mass to 90% by mass, particularly in the range of 15% by mass to 85% by mass. Preferably there is. When the solid content concentration is within the above range, sufficient conductivity is obtained, the viscosity is sufficiently low, and the metal particle dispersion can be easily applied to the substrate.

When applying the metal particle dispersion on the substrate, the metal particle dispersion may be applied over the entire surface of the substrate, or the metal particle dispersion may be applied in a pattern on the substrate.
Examples of the method for applying the metal particle dispersion on the substrate include gravure printing, screen printing, spray coating, spin coating, comma coating, bar coating, knife coating, die coating, offset printing, flexographic printing, inkjet printing, and dispenser. Printing etc. can be mentioned. When applying a metal particle dispersion in a pattern on a substrate, gravure printing, flexographic printing, screen printing, and inkjet printing are preferred from the viewpoint that fine patterning can be performed.

  After application of the metal particle dispersion, drying may be performed by a normal method. For example, the drying method which heats for about 0.1 minute-20 minutes at the temperature of about 80 degreeC-140 degreeC using a general oven etc. is mentioned. Although the thickness of the coating film after drying can be controlled by adjusting the coating amount, the average particle diameter of the metal particles, and the like, it is usually about 0.01 μm to 100 μm, preferably 0.1 μm to 50 μm. Within range.

The method for firing the coating film of the metal particle dispersion may be any method that can sinter the metal particles, and a general firing method can be applied. For example, a heat treatment method, a light treatment method, a plasma treatment method, or the like can be given. By baking the coating film, a porous conductive layer made of a sintered body of metal particles is obtained.
Examples of the heat treatment include hot plate heating, hot air heating, hot pressing using a hot plate or a hot roll.
Examples of the light treatment include laser treatment, ultraviolet lamp treatment, infrared lamp treatment, far-infrared lamp treatment, and flash light lamp treatment.
The plasma treatment is a treatment that ionizes gases such as hydrogen, carbon monoxide, ammonia, alcohol, etc. that exhibit reducibility into a plasma state and generates highly reactive active species, for example, electron cyclotron resonance (ECR) plasma. , Capacitively coupled plasma, inductively coupled plasma, atmospheric pressure plasma, microwave plasma, surface wave plasma generated by application of microwave energy, and the like. Among these, surface wave plasma treatment is preferable.
In addition, said baking method can be used in combination of 2 or more type.

  Microwave surface wave plasma has the characteristics of high plasma density and low electron temperature, and the coating film can be fired at a low temperature in a short time to form a dense and smooth porous conductive layer. Can do. The surface wave plasma is irradiated with plasma having a uniform density within the surface with respect to the processing surface. As a result, compared to other firing methods, it is less likely to form a non-uniform film such as partial sintering of metal particles in the plane, and grain growth can be prevented. A dense and smooth film can be obtained. In addition, since it is not necessary to provide an electrode in the in-plane processing chamber, contamination of impurities derived from the electrode can be prevented, and damage to the processing material due to abnormal discharge can be prevented. Furthermore, when using a resin base material, there is little damage to a resin base material, and there is also little damage to another layer.

  Moreover, the microwave surface wave plasma is suitable for enhancing the adhesion of the porous conductive layer to the resin substrate. This is presumably because microwave surface wave plasma is likely to generate a polar functional group such as a hydroxyl group or a carboxyl group at the interface between the substrate and the porous conductive layer. In particular, when a plasma generated in a reducing gas atmosphere is used for a polyester base material, the plasma of the gas containing the reducing gas reacts with the ester bond of the base material, and is modified to the interface side of the base material. It is presumed that the adhesiveness at the interface between the porous conductive layer and the base material is improved because the quality is increased and many reactive groups with high polarity are generated. Therefore, the microwave surface wave plasma is different from the conventional method in which the substrate surface is roughened by plasma treatment or the like in advance and the adhesion to the porous conductive layer is improved. It is excellent in that the adhesion to the layer is high.

  In addition, about the conditions of microwave surface wave plasma, the conditions as described in Unexamined-Japanese-Patent No. 2010-86825 are applicable, for example.

The atmosphere at the time of firing is appropriately selected according to the type of conductive material constituting the porous conductive layer.
In the case of forming a porous conductive layer containing a metal, an atmosphere of an inert gas or a reducing gas is preferable, and a reducing gas is particularly preferable. In the case of a reducing gas atmosphere, the oxide present on the surface of the metal particles is reduced and removed, and a porous conductive layer having good conductivity can be formed. Therefore, when forming a porous conductive layer which is a porous layer containing a metal, metal particles whose surface is oxidized or metal particles whose surface is oxidized can be used.

Examples of the reducing gas include hydrogen, carbon monoxide, ammonia, and a mixed gas thereof. Of these, hydrogen gas is preferred. Hydrogen gas is suitable for removing organic substances adhering to the surface of the metal particles.
The reducing gas may be mixed with an inert gas such as nitrogen, helium, argon, neon, krypton, or xenon. In this case, there is an effect that plasma is easily generated.

  On the other hand, in the case of forming a porous conductive layer containing a metal oxide, an atmosphere containing an inert gas such as nitrogen or argon and oxygen as necessary may be used.

Furthermore, when a porous conductive layer containing copper is formed, a method using hydrogen plasma or nitrogen plasma is preferable. In particular, by using hydrogen plasma, a specific resistance of about 3 × 10 ⁻⁶ Ω · cm to 3 × 10 ⁻⁵ Ω · cm is obtained, and a porous conductive layer having good adhesion to the substrate is formed. Because it can.

The firing temperature may be any temperature that allows the metal particles to be sintered, and is appropriately selected according to the type, particle diameter, firing method, and the like of the metal particles. Especially, it is preferable that a calcination temperature is below the heat-resistant temperature of a base material, and the inside of the range of 100 to 150 degreeC is preferable if silver particle is made into an example.
The firing time is appropriately selected according to the type of metal particles, the firing method, and the like. For example, when silver particles are fired by heat treatment, the firing time is preferably within a range of 10 minutes to 120 minutes, and more preferably within a range of 15 minutes to 40 minutes. For example, when copper particles are fired by hydrogen plasma, the firing time is preferably within a range of 1 minute to 10 minutes, and more preferably within a range of 2 minutes to 5 minutes.

2. Pressure-sensitive adhesive layer The pressure-sensitive adhesive layer in the present invention is formed on the porous conductive layer. The pressure-sensitive adhesive layer has a function of adhering the porous conductive layer and the transferred substrate when transferring the laminate of the present invention to the transferred substrate.

