CN211907196U - Integrated into one piece power coil for inductance - Google Patents
Integrated into one piece power coil for inductance Download PDFInfo
- Publication number
- CN211907196U CN211907196U CN202020892892.1U CN202020892892U CN211907196U CN 211907196 U CN211907196 U CN 211907196U CN 202020892892 U CN202020892892 U CN 202020892892U CN 211907196 U CN211907196 U CN 211907196U
- Authority
- CN
- China
- Prior art keywords
- coil
- turn
- layer
- power inductor
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Coils Or Transformers For Communication (AREA)
Abstract
The invention relates to an integrated power inductor coil, in particular to an integrated power inductor coil, which is a single-layer multi-ring or multi-layer multi-ring or single-ring multi-layer or combination of the coils, wherein high-temperature-resistant high-insulation organic matter films are adopted between layers to separate the layers and are connected in series and conducted through holes arranged on the coils. The coil for the integrally formed power inductor has the advantages of being high in coil density, low in direct-current resistance, large in saturation current, high in production efficiency and the like.
Description
Technical Field
The utility model relates to an electronic components part, concretely relates to coil for integrated into one piece power inductance and preparation method thereof.
Background
The inductor is a common electronic device component, and the coil for the power inductor is widely applied to electronic products such as displays, computers, mobile phones and the like. The inductor functions typically include choke, filtering and oscillation. The inductance of the inductor mainly depends on the number of turns (number of turns) of the coil, the winding mode, the material without the magnetic core and the magnetic core, and other factors, and the inductance is a physical quantity for measuring the electromagnetic induction capability of the coil, and how to optimize the inductance is one direction that needs to be researched by the technical personnel in the field.
SUMMERY OF THE UTILITY MODEL
For providing a coil for inductance that coil density is high, low direct current resistance and production efficiency are high, the utility model provides a following technical scheme:
the utility model provides an integrated into one piece is coil for power inductance, the coil be the combination of many circles of individual layer or many circles of multilayer or single circle multilayer or above-mentioned coil, adopt high temperature resistant high insulating nature organic matter film to separate and establish ties through the perforating hole of locating on each coil between the layer and switch on.
Furthermore, the single-layer multi-turn or multi-layer multi-turn or single-turn multi-layer coil is arranged on the copper foil.
Furthermore, the single-layer multi-turn coil refers to a multi-turn circuit on a layer of copper foil.
Furthermore, the multilayer multi-turn coil is formed by stacking and pressing single-layer multi-turn coils through copper foils, and circuits between layers are connected in series and conducted through copper-plated through holes.
Furthermore, the single-turn multilayer coil is formed by laminating and pressing single-turn circuits through copper foils, and the circuits between the layers are connected and conducted in series through copper-plated through holes.
Further, the through-hole corresponds to a position on each coil, a position on the copper foil, and a position on the organic film.
Furthermore, the through hole is circular or elliptical.
The utility model also provides a preparation method of integrated into one piece coil for power inductance, preparation method include following step:
(1) drilling the copper foil by adopting a drilling technology;
(2) plating through hole copper or surface copper by adopting an electro-coppering technology;
(3) defining a through hole or a circuit trace by adopting an exposure and development technology;
(4) removing the part needing to be provided with the through hole or the part needing not to be provided with the coil by adopting an etching technology;
(5) removing the organic insulating film in the etched through hole by adopting a laser drilling technology;
(6) pressing the organic insulating film or the copper foil together by adopting a hot pressing technology;
(7) stamping or cutting the coil through hole and the coil profile by a stamping or cutting technique.
Furthermore, the manufacturing method of the single-layer multi-turn coil is characterized in that the single-side copper foil is manufactured through the steps (3), (4), (6) and (7) in sequence.
Furthermore, the single-turn multilayer coil or the multi-turn multilayer coil is manufactured by etching an internal double-layer coil after double-sided copper foils are sequentially subjected to the operations of the steps (1), (2), (3) and (4), then vertically attaching the high-temperature-resistant high-insulation organic film and the copper foil to the double-layer coil through the step (6), then respectively enabling the newly attached copper foil to be connected and conducted with the internal coil in series through the steps (3), (4), (5) and (2), and finally performing the steps (3), (4), (6) and (7).
