CN102026529A - Shielding film, shielding distribution board having the same and grounding method thereof - Google Patents
Shielding film, shielding distribution board having the same and grounding method thereof Download PDFInfo
- Publication number
- CN102026529A CN102026529A CN2010102873339A CN201010287333A CN102026529A CN 102026529 A CN102026529 A CN 102026529A CN 2010102873339 A CN2010102873339 A CN 2010102873339A CN 201010287333 A CN201010287333 A CN 201010287333A CN 102026529 A CN102026529 A CN 102026529A
- Authority
- CN
- China
- Prior art keywords
- layer
- screened film
- film
- coverlay
- following layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 25
- 229910052751 metal Inorganic materials 0.000 claims abstract description 88
- 239000002184 metal Substances 0.000 claims abstract description 88
- 239000002245 particle Substances 0.000 claims abstract description 57
- 239000004020 conductor Substances 0.000 claims abstract description 45
- 229920005989 resin Polymers 0.000 claims abstract description 39
- 239000011347 resin Substances 0.000 claims abstract description 39
- 239000000758 substrate Substances 0.000 claims abstract description 37
- 238000010438 heat treatment Methods 0.000 claims abstract description 26
- 238000002844 melting Methods 0.000 abstract 1
- 230000008018 melting Effects 0.000 abstract 1
- 239000010408 film Substances 0.000 description 194
- 230000000694 effects Effects 0.000 description 21
- 230000015572 biosynthetic process Effects 0.000 description 17
- -1 ammonia ester Chemical class 0.000 description 13
- 239000007787 solid Substances 0.000 description 10
- 239000011248 coating agent Substances 0.000 description 9
- 238000000576 coating method Methods 0.000 description 9
- 239000000843 powder Substances 0.000 description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 8
- 239000000463 material Substances 0.000 description 7
- 238000012545 processing Methods 0.000 description 7
- 239000004593 Epoxy Substances 0.000 description 6
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 6
- 238000009413 insulation Methods 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 5
- 229910052737 gold Inorganic materials 0.000 description 5
- 239000010931 gold Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000012528 membrane Substances 0.000 description 5
- 229920000728 polyester Polymers 0.000 description 5
- 229920001721 polyimide Polymers 0.000 description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 4
- 239000004734 Polyphenylene sulfide Substances 0.000 description 4
- 239000004743 Polypropylene Substances 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 239000007769 metal material Substances 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 description 4
- 239000005020 polyethylene terephthalate Substances 0.000 description 4
- 229920000069 polyphenylene sulfide Polymers 0.000 description 4
- 229920001155 polypropylene Polymers 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 229910052718 tin Inorganic materials 0.000 description 4
- 239000011135 tin Substances 0.000 description 4
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 3
- 239000004952 Polyamide Substances 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 3
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 239000004411 aluminium Substances 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910021529 ammonia Inorganic materials 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N ammonia Natural products N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 3
- 230000004888 barrier function Effects 0.000 description 3
- 230000005465 channeling Effects 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 3
- 239000012467 final product Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 229910052763 palladium Inorganic materials 0.000 description 3
- 229920002647 polyamide Polymers 0.000 description 3
- 229920000573 polyethylene Polymers 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 239000010936 titanium Substances 0.000 description 3
- 229910052719 titanium Inorganic materials 0.000 description 3
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- 239000013032 Hydrocarbon resin Substances 0.000 description 2
- 239000004697 Polyetherimide Substances 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 150000001336 alkenes Chemical class 0.000 description 2
- 229920000180 alkyd Polymers 0.000 description 2
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 229920006351 engineering plastic Polymers 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229920006270 hydrocarbon resin Polymers 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229920002480 polybenzimidazole Polymers 0.000 description 2
- 229920001601 polyetherimide Polymers 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 239000005060 rubber Substances 0.000 description 2
- 239000003351 stiffener Substances 0.000 description 2
- 150000003505 terpenes Chemical class 0.000 description 2
- 235000007586 terpenes Nutrition 0.000 description 2
- 229920002725 thermoplastic elastomer Polymers 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- 238000009692 water atomization Methods 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- HCITUYXHCZGFEO-UHFFFAOYSA-N 1,3,5-triazine-2,4,6-triamine Chemical compound NC1=NC(N)=NC(N)=N1.N=C1NC(=N)NC(=N)N1 HCITUYXHCZGFEO-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 241000784726 Lycaena thetis Species 0.000 description 1
- 239000004693 Polybenzimidazole Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- FDOWWCFFWMGFGQ-UHFFFAOYSA-N but-3-enoic acid Chemical compound OC(=O)CC=C.OC(=O)CC=C FDOWWCFFWMGFGQ-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 239000013039 cover film Substances 0.000 description 1
- 229920003020 cross-linked polyethylene Polymers 0.000 description 1
- 239000004703 cross-linked polyethylene Substances 0.000 description 1
- 210000001787 dendrite Anatomy 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- XIKYYQJBTPYKSG-UHFFFAOYSA-N nickel Chemical compound [Ni].[Ni] XIKYYQJBTPYKSG-UHFFFAOYSA-N 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- SBEQWOXEGHQIMW-UHFFFAOYSA-N silicon Chemical compound [Si].[Si] SBEQWOXEGHQIMW-UHFFFAOYSA-N 0.000 description 1
- 238000013517 stratification Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Images
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention discloses a shielding film which prevents the grounding conductor of the substrate being the adhering object of the shielding film from revealing and facilitates the grounding, a shielding distribution board which uses the shielding film and possesses a shielding function and resistance control function through one step, and the grounding method of using the shielding film. The shielding film (20) which is connected to a conducting member (30) by means of heating and pressurization is composed by resin whose melting point is higher than the heating temperature. The shielding film (10) comprises a covering film (25) which forms a layer thickness (L1) that is thinner than the average protruding length (L2) of the conducive particle (35) protruding from a conductive bonding layer (33), a metal film layer (24) which stacks on the covering film (25) in order and a bonding layer (23).
