CN107660113A - Emi shielding film of the high shield effectiveness of high-transmission and preparation method thereof - Google Patents
Emi shielding film of the high shield effectiveness of high-transmission and preparation method thereof Download PDFInfo
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- CN107660113A CN107660113A CN201610591941.6A CN201610591941A CN107660113A CN 107660113 A CN107660113 A CN 107660113A CN 201610591941 A CN201610591941 A CN 201610591941A CN 107660113 A CN107660113 A CN 107660113A
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- 238000002360 preparation method Methods 0.000 title claims abstract description 16
- 239000010410 layer Substances 0.000 claims abstract description 159
- 229910052751 metal Inorganic materials 0.000 claims abstract description 88
- 239000002184 metal Substances 0.000 claims abstract description 88
- 239000011241 protective layer Substances 0.000 claims abstract description 27
- 239000012790 adhesive layer Substances 0.000 claims abstract description 26
- 229920001721 polyimide Polymers 0.000 claims abstract description 21
- 239000004642 Polyimide Substances 0.000 claims abstract description 15
- 239000002245 particle Substances 0.000 claims abstract description 7
- 239000011347 resin Substances 0.000 claims description 37
- 229920005989 resin Polymers 0.000 claims description 37
- -1 amido formate Chemical compound 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 9
- 239000000654 additive Substances 0.000 claims description 8
- 230000000996 additive effect Effects 0.000 claims description 8
- 230000003746 surface roughness Effects 0.000 claims description 8
- 239000004595 color masterbatch Substances 0.000 claims description 7
- 239000000126 substance Substances 0.000 claims description 7
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 6
- 150000001555 benzenes Chemical class 0.000 claims description 6
- 229910052731 fluorine Inorganic materials 0.000 claims description 6
- 239000011737 fluorine Substances 0.000 claims description 6
- 238000007747 plating Methods 0.000 claims description 6
- 239000009719 polyimide resin Substances 0.000 claims description 6
- 238000012545 processing Methods 0.000 claims description 6
- 239000011265 semifinished product Substances 0.000 claims description 6
- 229920002379 silicone rubber Polymers 0.000 claims description 6
- 239000003822 epoxy resin Substances 0.000 claims description 5
- 229920003192 poly(bis maleimide) Polymers 0.000 claims description 5
- 229920000647 polyepoxide Polymers 0.000 claims description 5
- 239000004925 Acrylic resin Substances 0.000 claims description 4
- 229920000178 Acrylic resin Polymers 0.000 claims description 4
- 230000000694 effects Effects 0.000 claims description 4
- 239000003921 oil Substances 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 3
- 239000004411 aluminium Substances 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 239000003575 carbonaceous material Substances 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 239000000975 dye Substances 0.000 claims description 3
- 230000008020 evaporation Effects 0.000 claims description 3
- 238000001704 evaporation Methods 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 239000000049 pigment Substances 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004408 titanium dioxide Substances 0.000 claims description 3
- 229910052725 zinc Inorganic materials 0.000 claims description 3
- 239000011701 zinc Substances 0.000 claims description 3
- 150000003949 imides Chemical class 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 2
- 229910052737 gold Inorganic materials 0.000 claims 2
- 239000010931 gold Substances 0.000 claims 2
- 239000002253 acid Substances 0.000 claims 1
- 150000001336 alkenes Chemical group 0.000 claims 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims 1
- 150000002632 lipids Chemical class 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 claims 1
- 229910052760 oxygen Inorganic materials 0.000 claims 1
- 239000001301 oxygen Substances 0.000 claims 1
- 230000005540 biological transmission Effects 0.000 abstract description 5
- 230000000873 masking effect Effects 0.000 abstract description 3
- 238000004026 adhesive bonding Methods 0.000 abstract description 2
- 230000006872 improvement Effects 0.000 description 9
- 238000005516 engineering process Methods 0.000 description 7
- 239000000047 product Substances 0.000 description 5
- 230000008859 change Effects 0.000 description 3
- 238000004891 communication Methods 0.000 description 3
- 239000004952 Polyamide Substances 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000008033 biological extinction Effects 0.000 description 2
- 230000010267 cellular communication Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 238000007731 hot pressing Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000004836 Glue Stick Substances 0.000 description 1
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- BVCZEBOGSOYJJT-UHFFFAOYSA-N ammonium carbamate Chemical compound [NH4+].NC([O-])=O BVCZEBOGSOYJJT-UHFFFAOYSA-N 0.000 description 1
- 239000010426 asphalt Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 150000002466 imines Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000011017 operating method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/06—Interconnection of layers permitting easy separation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/10—Coating on the layer surface on synthetic resin layer or on natural or synthetic rubber layer
