CN105101761A - High-transmission thin electromagnetic interference shielding film, and manufacturing method and applications thereof - Google Patents
High-transmission thin electromagnetic interference shielding film, and manufacturing method and applications thereof Download PDFInfo
- Publication number
- CN105101761A CN105101761A CN201410185382.XA CN201410185382A CN105101761A CN 105101761 A CN105101761 A CN 105101761A CN 201410185382 A CN201410185382 A CN 201410185382A CN 105101761 A CN105101761 A CN 105101761A
- Authority
- CN
- China
- Prior art keywords
- layer
- transmission
- metal screen
- adhesive layer
- shielding film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The invention discloses a high-transmission thin electromagnetic interference shielding film, and a manufacturing method and applications thereof. The high-transmission thin electromagnetic interference shielding film includes a metal shielding layer and an adhesive layer; the metal shielding layer is provided with two opposite surfaces which are respectively a first surface and a second surface; the adhesive layer is arranged at the second surface of the metal shielding layer; the second surface of the metal shielding layer is a rough surface of which the average surface roughness (Rz) is in a range of 0.5 to 12 microns; the thickness of the metal shielding layer is in a range of 1 to 35 microns; and the thickness of the adhesive layer is in a range of 1 to 16 microns. According to the high-transmission thin electromagnetic interference shielding film, the adhesive layer becomes thinner in hot pressing, and the metal shielding layer can pierce the adhesive layer by means of the surface roughness, so that the metal shielding layer and a grounding wire on a circuit board can form a conduction circuit, and therefore, the grounding impedance value of the circuit board can be decreased, and electromagnetic wave interference can be reduced. The high-transmission thin electromagnetic interference shielding film has the advantages of small transmission loss, high transmission quality, excellent shielding effect, high flexibility, favorable electrical properties, excellent chemical resistance, excellent softness, high shielding performance and the like.
Description
Technical field
The present invention relates to the emi shielding film that a kind of adhesive layer is covered without the slimming of conducting particles, high-transmission, height, particularly a kind of slim have excellent chemical resistance, electrical characteristic, for the high-transmission thin electromagnetic interference shielding film of the printed circuit board (PCB) of high flexible.
Background technology
Under electronics and the multi-functional complicated market demand of communication product trend, the structure dress of circuit substrate needs lighter, thin, short, little; And functionally, then need the transmission of powerful and high-speed signal.Therefore, line density certainly will improve, distance to each other between support plate circuit is more and more nearer, and operating frequency is broadband towards height, if add configuration, unreasonable lower electromagnetic interference (ElectromagneticInterference, the EMI) situation that connects up is more and more serious, therefore must effectively manage electromagnetic compatibility (ElectromagneticCompatibility, EMC), thus maintain electronic product normal signal transmission and improve reliability.Frivolous and the characteristic that can arbitrarily bend, makes soft board occupy very important status in the development moving towards demand portable information and communication electronic industry.
Because telecommunications product more attains little trend, order about soft board and must carry more strong large function, on the other hand because portable electronic product moves towards microminiature, also the high demand of high density soft board technology is and then driven, functionally then require powerful and under the situation of high frequency, high density, graph thinning, be proposed the screen for film-type flexible printed wiring board (FPC) in the market, be widely adopted in the small-sized electronic products such as mobile phone, numerical digit camera, digit camera.
In view of this, a kind of material of shield electromagnetic interference of novelty is urgently developed.
Summary of the invention
In order to solve the problem, the invention provides a kind of high-transmission slimming emi shielding film and manufacture method thereof and application, this high-transmission slimming emi shielding film utilizes metal screen layer surface roughness to puncture adhesive layer and printed circuit board ground cabling to carry out conducting and realize electro-magnetic screen function, have the advantages such as transmission loss is little, transmission quality is high, shielding is good, good flexibility, electrical characteristic are good, chemical resistance is good, flexibility is good, height covers.
The present invention in order to the technical scheme solving its technical problem and adopt is:
The invention provides a kind of high-transmission slimming emi shielding film, comprise metal screen layer and adhesive layer, described metal screen layer has two relative surfaces and is respectively first surface and second surface, described adhesive layer is positioned on the second surface of described metal screen layer, the second surface of described metal screen layer is rough surface and average surface roughness (Rz) is 0.5-12 micron, the thickness of described metal screen layer is 1-35 micron, the thickness of described adhesive layer is 1-16 micron, and not containing conducting particles in adhesive layer.
