TWI581679B - Electronic assembly - Google Patents

Description

Electronic assembly

This invention relates to an electronic assembly, and more particularly to an electronic assembly comprising a combination of a soft board and a soft board.

Handheld devices, such as smart phones and tablet computers, have the advantages of multiple functions and portability, making this type of handheld device more and more popular with consumers. Handheld devices are usually equipped with a variety of electronic modules with different functions, such as a liquid crystal display module (LCD module) and a camera module. The electronic modules can be connected to the motherboard through a flexible board (ie, a flexible printed circuit or a flexible printed circuit (FPC)), that is, a hard board (hard circuit board) for carrying electronic components to accommodate The limited space of the outer casing of the hand-held device.

The soft board described above generally extends from the electronic module and has a connection end. When the connection end of the flexible board is inserted into the slot connector that has been mounted to the motherboard, the pads of the connection end are arranged to contact the elastic terminal arrangement of the socket connector, thereby achieving an electrical connection. However, when the appearance of the handheld device changes in appearance or internal configuration, the slot connector of the motherboard is opposite to the connector of the flexible module of the electronic module. When the position changes, the soft board part of the electronic module must be redesigned, produced and assembled, which increases the production cost. In addition, the slot connector of the motherboard adopts a resilient terminal to contact the pad arrangement of the connection end of the flexible board, so that the elastic terminal of the slot connector must have a certain deformation space, and the elastic terminals maintain proper spacing with each other, which become The size of the slot connector cannot be further reduced.

The present invention provides an electronic assembly for extending a transmission path of a flexible board via another flexible board.

An electronic assembly of the present invention includes a first flexible board, a second flexible board, and a conductive adhesive layer. The first flexible board has a first connection end and a first pad arrangement located at the first connection end. The first pad arrangement includes a plurality of first pads. The second flexible board has a second connection end and a second pad arrangement at the second connection end. The second pad arrangement includes a plurality of second pads. The first pads are structurally and electrically connected to the second pads via a conductive adhesive layer.

An electronic assembly of the present invention includes an electronic module, a first flexible board, a second flexible board, and a conductive adhesive layer. The first flexible board extends from the electronic module and has a first connecting end and a first pad arrangement at the first connecting end. The first pad arrangement includes a plurality of first pads. The second flexible board has a second connection end and a second pad arrangement at the second connection end. The second pad arrangement includes a plurality of second pads. The first pads are structurally and electrically connected to the second pads via a conductive adhesive layer.

An electronic assembly of the present invention includes an electronic module, a hard board, and a The first soft board, the second soft board and a conductive adhesive layer. The first flexible board extends from the electronic module and has a first connecting end and a first pad arrangement at the first connecting end. The first pad arrangement includes a plurality of first pads. The second flexible board is connected to the hard board and has a second connection end and a second pad arrangement at the second connection end. The second pad arrangement includes a plurality of second pads. The first pads are structurally and electrically connected to the second pads via a conductive adhesive layer.

Based on the above, in the present invention, the first flexible board and the second soft board can be combined by the conductive adhesive layer, so that the transmission path of the first flexible board can be extended via the second flexible board. Therefore, in the case where the electronic module and the first flexible board have been produced, the design flexibility can be brought about by the second flexible board to make full use of the existing parts. In addition, compared with the conventional socket connector, the first flexible board and the second flexible board are connected via the conductive adhesive layer to occupy a small space, which is advantageous for the appearance of the thinned device.

The above described features and advantages of the invention will be apparent from the following description.

10‧‧‧Electronic assembly

12‧‧‧Electronic module

14‧‧‧ Hard board

14a‧‧‧Electrical connector

100‧‧‧ first soft board

102‧‧‧First connection

104‧‧‧First pad arrangement

104a‧‧‧First mat

200‧‧‧ second soft board

202‧‧‧second connection

204‧‧‧Second pad arrangement

204a‧‧‧second mat

204b‧‧‧second mat

300‧‧‧conductive adhesive layer

302‧‧‧Electrical part

304‧‧‧Insulation

400‧‧‧ anisotropic conductive paste

402‧‧‧ conductive particles

404‧‧‧Insulating resin

L1‧‧‧ length

L2‧‧‧ length

W1‧‧‧Width

W2‧‧‧Width

1A is a front elevational view of an electronic assembly prior to assembly, in accordance with an embodiment of the present invention.

Figure 1B is a front elevational view of the electronic assembly of Figure 1 after assembly.

Fig. 2A is an enlarged view of the first connection end of Fig. 1A.

Fig. 2B is an enlarged view of the second connection end of Fig. 1A.

