CN105101762B - It is thinned high-transmission emi shielding film and its manufacturing method and application - Google Patents
It is thinned high-transmission emi shielding film and its manufacturing method and application Download PDFInfo
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- CN105101762B CN105101762B CN201410186768.2A CN201410186768A CN105101762B CN 105101762 B CN105101762 B CN 105101762B CN 201410186768 A CN201410186768 A CN 201410186768A CN 105101762 B CN105101762 B CN 105101762B
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Abstract
The invention discloses a kind of slimming high-transmission emi shielding film and its manufacturing method and applications, the screened film of the present invention is overlapped successively by the first release film, ink layer, the conductive adhesive layer with metal conductive particles, adhesive layer and the second release film to be constituted, the overall thickness of ink layer, conductive adhesive layer and adhesive layer is 16 to 83 microns, has many advantages, such as that transmission loss is small, transmission quality is high, shielding is good, good flexibility, electrical characteristic is good, chemical resistance is good, flexibility is good.When screened film of the present invention is applied to flexible printed wiring board, its ink layer, the conductive adhesive layer with metal conductive particles and adhesive layer Landfill covering are in printed circuit board surface, when screened film and press fit of circuit boards, adhesive layer is thinning because of hot pressing thickness, metal conductive particles in conductive adhesive layer pierce through adhesive layer because resin material is by hot pressing, and then form turning circuit with cabling is grounded on circuit board so that the attenuating of circuit board ground impedance value achievees the purpose that reduce Electromagnetic Interference.
Description
Technical field
The present invention relates to a kind of slimming, high-transmission emi shielding film, more particularly to it is a kind of it is slim have it is excellent
Chemical resistance, electrical characteristic, the slim high-transmission emi shielding film of the printed circuit board for high flexible.
Background technology
Under the market demand that electronics and communication product tend to multi-functional complication, the structure of circuit board dress need it is lighter,
It is thin, short, small；And functionally, then need powerful and high-speed signal to transmit.Therefore, line density certainly will improve, support plate circuit it
Between distance from increasingly closer and working frequency towards high broadband, if along with configuration, wiring are unreasonable
Lower electromagnetic interference (Electromagnetic Interference, EMI) situation is increasingly severe, it is therefore necessary to effectively management electricity
Magnetic be compatible with (Electromagnetic Compatibility, EMC), to come maintain electronic product normal signal transmit and
Improve reliability.Characteristic that is frivolous and being arbitrarily bent so that soft board is moving towards demand portable information and communication electronics production
Occupy very important status in the development of industry.
Since electronic communication product more attains small trend, drive soft board that must carry more strong big function, on the other hand by
Microminiature is moved towards in portable electronic product, the high demand of high density soft board technology is also and then driven, functionally then requires strong
Under the case where big and high frequency, high density, graph thinning, had been introduced currently on the market for film-type flexible printed wiring board
(FPC) screen is widely adopted in the small-sized electronic products such as mobile phone, numerical digit camera, digit camera.
In view of this, it would be highly desirable to develop a kind of material of novel shielding electromagnetic interference.
Invention content
To solve the above-mentioned problems, the present invention provides a kind of slimming high-transmission emi shielding film and its manufacturers
Method and application, the slimming high-transmission emi shielding film is with transmission loss is small, transmission quality is high, shielding is good, flexible
The advantages that property is good, electrical characteristic is good, chemical resistance is good, flexibility is good.
The present invention in order to solve its technical problem used by technical solution be：
The present invention provides a kind of slimming high-transmission emi shielding films, by the first release film, ink layer, have gold
Conductive adhesive layer, adhesive layer and the second release film for belonging to conducting particles overlap composition successively, and ultimately remain in circuit board surface
Structure is to be overlapped to constitute successively by the ink layer, conductive adhesive layer and adhesive layer, the ink layer, conductive adhesive layer and adhesive layer
Overall thickness is 16 to 83 microns, wherein the thickness of the conductive adhesive layer is 8 to 60 microns, and the thickness of the adhesive layer is 5 to 15
The thickness of micron, the ink layer is 3 to 8 microns.
