CN202035213U - Six-layer high density interconnect (HDI) rigid flexible combined board - Google Patents
Six-layer high density interconnect (HDI) rigid flexible combined board Download PDFInfo
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- CN202035213U CN202035213U CN2011201263858U CN201120126385U CN202035213U CN 202035213 U CN202035213 U CN 202035213U CN 2011201263858 U CN2011201263858 U CN 2011201263858U CN 201120126385 U CN201120126385 U CN 201120126385U CN 202035213 U CN202035213 U CN 202035213U
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Abstract
The utility model discloses a six-layer high density interconnect (HDI) rigid flexible combined board, which comprises a rigid board region and a flexible board region, wherein the rigid board region comprises a double-layer flexible circuit board and four single-layer rigid circuit boards which are in laminated arrangement, the four rigid circuit boards are divided into two groups, each group is formed by pasting two rigid circuit boards, one group of the rigid circuit boards is fixedly arranged on the upper surface of the flexible circuit board, the other group of rigid circuit boards is fixed arranged on the lower surface of the flexible circuit board, the flexible board region comprises a double-layer flexible circuit board, the flexible circuit board arranged in the flexible board region and the flexible circuit board arranged in the rigid board region are made into a whole, circuits are respectively formed on the flexible circuit boards and the rigid circuit boards, the inner layer of the rigid board region is provided with buried holes, the outer layer surface of the rigid board region is provided with blind holes of which the opening ends facing the outward surface, and conductive metals are respectively plated in the buried holes and the blind holes. The six-layer HDI rigid flexible combined board adopts the buried holes and the blind holes for conducting each inter-layer circuit, the area of the circuit board occupied by the holes is reduced, the wiring space is increased, and the high-density interconnection of circuits on the circuit board is realized.
Description
Technical field
The utility model relates to circuit board, relates in particular to a kind of six layers of HDI Rigid Flex.
Background technology
Present circuit board is generally rigid circuit board (PCB) or flexible electric circuit board (FlexiblePrinted Circuit, abbreviation FPC), a kind of Rigid Flex (Rigid-Flex PCB) appears recently, there are rigid circuit board and flexible electric circuit board pressing to form, it has concentrated the advantage of rigid circuit board (PCB) and flexible electric circuit board (FPC), binding components and parts etc. both can well on rigid circuit board, have been welded, the anti-bending performance that can have flexible electric circuit board again, and noise is few, the reliability height, often adopt plated-through hole that the circuit on each laminate is coupled together between the rigid-flex, in general the many apertures of number of openings are also bigger, and it is more that it takies board area, make the number of, lines that can distribute in the plate few, the components and parts of surface soldered or binding are less, thereby influence electric performance and effect.
HDI is the abbreviation of high power density inverter (High Density Inverter), is a kind of technology of production printed board, in circuit-board industry, the circuit distribution density is called the HDI plate than higher circuit board, or is referred to as " high density circuit board ".
The utility model content
The technical problem that the utility model mainly solves provides a kind of six layers of HDI Rigid Flex, combine by rigid circuit board and flexible electric circuit board, and have the internal layer buried via hole that is used for each interlayer circuit of conducting and a structure of outer surface blind hole, reduce number of openings, make line layer have more space to connect up, thereby make circuit board that more electric function be arranged, realize the circuit high density interconnect.
For solving the problems of the technologies described above, the technical solution adopted in the utility model is: a kind of six layers of HDI Rigid Flex are provided, comprise hardboard zone and soft board zone, described hardboard zone comprises a two-layer flexible circuit board and four individual layer rigid circuit boards of stacked setting, described four individual layer rigid circuit boards are divided into two groups, every group is sticked to form by two rigid circuit boards, described rigid circuit board is fixedly installed on described flexible electric circuit board upper surface for one group, and another group is fixedly installed on described flexible electric circuit board lower surface; Described soft board zone comprises a two-layer flexible circuit board, and the flexible electric circuit board in the flexible electric circuit board in described soft board zone and described hardboard zone is an one; All be formed with circuit on described flexible electric circuit board and the described rigid circuit board, the internal layer in described hardboard zone is provided with buried via hole, and the superficies in described hardboard zone are provided with the blind hole of openend outward surface, all are coated with conducting metal in described buried via hole and the described blind hole.
Wherein, described hardboard zone is divided into two places, and this two places hardboard area distribution is in two ends, described soft board zone.
