200922456 九、發明說明 【發明所屬之技術領域】 本發明是有關在電腦、通信機器、攝影機等的裝置内 等所使用的印刷配線板用屏蔽薄膜、及、印刷配線板。 【先前技術】 以往使用金屬層的印刷配線板用屏蔽薄膜爲公知。例 如有揭示於下述專利文獻1者。在專利文獻1中揭示有： 可容易轉印至FPC等的轉印用金屬薄膜薄板，其特徵是在 合成樹脂薄板基材的至少一方的表面積層有金屬層，該金 屬層與合成樹脂薄板的剝離強度爲5N/cm以下、及附導電 性接著層的轉印用金屬薄膜薄板，其特徵是在該轉印用金 屬薄膜薄板的金屬層表面，使金屬粉末及/或碳粉末分散 而成的導電性接著層積層於樹脂組成物。 [專利文獻1]特開2006-297714號公報 【發明內容】 (發明所欲解決的課題） 近年來在電腦、通信機器、攝影機等的裝置中，期望 更耐於從大的彎曲半徑到形成小的彎曲半徑（1 . 0mm )爲 止的重複彎曲•滑動之印刷配線板用屏蔽薄膜、及、印刷 配線板。 然而，專利文獻1者雖具有某程度的可撓性，但對於 從大的彎曲半徑到形成小的彎曲半徑（1.0 mm )爲止的重 -5- 200922456 複彎曲•滑動而言並未被加以考量’ 一旦進行如此從大的 彎曲半徑到形成小的彎曲半徑（〗·0mm)爲止的重複彎曲 •滑動，則會有時產生金屬層的破壞’有電磁波屏蔽特性 降低的情況。 於是，本發明的目的是在於提供一種對於從大的彎曲 半徑到形成小的彎曲半徑（1 . 〇 mm )爲止的重複彎曲•滑 動而言，不易產生金屬層的破壞之印刷配線板用屏蔽薄膜 及印刷配線板。 (用以解決課題的手段及效果） (1 )本發明之印刷配線板用屏蔽薄膜係具備形成於 絕緣層的一面之第1金屬層，上述絕緣層的一面表面的算 術平均粗度（JIS B 0601 ( 1994年））爲0.5〜5·0μηι，且 上述第1金屬層，係以能夠沿著上述絕緣層的一面表面來 形成蛇腹構造之方式形成。 若根據上述構成，則由於金屬層爲具備高彎曲性的蛇 腹構造，因此可提供一種對於從大的彎曲半徑到形成小的 彎曲半徑（l.〇mm)爲止的重複彎曲•滑動而言，不易產 生金屬層的破壞之印刷配線板用屏蔽薄膜。因此，可提供 一種電磁波屏蔽特性不易降低的印刷配線板用屏蔽薄膜。 並且，在貼附於印刷配線板使用時，可保護印刷配線板， 且即使印刷配線板重複彎曲•滑動，還是可維持電磁波屏 蔽特性。 (2 )在上述（1 )的印刷配線板用屏蔽薄膜中，上述 -6- 200922456 第1金屬層之與上述絕緣層相反側的面的算術平均粗度爲 0 · 5 〜5.0 μηι。 若根據上述構成，則可形成更佳形狀的蛇腹構造，可 更確實地發揮上述（1 )的效果。 (3 )在上述（1 )或（2 )的印刷配線板用屏蔽薄膜 中’較理想是上述第1金屬層爲使用鎳、銅、銀、錫、金 、IG、銘、絡、欽、辞、及含該寺材料的任—個以上的合 金之任一材料的層。 藉由上述構成，可成爲電磁波屏蔽特性高的金屬層。 並且’在該金屬層的表面’將由相異的材料所構成的其他 金屬層形成於表面時，成爲容易合金化者。 (4 )在上述（1 )或（2 )的印刷配線板用屏蔽薄膜 中’較理想是上述第1金屬層爲以1種以上的鱗片狀金屬 粒子所形成的層。 藉由上述構成’在對印刷配線板以所定溫度（例如 1 50 °C )以上藉由加壓壓製來貼附使用時，在鱗片狀金屬 粒子間’可形成間隙部份的同時亦產生金屬間結合而形成 電性連接的金屬層，因此可成爲更富有可撓性的導電層。 因此’如上述般利用於印刷配線板時，可提供一種對於從 大的彎曲半徑到形成小的彎曲半徑（1 · 0 mm )爲止的重複 彎曲•滑動而言’更不易產生金屬層的破壞之印刷配線板 用屏蔽薄膜。 (5 )在上述（1 )或（2 )的印刷配線板用屏蔽薄膜 中’較理想是在上述第丨金屬層之與上述絕緣層相反的側 200922456 形成有導電性接著劑層。 根據上述構成，可容易貼附於印刷配線板的同時’除 了作爲接著劑層使用以外，亦可作爲具有電磁波屏蔽效果 的層使用。更在上述（4)的印刷配線板用屏蔽薄膜中’ 對印刷配線板加壓壓製來貼附使用時，導電性接著劑層會 被充塡於鱗片狀金屬粒子間的間隙’可使金屬層的強度及 可撓性提升。 (6 )並且，在上述（1 )或（2 )的印刷配線板用屏 蔽薄膜中，上述第1金屬層爲具有複數孔的多孔質層’在 上述第1金屬層之與上述絕緣層相反的側形成有導電性接 著劑層。 若根據上述構成，則對印刷配線板加壓壓製來貼附使 用時，導電性接著劑層會被充塡於孔的空隙，可使金屬層 的強度及可撓性提升。 (7 )而且，在上述（1 )或（2 )的印刷配線板用屏 蔽薄膜中，在上述第1金屬層之與上述絕緣層相反的側形 成有使用鎳、銅、銀、錫、金、鈀、鋁、鉻、鈦 '鋅、及 含該等材料的任一個以上的合金之任一材料的第2金屬層 ’上述第1金屬層與上述第2金屬層係由相異種類的材料 所構成。 若根據上述構成，則可藉由第2金屬層來取得對金屬 層1 2防蝕的效果。並且，對印刷配線板以所定溫度（例 如1 5 0 °C )以上藉由加壓壓製來貼附使用時，亦可在第1 金屬層與第2金屬層之間形成金屬間化合物。其結果，對 -8- 200922456 印刷配線板以所定溫度以上藉由加壓壓製來貼附使用時， 可成爲強度及可撓性提升的印刷配線板用屏蔽薄膜。 (8 )在上述（7 )的印刷配線板用屏蔽薄膜中，較理 想是上述第2金屬層爲以1種以上的鱗片狀金屬粒子所形 成的層。 藉由上述構成，在對印刷配線板以所定溫度（例如 1 5 0 °C )以上藉由加壓壓製來貼附使用時，在構成第2金 屬層的鱗片狀金屬粒子間，可形成間隙部份的同時亦產生 金屬間結合而形成電性連接的金屬層，因此可成爲更富有 可撓性的導電層。因此，如上述般利用於印刷配線板時， 可提供一種對於從大的彎曲半徑到形成小的彎曲半徑（ 1.0 mm )爲止的重複彎曲•滑動而言，更不易產生金屬層 的破壞之印刷配線板用屏蔽薄膜。 (9 )在上述（8 )的印刷配線板用屏蔽薄膜中，較理 想是在上述第2金屬層之與上述絕緣層相反的側形成有導 電性接著劑層。 根據上述構成，可容易貼附於印刷配線板的同時，除 了作爲接著劑層使用以外，亦可作爲具有電磁波屏蔽效果 的層使用。更對印刷配線板加壓壓製來貼附使用時，導電 性接著劑層會被充塡於鱗片狀金屬粒子間的間隙，可使金 屬層的強度及可撓性提升。 (1 〇 )並且，在上述（7 )的印刷配線板用屏蔽薄膜 中，上述第2金屬層可爲具有複數孔的多孔質層，在上述 第2金屬層之與上述絕緣層相反的側形成有導電性接著劑 -9- 200922456 層。 若根據上述構成，則對印刷配線板加壓壓製來貼附使 用時，導電性接著劑層的一部份會被充塡於第2金屬層的 孔的空隙，可使金屬層的強度及可撓性提升。 (1 1 )在上述（1)或（2 )的印刷配線板用屏蔽薄膜 中’較理想是上述第1金屬層爲具有複數孔的多孔質層或 以1種以上的鱗片狀金屬粒子所形成的層。 藉由上述構成，對印刷配線板加壓壓製來貼附使用時 ’當上述第1金屬層爲具有複數個孔的多孔質層時是在孔 的空隙充塡有導電性接著劑層的一部份，當爲1種以上的 鱗片狀金屬粒子所形成的層時是在鱗片狀金屬粒子間的間 隙充塡有導電性接著劑層的一部份，可使第1金屬層的強 度及可撓性提升。 (1 2 )別的觀點，本發明的印刷配線板用屏蔽薄膜， 可具備： 形成於絕緣層的一面之第1金屬層；及 形成於上述第1金屬層之與上述絕緣層相反的側之第 2金屬層， 上述第1金屬層及上述第2金屬層爲使用鎳、銅、銀 、錫、金、鈀、鋁、鉻、鈦、鋅、及含該等材料的任—個 以上的合金之任一材料的層，且由彼此相異種類的材料所 構成。 若根據上述構成，則可藉由第2金屬層來取得對金屬 層12防蝕的效果。並且，對印刷配線板以所定溫度（例 -10- 200922456 如1 5 0 °C )以上藉由加壓壓製來貼附使用時，亦可在第1 金屬層與第2金屬層之間形成金屬間化合物。其結果，對 印刷配線板以所定溫度以上藉由加壓壓製來貼附使用時， 可成爲強度及可撓性提升的印刷配線板用屏蔽薄膜。因此 ，可提供一種對於從大的彎曲半徑到形成小的彎曲半徑（ 1.0 mm)爲止的重複彎曲•滑動而言，更不易產生金屬層 的破壞之印刷配線板用屏蔽薄膜。 (1 3 )在上述（1 2 )的印刷配線板用屏蔽薄膜中’較 理想是上述第2金屬層爲以1種以上的鱗片狀金屬粒子所 形成的層。 藉由上述構成，對印刷配線板以所定溫度（例如 15 〇 r )以上藉由加壓壓製來貼附使用時’在構成第2金 屬層的鱗片狀金屬粒子間，可形成間隙部份的同時亦產生 金屬間結合而形成電性連接的金屬層，因此可成爲更富有 可撓性的導電層。因此，可提供一種對於從大的彎曲半徑 到形成小的彎曲半徑（1 . 〇mm )爲止的重複彎曲·滑動而 言，更不易產生金屬層的破壞之印刷配線板用屏蔽薄膜。 (1 4 )在上述（1 3 )的印刷配線板用屏蔽薄膜中’較 理想是在上述第2金屬層之與上述絕緣層相反的側形成有 導電性接著劑層。 根據上述構成，可容易貼附於印刷配線板。更對印刷 配線板加壓壓製來貼附使用時’導電性接著劑層會被充塡 於鱗片狀金屬粒子間的間隙’可使金屬層的強度及可燒性 提升。 -11 - 200922456 (1 5 )並且，在上述（1 2 )的印刷配線板用屏蔽薄膜 中，上述第2金屬層可爲具有多數孔的多孔質層’在上述 第2金屬層之與上述絕緣層相反的側形成有導電性接胃齊11 層。 根據上述構成，對印刷配線板加壓壓製來貼附使用時 ，導電性接著劑層的一部份會被充塡於第2金屬層的？L的 空隙，可使第2金屬層的強度及可撓性提升。 (1 6 )在上述（1 4 )或（1 5 )的印刷配線板用屏蔽薄 膜中，上述第1金屬層可爲具有複數孔的多孔質層或以1 種以上的鱗片狀金屬粒子所形成的層。 藉由上述構成，對印刷配線板加壓壓製來貼附使用時 ’當上述第1金屬層爲具有複數孔的多孔質層時是在孔的 空隙存在導電性接著劑層的一部份會經由第2金屬層來充 塡之處’當上述第1金屬層爲以1種以上的鱗片狀金屬粒 子所形成的層時是在鱗片狀金屬粒子間的間隙存在導電性 接著劑層的一部份會經由第2金屬層來充塡之處，因此可 使第1金屬層的強度及可撓性提升。 (1 7 )另外’別的觀點，本發明的印刷配線板用屏蔽 薄膜可具備形成於絕緣層的一面之金屬層，上述金屬層爲 以1種以上的鱗片狀金屬粒子所形成的層。 藉由上述構成’以所定溫度（例如1 5 0它）以上藉由 加壓壓製來貼附使用時’在鱗片狀金屬粒子間，可形成間 隙份的同時亦產生金屬間結合而形成電性連接的金屬層 ’因此可成爲更富有可撓性的導電層。因此，可提供—種 -12- 200922456 對於從大的彎曲半徑到形成小的彎曲半徑（1 . 〇mm )爲止 的重複彎曲•滑動而言，更不易產生金屬層的破壞之印刷 配線板用屏蔽薄膜。 (1 8 )在上述（1 7 )的印刷配線板用屏蔽薄膜中，較 理想是在上述金屬層之與上述絕緣層相反的側形成有導電 性接著劑層。 根據上述構成，可容易貼附於印刷配線板。並且，對 印刷配線板加壓壓製來貼附使用時，導電性接著劑層會被 充塡於鱗片狀金屬粒子間的間隙，可使金屬層的強度及可 撓性提升。 (1 9 )另外，其他的觀點，本發明的印刷配線板用屏 蔽薄膜可具備形成於絕緣層的一面之金屬層，上述金屬層 爲具有複數孔的多孔質層，在上述金屬層之與上述絕緣層 相反的側形成有導電性接著劑層。 根據上述構成，對印刷配線板加壓壓製來貼附使用時 ，導電性接著劑層的一部份會被充塡於金屬層的孔的空隙 ，可使金屬層的強度及可撓性提升。因此，可提供一種對 於從大的彎曲半徑到形成小的彎曲半徑（1 . Omm )爲止的 重複彎曲•滑動而言，更不易產生金屬層的破壞之印刷配 線板用屏蔽薄膜。 (20)在上述（1) 、 （2) 、 （12)〜（15) 、 （17 )〜（1 9 )的印刷配線板用屏蔽薄膜中，可使用彎曲半徑 的下限爲至1 .Omm爲止的重複彎曲·滑動用的屏蔽薄膜。 (2 1)本發明的印刷配線板是在含丨層以上的印刷電 -13- 200922456 路的基板的至少一面’上述（1 )或（2 )所記載的印刷配 線板用屏蔽薄膜爲經由塗佈於上述第1金屬層的導電性接 著劑來貼附而成者。 (2 2 )本發明的印刷配線板是在含丨層以上的印刷電 路的基板的至少一面，上述（5 )所記載的印刷配線板用 屏蔽薄膜爲經由塗佈於上述第1金屬層的上述導電性接著 劑來貼附而成者’且，上述導電性接著劑層的一部份會被 充塡於上述鱗片狀金屬粒子的間隙。 (23 )本發明的印刷配線板是在含1層以上的印刷電 路的基板的至少一面，上述（6 )所記載的印刷配線板用 屏蔽薄膜爲經由塗佈於上述第1金屬層的上述導電性接著 劑來貼附而成者，且，上述導電性接著劑層的一部份會被 充塡於上述孔的空隙。 (2 4 )本發明的印刷配線板是在含1層以上的印刷電 路的基板的至少一面，上述（1) 、（2) 、 （12)所記載 的印刷配線板用屏蔽薄膜爲經由塗佈於上述第2金屬層白勺 導電性接著劑來貼附而成者，且在上述第1金屬層與上述 第2金屬層之間，具備形成上述第1金屬層的材料與形成 上述第2金屬層的材料之金屬間化合物層。 (2 5 )本發明的印刷配線板是在含1層以上的印刷電 路的基板的至少一面，上述（1 ) 、 （ 2 ) 、 （ 1 3 )所記載 的印刷配線板用屏蔽薄膜爲經由塗佈於上述第2金S g % 導電性接著劑來貼附而成者，且上述第2金屬層爲1種& 上的鱗片狀金屬粒子彼此間的金屬間結合層。 -14- 200922456 (2 6 )本發明的印刷配線板是在含1層以上的印刷電 路的基板的至少一面’上述（1) 、（2) 、（14)所記載 的印刷配線板用屏蔽薄膜爲經由塗佈於上述第2金屬層的 導電性接著劑來貼附而成者，且上述導電性接著劑層的一 部份會被充塡於上述鱗片狀金屬粒子的間隙。 (27 )本發明的印刷配線板是在含1層以上的印刷電 路的基板的至少一面，上述（1 ) 、（ 2 ) 、（ 1 5 )所記載 的印刷配線板用屏蔽薄膜爲經由塗佈於上述第2金屬層的 上述導電性接著劑來貼附而成者，且上述導電性接著劑層 的一部份會被充塡於上述孔的空隙。 (2 8 )本發明的印刷配線板是在含1層以上的印刷電 路的基板的至少一面，上述（：!丨）所記載的印刷配線板用 屏蔽薄膜爲經由塗佈於上述第2金屬層的上述導電性接著 劑來貼附而成者，且上述導電性接著劑層的一部份會被充 1金屬層的上述鱗片狀金屬粒子的間隙或上述 孔的空隙。 (29 )本發明的印刷配線板是在含1層以上的印刷電 路的基板的至少一面，上述（丨6 )所記載的印刷配線板用 屏蔽薄膜爲經由塗佈於上述第2金屬層的上述導電性接著 劑來貼附而成者，且上述導電性接著劑層的一部份會被充 _ 0 ±述第1金屬層的上述鱗片狀金屬粒子的間隙或上述 孔的空隙。 (3 0 )本發明的印刷配線板是在含1層以上的印刷電 路的基板的至少一面，上述（1 7 )所記載的印刷配線板用 -15- 200922456 屏蔽薄膜爲經由塗佈於上述金屬層的導電性接著劑來貼附 而成者，且上述金屬層爲1種以上的鱗片狀金屬粒子彼此 間的金屬間結合層。 (3 1 )本發明的印刷配線板是在含1層以上的印刷電 路的基板的至少一面，上述（1 8 )所記載的印刷配線板用 屏蔽薄膜爲經由塗佈於上述金屬層的導電性接著劑來貼附 而成者，且上述導電性接著劑層的一部份會被充塡於上述 鱗片狀金屬粒子的間隙。 (3 2 )本發明的印刷配線板是在含1層以上的印刷電 路的基板的至少一面，上述（1 9 )所記載的印刷配線板用 屏蔽薄膜爲經由塗佈於上述金屬層的導電性接著劑來貼附 而成者’且上述導電性接著劑層的一部份會被充塡於上述 孔的空隙。 若根據上述（2 1 )〜（3 2 )的構成，則可提供一種具 有上述（1 )〜（1 9 )的印刷配線板用屏蔽薄膜的各個效 果之印刷配線板。特別是可提供一種即使對於從大的彎曲 半徑到形成小的彎曲半徑（1 . 〇mm )爲止的重複彎曲.滑 動’電磁波屏蔽特性也不會降低，且被物理性保護之印刷 配線板。 【實施方式】 <第1實施形態> 說明有關本發明的第1實施形態的印刷配線板用屏蔽 薄膜。圖1是本發明的第1實施形態的印刷配線板用屏蔽 -16- 200922456 薄膜的模式剖面圖。 圖1所示的印刷配線板用屏蔽薄膜10是在絕緣層1 的一面（表面的算術平均粗度（JIS B 0601 (1994年）） 爲〇·5〜5·0μιη)設置蛇腹構造的金屬層2者。 絕緣層1係由覆蓋薄膜或絕緣樹脂的被覆層所構成。 覆蓋薄膜時是由工程塑料所構成。例如可舉聚丙烯、交聯 聚乙烯、聚酯、聚苯並咪唑、聚醯亞胺、聚醯亞胺醯胺、 聚醚酰亞胺、聚苯硫醚（PPS )、聚奈二甲醇乙二醇酯（ PEN )等。不太被要求耐熱性時，較理想是便宜的聚酯薄 膜’被要求難燃性時，較理想是聚苯硫醚薄膜，更被要求 耐熱性時較理想是聚醯亞胺薄膜。絕緣樹脂時，只要是具 有絕緣性的樹脂即可’例如可舉熱硬化性樹脂或紫外線硬 化性樹脂等。熱硬化性樹脂’例如可舉酚樹脂、丙烯酸樹 脂、環氧樹脂、三聚氰胺樹脂、砂樹脂、丙儲酸變性砂樹 脂等。紫外線硬化性樹脂’例如可舉環氧丙烯酸醋樹脂、 聚酯丙烯酸酯樹脂、及該等的甲基丙烯酸酯變性品等。另 外’硬化形態’可爲熱硬化、紫外線硬化、電子線硬化等 ，只要是硬化者即可。 絕緣層1的表面粗度的調整方法，可舉：以砂等的粒 子來使絕緣層1的表面本身變粗的噴沙法、在絕緣層1的 表面塗佈被为敁混入微粒子的合成樹脂而賦予凹凸的化學 表面粗糙法、在硬化前的樹脂材料本身預先混入微粒子而 使硬化形成絕緣if 1 1¾攪拌混入》去、利m _性藥劑或鹼性 藥劑等藥劑的鈾刻法、電漿軸刻法等。 -17- 200922456 &屬層2之與絕緣層相反側的面的算術平均粗度爲 〇·5〜5·〇μιη ’形成所望形狀的蛇腹構造。形成金屬層2的 金屬材料’可舉鎳、銅、銀、錫、金、鈀、鋁、鉻、鈦、 辞 '及、含該等材料的任一個以上的合金等，金屬材料及 厚度只要對應與所被要求的電磁波屏蔽特性及重複彎曲· 滑動耐性來適宜選擇即可，厚度方面只要設爲〇.1μιη〜 8μιη程度的厚度即可。另外，金屬層2的形成方法有電解 電鍍法、無電解電鍍法、濺射法、電子束蒸鍍法、真空蒸 鍍法、CVD法、MOCVD等。 另外’雖未圖示，但亦可在絕緣層1的外側依序形成 有離模層及分離薄膜。又’亦可在金屬層2的外側形成接 著劑層。藉由該等’在印刷配線板經由接著劑層來貼附之 後’可用壓製機來將印刷配線板用屏蔽薄膜1 〇予以一面 加熱·加壓一面接合，在該接合後，與離模層一起剝下分 離薄膜’藉此可取得附屏蔽的印刷配線板。 在此，接著劑層’可使用聚苯乙烯系、乙酸乙烯酯系 、聚酯系、聚乙烯系、聚丙烯系、聚醯胺系、橡膠系、丙 稀酸系#的熱可塑性樹脂、或酌系、環氧系、氨基甲酸乙 酯系、三聚氰胺系、醇酸系等的熱硬化性樹脂。不特別要 求耐熱性時’最好是保管條件等不受約制的聚酯系的熱可 塑性樹脂’被要求耐熱性或更佳的可撓性時，最好是形成 屏蔽層之後的可靠度高的環氧系的熱硬化性樹脂。無論是 哪種情況’當然最好是熱壓時的滲出（樹脂流）小。 又’ fee者劑層較理想是以含有導電性塡充物的上述樹 -18 - 200922456 脂所構成。因爲除了作爲接著劑層使用以外，還可作爲具 有電磁波屏蔽效果的層使用。導電性塡充物，可使用對碳 、銀、銅、鎳、焊錫、鋁及銅粉施以鍍銀的銀覆蓋銅塡充 物’此外對樹脂球或玻璃串珠等施以金屬電鍍的塡充物或 該等的塡充物的混合體。因爲銀高價，銅欠耐熱的可靠度 ，鋁欠耐濕的可靠度，焊錫難以取得充分的導電性，所以 較理想是使用比較便宜且具有良好的導電性，可靠度高的 銀覆蓋銅塡充物或鎳。 金屬塡充物等的導電性塡充物之至接著性樹脂的調配 比例雖亦受塡充物的形狀等所左右，但爲銀覆蓋銅塡充物 時，對接著性樹脂100重量份而言，較理想是爲10〜400 重量份，更理想是可爲20〜150重量份。一旦超過400重 量份，則至接地電路（銅箔）的接著性會降低，印刷配線 板等的可撓性會變差。又，若低於1 〇重量份，則導電性 會顯著降低。此外’爲鎳塡充物時’對接著性樹脂1 0 0重 量份而言’較理想是爲40〜400重量份，更理想是可爲 100〜350重量份。一旦超過400重量份’則至接地電路（ 銅箔）的接著性會降低’屏蔽F PC等的可撓性會變差。又 ，若低於40重量份’則導電性會顯著降低。金屬塡充物 的形狀可爲球狀 '針狀、纖維狀、薄片狀、樹脂狀的任一 個。又，上述導電性塡充物較理想是低融點金屬。 若根據本實施形態’則由於金屬層2爲具備高彎曲性 的蛇腹構造’因此可提供一種對於從大的彎曲半徑到形成 小的彎曲半徑（l_〇mm)爲止的重複彎曲.滑動而言，不 -19- 200922456 易產生金屬層2的破壞之印刷配線板用屏蔽薄膜1 〇。因此 ，可提供一種電磁波屏蔽特性不易降低的印刷配線板用屏 蔽薄膜。並且，在貼附於印刷配線板使用時，可保護印刷 配線板，且即使印刷配線板重複彎曲•滑動，還是可維持 電磁波屏蔽特性。 <第2實施形態> 其次’說明有關本發明的第2實施形態的印刷配線板 用屏蔽薄膜。圖2是本發明的第2實施形態的印刷配線板 用屏蔽薄膜的模式剖面圖。另外，對與第1實施形態的符 號1、2同様的部份依序賦予符號1 1、1 2，有時省略其說 明。 本實施形態的印刷配線板用屏蔽薄膜20是在金屬層 1 2 (第1金屬層）之與絕緣層1 1相反側的面具備蛇腹構 造的金屬層1 3 (第2金屬層）的點與第1實施形態相異。 金屬層1 3是鎳、銅、銀、錫、金、鈀、鋁、鉻、鈦 、鋅、及含該等材料的任一個以上的合金之任一材料，雖 使用與金屬層1 2相異的材料來形成，但金屬材料及厚度 只要對應於所被要求的電磁波屏蔽特性及重複彎曲•滑動 耐性來適宜選擇即可。另外，厚度方面只要爲Ο.ίμιη〜 8μιη程度的厚度即可。又，金屬層13的形成方法有電解 電鍍法、無電解電鍍法' 濺射法、電子束蒸鍍法、真空蒸 鍍法、CVD法、MOCVD等。又，金屬層13之與絕緣層相 反側的面的算術平均粗度爲0.5〜5 _ 0 μ m，形成所望形狀的 -20- 200922456 蛇腹構造。在此’就一變形例而言，當金屬層13是由錫 等比較柔軟度高的金屬材料構成時，外部側的面亦可不形 成蛇腹構造。 另外，雖未圖示’但亦可在絕緣層1 1的外側依序形 成有離模層及分離薄膜。又，亦可在金屬層13的外側形 成與第1實施形態同樣的接著劑層。藉由該等，在印刷配 線板經由接著劑層來貼附之後，可用壓製機來將印刷配線 板用屏蔽薄膜20予以一面加熱•加壓一面接合，在該接 合後’與離模層一起剝下分離薄膜，藉此可取得附屏蔽的 印刷配線板。 若根據本實施形態，則可發揮與第1實施形態同樣的 效果。又’可藉由金屬層1 3來取得對金屬層〗2防蝕的效 果。並且’對印刷配線板以所定溫度（例如1 5 0。(3 )以上 藉由加壓壓製來貼附使用時，亦可在金屬層12與金屬層 1 3之間形成金屬間化合物。其結果，對印刷配線板以所定 溫度以上藉由加壓壓製來貼附使用時，由於強度會提升， 因此可提供一種對於從大的彎曲半徑到形成小的彎曲半徑 (1.0mm)爲止的重複彎曲•滑動而言，更不易產生金屬 層的破壞之印刷配線板用屏蔽薄膜。 <第3實施形態> 其次’說明有關本發明的第3實施形態的印刷配線板 用屏蔽薄膜。圖3是本發明的第3實施形態的印刷配線板 用屏蔽薄膜的模式剖面圖。 -21 - 200922456 圖3所示的印刷配線板用屏蔽薄膜3 0是設置藉由在 絕緣層21的大致平面的一面使1種以上的鱗片狀金屬粒 子堆積而成的金屬層22者。 金屬層22是如圖4的模式圖所示，藉由使多數的鱗 片狀金屬粒子堆積來形成者。此鱗片狀金屬粒子的平均粒 子徑是Ιμιη〜ΙΟΟμπι’厚度是〇·ΐμη!〜但厚度超過 8μηι者’因爲金屬層22過厚’無法取得所望厚度的薄膜 ’所以較不理想。又，鱗片狀金屬粒子的材料，雖可舉鎳 、銅、銀、錫、金、鈀、鋁、鉻、鈦、鋅、及、含該等的 任一個以上的合金等’但可對應於所被要求的電磁波屏蔽 特性及重複彎曲·滑動耐性來適宜選擇1種以上的材料。 另外，在如此的鱗片狀金屬粒子堆積的金屬層中，藉由所 定溫度以上的加熱下的加壓，在鱗片狀金屬粒子間形成間 隙部份的同時亦產生金屬間結合，可成爲電性連接的層。 另外’此時的金屬層22是預先調整成在將含該金屬層22 的屏蔽薄膜以所定溫度（例如1 5 0 °C )以上藉由加壓壓製 來貼附於印刷配線板時，可形成0 . 1 μιη〜8 μπι的厚度之類 的厚度。 另外，雖未圖示，但亦可在絕緣層2 1的外側依序形 成有離模層及分離薄膜。又，亦可在金屬層22的外側形 成與第1實施形態同樣的接著劑層。藉由該等，在印刷配 線板經由接著劑層來貼附之後，可用壓製機來將印刷配線 板用屏蔽薄膜30予以一面加熱.加壓一面接合，在該接 合後，與離模層一起剝下分離薄膜，藉此可取得附屏蔽的 -22- 200922456 印刷配線板。此時，特別是藉由加熱•加壓在形成於鱗片 狀金屬粒子間的間隙部份充塡接著劑層的一部份’可使金 屬層的強度及可撓性提升。 若根據本實施形態，則對印刷配線板以所定溫度（例 如1 5 0 °C )以上藉由加壓壓製來貼附使用時，在鱗片狀金 屬粒子間，可形成間隙部份的同時亦產生金屬間結合而形 成電性連接的金屬層，因此可成爲更富有可撓性的導電層 。因此，如上述般利用於印刷配線板時，可提供一種對於 從大的彎曲半徑到形成小的彎曲半徑（1 . 0mm )爲止的重 複彎曲•滑動而言，更不易產生金屬層的破壞之印刷配線 板用屏蔽薄膜。 <第4實施形態> 其次’說明有關本發明的第4實施形態的印刷配線板 用屏蔽薄膜。圖5是本發明的第4實施形態的印刷配線板 用屏蔽薄膜的模式剖面圖。 本實施形態的印刷配線板用屏蔽薄膜40是在絕緣層 31的大致平面的一面依序設置金屬層32(第1金屬層） 、金屬層33(第2金屬層）者。 32、33的厚度只要 金屬層3 3是鎳、銅、銀、錫、金、鈀 '鋁、鉻、鈦 鋅、及含該等材料的任一個以上的合金之任一材料，雖 使用與金屬層3 2相異的材料來形成，但金屬材料及厚度 只要對應於所被要求的電磁波屏蔽特性及重複彎曲.滑動 耐丨生來適宜選擇即可。另外，金屬層 -23- 200922456 爲Ο.ίμιη〜8μιη程度的厚度即可。又，金屬層32、33的形 成方法有電解電鍍法、無電解電鍍法、濺射法、電子束蒸 鍍法、真空蒸鍍法、CVD法、MOCVD等。 另外，雖未圖不’但亦可在絕緣層3 1的外側依序形 成有離模層及分離薄膜。又，亦可在金屬層3 2的外側形 成與第1實施形態同樣的接著劑層。藉由該等，在印刷配 線板經由接著劑層來貼附之後，可用壓製機來將印刷配線 板用屏蔽薄膜4 0予以一面加熱•加壓一面接合，在該接 合後，與離模層一起剝下分離薄膜，藉此可取得附屏蔽的 印刷配線板。 若根據本實施形態，則可藉由金屬層3 3來取得對金 屬層3 2防蝕的效果。並且，對印刷配線板以所定溫度（ 例如1 5 0 °C )以上藉由加壓壓製來貼附使用時，亦可在金 屬層3 2與金屬層3 3之間形成金屬間化合物（未圖示）。 其結果，對印刷配線板以所定溫度以上藉由加壓壓製來貼 附使用時，由於強度會提升，因此可提供一種對於從大的 彎曲半徑到形成小的彎曲半徑（1 _ 0 mm )爲止的重複彎曲 •滑動而言，更不易產生金屬層的破壞之印刷配線板用屏 蔽薄膜。 〈第5實施形態> 其次，說明有關本發明的第5實施形態的印刷配線板 。圖6是依序表示本發明的第5實施形態的印刷配線板的 製造方法的工序模式剖面圖。圖7是第5實施形態的印刷 -24- 200922456 配線板用的屏蔽薄膜體。另外’對與第1實施形態的符號 1、2、10同樣的部份依序賦予符號41、42、50’有時省 略其說明。 