It further says, wherein the conductive adhesive layer can be individual one layer of adhesion layer with metal conductive particles.
Can be pair that the adhesion layer overlapping by one layer without the adhesion layer of metal conductive particles and one layer with metal conductive particles is constituted
Layer structure sheaf, wherein without conducting particles adhesion layer gluing in the ink layer and the sticking together with metal conductive particles
Between layer.
It further says, wherein the adhesive layer contains fluorine additive.The adhesive layer dielectric property Df values are 0.003.
It further says, wherein it is siliceous that first release film and the second release film are respectively PET fluorine modeling release film, PET
One kind in oily release film, PET matts release film and PE release films, and thickness is respectively 25 to 100 microns.
It further says, wherein the ink layer is the resin layer containing color masterbatch additive, and the resin of the ink layer
Material be epoxy resin, acrylic resin, amido formate system resin, silicon rubber system resin, it is poly- to ring diformazan benzene series resin,
The color masterbatch additive of at least one of bismaleimide amine system resin and polyimide resin, the ink layer includes carbon materials
At least one of material, titanium dioxide, pigment, dyestuff and toner.
It is described slim the present invention also provides the printed circuit board with above-mentioned slimming high-transmission emi shielding film
The ink layer, the conductive adhesive layer with metal conductive particles and the adhesive layer changed in high-transmission emi shielding film are finally covered
It is placed on printed circuit board surface, adhesive layer is adhered to printed circuit board, and the metal conductive particles in the conductive adhesive layer pierce through
The adhesive layer simultaneously contacts conducting with the ground connection cabling on printed circuit board.
The present invention also provides the manufacturing methods of the slimming high-transmission emi shielding film：
Step 1：It is coated with the ink layer on first release film, by select different surface roughness first
Release film keeps the reflective degree of ink layer surface different, reaches different glossiness；
Step 2：The conductive adhesive layer is coated on the another side of the ink layer；
Step 3：Second release film is taken, the adhesive layer is coated on second release film；
Step 4：Semi-finished product made from step 2 and step 3 are pressed into the slimming high-transmission electromagnetic interference shield
Film.
The beneficial effects of the invention are as follows：The present invention, which is thinned high-transmission emi shielding film, to be applied on the first release film
Cloth ink layer, the applying conductive glue-line on ink layer are coated with adhesive layer on the second release film, then by conductive adhesive layer and adhesive layer
To pressure, slimming high-transmission emi shielding film has that ultrathin, flexibility is good, color masking, chemical resistance are good, electrical characteristic
The advantages that good, good flexibility, transmission quality are high and speed is high, better than traditional PI protective film (the thin thin PI of glue), photosensitive type PI (or pressures
Gram force system) protective film, non-photo-sensing type PI protective films (photoresist need to be gone up) and general screened film, it is suitable for mobile phone, tablet computer etc.
The application for containing the handheld device of many antennas (bluetooth, Wi-Fi, cellular communication and GPS etc.), is allowed in the space of very little
It is interference-free from each other, to replace general barrier film material.
Description of the drawings
Fig. 1 is the structural schematic diagram of present invention slimming high-transmission emi shielding film；
Fig. 2 is that the metal conductive particles in conductive adhesive layer of the present invention pierce through adhesive layer because resin material is by hot pressing, into
And form turning circuit schematic diagram with the ground connection cabling on flexible printed wiring board；
Fig. 3 is the printed circuit board arrangement schematic diagram with screened film of the present invention.
Specific implementation mode
Illustrate the specific implementation mode of the present invention below by way of specific specific example, those skilled in the art can be by this theory
The bright revealed content of book understands advantages of the present invention and effect easily.The present invention can also other different modes give reality
It applies, that is, under the scope of not departing from disclosed, different modification and change can be given.