In a preferred embodiment of the present invention, above-mentioned high-transmission slimming emi shielding film is also provided with the first release film, ink layer and the second release film, described ink layer is formed on the first surface of described metal screen layer, and described ink layer is folded between described first release film and described metal screen layer, described adhesive layer is folded between described metal screen layer and described second release film, the structure finally remaining in circuit board surface is by described ink layer, metal screen layer and adhesive layer be superimposed formation successively, described ink layer, the gross thickness of metal screen layer and adhesive layer is 5-50 micron, the thickness of described ink layer is 1-7 micron.
Say further, the dielectric constant of described adhesive layer is 2.0-3.5.
Say further, the dielectric loss factor of described adhesive layer is 0.001-0.010.
Say further, described metal screen layer is through anti-oxidant resistance to heat treated metal screen layer.
Say further, described metal screen layer is Copper Foil, aluminium foil, goldleaf or silver foil.
Say further, described first release film and the second release film mould the one in release film, PET silicate-containing oil release film, the sub-light release film of PET and PE release film for PET fluorine separately, and thickness is 25 to 100 microns separately.
Say further, described ink layer is the resin bed containing coloured female additive, and the resin material of described ink layer is epoxy resin, acrylic resin, amido formate system resin, silicon rubber system resin, poly-at least one in ring diformazan benzene series resin, bismaleimides system resin and polyimide resin, the look female additive of described ink layer comprises at least one in material with carbon element, titanium dioxide, pigment, dyestuff and toner.
Present invention also offers a kind of printed circuit board (PCB) with above-mentioned high-transmission slimming emi shielding film, described high-transmission slimming emi shielding film adheres to printed circuit board surface by described adhesive layer, and the second surface of described metal screen layer utilizes its surface roughness to pierce through described adhesive layer and walks linear contact lay conducting with the ground connection of printed circuit board (PCB).
The manufacture method of above-mentioned high-transmission slimming emi shielding film:
Step one: dope layer of ink on described first release film, by selecting the first release film of different surface roughness to make the reflective degree of ink layer surface different, reaches different glossiness;
Step 2: hot pressing is fitted described metal screen layer on described ink layer;
Step 3: get described second release film, described second release film is coated with described adhesive layer;
Step 4: the semi-finished product that step 2 and step 3 obtain are pressed into described high-transmission slimming emi shielding film.
The invention has the beneficial effects as follows: high-transmission slimming emi shielding film of the present invention is dope layer of ink on the first release film, hot pressing laminating metal screen layer on ink layer, second release film is coated with adhesive layer, again by metal screen layer and adhesive layer to pressure, this high-transmission slimming emi shielding film has ultrathin type, flexibility is good, color masking, chemical resistance is good, electrical characteristic is good, good flexibility, transmission quality height and speed advantages of higher, be better than traditional PI diaphragm (the thin PI of thin glue), photosensitive type PI (or acryl system) diaphragm, non-photo-sensing type PI diaphragm (photoresistance need be gone up) and general screened film, be applicable to mobile phone, panel computers etc. contain a lot of antenna (bluetooth, Wi-Fi, cellular communication and GPS etc.) the application of handheld device, interference-free between making it in very little space mutually, thus replace general barrier film material.
Accompanying drawing explanation
Fig. 1 is the structural representation of high-transmission slimming emi shielding film of the present invention;
Fig. 2 is the structural representation of the high-transmission slimming emi shielding film of the embodiment of the present invention;
Fig. 3 is that metal screen layer of the present invention utilizes its surface roughness to pierce through described adhesive layer and forms turning circuit schematic diagram with the ground connection cabling of printed circuit board (PCB);
Fig. 4 is the printed circuit board arrangement schematic diagram with screened film of the present invention.
Embodiment
Below by way of specific instantiation, the specific embodiment of the present invention is described, those skilled in the art can understand advantage of the present invention and effect easily by content disclosed in the present specification.The present invention also can be implemented in further, different ways, that is, not departing under disclosed category, can give different modifications and change.
A kind of high-transmission slimming emi shielding film, as shown in Figure 1, comprise metal screen layer 1 and adhesive layer 2, described metal screen layer 1 has two relative surfaces and is respectively first surface 11 and second surface 12, described adhesive layer is positioned on the second surface of described metal screen layer, the second surface 12 of described metal screen layer is rough surface and average surface roughness (Rz) is 0.5-12 micron, the thickness of described metal screen layer 1 is 1-35 micron, the thickness of described adhesive layer 2 is 1-16 micron, and not containing conducting particles in adhesive layer.
