CN105338738B - Circuit board assemblies and mobile phone camera module - Google Patents
Circuit board assemblies and mobile phone camera module Download PDFInfo
- Publication number
- CN105338738B CN105338738B CN201410344895.0A CN201410344895A CN105338738B CN 105338738 B CN105338738 B CN 105338738B CN 201410344895 A CN201410344895 A CN 201410344895A CN 105338738 B CN105338738 B CN 105338738B
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- CN
- China
- Prior art keywords
- circuit board
- ventilation hole
- printed circuit
- heat sink
- flexible pcb
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The present invention relates to a kind of circuit board assemblies and mobile phone camera modules.Circuit board assemblies include：Heat sink has opposite heat-delivery surface and load-bearing surface, the ventilation hole through load-bearing surface and heat-delivery surface is offered on heat sink；Printed circuit board is set on load-bearing surface, and covers ventilation hole；Flexible PCB is set on surface of the printed circuit board far from heat sink, and flexible PCB includes the electronic component installing zone on the surface for being disposed far from printed circuit board.Foregoing circuit board group part has preferable heat dissipation effect.
Description
Technical field
The present invention relates to technical field of electronic equipment, more particularly to a kind of circuit board assemblies and mobile phone camera module.
Background technology
Traditional mobile phone camera module includes circuit board assemblies and Image Sensor (Sensor).Wherein, circuit board assemblies
Including flexible PCB (Flexible Circuit Board, FPC), the printed circuit board that is pressed under the installing zone of FPC
(Printed Circuit Board, PCB) and the reinforced sheet being pasted below PCB.Image Sensor passes through chip on board
(Chip On Board, COB) technique is pasted on the installing zone of FPC.PCB can increase the intensity of FPC installing zones and smooth
Degree, and more connection circuits can be further set, reinforced sheet can then increase FPC installing zones and the intensity of PCB, prevent
Image Sensor is charged and attacked in COB techniques causes FPC and PCB to damage on FPC.In addition, reinforced sheet usually passes through conducting resinl and PCB
It bonds, the electrostatic grounding when work of mobile phone camera module and cooling effect can be played the role of.But mobile phone camera module works
When, generation heat is bigger, and existing mobile phone camera modular structure heat dissipation effect is not ideal enough.
Invention content
Based on this, it is necessary to provide a kind of circuit board assemblies and mobile phone camera module with preferable heat dissipation performance.
A kind of circuit board assemblies, including：
Heat sink has opposite heat-delivery surface and load-bearing surface, is offered through the carrying table on the heat sink
The ventilation hole in face and the heat-delivery surface；
Printed circuit board is set on the load-bearing surface, and covers the ventilation hole；And
Flexible PCB is set on surface of the printed circuit board far from the heat sink, the flexible PCB packet
Include the electronic component installing zone on the surface for being disposed far from the printed circuit board.
Surface of the flexible PCB far from the printed circuit board is installation surface in one of the embodiments,
The electronic component installing zone is a part for the installation surface；The flexible PCB includes being convexly equipped in the installation surface
On multiple weld pads, the multiple weld pad is located at except the electronic component installing zone, and the multiple weld pad is alternatively arranged and often
One weld pad and a ventilation hole face are arranged.
The multiple weld pad arranges in two separate ranks in one of the embodiments, and the two row weld pad be located at it is described
The both sides of electronic component installing zone.
The number of the ventilation hole is multiple in one of the embodiments, and the number of the ventilation hole is more than described
The number of weld pad, three row of the multiple ventilation hole point or the above arrangement of three row.
Spacing in one of the embodiments, between adjacent two row ventilation hole is identical.
The spacing being located between the two neighboring weld pad of same row in one of the embodiments, is identical.
Surface of the flexible PCB far from the printed circuit board is installation surface in one of the embodiments,
The electronic component installing zone is a part for the installation surface；The flexible PCB includes being convexly equipped in the installation surface
On weld pad, the weld pad is located at except the electronic component installing zone；
The position of the printed circuit board and the ventilation hole face is equipped with butt hole, and the butt hole runs through the printing
Two opposite surfaces of circuit board, the butt hole are docked and are connected to the ventilation hole, and the butt hole and the weld pad position
It sets and is staggered.