Embodiment：A kind of slimming high-transmission emi shielding film, as shown in Figure 1, by the first release film 1, ink layer
2, the conductive adhesive layer 3 with metal conductive particles, adhesive layer 4 and the second release film 5 overlap composition successively, and ultimately remain in electricity
The structure of road plate surface is to be overlapped to constitute successively by the ink layer 2, conductive adhesive layer 3 and adhesive layer 4, the ink layer, conduction
The overall thickness of glue-line and adhesive layer is 16 to 83 microns.
Wherein, first release film, 1 and second release film 5 be respectively PET fluorine modeling release film, PET silicate-containing oils release film,
One kind in PET matts release film and PE release films, and thickness is respectively 25 to 100 microns.
Wherein, the ink layer 2 is the resin layer containing color masterbatch additive, and the resin material of the ink layer is epoxy
Resin, amido formate system resin, silicon rubber system resin, gathers to ring diformazan benzene series resin, bismaleimide acrylic resin
The color masterbatch additive of at least one of amine system resin and polyimide resin, the ink layer includes carbon material, titanium dioxide, face
At least one of material, dyestuff and toner.Pigment may include obtained by organic material and inorganic material.Ink layer glossiness
(Gloss) 20 or so.Ink layer can be a variety of colors such as black, red, orange, yellow, blue.The thickness of ink layer is
3 to 8 microns.
Wherein, the conductive adhesive layer 3 can be individual one layer of adhesion layer with metal conductive particles；Can also be by one
Layer is without the adhesion layer (increasing ink layer and with the binding force between metal conductive particles adhesion layer) of metal conductive particles and one
Layer with metal conductive particles adhesion layer overlapping constitute double-layer structure layer, wherein without conducting particles adhesion layer gluing in
Between the ink layer and the adhesion layer with metal conductive particles.Resin material used by conductive adhesive layer is asphalt mixtures modified by epoxy resin
Fat, amido formate system resin, silicon rubber system resin, gathers to ring diformazan benzene series resin, bismaleimide acrylic resin
It is at least one of resin and polyimide resin.The thickness of the conductive adhesive layer is 8 to 60 microns.
Wherein, the adhesive layer 4 contains fluorine additive, and the thickness of adhesive layer is 5 to 15 microns.Adhesive layer dielectric property Df
Value is 0.003.
The manufacturing method of above-mentioned slimming high-transmission emi shielding film is as follows：
Step 1：It is coated with the ink layer on first release film, by select different surface roughness first
Release film keeps the reflective degree of ink layer surface different, reaches different glossiness；
Step 2：The conductive adhesive layer is coated on the another side of the ink layer；
Step 3：Second release film is taken, the adhesive layer is coated on second release film, the second release film is used
In the stickiness for keeping the adhesive layer, use is made in favor of being subsequently bonding on circuit board or other pressings；
Step 4：Semi-finished product made from step 2 and step 3 are pressed into the slimming high-transmission electromagnetic interference shield
Film.
When above-mentioned slimming high-transmission emi shielding film is applied to printed circuit board, first the second release film is gone
Remove, then pressed, adhesive layer 4 because hot pressing thickness is thinning, metal conductive particles 31 in conductive adhesive layer 3 because resin material by
Hot pressing and pierce through adhesive layer 4, and then on flexible printed wiring board ground connection cabling 61 formed turning circuit, as shown in Fig. 2, through
By lower for a period of time so that resin reaches fully crosslinked solidification to maintain good electrical and mechanical properties so that flexible printer circuit
The attenuating of plate earthing impedance value achievees the purpose that reduce Electromagnetic Interference, while having the advantages that high-speed and high-efficiency transmission.It is covered with thin
The printed circuit board arrangement of type high-transmission emi shielding film is as shown in figure 3, the slimming high-transmission electromagnetic interference screen
The ink layer 2 in film, the conductive adhesive layer 3 with metal conductive particles and 4 Landfill covering of adhesive layer are covered in printed circuit board 6
Surface, the metal conductive particles 31 in the conductive adhesive layer pierce through the adhesive layer and with the ground connection cabling 61 on printed circuit board
Contact conducting.
