CN104780719A - Method for embedding inductors in printed-circuit board and printed-circuit board adopted by method - Google Patents
Method for embedding inductors in printed-circuit board and printed-circuit board adopted by method Download PDFInfo
- Publication number
- CN104780719A CN104780719A CN201510206398.9A CN201510206398A CN104780719A CN 104780719 A CN104780719 A CN 104780719A CN 201510206398 A CN201510206398 A CN 201510206398A CN 104780719 A CN104780719 A CN 104780719A
- Authority
- CN
- China
- Prior art keywords
- split ring
- circuit board
- hole
- printed circuit
- inductance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/1003—Non-printed inductor
Abstract
The invention discloses a method for embedding inductors in a printed-circuit board and the printed-circuit board adopted by the method and belongs to the technical field of printed-circuit board manufacturing. The method comprises the following steps that 1, a hole is drilled in the double-layer printed-circuit board and is metalized to enable an upper layer and a lower layer to be connected electrically; 2, graph making is performed, and at least one split ring is manufactured on the upper side and the lower side respectively; 3, continuous pressing is performed on at least one board face of the double-layer printed-circuit board to form a multiple-layer printed-circuit board, drilling, hole metallization and graph making are required to be performed after each layer is pressed, and the split rings are manufactured on each layer; 4, after manufacture of split ring coils is completed, the centers of the split rings are drilled, magnetic cores are embedded into the holes, and the magnetic cores and the split ring coils form the embedded instructors in the vertical direction. The size of the printed-circuit board can be decreased, and the method for embedding the inductor in the printed-circuit board enables the densification and miniaturization of the printed-circuit board to be achieved and is used for manufacturing the printed-circuit board.
Description
Technical field
The present invention relates to a kind of manufacture method of circuit board, more particularly, particularly relate to a kind of method imbedding inductance in printed circuit board.The present invention also relates to simultaneously and has the above-mentioned printed circuit board imbedding inductance.
Background technology
Along with electronic product is towards compact direction development, product power source block density is more and more higher, and build is also more and more less.In element pasted on surface, the surface area that inductance element accounts for printed circuit board is comparatively large, especially power panel, and shared by it, printed circuit board surface area is more than 40%, and most inductance element needs manual attachment, and serious have impact on packaging efficiency.If inductance can be embedded to the inside of printed circuit board, not only can save the ability that plate space of planes strengthens wiring cloth member, realize high density, compact, and can avoid mounting inductance element by hand, realize automatic assembling, significantly promote packaging efficiency, and device solder joint number reduces and greatly can improve product reliability.
Summary of the invention
Last object of the present invention be to provide a kind of method imbedding inductance in printed circuit board, its method is embodied in the making realizing imbedding inductance in vertical direction, present invention achieves and imbed inductance in the inside of printed circuit board, reduce the size of printed circuit board, realize densification and the miniaturization of printed circuit board.
After of the present invention, an object is to provide and a kind ofly has the above-mentioned printed circuit board imbedding inductance.
Last technical scheme of the present invention is achieved in that a kind of method imbedding inductance in printed circuit board, comprises the steps: that (1) holes on double layer printed circuit plate, and plated-through hole makes upper and lower two-layer electrical connection; (2) make figure, respectively make at least one split ring at upper and lower surface, each split ring all connects with the hole after corresponding metallization, and be positioned at the split ring one_to_one corresponding of upper and lower surface, corresponding split ring is arranged with one heart; (3) at least one lateral plates of double layer printed circuit plate, continue pressing form multilayer printed circuit board, every pressing one deck, all need sequentially to carry out to hole, hole metallization and graphic making, every layer makes the split ring concentric with made split ring in step (2), and each concentric split ring is sequentially connected to form split ring coil by the hole after metallizing and the sense of current on each split ring is identical; (4) after split ring coil makes, in the centre-drilling hole of split ring, hole is embedded in magnetic core, and magnetic core and split ring coil are formed, and vertical direction imbeds inductance; (5) other figure on the split ring free end connecting circuit board at two ends is positioned at, or by outer graphics metallic conductor by the series connection of inductance individuality together, form the large inductance of series connection, or by outer graphics metallic conductor by individual for inductance parallel connection together, form small inductor in parallel.