The beneficial effects of the utility model reside in that: the utility model discloses a coil for integrated into one piece inductance is the copper foil that adopts the low resistivity as main raw and other materials, through the copper facing, the etching, drilling or blind hole, the pressfitting, the many circles of individual layer of technical method preparation such as punching press or cutting, many circles of multilayer and the multilayer coil assembly of single circle, coil between the middle layer of coil assembly separates through high temperature resistant high insulating nature organic matter film, and come the series connection through the copper facing perforating hole and switch on, there is a circular or oval through hole in the middle of the coil assembly in addition, be used for filling the compound magnetic of magnetism when integrated into one piece power inductance production, improve the inductance value of integrated into one piece power inductance product. Compared with the conventional coil which is formed by winding an insulating layer coated with a copper wire, the coil for the inductor and the preparation method thereof can reduce the volume ratio of the insulating layer, so that the volume ratio of copper is correspondingly improved, the coil density is higher, the direct-current resistance is lower, and the coil has the characteristics of high coil density, low direct-current resistance, high production efficiency and the like.
Drawings
Fig. 1 is a schematic perspective view of an integrally formed coil for a power inductor according to the present invention;
fig. 2 is a cross-sectional view of fig. 1.
Detailed Description
The invention will be further explained and explained with reference to the drawings.
The utility model provides an integrated into one piece is coil for power inductance, the coil be the combination of many circles of individual layer or many circles of multilayer or single circle multilayer or above-mentioned coil, adopt high temperature resistant high insulating nature organic matter film to separate and establish ties through the perforating hole of locating on each coil between the layer and switch on. Referring to fig. 1, fig. 1 is a multilayer multi-turn coil, as shown in fig. 2, the multilayer multi-turn coil is composed of an upper single-layer multi-turn coil (1) and a lower single-layer multi-turn coil (2), wherein the single-layer multi-turn coil (1) is arranged on a copper foil (3), and the two are pressed together; the single-layer multi-turn (2), the copper foil (3) and the single-layer multi-turn (1) are separated by a high-temperature-resistant high-insulation organic film (4), and the two single-layer multi-turns (1 and 2) are connected by the through hole (5) penetrating through the single-layer multi-turn (1), the copper foil (3), the organic film (4) and the single-layer multi-turn (2).
Similarly, a multi-layer multi-turn or single-turn multi-layer coil is also provided on the copper foil and laminated together.
As shown in fig. 1 or fig. 2, the single-layer multi-turn coil means that a plurality of turns of a circuit are formed on a layer of copper foil.
As shown in figure 1 or figure 2, the multilayer multi-turn coil is formed by stacking and pressing single-layer multi-turn copper foils (3), and circuits between layers are connected in series and conducted through copper-plated through holes (5).
The single-turn multilayer coil is formed by superposing and pressing single-turn circuits through copper foils (3), and the circuits between layers are connected in series and conducted through copper-plated through holes (5).
The through hole (5) corresponds to the position on each coil, the position on the copper foil and the position on the organic film (4).
Preferably, the through-hole (5) is circular or elliptical.
The utility model also provides a preparation method of integrated into one piece coil for power inductance, preparation method include following step:
(1) drilling the copper foil by adopting a drilling technology;
(2) plating through hole copper or surface copper by adopting an electro-coppering technology;
(3) defining a through hole or a circuit trace by adopting an exposure and development technology;
(4) removing the part needing to be provided with the through hole or the part needing not to be provided with the coil by adopting an etching technology;
(5) removing the organic insulating film in the etched through hole by adopting a laser drilling technology;
(6) pressing the organic insulating film or the copper foil together by adopting a hot pressing technology;
(7) stamping or cutting the coil through hole and the coil profile by a stamping or cutting technique.
Furthermore, the manufacturing method of the single-layer multi-turn coil is characterized in that the single-side copper foil is manufactured through the steps (3), (4), (6) and (7) in sequence.
Furthermore, the single-turn multilayer coil or the multi-turn multilayer coil is manufactured by etching an internal double-layer coil after double-sided copper foils are sequentially subjected to the operations of the steps (1), (2), (3) and (4), then vertically attaching the high-temperature-resistant high-insulation organic film and the copper foil to the double-layer coil through the step (6), then respectively enabling the newly attached copper foil to be connected and conducted with the internal coil in series through the steps (3), (4), (5) and (2), and finally performing the steps (3), (4), (6) and (7).