The number of the weld pad is multiple in one of the embodiments, and the multiple weld pad arranges in two separate ranks, and described
Two row weld pads are located at the both sides of the installing zone, and there are spacing between the two neighboring weld pad of same row；
The number of the ventilation hole is multiple, and the multiple ventilation hole point multiple row arranges, and the multiple row ventilation hole is located at
Between the two row weld pad, there are spacing between adjacent two row ventilation hole.
The shape of the ventilation hole is rectangular or cylindrical in one of the embodiments,；
And/or the heat sink is steel disc；
And/or conductive adhesive layer is equipped between the heat sink and the printed circuit board.
A kind of mobile phone camera module, including：
Above-mentioned circuit board assemblies；And
Image Sensor is set on the electronic component installing zone, and the Image Sensor and the flexible PCB
Electrical connection.
When using foregoing circuit board group part, the heat that the electronic component on flexible PCB generates is conducted successively to soft
Property circuit board, printed circuit board and heat sink on, then with air carry out heat exchange, to realize heat dissipation.It is arranged on heat sink
Ventilation hole can increase heat sink and printed circuit board and the area of air draught, to accelerate heat sink and printed circuit board
With the speed of air heat exchange so that foregoing circuit board group part have preferable heat dissipation performance.
Description of the drawings
Fig. 1 is the structural schematic diagram of the mobile phone camera module of an embodiment；
Fig. 2 is the exploded view of the mobile phone camera module in Fig. 1；
Fig. 3 is the structural schematic diagram of the mobile phone camera module in another embodiment；
Fig. 4 is the exploded view of the mobile phone camera module in Fig. 3；
Fig. 5 is the structural schematic diagram of the mobile phone camera module in another embodiment.
Specific implementation mode
Below in conjunction with the accompanying drawings and circuit board assemblies and mobile phone camera module are further detailed in specific embodiment.
As shown in Figures 1 and 2, the mobile phone camera module 10 of an embodiment, including circuit board assemblies 100, image sensing
Device 200 and conducting wire 300.
Circuit board assemblies 100 include heat sink 110, printed circuit board 120 and flexible PCB 130.
Heat sink 110 has opposite heat-delivery surface 112 and load-bearing surface 114.It is offered on heat sink 110 through carrying
The ventilation hole 116 on surface 112 and heat-delivery surface 114.Heat sink 110 needs have certain rigidity to increase printed circuit board
120 and flexible PCB 130 intensity.In the present embodiment, heat sink 110 is with certain rigidity and with preferably scattered
The steel disc of hot property, to which more conducively foregoing circuit board group part 100 radiates.
Further, in the present embodiment, the shape of ventilation hole 116 is rectangle.Certainly, the shape of ventilation hole 116 also may be used
Think cylindrical or other shapes.
Printed circuit board 120 is set on load-bearing surface 114, and covers ventilation hole 116.Printed circuit board 120 is for increasing
The intensity and flatness of flexible PCB 130, and more connection circuits can be further set.In the present embodiment,
Conductive adhesive layer (not shown) is equipped between printed circuit board 120 and heat sink 110.Conductive adhesive layer plays connection printed circuit board
120 with the effect of heat sink 110, and when mobile phone camera module 10 works, conductive adhesive layer can also play the role of electrostatic grounding
And cooling effect.
Flexible PCB 130 is set on surface of the printed circuit board 120 far from heat sink 110.Flexible PCB 130 includes
Electronic component installing zone 1322 set on surface of the flexible PCB 130 far from printed circuit board 120.
In the present embodiment, circuit board assemblies 100 are applied in mobile phone camera module 10, electronic component installing zone 1322
For installing Image Sensor 200.It is appreciated that in other embodiments, when circuit board assemblies 100 are applied to LED technology
When field, electronic component installing zone 1322 can be used for installing LED chip.
When using foregoing circuit board group part 100, the heat that the electronic component on flexible PCB 130 generates passes successively
It is directed on flexible PCB 130, printed circuit board 120 and heat sink 110, then heat exchange is carried out with air, to realize heat dissipation.
Ventilation hole 116 is set on heat sink 110, the area of heat sink 110 and printed circuit board 120 and air draught can be increased,
To accelerate the speed of heat sink 110 and printed circuit board 120 and air heat exchange, so that foregoing circuit board group part 100
With preferable heat dissipation performance.