本實施形態的印刷配線板1 0 0，如圖6 ( c )所示，和 第1實施形態同樣的印刷配線板用屏蔽薄膜5 0與基體薄 膜46是藉由接著劑層47來接著者。基體薄膜46是具備 :基薄膜4 3、及形成於基薄膜4 3上的印刷電路4 4 (信號 電路4 4 a及接地電路4 4 b )、及至少除了 一部份（非絕緣 部）4 4 c以外形成於印刷電路4 4上的絕緣薄膜4 5。 基薄膜4 3、絕緣薄膜4 5皆是由工程塑料所構成。例 如可舉聚丙烯、交聯聚乙烯、聚酯、聚苯並咪唑、聚醯亞 胺、聚醯亞胺醯胺、聚醚酰亞胺、聚苯硫醚（PPS )等的 樹脂。不太被要求耐熱性時，較理想是便宜的聚酯薄膜， 被要求難燃性時，較理想是聚苯硫醚薄膜，更被要求耐熱 性時，較理想是聚醯亞胺薄膜。 在此，基薄膜43與印刷電路44的接合是可藉由接著 劑來接著，或不使用接著劑，與所謂無接著劑型銅張積層 板同樣地接合。又，絕緣薄膜45是可使用接著劑來貼合 可撓性絕緣薄膜，或藉由感光性絕緣樹脂的塗工、乾燥、 曝光、顯像、熱處理等的一連串手法來形成。又，基體薄 膜46可適當採用：只在基薄膜的一方的面具有印刷電路 的單面型印刷配線板、在基薄膜的兩面具有印刷電路的兩 面型印刷配線板、這樣的印刷配線板被複數層積層的多層 型印刷配線板、具有多層零件搭載部及電纜部的 -25- 200922456 ‘ FLEXBOARD”（註冊商標）、或將構成多層部的構件設 爲硬質者的伸縮硬基板、或捲帶式晶片載體封裝（TCP : Tape-Carrier Package)用的TAB捲帶等來實施。 接著劑層47是以作爲接著性樹脂之聚苯乙烯系、乙 酸乙烯酯系、聚酯系、聚乙烯系、聚丙烯系、聚醯胺系、 橡膠系、丙烯酸系等的熱可塑性樹脂、或酚系、環氧系、 氨基甲酸乙酯系、三聚氰胺系、醇酸系等的熱硬化性樹脂 所構成。又’亦可使用該等接著性樹脂中混合金屬、碳等 的導電性塡充物，使持有導電性的導電性接著劑。又，亦 可減少導電性塡充物的量等來形成異方性導電層。不特別 被要求耐熱性時’最好是保管條件等不受約制的聚酯系的 熱可塑性樹脂’被要求耐熱性或更佳的可撓性時，最好是 形成屏蔽層之後的可靠度高的環氧系的熱硬化性樹脂。無 論是哪種情況’當然最好是熱壓時的滲出（樹脂流）小。 導電性塡充物，可使用對碳、銀、銅、鎳、焊錫、銘 及銅粉施以鍍銀的銀覆蓋銅塡充物，此外對樹脂球或玻璃 串珠等施以金屬電鍍的塡充物或該等的塡充物的混合體。 因爲銀高價，銅欠耐熱的可靠度，鋁欠耐濕的可靠度，焊 錫難以取得充分的導電性，所以較理想是使用比較便宜且 具有良好的導電性，可靠度高的銀覆蓋銅塡充物或鎳。 導電性塡充物之至接著性樹脂的調配比例雖亦受塡充 物的形狀等所左右，但爲銀覆蓋銅塡充物時，對接著性樹 脂100重量份而言，較理想是爲10〜400重量份，更理想 是可爲20〜150重量份。一旦超過400重量份，則至接地 -26- 200922456 電路（銅箔）4 4 b的接著性會降低’印刷配線板1 0 0等 可撓性會變差。又，若低於1 〇重量份’則導電性會顯 降低。此外，爲鎳塡充物時’對接著性樹脂100重量份 言，較理想是爲40〜400重量份’更理想是可爲100〜3 重量份。—旦超過400重量份，則至接地電路（銅箔 44b的接著性會降低，印刷配線板1 0 0的可撓性會變差 又，若低於4 0重量份，則導電性會顯著降低。金屬填 物等的導電性塡充物的形狀可爲球狀、針狀、纖維狀、 片狀、樹脂狀的其中之一。 接著劑層4 7的厚度，如前述般，混合金屬塡充物 的導電性塡充物時，僅該等塡充物的部份變厚’形 2 0± 5 μιη程度。並且，不混合導電性塡充物時’爲1， ΙΟμιη。因此，可使屏蔽層（金屬層42及接著劑層47) 全體厚度變薄，可爲薄的印刷配線板1 00。 其次，利用圖7來說明有關使用於本發明的第5實 形態的印刷配線板的製造之屏蔽薄膜體。圖7的屏蔽薄 體是具有：與第1實施形態同樣的印刷配線板用屏蔽薄 5 〇、及依序形成於印刷配線板用屏蔽薄膜5 0的絕緣層 (與金屬層4 2相反側）的表面之離模層4 8b、分離薄 4 8a、及形成於金屬層42 (與絕緣層4 1相反側）的表面 上述接著劑層4 7。另外’當接著劑層4 7爲導電性接著 層時，是與金屬層42 —起形成屏蔽層。 在分離薄膜48a中是使用與基薄膜43、絕緣薄膜 、絕緣層4 1同樣的工程塑料，但因爲在製造過程會被 的 著 而 50 充 薄 等 成 的 施 膜 膜 4 1 膜 之 劑 4 5 除 -27- 200922456 去，所以較理想是便宜的聚酯薄膜。 離模層4 8 b並無特別加以限定，只要是對絕緣層4 1 具有剝離性者即可，例如可使用被覆矽的P ET薄膜等。 其次，說明有關本發明的第5實施形態的印刷配線板 的製造方法。首先，在基體薄膜46上載置上述圖7的屏 蔽薄膜體，使用壓製機49 ( 49a、49b )來一面加熱一面加 壓。藉由加熱變軟的接著劑層4 7的一部份是利用加壓來 如箭號那樣流進絕緣除去部4 5 a (參照圖6 ( a ))。 如此，接著劑層47的一部份與接地電路44b的非絕 緣部44c及絕緣薄膜45充分地接著之後，從壓製機49取 出所被形成的印刷配線板1 0，若將印刷配線板用屏蔽薄膜 50的分離薄膜48a與離模層48b —起剝離f(參照圖6(b ))，則可取得印刷配線板1 0 0 (參照圖6 ( c ))。 若根據本實施形態，則可發揮第1實施形態的印刷配 線板用屏蔽薄膜的效果。 特別是可提供一種即使對於從大的彎曲半徑到形成小 的彎曲半徑（1 · 0mm )爲止的重複彎曲•滑動，電磁波屏 蔽特性也不會降低，且被物理性保護之印刷配線板1 00。 <第6實施形態> 其次，說明有關本發明的第6實施形態的印刷配線板 。圖8是本發明的第6實施形態的印刷配線板的模式剖面 圖。另外，對與第2實施形態的符號1 1、1 2 ' 1 3、2 0同 樣的部份依序賦予符號5 1、5 2 ' 5 3、5 0，有時省略其說明 -28- 200922456 。並且，對與第5實施形態的符號43〜47同樣的部份依 序賦予符號5 4〜5 8，有時省略其說明。 本實施形態的印刷配線板1 〇 1是取代印刷配線板用屏 蔽薄膜5 0，而具備與第2實施形態同樣的印刷配線板用屏 蔽薄膜60的點與第5實施形態相異。另外’印刷配線板 1 〇 1可使用與第5實施形態同樣的製造方法來製造。 若根據本實施形態，則可發揮與第5實施形態的印刷 配線板同樣的效果。另外，就其變形例而言’可爲取代印 刷配線板用屏蔽薄膜6 0，將第3或第4實施形態的印刷配 線板用屏蔽薄膜與本實施形態同樣貼附之印刷配線板。 <第7實施形態> 其次，說明有關本發明的第7實施形態的印刷配線板 。圖9是本發明的第7實施形態的印刷配線板的模式剖面 圖。另外，對與第3實施形態的符號2 1、2 2、3 0同樣的 部份依序賦予符號61a、62a、70a(61b、62b、70b) ’有 時省略其說明。並且，對與第5實施形態的符號44〜4 7 同樣的部份依序賦予符號64〜67，有時省略其說明。 本實施形態的印刷配線板1 02是（1 )經由接著劑層 6 7、6 8來將與第3實施形態同樣的印刷配線板用屏蔽薄膜 7 0 a、7 〇 b分別貼附於基體薄膜6 6的兩面的點、（2 )在接 地電路6 4 b上下的絕緣薄膜6 5及基薄膜6 3側設有絕緣除 去部65a及絕緣除去部63a，在接地電路64b的上下面的 非絕緣部6 4 c中，各接著劑層6 7、6 8與接地電路6 4 b會 -29- 200922456 被連接的點是與第5貫施形態相異。另外，在接著劑層68 中是使用與接著劑層67同樣的材料。並且，印刷配線板 1 02可使用與第5實施形態同樣的製造方法來製造。 若根據本實施形態’則可提供一種能夠在基體薄膜6 6 的兩面發揮與第5實施形態的印刷配線板丨〇 〇同樣的效果 之印刷配線板102。 另外’就其變形例而言’可爲取代印刷配線板用屏蔽 薄膜70a、70b ’將第1、第2、或第4實施形態的印刷配 線板用屏蔽薄膜予以和本實施形態同様地貼附之印刷配線 板。又’亦可適當組合使用第1〜第4實施形態的各印刷 配線板用屏蔽薄膜。 <第8實施形態> 其次’說明有關本發明的第8實施形態的印刷配線板 。圖1 〇是本發明的第8實施形態的印刷配線板的模式剖 面圖。另外’對與第4實施形態的符號3 1、3 2、3 3、4 0 同樣的部份依序賦予符號71a、72a、73a、80a (71b、72b 、73b、80b) ’有時省略其說明。並且，對與第5實施形 態的符號45〜47同樣的部份依序賦予符號76〜78，有時 省略其說明。 本實施形態的印刷配線板1 〇3是（1 )經由接著劑層 7 8、7 9來將與第4實施形態同樣的印刷配線板用屏蔽薄膜 8 0a、8 0b分別貼附於基體薄膜77的兩面的點、（2 )在接 地電路75b上下的絕緣薄膜76及基薄膜74側設有絕緣除 -30- 200922456 去部7 6 a及絕緣除去部74 a，且在接地電路7 5 b設有使絕 緣除去部76a與絕緣除去部？4a連通的貫通孔75d，在該 貫通孔75d内接著劑層78' 79會在位置78a接觸的點是 與第5實施形態相異。另外，在接著劑層7 9中是使用與 接著劑層78同樣的材料。並且，印刷配線板1 〇3可使用 與第5實施形態同樣的製造方法來製造。 若根據本實施形態，則可提供一種能夠在基體薄膜77 的兩面發揮與第5實施形態的印刷配線板同樣的效果之印 刷配線板103。 另外’就其變形例而言，可爲取代印刷配線板用屏蔽 薄膜70a、70b ’將第i、第2、或第4實施形態的印刷配 線板用屏蔽薄膜予以和本實施形態同様地貼附之印刷配線 板。又’亦可適當組合使用第1〜第4實施形態的各印刷 配線板用屏蔽薄膜。 <第9實施形態> 其次，說明有關本發明的第9實施形態的印刷配線板 。圖11是本發明的第8實施形態的印刷配線板的模式剖 面圖。另外，對與第1實施形態的符號1、2、10同樣的 部份依序賦予符號8 1、8 2、9 0，有時省略其說明。並且， 對與第5實施形態的符號43〜47同樣的部份依序賦予符 號8 3〜8 7，有時省略其說明。 本實施形態的印刷配線板1 〇4是在基體薄膜8 6的一 面經由接著劑層8 7來被覆印刷配線板用屏蔽薄膜9 0，在 -31 - 200922456 其端部設置矩形狀的接地構件93。 接地構件9 3是在寬度W的矩形狀的金屬箔91的〜 面設置接著性樹脂層92。接地構件93的寬度W是越大， 接地阻抗越小，較理想，但最好由操作性及經濟性的觀點 來適當選定。就此例而言，寬度W之中，寬度W1會露出 ，寬度W2是與接著劑層87接著。只要將此寬度W1的露 出部份利用適當的導電構件來連接至附近的接地部，便可 確實地接地。並且，若接著被確實地進行，則亦可更縮小 寬度W2。而且，接地構件93的長度，就此例而言是爲了 加工容易，而使與屏蔽薄膜90或基體薄膜86的寬度一致 ，但亦爲更短或更長，只要是連接至導電性接著劑層92 的部份、及可露出而連接至附近的接地部者即可。 同樣，接地構件93的形狀亦非限於矩形狀，只要是 其一部份被連接至接著劑層8 7，其他的一部份可連接至附 近的接地部之形狀者即可。 並且，其配設位置並非一定限於印刷配線板1 〇4的端 部，如圖1 1 ( a )的假想線所示，亦可爲端部以外的位置 93a。但，此情況爲了能夠連接至附近的接地部，接地構 件9 3 a是形成從屏蔽薄膜9 0往側部伸出而露出。往兩側 的伸出長度L 1，L2是只要可連接至機器的框體等附近的 接地部之長度即可，伸出部亦可只有一端。以使金屬層8 2 的表面能夠接至接地部的方式，藉由螺絲固定或錫焊等來 連接。 接地構件9 3的金屬箔91的材料，基於導電性、可撓 -32- 200922456 性、經濟性等的點，較理想是銅箔，但並非限於此。又， 亦可取代金屬箔’使用導電性樹脂，但基於導電性的點’ 較理想是金屬箔。 又，接著性樹脂層9 2較理想是使用聚苯乙烯系、乙 酸乙烯酯系、聚酯系、聚乙烯系、聚丙烯系、聚醯胺系、 橡膠系、丙烯酸系等的熱可塑性樹脂、或酚系、環氧系、 氨基甲酸乙酯系、三聚氰胺系、聚醯亞胺系、醇酸系等的 熱硬化性樹脂，對構成接地構件9 3的金屬箔、接著性樹 脂層或基體薄膜8 6的絕緣薄膜8 5而言接著性佳者。又， 接地構件9 3是予以設於端部以外的位置而用屏蔽層（爲 金屬層8 2，但當接著劑層8 7爲導電性接著劑層時，亦包 含接著劑層8 7 )來覆蓋時，亦可僅以金屬箔或金屬線來構 成。 如上述般，屏蔽薄膜90的屏蔽層（爲金屬層82，但 當接著劑層8 7爲導電性接著劑層時，亦包含接著劑層8 7 )是藉由接地構件9 3來接地，因此不必設置寬廣的接地 線作爲印刷電路的一部份，該部份可提高信號線的配線密 度。而且，接地構件93的接地阻抗相較於以往的印刷配 線板的接地線的接地阻抗，較容易縮小，因此屏蔽層的電 磁波屏蔽效果也會變大。 此外，和以往同樣設置寬廣的接地線來與屏蔽層（爲 金屬層8 2，但當接著劑層8 7爲導電性接著劑層時，亦含 接著劑層8 7 )連接的印刷配線板中設置接地構件者當然包 含於本發明。此情況，因爲寬廣的接地線之基板接地、及 -33- 200922456 接地構件之框架接地的相加效果，所以電磁波屏蔽效果更 佳，更安定。 基體薄膜86的前端部是僅寬度tl露出，印刷電路84 會露出。並且，就此例而言，接地構件93是以其寬度方 向的一端能夠從絕緣薄膜8 5的端部僅隔寬度t2之方式接 著，藉由此寬度t2來確保與信號線之間的絕緣電阻。 另外，接地構件是除了圖1 1所示的形態以外亦可爲 各種的形態。例如，可爲：接地構件是由銅、銀、鋁等所 構成的金屬箔，從金屬箔的一面突出的複數個導電性凸塊 會貫穿覆蓋薄膜來連接至屏蔽層，露出的金屬箔會被連接 至其附近的接地部之形態。 又，亦可爲：接地構件是複數的突起會被形成於一面 ，由銅、銀、鋁等所構成的金屬板，突起會貫穿覆蓋薄膜 來連接至屏蔽層，露出的金屬板會被連接至其附近的接地 部之形態。 又，亦可爲：接地構件是由銅、銀、鋁等所構成的金 屬箔，從金屬箔的一面突出的複數個金屬塡充物會貫穿覆 蓋薄膜來連接至屏蔽層的接著劑層及金屬層，露出的金屬 箔會被連接至其附近的接地部之形態。 又，亦可爲：利用准分子雷射來除去覆蓋薄膜，藉此 在屏蔽薄膜的所定位置形成窗部，在窗部經由混合導電性 塡充物的導電性接著劑來連接導體的接地構件的一端之形 態。接地構件的另一端是被連接至位於附近的接地部。或 ，亦可不經由接地構件，位於附近的接地部直接連接至該 -34- 200922456 窗部。 另外’就其變形例而言’亦可爲取代印刷配線板用屏 蔽薄膜9 0，將第2〜第4實施形態的印刷配線板用屏蔽薄 膜予以和本實施形態同樣地貼附之印刷配線板。 [實施例] (實施例1 ) 首先’製作與圖1所示的印刷配線板用屏蔽薄膜10 同様構成的印刷配線板用屏蔽薄膜（金屬層的詳細是參照 下述表1的實施例1 )。圖1 3 ( a )是表示此時所被製作 的印刷配線板用屏蔽薄膜的S EV[照片。又，圖1 3 ( b )是 表示圖1 3 ( a )的SEM照片的攝影方向的模式圖。在製作 具有如此的蛇腹構造的金屬層之印刷配線板用屏蔽薄膜後 ，將此印刷配線板用屏蔽薄膜經由接著劑來以壓製機一面 加熱•加壓一面接合至印刷配線板，製作附屏蔽的印刷配 線板（寬度1 〇mm、長度1 70mm )。在此’本實施例的印 刷配線板用屏蔽薄膜的絕緣層是厚度爲1 2.5 的聚醯亞 胺樹脂層。接著劑層是使用厚度爲1 7μιη的環氧樹脂。將 如此製作的印刷配線板作爲實施例1的試料。 (實施例2 ) 其次，製作與圖1所示的印刷配線板用屏蔽薄膜1 〇 同様構成的印刷配線板用屏蔽薄膜（金屬層的詳細是參照 下述表1的實施例2)。然後’將此印刷配線板用屏蔽薄 -35- 200922456 膜經由接著劑來以壓製機一面加熱•加壓一面接合至印刷 配線板，製作附屏蔽的印刷配線板（寬度1 〇mm、長度 1 7 0 m m )。另外，絕緣層及接著劑是使用與實施例1同樣 者。將如此製作的印刷配線板作爲實施例2的試料。 (實施例3 ) 其次，製作與圖1所示的印刷配線板用屏蔽薄膜10 同様構成的印刷配線板用屏蔽薄膜（金屬層的詳細是參照 下述表1的實施例3 )。然後，將此印刷配線板用屏蔽薄 膜經由接著劑來以壓製機一面加熱•加壓一面接合至印刷 配線板，製作附屏蔽的印刷配線板（寬度1 Omm、長度 1 7 0mm )。另外，絕緣層及接著劑是使用與實施例1同樣 者。將如此製作的印刷配線板作爲實施例3的試料。 (比較例1 ) 取代實施例1之2層的金屬層，製作一形成厚度爲 0.1 μπα的1層的銀薄膜層之印刷配線板用屏蔽薄膜。然後 ，將此印刷配線板用屏蔽薄膜經由接著劑來以壓製機一面 加熱•加壓一面接合至印刷配線板，製作附屏蔽的印刷配 線板（寬度1 0 m m、長度1 7 0 m m )。另外，絕緣層及接著 劑是使用與實施例1同樣者。將如此製作的印刷配線板作 爲比較例1的試料。 (比較例2) -36- 200922456 取代實施例1之2層的金屬層，製作一形成厚度爲 2 0 μηι的1層的銀糊層之印刷配線板用屏蔽薄膜。然後， 將此印刷配線板用屏蔽薄膜經由接著劑來以壓製機一面加 熱·加壓一面接合至印刷配線板，製作附屏蔽的印刷配線 板（寬度10mm、長度170mm)。另外，絕緣層及接著劑 是使用與實施例1同樣者。將如此製作的印刷配線板作爲 比較例2的試料。 [耐彎曲性試驗] 依照IPC規格，如圖12所示，在固定板12 1與滑動 板1 22之間使附屏蔽的印刷配線板1 1 1 (爲上述實施例1 及比較例1、2的試料的任一個）在將曲率設爲1 . 〇mm的 狀態下彎曲成U字型來安裝，在試驗環境23 °C中，驗證有 關使滑動板1 22在3 0mm的行程、滑動速度1 00次/分的條 件下滑動於上下時之印刷配線板用屏蔽薄膜的金屬層的耐 性（電磁屏蔽性的維持）及是否可保護印刷配線板。另外 ，上述實施例1及比較例1、2的試料之各印刷配線板的 印刷電路是使用線數爲6條，線寬爲0. 1 2mm，空間寬爲 0.1 mm者。並且，有關印刷配線板用屏蔽薄膜的金屬層的 耐性（電磁屏蔽性的維持）及是否可保護印刷配線板方面 是藉由測定各試料的金屬層或印刷電路的通電量來驗證。 將驗證結果顯示於下述表1。 -37- 200922456 【一谳】 1 P Η m ή ip ®In 塘 m 續 m 議 璨q Mm 莓贓 &g 〇 脈S κ承 85,200 73,000 94,200 咏 課 m 形成無限 大的次數 >1,000,000 >1,000,000 >1,000,000 形成100 Ω 以上的次數 | >1,000,000] >1,000,000 I 108,100 形成10 Ω以 上的次數 871,100 101,000 1,100 十點平 均高度 Rz (" m) | 10.92) I 9.87] 最大 高度 Ry (“ m) | 12.92] | 12.89] 算術平 均粗度 Ra (" m) | 0.738| | 0.573| | 0.536丨 金屬薄膜層的種類 第2金屬層 1 厚度(μπι)| CM 〇 Csi 〇 材質 騷 第1金屬層 厚度(Am) 〇 CNJ | 0.01 材質 嫌 m 實施例1 1實施例2 | 實施例3 86,300 31,800 5,700 馨 6.04 11.51 0.235 鹿 5 比較例1 26,900 64,800 62,100 6,400 1 1 1 璀 銀糊 比較例2 -38 - 200922456 由表1可知，實施例1〜3的試料是金屬層具有耐性 ’且可保護印刷配線板。相對的，由比較例1可知，雖可 保護印刷配線板，但銀薄膜層的電磁屏蔽性無法維持會降 低（通電量降低）。又’由比較例2可知，雖可維持銀糊 層的電磁屏蔽性，但無法保護印刷配線板（斷線）。 另外’本發明可在不脫離申請專利範圍的範圍內實施 設計變更’非限於上述實施形態或實施例。例如，在上述 實施形態中’雖金屬層爲顯不2層，但金屬層亦可爲3層 以上。 並且，在上述實施形態的各金屬層，亦可使用具有複 數孔或空隙的多孔質（porous )者。在具有複數孔的多孔 質金屬層時，孔的直徑爲Ο.ίμηι〜ΙΟμιη，在具有複數空隙 的多孔質金屬層時，空隙的大小爲Ο.ΐμπι〜ΙΟμιη，空隙率 爲1〜50%。另外，若空隙率未滿1 %，則幾乎不可能具有 後述的效果，若超過50%，則導電性會相當降低。另外， 此時的金屬層是在將含該金屬層的屏蔽薄膜以所定溫度（ 例如1 5 0 °C )以上藉由加壓壓製來貼附於印刷配線板時， 預先被調整成Ο.ίμηι〜8μπι的厚度之類的厚度。並且’有 關複數金屬層的使用，亦與第2或第4實施形態同樣，以 所定溫度（例如1 5 (TC )以上藉由加壓壓製來貼附於印刷 配線板使用時，可在金屬層1 2與金屬層1 3之間形成金屬 間化合物。藉由該等，對印刷配線板加壓壓製來貼附使用 時，導電性接著劑層的一部份會被充塡於金屬層的孔的空 隙，可使金屬層的強度及可撓性提升。因此，可提供一種 -39- 200922456 對於從大的彎曲半徑到形成小的彎曲半徑（1 . 〇mm )爲止 的重複彎曲•滑動而言，更不易產生金屬層的破壞之印刷 配線板用屏蔽薄膜及被貼附此薄膜的印刷配線板。 又，亦可爲適當組合印刷配線板用屏蔽薄膜的各實施 形態的各層之類的印刷配線板用屏蔽薄膜。並且，在各實 施形態的印刷配線板用屏蔽薄膜中，雖是僅顯示在絕緣層 的一面側設置金屬層者，但亦可在絕緣層的兩面設置。 又，本發明的印刷配線板用屏蔽薄膜，可利用於FPC 、COF (薄膜承載晶粒構裝（Chip on Flex ) ) 、RF (伸 縮印刷板）、多層可撓性基板、硬基板等，但並非限於該 等。 【圖式簡單說明】 圖1是本發明的第1實施形態的印刷配線板用屏蔽薄 膜的模式剖面圖。 圖2是本發明的第2實施形態的印刷配線板用屏蔽薄 膜的模式剖面圖。 圖3是本發明的第3實施形態的印刷配線板用屏蔽薄 膜的模式剖面圖。 圖4是形成圖3所示的印刷配線板用屏蔽薄膜的金屬 層的鱗片狀金屬粒子群的模式圖。 圖5是本發明的第4實施形態的印刷配線板用屏蔽薄 膜的模式剖面圖。 圖6是依序表示本發明的第5實施形態的印刷配線板 4〇 - 200922456 的製造方法的工序模式剖面圖。 圖7是第5實施形態的印刷配線板用的屏蔽薄膜體。 圖8是本發明的第6實施形態的印刷配線板的模式剖 面圖。 圖9是本發明的第7實施形態的印刷配線板的模式剖 面圖。 圖1 0是本發明的第8實施形態的印刷配線板的模式 剖面圖。 圖1 1是本發明的第9實施形態的印刷配線板的模式 剖面圖。 圖1 2是表示耐彎曲性試驗的試驗方法的圖。 圖1 3 ( a )是表示本發明的實施例1的印刷配線板用 屏蔽薄膜的S E Μ照片，（b )是表示（a )的S E Μ照片的 攝影方向的模式圖。 【主要元件符號說明] 1 Μ 21 31、 41、 61a、 71a、 71b、 81:絕緣層 2、 12、 13、 22、 32、 33、 42、 62a、 62b、 82:金屬 層 10、 20、 30、 4〇、 50、 6〇、 7〇a、 7〇b、 8〇a、 8〇b、 90 :印刷配線板用屏蔽薄膜 43、 63、 74:基薄膜 4 4、8 4 :印刷電路 44a :信號電路 -41 - 200922456 44b ' 64b、 75b:接地電路 4 4 c、6 4 c :非絕緣部 4 5、6 5、7 6、8 5 :絕緣薄膜 45a、 63a、 65a、 74a、 76a:絕緣除去部 46、 66、 77、 86:基體薄膜 47、 67、 68、 78、 79、 87:接著劑層 48a :分離薄膜 48b :離模層 4 9 :壓製機 7 5 d :貫通孔 9 1 :金屬箔 92 :接著性樹脂層 9 3、9 3 a :接地構件 78a、 93a ：位置 100、 101、 102、 103、 104、 111:印刷配線板 1 2 1 :固定板 122 :滑動板 -42-[Technical Field] The present invention relates to a shielding film for a printed wiring board used in a device such as a computer, a communication device, or a video camera, and a printed wiring board. [Prior Art] Conventionally, a shielding film for a printed wiring board using a metal layer is known. For example, it is disclosed in Patent Document 1 below. Patent Document 1 discloses a metal foil for transfer which can be easily transferred to an FPC or the like, and is characterized in that a metal layer is formed on at least one surface layer of the synthetic resin sheet substrate, and the metal layer and the synthetic resin sheet are a thin metal foil for transfer having a peeling strength of 5 N/cm or less and a conductive adhesive layer, wherein the metal powder and/or the carbon powder are dispersed on the surface of the metal layer of the metal foil for transfer. The conductivity is then laminated to the resin composition. [Problem to be Solved by the Invention] In recent years, in devices such as computers, communication devices, and video cameras, it has been desired to be more resistant to deformation from a large bending radius to a small size. A bending film for a printed wiring board and a printed wiring board for repeated bending and sliding of a bending radius (1.0 mm). However, although Patent Document 1 has a certain degree of flexibility, it has not been considered for the weight--5-200922456 complex bending/sliding from a large bending radius to a small bending radius (1.0 mm). When repeated bending or sliding from a large bending radius to a small bending radius (〖0 mm) is performed, the destruction of the metal layer may occur, and the electromagnetic shielding property may be lowered. Accordingly, an object of the present invention is to provide a shielding film for a printed wiring board which is less likely to cause breakage of a metal layer from repeated bending and sliding from a large bending radius to a small bending radius (1. 