  Examples of the material for the pressure-sensitive adhesive layer include a pressure-sensitive adhesive and a photosensitive resin whose adhesiveness or adhesiveness is reduced by light irradiation.

The pressure sensitive adhesive is not particularly limited as long as it can adhere the porous conductive layer and the substrate to be transferred, and is appropriately selected according to the type of the substrate to be transferred. The For example, a general pressure-sensitive adhesive used for a transfer foil can be used. A pressure sensitive adhesive may be used individually by 1 type, and may be used in combination of 2 or more types.
The pressure-sensitive adhesive is not particularly limited as long as it exhibits tackiness or adhesiveness under pressure, and a curable resin that is partially cured or a crosslinked rubber material may be used.
Specific examples of pressure-sensitive adhesives include acrylic resin, urethane resin, amide resin, epoxy resin, styrene-butadiene copolymer, natural rubber, casein, gelatin, rosin resin, terpene resin, phenol resin, styrene resin, Conventional adhesives such as silicone resin, styrene resin, polyolefin, urethane resin, ionomer resin, vinyl chloride resin, vinyl acetate resin, vinyl chloride-vinyl acetate copolymer resin, polyester resin, polyamide resin can be widely used. . As the pressure-sensitive adhesive, an adhesive that does not stick at room temperature and develops tackiness or adhesiveness by pressurization is preferable.

  As the photosensitive resin whose tackiness or adhesiveness is reduced by light irradiation, for example, it is cured by irradiation with light of a specific wavelength such as ultraviolet ray, visible light, infrared ray, etc., and the tackiness or adhesiveness is lowered, and In the non-light-irradiated portion, a material capable of bonding the porous conductive layer and the substrate to be transferred can be used. Specifically, known materials such as polyfunctional (meth) acrylic resins formulated with photopolymerization initiators or photocurable varnishes formulated with epoxy resins with photoacid generators or photobase generators are widely used. it can. Also, a solvent dilution type, a W / O emulsion type, or a non-sol type that does not contain a solvent may be used. Such photosensitive resin may be used individually by 1 type, and may be used in combination of 2 or more type.

  Further, the pressure-sensitive adhesive layer may contain additives in addition to the pressure-sensitive adhesive. Examples of the additive include a dispersant, a filler, a plasticizer, and an antistatic agent.

  When a pressure sensitive adhesive is used, the pressure sensitive adhesive layer 4 may be formed on the entire surface of the substrate 2 as illustrated in FIG. 1, and on the substrate 2 as illustrated in FIG. It may be formed in a pattern. As shown in FIG. 6A, when the pressure-sensitive adhesive layer 4 is formed in a pattern on the substrate 2, the laminate 1 is not partially transferred but is shown in FIG. 6C. As described above, the pattern of the porous conductive layer 3 can be transferred onto the transfer substrate 11.

Moreover, when using the photosensitive resin which adhesiveness or adhesiveness falls by light irradiation, the contact bonding layer 4 is normally formed in the whole surface on the base material 2 so that it may illustrate in Fig.7 (a).
FIGS. 7A to 7D are process diagrams showing another example of a method for producing a conductive substrate using the laminate of the present invention. The pressure-sensitive adhesive layer 4 is adhesive or adhesive by light irradiation. This is an example of using a photosensitive resin in which the decrease in viscosity occurs. First, as shown in FIG. 7A, a laminate 1 in which a porous conductive layer 3 and a pressure-sensitive adhesive layer 4 are sequentially laminated on a substrate 2 is prepared, and a photomask 15 is attached to the pressure-sensitive adhesive layer 4. Then, the light 16 is irradiated in a pattern to reduce the adhesiveness or adhesiveness at the light irradiation portion of the pressure-sensitive adhesive layer 4 to form the low adhesion portion 4b. Next, as shown in FIGS. 7B to 7C, the pressure-sensitive adhesive layer 4 of the laminate 1 and the transferred substrate 11 are arranged so as to be in contact with each other and are brought into close contact with each other. Then, as shown in FIG.7 (d), the base material 2 side is peeled. Since the pressure-sensitive adhesive layer 4 includes an adhesive portion 4a that is a non-light-irradiated portion and a low-adhesion portion 4b that is a light-irradiated portion and has reduced adhesiveness or adhesiveness, the adhesive portion 4a However, in the low adhesion part 4b, the adhesion to the substrate 11 to be transferred is lowered. Therefore, when the base material 2 side is peeled off, the porous conductive layer 3 and the pressure-sensitive adhesive layer 4 are peeled off together with the base material 2 in the low adhesion portion 4b, and the adhesive portion 4a adheres to the transfer base material 11 and is porous. The conductive conductive layer 3 is transferred. Thereby, the electroconductive base material 10 which has the pattern of the pressure sensitive adhesive layer 4 and the porous conductive layer 3 is obtained. Also in this case, the pattern of the porous conductive layer 3 can be transferred onto the transfer substrate 11 without partially transferring the laminate 1.

  Examples of the method for forming the pressure-sensitive adhesive layer include a method in which a resin composition such as a pressure-sensitive adhesive or a photosensitive resin is applied on the porous conductive layer and dried. As a coating method of the resin composition, it can be appropriately selected from general coating methods and applied, for example, gravure printing, screen printing, spray coating, spin coating, comma coating, bar coating, knife coating, die coating, Examples include offset printing, flexographic printing, inkjet printing, dispenser printing, and the like.

  The thickness of the pressure-sensitive adhesive layer is not particularly limited as long as the thickness of the pressure-sensitive adhesive layer can be cut when transferring the laminate of the present invention to the substrate to be transferred. It is appropriately selected depending on the type. Specifically, the thickness of the pressure-sensitive adhesive layer is preferably in the range of 0.1 μm to 50 μm, and more preferably in the range of 0.5 μm to 25 μm. If the thickness of the pressure-sensitive adhesive layer is too thin, there is a possibility that the adhesion to the transfer substrate will be insufficient. On the other hand, if the thickness is too large, the pressure applied to the pressure-sensitive adhesive layer becomes too great when the laminate of the present invention is transferred, and the transferred substrate or the like may be damaged. Further, for example, when the substrate to be transferred is a paper substrate, some paper substrates are difficult to transfer depending on the type. In that case, from the viewpoint of transferability, the thickness of the pressure-sensitive adhesive layer is in the above range. Of these, a relatively thick film is preferable.