Wherein, described blind hole is conical, and the bigger end of diameter is an openend.
Wherein, described buried via hole is cylindrical.
Wherein, the conducting metal that is plated in described buried via hole and the described blind hole is a copper.
The beneficial effects of the utility model are: the Rigid Flex that is different from prior art is by each interlayer circuit of through hole conducting, because taking a large amount of line plate plate areas greatly, the number of openings multiple aperture cause the interior number of, lines that can distribute of plate few, thereby influence electric performance and effect, HDI Rigid Flex of the present utility model adopts the structure of internal layer buried via hole and outer surface blind hole, reduce the quantity in hole, make each layer line layer have more space to connect up, realize the welding binding of more components and parts etc. at identical circuit board surface, make circuit board that more electric function be arranged, realize the circuit high density interconnect on the circuit board.
Description of drawings
Fig. 1 is the structure cutaway view of the utility model HDI Rigid Flex.
Embodiment
By describing technology contents of the present utility model, structural feature in detail, realized purpose and effect, give explanation below in conjunction with execution mode and conjunction with figs. are detailed.
See also Fig. 1, HDI Rigid Flex of the present utility model is combined by 11,12,13,14 and two-layer flexible circuit board 2 laminations of four individual layer rigid circuit boards, the one side of described rigid circuit board 11,12,13,14 is formed with circuit, flexible electric circuit board 2 is double-layer circuit boards, and lower surface all is formed with circuit thereon; Four individual layer rigid circuit boards are divided into two groups, after fitting, rigid circuit board 11 and rigid circuit board 12 be fixed on the upper surface of flexible electric circuit board 2, after fitting, rigid circuit board 13 and rigid circuit board 14 be fixed on the lower surface of flexible electric circuit board 2, rigid circuit board 11,12,13,14 is provided with at the two ends of flexible electric circuit board 2, the mid portion of flexible electric circuit board 2 forms a soft board zone 20 like this, the stacked rigid circuit board that is provided with at the two ends of flexible electric circuit board 2, stacked this part forms hardboard zone 10.The device that is separately positioned on two slide relative as the hardboard zone 10 with two ends for example on the slip lid and body of slide phone, because only there is flexible electric circuit board 2 in soft board zone 20, can have the good bending and the performance of destroying or force to yield.
Has blind hole on the outer rigid circuit board 11 and 14 in hardboard zone 10, be coated with conducting metal such as copper in the blind hole, silver, aluminium etc., the degree of depth of blind hole can arrive the second layer, the line layer of the 3rd layer even four-layer circuit board makes the line conduction of each interlayer, be provided with blind hole 3 as rigid circuit board 11, blind hole 3 arrives the line layer of rigid circuit board 12, rigid circuit board 11 can be connected with 12 circuit like this, the quantity of blind hole is set to a plurality of according to actual needs, for ease of production and processing and better electric conductivity, blind hole 3 be shaped as taper shape, and the bigger end of diameter is openend surface outward.
The internal layer in hardboard zone 10 has buried via hole 4, buried via hole 4 is shaped as cylindrical, be coated with conducting metal such as copper, silver, aluminium etc. in the hole, buried via hole 4 is used for the connection of circuit between inner layer circuit board, as shown in Figure 1, first buried via hole 41 runs through flexible electric circuit board 2, the second buried via holes 42 and runs through rigid circuit board 12, flexible electric circuit board 2 and rigid circuit board 13.
The Rigid Flex that is different from prior art is by each interlayer circuit of through hole conducting, because taking a large amount of line plate plate areas greatly, the number of openings multiple aperture cause the interior number of, lines that can distribute of plate few, thereby influence electric performance and effect, HDI Rigid Flex of the present utility model adopts the structure of internal layer buried via hole and outer surface blind hole, reduce the quantity in hole, make each layer line layer have more space to connect up, realize the welding binding of more components and parts etc. at identical circuit board surface, make circuit board that more electric function be arranged, realize the circuit high density interconnect on the circuit board.
The above only is embodiment of the present utility model; be not so limit claim of the present utility model; every equivalent structure or equivalent flow process conversion that utilizes the utility model specification and accompanying drawing content to be done; or directly or indirectly be used in other relevant technical fields, all in like manner be included in the scope of patent protection of the present utility model.
