WO2009019963A1 - Shield film for printed wiring board, and printed wiring board - Google Patents

Shield film for printed wiring board, and printed wiring board

Info

Publication number
WO2009019963A1
WO2009019963A1 PCT/JP2008/062844 JP2008062844W WO2009019963A1 WO 2009019963 A1 WO2009019963 A1 WO 2009019963A1 JP 2008062844 W JP2008062844 W JP 2008062844W WO 2009019963 A1 WO2009019963 A1 WO 2009019963A1
Authority
WO
Grant status
Application
Patent type
Prior art keywords
board
film
printed
wiring
layer
Prior art date
Application number
PCT/JP2008/062844
Other languages
French (fr)
Japanese (ja)
Inventor
Masayuki Totouge
Kenji Kamino
Syohei Morimoto
Yoshinori Kawakami
Original Assignee
Tatsuta System Electronics Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0216Reduction of cross-talk, and noise or electromagnetic interference
    • H05K1/0218Reduction of cross-talk, and noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073Shielding materials
    • H05K9/0081Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0084Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0393Flexible materials
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07Electric details
    • H05K2201/0707Shielding
    • H05K2201/0715Shielding provided by an outer layer of PCB
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • H05K3/281Applying non-metallic protective coatings by means of a preformed insulating foil

Abstract

Provided are a shield film for a printed wiring board, and a printed wiring board. In the shield film, a metal layer is not easily broken due to repeated bending and sliding, ranging from a large bending radius to a small bending radius (1.0mm). A shield film (10) for a printed wiring board is provided with a metal layer (2) formed on one surface of an insulating layer (1). The arithmetic average roughness (JIS B 0601 (year of 1994)) of the one surface of the insulating layer (1) is 0.5-5.0μm, and a metal layer (2) is formed in a corrugated structure along the one surface of the insulating layer (1). The printed wiring board is provided by attaching the shield film (10) to a base film.
PCT/JP2008/062844 2007-08-03 2008-07-16 Shield film for printed wiring board, and printed wiring board WO2009019963A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2007-202709 2007-08-03
JP2007202709A JP4974803B2 (en) 2007-08-03 2007-08-03 Printed circuit board for shielding film and the printed wiring board

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR20107004573A KR101510173B1 (en) 2007-08-03 2008-07-16 Shield film for printed wiring board, and printed wiring board
KR20147017354A KR101561132B1 (en) 2007-08-03 2008-07-16 Shield film for printed wiring board, and printed wiring board
CN 200880101719 CN101772996B (en) 2007-08-03 2008-07-16 Shielding film for printed wiring board and printed wiring board
KR20147027932A KR101553282B1 (en) 2007-08-03 2008-07-16 Shield film for printed wiring board, and printed wiring board

Publications (1)

Publication Number Publication Date
WO2009019963A1 true true WO2009019963A1 (en) 2009-02-12

Family

ID=40341200

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/062844 WO2009019963A1 (en) 2007-08-03 2008-07-16 Shield film for printed wiring board, and printed wiring board

Country Status (4)

Country Link
JP (1) JP4974803B2 (en)
KR (3) KR101561132B1 (en)
CN (1) CN101772996B (en)
WO (1) WO2009019963A1 (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010100931A1 (en) * 2009-03-06 2010-09-10 信越ポリマー株式会社 Coverlay film, method for manufacturing coverlay film, and flexible printed wiring board
US20110247863A1 (en) * 2010-04-07 2011-10-13 Fujikura Ltd. Flexible printed board and method of manufacturing same
US20110284268A1 (en) * 2010-05-20 2011-11-24 3M Innovative Properties Company Flexible circuit coverfilm adhesion enhancement
JP2014109445A (en) * 2012-11-30 2014-06-12 National Institute Of Advanced Industrial & Technology Flexible power sensor
JPWO2013077108A1 (en) * 2011-11-24 2015-04-27 タツタ電線株式会社 Shielding film, shielded printed circuit board, and method for producing a shielding film
JP2015088658A (en) * 2013-10-31 2015-05-07 積水ナノコートテクノロジー株式会社 Sheet-like electromagnetic wave shield material
WO2015186624A1 (en) * 2014-06-02 2015-12-10 タツタ電線株式会社 Electroconductive adhesive film, printed circuit board, and electronic device

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5940279B2 (en) * 2011-10-27 2016-06-29 藤森工業株式会社 Method of manufacturing a Fpc for an electromagnetic wave shielding material
CN103167788B (en) * 2011-12-08 2015-10-28 财团法人工业技术研究院 An electromagnetic wave shielding film composite having a composite film of the flexible printed circuit board
CN104350816A (en) * 2012-06-07 2015-02-11 大自达电线股份有限公司 Shield film and shield printed wiring board
CN102711428B (en) * 2012-06-21 2015-11-18 广州方邦电子有限公司 Ultrathin high shielding effectiveness of the shielding film and its production method
US20150373835A1 (en) * 2012-12-20 2015-12-24 Tatsuta Electric Wire & Cable Co., Ltd. Method for manufacturing shield printed wiring board, and shield film and shield printed wiring board
US9820376B2 (en) * 2013-05-28 2017-11-14 Tatsuta Electric Wire & Cable Co., Ltd. Shape-retaining film, and shape-retaining-type flexible circuit board provided with same shape-retaining film
CN105101761A (en) * 2014-05-06 2015-11-25 昆山雅森电子材料科技有限公司 High-transmission thin electromagnetic interference shielding film, and manufacturing method and applications thereof
JPWO2016088381A1 (en) * 2014-12-05 2017-09-14 タツタ電線株式会社 Electromagnetic wave shielding film
CN106393882A (en) * 2016-08-30 2017-02-15 联泓(江苏)新材料研究院有限公司 Electromagnetic radiation-resistant insulating functional film and production method thereof