Claims (7)
1. The coil for the power inductor is characterized in that the coil is a single-layer multi-turn or multi-layer multi-turn or single-turn multi-layer coil or a combination of the coils, and the layers are separated by a high-temperature-resistant high-insulation organic film and are connected in series and conducted through holes arranged on the coils.
2. The integrated power inductor as claimed in claim 1, wherein the single-layer multi-turn or multi-layer multi-turn or single-turn multi-layer coil is disposed on a copper foil.
3. The integrated power inductor as claimed in claim 1, wherein the single-layer multi-turn coil is formed by a plurality of turns on a copper foil.
4. The integrated power inductor coil as claimed in claim 1, wherein the multi-layer and multi-turn coil is formed by stacking and laminating a single layer and a plurality of turns with copper foils, and the circuits between the layers are connected in series through the copper-plated through holes.
5. The integrated power inductor coil as claimed in claim 1, wherein the single-turn multilayer coil is formed by laminating a single-turn circuit with copper foil, and the circuits between layers are connected in series through copper-plated through holes.
6. The integrally formed power inductor coil according to claim 1, wherein the through-hole corresponds to each coil, the copper foil, and the organic film.
7. The integrally formed power inductor coil according to claim 1, wherein the through hole has a circular or elliptical shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020892892.1U CN211907196U (en) | 2020-05-25 | 2020-05-25 | Integrated into one piece power coil for inductance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020892892.1U CN211907196U (en) | 2020-05-25 | 2020-05-25 | Integrated into one piece power coil for inductance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211907196U true CN211907196U (en) | 2020-11-10 |
Family
ID=73270299
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020892892.1U Active CN211907196U (en) | 2020-05-25 | 2020-05-25 | Integrated into one piece power coil for inductance |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211907196U (en) |
-
2020
- 2020-05-25 CN CN202020892892.1U patent/CN211907196U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6148500A (en) | Electronic inductive device and method for manufacturing | |
| CN104078221B (en) | Inductor and method for manufacturing the same | |
| CN207250269U (en) | Multilager base plate built in coil | |
| CN1846287B (en) | Fractional turns transformer with ferrite polymer core | |
| KR101983136B1 (en) | Power inductor and manufacturing method thereof | |
| EP3291254A1 (en) | Method related to laminated polymeric planar magnetics | |
| KR101532171B1 (en) | Inductor and Manufacturing Method for the Same | |
| KR20130091642A (en) | Miniature power inductor and methods of manufacture | |
| JP2013243330A (en) | Sheet-like inductor, inductor with built-in lamination substrate, and manufacturing method therefor | |
| CN101631433A (en) | Implementation method of printing thick copper foil in PCB | |
| CN106332447B (en) | A kind of induction structure and preparation method thereof for printed circuit board potting technology | |
| JP2005506713A (en) | Multilayer circuit and manufacturing method thereof | |
| TW200416755A (en) | Inductance element, laminated electronic component, laminated electronic component module and method for producing these element, component and module | |
| US9978499B2 (en) | Methods for manufacturing integrated magnetic components and LED power supply | |
| JP6048509B2 (en) | Multilayer inductor element | |
| JP6086370B2 (en) | Inductor built-in substrate manufacturing method, inductor built-in substrate, and power supply module using the same | |
| KR101338139B1 (en) | Power inductor | |
| CN211907196U (en) | Integrated into one piece power coil for inductance | |
| KR100733279B1 (en) | Method of fabricating printed circuit board with embedded inductor | |
| CN111477438A (en) | Coil for integrally-formed power inductor and preparation method thereof | |
| CN105761881A (en) | Planar winding coil for double-column magnetic core structure | |
| CN116153638A (en) | Manufacturing method of planar transformer and planar transformer | |
| CN104780719A (en) | Method for embedding inductors in printed-circuit board and printed-circuit board adopted by method | |
| KR101883036B1 (en) | Multilayered electronic component and multilayered chip antenna comprising the same | |
| TWI763499B (en) | Circuit board and its manufacturing method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |