CN106332447B - A kind of induction structure and preparation method thereof for printed circuit board potting technology - Google Patents
A kind of induction structure and preparation method thereof for printed circuit board potting technology Download PDFInfo
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- CN106332447B CN106332447B CN201610791943.XA CN201610791943A CN106332447B CN 106332447 B CN106332447 B CN 106332447B CN 201610791943 A CN201610791943 A CN 201610791943A CN 106332447 B CN106332447 B CN 106332447B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
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Abstract
The present invention provides a kind of induction structure and preparation method thereof for printed circuit board potting technology, belong to printed circuit integrated component technical field, the present invention mentions inductance inductance value and inductance in the stability using process by improving the circular mode of core configurations and coil to reach；Induction structure provided by the invention can reduce footprint area of the copper coil in PCB substrate, improve inductance element size micromation degree, induction structure obtained is small, performance is high；The present invention mainly uses pattern transfer technology, inter-level vias, windowing processing, plating and the techniques such as chemical plating, hot pressing increasing layer to form the induction structure for printed circuit board potting inductive technologies, the production method is simple, controllability is strong, with the process compatible of existing printed circuit board technology, be conducive to the component integration degree for improving printed circuit.
Description
Technical field
It is especially a kind of for printed circuit board potting technology the invention belongs to printed circuit integrated component technical field
Induction structure and preparation method thereof.
Background technology
The micromation of multifunction electronic information products requires to carry component and realizes electrical transmission with lightening development trend
Printed circuit product show higher integrated level, the realization of integrated level is mainly made in printed circuit by element potting
Intralamellar part.The printed circuit board of this integrated component reduces electronic information in addition to that can reduce the area shared by plate face laying element
Outside the three-dimensional dimension of product, realize that the minimum range of electric signal is transmitted since element is embedded in printed circuit intralamellar part, it is maximum
It eliminates to degree the attenuation problem of printed circuit signal and improves the integrality of signal transmission.
Potting inductance element, resistive element are the integrated main technique methods of printed circuit.Printed circuit embedded resistors
The method of element includes print process, galvanoplastic and etching method.The method of printing embedded resistors element is primarily limited to conductive carbon paste
It is unstable that resistance value is shown after solidification, it is difficult to form the resistive element of more smart plating.The method that embedded resistors element is electroplated is in copper
Line regional area nickel plating phosphorous layer and form resistive element, but the unstable resistance value essence for leading to nickel phosphorous layer of existingization plating formula
Degree is poor.The method for etching nickel phosphorus embedded resistors element is will to cover nickel phosphorus thin substrate to be laminated on copper-clad base plate, then passes through etching
Nickel phosphorus resistive element figure is formed to method choice, although can guarantee larger resistance stability, covers nickel phosphorus thin substrate
Cost it is very high without fit printed circuit low cost manufacturing.Therefore, printed circuit manufacturer only can be selectively high-end
Integrated resistor element in printed circuit.
Compared to integrated resistor element, the more aobvious advantage of printed circuit integrated inductor element, the reason is that the formation of inductance element
It only needs copper foil being etched into conductive coil；Although the technique of printed circuit potting inductance element is relatively easy, inductance member
The inductance value of part is smaller and can not play specific requirement.The method that tradition improves inductance value is to increase conductive coil quantity, still
So that the plate suqare occupied by inductance element becomes larger, the miniaturization for being unfavorable for printed circuit size manufactures for the increase of number of coils,
The manufacture and application of serious limitation potting inductance element.Therefore, it under the premise of ensureing that potting inductance element is compact in size, carries
The inductance value of high inductance element is the hot spot and difficult point of current printed circuit integrated technology exploitation.