2C is an enlarged view of the first connection end, the second connection end, and the conductive adhesive layer of FIG. 1B after being combined.

3A-3C are cross-sectional views showing the bonding process of the first soft board, the second soft board, and the conductive adhesive layer of FIG. 2C.

4 is a partial enlarged view of an electronic assembly in accordance with an embodiment of the present invention.

Referring to FIG. 1A , in the embodiment, the electronic assembly 10 includes an electronic module 12 and a hard board 14 . The electronic module 12 can be a camera module, a sound module, a vibration module, a liquid crystal display module or other functional modules. The hard board 14 (ie, the rigid circuit board) can be a motherboard or a modular board of an electronic device (eg, a handheld device). The electronic assembly 10 further includes a first flexible board 100 (ie, a first flexible circuit board) that extends from the electronic module 12. In actual manufacture, the electronic module 12 and the first flexible board 100 are simultaneously fabricated. In the prior art, after the electronic module 12 and the first flexible board 100 are fabricated into a single component, a first connection end 102 of the first flexible board 100 can be connected to an electrical connector 14a on the hard board 14 ( For example, the socket connector is such that the electronic module 12 is electrically connected to the hard board 14 via the first flexible board 100.

However, when the appearance or internal configuration of the electronic device to which the electronic assembly 10 is applied is changed, the first connection end 102 of the original first flexible board 100 and the electrical connector 14a of the hard board 14 are not positionally compatible. Therefore, in the embodiment, the electronic assembly 10 further includes a second flexible board 200 for extending the first flexible board 100. path. Therefore, the electronic module 12 can be sequentially connected to the hard board 14 via the first soft board 100 and the second soft board 200, as shown in FIG. 1B. When the single component formed by the electronic module 12 and the first flexible board 100 has been produced, the additional second soft board 200 can bring design flexibility to such a situation.

Referring to FIG. 1A, the electronic assembly 10 further includes a conductive adhesive layer 300. A second connection end 202 of the second flexible board 200 is structurally and electrically connected to the first connection end 102 of the first flexible board 100 via the conductive adhesive layer 300, and another second connection end of the second flexible board 200. 202 is then coupled to electrical connector 14a on hard board 14. In another embodiment not shown, the second flexible board can also be connected to the hard board via another conductive adhesive layer.

In this embodiment, the material of the conductive adhesive layer 300 is an anisotropic conductive adhesive (ACA). According to the appearance of the storage, the anisotropic conductive paste includes an anisotropic conductive paste (ACP) and an anisotropic conductive film (ACF).

Referring to FIG. 2A, in the embodiment, the first flexible board 100 has a first pad arrangement 104, which is located at the first connection end 102. The first pad arrangement 104 includes a plurality of first pads 104a that may form conductive lines from the first flexible board 100. In addition, referring to FIG. 2B , in the embodiment, the second flexible board 200 has a second pad arrangement 204 , which is located at the second connection end 202 . The second pad arrangement 204 includes a plurality of second pads 204a that may also form conductive lines from the second flexible board 200. Therefore, the first pads 104a can be electrically connected to the corresponding second pads 204a by the conductive adhesive layer 300, thereby establishing a relationship between the first flexible board 100 and the second flexible board 200. Electrical connection. In other words, the conductive adhesive layer 300 is adhered between the first pad arrangement 104 and the second pad arrangement 204. The first pads 104a are correspondingly pressed to the second pads 204a, and the pressed conductive layers are pressed. 300 electrically connects the first pads 104a to the second pads 204a. The case where the first flexible board 100 and the second flexible board 200 are bonded to each other by the conductive paste 300 is as shown in FIGS. 1B and 2C.

Referring to FIG. 2A and FIG. 2B, in the embodiment, the outline of the first pad 104a is short and wide, and the outline of the second pad 204a is elongated. Therefore, the width W1 of the first pad 104a is greater than the width W2 of the corresponding second pad 204a, and the length L1 of the first pad 104a is smaller than the length L2 of the corresponding second pad 204a.

Referring to FIG. 3A, an anisotropic conductive paste 400 may be formed on the first flexible board 100 (or the second flexible board 200), and then adjacent to the first flexible board 100 and the second soft board 200, so that the anisotropic conductive paste is obtained. The conductive particles 402 in 400 contact the first pad 104a and the corresponding second pad 204a as a conductive medium between the first pad 104a and the corresponding second pad 204a, as shown in FIG. 3B. While being extruded, the insulating resin 404 of the anisotropic conductive paste 400 is also cured by heating, thereby filling the space between the first flexible board 100 and the second flexible board 200, and connecting the first soft structure. The board 100 and the second board 200. The cured insulating resin 404 becomes the insulating portion 304. Finally, the heated and extruded anisotropic conductive paste 400 forms a conductive paste layer 300, as shown in FIG. 3C.