- B32B2255/102—Coating on the layer surface on synthetic resin layer or on natural or synthetic rubber layer synthetic resin or rubber layer being a foamed layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/20—Inorganic coating
- B32B2255/205—Metallic coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/212—Electromagnetic interference shielding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
Abstract
The invention discloses emi shielding film of the high shield effectiveness of a kind of high-transmission and preparation method thereof, gained emi shielding film includes a polyimide layer with hole, a metal level has been plated respectively on relative two surfaces of polyimide layer, two metal layers are respectively defined as the first metal layer and second metal layer, the surface of the first metal layer is rough surface, and an ink protective layer is coated with the first metal layer surface, the surface of second metal layer is also rough surface, and an adhesive layer without metal conductive particles is coated with second metal layer surface, and the first release film layer is also covered with ink protective layer surface, the second release film layer is also covered with gluing layer surface；Compared to prior art, present invention gained emi shielding film has the characteristics that flexibility is good, electrical characteristic is good, flexibility is good, transmission quality and speed are high, color masking is good and shield effectiveness is high, well suitable for the application such as mobile phone, tablet personal computer.
Description
Technical field
The present invention relates to emi shielding film technical field, the specific one kind that provides has
Excellent chemical resistance, electrical characteristic, printed circuit board (PCB) for high flexible high-transmission
Emi shielding film of high shield effectiveness and preparation method thereof.
Background technology
In the case where electronics and communication product tend to the market demand of multi-functional complication, circuit
The structure dress of substrate needs lighter, thin, short, small；And functionally, then need powerful
And high-speed signal transmits.Therefore, line density certainly will improve, between support plate circuit
Distance is more and more nearer to each other, and working frequency is broadband towards height, along with such as
Fruit configuration, the unreasonable lower electromagnetic interference situation of wiring are increasingly severe, therefore must
Electromagnetic compatibility (Electromagnetic Compatibility, EMC) must be effectively managed,
With the electromagnetic interference problem that solves component inside and outside, so as to maintain electronic product just
Normal signal transmission and raising reliability.Thus, characteristic that is frivolous and can arbitrarily bending,
So that soft board is on development of the demand portable information with communication electronics industry is moved towards
Occupy very important status.
Due to the more small small trend of electronic communication product, soft board is driven to carry more
More power, on the other hand because portable electronic product moves towards microminiature, also with
The high demand for driving high density soft board technology, functionally then requires powerful and Gao Ping
Under the situation for covering efficiency, high frequency, high density, graph thinning, in the market
The screen for film-type flexible printed wiring board (FPC) is proposed, in mobile phone, number
It is widely adopted in the small-sized electronic products such as position camera, digit camera.In view of
This, it would be highly desirable to develop a kind of material of novel, efficient shielding electromagnetic interference.
The content of the invention
In order to overcome drawbacks described above, the invention provides a kind of high shield effectiveness of high-transmission
Emi shielding film and preparation method thereof, the preparation method is simple and reliable, and
Have that flexibility is good, electrical characteristic through emi shielding film made from the preparation method
Good, the features such as chemical resistance is good, transmission loss is small, transmission quality is high.
The present invention in order to solve its technical problem used by technical scheme be：It is a kind of high
The emi shielding film of high shield effectiveness is transmitted, including one has the polyamides of hole sub-
Amine layer, the polyimide layer have plated layer of metal respectively on two surfaces relatively
Two metal layers are respectively defined as the first metal layer and second metal layer by layer, wherein
The surface of the first metal layer is rough surface, and on the first metal layer surface
Upper coating last layer ink protective layer, the surface of the second metal layer is also coarse table
Face, and last layer is coated with without metal conductive particles on the second metal layer surface
Adhesive layer, and one first mould release membrance is also covered with the surface of the ink protective layer
Layer, also it is covered with one second release film layer on the surface of the adhesive layer.
As a further improvement on the present invention, the thickness of the polyimide layer be 5~
25 microns.
As a further improvement on the present invention, the first metal layer and second metal layer
Respectively it is respectively selected from any one in silver, copper, zinc, nickel and aluminium；
And the first metal layer and the thickness of second metal layer are 0.2~5 micro-
Rice.