Slimming high-transmission emi shielding film used in the present invention is high with flexibility, electrical characteristic is good, anti-ization
The characteristics such as property is good, transmission loss is few, transmission quality is high, have more compared to polyimides cover film used in previous insulating layer
Ultra-flexible has many advantages, such as that manufacturing method is simple, of low cost, has higher transmission matter compared to general electromagnetic shielding film
Amount.And emi shielding film of the present invention has better extinction effect, to meet the various different demands of client.Traditionally
Using the black polyamide thin film added with carbon dust, though the polyimides protective film of this manufacture has preferable delustring to imitate
Fruit, but cost is excessively high, when practical volume production, do not meet demand, and there is also have tension for the polyimides protective film containing additive
The anxiety that the properties such as intensity, dimensional stability are deteriorated is considered.Therefore, the present invention can preferably be applied to want excellent to signal transmission quality
There is circuit in enterprise the printed circuit board of mask requirement.
Claims (5)
1. a kind of slimming high-transmission emi shielding film, it is characterised in that：By the first release film, ink layer, there is metal
Conductive adhesive layer, adhesive layer and the second release film of conducting particles overlap composition successively, and ultimately remain in the knot of circuit board surface
Structure is to be overlapped to constitute successively by the ink layer, conductive adhesive layer and adhesive layer, the ink layer, conductive adhesive layer and adhesive layer it is total
Thickness is 16 to 83 microns, wherein the thickness of the conductive adhesive layer is 8 to 60 microns, and the thickness of the adhesive layer is 5 to 15 micro-
The thickness of rice, the ink layer is 3 to 8 microns, and the adhesive layer contains fluorine additive, and the adhesive layer dielectric property Df values are
0.003, the conductive adhesive layer is by one layer without the adhesion layer of metal conductive particles and one layer of sticking together with metal conductive particles
Stacking close constitute double-layer structure layer, wherein without conducting particles adhesion layer gluing in the ink layer and the band metal
Between the adhesion layer of conducting particles.
2. slimming high-transmission emi shielding film as described in claim 1, it is characterised in that：First release film and
Second release film is respectively one in PET fluorine modeling release film, PET silicate-containing oils release film, PET matts release film and PE release films
Kind, and thickness is respectively 25 to 100 microns.
3. slimming high-transmission emi shielding film as described in claim 1, it is characterised in that：The ink layer be containing
The resin layer of color masterbatch additive, and the resin material of the ink layer is epoxy resin, acrylic resin, amido formate system
Resin, silicon rubber system resin, it is poly- in ring diformazan benzene series resin, bismaleimide amine system resin and polyimide resin at least
The color masterbatch additive of one kind, the ink layer includes at least one of carbon material, titanium dioxide, pigment, dyestuff and toner.
4. a kind of printing electricity with slimming high-transmission emi shielding film as claimed any one in claims 1 to 3
Road plate, it is characterised in that：The ink layer being thinned in high-transmission emi shielding film has metal conductive particles
Conductive adhesive layer and adhesive layer Landfill covering in printed circuit board surface, adhesive layer is adhered to printed circuit board, and the conduction
Metal conductive particles in glue-line pierce through the adhesive layer and contact conducting with the ground connection cabling on printed circuit board.