Description
Technical field
The present invention relates to ground connection (ground) method of attachment of employed screened film (shield film), shielding distributing board and screened film in the substrate with electric conductor of a kind of flexible flat cable (flexible flat cable) etc. with this screened film.
Background technology
In the past, the substrate with electric conductor of flexible flat cable etc. is being office automation (the Office Automation of representative with TV (television), video tape recorder (video recorder), mobile phone and PC, OA) in the various electronic equipments of equipment etc., be used to more and will be connected between device interior or the equipment.
In addition, in recent years, because the development of information-intensive society, electronic equipment is required to realize the high speed of electronic communication, thereupon, in order to alleviate, on the substrate with electric conductor of flexible flat cable etc., attaching screened film from the unnecessary radiation of the signal of telecommunication behind the high speed or from the noise (noise) of outside.And, because need with the equipment that is connected between carry out the coupling of impedance (impedance), have the impedance Control film (impedancecontrol film) of impedance being controlled the function of (control) so described substrate is attaching.
For example, in patent documentation 1, as shown in Figure 6, disclosed a kind of flexible flat cable 50, comprise that signal conductor 51 is arranged side by side on Width with a plurality of conductors of earthing conductor 52, by the foamed insulation body 54 of following layer 53 with insulating properties on thickness direction, after the described a plurality of conductors of clamping are come in both sides, through stacked (laminate) processing, then come the described foamed insulation body 54 of clamping from both sides by metal level 56 with conductivity following layer 55.In addition, metal level 56 is provided with insulating film 57.
Flexible flat cable 50 with aforesaid formation gives compound by the dielectric constant with the dielectric constant of foamed insulation body 54 and air, can adjust characteristic impedance.In addition, flexible flat cable 50 has shield effectiveness under the effect of metal level 56.
In addition, for example, in patent documentation 2, as shown in Figure 7, disclosed a kind of impedance Control shielding distributing board 60, on Ranvier's membrane (base film) 63, the a plurality of conductors that comprise signal conductor 61 and earthing conductor 62 are arranged side by side on Width, and be provided with insulating barrier 64, and, the screened film that is disposed with the impedance Control film that comprises opening metal film layer 66 with conductivity following layer 65 and insulating film 67 and comprises non-opening metal film layer 69 with conductivity following layer 68 and insulating film 70.
Impedance Control shielding distributing board 60 with aforesaid formation has the impedance Control effect, and under the effect of non-opening metal film layer 69, has shield effectiveness under the effect of opening metal film layer 66.
[prior art document]
[patent documentation]
[patent documentation 1] Japan Patent spy opens the 2003-31033 communique
[patent documentation 2] Japan Patent spy opens the 2006-24824 communique
But, as shown in Figure 6, for the flexible flat cable 50 of patent documentation 1, for the current potential that makes metal level 56 is an earthing potential, need specially to form nonisulated 58 on the part in conductivity following layer 55, foamed insulation body 54 and following layer 53 in advance, and metal level 56 is connected with earthing conductor 52 by this conductivity following layer 59 of nonisulated 58 of landfill.
In addition, obtain impedance effect and these two effects of shield effectiveness, need at least two steps promptly foamed insulation body 54 to be carried out processing steps, reaches the step of carrying out clamping by metal level 56 then in order to make flexible flat cable 50.
In addition, as shown in Figure 7, for the impedance Control shielding distributing board 60 of patent documentation 2, for the current potential that makes opening metal film layer 66 is an earthing potential, also need specially to be provided with nonisulated 71 on the part in insulating barrier 64 in advance, and opening metal film layer 66 is connected with earthing conductor 62 by this conductivity following layer 65 of nonisulated 71 of landfill.
In addition, obtain impedance effect and these two effects of shield effectiveness, need to form at least two steps of opening metal film layer and non-these two layers of opening metal film layer in order to make impedance Control shielding distributing board 60.
So, there are following problem in the flexible flat cable 50 of patent documentation 1 and the impedance Control of patent documentation 2 shielding distributing board 60: in order to obtain shield effectiveness and impedance Control effect, need specially be provided with nonisulated and earthing conductor is exposed, maybe need to form at least two steps of layer with shield effectiveness and layer, can expend time and cost (cost) with impedance Control effect.
Summary of the invention
Therefore, the object of the present invention is to provide the earthing conductor that can not make the substrate that becomes the attaching of screened film object to expose and easily the screened film of ground connection, can use this screened film and have the shielding distributing board of function of shielding and impedance Control function with a step and use the earthing method that this screened film is arranged.
Screened film of the present invention is connected in conductive member by heating and pressurization, this conductive member comprise under the contact condition in order to metal level that is connected with the external ground member and the conductivity following layer that comprises electroconductive particle, described screened film comprises: coverlay (cover film), by being formed because of the softening resin of described heating, by described heating and the pressurization connect after, form than the average outstanding thinner layer thickness of length from the outstanding described electroconductive particle of described conductivity following layer, and then in described conductivity following layer; And stack gradually metal film layer and following layer in described coverlay.
According to described formation, when when heating and pressurization are connected in the screened film that comprises coverlay, metal film layer and following layer with conductive member, softening because of heating in the screened film by the formed coverlay of resin, and when connecting, the average outstanding length of the electroconductive particle that the layer thickness of coverlay is more outstanding than the conductivity following layer in conductive member is thinner, therefore, because of till pressurization can wear out coverlay in the screened film and arrive metal film layer from the outstanding electroconductive particle of conductivity following layer.Whereby, be earthing potential because can make the current potential of the metal film layer in the screened film via electroconductive particle, so need not, the earthing conductor that is attaching in the substrate of screened film is connected with metal film layer in the screened film as in the past.Therefore, neither need in advance substrate to be processed the time that earthing conductor is exposed, also can not expend processing cost.In addition, because only conductive member is connected in screened film, so even for example when having used the substrate of strip, still can be in the position of expection easily with screened film ground connection.