〇mm). And printed wiring boards. (Means for Solving the Problem and Effect) (1) The shielding film for a printed wiring board of the present invention includes a first metal layer formed on one surface of the insulating layer, and an arithmetic mean roughness of one surface of the insulating layer (JIS B 0601 (1994)) is 0.5 to 5·0 μηι, and the first metal layer is formed so as to form a bellows structure along one surface of the insulating layer. According to the above configuration, since the metal layer is a bellows structure having high flexibility, it is possible to provide a repetitive bending and sliding from a large bending radius to a small bending radius (l.〇mm). A shielding film for a printed wiring board that causes destruction of a metal layer. Therefore, it is possible to provide a shielding film for a printed wiring board in which electromagnetic wave shielding characteristics are not easily lowered. Further, when it is attached to a printed wiring board, the printed wiring board can be protected, and the electromagnetic wave shielding characteristics can be maintained even if the printed wiring board is repeatedly bent and slid. (2) In the shielding film for a printed wiring board according to the above (1), the arithmetic mean roughness of the surface of the first metal layer of the -6-200922456 opposite to the insulating layer is 0 · 5 to 5.0 μη. According to the above configuration, the bellows structure having a better shape can be formed, and the effect of the above (1) can be more surely exhibited. (3) In the shielding film for a printed wiring board according to the above (1) or (2), it is preferable that the first metal layer is made of nickel, copper, silver, tin, gold, IG, 铭, 络, 钦, 、, And a layer comprising any one or more of the alloys of the temple material. According to the above configuration, the metal layer having high electromagnetic wave shielding properties can be obtained. Further, when another metal layer composed of a different material is formed on the surface of the metal layer, it is easy to alloy. (4) In the shielding film for a printed wiring board according to the above (1) or (2), it is preferable that the first metal layer is a layer formed of one or more scaly metal particles. According to the above configuration, when the printed wiring board is attached by pressure pressing at a predetermined temperature (for example, 1 50 ° C) or more, a gap portion can be formed between the scaly metal particles, and an intermetallic portion is also generated. The metal layer that is electrically connected is formed in combination, and thus can be a more flexible conductive layer. Therefore, when used as a printed wiring board as described above, it is possible to provide a metal layer which is less likely to be broken for repeated bending and sliding from a large bending radius to a small bending radius (1·0 mm). A shielding film for printed wiring boards. (5) In the shielding film for a printed wiring board according to the above (1) or (2), it is preferable that a conductive adhesive layer is formed on a side of the second metal layer opposite to the insulating layer 200922456. According to the above configuration, it can be easily attached to the printed wiring board, and can be used as a layer having an electromagnetic wave shielding effect, in addition to being used as an adhesive layer. Further, in the shielding film for a printed wiring board of the above (4), when the printed wiring board is pressed and pressed for use, the conductive adhesive layer is filled with a gap between the scaly metal particles to make the metal layer. Increased strength and flexibility. (6) The shielding film for a printed wiring board according to the above (1) or (2), wherein the first metal layer is a porous layer having a plurality of holes, and the first metal layer is opposite to the insulating layer A conductive adhesive layer is formed on the side. According to the above configuration, when the printed wiring board is pressed and pressed for use, the conductive adhesive layer is filled in the voids of the holes, and the strength and flexibility of the metal layer can be improved. (7) The shielding film for a printed wiring board according to the above (1) or (2), wherein nickel, copper, silver, tin, gold, or the like is formed on a side of the first metal layer opposite to the insulating layer. a second metal layer of palladium, aluminum, chromium, titanium 'zinc, and any one or more of the alloys of the above materials. The first metal layer and the second metal layer are made of different materials. Composition. According to the above configuration, the effect of preventing corrosion of the metal layer 12 can be obtained by the second metal layer. Further, when the printed wiring board is attached by pressurization at a predetermined temperature (e.g., 150 ° C) or higher, an intermetallic compound may be formed between the first metal layer and the second metal layer. As a result, when the printed wiring board of -8-200922456 is attached by pressure pressing at a predetermined temperature or higher, it can be used as a shielding film for printed wiring boards with improved strength and flexibility. (8) In the shielding film for a printed wiring board of the above (7), it is preferable that the second metal layer is a layer formed of one or more scaly metal particles. According to the above configuration, when the printed wiring board is attached by pressurization at a predetermined temperature (for example, 150 ° C) or more, a gap portion can be formed between the scaly metal particles constituting the second metal layer. At the same time, the metal layer is formed by the combination of the metals to form an electrical connection, so that it can be a more flexible conductive layer. Therefore, when it is used for a printed wiring board as described above, it is possible to provide a printed wiring which is less likely to cause damage of a metal layer from repeated bending and sliding from a large bending radius to a small bending radius (1.0 mm). A shielding film for the board. (9) In the shielding film for a printed wiring board according to the above (8), it is preferable that a conductive adhesive layer is formed on a side of the second metal layer opposite to the insulating layer. According to the above configuration, it can be easily attached to the printed wiring board, and can be used as a layer having an electromagnetic wave shielding effect in addition to being used as an adhesive layer. When the printed wiring board is pressed and pressed for use, the conductive adhesive layer is filled in the gap between the scaly metal particles, and the strength and flexibility of the metal layer can be improved. (1) In the shielding film for a printed wiring board according to the above (7), the second metal layer may be a porous layer having a plurality of holes, and the second metal layer may be formed on a side opposite to the insulating layer. Conductive adhesive -9- 200922456 layer. According to the above configuration, when the printed wiring board is pressed and pressed for use, a part of the conductive adhesive layer is filled in the void of the hole of the second metal layer, and the strength of the metal layer can be made. Increased flexibility. (1) In the shielding film for a printed wiring board according to the above (1) or (2), it is preferable that the first metal layer is a porous layer having a plurality of pores or formed of one or more scaly metal particles. Layer. According to the above configuration, when the printed wiring board is pressed and pressed for use, when the first metal layer is a porous layer having a plurality of holes, a void of the hole is filled with a portion of the conductive adhesive layer. In the case of a layer formed of one or more scaly metal particles, a gap between the scaly metal particles is filled with a portion of the conductive adhesive layer, and the strength and flexibility of the first metal layer can be made. Sexual improvement. (1 2) In another aspect, the shielding film for a printed wiring board of the present invention may include: a first metal layer formed on one surface of the insulating layer; and a side opposite to the insulating layer of the first metal layer In the second metal layer, the first metal layer and the second metal layer are made of nickel, copper, silver, tin, gold, palladium, aluminum, chromium, titanium, zinc, and any one or more alloys containing the materials. A layer of any of the materials and consisting of materials of a different type. According to the above configuration, the effect of preventing corrosion of the metal layer 12 can be obtained by the second metal layer. Further, when the printed wiring board is attached by pressure pressing at a predetermined temperature (Example-10-200922456, for example, 150 ° C) or more, a metal may be formed between the first metal layer and the second metal layer. Intermetallic compound. As a result, when the printed wiring board is attached by press-pressing at a predetermined temperature or higher, it can be used as a shielding film for a printed wiring board having improved strength and flexibility. Therefore, it is possible to provide a shielding film for a printed wiring board which is less likely to cause breakage of a metal layer from repeated bending and sliding from a large bending radius to a small bending radius (1.0 mm). (1) In the above-mentioned (1 2) shielding film for a printed wiring board, it is preferable that the second metal layer is a layer formed of one or more scaly metal particles. According to the above configuration, when the printed wiring board is attached by pressurization at a predetermined temperature (for example, 15 〇r) or more, the gap portion can be formed between the scaly metal particles constituting the second metal layer. A metal layer that is electrically bonded to each other is also formed, so that it can be a more flexible conductive layer. Therefore, it is possible to provide a shielding film for a printed wiring board which is less likely to cause breakage of a metal layer from repeated bending and sliding from a large bending radius to a small bending radius (1. 