5. a kind of manufacturing method of slimming high-transmission emi shielding film as claimed any one in claims 1 to 3,
It is characterized in that：
Step 1：It is coated with the ink layer on first release film, first by selecting different surface roughness is release
Film keeps the reflective degree of ink layer surface different, reaches different glossiness；
Step 2：The conductive adhesive layer is coated on the another side of the ink layer；
Step 3：Second release film is taken, the adhesive layer is coated on second release film；
Step 4：Semi-finished product made from step 2 and step 3 are pressed into the slimming high-transmission emi shielding film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410186768.2A CN105101762B (en) | 2014-05-06 | 2014-05-06 | It is thinned high-transmission emi shielding film and its manufacturing method and application |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201410186768.2A CN105101762B (en) | 2014-05-06 | 2014-05-06 | It is thinned high-transmission emi shielding film and its manufacturing method and application |
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| CN105101762A CN105101762A (en) | 2015-11-25 |
| CN105101762B true CN105101762B (en) | 2018-08-07 |
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Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107791641B (en) * | 2016-08-30 | 2020-01-14 | 昆山雅森电子材料科技有限公司 | High-shielding electromagnetic interference shielding film with double metal layers and preparation method thereof |
| CN110691497B (en) * | 2018-07-06 | 2024-04-23 | 广州方邦电子股份有限公司 | Electromagnetic shielding film, circuit board and preparation method of electromagnetic shielding film |
| CN110769677A (en) * | 2018-07-27 | 2020-02-07 | 广州方邦电子股份有限公司 | Electromagnetic shielding film, circuit board and preparation method of electromagnetic shielding film |
| CN110769668B (en) * | 2018-07-27 | 2024-04-23 | 广州方邦电子股份有限公司 | Electromagnetic shielding film, circuit board and preparation method of electromagnetic shielding film |
| CN110769664B (en) * | 2018-07-27 | 2024-02-06 | 广州方邦电子股份有限公司 | Electromagnetic shielding film, circuit board and preparation method of electromagnetic shielding film |
| CN110783015A (en) * | 2018-11-26 | 2020-02-11 | 广州方邦电子股份有限公司 | Conductive adhesive film, circuit board and preparation method of conductive adhesive film |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102026529A (en) * | 2009-09-18 | 2011-04-20 | 大自达电线株式会社 | Shielding film, shielding distribution board having the same and grounding method thereof |
| CN102387656A (en) * | 2010-08-30 | 2012-03-21 | 富葵精密组件(深圳)有限公司 | Circuit board with grounding shield structure and manufacturing method thereof |
| CN203194086U (en) * | 2013-04-02 | 2013-09-11 | 昆山雅森电子材料科技有限公司 | Thin-type colorful electromagnetic interference shielding film |
| CN103763893A (en) * | 2014-01-14 | 2014-04-30 | 广州方邦电子有限公司 | Electromagnetic wave shielding film and method for manufacturing circuit board with same |
| CN203859981U (en) * | 2014-05-06 | 2014-10-01 | 昆山雅森电子材料科技有限公司 | Thin high-transmission electromagnetic interference shielding film and printed circuit board having same |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102572025A (en) * | 2010-12-31 | 2012-07-11 | 沈阳晨讯希姆通科技有限公司 | Electromagnetic shielding structure in mobile phone |
| CN103687459A (en) * | 2012-09-14 | 2014-03-26 | 昆山雅森电子材料科技有限公司 | Electromagnetic wave shielding structure and flexible printed circuit board with same |
-
2014
- 2014-05-06 CN CN201410186768.2A patent/CN105101762B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102026529A (en) * | 2009-09-18 | 2011-04-20 | 大自达电线株式会社 | Shielding film, shielding distribution board having the same and grounding method thereof |
| CN102387656A (en) * | 2010-08-30 | 2012-03-21 | 富葵精密组件(深圳)有限公司 | Circuit board with grounding shield structure and manufacturing method thereof |
| CN203194086U (en) * | 2013-04-02 | 2013-09-11 | 昆山雅森电子材料科技有限公司 | Thin-type colorful electromagnetic interference shielding film |
| CN103763893A (en) * | 2014-01-14 | 2014-04-30 | 广州方邦电子有限公司 | Electromagnetic wave shielding film and method for manufacturing circuit board with same |
| CN203859981U (en) * | 2014-05-06 | 2014-10-01 | 昆山雅森电子材料科技有限公司 | Thin high-transmission electromagnetic interference shielding film and printed circuit board having same |
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| CN105101762A (en) | 2015-11-25 |
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