  Further, as illustrated in FIG. 6B, the non-pressure-sensitive adhesive layer 5 may be formed in a pattern on the pressure-sensitive adhesive layer 4. Also in this case, the pattern of the porous conductive layer 3 can be transferred onto the transfer substrate 11 as shown in FIG. 6C without partially transferring the laminate 1.

Examples of the material for the non-pressure-sensitive adhesive layer include a thermoplastic resin that does not melt at a temperature at which the adhesive layer melts, a thermosetting resin, and a photocurable resin.
The thickness of the non-pressure-sensitive adhesive layer may be any thickness that allows the pressure-sensitive adhesive layer and the transferred substrate to be bonded when the laminate of the present invention is transferred to the transferred substrate. It is appropriately selected depending on the method and the type of the substrate to be transferred. Specifically, the thickness of the non-pressure sensitive adhesive layer is preferably in the range of 100 nm to 3 μm.
Examples of the method for forming the non-pressure-sensitive adhesive layer include a method in which the resin composition is applied in a pattern on the pressure-sensitive adhesive layer, dried, and cured as necessary. As a coating method of the resin composition, it can be applied by appropriately selecting from general coating methods.

3. Base material The base material used in the present invention supports the porous conductive layer and the pressure-sensitive adhesive layer.
The substrate is not particularly limited as long as the porous conductive layer can be formed. Examples thereof include inorganic substrates such as glass substrates and ceramic substrates, metal substrates, resin substrates, and paper substrates. A material etc. can be used.
Especially, it is preferable that a base material is a resin base material. In the present invention, the metal particles can be sintered at a low temperature to form a porous conductive layer, as will be described later. Therefore, it is necessary to use a highly heat-resistant substrate with little damage to the substrate. However, a substrate having low heat resistance can also be used. In particular, it is very useful in that an inexpensive general-purpose plastic resin substrate such as polyethylene terephthalate can be used.

  A general resin substrate can be used as the resin substrate. Preferred examples of the resin substrate include polyimide, polyamide, polyamideimide, polyethylene terephthalate, polyethylene naphthalate, polyphenylene sulfide, polyether ether ketone, polyether sulfone, polycarbonate, polyether imide, epoxy resin, phenol resin, and glass. -Resin films such as epoxy resins, polyphenylene ethers, acrylic resins, polyolefins such as polyethylene and polypropylene, polycycloolefins such as polynorbornene, and liquid crystalline polymer compounds. Among them, an inexpensive general-purpose plastic resin base material such as polyethylene terephthalate is preferable.

  The substrate may be flexible or rigid, and is appropriately selected according to the method for transferring the laminate of the present invention to the substrate to be transferred. Especially, it is preferable that a base material has flexibility. The porous conductive layer described above is porous and exhibits high resistance to bending. Therefore, when the substrate has flexibility, it can be transferred to the substrate to be transferred while giving the laminate a high curvature. Moreover, it is more preferable that it is a resin base material which has flexibility from the reason mentioned above.

Further, a release layer may be formed on the surface of the substrate, or a release treatment may be performed. This is because peeling between the substrate and the porous conductive layer or the protective layer becomes easy.
Examples of the material for the release layer include a fluorine release agent, a silicone release agent, and a wax release agent. Examples of the method for forming the release layer include a method in which a release agent is applied by a coating method such as dip coating, spray coating, or roll coating.
Examples of the mold release treatment include surface treatment such as fluorine treatment and silicone treatment.

  Although it does not specifically limit as thickness of a base material, In the case of an inorganic base material, it is about 0.1 mm-10 mm normally, Preferably it exists in the range of 0.5 mm-5 mm. On the other hand, in the case of a resin base material, the thickness of the base material is usually about 1.0 μm to 1000 μm. When the thickness of the resin base material is within the above range, deformation of the base material is suppressed when forming the porous conductive layer, which is preferable in terms of shape stability of the formed porous conductive layer. This is preferable in terms of flexibility when the machining is performed continuously.

4). Other Configurations The laminate of the present invention may have other configurations as necessary in addition to the above-described base material, porous conductive layer, and pressure-sensitive adhesive layer. For example, an antistatic layer, a heat-resistant protective layer, a friction-resistant layer, a slipping layer, or the like may be provided on the surface of the substrate opposite to the surface on which the porous conductive layer is formed. Moreover, the protective layer may be formed between the base material and the porous conductive layer. Hereinafter, the protective layer will be described.

(Protective layer)
In the present invention, as exemplified in FIG. 8A, a protective layer 6 may be formed between the base material 2 and the porous conductive layer 3. As shown in FIG. 8B, the protective layer 6 is the outermost layer of the conductive substrate 10 after the porous conductive layer 3 is transferred from the laminate 1 to the transferred substrate 11, The porous conductive layer 3 can be protected from abrasion, light, chemicals, and the like. Moreover, a porous conductive layer can be insulated by setting it as the protective layer which has insulation.

The material of the protective layer may be any material that can protect the porous conductive layer and has an insulating property, and examples thereof include an ultraviolet curable resin and an electron beam curable resin. The protective layer may further contain a filler.
Moreover, you may use a protective film as a protective layer.

As a formation method of a protective layer, the method of apply | coating curable resin composition on a base material, and drying is mentioned, for example. Examples of the method for applying the curable resin composition include a gravure coating method, a roll coating method, a comma coating method, a gravure printing method, a screen printing method, and a gravure reverse roll coating method.
When a protective film is used as the protective layer, the substrate and the protective film can be bonded together via a weak adhesive layer. When the weak adhesive layer is peeled off, the weak adhesive layer is preferably peelable together with the base material.

  The thickness of the protective layer is preferably in the range of 0.5 μm to 30 μm, and more preferably in the range of 3 μm to 15 μm. When the thickness of the protective layer is within the above range, surface properties such as excellent high hardness, scratch resistance, chemical resistance and stain resistance can be obtained, and further excellent moldability and shape followability can be obtained. it can.

5. Form The form of the laminate of the present invention is not particularly limited as long as the pressure-sensitive adhesive layer and the porous conductive layer can be transferred onto the substrate to be transferred, and examples thereof include a sheet form and a belt form.
Especially, in this invention, it is preferable that the form of a laminated body is strip | belt shape. This is because the porous conductive layer can be easily formed in a desired wiring pattern on the transfer substrate. In this case, the base material is preferably flexible.

When the laminate is in the form of a strip, the line width of the laminate can be appropriately selected depending on the application, and is not particularly limited, but is in the range of 0.5 mm to 50 mm, and in particular, the range of 1.0 mm to 30 mm. Especially, it is preferable that it exists in the range of 1.0 mm-10 mm.
When the line width is within the above range, a known correction tape transfer tool can be applied to a laminate transfer tool, and the porous conductive layer can be easily formed into a desired wiring pattern on the substrate to be transferred. It is because it can form.