〇mm). (1) In the shielding film for a printed wiring board according to the above (1 3), it is preferable that a conductive adhesive layer is formed on a side of the second metal layer opposite to the insulating layer. According to the above configuration, it is easy to attach to the printed wiring board. Further, when the printed wiring board is pressed and pressed for use, the conductive adhesive layer is filled in the gap between the scaly metal particles, and the strength and burntability of the metal layer can be improved. In the shielding film for a printed wiring board according to the above (1), the second metal layer may be a porous layer having a plurality of holes, and the insulating layer of the second metal layer The opposite side of the layer is formed with a layer of conductive skin. According to the above configuration, when the printed wiring board is pressed and pressed for use, a part of the conductive adhesive layer is filled with the second metal layer. The gap of L can increase the strength and flexibility of the second metal layer. (1) In the shielding film for a printed wiring board according to the above (1) or (1), the first metal layer may be a porous layer having a plurality of pores or formed of one or more scaly metal particles. Layer. According to the above configuration, when the printed wiring board is pressed and pressed for use, when the first metal layer is a porous layer having a plurality of holes, a part of the conductive adhesive layer exists in the void of the hole. When the second metal layer is filled with a layer formed of one or more scaly metal particles, a part of the conductive adhesive layer exists in the gap between the scaly metal particles. Since the second metal layer is filled, the strength and flexibility of the first metal layer can be improved. (1) In another aspect, the shield film for a printed wiring board of the present invention may have a metal layer formed on one surface of the insulating layer, and the metal layer is a layer formed of one or more scaly metal particles. According to the above configuration, when attached at a predetermined temperature (for example, 1 550 Å or more) by press-pressing, it is formed between the scaly metal particles, and a gap portion can be formed, and an intermetallic bond is formed to form an electrical connection. The metal layer 'can therefore become a more flexible conductive layer. Therefore, it is possible to provide a shield for printed wiring boards which is less likely to cause damage of the metal layer from repeated bending and sliding from a large bending radius to a small bending radius (1. 〇mm). film. (1) In the shielding film for a printed wiring board according to the above (17), it is preferable that a conductive adhesive layer is formed on a side of the metal layer opposite to the insulating layer. According to the above configuration, it is easy to attach to the printed wiring board. Further, when the printed wiring board is pressed and pressed for use, the conductive adhesive layer is filled in the gap between the scaly metal particles, and the strength and flexibility of the metal layer can be improved. (1) In another aspect, the shielding film for a printed wiring board of the present invention may include a metal layer formed on one surface of the insulating layer, and the metal layer is a porous layer having a plurality of holes, and the metal layer is A conductive adhesive layer is formed on the opposite side of the insulating layer. According to the above configuration, when the printed wiring board is pressed and pressed for use, a part of the conductive adhesive layer is filled in the void of the hole of the metal layer, and the strength and flexibility of the metal layer can be improved. Therefore, it is possible to provide a shielding film for a printed wiring board which is less likely to cause breakage of a metal layer from repeated bending and sliding from a large bending radius to a small bending radius (1.0 mm). (20) In the shielding film for a printed wiring board of the above (1), (2), (12) to (15), (17) to (1 9 ), the lower limit of the bending radius can be used up to 1.0 mm. A shielding film for repeated bending and sliding. (2) The printed wiring board of the present invention is a coating film for a printed wiring board described in the above (1) or (2), which is at least one surface of a printed circuit of the above-mentioned (1) or (2). The conductive adhesive attached to the first metal layer is attached. (2) The printed wiring board of the present invention is at least one surface of the substrate including the printed circuit of the ruthenium layer or more, and the shield film for the printed wiring board according to the above (5) is applied to the first metal layer. A conductive adhesive is attached to the packager', and a part of the conductive adhesive layer is filled in the gap between the scaly metal particles. (23) The printed wiring board of the present invention is at least one surface of a substrate including one or more printed circuits, and the shield film for a printed wiring board according to (6) is the conductive material applied to the first metal layer. An adhesive is attached to the laminate, and a portion of the conductive adhesive layer is filled in the voids of the holes. (2) The printed wiring board of the present invention is at least one surface of a substrate including one or more printed circuits, and the shielding film for a printed wiring board described in the above (1), (2), and (12) is coated. And a conductive adhesive of the second metal layer is attached, and a material for forming the first metal layer and the second metal are formed between the first metal layer and the second metal layer An intermetallic compound layer of material of the layer. (2) The printed wiring board of the present invention is at least one surface of a substrate including one or more printed circuits, and the shielding film for a printed wiring board described in the above (1), (2), and (13) is coated. The second metal layer is attached to the second gold S g % conductive adhesive, and the second metal layer is an intermetallic bonding layer between the scaly metal particles on one type. -14-200922456 (2) The printed wiring board of the present invention is a shielding film for a printed wiring board described in the above (1), (2), and (14) on at least one surface of a substrate including one or more printed circuits. The film is attached via a conductive adhesive applied to the second metal layer, and a part of the conductive adhesive layer is filled in a gap between the scaly metal particles. (27) The printed wiring board of the present invention is at least one surface of a substrate including one or more printed circuits, and the shielding film for a printed wiring board described in the above (1), (2), and (15) is coated. The conductive adhesive is adhered to the second metal layer, and a part of the conductive adhesive layer is filled in the void of the hole. (2) The printed wiring board of the present invention is at least one surface of a substrate including one or more printed circuits, and the shielding film for a printed wiring board described in the above (::) is applied to the second metal layer. The conductive adhesive is attached, and a part of the conductive adhesive layer is filled with a gap of the scaly metal particles of the metal layer or a void of the hole. (29) The printed wiring board of the present invention is at least one surface of a substrate including one or more printed circuits, and the shield film for a printed wiring board according to (6) is applied to the second metal layer. A conductive adhesive is attached, and a part of the conductive adhesive layer is filled with a gap of the scaly metal particles of the first metal layer or a void of the hole. (3) The printed wiring board of the present invention is at least one surface of a substrate including one or more printed circuits, and the -15-200922456 shielding film for the printed wiring board described in the above (1 7) is applied to the metal. The conductive adhesive of the layer is attached, and the metal layer is an intermetallic bonding layer of one or more scaly metal particles. (3) The printed wiring board of the present invention is at least one surface of a substrate including one or more printed circuits, and the conductive film for a printed wiring board according to the above (1) is conductively applied to the metal layer. The adhesive is then attached, and a portion of the conductive adhesive layer is filled in the gap between the scaly metal particles. (3) The printed wiring board of the present invention is at least one surface of a substrate including one or more printed circuits, and the conductive film for a printed wiring board according to the above (1) is conductively applied to the metal layer. The agent is then attached to the viewer' and a portion of the conductive adhesive layer is filled in the voids of the holes. According to the above configuration of (2 1 ) to (3 2 ), it is possible to provide a printed wiring board having the respective effects of the above-described (1) to (1 9 ) shielding films for printed wiring boards. In particular, it is possible to provide a printed wiring board which is not physically reduced from the large bending radius to the formation of a small bending radius (1. 〇mm). [Embodiment] <First Embodiment> A shielding film for a printed wiring board according to the first embodiment of the present invention will be described. Fig. 1 is a schematic cross-sectional view showing a film of a shield-16-200922456 for a printed wiring board according to a first embodiment of the present invention. The shielding film 10 for a printed wiring board shown in FIG. 1 is a metal layer provided with a bellows structure on one surface of the insulating layer 1 (the arithmetic mean roughness of the surface (JIS B 0601 (1994)) is 〇·5 to 5·0 μm). 2 people. The insulating layer 1 is composed of a coating layer covering a film or an insulating resin. When covering the film, it is made of engineering plastics. For example, polypropylene, crosslinked polyethylene, polyester, polybenzimidazole, polyimine, polyamidamine, polyetherimide, polyphenylene sulfide (PPS), polynaphthyldiacetate Glycol ester (PEN) and the like. When it is not required to be heat-resistant, it is preferable that the polyester film which is inexpensive is required to be flame-retardant. It is preferably a polyphenylene sulfide film, and more preferably a polyimide film is required for heat resistance. In the case of the insulating resin, any resin having an insulating property may be used, for example, a thermosetting resin or an ultraviolet curable resin. The thermosetting resin is exemplified by a phenol resin, an acrylic resin, an epoxy resin, a melamine resin, a sand resin, a cyanic acid-denatured sand resin, and the like. Examples of the ultraviolet curable resin ′ are an epoxy acrylate resin, a polyester acrylate resin, and the like, and such methacrylate denatured products. Further, the 'hardened form' may be heat hardening, ultraviolet curing, electron beam hardening, or the like, as long as it is hardened. The method of adjusting the surface roughness of the insulating layer 1 is a sandblasting method in which the surface of the insulating layer 1 is made thick by particles such as sand, and a synthetic resin in which fine particles are mixed on the surface of the insulating layer 1 The chemical surface roughening method for imparting irregularities, the resin material itself before hardening, and the uranium engraving method and plasma for prematurely mixing the fine particles to form an insulating if 1 13⁄4 stirring and mixing into a drug, an alkaline agent, or an alkaline agent. Axis engraving and so on. -17- 200922456 & The arithmetic mean roughness of the surface of the genus layer 2 opposite to the insulating layer is 〇·5~5·〇μιη ′ to form the bellows structure of the desired shape. The metal material forming the metal layer 2 may be nickel, copper, silver, tin, gold, palladium, aluminum, chromium, titanium, or the like, and an alloy containing any one or more of these materials, and the metal material and the thickness may correspond to each other. The electromagnetic wave shielding characteristics and the repeated bending and sliding resistance which are required may be appropriately selected, and the thickness may be