Described adhesive layer has low-k, low-dielectric loss property under the transmission of 1GHz ~ 20GHz high-frequency signals.The dielectric constant of described adhesive layer is 2.0-3.5.The dielectric loss factor of described adhesive layer is 0.001-0.010.
Described metal screen layer is through anti-oxidant resistance to heat treated metal screen layer.Described metal screen layer is Copper Foil, aluminium foil, goldleaf or silver foil.
Embodiment: a kind of high-transmission slimming emi shielding film, as shown in Figure 2, comprise metal screen layer 1 and adhesive layer 2, described metal screen layer has two relative surfaces and is respectively first surface 11 and second surface 12, described adhesive layer is positioned on the second surface of described metal screen layer, the second surface 12 of described metal screen layer is rough surface and average surface roughness (Rz) is 0.5-12 micron, the thickness of described metal screen layer 1 is 1-35 micron, the thickness of described adhesive layer 2 is 1-16 micron, also be provided with the first release film 4, ink layer 3 and the second release film 5, described ink layer is formed on the first surface of described metal screen layer, and described ink layer is folded between described first release film and described metal screen layer, described adhesive layer is folded between described metal screen layer and described second release film, the structure finally remaining in circuit board surface is by described ink layer 3, metal screen layer 1 and adhesive layer 2 superimposed formation successively, described ink layer, the gross thickness of metal screen layer and adhesive layer is 5-50 micron, the thickness of described ink layer is 1-7 micron.
Described adhesive layer has low-k, low-dielectric loss property under the transmission of 1GHz ~ 20GHz high-frequency signals.The dielectric constant of described adhesive layer is 2.0-3.5.The dielectric loss factor of described adhesive layer is 0.001-0.010.
Described metal screen layer is through anti-oxidant resistance to heat treated metal screen layer.Described metal screen layer is Copper Foil, aluminium foil, goldleaf or silver foil.
Described first release film and the second release film mould the one in release film, PET silicate-containing oil release film, the sub-light release film of PET and PE release film for PET fluorine separately, and thickness is 25 to 100 microns separately.
Described ink layer is the resin bed containing coloured female additive, and the resin material of described ink layer is epoxy resin, acrylic resin, amido formate system resin, silicon rubber system resin, poly-at least one in ring diformazan benzene series resin, bismaleimides system resin and polyimide resin, the look female additive of described ink layer comprises at least one in material with carbon element, titanium dioxide, pigment, dyestuff and toner.Pigment can comprise obtained by organic material and inorganic material.Ink layer can be black, redness, the shades of colour such as orange, yellow, blue.
The manufacture method of above-mentioned high-transmission slimming emi shielding film is as follows:
Step one: dope layer of ink on described first release film, by selecting the first release film of different surface roughness to make the reflective degree of ink layer surface different, reaches different glossiness;
Step 2: hot pressing is fitted described metal screen layer on described ink layer;
Step 3: get described second release film, described second release film is coated with described adhesive layer, and the second release film, for keeping the stickiness of described adhesive layer, is beneficial to follow-uply be bonding on circuit board or use is made in other pressing;
Step 4: the semi-finished product that step 2 and step 3 obtain are pressed into described high-transmission slimming emi shielding film.
When above-mentioned high-transmission slimming emi shielding film is applied to flexible printed wiring board, first the second release film is removed, carry out pressing again, adhesive layer 2 is because of hot pressing lower thickness, the second surface 12 of described metal screen layer 1 utilizes its surface roughness to pierce through described adhesive layer 2, and then form turning circuit with the ground connection cabling 61 on flexible printed wiring board 6, complete crosslinking curing is reached to maintain electrically good and mechanical properties via making resin under a period of time, flexible printed wiring board impedance ground value is made to lower the object reaching and reduce Electromagnetic Interference, there is the advantage of high-speed and high-efficiency transmission simultaneously, principle as shown in Figure 3.Be coated with the printed circuit board arrangement of high-transmission slimming emi shielding film of the present invention as shown in Figure 4, described ink layer 3 in described high-transmission slimming emi shielding film, metal screen layer 1 and adhesive layer 2 Landfill covering are in flexible printed wiring board 6 surface, and the second surface of described metal screen layer 1 utilizes its surface roughness to pierce through described adhesive layer 2 and contacts conducting with the ground connection cabling 61 of printed circuit board (PCB).