Chinese invention patent《A kind of LTCC low-temperature co-fired ceramics power inductor》Application No. is CN201010114193.5
In disclose low-temperature co-fired ceramics (Low Temperature Co-fired Ceramic), LTCC techniques make potting magnetic core
Inductance element, used in ceramic material need at a temperature of 900 DEG C sinter molding, it is used mixed with core material epoxy resin
Have to thermally expand with ceramic material and mismatch characteristic, and conductive coil used is essentially conductive silver paste or conductive copper paste, sintering
Temperature is excessively high, conductive coil long-term work oxidation and thermally expands the problems such as mismatching and makes the technique can not be applied printing
The inductance element of circuit production potting magnetic core processed.Thus, researcher gradually develops the potting for meeting printed circuit process requirements
Core inductance element, such as：Chinese invention patent《The making side of magnetic core lamination type blind hole electromagnetic induction multilayer printed circuit board
Method》Application No. is disclosing to make potting magnetic core using laminating method in CN201410285999.9, then makes and lead in magnetic core
Through-hole, via hole form similar inductive circuit structure；Patent name is respectively《Induction type printed circuit board and its processing technology》、
《The production method of pcb board with embedment inductance component》With《Induction type printed circuit board》, number of patent application is respectively
Chinese patent and Chen Jian of CN200910266891.4, CN201210408784.2 and CN200920351884.X etc. are in document
《A kind of inductance core in an assembling process is embedded to PCB technologies》, once will etc. was in document《Bury the research and development of magnetic core PCB product》In
Similar potting core inductance element production method is reported；And Chinese invention patent《A kind of lamination being embedded into inductance magnet ring
Production method》Application No. is disclosures in CN201010548089.7 to show that via hole is moved to magnetic core respectively accounts for one with dielectric layer
Half region, but the process of potting magnetic core is substantially without excessive difference；This method institute using drill holes drilled through be easily destroyed magnetic core with
The binding force of substrate and the separation for causing magnetic core and substrate, and pure magnetic core exists to thermally expand with substrate media and mismatches, circuit
The reliability of panel products is by very big influence.Patent name is respectively《In printed circuit board be embedded to inductance method and its
Printed circuit board》With《Printed circuit board with embedment inductance》, number of patent application be respectively CN201510206398.9 and
The opening ring coil that the technical solution that the Chinese patent of CN201520262439.1 provides realizes through-hole interconnection surrounds magnetic core
Induction structure, but the mutual inductance of coil and magnetic core effect be only limited in in-plane, vertical direction fails to effectively improve
Inductance value, and the realization of multiple inter-level vias interconnection is easy to be influenced by corresponding precision, and it is reliable to be unfavorable for acquisition electrical transmission
With the induction structure of high inductance value effect.Chinese invention patent《Bury the production method and party's legal system of induction type printed circuit board
The circuit board obtained》Application No. is magnetic core is wrapped in resin material using injection molding forming method in CN201310216850.0, then
By pressing fixed magnetic core in substrate, although the method attempts the binding force at enhancing magnetic core edge and substrate media resin,
It is that magnetic core and its peripheral resin material, the coefficient of thermal expansion difference of base plate resin are big, when completing to press postcooling, magnetic core and tree
The thermal stress effect of fat easily causes plate bursting problem, equally exists process stability problem.Chinese utility model patent《It is a kind of small-sized
The NFC antenna of embedded FERRITE CORE》Application No. is in CN201320168284.6 then in wire coil upper and lower regional area
Thin magnetic core is bonded, can not then not increased the inductance value of coil in this method by the wire coil region that thin magnetic core covers, be unfavorable for obtaining
Obtain the inductance element of high quality.Chinese invention patent《A kind of preparation method of printed circuit board potting core inductance》Application No. is
Using chemical plating method in one layer of core material of conductive coil coating surface in CN201510375350.0, but this magnetic core material
Material, which has to pass through high-temperature heat treatment just, can cause lattice variations and generate magnetic effect, and tellite can not bear its processing
High temperature, the technique for being unfavorable for potting core structure are realized.Bang D H etc. are in document《Ni-Zn ferrite screen
printed power inductors for compact DC-DC power converter applications》(《Ni-
Zn ferrite silk-screen printing power inductances and its application in DC-DC power converter》), Sugawa Y etc. are in document
《Carbonyl-iron/epoxy composite magnetic core for planar power inductor used
in package-level power grid》(《Carbonyl iron/asphalt mixtures modified by epoxy resin for planar inductive inductance in package level power grid
Resin composite material magnetic core》) in propose that the method for coating magnetic material on inductance element surface enhances inductance value, but can only be in plane
Direction obtains the enhancing of inductance value, the enhancing effect unobvious of inductance element.Kim C H etc. are in document《Thick-copper-
buried inductors using anodized aluminum package substrates》(《Based on anodized aluminium
The thick copper potting inductance of package substrate》) in point out to realize the making of inductance coil in a manner of excess metal and to improve plate face flat
Whole property, but magnetic core is not added, the inductance value of inductance element can only be improved by increasing coil number, be unfavorable for the ruler of inductance element
Very little micromation.