Imbed in the method for inductance in above-mentioned a kind of printed circuit board, step (1) and step (3) described boring are holes drilled through or blind hole.
Imbed in the method for inductance in above-mentioned a kind of printed circuit board, in step (2) and step (3), split ring is connected for directly to connect with the hole after metallization; The A/F of split ring is not less than the radius in the hole after institute's connection metal.
Imbed in the method for inductance in above-mentioned a kind of printed circuit board, in step (2) and step (3), split ring is connected for be connected by electric conductor line with the hole after metallization.
After of the present invention, a technical scheme is achieved in that a kind ofly have the printed circuit board imbedding inductance described in above-mentioned arbitrary claim, comprise the body by some layer insulatings and the pressing of some layers of metal pattern layer intersecting, wherein said body is provided with through hole along the direction in vertical panel face, in through hole, be embedded with magnetic core, the metal pattern layer of magnetic core periphery is provided with split ring; Insulating barrier between adjacent two layers metal pattern layer is provided with metallized interlayer conductive hole along the direction in vertical panel face, adjacent two split rings and metallized interlayer conductive hole are connected to form split ring coil, and the sense of current of each layer split ring (6) is identical; Split ring coil coordinates with magnetic core to be formed, and vertical direction imbeds inductance individuality; Split ring coil two ends are connected with other figure in metal pattern layer respectively.
In above-mentioned printed circuit board, each inductance is connected to form cascaded structure or parallel-connection structure individual by outermost metal pattern layer.
In above-mentioned printed circuit board, split ring is connected for directly to connect with the interlayer conductive hole after metallization; The A/F of split ring is not less than the radius in the hole after institute's connection metal.
In above-mentioned printed circuit board, split ring is connected for be connected by electric conductor line with the interlayer conductive hole after metallization.
A kind of printed circuit board, its inside has the circuit board unit that the printed circuit board described in the claims is made, and this circuit board unit is connected with external graphics by metallized conductive hole.
After the present invention adopts said method and corresponding construction, compared with prior art, there is following advantage: according to the present invention, following beneficial effect can be realized:
(1) imbed inductance in circuit board vertical direction, reduce attachment expense, and plate face size under same design condition, can be reduced, save the ability that plate space of planes strengthens wiring cloth member, realize product high density, compact;
(2) avoid mounting inductance element by hand, realize automatic assembling, significantly promote packaging efficiency;
(3) device solder joint number reduces and greatly can improve product reliability;
(4) manufacture craft is simple, the manufacture method of the similar general printed circuit board of manufacture method.
Accompanying drawing explanation
Below in conjunction with the embodiment in accompanying drawing, the present invention is described in further detail, but do not form any limitation of the invention.
Fig. 1 is one of structural representation of the embodiment of the present invention 2;
Fig. 2 is the structural representation two of the embodiment of the present invention 3;
Fig. 3 is the structural representation of split ring coil of the present invention.
In figure: insulating barrier 1, metal pattern layer 2, body 3, magnetic core 4, split ring 5, interlayer conductive hole 6, circuit board unit 7.
Embodiment
Embodiment 1
Imbed the method for inductance in a kind of printed circuit board of the present invention, comprise the steps:
(1) hole on double layer printed circuit plate, described boring is holes drilled through or blind hole.Through hole runs through the top and bottom of plate, holes drilled through can be realized by the mode of machine drilling, laser drill or punching, and laser drill can be holed by infrared laser or Ultra-Violet Laser boring realizes, for the hole being less than 0.1mm, preferred laser drill, the preferred laser drill of drilling blind hole; Metallization, plates layer of metal in the outer surface and hole of plate, and metal can be the metallization of electroless coating formula, and also can be the metallization of plating formula, plated-through hole makes upper and lower two-layer electrical connection;
(2) figure is made, the mode of etching is adopted to remove unwanted metallic member, leave required figure, a split ring is at least comprised in every layer pattern, each split ring all connects with the hole after corresponding metallization, be positioned at the split ring one_to_one corresponding of upper and lower surface, corresponding split ring is arranged with one heart;
(3) at least one lateral plates of double layer printed circuit plate, continue pressing form multilayer printed circuit board, every pressing one deck, all need sequentially to carry out to hole, hole metallization and graphic making, every layer makes the split ring concentric with made split ring in step (2), and each concentric split ring is sequentially connected to form split ring coil by the hole after metallizing and the sense of current on each split ring is identical; In the present embodiment, be on the two sides of double layer printed circuit plate, continue pressing respectively form four laminates, then sequentially carry out holing on the layer of the new pressing in two sides, hole metallization and graphic making;
(4) after split ring coil makes, in the centre-drilling hole of split ring, hole is embedded in magnetic core, and magnetic core and split ring coil are formed, and vertical direction imbeds inductance; Magnetic core can be hollow, i.e. not embedded magnetic core, or magnetic substance, irony, copper etc., intermediate frequency or high-frequency inductor are generally hollow, magnetic substance or copper, and low frequency inductance is generally irony.