Claims (5)
1. six layers of HDI Rigid Flex, it is characterized in that, comprise hardboard zone and soft board zone, described hardboard zone comprises a two-layer flexible circuit board and four individual layer rigid circuit boards of stacked setting, described four individual layer rigid circuit boards are divided into two groups, every group is sticked to form by two rigid circuit boards, and described rigid circuit board is fixedly installed on described flexible electric circuit board upper surface for one group, and another group is fixedly installed on described flexible electric circuit board lower surface; Described soft board zone comprises a two-layer flexible circuit board, and the flexible electric circuit board in the flexible electric circuit board in described soft board zone and described hardboard zone is an one; All be formed with circuit on described flexible electric circuit board and the described rigid circuit board, the internal layer in described hardboard zone is provided with buried via hole, and the superficies in described hardboard zone are provided with the blind hole of openend outward surface, all are coated with conducting metal in described buried via hole and the described blind hole.
2. six layers of HDI Rigid Flex according to claim 1 is characterized in that: described hardboard zone is divided into two places, and this two places hardboard area distribution is in two ends, described soft board zone.
3. six layers of HDI Rigid Flex according to claim 2 is characterized in that: described blind hole is for conical, and the bigger end of diameter is an openend.
4. six layers of HDI Rigid Flex according to claim 2 is characterized in that: described buried via hole is cylindrical.
5. according to each described six layers of HDI Rigid Flexs of claim 1-4, it is characterized in that: the conducting metal that is plated in described buried via hole and the described blind hole is a copper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201263858U CN202035213U (en) | 2011-04-26 | 2011-04-26 | Six-layer high density interconnect (HDI) rigid flexible combined board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201263858U CN202035213U (en) | 2011-04-26 | 2011-04-26 | Six-layer high density interconnect (HDI) rigid flexible combined board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202035213U true CN202035213U (en) | 2011-11-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011201263858U Expired - Fee Related CN202035213U (en) | 2011-04-26 | 2011-04-26 | Six-layer high density interconnect (HDI) rigid flexible combined board |
Country Status (1)
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| CN (1) | CN202035213U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104284519A (en) * | 2014-09-23 | 2015-01-14 | 梅州市志浩电子科技有限公司 | Printed circuit board depth control gong device and method |
| CN106686885A (en) * | 2016-12-29 | 2017-05-17 | 欣旺达电子股份有限公司 | Printed circuit board (PCB) protection plate of rapid charging battery |
| WO2017113797A1 (en) * | 2015-12-29 | 2017-07-06 | 广东欧珀移动通信有限公司 | Flexible circuit board and mobile terminal |
| CN107801309A (en) * | 2017-11-29 | 2018-03-13 | 瑞声声学科技(苏州)有限公司 | The preparation method of six sandwich circuit boards and six sandwich circuit boards |
-
2011
- 2011-04-26 CN CN2011201263858U patent/CN202035213U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104284519A (en) * | 2014-09-23 | 2015-01-14 | 梅州市志浩电子科技有限公司 | Printed circuit board depth control gong device and method |
| WO2017113797A1 (en) * | 2015-12-29 | 2017-07-06 | 广东欧珀移动通信有限公司 | Flexible circuit board and mobile terminal |
| CN106686885A (en) * | 2016-12-29 | 2017-05-17 | 欣旺达电子股份有限公司 | Printed circuit board (PCB) protection plate of rapid charging battery |
| CN106686885B (en) * | 2016-12-29 | 2023-09-26 | 欣旺达电子股份有限公司 | PCB protection board for quick battery charging |
| CN107801309A (en) * | 2017-11-29 | 2018-03-13 | 瑞声声学科技(苏州)有限公司 | The preparation method of six sandwich circuit boards and six sandwich circuit boards |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee |
Owner name: SHENZHEN JINGCHENGDA ELECTRIC CIRCUIT CO., LTD. Free format text: FORMER NAME: SHENZHEN JINGCHENGDA CIRCUIT CO., LTD. |
|
| CP01 | Change in the name or title of a patent holder |
Address after: 518000 Guangdong city of Shenzhen province Baoan District Shajing Town Xin Yangcun West bad industrial zone B building Patentee after: Shenzhen Jingchengda Circuit Technology Co., Ltd. Address before: 518000 Guangdong city of Shenzhen province Baoan District Shajing Town Xin Yangcun West bad industrial zone B building Patentee before: Shenzhen Jingchengda Electric Circuit Co.,Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20111109 Termination date: 20160426 |