In the present embodiment, surface of the flexible PCB 130 far from heat sink 110 is installation surface 132.Electronic component
Installing zone 1322 is a part for installation surface 132.Flexible PCB 130 includes the weld pad being convexly equipped in installation surface 132
134, weld pad 134 is located at except electronic component installing zone 1322.
Further, in the present embodiment, the number of weld pad 134 is multiple, and multiple weld pads 134 are alternatively arranged, and each
Weld pad 134 and 116 face of a ventilation hole are arranged.Since weld pad 134 needs to be electrically connected with electronic component, collection is easy at weld pad 134
Ventilation hole 116 is more conducive to circuit board assemblies 100 with the setting of 134 face of weld pad and radiated by poly- more heat.
Further, in the present embodiment, in order to which rationally using the space of flexible PCB 130, multiple weld pads 134 are divided to two
Row arrangement, and two row weld pads 134 are located at the both sides of electronic component installing zone 1322.In the present embodiment, ventilation hole 116
Number be it is multiple, and the number of ventilation hole 116 be more than weld pad 134 number, multiple ventilation holes 116 divide three row or three arrange more than
Arrangement.Although adding the heat dissipation that more ventilation holes 116 is conducive to improve circuit board assemblies 100, heat sink 110 can be influenced
Rigidity.In the present embodiment, after considering the heat dissipation of circuit board assemblies 100 and the two rigid factors of heat sink 110,
Five row ventilation holes 116 are set.
As shown in Figures 3 and 4, it will be understood that in other embodiments, the number of the number and weld pad 134 of ventilation hole 116
Mesh is identical.Since each weld pad 134 and 116 face of a ventilation hole are arranged, multiple ventilation holes 116 arrange in two separate ranks.
Further, in embodiments, the spacing between adjacent two row ventilation hole 116 is identical, to be more conducive to uniformly dissipate
Heat and more conducively making heat sink 110.
Further, in embodiments, the spacing being located between the two neighboring weld pad 134 of same row is identical.Also it ascends the throne
Spacing between the two neighboring ventilation hole 116 of same row is identical, thus more conducively Homogeneouslly-radiating.
As shown in figure 5, in other embodiments, printed circuit board 120 is equipped with the position of 116 face of ventilation hole and docks
Hole 122.Butt hole 122 is docked and is connected to ventilation hole 116 through two opposite surfaces of printed circuit board 120, butt hole 122,
And butt hole 122 is staggeredly located (namely butt hole 122 is not located at the underface of weld pad 134) with weld pad 134.Add butt hole
122, the area of heat sink 110, printed circuit board 120 and flexible PCB 130 and air draught can be increased, to accelerate to dissipate
The speed of hot plate 110, printed circuit board 120 and flexible PCB 130 and air heat exchange, so that foregoing circuit board group part
With preferable heat dissipation performance.Since printed circuit board 120 can increase the intensity and flatness of flexible PCB 130, in order to
Butt hole 122 is avoided to influence the flatness of flexible PCB 130, butt hole 122 is staggeredly located with the needs of weld pad 134.
Further, the number of weld pad 134 is multiple, and multiple weld pads 134 arrange in two separate ranks, and two row weld pads 134 distinguish position
In the both sides of electronic component installing zone 1322.There are spacing between the two neighboring weld pad 134 of same row.Ventilation hole 116
Number be it is multiple, 116 points of multiple rows of multiple ventilation holes arrange, and multiple row ventilation hole 116 is between two row weld pads 134, adjacent
There are spacing between two row ventilation holes 116.Each ventilation hole 116 and 122 face of a butt hole are arranged.
Image Sensor 200 is set on electronic component installing zone 1322, and Image Sensor 200 and flexible PCB 130
Electrical connection.In the present embodiment, there is pad 210 on surface of the Image Sensor 200 far from flexible PCB 130.
300 one end of conducting wire is electrically connected with weld pad 134, and the other end is electrically connected with pad 210, to realize Image Sensor
200 are electrically connected with flexible PCB 130.
Since foregoing circuit board group part 100 has preferable heat dissipation effect, using foregoing circuit board group part 100
Mobile phone camera module 10 has preferable heat dissipation effect.