It should be noted that, in this embodiment, when the material of the conductive particles 402 of the anisotropic conductive paste 400 includes a solder, the conductive particles 402 may be in the process of pressing and heating as shown in FIG. 3B. Diffusion to combine the first pads 104a and The second pad 204a is as shown in FIG. 3C. The diffused and cured conductive particles 402 can establish a larger conductive portion 302, thereby helping to ensure electrical conduction between the first pads and the second pads 204a of the 104a.

Referring to FIG. 4, in another embodiment, when a plurality of adjacent first pads 104a have the same electrical properties (such as power source properties or grounding properties), the corresponding plurality of second pads 204a (eg, 2B or 2C) may be connected to each other to form a larger second pad 204b. In other words, the larger or wider second pad 204b can be connected to a portion of the first pads 104a, that is, the plurality of first pads 104a via the conductive adhesive layer 300, to achieve good electrical performance.

In summary, in the present invention, the first flexible board and the second soft board can be combined by the conductive adhesive layer, so that the transmission path of the first flexible board can be extended via the second flexible board. Therefore, in the case where the electronic module and the first flexible board have been produced, the design flexibility can be brought about by the second flexible board to make full use of the existing parts. In addition, compared with the conventional socket connector, the first flexible board and the second flexible board are connected via the conductive adhesive layer to occupy a small space, which is advantageous for the appearance of the thinned device. In addition, when the anisotropic conductive paste of the solder conductive particles is used, in the process of pressurization and heating, the conductive particles of the solder may be diffused, and a conductive layer with a larger area is recommended to combine the two corresponding pads, thereby helping to ensure the two correspondences. Electrical conduction between the pads.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and any one of ordinary skill in the art can make some changes and refinements without departing from the spirit and scope of the present invention. The scope of the invention is defined by the scope of the appended claims.

10‧‧‧Electronic assembly

12‧‧‧Electronic module

14‧‧‧ Hard board

14a‧‧‧Electrical connector

100‧‧‧ first soft board

102‧‧‧First connection

200‧‧‧ second soft board

202‧‧‧second connection

300‧‧‧conductive adhesive layer

Claims (9)

An electronic assembly comprising: a first flexible board having a first connection end and a first pad arrangement at the first connection end, the first pad arrangement comprising a plurality of first pads; a second flexible board having a second connecting end and a second pad arrangement at the second connecting end, the second pad arrangement comprising a plurality of second pads, wherein the width of the first pad is greater than a corresponding a width of the second pad, and a length of the first pad is smaller than a length of the corresponding second pad; and a conductive adhesive layer, the first pad is structurally and electrically connected via the conductive adhesive layer The second pads are connected, and one of the second pads is connected to a portion of the first pads via the conductive adhesive layer. The electronic assembly of claim 1, wherein the conductive adhesive layer is adhered between the first pad arrangement and the second pad arrangement, and the first pads are correspondingly pressed to the second The conductive adhesive layer is electrically connected to the second pads. The electronic assembly of claim 1, wherein the conductive adhesive layer is made of an anisotropic conductive paste, and the conductive particles of the anisotropic conductive paste are made of solder. An electronic assembly includes: an electronic module, a first flexible board extending from the electronic module, and having a first connection end and a first pad arrangement at the first connection end, the first Pad arrangement includes multiple a second flexible board having a second connecting end and a second pad arrangement at the second connecting end, the second pad arrangement comprising a plurality of second pads, wherein the first connection The width of the pad is greater than the width of the corresponding second pad, and the length of the first pad is smaller than the length of the corresponding second pad; and a conductive adhesive layer, the first pads pass through the conductive adhesive layer The second pads are structurally and electrically connected, and one of the second pads is connected to a portion of the first pads via the conductive adhesive layer. The electronic assembly of claim 4, wherein the electronic module is a camera module, a sound module, a vibration module or a liquid crystal display module. The electronic assembly of claim 4, wherein the conductive adhesive layer is adhered between the first pad arrangement and the second pad arrangement, and the first pads are correspondingly pressed to the second The conductive adhesive layer is electrically connected to the second pads. The electronic assembly of claim 4, wherein the conductive adhesive layer is made of an anisotropic conductive paste, and the conductive particles of the anisotropic conductive paste are made of solder. The electronic assembly of claim 4, further comprising: a rigid board connected to the second flexible board. The electronic assembly of claim 8, wherein the hard board is a motherboard or a module board.