CN203661415U - Soft circuit board and hard circuit board combination device and mobile phone camera module - Google Patents

Soft circuit board and hard circuit board combination device and mobile phone camera module Download PDF

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Publication number
CN203661415U
CN203661415U CN201320868107.9U CN201320868107U CN203661415U CN 203661415 U CN203661415 U CN 203661415U CN 201320868107 U CN201320868107 U CN 201320868107U CN 203661415 U CN203661415 U CN 203661415U
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CN
China
Prior art keywords
circuit board
hardboard
soft
via hole
hard
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201320868107.9U
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Chinese (zh)
Inventor
郑凯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nanchang OFilm Tech Co Ltd
Suzhou OFilm Tech Co Ltd
Nanchang OFilm Optoelectronics Technology Co Ltd
OFilm Group Co Ltd
Original Assignee
Nanchang OFilm Tech Co Ltd
Suzhou OFilm Tech Co Ltd
Nanchang OFilm Optoelectronics Technology Co Ltd
Shenzhen OFilm Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nanchang OFilm Tech Co Ltd, Suzhou OFilm Tech Co Ltd, Nanchang OFilm Optoelectronics Technology Co Ltd, Shenzhen OFilm Tech Co Ltd filed Critical Nanchang OFilm Tech Co Ltd
Priority to CN201320868107.9U priority Critical patent/CN203661415U/en
Application granted granted Critical
Publication of CN203661415U publication Critical patent/CN203661415U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model provides a soft circuit board and hard circuit board combination device and a mobile phone camera module. The soft circuit board and hard circuit board combination device comprises a first combination part, a second combination part and a circuit board soft board; the circuit board soft board is connected with the first combination part and the second combination part; the circuit board soft board is provided with an upper surface and a lower surface; a first hard board body is combined on the upper surface of the circuit board soft board via bonding material inside a first hard board passing hole; a second hard board body is combined on the lower surface of the circuit board soft board via bonding material inside a second hard board passing hole; the second combination part comprises a third hard board body and a third hard board passing hole arranged inside the third hard board body; a third hard board body is combined on the lower surface of the circuit board soft board via bonding material inside a third hard board passing hole; and the upper surface, corresponding to the position of the third hard board body, of the circuit board soft board is electrically connected with a connector.