  The band-shaped laminate can be obtained, for example, by forming a pressure-sensitive adhesive layer and a porous conductive layer on a band-shaped substrate. Moreover, a strip-shaped laminate can be obtained by cutting a sheet-like laminate with a predetermined line width.

6). Applications The laminate of the present invention can be used for the production of conductive substrates as described later. For example, printed wiring boards, electromagnetic shielding materials, antennas, power semiconductors, noise filters, capacitor electrodes, various sensor electrodes ( (Touch sensor, biosensor, temperature sensor, gas sensor, light sensor, pressure sensor, flow sensor), display electrode, solar cell electrode, IC card, RFID, etc. .
The laminate of the present invention can be used as an electromagnetic wave shielding layer for preventing unauthorized reading of information recorded on a non-contact type IC card and a conductive layer for modulating the resonance frequency. For example, a porous conductive layer can be applied to a part of the card and transported in a state where reading is impossible, and the pressure-sensitive adhesive layer can be scratched and removed at the time of use. Since the laminate of the present invention has a porous conductive layer, it can be easily peeled off by scratching by controlling the adhesive force of the pressure-sensitive adhesive layer.
The laminate of the present invention can also be used to form designs, designs, characters, etc. that take advantage of the color and gloss of the porous conductive layer.

B. The manufacturing method of the electroconductive base material The manufacturing method of the electroconductive base material of this invention prepares the above-mentioned laminated body, the said pressure-sensitive adhesive layer of the said laminated body on the to-be-transferred base material, and the said porous electroconductivity And a transfer step of transferring the layer by pressurizing the layer.

  2 (a) to 2 (c), 3 (a) to 3 (c), 4 (a), and 4 (b) are process diagrams showing an example of the method for producing a conductive substrate of the present invention. 2 (a) to (c), FIGS. 3 (a) to (c), and FIGS. 4 (a) and (b) are described in detail in the above “A. Laminate”. Description is omitted.

  In the present invention, since the resin contained in the pressure-sensitive adhesive layer can enter the pores of the porous conductive layer, not only the surface area to which the porous conductive layer and the pressure-sensitive adhesive layer are bonded increases, The anchor effect can enhance the adhesion between the porous conductive layer and the pressure-sensitive adhesive layer. Therefore, in the transfer step, the pressure-sensitive adhesive layer and the porous conductive layer can be satisfactorily transferred to the transfer substrate, and excellent transferability can be obtained.

  In the present invention, a pressure-sensitive adhesive and a pressure-sensitive adhesive can be used as the pressure-sensitive adhesive layer. Therefore, when transferring the laminate onto the substrate to be transferred, heating is not required, and the porous conductive layer is used. It is possible to suppress a decrease in conductivity due to oxidation of the metal, distortion of the laminate, and the like.

  In the present invention, since the porous conductive layer is porous, brittleness is imparted. Therefore, unlike conventional vapor deposition layers, burrs are hardly generated during transfer, and large crystal grains are not included. Therefore, good foil breakability can be obtained. Furthermore, as illustrated in FIGS. 3A to 3C, when the pattern of the pressure-sensitive adhesive layer and the porous conductive layer of the laminate is transferred onto the transfer substrate, it can be transferred with high resolution. it can. Further, by using a belt-like laminate as illustrated in FIGS. 4A and 4B, a pressure sensitive adhesive layer and a porous conductive layer pattern can be easily formed on a substrate to be transferred using a transfer tool. Can be transferred.

  In the present invention, since the porous conductive layer can be formed by sintering metal particles at a low temperature, it is not necessary to use a highly heat-resistant substrate as the substrate of the laminate, and the heat resistance is low. Substrates can also be used. In particular, an inexpensive general-purpose plastic resin substrate such as polyethylene terephthalate can be used. Therefore, the manufacturing cost can be reduced.

  In addition, since the pressure-sensitive adhesive layer and the porous conductive layer are transferred onto the substrate to be transferred, a substrate that has conventionally been difficult to form a porous conductive layer can also be used as the substrate to be transferred. . Therefore, an inexpensive general-purpose plastic resin base material such as polyethylene terephthalate or a conductive base material in which a porous conductive layer is formed on a transfer base material such as a paper base material can be obtained. Furthermore, it is also possible to form a porous conductive layer on a substrate to be transferred that is a three-dimensional object. Moreover, a conductive base material can be easily produced only by pressurizing and transferring a pressure-sensitive adhesive layer and a porous conductive layer on a transfer target base material.

  Hereinafter, each process in the manufacturing method of the electroconductive base material of this invention is demonstrated.

1. Preparatory process The preparatory process in this invention is a process of preparing the above-mentioned laminated body.
In addition, since it described in detail in said "A. laminated body" about the laminated body, description here is abbreviate | omitted.

2. Transfer process The transfer process in the present invention is a process of transferring the pressure-sensitive adhesive layer and porous conductive layer of the laminate on the transfer substrate by applying pressure.

  The substrate to be transferred is not particularly limited as long as the porous conductive layer can be pressed and transferred through the pressure-sensitive adhesive layer, and is appropriately selected depending on the use of the conductive substrate. Selected. For example, a resin base material, a paper base material, a glass base material, a ceramic base material, a metal base material, etc. are mentioned.

  As a method for transferring the pressure-sensitive adhesive layer and the porous conductive layer of the laminate on the transfer substrate, the method can attach the pressure-sensitive adhesive layer to a predetermined position on the transfer substrate. There is no particular limitation as long as it includes, for example, a method using a roller or a stamp, a pressing method, and the like.

  In addition, as illustrated in FIGS. 3A to 3C, when the pattern of the pressure-sensitive adhesive layer and the porous conductive layer is transferred onto the substrate to be transferred by pressurization, as a transfer method, for example, Examples thereof include a method using a concavo-convex plate and a method of drawing a laminate using projections such as needles.

  When transferring the pressure-sensitive adhesive layer and the porous conductive layer onto the transfer substrate, the pattern of the pressure-sensitive adhesive layer and the porous conductive layer may be pressed and transferred onto the transfer substrate. Good. A conductive substrate in which a pattern of a porous conductive layer is formed on a transfer substrate can be obtained.