set to a thickness of about 11 μm to 8 μm. Further, the metal layer 2 is formed by electrolytic plating, electroless plating, sputtering, electron beam evaporation, vacuum evaporation, CVD, MOCVD, or the like. Further, although not shown, a release layer and a separation film may be sequentially formed on the outer side of the insulating layer 1. Further, an adhesive layer may be formed on the outer side of the metal layer 2. After the "printing of the printed wiring board via the adhesive layer", the printed wiring board is bonded to the protective film 1 by heating and pressing, and after the bonding, together with the release layer The separation film is peeled off, whereby a shielded printed wiring board can be obtained. Here, as the adhesive layer ', a thermoplastic resin such as polystyrene, vinyl acetate, polyester, polyethylene, polypropylene, polyamide, rubber or acrylic #, or A thermosetting resin such as an epoxy resin, a urethane system, a melamine system or an alkyd resin is used. When heat resistance is not particularly required, it is preferable that the polyester-based thermoplastic resin which is not subject to storage conditions is required to have heat resistance or better flexibility, and it is preferable to have high reliability after forming the shield layer. An epoxy-based thermosetting resin. In either case, it is preferable that the bleed (resin flow) at the time of hot pressing is small. Further, the "feet agent layer" is preferably composed of the above-mentioned tree -18 - 200922456 grease containing a conductive chelating substance. Since it can be used as a layer having an electromagnetic wave shielding effect in addition to being used as an adhesive layer. For conductive inclusions, silver-coated copper ruthenium filled with carbon, silver, copper, nickel, solder, aluminum, and copper powder may be used. In addition, metal plating may be applied to resin balls or glass beads. a mixture of objects or such inclusions. Because of the high price of silver, the reliability of copper due to heat resistance, the reliability of aluminum under moisture resistance, and the difficulty in obtaining sufficient conductivity of solder, it is desirable to use a silver-coated copper-filled copper which is relatively inexpensive and has good electrical conductivity and high reliability. Object or nickel. The ratio of the conductive filler to the adhesive resin such as the metal filler is also affected by the shape of the filler, etc., but when the silver is covered with the copper ruthenium, the weight of the adhesive resin is 100 parts by weight. It is preferably 10 to 400 parts by weight, more preferably 20 to 150 parts by weight. When it exceeds 400 parts by weight, the adhesion to the ground circuit (copper foil) is lowered, and the flexibility of the printed wiring board or the like is deteriorated. Further, if it is less than 1 part by weight, the electrical conductivity is remarkably lowered. Further, it is more preferably 40 to 400 parts by weight, more preferably 100 to 350 parts by weight, based on 100 parts by weight of the adhesive resin. When it exceeds 400 parts by weight, the adhesion to the ground circuit (copper foil) is lowered. The flexibility of the shield F PC or the like is deteriorated. Further, if it is less than 40 parts by weight, the electrical conductivity is remarkably lowered. The shape of the metal ruthenium may be any of a spherical shape of a needle, a fiber, a sheet, or a resin. Further, the conductive filler is preferably a low melting point metal. According to the present embodiment, since the metal layer 2 is a bellows structure having high flexibility, it is possible to provide a repeated bending from a large bending radius to a small bending radius (l_〇mm). , No -19- 200922456 Shield film 1 for printed wiring boards which is prone to damage of metal layer 2. Therefore, it is possible to provide a shield film for a printed wiring board in which electromagnetic wave shielding characteristics are not easily lowered. Further, when it is attached to a printed wiring board, the printed wiring board can be protected, and the electromagnetic wave shielding characteristics can be maintained even if the printed wiring board is repeatedly bent and slid. <Second Embodiment> Next, a shielding film for a printed wiring board according to a second embodiment of the present invention will be described. Fig. 2 is a schematic cross-sectional view showing a shield film for a printed wiring board according to a second embodiment of the present invention. Incidentally, the symbols 1 and 1 are assigned to the same portions as the symbols 1 and 2 of the first embodiment, and the description thereof may be omitted. The shielding film 20 for a printed wiring board according to the present embodiment is a point of a metal layer 13 (second metal layer) having a bellows structure on a surface of the metal layer 1 2 (first metal layer) opposite to the insulating layer 1 1 . The first embodiment differs. The metal layer 13 is any material of nickel, copper, silver, tin, gold, palladium, aluminum, chromium, titanium, zinc, and an alloy containing any one or more of these materials, although it is different from the metal layer 12 The material is formed, but the metal material and the thickness may be appropriately selected in accordance with the required electromagnetic wave shielding characteristics and repeated bending and sliding resistance. In addition, the thickness may be as long as Ο.ίμιη~ 8μιη. Further, the method of forming the metal layer 13 includes electrolytic plating, electroless plating, sputtering, electron beam evaporation, vacuum evaporation, CVD, MOCVD, and the like. Further, the arithmetic mean roughness of the surface of the metal layer 13 opposite to the insulating layer is 0.5 to 5 _ 0 μ m to form the desired shape of the -20-200922456 bellows structure. Here, in the case of the modification, when the metal layer 13 is made of a relatively soft metal material such as tin, the outer side surface may not have a bellows structure. Further, although not shown, a release layer and a separation film may be formed on the outer side of the insulating layer 1 1 in this order. Further, an adhesive layer similar to that of the first embodiment may be formed outside the metal layer 13. By attaching the printed wiring board to the printed wiring board via the adhesive layer, the printed wiring board can be bonded to the protective film 20 by heating and pressurizing one side, and after the bonding, it is peeled off together with the release layer. The film is separated, whereby a shielded printed wiring board can be obtained. According to this embodiment, the same effects as those of the first embodiment can be obtained. Further, the effect of preventing corrosion of the metal layer 2 can be obtained by the metal layer 13. Further, when the printed wiring board is attached by a predetermined temperature (for example, 150 to (3) or more by pressure pressing, an intermetallic compound may be formed between the metal layer 12 and the metal layer 13 as a result. When the printed wiring board is attached by pressure pressing at a predetermined temperature or higher, since the strength is increased, it is possible to provide a repeated bending from a large bending radius to a small bending radius (1.0 mm). In the case of sliding, a shielding film for a printed wiring board which is less likely to cause damage of a metal layer. <Third Embodiment> Next, a shielding film for a printed wiring board according to a third embodiment of the present invention will be described. Fig. 3 is a schematic cross-sectional view showing a shield film for a printed wiring board according to a third embodiment of the present invention. -21 - 200922456 The shield film 30 for a printed wiring board shown in Fig. 3 is provided with a metal layer 22 in which one or more scaly metal particles are deposited on a substantially planar surface of the insulating layer 21. The metal layer 22 is formed by stacking a plurality of scaly metal particles as shown in the schematic view of Fig. 4 . The average particle diameter of the scaly metal particles is Ιμιη~ΙΟΟμπι' thickness is 〇·ΐμη!~ but the thickness exceeds 8μηι because the metal layer 22 is too thick 'the film of the desired thickness cannot be obtained', which is less desirable. Further, the material of the flaky metal particles may be nickel, copper, silver, tin, gold, palladium, aluminum, chromium, titanium, zinc, or an alloy containing one or more of these, but may correspond to One or more types of materials are appropriately selected depending on the required electromagnetic wave shielding characteristics and repeated bending and sliding resistance. Further, in the metal layer in which the scaly metal particles are deposited, by the pressurization under heating at a predetermined temperature or higher, a gap portion is formed between the scaly metal particles, and an intermetallic bond is also formed, which can be electrically connected. Layer. Further, the metal layer 22 at this time is adjusted in advance so that when the shielding film containing the metal layer 22 is attached to the printed wiring board by press-pressing at a predetermined temperature (for example, 150 ° C) or more, it can be formed. A thickness such as a thickness of 0.1 μm to 8 μm. Further, although not shown, a release layer and a separation film may be sequentially formed on the outer side of the insulating layer 2 1 . Further, an adhesive layer similar to that of the first embodiment may be formed outside the metal layer 22. By attaching the printed wiring board to the printed wiring board via the adhesive layer, the printed wiring board can be heated by the mask film 30 by a press, and bonded while being pressed, and after the bonding, peeling off together with the release layer. The film is separated, whereby the shielded -22-200922456 printed wiring board can be obtained. At this time, in particular, by heating and pressurizing a part of the adhesive layer formed in the gap portion formed between the scaly metal particles, the strength and flexibility of the metal layer can be improved. According to the present embodiment, when the printed wiring board is attached by pressurization at a predetermined temperature (for example, 150 ° C) or more, a gap portion can be formed between the scaly metal particles. The metal bonds together to form an electrically connected metal layer, and thus can be a more flexible conductive layer. Therefore, when it is used for a printed wiring board as described above, it is possible to provide printing which is less likely to cause breakage of a metal layer from repeated bending and sliding from a large bending radius to a small bending radius (1.0 mm). A shielding film for wiring boards. <Fourth Embodiment> Next, a shielding film for a printed wiring board according to a fourth embodiment of the present invention will be described. Fig. 5 is a schematic cross-sectional view showing a shield film for a printed wiring board according to a fourth embodiment of the present invention. In the shield film 40 for a printed wiring board of the present embodiment, the metal layer 32 (first metal layer) and the metal layer 33 (second metal layer) are provided on the substantially planar surface of the insulating layer 31. The thickness of 32 and 33 is as long as the metal layer 33 is any material of nickel, copper, silver, tin, gold, palladium 'aluminum, chromium, titanium zinc, and any one or more alloys containing the materials, although