Description

Hard circuit board coupling apparatus and mobile phone camera module
Technical field
The utility model relates to hard circuit board coupling apparatus, relates in particular to a kind of hard circuit board coupling apparatus of mobile phone camera module.
Background technology
In order to improve the flexibility connecting between element, in the electronic product such as digital camera, mobile phone such as, conventionally replace original hardboard with hard circuit board coupling apparatus and come connection lens module and connector.Existing mobile phone camera module as Figure 1-Figure 4, it comprises camera lens module 100, connector 300 and for by the hard circuit board coupling apparatus 200 of the two connection.As shown in Figure 4, hard circuit board assembly 200 comprises two-layer soft board 210 and the two-layer hardboard 220 that is positioned at soft board 210 upper and lower surfaces.Hardboard 220 is provided with multiple via holes 230, and the interior filling of via hole 230 or be electroplate with grafting material, as tin, copper, nickel, by hardboard 220 and soft board 210 combinations, and makes the two electrical connection by grafting material.
In the time that manufacture has the mobile phone camera module of above-mentioned hard circuit board coupling apparatus, need form respectively the hard circuit board coupling apparatus 200 of four layers corresponding to camera lens module 100 and connector 300, and need to form multiple via holes, to realize electrical connection by the grafting material of filling or electroplating in via hole.Therefore cause technique loaded down with trivial details, and make the layout complexity on circuit board, also cause electromagnetic interference influence larger.
Utility model content
Based on the problems referred to above, the utility model provides a kind of hard circuit board coupling apparatus and mobile phone camera module, to simplify the manufacturing process of mobile phone camera module, reduces electromagnetic interference.
For reaching above-mentioned purpose, the utility model provides a kind of hard circuit board coupling apparatus, comprise: the first joint portion, it comprises the first hardboard body, the second hardboard body, is opened in intrinsic the first hardboard via hole of the first hardboard and is opened in intrinsic the second hardboard via hole of the second hardboard; The second joint portion; And soft circuit board, it connects the first joint portion and the second joint portion, and soft circuit board has upper surface and lower surface, the first hardboard body is incorporated into the upper surface of soft circuit board by the grafting material in the first hardboard via hole, the second hardboard body is incorporated into the lower surface of soft circuit board by the grafting material in the second hardboard via hole; It is characterized in that, the second joint portion comprises the 3rd hardboard body and is opened in intrinsic the 3rd hardboard via hole of the 3rd hardboard, the 3rd hardboard body is incorporated into the lower surface of soft circuit board by the grafting material in the 3rd hardboard via hole, the upper surface corresponding to the 3rd hardboard body position of soft circuit board is directly electrically connected a connector.
According to above-mentioned execution mode, the first binding site is in one end of hard circuit board coupling apparatus, and the second binding site is in the other end of hard circuit board coupling apparatus.
According to above-mentioned execution mode, the 3rd hardboard body comprises the insulating barrier, conductive layer and the ink layer that stack gradually, and insulating barrier is incorporated into the lower surface of soft circuit board.
According to above-mentioned execution mode, in insulating barrier and ink layer, be equipped with the 3rd hardboard via hole.
According to above-mentioned execution mode, soft circuit board is provided with soft board via hole, and it aligns with the 3rd hardboard via hole, and the 3rd hardboard body is incorporated into the lower surface of soft circuit board by the grafting material in soft board via hole and the 3rd hardboard via hole.
According to above-mentioned execution mode, the second joint portion also comprises supporting bracket, and it is fixed on the lower surface of the 3rd hardboard body.
The utility model also provides a kind of mobile phone camera module, it comprises camera lens module and connector, also comprise above-mentioned hard circuit board coupling apparatus, camera lens module is connected in the first joint portion, and connector is directly arranged at the upper surface corresponding to the 3rd hardboard body position of soft circuit board.
According to above-mentioned execution mode, connector is welded in the upper surface corresponding to the 3rd hardboard body position.
The utility model is compared to the beneficial effect of prior art: the connector of mobile phone camera module is set directly at a side of soft circuit board, must respectively arrange compared with the hard circuit board coupling apparatus of a layer circuit board hardboard at soft circuit board upper and lower sides with existing, the utility model only need to form circuit board hardboard in a side of the connection connector of soft circuit board, omit the circuit board hardboard of opposite side, thereby can simplify the manufacturing process of hard circuit board coupling apparatus, reduce number of vias, simplify the layout on circuit board, reduce the electromagnetic interference that number of vias causes more.
Brief description of the drawings
Fig. 1 is the front view of the mobile phone camera module of prior art.
Fig. 2 is the end view of the mobile phone camera module of prior art.
Fig. 3 is the schematic diagram of the mobile phone camera module of prior art, wherein not shown camera lens module.
Fig. 4 is the partial sectional view that existing hard circuit board coupling apparatus is shown.
Fig. 5 is the partial sectional view of the hard circuit board coupling apparatus of an embodiment of the present utility model.
Fig. 6 is the partial sectional view of the hard circuit board coupling apparatus of another embodiment of the present utility model.
Fig. 7 is the end view of mobile phone camera module of the present utility model.
Embodiment
Referring now to accompanying drawing, example embodiment is more fully described.But example embodiment can be implemented in a variety of forms, and should not be understood to be limited to execution mode set forth herein; On the contrary, provide these execution modes to make the utility model more comprehensively with complete, and the design of example embodiment is conveyed to those skilled in the art all sidedly.In the drawings, for clear, may exaggerate the thickness of region and layer.Identical in the drawings Reference numeral represents same or similar structure, thereby will omit their detailed description.
In addition, described feature, structure or characteristic can be combined in one or more embodiment in any suitable manner.In the following description, thus provide many details to provide fully understanding embodiment of the present utility model.But, one of skill in the art will appreciate that and can put into practice the technical solution of the utility model and there is no one or more in described specific detail, or can adopt other method, constituent element, material etc.In other cases, be not shown specifically or describe known features, material or operation to avoid fuzzy major technique intention of the present utility model.
Shown in Fig. 5, the utility model provides a kind of hard circuit board coupling apparatus 200, and it comprises: the first joint portion 10, the second joint portion 20 and soft circuit board 30.
The first joint portion 10 comprises the first hardboard body 11, the second hardboard body 12, is opened in the first hardboard via hole H1 in the first hardboard body 11 and is opened in the second hardboard via hole H2 in the second hardboard body 12.Herein, the first hardboard body 11 and the second hardboard body 12 are rigid printed circuit board (printed circuit board, PCB).
Soft circuit board 30 is flexible PCB (flexible printed circuit, and connect the first joint portion 10 and the second joint portion 20 FPC), described soft circuit board 30 has upper surface 31 and lower surface 32, upper surface 31, the second hardboard bodies 12 that the first hardboard body 11 is incorporated into soft circuit board by the grafting material 40 in the first hardboard via hole H1 are incorporated into the lower surface 32 of soft circuit board 30 by the grafting material 40 in the second hardboard via hole H2.
The second joint portion 20 comprises the 3rd hardboard body 21 and is opened in the 3rd hardboard via hole H3 in the 3rd hardboard body 21, and the 3rd hardboard body 21 is also rigid printed circuit board.Described the 3rd hardboard body 21 is incorporated into the lower surface 32 of soft circuit board 30 by the grafting material 40 in the 3rd hardboard via hole H3, the upper surface 31 corresponding to the 3rd hardboard body 21 positions of soft circuit board 30 is directly electrically connected a connector 300, specifically, the surface of soft circuit board 30 is provided with the pad (not shown) welding together with connector 300, and the pin of connector 300 and pad weld together the electric connection that realizes connector and soft circuit board 300.
The connector 300 of mobile phone camera module is set directly at the upper surface 31 of soft circuit board 30, must respectively arrange compared with the hard circuit board coupling apparatus of a layer circuit board hardboard in soft circuit board upper and lower surface with existing, the utility model only need to form circuit board hardboard in a side of one end of the connection connector of soft circuit board, omit the circuit board hardboard of opposite side, thereby can simplify the manufacturing process of hard circuit board coupling apparatus, reduce number of vias, simplify the layout on circuit board, reduce the electromagnetic interference that number of vias causes more.