In addition, in screened film of the present invention, also insert layer can be arranged then further on described following layer, by with described insert layer then in substrate with electric conductor, the impedance of substrate with this electric conductor is controlled.
According to described formation, adjust by thickness insert layer, can adjust the impedance of substrate with electric conductor.Therefore, screened film comprises layer that the impedance of the substrate with electric conductor is adjusted and the layer with shield effectiveness, only, just both can give shield effectiveness, can give the impedance Control effect to this substrate again substrate by a step that screened film is attached at substrate.
In addition, in screened film of the present invention, described substrate also can be flexible flat cable.
According to described formation, can provide the screened film that is attached at flexible flat cable.
In addition, the present invention is a kind of shielding distributing board, comprises substrate and aforesaid screened film with electric conductor.
According to described formation, can provide the shielding that is pasted with screened film distributing board.
In addition, the present invention is a kind of earthing method of screened film, and this screened film comprises by the formed coverlay of resin and stack gradually metal film layer and following layer in described coverlay that the earthing method of this screened film is characterised in that:
Conductive member comprises metal level that is connected with the external ground member under the contact condition and the conductivity following layer that comprises electroconductive particle, so that the softening temperature of described resin is come this conductive member while heating, pressurizeing, this conductivity following layer and described coverlay are followed, whereby, outstanding that the described electroconductive particle longer than the layer thickness of described coverlay arrives till the described metal film layer, thus ground connection.
According to described earthing method, when when heating and pressurization are connected in the screened film that comprises coverlay, metal film layer and following layer with conductive member, softening because of heating in the screened film by the formed coverlay of resin, and when connecting, the average outstanding length of the electroconductive particle that the layer thickness of coverlay is more outstanding than the conductivity following layer in conductive member is thinner, therefore, because of till pressurization can wear out coverlay in the screened film and arrive metal film layer from the outstanding electroconductive particle of conductivity following layer.Whereby, be earthing potential because can make the current potential of the metal film layer in the screened film via electroconductive particle, so need not, the earthing conductor that is attaching in the substrate of screened film is connected with metal film layer in the screened film as in the past.Therefore, neither need in advance substrate to be processed the time that earthing conductor is exposed, also can not expend processing cost.In addition, because only conductive member is connected in screened film, so even for example when having used the substrate of strip, still can be in the position of expection easily with screened film ground connection.
[effect of invention]
According to screened film of the present invention, be earthing potential because can make the current potential of the metal film layer in the screened film via electroconductive particle, so neither need in advance substrate to be processed the time that earthing conductor is exposed, can not expend processing cost yet.In addition, because only conductive member is connected in screened film, so can be in the position of expecting easily with screened film ground connection.
Above-mentioned explanation only is the general introduction of technical solution of the present invention, for can clearer understanding technological means of the present invention, and can be implemented according to the content of specification, below with preferred embodiment of the present invention and conjunction with figs. describe in detail as after.
Description of drawings
Fig. 1 is the A-A ' line arrow pseudosection of Fig. 2 of the shielding distributing board of embodiment of the present invention.
Fig. 2 is the figure of outward appearance of the shielding distributing board of expression embodiment of the present invention.
Fig. 3 is the B-B ' line arrow pseudosection of Fig. 2 of the shielding distributing board of embodiment of the present invention.
Fig. 4 (a) is in the earthing method of screened film of expression embodiment of the present invention, and conductive member is connected figure before with screened film.
Fig. 4 (b) is in the earthing method of screened film of expression embodiment of the present invention, the figure when conductive member is connected with screened film.
Fig. 5 is the figure of manufacture method of the screened film of expression embodiment of the present invention.
Fig. 6 is the figure of section of the flexible flat cable of expression patent documentation 1.
Fig. 7 is the figure that the impedance Control of expression patent documentation 2 shields the section of distributing board.
[explanation of symbol]
1: the shielding distributing board
10: flexible flat cable
11,51,61: signal conductor
12,52,62: earthing conductor
13: dielectric film
14,63: Ranvier's membrane
20: screened film
21,23,53: following layer
22: insert layer
24: metal film layer
25: coverlay
30: conductive member
31: plating layer
32,56: metal level
33,55,59,65,68: the conductivity following layer
34: solid
35: electroconductive particle
40: stiffener
41: roll out machine
42,44: apparatus for coating
43,45: drying oven
46: make-up machine
47: wrapping machine
50: flexible flat cable
54: the foamed insulation body
57,67,70: insulating film
58,71: nonisulated portion
60: impedance Control shielding distributing board
64: insulating barrier
66: the opening metal film layer
69: non-opening metal film layer
E: circle portion
L1: layer thickness
L2: on average outstanding length
Embodiment
Below, come embodiments of the present invention are described based on accompanying drawing.
(whole formation)
As shown in Figure 1, screened film 20 of the present invention is connected in conductive member 30 by heating and pressurization, this conductive member 30 comprise under the contact condition in order to metal level that is connected with the external ground member and the conductivity following layer 33 that comprises electroconductive particle 35, described screened film 20 comprises: coverlay 25, by being formed because of the softening resin of heating, when by heating and pressurization when connecting, form than from the thinner layer thickness L1 of the average outstanding length L 2 of the outstanding electroconductive particle 35 of conductivity following layer 33, and then in conductivity following layer 33; And stack gradually metal film layer 24 and following layer 23 in coverlay 25.
In addition, as shown in Figure 1, screened film 20 of the present invention is attached on the substrate with electric conductor of flexible flat cable 10 grades, this screened film 20 has following function: alleviate from the unnecessary radiation of the signal of telecommunication or from the noise of outside, and impedance adjusted, so that flexible flat cable 10 and be connected between the equipment of this flexible flat cable 10 and can not produce not matching of impedance.
In addition because screened film of the present invention 20 by the heating and the pressurization and be connected in the conductive member 30 that is connected with the external ground member, so the current potential of this screened film 20 can be made as earthing potential.