(5) other figure on the split ring free end connecting circuit board at two ends is positioned at, or by outer graphics metallic conductor by the series connection of inductance individuality together, form the large inductance of series connection, or by outer graphics metallic conductor by individual for inductance parallel connection together, form small inductor in parallel.
Further, in step (2) and step (3), split ring and the hole after metallizing are connected with two kinds of modes.One is directly connect, this connected mode, and the A/F of split ring is not less than the radius in the hole after institute's connection metal.
Another kind of for be connected by electric conductor line.This connected mode, it is very little that opening just can do, and its size is subject to the impact of graphic making gap ability.
Embodiment 2
Consult shown in Fig. 1, of the present invention a kind ofly have the printed circuit board imbedding inductance, comprise the body 3 by some layer insulatings 1 and the pressing of some layers of metal pattern layer 2 intersecting, the number of plies of body 3 is at least three layers, the concrete number of plies is depending on concrete, and in the present embodiment, the number of plies of body is four layers.Direction along vertical panel face on described body 3 is provided with through hole, is embedded with magnetic core 4 in through hole, and the metal pattern layer 5 of magnetic core 4 periphery is provided with split ring 5; Insulating barrier between adjacent two layers metal pattern layer is provided with metallized interlayer conductive hole along the direction in vertical panel face, adjacent two split rings 5 are connected to form split ring coil with metallized interlayer conductive hole 6, the sense of current of each layer split ring 5 is identical, and split ring coil coordinates with magnetic core 4 to be formed, and vertical direction imbeds inductance individuality.Its structure is as shown in Figure 3: two split rings 5 at two ends, and split ring 5 one end connects middle split ring 5 by interlayer conductive hole 6, and the other end, as a pole of whole flush type inductance, is connected with other figures of circuit board.One end of middle split ring 5 is connected with upper strata split ring 5 by the interlayer conductive hole 6 on upper strata, and the other end is connected with lower floor split ring 5 by the interlayer conductive hole 6 that is positioned at lower floor, and namely an interlayer conductive hole 6 connects two-layer two split rings 5 up and down.For four laminates, wherein imbed magnetic core containing one, four split ring ab, ef, ij and mn (letter represents the two ends of split ring), four split rings are connected by three holes, hole is cd, gh and kl (letter represents the two ends in hole) respectively, four split ring compositions imbed the coil of inductance, the two ends of coil extend out and connect A and B bright spot, if pass into electric current at A place, the circulating direction of electric current is: A → a → b → c → d → e → f → g → h → i → j → k → l → m → n → B; If pass into electric current at B place, the circulating direction of electric current is: B → n → m → l → k → j → i → h → g → f → e → d → c → b → a → A.
Each inductance is connected to form cascaded structure or parallel-connection structure individual by outermost metal pattern layer 2, depends on actual need and determines, and can certainly have series and parallel connections structure simultaneously; Split ring coil two ends are connected with other figure in metal pattern layer 2 respectively.
Further, the interlayer conductive hole 6 after split ring 5 and metallization is connected with two kinds of modes, and one be direct connection, adopts this connected mode, and the A/F of split ring 5 is not less than the radius in the hole after institute's connection metal.Another kind is connected by electric conductor line.This connected mode, it is very little that opening just can do, and its size is subject to the impact of graphic making gap ability.