And, because the weight of connector own is less, even if therefore omit a layer circuit board hardboard, can not affect the support effect for connector, therefore still can guarantee the stability of mobile phone camera module yet.
In the present embodiment, the first joint portion 10 is positioned at one end of hard circuit board coupling apparatus 200, and the second joint portion 20 is positioned at the other end of hard circuit board coupling apparatus 200.
In the present embodiment, the 3rd hardboard body 21 comprises the insulating barrier 211, conductive layer 212 and the ink layer 213 that stack gradually, and insulating barrier 211 is incorporated into the lower surface 32 of soft circuit board 30.Wherein, the material of insulating barrier 211 can be resin, and the material of conductive layer 212 can be copper.
In embodiment as shown in Figure 5, be equipped with the 3rd hardboard via hole H3 in insulating barrier 211 and ink layer 213, the grafting material 40 of filled conductive in the 3rd hardboard via hole H3, to engage and to be electrically connected with adjacent layer.
In another embodiment as shown in Figure 6, be provided with the 3rd hardboard via hole H3 running through at whole the 3rd hardboard body 21, soft circuit board 30 is provided with soft board via hole H4, and soft board via hole H4 aligns with the 3rd hardboard via hole H3, the grafting material of equal filled conductive in the 3rd hardboard via hole H3 and soft board via hole H4, make the 3rd hardboard body 21 be incorporated into the lower surface of soft circuit board 30, and be electrically connected with it.
Preferably, as shown in Figure 6, the second joint portion 20 also comprises supporting bracket 23, and it is fixed on the lower surface of the 3rd hardboard body 21.Supporting bracket 23 can be steel plate, and it can be fixed on by conducting resinl the lower surface of the 3rd hardboard body 21.Supporting bracket 23 can supplemental support connector 300, further improves stability, and because steel plate is by conducting resinl and the second joint portion 20 combinations, this steel plate can also play ground connection effect, derives the static of the second joint portion, reduces the interference of static to signal.
As shown in Figure 7, the utility model provides a kind of mobile phone camera module, and it comprises camera lens module 100, connector 300 and above-mentioned hard circuit board coupling apparatus 200.
Hard circuit board coupling apparatus 200 is electrically connected camera lens module 100 and connector 300, and connector 300 is directly arranged at the upper surface 31 corresponding to the 3rd hardboard body position of soft circuit board, for example, be welded in upper surface 31.Camera lens module 100 is connected in the first joint portion 10, the structure of the first joint portion 10 is identical with the structure of existing hard circuit board coupling apparatus, and it comprises the first hardboard body 11, the second hardboard body 12, the second hardboard via hole H2 that is located at the first hardboard via hole H1 of the first hardboard body 11 and is located at the second hardboard body 12.Upper surface 31, the second hardboard bodies 12 that the first hardboard body 11 is incorporated into soft circuit board by the grafting material 40 in the first hardboard via hole H1 are incorporated into the lower surface 32 of soft circuit board by the grafting material 40 in the second hardboard via hole H2.Camera lens module 100 can be connected in the second hardboard body 12.
The connector 300 of mobile phone camera module is set directly at the upper surface 31 of soft circuit board 30, must respectively arrange compared with the hard circuit board coupling apparatus of a layer circuit board hardboard in soft circuit board upper and lower surface with existing, the utility model only need to form circuit board hardboard in a side of one end of the connection connector of soft circuit board, omit the circuit board hardboard of opposite side, thereby can simplify the manufacturing process of hard circuit board coupling apparatus, reduce number of vias, simplify the layout on circuit board, reduce the electromagnetic interference that number of vias causes more.
Although described the utility model with reference to several exemplary embodiments, should be appreciated that term used is explanation and exemplary and nonrestrictive term.Because the utility model can specifically be implemented in a variety of forms and not depart from spirit or the essence of utility model, so be to be understood that, above-described embodiment is not limited to any aforesaid details, and explain widely in the spirit and scope that should limit in the claim of enclosing, therefore fall into whole variations in claim or its equivalent scope and remodeling and all should be the claim of enclosing and contain.