As a further improvement on the present invention, the surface roughness of the first metal layer
For 2.5~4 microns；The surface roughness of the second metal layer is 5~7 microns.
As a further improvement on the present invention, the ink protective layer is to add containing color masterbatch
Add the resin bed of thing, wherein, the resin material of the ink protective layer is selected from asphalt mixtures modified by epoxy resin
Fat, acrylic resin, amido formate system resin, silicon rubber system resin, poly- pair
In ring diformazan benzene series resin, bismaleimide amine system resin and polyimide resin extremely
Few one kind, the color masterbatch additive of the ink protective layer be selected from carbon material, titanium dioxide,
At least one of pigment, dyestuff and toner；
And the thickness of the ink protective layer is 3~25 microns.
As a further improvement on the present invention, the adhesive layer is to contain fluorine additive
Resin bed, wherein, the resin material of the adhesive layer is selected from epoxy resin, acrylic acid
It is resin, amido formate system resin, silicon rubber system resin, poly- to ring diformazan benzene series
At least one of resin, bismaleimide amine system resin and polyimide resin；And
The thickness of the adhesive layer is 5~15 microns.
As a further improvement on the present invention, first release film layer and second release
It is sub- that film layer is respectively respectively selected from PET fluorine modeling mould release membrance, PET silicate-containing oils mould release membrance, PET
At least one of light mould release membrance and PE mould release membrances；
And the thickness of first release film layer and the second release film layer be 25~
100 microns.
Present invention also provides a kind of electromagnetism for preparing the high shield effectiveness of the high-transmission
The preparation method of interference shielding film, including following preparation process：
Step 1)：On relative two surfaces of the polyimide layer with hole
Layer of metal layer has been plated respectively, and two metal layers are respectively defined as the first metal layer
And second metal layer, and the first metal layer and second metal layer surface is respectively distinguished
With certain roughness；
Step 2)：First last layer ink is coated with the first metal layer surface to protect
Sheath, and in being covered with one first release film layer on the surface of the ink protective layer,
By that can protect the ink from the first release film layer of different surface roughness
The reflective degree on sheath surface is different, to reach different glossiness；
Then last layer is coated with the second metal layer surface again to lead without metal
The adhesive layer of charged particle, and it is release in being covered with one second on the surface of the adhesive layer
Film layer；Obtain semi-finished product；
Step 3)：To above-mentioned steps 2) gained semi-finished product press, that is, be made institute
State the emi shielding film of the high shield effectiveness of high-transmission.
As a further improvement on the present invention, above-mentioned steps 1) in, in the polyamides
The processing technology bag of layer of metal layer is plated on relative two surfaces of imine layer respectively
Include at least one of sputter, plating, evaporation and chemical plating processing mode.
The beneficial effects of the invention are as follows：Emi shielding film tool obtained by the present invention
Have flexibility is good, chemical resistance is good, electrical characteristic is good, flexibility is good, transmission quality and
The features such as speed is high, it is much better than traditional PI diaphragms (the thin thin PI of glue), photosensitive type
PI (or acryl system) diaphragm, non-photo-sensing type PI diaphragms (photoresistance need to be gone up), with
And in general screened film (single-layer metal conductor layer or only one layer it is comprehensive conductive cementing
Structure etc.), particularly, the emi shielding film obtained by the present invention also has very
High shield effectiveness, the high shield effectiveness requirement that more than 80dB can be reached, and tool
Have extraordinary color masking (i.e. extinction), can be applied to well mobile phone,
Tablet personal computer etc. contains many antennas (bluetooth, Wi-Fi, cellular communication and GPS
Deng) handheld device field, be allowed in the space of very little interference-free from each other,
So as to effectively instead of general barrier film material.
Brief description of the drawings
Fig. 1 is the emi shielding film of the high shield effectiveness of high-transmission of the present invention
Cross-sectional view.
With reference to accompanying drawing, make the following instructions：
1 --- polyimide layer 2 --- the first metal layer
3 --- second metal layer 4 --- ink protective layers
5 --- adhesive layer 6 --- first release film layers
7 --- the second release film layer
Embodiment
Illustrate embodiments of the present invention by particular specific embodiment below, be familiar with
The personage of this skill can understand the present invention easily by content disclosed in the present specification
Other advantages and effect.