Herein, so-called " connection " is meant that plural member is electrically connected at least, and in the case, so-called " connection " is meant that screened film 20 is electrically connected at least with conductive member 30.
(conductive member 30)
Herein, at first the conductive member 30 that is connected in screened film 20 of the present invention is described.Shown in Fig. 4 (a), Fig. 4 (b), conductive member 30 has following formation: on the metal level of following with contact condition and the conductivity following layer 33 that comprises electroconductive particle 35 32, more be applied with the plating layer 31 of Gold plated Layer, tin coating etc.
(conductivity following layer 33)
Contained conductivity following layer 33 forms the mixture of electroconductive particle 35 and solid 34 (acrylic acid (acrylic) is resin etc.) in the conductive member 30.That is, conductivity following layer 33 is electroconductive particle 35 to be dispersed in the solid 34 of acrylic resin etc. form.The electrical connection of conductivity following layer 33, be one or more electroconductive particles 35 in the solid 34 on the thickness direction of conductivity adhesion agent layer 33 continuously contact realize and keep by the adhesion of solid 34.
(solid 34)
About solid contained in the conductivity following layer 33 34, can enumerate acrylic resin, epoxy (epoxy) is that resin, silicon (silicon) are that resin, thermoplastic elastomer (TPE) (elastomer) are that resin, rubber (gum) are that resin and polyester (polyester) are resin etc.Moreover solid 34 both can be the monomer of described resin, also can be the mixture of described resin.
In addition, solid 34 also can more comprise tackifier.As tackifier, can enumerate the tackifier (tackifier) of aliphatic acid hydrocarbon resin, C5/C9 hybrid resin, rosin (rosin), rosin derivative, special resin, terpenes (terpene) resin, fragrant family hydrocarbon resin and heat reactivity resin etc.
(electroconductive particle 35)
Form part or all of electroconductive particle contained in the conductivity following layer 33 35 by metal material.For example, the nickel powder that electroconductive particle 35 has copper powder, silver powder, nickel (nickel) powder, is coated with the copper powder (being coated with the Cu powder of Ag) of silver, is coated with golden copper powder, is coated with the nickel powder (being coated with the Ni powder of Ag) of silver and is coated with gold can wait and make these metal powders by water atomization (water atomization method), carbonyl process (carbonyl method).In addition, except described powder, also can use at particle that is coating resin on the metal powder and the particle that on resin, coating metal powder.Moreover electroconductive particle 35 preferably is coated with the Cu powder of Ag or is coated with the Ni powder of Ag.Reason is to obtain the electroconductive particle 35 that conductivity improves by the material of cheapness.
In addition, shown in Fig. 4 (a), electroconductive particle 35 is in and metal level 32 state of contact, and is being attached at a side of screened film 20, and the part of this electroconductive particle 35 is outstanding from conductivity following layer 33.
(metal level 32)
Contained metal level 32 is by nickel, copper, silver, tin, gold, palladium (palladium), aluminium (aluminium), chromium (chrome), titanium (titanium), zinc and comprises any material in these materials or the metal material of the alloy of the material more than 2 kinds etc. is formed in the conductive member 30.
In addition, as shown in Figure 2, metal level 32 is connected in the external ground member of framework etc., and the current potential of this metal level 32 is held at ground current potential.
And, on metal level 32, be applied with the plating layer 31 of Gold plated Layer, tin coating etc.
(screened film 20)
As shown in Figure 1, use screened film of the present invention 20 that described conductive member 30 comes ground connection stacking gradually the insert layer 22 with following layer 21, metal film layer 24 and coverlay 25 with following layer 23 in the mode of stratification.
(coverlay 25)
Contained coverlay 25 is formed by epoxy system, polyester system, acrylic acid series, phenol (phenol) are, ammonia ester (urethane) is etc. the resin or the mixture of these resins in the screened film 20.
Herein, the round E of portion among Fig. 1 is the part that the conductivity following layer in the conductive member 30 33 is then amplified in the situation of coverlay 25.
Shown in the round E of portion of Fig. 1, when conductive member 30 was connected in screened film 20, the conductivity following layer 33 in the conductive member 30 was connected in the coverlay 25 in the screened film 20.When realizing then, coverlay 25 is softened from the heating of conductive member 30 sides.
In addition, the epoxy that forms coverlay 25 is that resin is formed by resin softening under the heating-up temperature when conductive member 30 is connected in screened film 20, and the softening temperature of this resin is in 100 ℃～140 ℃ scope.
In addition, shown in the round E of portion of Fig. 1, electroconductive particle 35 is present in the inside of the conductivity following layer 33 in the conductive member 30.When screened film 20 was connected with conductive member 30, the part of this electroconductive particle 35 was outstanding from conductivity following layer 33, and the average outstanding length L 2 of the electroconductive particle 35 of this protuberance is set longlyer than the layer thickness L1 of coverlay 25.
(metal film layer 24)
Contained metal film layer 24 has and alleviates from the unnecessary radiation of the signal of telecommunication or from the shield effectiveness of the noise of outside in the screened film 20.
In addition, because the conductive member 30 that is connected in the external ground member is connected in screened film 20 by heating and pressurization, so metal film layer 24 is connected with conductive member 30 via the electroconductive particles 35 in the conductivity following layer 33 of wearing out coverlay 25.Whereby, can be by conductive member 30 with screened film 20 ground connection.
As the metal material that forms this metal film layer 24, can enumerate nickel, copper, silver, tin, gold, palladium, aluminium, chromium, titanium, zinc and comprise any material in these materials or the alloy of the material more than 2 kinds etc.In addition, suitably select the metal material of metal film layer 24 and thickness to get final product according to required shield effectiveness and anti-alternating bending, anti-sliding, but for thickness, the thickness that is made as about 3 μ m～20 μ m get final product.In addition, preferred 6 μ m～15 μ m, more preferably 9 μ m～12 μ m.If thickness less than 3 μ m then can't obtain sufficient transmission characteristic, if thickness surpasses 20 μ m, then bendability becomes problem.In addition, metal film layer 24 can be considered to use metal forming, plating layer etc., but the preferable alloy paper tinsel.