Claims (8)

1. a hard circuit board coupling apparatus, comprising:
The first joint portion, it comprises the first hardboard body, the second hardboard body, is opened in intrinsic the first hardboard via hole of the first hardboard and is opened in intrinsic the second hardboard via hole of the second hardboard;
The second joint portion; And
Soft circuit board, it connects the first joint portion and the second joint portion, and soft circuit board has upper surface and lower surface, the first hardboard body is incorporated into the upper surface of soft circuit board by the grafting material in the first hardboard via hole, the second hardboard body is incorporated into the lower surface of soft circuit board by the grafting material in the second hardboard via hole;
It is characterized in that, the second joint portion comprises the 3rd hardboard body and is opened in intrinsic the 3rd hardboard via hole of the 3rd hardboard, the 3rd hardboard body is incorporated into the lower surface of soft circuit board by the grafting material in the 3rd hardboard via hole, the upper surface corresponding to the 3rd hardboard body position of soft circuit board is directly electrically connected a connector.
2. hard circuit board coupling apparatus as claimed in claim 1, is characterized in that, described the first binding site is in one end of hard circuit board coupling apparatus, and described the second binding site is in the other end of described hard circuit board coupling apparatus.
3. hard circuit board coupling apparatus as claimed in claim 2, is characterized in that, described the 3rd hardboard body comprises the insulating barrier, conductive layer and the ink layer that stack gradually, and insulating barrier is incorporated into the lower surface of described soft circuit board.
4. hard circuit board coupling apparatus as claimed in claim 3, is characterized in that, is equipped with the 3rd hardboard via hole in described insulating barrier and described ink layer.
5. hard circuit board coupling apparatus as claimed in claim 3, it is characterized in that, described soft circuit board is provided with soft board via hole, and it aligns with the 3rd hardboard via hole, and described the 3rd hardboard body is incorporated into the lower surface of soft circuit board by the grafting material in soft board via hole and the 3rd hardboard via hole.
6. the hard circuit board coupling apparatus as described in any one in claim 1-5, is characterized in that, the second joint portion also comprises supporting bracket, and it is fixed on the lower surface of the 3rd hardboard body.
7. a mobile phone camera module, it comprises camera lens module and connector, it is characterized in that, it also comprises the hard circuit board coupling apparatus as described in any one in claim 1 to 6, described camera lens module is connected in the first joint portion, and described connector is directly arranged at the upper surface corresponding to the 3rd hardboard body position of soft circuit board.
8. mobile phone camera module as claimed in claim 7, is characterized in that, described connector is welded in the upper surface corresponding to the 3rd hardboard body position.
CN201320868107.9U 2013-12-26 2013-12-26 Soft circuit board and hard circuit board combination device and mobile phone camera module Expired - Fee Related CN203661415U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201320868107.9U CN203661415U (en) 2013-12-26 2013-12-26 Soft circuit board and hard circuit board combination device and mobile phone camera module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201320868107.9U CN203661415U (en) 2013-12-26 2013-12-26 Soft circuit board and hard circuit board combination device and mobile phone camera module

Publications (1)

Publication Number Publication Date
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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104584530A (en) * 2014-06-27 2015-04-29 深圳市大疆创新科技有限公司 Circuit board device and image acquisition module provided with the circuit board device
CN105137564A (en) * 2015-09-24 2015-12-09 南昌欧菲光电技术有限公司 Camera head module
CN105338737A (en) * 2014-07-18 2016-02-17 南昌欧菲光电技术有限公司 Circuit board assembly and mobile phone camera module
CN105338738A (en) * 2014-07-18 2016-02-17 南昌欧菲光电技术有限公司 Circuit board assembly and mobile phone camera module
TWI581679B (en) * 2014-08-15 2017-05-01 宏達國際電子股份有限公司 Electronic assembly
CN106993115A (en) * 2016-01-20 2017-07-28 南昌欧菲光电技术有限公司 Camera module and its FPC

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104584530A (en) * 2014-06-27 2015-04-29 深圳市大疆创新科技有限公司 Circuit board device and image acquisition module provided with the circuit board device
US10057473B2 (en) 2014-06-27 2018-08-21 SZ DJI Technology Co., Ltd. Circuit board device and image capturing module having the circuit board device
CN104584530B (en) * 2014-06-27 2018-12-04 深圳市大疆创新科技有限公司 Circuit board arrangement and image capture mould group with the circuit board arrangement
CN105338737A (en) * 2014-07-18 2016-02-17 南昌欧菲光电技术有限公司 Circuit board assembly and mobile phone camera module
CN105338738A (en) * 2014-07-18 2016-02-17 南昌欧菲光电技术有限公司 Circuit board assembly and mobile phone camera module
CN105338738B (en) * 2014-07-18 2018-09-11 南昌欧菲光电技术有限公司 Circuit board assemblies and mobile phone camera module
CN105338737B (en) * 2014-07-18 2019-02-12 南昌欧菲光电技术有限公司 Circuit board assemblies and mobile phone camera mould group
TWI581679B (en) * 2014-08-15 2017-05-01 宏達國際電子股份有限公司 Electronic assembly
CN105137564A (en) * 2015-09-24 2015-12-09 南昌欧菲光电技术有限公司 Camera head module
CN105137564B (en) * 2015-09-24 2019-11-12 南昌欧菲光电技术有限公司 Camera module
CN106993115A (en) * 2016-01-20 2017-07-28 南昌欧菲光电技术有限公司 Camera module and its FPC

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C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20140618

Termination date: 20211226