it is used with metal. The layer 3 2 is formed of a different material, but the metal material and the thickness may be appropriately selected in accordance with the required electromagnetic wave shielding characteristics and repeated bending. In addition, the metal layer -23-200922456 is Ο. ίμιη~8μιη thickness. Further, the metal layers 32 and 33 may be formed by electrolytic plating, electroless plating, sputtering, electron beam evaporation, vacuum deposition, CVD, MOCVD or the like. Further, although not shown, a release layer and a separation film may be sequentially formed on the outer side of the insulating layer 31. Further, an adhesive layer similar to that of the first embodiment may be formed outside the metal layer 32. By attaching the printed wiring board to the printed wiring board via the adhesive layer, the printed wiring board can be bonded to the protective film 40 by heating and pressing, and after the bonding, together with the release layer The separation film is peeled off, whereby a shielded printed wiring board can be obtained. According to this embodiment, the effect of preventing corrosion of the metal layer 32 can be obtained by the metal layer 33. Further, when the printed wiring board is attached by pressurization at a predetermined temperature (for example, 150 ° C) or more, an intermetallic compound may be formed between the metal layer 32 and the metal layer 33 (not shown). Show). As a result, when the printed wiring board is attached by press-pressing at a predetermined temperature or higher, since the strength is increased, it is possible to provide a small bending radius (1 _ 0 mm) from a large bending radius. In the case of repeated bending and sliding, a shielding film for a printed wiring board which is less likely to cause damage of a metal layer. <Fifth Embodiment> Next, a printed wiring board according to a fifth embodiment of the present invention will be described. Fig. 6 is a cross-sectional view showing the steps of a method of manufacturing a printed wiring board according to a fifth embodiment of the present invention. Fig. 7 is a view showing a shield film body for a wiring board of the printing -24-200922456 of the fifth embodiment. Further, the same reference numerals are given to the symbols 41, 42, and 50' in the same manner as the symbols 1, 2, and 10 of the first embodiment. As shown in Fig. 6 (c), the printed wiring board 100 for the printed wiring board and the base film 46 of the printed wiring board according to the first embodiment are connected by the adhesive layer 47. The base film 46 is provided with a base film 43 and a printed circuit 4 4 (signal circuit 4 4 a and ground circuit 4 4 b ) formed on the base film 43 and at least a part (non-insulated portion) 4 An insulating film 45 formed on the printed circuit 44 other than 4 c. Both the base film 43 and the insulating film 45 are made of engineering plastics. For example, a resin such as polypropylene, crosslinked polyethylene, polyester, polybenzimidazole, polyimine, polyamidamine, polyetherimide or polyphenylene sulfide (PPS) may be mentioned. When the heat resistance is not required, it is preferably a polyester film which is inexpensive, and when it is required to be flame retardant, it is preferably a polyphenylene sulfide film, and when heat resistance is required, it is preferably a polyimide film. Here, the bonding of the base film 43 to the printed circuit 44 can be carried out in the same manner as the so-called non-adhesive copper-clad laminate by means of an adhesive or without using an adhesive. Further, the insulating film 45 can be formed by laminating a flexible insulating film with an adhesive or by a series of techniques such as coating, drying, exposure, development, heat treatment, and the like of a photosensitive insulating resin. Further, the base film 46 can be suitably used as a single-sided type printed wiring board having a printed circuit on only one surface of the base film, and a double-sided type printed wiring board having a printed circuit on both surfaces of the base film, and such a printed wiring board is plural Multilayer printed wiring board with laminated layers, -25-200922456 'FLEXBOARD' (registered trademark) having a multi-layer component mounting portion and a cable portion, or a telescopic hard substrate or a tape-type type in which a member constituting the multilayer portion is made rigid It is implemented by a TAB tape for a wafer carrier package (TCP: Tape-Carrier Package), etc. The adhesive layer 47 is a polystyrene type, a vinyl acetate type, a polyester type, a polyethylene type, and a poly" which are adhesive resins. A thermoplastic resin such as acryl, polyamide, rubber or acrylic, or a thermosetting resin such as phenol, epoxy, urethane, melamine or alkyd. It is also possible to use a conductive filler such as a metal or a carbon in the above-mentioned adhesive resin to hold a conductive conductive adhesive. Further, the amount of the conductive filler can be reduced. When the heat resistance is not particularly required, it is preferable that the polyester-based thermoplastic resin which is not subject to storage conditions is required to have heat resistance or better flexibility. An epoxy-based thermosetting resin having high reliability after the formation of the shield layer. In either case, it is preferable that the bleeding (resin flow) at the time of hot pressing is small. The conductive filler can be used for carbon, Silver, copper, nickel, solder, solder and copper powder are coated with silver-plated silver-coated copper ruthenium, and metal-plated ruthenium or a mixture of such ruthenium is applied to resin balls or glass beads. Because of the high price of silver, the reliability of copper due to heat resistance, the reliability of aluminum under moisture resistance, and the difficulty in obtaining sufficient conductivity of solder, it is desirable to use silver-coated copper enamel which is relatively inexpensive and has good electrical conductivity and high reliability. Filling or nickel. The blending ratio of the conductive filler to the adhesive resin is also affected by the shape of the entangled material, etc., but when the silver is covered with the copper ruthenium, 100 parts by weight of the adhesive resin is used. More preferably, it is 10 to 400 parts by weight, more reasonable It is 20 to 150 parts by weight. When it exceeds 400 parts by weight, the adhesion to the ground -26-200922456 circuit (copper foil) 4 4 b is lowered, and the flexibility such as the printed wiring board 100 is deteriorated. In addition, when the amount is less than 1 part by weight, the conductivity is remarkably lowered. Further, in the case of the nickel-filled material, it is more preferably 40 to 400 parts by weight based on 100 parts by weight of the adhesive resin. 100 to 3 parts by weight. When the amount exceeds 400 parts by weight, the adhesion to the grounding circuit (the adhesion of the copper foil 44b is lowered, and the flexibility of the printed wiring board 100 is deteriorated, and if it is less than 40 parts by weight, The conductivity is remarkably lowered. The shape of the conductive filler such as a metal filler may be one of a spherical shape, a needle shape, a fiber shape, a sheet shape, and a resin shape. Next, the thickness of the agent layer 47 is as described above, and when the conductive inclusions of the metal ruthenium are mixed, only a portion of the chelates is thickened to a degree of 20 ± 5 μm. Further, when the conductive entangled material is not mixed, 'is 1, ΙΟμιη. Therefore, the entire thickness of the shield layer (the metal layer 42 and the adhesive layer 47) can be made thin, and the printed wiring board 100 can be thin. Next, a shielding film body to be used for the production of the printed wiring board according to the fifth embodiment of the present invention will be described with reference to Fig. 7 . The shield thin body of Fig. 7 has a shield thin film 5 for a printed wiring board similar to that of the first embodiment, and an insulating layer (opposite to the metal layer 4 2) which is sequentially formed on the shield film 50 for a printed wiring board. The surface of the release layer 48b, the separation thin 4 8a, and the surface of the metal layer 42 (on the side opposite to the insulating layer 4 1) are the above-mentioned adhesive layer 47. Further, when the adhesive layer 47 is a conductive adhesive layer, a shield layer is formed together with the metal layer 42. In the separation film 48a, an engineering plastic similar to that of the base film 43, the insulating film, and the insulating layer 41 is used. However, since the film is formed by the filming process, the coating film 4 1 is formed into a thin film 48. Except for -27-200922456, it is ideal for cheap polyester film. The release layer 4 8 b is not particularly limited as long as it has releasability to the insulating layer 4 1 , and for example, a coated P ET film or the like can be used. Next, a method of manufacturing a printed wiring board according to a fifth embodiment of the present invention will be described. First, the shield film body of Fig. 7 described above is placed on the base film 46, and pressed by a press 49 (49a, 49b) while being heated. A portion of the adhesive layer 47 which is softened by heating flows into the insulation removing portion 4 5 a by pressurization as shown by an arrow (refer to Fig. 6 (a)). After the portion of the adhesive layer 47 is sufficiently adhered to the non-insulating portion 44c of the grounding circuit 44b and the insulating film 45, the formed printed wiring board 10 is taken out from the press 49, and the printed wiring board is shielded. When the separation film 48a of the film 50 is peeled off from the release layer 48b (see Fig. 6 (b)), the printed wiring board 100 (see Fig. 6 (c)) can be obtained. According to the present embodiment, the effect of the shielding film for a printed wiring board of the first embodiment can be exhibited. In particular, it is possible to provide a printed wiring board 100 which is physically protected even without repeated bending and sliding from a large bending radius to a small bending radius (1·0 mm). <Sixth Embodiment> Next, a printed wiring board according to a sixth embodiment of the present invention will be described. Fig. 8 is a schematic cross-sectional view showing a printed wiring board according to a sixth embodiment of the present invention. In addition, the same reference numerals as in the symbols 1 1 and 1 2 ' 1 3 and 2 0 of the second embodiment are given to the symbols 5 1 and 5 2 ' 5 3 and 5 0, and the description thereof is omitted -28-200922456. . Further, the same portions as those of the symbols 43 to 47 of the fifth embodiment are denoted by reference numerals 5 to 5, respectively, and the description thereof will be omitted. The printed wiring board 1 〇 1 of the present embodiment is different from the fifth embodiment in that the printed wiring board shielding film 60 is replaced with the shielding film 50 of the second embodiment. Further, the printed wiring board 1 〇 1 can be manufactured by the same manufacturing method as that of the fifth embodiment. According to the present embodiment, the same effects as those of the printed wiring board of the fifth embodiment can be obtained. In the modified example, the printed wiring board for the printed wiring board of the third or fourth embodiment can be used in place of the shielding film 60 for the printed wiring board. <Seventh Embodiment> Next, a