(insert layer 22)
(following layer 21,23)
Contained following layer the 21, the 23rd in the screened film 20, by alkene (olefin) be, ammonia ester system, vinylacetate (vinyl acetate) are, polyester system, polyamide (polyamide) are, rubber system, and the thermoplastic resin of acrylic acid series etc., or phenol system, epoxy system, ammonia ester system, melamine (melamine) are, polyimides (polyimide) is, and alkyd (alkyd) the thermmohardening type resin that is etc. constitute.Can insert layer 22 be followed in flexible flat cable 10 by following layer 21.In addition, can metal film layer 24 be followed in insert layer 22 by following layer 23.
If use screened film 20 with described formation, then comprise coverlay 25 when conductive member 30 being connected in by heating and pressurization, metal film layer 24, and during the screened film 20 of following layer 23, softening because of heating in the screened film 20 by the formed coverlay 25 of resin, and when connecting, the layer thickness L1 of coverlay 25 is thinner than the average outstanding length L 2 of the electroconductive particle 35 that the conductivity following layer in conductive member 30 33 is given prominence to, therefore, because of till pressurization can wear out coverlays 25 in the screened film 20 and arrive metal film layer 24 from the outstanding electroconductive particles 35 of conductivity following layer 33.Whereby, because can make the current potential of the metal film layer 24 in the screened film 20 via electroconductive particle 35 is earthing potential, so need not as in the past, the earthing conductor that is attaching in the substrate of screened film 20 be connected with metal film layer 24 in the screened film 20.Therefore, neither need in advance substrate to be processed the time that earthing conductor is exposed, also can not expend processing cost.In addition, because only conductive member 30 is connected in screened film 20, so even for example when having used the substrate of strip, still can be in the position of expection easily with screened film 20 ground connection.
(flexible flat cable 10)
Then, the flexible flat cable 10 that is attached at the screened film 20 with described formation is described.As shown in Figure 1, flexible flat cable 10 has following formation: on Ranvier's membrane 14, comprise that signal conductor 11 is arranged side by side on Width with a plurality of conductors of earthing conductor 12, and on described a plurality of conductors dielectric film 13 is being set.
Ranvier's membrane 14 forms by engineering plastics (engineering plastic) with dielectric film 13.For example, can enumerate polyethylene terephthalate, polypropylene, crosslinked polyethylene, polyester, polybenzimidazoles (polybenzimidazole), polyimides, polyimides polyamide, Polyetherimide (polyetherimide) and polyphenylene sulfide (Poly Phenylene Sulfide, the PPS) resin of Denging.When not too requiring thermal endurance, preferred cheap polyester film, when requiring anti-flammability, preferred polyphenylene sulfide film, in addition, and when requiring thermal endurance, preferred polyimide film.
In addition, when Ranvier's membrane 14 is engaged with signal conductor 11 and earthing conductor 12, can follow, also can carry out extrusion molding resin by solid.
In addition, as shown in Figure 3, be provided with stiffener 40, the intensity of connector (connector) insertion section of flexible flat cable is improved in the end of flexible flat cable 10.
Flexible flat cable 10 with described formation makes circuit signal become stable by the metal film layer 24 in the screened film 20.And flexible flat cable 10 has effectiveness under the effect of screened film 20.
Moreover, screened film 20 is except can be used for flexible flat cable, also can be used for flexible PCB (Flexible Printed Circuit, FPC), carrying flexible PCB (the Chip On Flexible of chip, COF), RF (flexible printed board), multilayer flexible substrate and hard (rigid) substrate etc., but might not be limited to these substrates.
In addition, as shown in Figure 2, the external ground member of the framework that the earthing conductor 12 of flexible flat cable 10 and conductive member 30 similarly are connected in the electronic equipment of being packed into etc., whereby, earthing conductor 12 reaches identical earthing potential with conductive member 30.And, as mentioned above, can conductive member 30 and screened film 20 be made as same potential via electroconductive particle 35, therefore, can make screened film 20 be identical earthing potential with earthing conductor 12.
(shielding distributing board 1)
Then, the shielding distributing board 1 that is made of screened film 20 and flexible flat cable 10 is described.
As Fig. 1 and shown in Figure 3, shielding distributing board 1 of the present invention has following formation: be attached to by a screened film 20 on the single face or two faces of flexible flat cable 10 (FFC), perhaps be wrapped on two faces of flexible flat cable 10, conductive member 30 is connected in screened film 20.
As mentioned above, because conductive member 30 is connected in screened film 20, so the conductive member 30 of external ground member that can be by being connected in framework etc. makes screened film 20 ground connection.
(earthing method of screened film 20)
Then, use Fig. 4 (a), Fig. 4 (b) to come at length the earthing method of screened film 20 is described.
As Fig. 4 (a), shown in Fig. 4 (b), the earthing method of screened film 20 of the present invention, be to comprise by the formed coverlay 25 of resin, and stack gradually in the earthing method of the screened film 20 of the metal film layer 24 of coverlay 25 and following layer 23, conductive member 30 comprises the metal level that is connected in the external ground member 32 under the contact condition and comprises the conductivity following layer 33 of electroconductive particle 35, so that the softening temperature of resin is come this conductive member 30 heating on one side, pressurization on one side, conductivity following layer 33 and coverlay 25 are followed, whereby, outstanding that the electroconductive particle 35 longer than the layer thickness L1 of coverlay 25 arrives till the metal film layer 24, thus ground connection.
