JPWO2020203109A1 - - Google Patents

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Publication number
JPWO2020203109A1
JPWO2020203109A1 JP2020538160A JP2020538160A JPWO2020203109A1 JP WO2020203109 A1 JPWO2020203109 A1 JP WO2020203109A1 JP 2020538160 A JP2020538160 A JP 2020538160A JP 2020538160 A JP2020538160 A JP 2020538160A JP WO2020203109 A1 JPWO2020203109 A1 JP WO2020203109A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2020538160A
Other languages
Japanese (ja)
Other versions
JP7543139B2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2020203109A1 publication Critical patent/JPWO2020203109A1/ja
Application granted granted Critical
Publication of JP7543139B2 publication Critical patent/JP7543139B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C23C14/20—Metallic material, boron or silicon on organic substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02—Pretreatment of the material to be coated
    • C23C14/024—Deposition of sublayers, e.g. to promote adhesion of the coating
    • C23C14/025—Metallic sublayers
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02—Pretreatment of the material to be coated
    • C23C14/027—Graded interfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Laminated Bodies (AREA)
JP2020538160A 2019-03-29 2020-03-11 Metallized film and method of manufacturing same Active JP7543139B2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019066489 2019-03-29
JP2019066489 2019-03-29
PCT/JP2020/010456 WO2020203109A1 (en) 2019-03-29 2020-03-11 Metallized film and manufacturing method therefor

Publications (2)

Publication Number Publication Date
JPWO2020203109A1 true JPWO2020203109A1 (en) 2020-10-08
JP7543139B2 JP7543139B2 (en) 2024-09-02

Family

ID=72668633

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020538160A Active JP7543139B2 (en) 2019-03-29 2020-03-11 Metallized film and method of manufacturing same

Country Status (5)

Country Link
JP (1) JP7543139B2 (en)
KR (1) KR20210149689A (en)
CN (1) CN113631370B (en)
TW (1) TWI840540B (en)
WO (1) WO2020203109A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023228602A1 (en) * 2022-05-27 2023-11-30 東レＫｐフィルム株式会社 Metal foil with release film and method for manufacturing same, and method for manufacturing electromagnetic shielding film

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58130153A (en) 1982-01-29 1983-08-03 太平洋セメント株式会社 Filler for coating and mending small dents on alc plate
EP1332238B1 (en) * 2000-10-09 2009-04-22 Hueck Folien Gesellschaft m.b.H. Metallized film, method for the production thereof, and its use
JP5510498B2 (en) * 2005-11-08 2014-06-04 日立化成株式会社 Metal foil with adhesive layer, metal-clad laminate, and printed wiring board and multilayer wiring board obtained using this metal-clad laminate
JP5057067B2 (en) * 2006-01-13 2012-10-24 東レＫｐフィルム株式会社 Film for metallized capacitor and capacitor using the same
JP2007243122A (en) 2006-03-06 2007-09-20 Be-Spputer Co Ltd Film forming method of shield film by sputtering and formed shield film
JP2008109022A (en) * 2006-10-27 2008-05-08 Fujifilm Corp Light-transmitting conductive electromagnetic wave shield film and method for manufacturing the same
JP4974803B2 (en) 2007-08-03 2012-07-11 タツタ電線株式会社 Shield film for printed wiring board and printed wiring board
JP6225437B2 (en) * 2012-08-16 2017-11-08 住友ベークライト株式会社 Electromagnetic wave shielding film and method for coating electronic component
KR102302011B1 (en) * 2013-05-29 2021-09-13 타츠타 전선 주식회사 Manufacturing method for electromagnetic wave shielding film
KR101375237B1 (en) * 2013-09-13 2014-03-18 신창핫멜트 주식회사 The fabrication method of thin electromagnetic shield film and electromagnetic shield film thereby
JP6650660B2 (en) * 2014-01-20 2020-02-19 東洋インキＳｃホールディングス株式会社 Electromagnetic wave shielding sheet for flexible printed wiring board and flexible printed wiring board with electromagnetic wave shielding sheet
JP6446823B2 (en) * 2014-04-25 2019-01-09 宇部興産株式会社 Method for manufacturing electromagnetic shielding member
CN107405880B (en) * 2015-03-27 2020-06-30 琳得科株式会社 Film for laminating transparent conductive layer, method for producing same, and transparent conductive film
JP6671051B2 (en) * 2015-08-18 2020-03-25 東レＫｐフィルム株式会社 Metallized film and method for producing metallized film
KR20180053677A (en) * 2015-09-14 2018-05-23 다츠다 덴센 가부시키가이샤 Manufacturing method of shielded printed wiring board
KR102608700B1 (en) * 2015-12-25 2023-11-30 타츠타 전선 주식회사 Electromagnetic wave shielding film and its manufacturing method
JP2017147276A (en) * 2016-02-15 2017-08-24 東洋インキＳｃホールディングス株式会社 Electromagnetic wave shield sheet, electromagnetic wave shield wiring circuit board and electronic apparatus
JP6706654B2 (en) * 2018-10-01 2020-06-10 信越ポリマー株式会社 Electromagnetic wave shield film, flexible printed wiring board with electromagnetic wave shield film, and methods for manufacturing the same

Also Published As

Publication number Publication date
TW202044977A (en) 2020-12-01
TWI840540B (en) 2024-05-01
KR20210149689A (en) 2021-12-09
CN113631370B (en) 2023-06-09
WO2020203109A1 (en) 2020-10-08
CN113631370A (en) 2021-11-09
JP7543139B2 (en) 2024-09-02

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