printed wiring board according to a seventh embodiment of the present invention will be described. Fig. 9 is a schematic cross-sectional view showing a printed wiring board according to a seventh embodiment of the present invention. Further, the same reference numerals are given to the symbols 61a, 62a, 70a (61b, 62b, 70b)' in the same manner as the symbols 2 1 , 2 2, and 3 0 of the third embodiment, and the description thereof will be omitted. In addition, the same reference numerals are given to the same portions as those of the symbols 44 to 47 in the fifth embodiment, and the description thereof will be omitted. The printed wiring board 102 of the present embodiment is attached to the base film by the shielding films 7 0 a and 7 〇 b of the printed wiring board similar to the third embodiment via the adhesive layers 6 7 and 6 8 . (2) The insulating removal portion 65a and the insulating removal portion 63a are provided on the side of the insulating film 65 and the base film 63 on the ground circuit 6 4 b, and the upper and lower surfaces of the ground circuit 64b are not insulated. In the portion 6 4 c, the point at which each of the adhesive layers 6 7 and 6 8 and the grounding circuit 6 4 b will be -29-200922456 is different from the fifth embodiment. Further, the same material as the adhesive layer 67 is used in the adhesive layer 68. Further, the printed wiring board 102 can be manufactured by the same manufacturing method as that of the fifth embodiment. According to the present embodiment, it is possible to provide a printed wiring board 102 which can exhibit the same effects as those of the printed wiring board according to the fifth embodiment on both surfaces of the base film 66. In addition, in the case of the modified example, the shielding film for a printed wiring board according to the first, second, or fourth embodiment can be attached in the same manner as the present embodiment instead of the shielding film 70a, 70b' for the printed wiring board. Printed wiring board. Further, the shielding films for printed wiring boards of the first to fourth embodiments can be used in combination as appropriate. <Eighth Embodiment> Next, a printed wiring board according to an eighth embodiment of the present invention will be described. Fig. 1 is a schematic cross-sectional view showing a printed wiring board according to an eighth embodiment of the present invention. Further, the same reference numerals are given to the symbols 71a, 72a, 73a, 80a (71b, 72b, 73b, 80b) in the same manner as the symbols 3 1 , 3 2, 3 3, and 4 0 of the fourth embodiment. Description. In the same manner as the symbols 45 to 47 of the fifth embodiment, the symbols 76 to 78 are sequentially assigned, and the description thereof will be omitted. The printed wiring board 1 〇 3 of the present embodiment is (1) the printed wiring board shielding films 80a and 80b which are the same as those of the fourth embodiment are attached to the base film 77 via the adhesive layers 798 and 7.9, respectively. The two sides of the ground, (2) the insulating film 76 and the base film 74 on the upper and lower sides of the grounding circuit 75b are provided with insulation except for the -30-200922456 portion 7 6 a and the insulation removing portion 74 a, and are provided at the grounding circuit 7 5 b Is there an insulating removal portion 76a and an insulation removing portion? The through hole 75d that communicates with 4a is different from the fifth embodiment in that the adhesive layer 78'79 is in contact with the position 78a in the through hole 75d. Further, the same material as the subsequent agent layer 78 is used in the adhesive layer 7.9. Further, the printed wiring board 1 〇 3 can be manufactured by the same manufacturing method as that of the fifth embodiment. According to the present embodiment, the printed wiring board 103 which can exhibit the same effect as the printed wiring board of the fifth embodiment on both surfaces of the base film 77 can be provided. In addition, in the modified example, the shielding film for a printed wiring board of the i, second, or fourth embodiment can be attached in the same manner as the present embodiment instead of the shielding film 70a, 70b' for the printed wiring board. Printed wiring board. Further, the shielding films for printed wiring boards of the first to fourth embodiments can be used in combination as appropriate. <Ninth Embodiment> Next, a printed wiring board according to a ninth embodiment of the present invention will be described. Fig. 11 is a schematic cross-sectional view showing a printed wiring board according to an eighth embodiment of the present invention. Incidentally, the same portions as those of the symbols 1, 2, and 10 of the first embodiment are sequentially assigned symbols 8 1 , 8 2, and 90, and the description thereof may be omitted. Further, the same portions as those of the symbols 43 to 47 of the fifth embodiment are sequentially assigned symbols 8 3 to 8 7 , and the description thereof will be omitted. In the printed wiring board 1 〇4 of the present embodiment, the printed wiring board shielding film 90 is coated on one surface of the base film 168 via the adhesive layer 87, and a rectangular grounding member 93 is provided at the end of -31 - 200922456. . The grounding member 913 is provided with an adhesive resin layer 92 on the surface of the rectangular metal foil 91 having a width W. The width W of the grounding member 93 is larger, and the grounding impedance is smaller, which is preferable, but it is preferably selected from the viewpoint of operability and economy. In this case, the width W1 is exposed in the width W, and the width W2 is followed by the adhesive layer 87. As long as the exposed portion of the width W1 is connected to the nearby ground portion by a suitable conductive member, it can be surely grounded. Further, if it is subsequently carried out reliably, the width W2 can be further reduced. Further, the length of the grounding member 93 is, for example, easy to process, and is uniform with the width of the shielding film 90 or the base film 86, but is also shorter or longer as long as it is connected to the conductive adhesive layer 92. The part can be exposed and connected to the nearby grounding. Similarly, the shape of the grounding member 93 is not limited to a rectangular shape as long as a part thereof is connected to the adhesive layer 807, and other portions can be connected to the shape of the nearby ground portion. Further, the arrangement position is not necessarily limited to the end portion of the printed wiring board 1 〇 4, and may be a position 93a other than the end portion as shown by the imaginary line in Fig. 1 1 (a). However, in this case, in order to be connectable to a nearby land portion, the grounding member 913a is formed to protrude from the side of the shielding film 90 to be exposed. The extension lengths L1, L2 to the both sides are as long as they can be connected to the length of the ground portion in the vicinity of the casing or the like of the machine, and the extension portion may have only one end. The surface of the metal layer 8 2 is connected to the ground portion by screwing or soldering. The material of the metal foil 91 of the grounding member 913 is preferably a copper foil based on the conductivity, the flexibility, the economy, and the like, but is not limited thereto. Further, a conductive resin may be used instead of the metal foil. However, a point "based on conductivity" is preferably a metal foil. Further, the adhesive resin layer 92 is preferably a thermoplastic resin such as polystyrene, vinyl acetate, polyester, polyethylene, polypropylene, polyamide, rubber or acrylic. Or a thermosetting resin such as a phenol type, an epoxy type, a urethane type, a melamine type, a polyimide type, or an alkyd type, and a metal foil, an adhesive resin layer or a base film constituting the grounding member 93 The insulating film 8 of 8 6 is excellent in adhesion. Further, the grounding member 913 is provided with a shield layer (which is the metal layer 8.2, but also includes the adhesive layer 8 7 when the adhesive layer 787 is a conductive adhesive layer). When covering, it may be formed only by metal foil or metal wire. As described above, the shielding layer of the shielding film 90 (which is the metal layer 82, but also includes the adhesive layer 8 when the adhesive layer 87 is a conductive adhesive layer) is grounded by the grounding member 93, so It is not necessary to provide a wide grounding wire as part of the printed circuit, which can increase the wiring density of the signal line. Further, since the grounding impedance of the grounding member 93 is relatively smaller than the grounding impedance of the grounding wire of the conventional printed wiring board, the electromagnetic shielding effect of the shield layer is also increased. Further, in the same manner as in the prior art, a wide grounding wire is provided in the printed wiring board to which the shielding layer (which is the metal layer 8 2 but also the adhesive layer 8 when the adhesive layer 87 is a conductive adhesive layer) is connected. The provision of the grounding member is of course included in the present invention. In this case, the electromagnetic wave shielding effect is better and more stable because of the grounding of the substrate of the wide grounding wire and the addition of the grounding of the frame of the -33-200922456 grounding member. The front end portion of the base film 86 is exposed only in the width t1, and the printed circuit 84 is exposed. Further, in this example, the grounding member 93 can be connected from the end portion of the insulating film 85 by a width t2 so that one end in the width direction thereof can secure the insulation resistance with the signal line by the width t2. Further, the grounding member may have various forms in addition to the configuration shown in Fig. 11. For example, the grounding member may be a metal foil composed of copper, silver, aluminum, or the like, and a plurality of conductive bumps protruding from one side of the metal foil may penetrate the cover film to be connected to the shielding layer, and the exposed metal foil may be A form of connection to a grounding portion in the vicinity thereof. Further, the grounding member may be a metal plate formed of a plurality of protrusions formed on one surface and made of copper, silver, aluminum, or the like, and the protrusion may penetrate the cover film to be connected to the shield layer, and the exposed metal plate may be connected to The form of the grounding portion in the vicinity. Moreover, the grounding member may be a metal foil made of copper, silver, aluminum, or the like, and a plurality of metal burrs protruding from one side of the metal foil may penetrate the cover film to be connected to the adhesive layer of the shielding layer and the metal. The layer, the exposed metal foil will be connected to the grounding portion in its vicinity. Further, the cover film may be removed by excimer laser irradiation, whereby a window portion may be formed at a predetermined position of the shielding film, and the grounding member of the conductor may be connected to the window portion via a conductive adhesive that mixes the conductive dopant. The form of one end. The other end of the grounding member is connected to a ground portion located nearby. Or, the grounding part located nearby may be directly connected to the window of -34-200922456 without passing through the grounding