Following table is several embodiment of the present invention and resistance value, peel strength and shielding test result:
High-transmission slimming emi shielding film used in the present invention has the characteristics such as flexibility is high, electrical characteristic good, chemical resistance is good, transmission loss is few, transmission quality is high, height covers, ultra-flexible is had more compared to the polyimides coverlay that insulating barrier used in the past, there is the advantages such as manufacture method is simple, with low cost, compare general electromagnetic shielding film and there is higher transmission quality.And emi shielding film of the present invention has better extinction effect, to meet the various different demand of client.Use the black polyamide thin film being added with carbon dust traditionally; though the polyimides diaphragm of this manufacture has good extinction effect; but high cost; do not meet demand during actual volume production, and the polyimides diaphragm containing additive also has the anxiety worry that the character such as tensile strength, dimensional stability is deteriorated.Therefore, the present invention can better be applied to signal transmission quality You Yao enterprise, circuit is had to the printed circuit board (PCB) of mask requirement.
Claims (10)
1. a high-transmission slimming emi shielding film, it is characterized in that: comprise metal screen layer and adhesive layer, described metal screen layer has two relative surfaces and is respectively first surface and second surface, described adhesive layer is positioned on the second surface of described metal screen layer, the second surface of described metal screen layer is rough surface and average surface roughness is 0.5-12 micron, the thickness of described metal screen layer is 1-35 micron, the thickness of described adhesive layer is 1-16 micron, and not containing conducting particles in adhesive layer.
2. high-transmission slimming emi shielding film as claimed in claim 1, it is characterized in that: be also provided with the first release film, ink layer and the second release film, described ink layer is formed on the first surface of described metal screen layer, and described ink layer is folded between described first release film and described metal screen layer, described adhesive layer is folded between described metal screen layer and described second release film, the structure finally remaining in circuit board surface is by described ink layer, metal screen layer and adhesive layer be superimposed formation successively, described ink layer, the gross thickness of metal screen layer and adhesive layer is 5-50 micron, the thickness of described ink layer is 1-7 micron.
3. high-transmission slimming emi shielding film as claimed in claim 1, is characterized in that: the dielectric constant of described adhesive layer is 2.0-3.5.
4. high-transmission slimming emi shielding film as claimed in claim 1, is characterized in that: the dielectric loss factor of described adhesive layer is 0.001-0.010.
5. high-transmission slimming emi shielding film as claimed in claim 1, is characterized in that: described metal screen layer is through anti-oxidant resistance to heat treated metal screen layer.
6. high-transmission slimming emi shielding film as claimed in claim 1, is characterized in that: described metal screen layer is Copper Foil, aluminium foil, goldleaf or silver foil.
7. high-transmission slimming emi shielding film as claimed in claim 2, it is characterized in that: described first release film and the second release film mould the one in release film, PET silicate-containing oil release film, the sub-light release film of PET and PE release film for PET fluorine separately, and thickness is 25 to 100 microns separately.
8. high-transmission slimming emi shielding film as claimed in claim 2, it is characterized in that: described ink layer is the resin bed containing coloured female additive, and the resin material of described ink layer is epoxy resin, acrylic resin, amido formate system resin, silicon rubber system resin, poly-at least one in ring diformazan benzene series resin, bismaleimides system resin and polyimide resin, the look female additive of described ink layer comprises at least one in material with carbon element, titanium dioxide, pigment, dyestuff and toner.
9. one kind has the printed circuit board (PCB) of the high-transmission slimming emi shielding film according to any one of claim 1 to 8, it is characterized in that: described high-transmission slimming emi shielding film adheres to printed circuit board surface by described adhesive layer, and the second surface of described metal screen layer utilizes its surface roughness to pierce through described adhesive layer and walks linear contact lay conducting with the ground connection of printed circuit board (PCB).