In board structure of circuit, all can imbed inductance individuality between layers arbitrarily.
Embodiment 3
A kind of printed circuit board of the present invention, its inside has the circuit board unit 7 that above-mentioned printed circuit board is made, and this circuit board unit 7 is connected with external graphics by metallized conductive hole.Consult shown in Fig. 2, for four laminates, imbed the inside that circuit board unit 7 is embedded into printed circuit board, two end points and the side a and b of imbedding inductance are connected on the conductor of printed circuit board by plated-through hole, thus realize the electrical connection with printed circuit board.A circuit board unit 7 can be imbedded, also can imbed multiple circuit board unit 7.
Above illustrated embodiment is better embodiment of the present invention, only be used for conveniently the present invention being described, not any pro forma restriction is done to the present invention, have in any art and usually know the knowledgeable, if do not depart from the present invention carry in the scope of technical characteristic, utilize the Equivalent embodiments that the done local of disclosed technology contents is changed or modified, and do not depart from technical characteristic content of the present invention, all still belong in the scope of the technology of the present invention feature.
Claims (9)
1. imbed a method for inductance in printed circuit board, it is characterized in that, comprise the steps: that (1) holes on double layer printed circuit plate, plated-through hole makes upper and lower two-layer electrical connection; (2) make figure, respectively make at least one split ring at upper and lower surface, each split ring all connects with the hole after corresponding metallization, and be positioned at the split ring one_to_one corresponding of upper and lower surface, corresponding split ring is arranged with one heart; (3) at least one lateral plates of double layer printed circuit plate, continue pressing form multilayer printed circuit board, every pressing one deck, all need sequentially to carry out to hole, hole metallization and graphic making, every layer makes the split ring concentric with made split ring in step (2), and each concentric split ring is sequentially connected to form split ring coil by the hole after metallizing and the sense of current on each split ring is identical; (4) after split ring coil makes, in the centre-drilling hole of split ring, hole is embedded in magnetic core, and magnetic core and split ring coil are formed, and vertical direction imbeds inductance; (5) other figure on the split ring free end connecting circuit board at two ends is positioned at, or by outer graphics metallic conductor by the series connection of inductance individuality together, form the large inductance of series connection, or by outer graphics metallic conductor by individual for inductance parallel connection together, form small inductor in parallel.
2. imbed the method for inductance in a kind of printed circuit board according to claim 1, it is characterized in that, step (1) and step (3) described boring are holes drilled through or blind hole.
3. imbed the method for inductance in a kind of printed circuit board according to claim 1, it is characterized in that, in step (2) and step (3), split ring is connected for directly to connect with the hole after metallization; The A/F of split ring is not less than the radius in the hole after institute's connection metal.
4. imbed the method for inductance in a kind of printed circuit board according to claim 1, it is characterized in that, in step (2) and step (3), split ring is connected for be connected by electric conductor line with the hole after metallization.
5. one kind has the printed circuit board imbedding inductance described in above-mentioned arbitrary claim, comprise the body (3) by some layer insulatings (1) and the intersecting pressing of some layers of metal pattern layer (2), it is characterized in that, direction along vertical panel face on described body (3) is provided with through hole, in through hole, be embedded with magnetic core (4), the metal pattern layer (2) that magnetic core (4) is peripheral is provided with split ring (5); Insulating barrier (1) between adjacent two layers metal pattern layer (2) is provided with metallized interlayer conductive hole (6) along the direction in vertical panel face, adjacent two split rings (5) and metallized interlayer conductive hole (6) are connected to form split ring coil, and the sense of current of each layer split ring (5) is identical; Split ring coil coordinates with magnetic core (4) to be formed, and vertical direction imbeds inductance individuality; Split ring coil two ends are connected with other figure in metal pattern layer (2) respectively.
6. printed circuit board according to claim 5, is characterized in that, each inductance is connected to form cascaded structure or parallel-connection structure individual by outermost metal pattern layer (2).
7. printed circuit board according to claim 5, is characterized in that, split ring (5) is connected for directly to connect with the interlayer conductive hole (7) after metallization; The A/F of split ring (5) is not less than the radius in the hole after institute's connection metal.