At first, shown in Fig. 4 (a), the conductive member 30 that is held at ground current potential is aimed at screened film 20, and heat from conductive member 30 sides.The heating-up temperature of this moment is made as 100 ℃～140 ℃ the scope that the formed coverlay 25 of resin is softened, and by this heating, coverlay 25 begins to soften.Moreover preferred 120 ℃～135 ℃ of the heating-up temperature of this moment as if 100 ℃ of this heating-up temperature less thaies, then can't obtain fully then.In addition,, then can cause damage (damage) to flexible flat cable 10 if described heating-up temperature surpasses 140 ℃, therefore not good.Then, after coverlay 25 heated, from 20 pressurizations of conductive member 30 side direction screened films, whereby, the conductivity following layer 33 further adherences in the conductive member 30 were in coverlay 25.At this moment, coverlay 25 has adherence because of softening, and enters in the coverlay 25 from conductivity following layer 33 outstanding electroconductive particles 35.Herein, when screened film 20 is connected with conductive member 30, longer from the average outstanding length L 2 of the outstanding electroconductive particle 35 of conductivity following layer 33 than the layer thickness L1 of coverlay, therefore, by further pressurizeing from conductive member 30 sides, electroconductive particle 35 can be worn out coverlay 25 and arrive till the metal film layer 24.
Whereby, shown in Fig. 4 (b), metal level 32 becomes conducting state with metal film layer 24 via electroconductive particle 35, thereby the current potential of metal film layer 24 can be made as earthing potential.
So, according to described earthing method, comprise coverlay 25 when conductive member 30 being connected in by heating and pressurization, during the screened film 20 of metal film layer 24 and following layer 23, softening because of heating in the screened film 20 by the formed coverlay 25 of resin, and when connecting, the layer thickness L1 of coverlay 25 is thinner than the average outstanding length L 2 of the electroconductive particle 35 that the conductivity following layer in conductive member 30 33 is given prominence to, therefore, because of till pressurization can wear out coverlay 25 in the screened film and arrive metal film layer 24 from the outstanding electroconductive particles 35 of conductivity following layer 33.Whereby, because can make the current potential of the metal film layer 24 in the screened film 20 via electroconductive particle 35 is earthing potential, so need not as in the past, the earthing conductor that is attaching in the substrate of screened film 20 be connected with metal film layer 24 in the screened film 20.Therefore, both do not needed in advance substrate to be processed the time that earthing conductor is exposed, and can not expend processing cost yet.In addition, because only conductive member 30 is connected in screened film 20, so even for example when having used the substrate of strip, still can be in the position of expection easily with screened film 20 ground connection.
(manufacture method of screened film 20)
Then, use Fig. 5 to come the manufacture method of screened film 20 is described.
As shown in Figure 5, the manufacture method of the screened film 20 of present embodiment comprises: roll out step, the metal film layer 24 that is wound into web-like is rolled out; Coverlay forms step, forms coverlay 25 on metal film layer 24; Following layer forms step, forms following layer 23 on metal film layer 24; Insert layer forms step, fits insert layer 22 with following layer 21 and forms screened film 20 by following layer 23; And winding step, formed screened film 20 is wound in web-like.
Particularly, at first in rolling out step, the metal film layer 24 that will place (set) web-like on the machine of rolling out 41 rolls out.Then, on one side by next metal film layer 24 channeling conducts (guide) of guide reel (roller), this metal film layer 24 is moved on one side to apparatus for coating 42 to being rolled out.
Then, in coverlay forms step, be that resin etc. is applied on the metal film layer 24 with epoxy by apparatus for coating 42, in drying oven 43 through super-dry, thereby form coverlay 25.Then, once more on one side by the guide reel channeling conduct, to apparatus for coating 44 move on one side.
Then, by apparatus for coating 44 that thermoplastic resin or thermmohardening type is resin-coated to the metal film layer 24 that is formed with coverlay 25 in following layer forms step, in drying oven 45 through super-dry, thereby formation following layer 23.
Then, form in the step in insert layer, the insert layer with following layer 21 22 by make-up machine 46 will be made in advance in addition fits on the metal film layer 24 that is formed with coverlay 25 and following layer 23, thereby makes screened film 20.
At last, by guide reel come screened film 20 channeling conducts to finish on one side, by wrapping machine 47 this screened film 20 is wound in web-like gradually on one side.Whereby, can make the screened film 20 of present embodiment.
More than, an embodiment of the invention are illustrated.Moreover the present invention needn't be defined in described execution mode.
For example, under the situation of present embodiment, the section of electroconductive particle 35 has circular shape, but needn't be defined in this, as long as when connecting, contact with metal level 32, and the average outstanding length L 2 of giving prominence to from conductivity following layer 33 is longer than the layer thickness L1 of coverlay 25, and the section of then described electroconductive particle 35 also can have any shape such as circle (so long as shape oval, that egg shape isogonism has radian gets final product), dendron (dendrite) shape, scale shape, aciculiform shape, chain shape, spike (spike) shape.Moreover, circular.
In addition, in Fig. 4 (a), Fig. 4 (b), conductive member 30 is following formation: comprise 1 electroconductive particle 35 on the thickness direction of conductivity following layer 33, a plurality of these electroconductive particles 35 are arranged on the Width of conductivity following layer 33, but the present invention needn't be defined in this.For example, contained electroconductive particle 35 is not limited to 1 on the thickness direction of conductivity following layer 33, also can a plurality of electroconductive particles 35 be arranged on the thickness direction of conductivity following layer 33 under the contact condition continuously according to the particle footpath of electroconductive particle 35.
In addition, in the manufacture method of the screened film 20 of Fig. 5, the insert layer 22 that will be pre-formed following layer 21 by make-up machine 46 fits in the metal film layer 24 that is formed with coverlay 25 and following layer 23, but needn't be defined in this, also can on the metal film layer 24 that is formed with coverlay 25 and following layer 23, form insert layer 22 and following layer 21 successively.
More than, example of the present invention is illustrated, but only concrete example has been carried out illustration, do not limit the present invention especially, can suitably design and change concrete formation etc.In addition, effect described in the working of an invention mode and effect have only been enumerated the best use of and the effect that is produced by the present invention, and effect of the present invention and effect are not limited to effect described in the embodiments of the present invention and effect.