10. a manufacture method for the high-transmission slimming emi shielding film according to any one of claim 2 to 8, is characterized in that:
Step one: dope layer of ink on described first release film, by selecting the first release film of different surface roughness to make the reflective degree of ink layer surface different, reaches different glossiness;
Step 2: hot pressing is fitted described metal screen layer on described ink layer;
Step 3: get described second release film, described second release film is coated with described adhesive layer;
Step 4: the semi-finished product that step 2 and step 3 obtain are pressed into described high-transmission slimming emi shielding film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410185382.XA CN105101761A (en) | 2014-05-06 | 2014-05-06 | High-transmission thin electromagnetic interference shielding film, and manufacturing method and applications thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410185382.XA CN105101761A (en) | 2014-05-06 | 2014-05-06 | High-transmission thin electromagnetic interference shielding film, and manufacturing method and applications thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105101761A true CN105101761A (en) | 2015-11-25 |
Family
ID=54580946
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410185382.XA Pending CN105101761A (en) | 2014-05-06 | 2014-05-06 | High-transmission thin electromagnetic interference shielding film, and manufacturing method and applications thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105101761A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107660113A (en) * | 2016-07-26 | 2018-02-02 | 昆山雅森电子材料科技有限公司 | Emi shielding film of the high shield effectiveness of high-transmission and preparation method thereof |
| CN107791641A (en) * | 2016-08-30 | 2018-03-13 | 昆山雅森电子材料科技有限公司 | High shielding emi shielding film with double-level-metal layer and preparation method thereof |
| CN108323145A (en) * | 2018-03-14 | 2018-07-24 | 广州方邦电子股份有限公司 | The preparation method of electromagnetic shielding film, wiring board and electromagnetic shielding film |
| WO2019200566A1 (en) * | 2018-04-18 | 2019-10-24 | 深圳市柔宇科技有限公司 | Flexible electronic device and manufacturing method thereof |
| WO2020093728A1 (en) * | 2018-11-09 | 2020-05-14 | 广州方邦电子股份有限公司 | Connector and manufacturing method |
| JP2020167250A (en) * | 2019-03-29 | 2020-10-08 | 東洋インキＳｃホールディングス株式会社 | Electromagnetic wave shield sheet, electromagnetic wave shield wiring circuit board, and electronic device |
| CN116782620A (en) * | 2023-07-03 | 2023-09-19 | 广州方邦电子股份有限公司 | Electromagnetic shield cover and circuit board |
| US11848508B2 (en) | 2018-11-09 | 2023-12-19 | Guangzhou Fangbang Electronics Co., Ltd. | Flexible connector and manufacturing method |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101553105A (en) * | 2008-04-01 | 2009-10-07 | 林淑清 | Electromagnetic wave shielding structure |
| CN101772996A (en) * | 2007-08-03 | 2010-07-07 | 大自达系统电子株式会社 | Printed wiring board-use screened film and printed wiring board |
| CN102164471A (en) * | 2010-02-22 | 2011-08-24 | 旭达精密工业股份有限公司 | Shield structure capable of resisting electromagnetic interference or used for static conduction and manufacturing method thereof |
| CN202941035U (en) * | 2011-10-24 | 2013-05-15 | 亚洲电材股份有限公司 | Electromagnetic interference shielding structure and flexible printed circuit board with same |
| CN103763893A (en) * | 2014-01-14 | 2014-04-30 | 广州方邦电子有限公司 | Electromagnetic wave shielding film and method for manufacturing circuit board with same |
-
2014
- 2014-05-06 CN CN201410185382.XA patent/CN105101761A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101772996A (en) * | 2007-08-03 | 2010-07-07 | 大自达系统电子株式会社 | Printed wiring board-use screened film and printed wiring board |
| CN101553105A (en) * | 2008-04-01 | 2009-10-07 | 林淑清 | Electromagnetic wave shielding structure |
| CN102164471A (en) * | 2010-02-22 | 2011-08-24 | 旭达精密工业股份有限公司 | Shield structure capable of resisting electromagnetic interference or used for static conduction and manufacturing method thereof |
| CN202941035U (en) * | 2011-10-24 | 2013-05-15 | 亚洲电材股份有限公司 | Electromagnetic interference shielding structure and flexible printed circuit board with same |
| CN103763893A (en) * | 2014-01-14 | 2014-04-30 | 广州方邦电子有限公司 | Electromagnetic wave shielding film and method for manufacturing circuit board with same |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107660113A (en) * | 2016-07-26 | 2018-02-02 | 昆山雅森电子材料科技有限公司 | Emi shielding film of the high shield effectiveness of high-transmission and preparation method thereof |
| CN107791641A (en) * | 2016-08-30 | 2018-03-13 | 昆山雅森电子材料科技有限公司 | High shielding emi shielding film with double-level-metal layer and preparation method thereof |