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000269632A (en) * 1999-03-17 2000-09-29 Tatsuta Electric Wire & Cable Co Ltd Shield flexible printed wiring board, manufacture thereof and reinforcing shield film therefor
JP2005327853A (en) * 2004-05-13 2005-11-24 Shin Etsu Polymer Co Ltd Electromagnetic wave noise suppressor and its manufacturing method
JP2006100541A (en) * 2004-09-29 2006-04-13 Toshiba Corp Shield type flexible circuit board
JP2006297714A (en) * 2005-04-19 2006-11-02 Seiren Co Ltd Metal thin film sheet for transfer

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JPS62256489A (en) * 1986-04-30 1987-11-09 Hitachi Ltd Semiconductor laser device
JPH0571199B2 (en) * 1987-06-05 1993-10-06 Riken Kk
JP2970297B2 (en) * 1993-02-26 1999-11-02 三菱マテリアル株式会社 The high-resistance magnetic shield material
JPH07202481A (en) * 1993-12-28 1995-08-04 Mitsubishi Materials Corp Method for manufacturing magnetic shield material
JPH0883994A (en) * 1994-07-11 1996-03-26 Nippon Paint Co Ltd Wideband electromagnetic-wave-absorbing material
JPH09116293A (en) * 1995-10-23 1997-05-02 Nippon Plast Kogyo Kk Electromagnetic wave shielding material, its manufacture, and its application method
JP3706440B2 (en) * 1996-08-30 2005-10-12 三洋電機株式会社 The motor drive circuit
JPH10173392A (en) * 1996-12-09 1998-06-26 Daido Steel Co Ltd Electromagnetic wave shielding sheet
JP4201548B2 (en) * 2002-07-08 2008-12-24 タツタ電線株式会社 Shielding film, the shield flexible printed wiring board and a process for their preparation
JP2005277262A (en) * 2004-03-26 2005-10-06 Toray Ind Inc Electromagnetic wave shield film
JP2006060008A (en) * 2004-08-20 2006-03-02 Tdk Corp Sheet-like composite magnetic substance and sheet article
JP4611700B2 (en) * 2004-09-24 2011-01-12 信越ポリマー株式会社 Electromagnetic noise suppression sheet and methods of use thereof

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000269632A (en) * 1999-03-17 2000-09-29 Tatsuta Electric Wire & Cable Co Ltd Shield flexible printed wiring board, manufacture thereof and reinforcing shield film therefor
JP2005327853A (en) * 2004-05-13 2005-11-24 Shin Etsu Polymer Co Ltd Electromagnetic wave noise suppressor and its manufacturing method
JP2006100541A (en) * 2004-09-29 2006-04-13 Toshiba Corp Shield type flexible circuit board
JP2006297714A (en) * 2005-04-19 2006-11-02 Seiren Co Ltd Metal thin film sheet for transfer

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102342187A (en) * 2009-03-06 2012-02-01 信越聚合物株式会社 Coverlay film, method for manufacturing coverlay film, and flexible printed wiring board
JP2010212300A (en) * 2009-03-06 2010-09-24 Shin Etsu Polymer Co Ltd Coverlay film, method for manufacturing the coverlay film and flexible printed wiring board
US9018533B2 (en) 2009-03-06 2015-04-28 Shin-Etsu Polymer Co., Ltd. Coverlay film, method for manufacturing coverlay film, and flexible printed wiring board
KR101242919B1 (en) 2009-03-06 2013-03-12 신에츠 폴리머 가부시키가이샤 Coverlay film, method for manufacturing coverlay film, and flexible printed wiring board
WO2010100931A1 (en) * 2009-03-06 2010-09-10 信越ポリマー株式会社 Coverlay film, method for manufacturing coverlay film, and flexible printed wiring board
US8809687B2 (en) * 2010-04-07 2014-08-19 Fujikura Ltd. Flexible printed board and method of manufacturing same
US20110247863A1 (en) * 2010-04-07 2011-10-13 Fujikura Ltd. Flexible printed board and method of manufacturing same
CN102907184A (en) * 2010-05-20 2013-01-30 3M创新有限公司 Flexible circuit coverfilm adhesion enhancement
US20110284268A1 (en) * 2010-05-20 2011-11-24 3M Innovative Properties Company Flexible circuit coverfilm adhesion enhancement
JPWO2013077108A1 (en) * 2011-11-24 2015-04-27 タツタ電線株式会社 Shielding film, shielded printed circuit board, and method for producing a shielding film
JP2014109445A (en) * 2012-11-30 2014-06-12 National Institute Of Advanced Industrial & Technology Flexible power sensor
JP2015088658A (en) * 2013-10-31 2015-05-07 積水ナノコートテクノロジー株式会社 Sheet-like electromagnetic wave shield material
WO2015186624A1 (en) * 2014-06-02 2015-12-10 タツタ電線株式会社 Electroconductive adhesive film, printed circuit board, and electronic device

Also Published As

Publication number Publication date Type
KR101553282B1 (en) 2015-09-15 grant
JP2009038278A (en) 2009-02-19 application
JP4974803B2 (en) 2012-07-11 grant
KR20100051699A (en) 2010-05-17 application
KR20140125458A (en) 2014-10-28 application
KR20140093738A (en) 2014-07-28 application
KR101510173B1 (en) 2015-04-08 grant
KR101561132B1 (en) 2015-10-19 grant
CN101772996A (en) 2010-07-07 application
CN101772996B (en) 2012-11-28 grant

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