When the pattern of the pressure-sensitive adhesive layer and the porous conductive layer is transferred onto the transfer substrate by applying pressure, a method using an uneven plate or a needle as described above may be applied, and FIG. A laminate 1 in which a pressure-sensitive adhesive layer 4 as exemplified in a) is previously formed in a pattern may be used, and non-pressure-sensitive adhesion is performed on the pressure-sensitive adhesive layer 4 as exemplified in FIG. You may use the laminated body 1 in which the layer 5 was formed in pattern shape.
In addition to the above, when transferring the pattern of the porous conductive layer on the substrate to be transferred, a belt-like laminate may be used as shown in FIG. A laminate 1 in which the porous conductive layer 3 as exemplified in 5 (a) is formed in a pattern in advance may be used.

  After adhering the pressure-sensitive adhesive layer of the laminate on the substrate to be transferred, the pressure-sensitive adhesive layer is usually adhered on the substrate to be transferred by physically separating the laminate from the substrate side. In the region, the substrate can be peeled from the porous conductive layer.

  In the present invention, when a flexible substrate is used, the substrate is peeled from the porous conductive layer by physically separating the laminate from the substrate side while bending the substrate. It is preferable because it can be easily transferred to a three-dimensional object having a complicated shape such as a curved surface, a stepped shape, or a cornered shape.

3. Connection Process In the present invention, in the transfer process, the pressure-sensitive adhesive layer and the porous conductive layer of the laminate are transferred onto the substrate to be transferred by pressing to transfer the first as shown in FIG. A laminated part X in which the pressure-sensitive adhesive layer 4c and the first porous conductive layer 3a, the second pressure-sensitive adhesive layer 4d and the second porous conductive layer 3b are laminated is formed, and a pressure P is further applied to the laminated part X Thus, as shown in FIG. 9B, there may be a connecting step of electrically connecting the first porous conductive layer 3a and the second porous conductive layer 3b.
9A and 9B are process diagrams showing an example of a connection process in the method for producing a conductive substrate of the present invention. Although not shown, the first porous conductive layer and the second porous conductive layer can be electrically connected by subjecting the laminated portion to heat treatment.

  Since the first porous conductive layer and the second porous conductive layer in the pressurized area in the laminated portion can be electrically connected, the laminated porous conductive layers in the conductive substrate can be easily connected to each other. Can be conducted in a simple manner. More specifically, since the first porous conductive layer and the second porous conductive layer are porous, they are included in the second pressure-sensitive adhesive layer in the porous film by pressurizing the laminated portion. The first porous conductive layer and the second porous conductive layer can be brought into contact and electrically connected.

  Further, in the present invention, although not shown, the first porous conductive layer and the second porous conductive layer may be electrically connected in the entire area of the above-described laminated portion, as shown in FIG. 9B. The first porous conductive layer 3a and the second porous conductive layer 3b may be electrically connected in a part of the stacked portion X. In this case, the second pressure-sensitive adhesive layer can be used as an insulating layer of the first porous conductive layer and the second porous conductive layer in a region where no pressure is applied in the laminated portion.

  The first pressure-sensitive adhesive layer and the first porous conductive layer may be formed on the entire area of the transferred substrate, or may be formed in a predetermined pattern. In addition, the second pressure-sensitive adhesive layer and the second porous conductive layer may be formed on the entire area of the substrate to be transferred, or may be formed in a predetermined pattern.

  In the present invention, the first porous conductive layer and the second porous conductive layer can be electrically connected by subjecting the laminated portion to at least one of heat treatment and pressure treatment. In addition, the laminated portion may be subjected to heat treatment, pressure treatment, or both heat treatment and pressure treatment.

  The pressure treatment method for the laminated portion is not particularly limited as long as it is a method capable of electrically connecting the first porous conductive layer and the second porous conductive layer. For example, the second porous conductive layer A method of pressing with a predetermined pressure from the side, for example, a method of pressing with a roller, a stamp, a press, a concavo-convex plate, a needle shape, or a nib shape. In particular, a method of applying a transverse shear force so as to press with a roller or rub and draw with a needle-like material is preferable because the pressure-sensitive adhesive is softened by the shear force and easily transferred.

  Moreover, as a heat processing method of the said laminated part, heating by electromagnetic waves, such as a heating roller, a hot stamp, hot press, needle-like or nib-like spot heating, infrared rays, a laser, is mentioned from the 2nd conductive layer side.

  Moreover, as a method of performing both the pressurizing process and the heat treatment of the laminated part at the same time, for example, a method of heating the laminated part surface by rubbing when the laminated part is pressurized can be exemplified.

C. Electronic Device Manufacturing Method The electronic device manufacturing method of the present invention is a manufacturing method characterized by having a conductive base material manufacturing step of manufacturing a conductive base material by the above-described conductive base material manufacturing method. .

In the present invention, since the conductive substrate is produced by the above-described method for producing a conductive substrate, a porous conductive layer having good conductivity can be formed. For example, when forming a pattern of a porous conductive layer, a high-resolution pattern can be formed.
Moreover, in this invention, since a conductive base material is produced with the manufacturing method of the above-mentioned conductive base material, manufacturing cost can be reduced.

  Hereinafter, the process in the manufacturing method of the electronic device of this invention is demonstrated.

1. Conductive base material preparation process The conductive base material preparation process in this invention is a process of producing a conductive base material with the manufacturing method of the above-mentioned conductive base material.
In addition, since it described in detail in the said "B. manufacturing method of an electroconductive base material" about the manufacturing method of an electroconductive base material, description here is abbreviate | omitted.

2. Other Steps The method for producing an electronic device of the present invention may have other steps as necessary in addition to the conductive substrate manufacturing step. Other steps are appropriately selected depending on the electronic device.

3. Electronic device Examples of the electronic device in the present invention include a printed wiring board, an electromagnetic wave shielding material, an antenna, a power semiconductor, a noise filter, a capacitor electrode, and various sensor electrodes (touch sensor, biosensor, temperature sensor, gas sensor, optical sensor). , Pressure sensor, flow sensor), display electrode, solar cell electrode, IC card, RFID, and the like.
In addition, when the electronic device of the present invention is, for example, a non-contact type IC card, the porous conductive layer includes an electromagnetic wave shielding layer for preventing unauthorized reading of information recorded on the non-contact type IC card, a resonance frequency It can be used as a conductive layer for modulating. Further, in this case, it is possible to temporarily apply a porous conductive layer to the non-contact type IC card and later remove the pressure sensitive adhesive layer by scratching. Since the non-contact type IC card has a porous conductive layer, it can be easily peeled off by scratching by controlling the adhesive force of the pressure-sensitive adhesive layer.

D. Transfer Tool The transfer tool of the present invention is used to press and transfer the pressure-sensitive adhesive layer and the porous conductive layer of the strip-shaped laminate on the substrate to be transferred using the laminate. The laminate, the unwinding reel to be unwound with the pressure-sensitive adhesive layer of the laminate as the outside, the pressure-sensitive adhesive layer and the porous of the laminate drawn from the unwinding reel A transfer head that presses and transfers the conductive layer onto the substrate to be transferred, a take-up reel that winds up the substrate after transfer of the pressure-sensitive adhesive layer and the porous conductive layer, the unwind reel, and An interlocking mechanism for interlockingly rotating the take-up reel.

  The transfer tool of the present invention will be described with reference to the drawings. FIG. 4A is a schematic diagram showing an example of the transfer tool of the present invention. The transfer tool 20 shown in FIG. 4A includes a laminate 1, an unwinding reel 21 that unwinds the pressure-sensitive adhesive layer 4 of the laminate 1, and a laminate 1 that is pulled out from the unwinding reel 21. The transfer head 22 for transferring the pressure-sensitive adhesive layer 4 and the porous conductive layer 3 onto the substrate 11 to be transferred is wound, and the substrate 2 after the transfer of the pressure-sensitive adhesive layer 4 and the porous conductive layer 3 is wound. A take-up reel 23 to be taken, and an interlocking mechanism 24 to rotate the take-up reel 21 and the take-up reel 23 in conjunction with each other. The unwinding reel 21 is rotatably supported by a support shaft 25, and the take-up reel 23 is rotatably supported by a support shaft 26. The transfer head 22 is formed of a plate-like member whose tip on the transfer substrate 11 side is thin, and has a flange 27 for suppressing the lamination transfer body 1 from coming off the transfer head. The interlocking mechanism 24 is used in mesh with the first gear 24a formed so as to rotate at the same angular speed as the take-up reel 23 and the first gear 24a formed so as to rotate at the same angular speed as the take-up reel 21. And a second gear 24b having a smaller number of teeth than the first gear 24a. The laminate 1, the unwinding reel 21, the transfer head 22, the take-up reel 23, and the interlocking mechanism 24 are housed in a case 28. The case 28 has a guide pin 29 that arranges the laminated body 1 at a predetermined position in the case 28.

  In the present invention, by using the transfer tool of the present invention, a porous conductive layer pattern can be easily formed on the substrate to be transferred using the strip-shaped laminate in the method for producing a conductive substrate. can do.

  Hereinafter, details of the transfer tool used in the present invention will be described.

1. Laminated body The laminated body used for this invention is a strip | belt shape. The details of the laminated body can be the same as the contents described in the section “A. Laminated body” described above, and thus the description thereof is omitted here.

2. Unwinding reel The unwinding reel used in the present invention unwinds with the adhesive layer of the laminate being on the outside.
The unwinding reel is not particularly limited as long as it can be unwound with the pressure-sensitive adhesive layer side of the laminated body facing outside, and can be the same as that used for a general transfer tool. Is omitted. Moreover, the unwinding reel is normally rotatably supported by a support shaft.

3. Transfer Head The transfer head used in the present invention transfers the pressure-sensitive adhesive layer and the porous conductive layer of the laminate pulled out from the unwinding reel onto the transfer substrate by pressing.

  The transfer head is not particularly limited as long as the pressure-sensitive adhesive layer and the porous conductive layer of the laminate can be transferred onto the substrate to be transferred, for example, a tapered shape in which the tip on the substrate to be transferred side becomes gradually thinner. A plate-like member and a roller member for pressurization. The transfer head may further include a flange for preventing the transfer body for lamination from coming off the transfer head. The form and material of the transfer head can be the same as that of a general transfer tool. For example, the transfer head described in JP2009-238676A can be used.

4). Winding reel The winding reel used in the present invention winds up the substrate after transfer of the adhesive layer and the porous conductive layer.
The take-up reel is not particularly limited as long as it can take up the substrate after transfer of the adhesive layer and the porous conductive layer, and can be the same as that used for a general transfer tool. The description here is omitted. Further, the take-up reel is normally supported rotatably by a support shaft.

5. Interlocking mechanism The interlocking mechanism used in the present invention rotates the unwinding reel and the take-up reel in conjunction with each other.

  The interlocking mechanism is not particularly limited as long as the take-up reel and the take-up reel can be rotated in conjunction with each other so that the laminate does not loosen between the take-up reel and the take-up reel. For example, a first gear formed so as to rotate at the same angular speed as the take-up reel and a first gear formed so as to rotate at the same angular speed as the take-up reel are used in mesh with the first gear. Alternatively, an interlocking mechanism having a second gear with a small number of teeth may be used. Moreover, the interlocking mechanism which has the belt which connects the winding pulley provided coaxially with the winding reel, the winding pulley provided coaxially with the winding reel, the winding pulley, and the winding pulley may be used.

6). Case In the transfer tool of the present invention, the laminate, the unwinding reel, the take-up reel and the interlocking mechanism are usually arranged in a case. Moreover, the case may have a guide pin, a guide roll, etc. which arrange | position a laminated body in the predetermined position in a case. Since the case can be the same as that used for a general transfer tool, description thereof is omitted here.

7). Others In the present invention, the transfer tool may be configured by arranging a laminated body instead of the known correction tape of the transfer tool used for the correction tape or the like.

8). Application The transfer tool of the present invention can be suitably used when transferring the wiring pattern of the pressure-sensitive adhesive layer and the porous conductive layer onto the transfer substrate in the above-described method for producing a conductive substrate.

  The present invention is not limited to the above embodiment. The above-described embodiment is an exemplification, and the present invention has substantially the same configuration as the technical idea described in the claims of the present invention, and any device that exhibits the same function and effect is the present invention. It is included in the technical scope of the invention.

  Hereinafter, the present invention will be described in more detail with reference to Examples and Comparative Examples.