Several embodiments of the invention above described embodiment only expresses, the description thereof is more specific and detailed, but simultaneously
Cannot the limitation to the scope of the claims of the present invention therefore be interpreted as.It should be pointed out that for those of ordinary skill in the art
For, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the guarantor of the present invention
Protect range.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (4)
1. a kind of circuit board assemblies, which is characterized in that including：
Heat sink, the heat sink are steel disc, have opposite heat-delivery surface and load-bearing surface, are offered on the heat sink
Through the ventilation hole of the load-bearing surface and the heat-delivery surface；
Printed circuit board is set on the load-bearing surface, and covers the ventilation hole；And
Flexible PCB is set on surface of the printed circuit board far from the heat sink, and the flexible PCB includes setting
Electronic component installing zone in the surface far from the printed circuit board；
Surface of the flexible PCB far from the printed circuit board is installation surface, and the electronic component installing zone is described
A part for installation surface；The flexible PCB includes the weld pad being convexly equipped in the installation surface, and the weld pad is located at institute
It states except electronic component installing zone；
The position of the printed circuit board and the ventilation hole face is equipped with butt hole, and the butt hole runs through the printed circuit
Two opposite surfaces of plate, the butt hole are docked and are connected to the ventilation hole, and the butt hole and the bond pad locations phase
It is wrong.
2. circuit board assemblies according to claim 1, which is characterized in that the number of the weld pad be it is multiple, it is the multiple
Weld pad arranges in two separate ranks, and the two row weld pad is located at the both sides of the installing zone, is located at the two neighboring weldering of same row
There are spacing between pad；
The number of the ventilation hole is multiple, and the multiple ventilation hole point multiple row arranges, and the multiple row ventilation hole is positioned at described
Between two row weld pads, there are spacing between adjacent two row ventilation hole.
3. circuit board assemblies according to claim 1, which is characterized in that the shape of the ventilation hole is rectangle or cylinder
Shape；
And/or conductive adhesive layer is equipped between the heat sink and the printed circuit board.
4. a kind of mobile phone camera module, which is characterized in that including：
Circuit board assemblies as claimed in any one of claims 1-3；And
Image Sensor is set on the electronic component installing zone, and the Image Sensor is electrically connected with the flexible PCB
It connects.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410344895.0A CN105338738B (en) | 2014-07-18 | 2014-07-18 | Circuit board assemblies and mobile phone camera module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410344895.0A CN105338738B (en) | 2014-07-18 | 2014-07-18 | Circuit board assemblies and mobile phone camera module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105338738A CN105338738A (en) | 2016-02-17 |
| CN105338738B true CN105338738B (en) | 2018-09-11 |
Family
ID=55288903
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410344895.0A Expired - Fee Related CN105338738B (en) | 2014-07-18 | 2014-07-18 | Circuit board assemblies and mobile phone camera module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105338738B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5375039A (en) * | 1992-09-29 | 1994-12-20 | Robert Bosch Gmbh | Circuit board heat dissipation layering arrangement |
| CN203167514U (en) * | 2013-04-11 | 2013-08-28 | 余原生 | Integrated circuit integrated structure |
| CN203661415U (en) * | 2013-12-26 | 2014-06-18 | 南昌欧菲光电技术有限公司 | Soft circuit board and hard circuit board combination device and mobile phone camera module |
| CN204031593U (en) * | 2014-07-18 | 2014-12-17 | 南昌欧菲光电技术有限公司 | Circuit board assemblies and mobile phone camera module |
-
2014
- 2014-07-18 CN CN201410344895.0A patent/CN105338738B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5375039A (en) * | 1992-09-29 | 1994-12-20 | Robert Bosch Gmbh | Circuit board heat dissipation layering arrangement |
| CN203167514U (en) * | 2013-04-11 | 2013-08-28 | 余原生 | Integrated circuit integrated structure |
| CN203661415U (en) * | 2013-12-26 | 2014-06-18 | 南昌欧菲光电技术有限公司 | Soft circuit board and hard circuit board combination device and mobile phone camera module |
| CN204031593U (en) * | 2014-07-18 | 2014-12-17 | 南昌欧菲光电技术有限公司 | Circuit board assemblies and mobile phone camera module |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105338738A (en) | 2016-02-17 |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180911 |