8. printed circuit board according to claim 5, is characterized in that, split ring (5) is connected for be connected by electric conductor line with the interlayer conductive hole (6) after metallization.
9. a printed circuit board, is characterized in that, its inside has the circuit board unit (7) that the printed circuit board described in claim 5 or 6 is made, and this circuit board unit (7) is connected with external graphics by metallized conductive hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510206398.9A CN104780719A (en) | 2015-04-27 | 2015-04-27 | Method for embedding inductors in printed-circuit board and printed-circuit board adopted by method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510206398.9A CN104780719A (en) | 2015-04-27 | 2015-04-27 | Method for embedding inductors in printed-circuit board and printed-circuit board adopted by method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104780719A true CN104780719A (en) | 2015-07-15 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201510206398.9A Pending CN104780719A (en) | 2015-04-27 | 2015-04-27 | Method for embedding inductors in printed-circuit board and printed-circuit board adopted by method |
Country Status (1)
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| CN (1) | CN104780719A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112185684A (en) * | 2020-10-06 | 2021-01-05 | 广州添利电子科技有限公司 | Manufacturing process of embedded magnet transformer printed coil circuit board |
| TWI823278B (en) * | 2021-03-04 | 2023-11-21 | 大陸商珠海越亞半導體股份有限公司 | Method for manufacturing embedded support frame with integrated inductor |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0677342A (en) * | 1992-08-28 | 1994-03-18 | Kyocera Corp | Circuit board |
| CN1182964A (en) * | 1996-11-15 | 1998-05-27 | 凌沛清(音译) | Structure and fabrication process of inductors on semiconductor chip |
| US20050190035A1 (en) * | 2004-02-27 | 2005-09-01 | Wang Albert Z. | Compact inductor with stacked via magnetic cores for integrated circuits |
| CN1735316A (en) * | 2004-08-11 | 2006-02-15 | 日月光半导体制造股份有限公司 | Circuit base board |
| CN101320618A (en) * | 2008-03-25 | 2008-12-10 | 上海集成电路研发中心有限公司 | Inductor integrated on chip and corresponding integration method |
| CN101819870A (en) * | 2010-04-01 | 2010-09-01 | 深圳顺络电子股份有限公司 | Method for adjusting inductance value of bank wound coil component |
| CN204560027U (en) * | 2015-04-27 | 2015-08-12 | 博敏电子股份有限公司 | There is the printed circuit board imbedding inductance |
-
2015
- 2015-04-27 CN CN201510206398.9A patent/CN104780719A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0677342A (en) * | 1992-08-28 | 1994-03-18 | Kyocera Corp | Circuit board |
| CN1182964A (en) * | 1996-11-15 | 1998-05-27 | 凌沛清(音译) | Structure and fabrication process of inductors on semiconductor chip |
| US20050190035A1 (en) * | 2004-02-27 | 2005-09-01 | Wang Albert Z. | Compact inductor with stacked via magnetic cores for integrated circuits |
| CN1735316A (en) * | 2004-08-11 | 2006-02-15 | 日月光半导体制造股份有限公司 | Circuit base board |
| CN101320618A (en) * | 2008-03-25 | 2008-12-10 | 上海集成电路研发中心有限公司 | Inductor integrated on chip and corresponding integration method |
| CN101819870A (en) * | 2010-04-01 | 2010-09-01 | 深圳顺络电子股份有限公司 | Method for adjusting inductance value of bank wound coil component |
| CN204560027U (en) * | 2015-04-27 | 2015-08-12 | 博敏电子股份有限公司 | There is the printed circuit board imbedding inductance |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112185684A (en) * | 2020-10-06 | 2021-01-05 | 广州添利电子科技有限公司 | Manufacturing process of embedded magnet transformer printed coil circuit board |
| TWI823278B (en) * | 2021-03-04 | 2023-11-21 | 大陸商珠海越亞半導體股份有限公司 | Method for manufacturing embedded support frame with integrated inductor |
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Application publication date: 20150715 |
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| RJ01 | Rejection of invention patent application after publication |