| CN107791641B (en) * | 2016-08-30 | 2020-01-14 | 昆山雅森电子材料科技有限公司 | High-shielding electromagnetic interference shielding film with double metal layers and preparation method thereof |
| US11272646B2 (en) | 2018-03-14 | 2022-03-08 | Guangzhou Fang Bang Electronic Co., Ltd. | Electromagnetic interference (EMI) shielding film, circuit board, and preparation method for EMI shielding film |
| CN108323145A (en) * | 2018-03-14 | 2018-07-24 | 广州方邦电子股份有限公司 | The preparation method of electromagnetic shielding film, wiring board and electromagnetic shielding film |
| WO2019174062A1 (en) * | 2018-03-14 | 2019-09-19 | 广州方邦电子股份有限公司 | Electromagnetic interference shielding film, circuit board, and preparation method for electromagnetic interference shielding film |
| WO2019200566A1 (en) * | 2018-04-18 | 2019-10-24 | 深圳市柔宇科技有限公司 | Flexible electronic device and manufacturing method thereof |
| WO2020093728A1 (en) * | 2018-11-09 | 2020-05-14 | 广州方邦电子股份有限公司 | Connector and manufacturing method |
| US11848508B2 (en) | 2018-11-09 | 2023-12-19 | Guangzhou Fangbang Electronics Co., Ltd. | Flexible connector and manufacturing method |
| US11962112B2 (en) | 2018-11-09 | 2024-04-16 | Guangzhou Fangbang Electronics Co., Ltd. | Connector and manufacturing method |
| JP2020167250A (en) * | 2019-03-29 | 2020-10-08 | 東洋インキＳｃホールディングス株式会社 | Electromagnetic wave shield sheet, electromagnetic wave shield wiring circuit board, and electronic device |
| JP7268446B2 (en) | 2019-03-29 | 2023-05-08 | 東洋インキＳｃホールディングス株式会社 | Electromagnetic wave shielding sheet, electromagnetic wave shielding printed circuit board and electronic equipment |
| CN116782620A (en) * | 2023-07-03 | 2023-09-19 | 广州方邦电子股份有限公司 | Electromagnetic shield cover and circuit board |
| CN116782620B (en) * | 2023-07-03 | 2024-03-08 | 广州方邦电子股份有限公司 | Electromagnetic shield cover and circuit board |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105101761A (en) | High-transmission thin electromagnetic interference shielding film, and manufacturing method and applications thereof | |
| CN204104291U (en) | Slimming high-transmission electromagnetic absorption screened film | |
| CN203859982U (en) | High-transmission thin electromagnetic interference shielding film and printed circuit board having same | |
| CN205864954U (en) | The emi shielding film of high-transmission height shield effectiveness | |
| CN105101762A (en) | Thin high-transmission electromagnetic interference shielding film, and manufacturing method and applications thereof | |
| CN206067098U (en) | High shielding emi shielding film with double-level-metal layer | |
| CN102480837B (en) | Flexible circuit board | |
| CN206650912U (en) | High shielding EMI screened films | |
| CN101448362B (en) | Ultra-thin shielding film and circuit board capable of changing circuit impedance, and method for preparing same | |
| CN107660113A (en) | Emi shielding film of the high shield effectiveness of high-transmission and preparation method thereof | |
| CN105578851A (en) | Thin-type high-transmission electromagnetic-absorbing screened film and manufacturing method thereof | |
| CN107426957A (en) | Conducting resinl film layer, preparation method and electromagnetic shielding film | |
| CN107791641B (en) | High-shielding electromagnetic interference shielding film with double metal layers and preparation method thereof | |
| CN105824359A (en) | Display device with NFC function | |
| CN204596965U (en) | A kind of multi-functional NFC antenna | |
| CN203194086U (en) | Thin-type colorful electromagnetic interference shielding film | |
| CN103717050A (en) | Thin-type flexible thermally-cured electromagnetic shielding glue film | |
| JP2018200982A (en) | Flexible printed wiring board, manufacturing method for flexible printed wiring board, and electronic equipment | |
| CN203859981U (en) | Thin high-transmission electromagnetic interference shielding film and printed circuit board having same | |
| KR20140125642A (en) | Multi-Layer Structured High Functional Magnetic Film and Manufacturing Method thereof | |
| CN104105386A (en) | Thin-type colorful electromagnetic interference shielding film and manufacturing method thereof | |
| JP6142933B1 (en) | Flexible printed wiring board, method for manufacturing flexible printed wiring board, and electronic device | |
| KR20180098123A (en) | Colored thin covering film and manufacturing method thereof | |
| CN208095043U (en) | Electromagnetic shielding film and wiring board | |
| CN112437598B (en) | High-shielding electromagnetic interference shielding film of multi-aperture copper foil and preparation method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20151125 |