[Synthesis Example 1: Synthesis of copper particles]
In a 200 ml three-necked flask, 10.0 g of copper hydroxide (manufactured by Wako Pure Chemical Industries), 34.5 g of decanoic acid (Lunac 10-98 manufactured by Kao), and 18.5 g of propylene glycol monomethyl ether (PGME) were weighed. . The mixture was heated to 100 ° C. with stirring and the temperature was maintained for 20 minutes. Thereafter, 41.3 g (manufactured by Guangei Chemical Industry Co., Ltd.) of 3-ethoxypropylamine was added, and the mixture was heated and stirred at 100 ° C. for 10 minutes. After cooling this mixed liquid to 10 ° C. using an ice bath, a solution prepared by dissolving 10.0 g of hydrazine monohydrate in 18.5 g of PGME (manufactured by Kanto Chemical Co., Ltd.) was added for 10 minutes. Stir. Thereafter, the reaction solution was heated to 100 ° C., and the temperature was maintained for 10 minutes. After cooling to 30 ° C., 66 g of hexane was added. After centrifugation, the supernatant was removed. The precipitate was washed with hexane to obtain copper particles.
When the obtained copper particles were observed with a transmission electron microscope (TEM), the average primary particle size was 65 nm.

[Preparation Example 1: Preparation of copper particle dispersion]
40 parts by mass of the copper particles obtained in Synthesis Example 1, 4 parts by mass of Solsperse 41000 (manufactured by Lubrizol) and 56 parts by mass of propylene glycol monomethyl ether (PGME) are mixed as a polymer dispersant, and a paint shaker (manufactured by Asada Tekko) As a preliminary dispersion, 2 mm zirconia beads were used for 1 hour, and as a main dispersion, 0.1 mm zirconia beads were used for 2 hours to obtain a copper particle dispersion.

[Production Example 1: Production of conductive film A]
A copper film dispersion is applied to a PET film (trade name: Cosmo Shine A4100, manufactured by Toyobo Co., Ltd., film thickness: 100 μm) using a bar coater # 4, dried at 80 ° C. for 3 minutes with a hot air dryer, and a film having a bronze luster. Got. Thereafter, while introducing hydrogen gas at an introduction pressure of 20 Pa, using a microwave surface wave plasma processing apparatus (MSP-1500, manufactured by Micro Electronics Co., Ltd.), firing was performed at a microwave output of 450 W for 240 seconds to form a porous conductive layer. A conductive film A was obtained.

[Production Example 2: Production of conductive film B]
Nano Ag ink (trade name MDot CF107 manufactured by Mitsuboshi Belting) was diluted 40% with pentanediol, and then applied to a PET film (trade name Cosmo Shine A4100, manufactured by Toyobo Co., Ltd., film thickness 100 μm) using a bar coater # 4. The film was dried and fired at 120 ° C. for 30 minutes with an air dryer to obtain a conductive film B having a silver gloss and a porous conductive layer.

[Production Example 3: Production of conductive film C]
Copper was formed into a film on a PET film (trade name: Cosmo Shine A4100, manufactured by Toyobo Co., Ltd., film thickness: 100 μm) by a sputtering method to obtain a conductive film C having a conductive layer.

[Evaluation]
(Measurement of porous conductive layer and sheet resistance value of conductive layer)
The conductive evaluation of the porous conductive layer and the conductive layer was performed by measuring the sheet resistance value by a four-probe method using a surface resistance meter (“Loresta GP” manufactured by Dia Instruments, PSP type probe). The sheet resistance values of the porous conductive layers of the conductive films A and B were both 0.20 Ω / □, and the sheet resistance value of the conductive layer of the conductive film C was 0.08 Ω / □.

(Measurement of film thickness of porous conductive layer and conductive layer)
The porous conductive layer and the film thickness of the conductive layer were evaluated as follows. For the produced conductive films A and B, carbon is sequentially laminated on the porous conductive layer as a protective layer by vacuum deposition and platinum is sputtered, and then FIB (focused ion beam, FB-2100 made by Hitachi High-Tech) is applied. After stacking tungsten using, a cross section of the porous conductive layer was prepared. Thereafter, the cross section of the porous conductive layer was observed using a SEM (S-4800 manufactured by Hitachi High-Tech) with the substrate inclined by 45 °, and the film thickness was measured from the SEM image. The film thickness was measured at 10 locations in the SEM image measured at a magnification of 30 k to 40 k, the inclination was corrected, and the average value was taken as the film thickness. The film thickness evaluation of the conductive layer of the conductive film C was also obtained in the same manner as the porous conductive layer. The film thickness of the porous conductive layer of the conductive film A was 400 nm, the film thickness of the porous conductive layer of the conductive film B was 380 nm, and the film thickness of the porous conductive layer of the conductive film C was 400 nm. From this result, it is understood that the volume resistance value of the conductive film A is 8.0 μΩ · cm, the volume resistance value of the conductive film B is 7.6 μΩ · cm, and the volume resistance value of the conductive film C is 3.0 μΩ · cm. It was.

(Measurement of porosity of porous conductive layer and conductive layer)
The porosity of the porous conductive layer and the conductive layer was measured as follows. In the SEM image obtained in the film thickness measurement, the area of the hole and the area of copper are calculated, and the porosity in the cross section is obtained by dividing the area of the hole by the area of the porous copper layer. It was. The porosity of the porous conductive layer of the conductive film A was 35%, the porosity of the porous conductive layer of the conductive film B was 30%, and the porosity of the conductive layer of the conductive film C was 0%.

[Example 1-1: Laminate 1 for transfer]
A pressure-sensitive adhesive (Nippon Paper's Auroren 200MX) was applied onto the copper surface of the conductive film A with a bar coater # 4 and dried in a hot air dryer at 90 ° C. for 30 seconds. A pressure sensitive adhesive layer of about 1.5 μm was formed.

[Example 1-2: Transfer laminate 2]
The pressure-sensitive adhesive of the transfer laminate 1 was changed to a mixture of Nippon Paper's Auroren 200MX and Auroren 350MX at a weight ratio of 1: 2, and the same procedure as that for the transfer laminate 1 was followed. Then, a transfer laminate 2 was prepared.

[Example 1-3: Transfer laminate 3]
A transfer laminate 3 was produced in the same manner as the transfer laminate 1 except that the conductive film A of the transfer laminate 1 was changed to the conductive film B.

[Comparative Example 1: Transfer laminate 4]
A transfer laminate 4 was produced by the same procedure as the transfer laminate 1 except that the conductive film A of the transfer laminate 1 was changed to the conductive film C.

[Evaluation]
For the transfer laminates 1 to 4, a commercially available high-quality paper was overlaid with a pressure-sensitive adhesive-coated surface, pressed from the back with a resin spatula, and the PET film was peeled off. The transferability was confirmed visually, and the sheet resistance value of the transfer was measured. The results are shown in Table 1. The transferability in the table is represented by the ratio of the area of the conductive layer transferred to the transfer object to the area of the conductive layer of the laminated body before transfer. The conductive layer that was not transferred remained in the transfer laminate.