It should be clear that structure, ratio, size depicted in this specification institute accompanying drawings etc.,
Only to coordinate the content disclosed in specification, for people skilled in the art
Solution and reading, the enforceable qualifications of the present invention are not limited to, therefore do not have skill
Essential meaning in art, the modification of any structure, the change of proportionate relationship or size
Adjustment, in the case where not influenceing the effect of present invention can be generated and the purpose that can reach,
All should still it fall in the range of disclosed technology contents can be covered.Yu Ben
" first ", " second " described in specification is only clear for ease of describing, Er Feiyong
To limit the enforceable scope of the present invention, its relativeness is altered or modified, in nothing
Under essence change technology contents, when being also considered as the enforceable category of the present invention.
Embodiment 1：
Refer to shown in accompanying drawing 1, it is the high shield effectiveness of high-transmission of the present invention
The cross-sectional view of the embodiment of emi shielding film.The high shielding of the high-transmission
The emi shielding film of efficiency includes a polyimide layer 1 with hole, described
Layer of metal layer has been plated respectively on relative two surfaces of polyimide layer 1, by two layers
Metal level is respectively defined as the first metal layer 2 and second metal layer 3, wherein described
The surface of one metal level 2 is rough surface, and on the surface of the first metal layer 2
Last layer ink protective layer 4 is coated with, the surface of the second metal layer 3 is also to be coarse
Surface, and last layer is coated with without metallic conduction on the surface of second metal layer 3
The adhesive layer 5 of particle, and one is also covered with the surface of the ink protective layer 4
One release film layer 6, one second mould release membrance is also covered with the surface of the adhesive layer 5
Layer 7.
In the present embodiment, the thickness of the polyimide layer 1 is 5~25 microns.
The first metal layer 2 and second metal layer 3 be respectively respectively selected from silver, copper, zinc,
Any one in nickel and aluminium, the thickness of the first metal layer 2 and second metal layer 3
Degree is 0.2~5 micron, and the surface roughness of the first metal layer 2 is
2.5~4 microns；The surface roughness of the second metal layer 3 is 5~7 microns.
The ink protective layer 4 is the resin bed containing color masterbatch additive, wherein, institute
The resin material for stating ink protective layer 4 is selected from epoxy resin, acrylic resin, amine
Carbamate system resin, silicon rubber system resin, gather to ring diformazan benzene series resin, span
Come at least one of imide series resin and polyimide resin, the ink protection
The color masterbatch additive of layer 4 is in carbon material, titanium dioxide, pigment, dyestuff and toner
At least one, and nationality is with the color masterbatch additive, the ink layer can be revealed as black,
The a variety of colors such as red, orange, yellow or blueness；In addition, the ink protection
The thickness of layer 4 is 3~25 microns.
The adhesive layer 5 is the resin bed containing fluorine additive, wherein, the gluing
The resin material of layer 5 is selected from epoxy resin, acrylic resin, amido formate system
Resin, silicon rubber system resin, gather to ring diformazan benzene series resin, bismaleimide amine system
At least one of resin and polyimide resin；And the thickness of the adhesive layer 5 is
5~15 microns, the dielectric property Df of the adhesive layer 5 is 0.003.
The release film layer 7 of first release film layer 6 and second is respectively respectively selected from PET
Fluorine modeling mould release membrance, PET silicate-containing oils mould release membrance, PET matts mould release membrance and PE mould release membrances
At least one of；And the thickness of the release film layer 7 of the first release film layer 6 and second
Degree is 25~100 microns.
Below to the emi shielding film of the high shield effectiveness of high-transmission of the present invention
Preparation method be described in detail.
Preparation example 1：
The preparation method of the emi shielding film of the high shield effectiveness of high-transmission, bag
Include following preparation process：
Step 1)：On relative two surfaces of the polyimide layer 1 with hole
It is upper to have plated layer of metal layer respectively, specific processing technology can use sputter, plating,
At least one of evaporation and chemical plating processing mode；Two metal layers are defined respectively
For the first metal layer 2 and second metal layer 3, the first metal layer 2 and second metal layer
3 realize conducting by the space of the polyimide layer 1, and in metal cladding also
The first metal layer 2 and the surface of second metal layer 3 is set respectively to distinguish by decoction control
With certain roughness；
Step 2)：Last layer ink is first coated with the surface of the first metal layer 2
Protective layer 4, and it is release in being covered with one first on the surface of the ink protective layer 4
Film layer 6, it is described by that can be made from the first release film layer of different surface roughness
The reflective degree on the surface of ink protective layer 4 is different, to reach different glossiness；
Then last layer is coated with without metal on the surface of second metal layer 3 again
The adhesive layer 5 of conducting particles, and in being covered with one on the surface of the adhesive layer 5
Two release film layers 7, to keep the stickiness of the adhesive layer 5, beneficial to being subsequently bonding on
Use is made in circuit board or other pressings；Obtain semi-finished product；
Step 3)：To above-mentioned steps 2) gained semi-finished product press, that is, be made institute
State the emi shielding film of the high shield effectiveness of high-transmission.