member. In addition, in the case of the modified example, the printed wiring board which is attached to the shield film of the printed wiring board of the second to fourth embodiments in the same manner as in the embodiment can be used instead of the shield film 90 for the printed wiring board. . [Examples] (Example 1) First, a shielding film for a printed wiring board which is formed in the same manner as the shielding film 10 for a printed wiring board shown in Fig. 1 was produced. (For details of the metal layer, refer to Example 1 of Table 1 below) . Fig. 13 (a) is a photograph showing the S EV of the shielding film for a printed wiring board produced at this time. Further, Fig. 13 (b) is a schematic view showing the photographing direction of the SEM photograph of Fig. 13 (a). After a shielding film for a printed wiring board having a metal layer having such a bellows structure is produced, the shielding film for a printed wiring board is bonded to a printed wiring board by a press and heated by a press, and a shield is produced. Printed wiring board (width 1 〇 mm, length 1 70 mm). Here, the insulating layer of the shielding film for a printed wiring board of the present embodiment is a polyimide layer having a thickness of 12.5. The subsequent layer was an epoxy resin having a thickness of 17 μm. The printed wiring board thus produced was used as the sample of Example 1. (Example 2) Next, a shielding film for a printed wiring board which is formed in the same manner as the shielding film 1 for a printed wiring board shown in Fig. 1 was produced. (For details of the metal layer, refer to Example 2 of Table 1 below). Then, the film of the printed wiring board was shielded by a thinner-35-200922456 film, and the film was bonded to the printed wiring board by a pressure on the press side to form a shielded printed wiring board (width 1 〇 mm, length 1 7). 0 mm ). Further, the insulating layer and the adhesive were used in the same manner as in the first embodiment. The printed wiring board thus produced was used as the sample of Example 2. (Example 3) Next, a shielding film for a printed wiring board which is formed in the same manner as the shielding film 10 for a printed wiring board shown in Fig. 1 was produced (see the third embodiment of Table 1 below for details of the metal layer). Then, the printed wiring board was bonded to the printed wiring board by a press machine while being heated and pressurized by a press, and a shielded printed wiring board (width 1 Omm, length 170 mm) was produced. Further, the insulating layer and the adhesive were used in the same manner as in the first embodiment. The printed wiring board thus produced was used as the sample of Example 3. (Comparative Example 1) A conductive film for a printed wiring board having a silver thin film layer of one layer having a thickness of 0.1 μπα was produced instead of the metal layer of the two layers of Example 1. Then, the printed wiring board shielding film was bonded to the printed wiring board while being heated and pressurized by a press, and a shielded printed wiring board (width 10 m, length 170 mm) was produced. Further, the insulating layer and the adhesive were used in the same manner as in the first embodiment. The printed wiring board thus produced was used as a sample of Comparative Example 1. (Comparative Example 2) -36-200922456 In place of the metal layer of the two layers of Example 1, a shielding film for a printed wiring board having a silver paste layer of one layer having a thickness of 20 μm was formed. Then, the printed wiring board shielding film was bonded to the printed wiring board while being heated and pressurized by a press using an adhesive to form a shielded printed wiring board (width: 10 mm, length: 170 mm). Further, the insulating layer and the adhesive were the same as in the first embodiment. The printed wiring board thus produced was used as a sample of Comparative Example 2. [Bending resistance test] According to the IPC standard, as shown in FIG. 12, a shielded printed wiring board 1 1 1 was formed between the fixed plate 12 1 and the slide plate 1 22 (for the above-described first embodiment and comparative examples 1 and 2) Any one of the samples was bent in a U-shape with a curvature of 1. 〇mm, and in the test environment at 23 ° C, it was verified that the sliding plate 1 22 was at a stroke of 30 mm, and the sliding speed was 1 The resistance of the metal layer of the shielding film for a printed wiring board (maintaining electromagnetic shielding property) when sliding up and down under the condition of 00 beats/min, and whether or not the printed wiring board can be protected. Further, in the printed circuit of each of the printed wiring boards of the samples of the first embodiment and the first and second comparative examples, the number of lines used was six, the line width was 0.12 mm, and the space width was 0.1 mm. Further, the resistance of the metal layer of the shielding film for a printed wiring board (maintaining the electromagnetic shielding property) and whether or not the printed wiring board can be protected is verified by measuring the amount of energization of the metal layer or the printed circuit of each sample. The verification results are shown in Table 1 below. -37- 200922456 [一谳] 1 P Η m ή ip ®In 塘 m Continued m 璨 q Mm Raspberry 赃 &g 〇脉 S κ承85,200 73,000 94,200 m课 m Form infinite number of times >1,000,000 > 1,000,000 >1,000,000 forms more than 100 Ω | >1,000,000] >1,000,000 I 108,100 The number of times 10 Ω or more is formed 871,100 101,000 1,100 Ten-point average height Rz (" m) | 10.92) I 9.87] Maximum height Ry (" m) | 12.92] | 12.89] Arithmetic mean roughness Ra (" m) | 0.738| | 0.573| | 0.536丨 Metal film layer type 2nd metal layer 1 Thickness (μπι)| CM 〇Csi 〇Material Sao 1 Metal layer thickness (Am) 〇CNJ | 0.01 Material mm Example 1 1 Example 2 | Example 3 86,300 31,800 5,700 馨6.04 11.51 0.235 Deer 5 Comparative Example 1 26,900 64,800 62,100 6,400 1 1 1 璀 Silver paste Comparative Example 2 - 38 - 200922456 It can be seen from Table 1 that the samples of Examples 1 to 3 have resistance to the metal layer and protect the printed wiring board. In contrast, it can be seen from Comparative Example 1 that the printed wiring board can be protected, but the silver thin film layer is protected. The electromagnetic shielding property could not be maintained (the amount of energization was reduced). Further, it can be seen from Comparative Example 2 that the electromagnetic shielding property of the silver paste layer can be maintained, but the printed wiring board (broken wire) cannot be protected. The design change is not limited to the above embodiment or the embodiment. For example, in the above embodiment, the metal layer may be two layers, but the metal layer may be three or more layers. In the metal layer of the above embodiment, a porous body having a plurality of pores or voids may be used. In the case of a porous metal layer having a plurality of pores, the diameter of the pores is Ο.ίμηι~ΙΟμιη, which has a plurality of voids. In the case of the porous metal layer, the size of the voids is Ο.ΐμπι to ΙΟμιη, and the void ratio is 1 to 50%. Further, when the void ratio is less than 1%, it is almost impossible to have an effect described later, and if it exceeds 50%, it is conductive. In addition, the metal layer at this time is attached to the printed wiring board by press-pressing the shielding film containing the metal layer at a predetermined temperature (for example, 150 ° C) or higher. When it is adjusted in advance to a thickness such as the thickness of Ο.ίμηι~8μπι. Further, the use of the plurality of metal layers is also in the metal layer at a predetermined temperature (for example, 15 (TC) or more by pressure pressing and attaching to a printed wiring board when used. An intermetallic compound is formed between the 1 2 and the metal layer 13. 3. When the printed wiring board is pressed and pressed for attachment, a part of the conductive adhesive layer is filled in the hole of the metal layer. The gap can increase the strength and flexibility of the metal layer. Therefore, a -39-200922456 can be provided for repeated bending and sliding from a large bending radius to a small bending radius (1. 〇mm). A shield film for a printed wiring board and a printed wiring board to which the film is attached, which is less likely to cause damage to the metal layer, and a printed wiring such as each layer of each embodiment of the shield film for a printed wiring board may be appropriately combined. In the shielding film for a printed wiring board of the embodiment, the metal film is provided on only one side of the insulating layer, but it may be provided on both surfaces of the insulating layer. The shielding film for a printed wiring board can be used for FPC, COF (Chip on Flex), RF (Flexible Printed Board), multilayer flexible substrate, hard substrate, etc., but is not limited thereto. 1 is a schematic cross-sectional view of a shielding film for a printed wiring board according to a first embodiment of the present invention. FIG. 2 is a schematic cross-sectional view showing a shielding film for a printed wiring board according to a second embodiment of the present invention. Fig. 3 is a schematic cross-sectional view showing a shielding film for a printed wiring board according to a third embodiment of the present invention. Fig. 4 is a schematic view showing a scaly metal particle group of a metal layer forming a shielding film for a printed wiring board shown in Fig. 3. Fig. 5 is a schematic cross-sectional view showing a shielding film for a printed wiring board according to a fourth embodiment of the present invention. Fig. 6 is a view showing a process mode of a method for manufacturing a printed wiring board 4〇-200922456 according to a fifth embodiment of the present invention. Fig. 7 is a schematic view of a printed wiring board for a printed wiring board according to a fifth embodiment of the present invention. Fig. 8 is a schematic cross-sectional view of a printed wiring board according to a sixth embodiment of the present invention. Fig. 9 is a seventh embodiment of the present invention. Fig. 10 is a schematic cross-sectional view of a printed wiring board according to a ninth embodiment of the present invention. Fig. 1 is a schematic cross-sectional view showing a printed wiring board according to a ninth embodiment of the present invention. Fig. 1 is a view showing a test method of the bending resistance test. Fig. 1 (a) is a SE Μ photograph showing a shielding film for a printed wiring board according to Example 1 of the present invention, and (b) is a view showing (a). Schematic diagram of the photographing direction of the SE photograph. [Main component symbol description] 1 Μ 21 31, 41, 61a, 71a, 71b, 81: Insulation 2, 12, 13, 22, 32, 33, 42, 62a, 62b , 82: metal layers 10, 20, 30, 4, 50, 6〇, 7〇a, 7〇b, 8〇a, 8〇b, 90: shielding films for printed wiring boards 43, 63, 74: base Film 4 4, 8 4 : Printed circuit 44a : Signal circuit - 41 - 200922456 44b ' 64b, 75b: Ground circuit 4 4 c, 6 4 c : Non-insulating portion 4 5, 6 5, 7 6 , 8 5 : Insulating film 45a, 63a, 65a, 74a, 76a: insulation removing portions 46, 66, 77, 86: base film 47, 67, 68, 78, 79, 87: adhesive layer 48a: minute Film 48b: release layer 4 9 : press 7 5 d : through hole 9 1 : metal foil 92 : adhesive resin layer 9 3 , 9 3 a : grounding members 78a, 93a: positions 100, 101, 102, 103, 104, 111: printed wiring board 1 2 1 : fixed plate 122: sliding plate - 42-