[Example 2-1 to Example 2-3 and Comparative Example 2]
For the transfer laminates 1 to 4, the laminate is cut into a width of 5 mm, a transfer tool including an unwinding reel, a resin transfer head, and a take-up reel is prepared, and the transfer laminate is rolled into the unwinding reel. Fixed. Subsequently, pressure was applied to the commercially available high-quality paper with a transfer head so that the pressure-sensitive adhesive-coated surface of the transfer laminate was placed, the transferability was visually confirmed, and the sheet resistance value of the transfer was measured. The results are shown in Table 2.

[Example 3-1 to Example 3-3 and Comparative Example 3]
The transfer laminates 1 to 4 were pressed on a commercially available high-quality paper with the pen tip of a ballpoint pen from which the ink had been removed so that the pressure-sensitive adhesive application surface of the transfer laminate was on, and a continuous pattern was drawn. The transferability was confirmed visually, and both ends of the pattern were measured with a tester to examine the presence or absence of conduction. The results are shown in Table 3.

  In Comparative Example 3, the conductive layer in the transfer laminate 4 was partially transferred onto the high-quality paper that is the transfer substrate, but the conductive layer in the transfer laminate 4 could not be transferred onto the high-quality paper. It was.

[Example 4-1 to Example 4-3]
For the transfer laminates 1 to 3, a ballpoint pen whose ink has been removed so that the pressure sensitive adhesive application surface of the transfer laminate is on the surface of the package in which commercially available cardboard is assembled in a box shape A continuous pattern was drawn so as to press the tip and make one round of the package side surface. Both ends of the pattern were measured with a tester, and the presence or absence of conduction was examined. The results are shown in Table 4.

[Example 5]
Using the transfer laminate 1 in Example 2-1, a commercially available high-quality paper was pressurized with a transfer head so that the pressure-sensitive adhesive-coated surface of the transfer laminate 1 came, and the porous conductive layer line The pattern was transcribed. Further, the porous conductive layer is pressed with a transfer head so that the pressure sensitive adhesive coated surface of the laminate for transfer is placed on a commercially available high-quality paper so as to intersect the line pattern of the transferred porous conductive layer. The line pattern was transferred. As shown in FIG. 10, a transfer product was produced in which the line patterns of the porous conductive layers 31 and 32 intersected on the high-quality paper as the transfer target substrate 11. When a tester was applied to the ends Y and Z of the line patterns of the porous conductive layers 31 and 32, it was confirmed that the line patterns of the two porous conductive layers 31 and 32 were conductive.

[Example 6]
About the laminated body 2 for transfer in Example 2-2, similarly to Example 5, a transfer product in which the line patterns of the porous conductive layers 31 and 32 shown in FIG. When a tester was applied to the ends Y and Z of the line patterns of the porous conductive layers 31 and 32, it was confirmed that the line patterns of the two porous conductive layers 31 and 32 were not conductive.
Furthermore, as shown in FIG. 10, pressure was applied to the intersection X of the line patterns of the two porous conductive layers 31 and 32 using a stick made of silicone rubber. When the end portions Y and Z of the line patterns of the two porous conductive layers after pressurization were examined using a tester, it was confirmed that the line patterns of the two porous conductive layers 31 and 32 were conductive. did.

[Example 7]
On the conductive film A, adhesive patterns of two types of commercially available tape glues (dot liner petit (heart pattern), dot liner petit (star pattern), manufactured by KOKUYO S & T) were copied to obtain a transfer laminate. Subsequently, the adhesive pattern surface of the above-mentioned transfer laminate was superimposed on a commercially available high-quality paper as a substrate to be transferred, and pressed with a resin spatula, a copper film was formed in a pattern (heart shape, star shape). I was able to transcribe.

DESCRIPTION OF SYMBOLS 1 ... Laminated body 2 ... Base material 3 ... Porous conductive layer 3a ... 1st porous conductive layer 3b ... 2nd porous conductive layer 4 ... Pressure sensitive adhesive layer 4c ... 1st pressure sensitive adhesive layer 4d ... 2nd pressure sensitive Adhesive layer 6 ... Protective layer 10 ... Conductive substrate 11 ... Transfer target substrate

Claims (10)

A substrate;
A porous conductive layer formed on the substrate;
And a pressure-sensitive adhesive layer formed on the porous conductive layer.   The laminate according to claim 1, wherein the substrate is a resin substrate.   The laminate according to claim 1, wherein the porous conductive layer contains a metal.   The laminate according to any one of claims 1 to 3, wherein a protective layer is formed between the substrate and the porous conductive layer.   The laminate according to any one of claims 1 to 4, wherein the laminate has a strip shape. A preparation step of preparing the laminate according to any one of claims 1 to 5,
And a transfer step of pressing and transferring the pressure-sensitive adhesive layer and the porous conductive layer of the laminate onto the transfer substrate.   The said transfer process pressurizes and transfers the pattern of the said pressure sensitive adhesive layer and the said porous conductive layer on the said to-be-transferred base material using the said strip | belt-shaped laminated body, The transfer of Claim 6 characterized by the above-mentioned. A method for producing a conductive substrate. In the transferring step, the first pressure-sensitive adhesive layer, the first porous conductive layer, and the pressure-sensitive adhesive layer and the porous conductive layer of the laminate are pressed and transferred onto the transfer substrate. Forming a laminated portion in which the second pressure-sensitive adhesive layer and the second porous conductive layer are laminated;
And a connecting step of electrically connecting the first porous conductive layer and the second porous conductive layer by performing at least one of a heat treatment and a pressure treatment on the laminated portion. The method for producing a conductive substrate according to claim 6 or 7, wherein:   A method for producing an electronic device, comprising a conductive substrate production step of producing a conductive substrate by the method for producing a conductive substrate according to any one of claims 6 to 8. A transfer tool that is used to press and transfer the pressure-sensitive adhesive layer and the porous conductive layer of the band-shaped laminate on a substrate to be transferred using the laminate according to claim 5. ,
The laminate;
An unwinding reel that unwinds with the pressure-sensitive adhesive layer of the laminate on the outside;
A transfer head that pressurizes and transfers the pressure-sensitive adhesive layer and the porous conductive layer of the laminate drawn from the unwinding reel onto the substrate to be transferred;
A take-up reel that winds up the substrate after transfer of the pressure-sensitive adhesive layer and the porous conductive layer;
A transfer tool comprising: an interlocking mechanism for interlockingly rotating the unwinding reel and the take-up reel.

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