In addition, work as the electromagnetic interference shield of the high shield effectiveness of high-transmission of the present invention
When film is applied on circuit board, its operating method is：First by the second release film layer 7
Remove, then hot pressing is together on circuit board, during hot pressing, the adhesive layer 5
Thickness can be thinning, have rough surface second metal layer 3 can puncture thinning glue
Stick layer 5 and then form path circuitry with the ground connection cabling of circuit board；When again via one section
Between after cause adhesive layer and ink protective layer to reach fully crosslinked solidification to remain good
Electrical and mechanical performance so that circuit board ground impedance value lower, reach drop
The purpose of low Electromagnetic Interference.
In summary, the emi shielding film obtained by the present invention has flexibility
It is good, chemical resistance is good, electrical characteristic is good, flexibility is good, transmission quality and speed height etc.
Feature, be much better than traditional PI diaphragms (the thin thin PI of glue), photosensitive type PI (or pressure
Gram force system) diaphragm, non-photo-sensing type PI diaphragms (photoresistance need to be gone up) and in general
Screened film (single-layer metal conductor layer or only one layer of comprehensive conductive adhesive structure etc.),
Particularly, the emi shielding film obtained by the present invention also has very high shielding
Efficiency, the high shield effectiveness requirement that more than 80dB can be reached, and with very good
Color masking (i.e. extinction), mobile phone, tablet personal computer can be applied to well
Etc. containing the hand-held of many antennas (bluetooth, Wi-Fi, cellular communication and GPS etc.)
Apparatus field, it is allowed in the space of very little interference-free from each other, so as to effectively
It instead of general barrier film material.
Above-mentioned embodiment only the illustrative present invention the effect of, not for limitation
The present invention, it is noted that for those skilled in the art,
On the premise of not departing from the technology of the present invention principle, some improvement and change can also be made
Type, these improvement and modification also should be regarded as within the scope of the present invention.In addition,
The quantity of each component is only illustrative in the above-described embodiment, also non-to be used to limit
The system present invention.
Claims (9)
1. a kind of emi shielding film of the high shield effectiveness of high-transmission, its feature exist
In：Including a polyimide layer (1) with hole, the polyimide layer (1)
Relative two surfaces on plated layer of metal layer respectively, two metal layers are fixed respectively
Justice is the first metal layer (2) and second metal layer (3), wherein first metal
The surface of layer (2) is rough surface, and on the first metal layer (2) surface
Last layer ink protective layer (4) is coated with, the surface of the second metal layer (3) is also
For rough surface, and last layer is coated with not on the second metal layer (3) surface
Adhesive layer (5) with metal conductive particles, and the table of the ink protective layer (4)
One first release film layer (6), the surface of the adhesive layer (5) are also covered with face
On be also covered with one second release film layer (7).
2. the electromagnetic interference of the high shield effectiveness of high-transmission according to claim 1
Screened film, it is characterised in that：The thickness of the polyimide layer (1) is 5~25
Micron.
3. the electromagnetic interference of the high shield effectiveness of high-transmission according to claim 1
Screened film, it is characterised in that：The first metal layer (2) and second metal layer (3)
Respectively it is respectively selected from any one in silver, copper, zinc, nickel and aluminium；
And the thickness of the first metal layer (2) and second metal layer (3) is
0.2~5 micron.
4. the electromagnetism of the high shield effectiveness of high-transmission according to claim 1 or 3
Interference shielding film, it is characterised in that：The rough surface of the first metal layer (2)
Spend for 2.5~4 microns；The surface roughness of the second metal layer (3) be 5~
7 microns.