The present invention can be used in employed screened film on the substrate with electric conductor of flexible flat cable etc. and have the shielding distributing board of screened film.
The above, it only is preferred embodiment of the present invention, be not that the present invention is done any pro forma restriction, though the present invention discloses as above with preferred embodiment, yet be not in order to limit the present invention, any those skilled in the art, in not breaking away from the technical solution of the present invention scope, when the structure that can utilize above-mentioned announcement and technology contents are made a little change or be modified to the equivalent embodiment of equivalent variations, but every content that does not break away from technical solution of the present invention, according to technical spirit of the present invention to any simple modification that above embodiment did, equivalent variations and modification all still belong in the scope of technical solution of the present invention.
Claims (5)
1. screened film is connected in conductive member by heating and pressurization, this conductive member comprise under the contact condition in order to metal level that is connected with the external ground member and the conductivity following layer that comprises electroconductive particle, this screened film is characterised in that and comprises:
Coverlay, by being formed because of the softening resin of described heating, after described heating and pressurization connect, form than the average outstanding thinner layer thickness of length from the outstanding described electroconductive particle of described conductivity following layer, and then in described conductivity following layer; And
Stack gradually metal film layer and following layer in described coverlay.
2. screened film according to claim 1, wherein:
Insert layer is further then arranged on described following layer,
By with described insert layer then in substrate with electric conductor, the impedance of substrate with this electric conductor is controlled.
3. screened film according to claim 2, wherein:
Described substrate is a flexible flat cable.
4. one kind shields distributing board, comprising:
Substrate with electric conductor; And
According to each described screened film in the claim 1 to 3.
5. the earthing method of a screened film, this screened film comprise by the formed coverlay of resin and stack gradually metal film layer and following layer in described coverlay that the earthing method of this screened film is characterised in that:
Conductive member comprises metal level that is connected with the external ground member under the contact condition and the conductivity following layer that comprises electroconductive particle, so that the softening temperature of described resin is come described conductive member while heating, pressurizeing, described conductivity following layer and described coverlay are followed, whereby, outstanding that the described electroconductive particle longer than the layer thickness of described coverlay arrives till the described metal film layer, thus ground connection.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009217650A JP2011066329A (en) | 2009-09-18 | 2009-09-18 | Shield film, shielded wiring board including the same, ground connection method in the shield film |
| JP2009-217650 | 2009-09-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102026529A true CN102026529A (en) | 2011-04-20 |
Family
ID=43867162
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010102873339A Pending CN102026529A (en) | 2009-09-18 | 2010-09-16 | Shielding film, shielding distribution board having the same and grounding method thereof |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2011066329A (en) |
| CN (1) | CN102026529A (en) |
| TW (1) | TWI610614B (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102387656A (en) * | 2010-08-30 | 2012-03-21 | 富葵精密组件(深圳)有限公司 | Circuit board with grounding shield structure and manufacturing method thereof |
| CN103763893A (en) * | 2014-01-14 | 2014-04-30 | 广州方邦电子有限公司 | Electromagnetic wave shielding film and method for manufacturing circuit board with same |
| CN104332217A (en) * | 2014-10-08 | 2015-02-04 | 广州方邦电子有限公司 | Free ground film and manufacturing method thereof, and shielding circuit board including free ground film and ground method thereof |
| CN104429173A (en) * | 2012-07-13 | 2015-03-18 | 大自达电线股份有限公司 | Shield film and shield printed wiring board |
| CN104658650A (en) * | 2015-01-23 | 2015-05-27 | 亳州联滔电子有限公司 | Flat cable |
| CN105101762A (en) * | 2014-05-06 | 2015-11-25 | 昆山雅森电子材料科技有限公司 | Thin high-transmission electromagnetic interference shielding film, and manufacturing method and applications thereof |
| CN116669410A (en) * | 2023-07-03 | 2023-08-29 | 广州方邦电子股份有限公司 | Electromagnetic shield cover and circuit board |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2013077108A1 (en) | 2011-11-24 | 2015-04-27 | タツタ電線株式会社 | Shield film, shield printed wiring board, and method of manufacturing shield film |
| WO2013183632A1 (en) * | 2012-06-07 | 2013-12-12 | タツタ電線株式会社 | Shield film and shield printed wiring board |
| TWI578893B (en) * | 2014-07-17 | 2017-04-11 | T-Kingdom Co Ltd | Shielding film and manufacturing method thereof |
| JP6187568B2 (en) * | 2015-09-17 | 2017-08-30 | 東洋インキＳｃホールディングス株式会社 | Laminated body for electromagnetic wave shield, electromagnetic wave shield laminated body, electronic device and manufacturing method thereof |
| CN105304219A (en) * | 2015-11-20 | 2016-02-03 | 苏州沃尔非自动化设备有限公司 | Lamination auxiliary tool having heating effect |
| JP6946437B2 (en) * | 2017-08-09 | 2021-10-06 | タツタ電線株式会社 | Manufacturing method of connection film and shield printed wiring board, and shield printed wiring board |
| CN110691501A (en) * | 2018-07-06 | 2020-01-14 | 广州方邦电子股份有限公司 | Electromagnetic shielding film, circuit board and preparation method of electromagnetic shielding film |