5. the electromagnetic interference of the high shield effectiveness of high-transmission according to claim 1
Screened film, it is characterised in that：The ink protective layer (4) is to be added containing color masterbatch
The resin bed of thing, wherein, the resin material of the ink protective layer (4) is selected from ring
Oxygen tree fat, acrylic resin, amido formate system resin, silicon rubber system resin,
Gather in ring diformazan benzene series resin, bismaleimide amine system resin and polyimide resin
At least one, the color masterbatch additive of the ink protective layer (4) be selected from carbon material,
At least one of titanium dioxide, pigment, dyestuff and toner；
And the thickness of the ink protective layer (4) is 3~25 microns.
6. the electromagnetic interference of the high shield effectiveness of high-transmission according to claim 1
Screened film, it is characterised in that：The adhesive layer (5) is the tree containing fluorine additive
Lipid layer, wherein, the resin material of the adhesive layer (5) is selected from epoxy resin, third
It is olefin(e) acid system resin, amido formate system resin, silicon rubber system resin, poly- to ring diformazan
At least one in benzene series resin, bismaleimide amine system resin and polyimide resin
Kind；
And the thickness of the adhesive layer (5) is 5~15 microns.
7. the electromagnetic interference of the high shield effectiveness of high-transmission according to claim 1
Screened film, it is characterised in that：First release film layer (6) and the second mould release membrance
Layer (7) is respectively respectively selected from PET fluorine modeling mould release membrance, PET silicate-containing oils mould release membrance, PET
At least one of matt mould release membrance and PE mould release membrances；
And the thickness of first release film layer (6) and the second release film layer (7) is equal
For 25~100 microns.
A kind of 8. high shielding effect of high-transmission as any one of claim 1-7
The preparation method of the emi shielding film of energy, it is characterised in that：Including following preparation
Step：
Step 1)：In relative two tables of the polyimide layer (1) with hole
Layer of metal layer has been plated on face respectively, two metal layers are respectively defined as the first gold medal
Belong to layer (2) and second metal layer (3), and make the first metal layer (2) and the
Two metal levels (3) surface respectively has certain roughness respectively；
Step 2)：Last layer oil is first coated with the first metal layer (2) surface
Black protective layer (4), and in being covered with one on the surface of the ink protective layer (4)
First release film layer (6), pass through the first release film layer from different surface roughness
The reflective degree on the ink protective layer (4) surface can be made different, to reach not
Same glossiness；
Then last layer is coated with without gold on the second metal layer (3) surface again
Belong to the adhesive layer (5) of conducting particles, and pasted on the surface of the adhesive layer (5)
It is covered with one second release film layer (7)；Obtain semi-finished product；
Step 3)：To above-mentioned steps 2) gained semi-finished product press, that is, be made institute
State the emi shielding film of the high shield effectiveness of high-transmission.
9. the electromagnetic interference of the high shield effectiveness of high-transmission according to claim 8
The preparation method of screened film, it is characterised in that：Above-mentioned steps 1) in, described poly-
The processing of layer of metal layer is plated on relative two surfaces of imide layer (1) respectively
Technique includes at least one of sputter, plating, evaporation and chemical plating processing mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610591941.6A CN107660113A (en) | 2016-07-26 | 2016-07-26 | Emi shielding film of the high shield effectiveness of high-transmission and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610591941.6A CN107660113A (en) | 2016-07-26 | 2016-07-26 | Emi shielding film of the high shield effectiveness of high-transmission and preparation method thereof |
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| CN107660113A true CN107660113A (en) | 2018-02-02 |
Family
ID=61125188
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610591941.6A Pending CN107660113A (en) | 2016-07-26 | 2016-07-26 | Emi shielding film of the high shield effectiveness of high-transmission and preparation method thereof |
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| Country | Link |
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| CN (1) | CN107660113A (en) |
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| CN110691501A (en) * | 2018-07-06 | 2020-01-14 | 广州方邦电子股份有限公司 | Electromagnetic shielding film, circuit board and preparation method of electromagnetic shielding film |
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| CN112616306B (en) * | 2020-01-21 | 2022-03-08 | 东洋油墨Sc控股株式会社 | Electromagnetic wave shielding sheet and electromagnetic wave shielding printed circuit board |
| CN116782620A (en) * | 2023-07-03 | 2023-09-19 | 广州方邦电子股份有限公司 | Electromagnetic shield cover and circuit board |
| CN116782620B (en) * | 2023-07-03 | 2024-03-08 | 广州方邦电子股份有限公司 | Electromagnetic shield cover and circuit board |
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