| JP7268446B2 (en) * | 2019-03-29 | 2023-05-08 | 東洋インキＳｃホールディングス株式会社 | Electromagnetic wave shielding sheet, electromagnetic wave shielding printed circuit board and electronic equipment |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1360464A (en) * | 2000-12-14 | 2002-07-24 | 株式会社电装 | Method for mfg. multilayer matrix and multilayer matrix made thereby |
| JP2003086907A (en) * | 2001-06-29 | 2003-03-20 | Tatsuta Electric Wire & Cable Co Ltd | Shielded flexible printed wiring board |
| JP2007299704A (en) * | 2006-05-02 | 2007-11-15 | Hitachi Cable Ltd | Shielded flat cable |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4445858B2 (en) * | 2002-08-08 | 2010-04-07 | 大日本印刷株式会社 | Electromagnetic wave shielding sheet |
-
2009
- 2009-09-18 JP JP2009217650A patent/JP2011066329A/en active Pending
-
2010
- 2010-09-13 TW TW099130909A patent/TWI610614B/en active
- 2010-09-16 CN CN2010102873339A patent/CN102026529A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1360464A (en) * | 2000-12-14 | 2002-07-24 | 株式会社电装 | Method for mfg. multilayer matrix and multilayer matrix made thereby |
| JP2003086907A (en) * | 2001-06-29 | 2003-03-20 | Tatsuta Electric Wire & Cable Co Ltd | Shielded flexible printed wiring board |
| JP2007299704A (en) * | 2006-05-02 | 2007-11-15 | Hitachi Cable Ltd | Shielded flat cable |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102387656B (en) * | 2010-08-30 | 2013-10-09 | 富葵精密组件(深圳)有限公司 | Circuit board with grounding shield structure and manufacturing method thereof |
| US8648261B2 (en) | 2010-08-30 | 2014-02-11 | Fukui Precision Component (Shenzhen) Co., Ltd. | Printed circuit board |
| CN102387656A (en) * | 2010-08-30 | 2012-03-21 | 富葵精密组件(深圳)有限公司 | Circuit board with grounding shield structure and manufacturing method thereof |
| CN104429173A (en) * | 2012-07-13 | 2015-03-18 | 大自达电线股份有限公司 | Shield film and shield printed wiring board |
| CN103763893B (en) * | 2014-01-14 | 2016-04-13 | 广州方邦电子股份有限公司 | Electromagnetic shielding film and comprise the manufacture method of wiring board of screened film |
| CN103763893A (en) * | 2014-01-14 | 2014-04-30 | 广州方邦电子有限公司 | Electromagnetic wave shielding film and method for manufacturing circuit board with same |
| CN105101762B (en) * | 2014-05-06 | 2018-08-07 | 昆山雅森电子材料科技有限公司 | It is thinned high-transmission emi shielding film and its manufacturing method and application |
| CN105101762A (en) * | 2014-05-06 | 2015-11-25 | 昆山雅森电子材料科技有限公司 | Thin high-transmission electromagnetic interference shielding film, and manufacturing method and applications thereof |
| WO2016054864A1 (en) * | 2014-10-08 | 2016-04-14 | 广州方邦电子有限公司 | Free grounding film and manufacturing method therefor, and shielding circuit board including free grounding film and grounding method |
| CN104332217A (en) * | 2014-10-08 | 2015-02-04 | 广州方邦电子有限公司 | Free ground film and manufacturing method thereof, and shielding circuit board including free ground film and ground method thereof |
| US10159141B2 (en) | 2014-10-08 | 2018-12-18 | Guangzhou Fang Bang Electronics Co., Ltd. | Free grounding film and manufacturing method therefor, and shielding circuit board including free grounding film and grounding method |
| CN104658650A (en) * | 2015-01-23 | 2015-05-27 | 亳州联滔电子有限公司 | Flat cable |
| CN116669410A (en) * | 2023-07-03 | 2023-08-29 | 广州方邦电子股份有限公司 | Electromagnetic shield cover and circuit board |
| CN116669410B (en) * | 2023-07-03 | 2024-02-20 | 广州方邦电子股份有限公司 | Electromagnetic shield cover and circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI610614B (en) | 2018-01-01 |
| JP2011066329A (en) | 2011-03-31 |
| TW201112941A (en) | 2011-04-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102026529A (en) | Shielding film, shielding distribution board having the same and grounding method thereof | |
| CN108323144B (en) | Electromagnetic shielding film, circuit board and preparation method of electromagnetic shielding film | |
| TWI409985B (en) | Flat cable | |
| KR101553282B1 (en) | Shield film for printed wiring board, and printed wiring board | |
| CN108323143B (en) | Electromagnetic shielding film, circuit board and preparation method of electromagnetic shielding film | |
| CN104350816A (en) | Shield film and shield printed wiring board | |
| CN103140126A (en) | Shield film, shielded printed wiring board, and method for manufacturing shield film | |
| WO2007133405A2 (en) | Shielded flexible circuits and methods for manufacturing same | |
| CN204014251U (en) | Shape keeps film and possesses the shape maintenance flexible PCB that this shape keeps film | |
| CN202076032U (en) | Shielding flat electric cable | |
| JP2003086907A (en) | Shielded flexible printed wiring board | |
| CN110268812A (en) | Electromagnetic shielding film and the shielding printed wiring board for having the electromagnetic shielding film | |
| CN201773632U (en) | Flat cable | |
| WO2012026165A1 (en) | Conductive rubber component and method for mounting same | |
| CN102280224A (en) | Manufacturing method of shielding flat cable and shielding belt used in the manufacturing method | |
| KR100899107B1 (en) | Flexible flat cable | |
| CN208754630U (en) | Electromagnetic shielding film and wiring board | |
| CN109585068B (en) | Long straight high-frequency transmission cable | |
| CN112309617B (en) | Flexible flat cable, manufacturing method thereof and signal transmission device | |
| CN110691503B (en) | Electromagnetic shielding film, circuit board and preparation method of electromagnetic shielding film | |
| JP2012054096A (en) | Flat cable | |
| JP6677938B2 (en) | Laminated film, electromagnetic wave shielding gasket, shielded cable | |
| CN216957549U (en) | FFC high frequency transmission line structure | |
| KR101217099B1 (en) | Flexible flat cable | |
| CN110769676B (en) | Electromagnetic shielding film, circuit board and preparation method of electromagnetic shielding film |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| REG | Reference to a national code |
Ref country code: HK Ref legal event code: DE Ref document number: 1156464 Country of ref document: HK |
|
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20110420 |
|
| REG | Reference to a national code |
Ref country code: HK Ref legal event code: WD Ref document number: 1156464 Country of ref document: HK |