Invention content
The present invention is provided for the existing potting core inductance structure technical problem low and unstable there are inductance inductance value
A kind of induction structure and preparation method thereof for printing board PCB potting technology.
The present invention adopts the following technical scheme that：
Technical solution 1：
A kind of induction structure for printed circuit board potting technology, including be etched in respectively double-sided copper-clad substrate top surface and
The first conductive coil 101 and the second conductive coil 102 of bottom surface and the magnetic core 7 in two lead loop；
First conductive coil 101 is two in the upright projection that second conductive coil, 102 place plane is formed
The inner end of conductive coil overlaps, and the inner end of the inner end of the first conductive coil 101 and the second conductive coil 102 is respectively equipped with the first weldering
Disk 201 and the second pad 202, first conductive coil 101 and second conductive coil 102 are by being set to described first
Via hole 301 between pad 201 and second pad 202 connects, and the inner wall of the via hole 301 is coated with uniform metal
Layer；
The non-lying copper region domain 1 and non-lying copper region domain two that the double-sided copper-clad substrate is formed through overetch conductive coil
602, the inner insulating layer 401 between the non-lying copper region domain 1 and the non-lying copper region domain 2 602 offers through-hole 501,
The position of opening of the through-hole 501 is located at the center in the non-lying copper region domain 1 and the non-lying copper region domain 2 602, and
501 size of the through-hole is no more than the size of the first circle coil of the first conductive coil 101 or the second conductive coil 102, institute
It includes clogging in vertical magnetic core 701,101 surface of the first conductive coil and the first conductive coil in the through-hole 501 to state magnetic core 7
It is not covered in the top surface magnetic core 702 in non-lying copper region domain 1 and 102 surface of the second conductive coil and the second conductive coil 102 in 101
The bottom surface magnetic core 703 in copper region 2 602.
Further, technical solution 2 is formed on the basis of the technical solution 1, further include in the technical solution 2 through
Windowing processing after respectively hot pressing in the top and bottom of the double-sided copper-clad substrate as increasing layer upper insulating medium layer 402 under
Insulating medium layer 403 and 203 He of third pad for being respectively arranged on 102 outer end of the first conductive coil 101 and the second conductive coil
4th pad 204；
The windowed regions of the upper insulating medium layer 402 and lower insulating medium layer 403 are respectively positioned on the double-sided copper-clad substrate
Non- lying copper region domain and conductive coil region are formed through overetch conductive coil, and windowed regions size is not less than conductive coil
The size in non-lying copper region domain is formed through overetch conductive coil with the double-sided copper-clad substrate；The third pad 203 is described
The corresponding region of top surface magnetic core 702 and the 4th pad 204 are respectively formed that fill out copper blind in the corresponding region of the bottom surface magnetic core 703
Hole 8 is to realize that the conductive coil on the double-sided copper-clad substrate is interconnected with outer circuit.
In the preferred embodiment of the present invention, the first conductive coil 101 and in the technical solution 1 and the technical solution 2
Two conductive coils 102 are plane multiturn coil and shape is identical, and first conductive coil 101 is in second conductive coil
In the upright projection that 102 place planes are formed in a conductive coil single-turn circular coil and single-turn circular coil in another conductive coil by
It is interior to sequentially staggered to form close winding structure outside.
The following technical solution 3 is the production method of induction structure disclosed in technical solution 1：
A kind of production method of induction structure for printed circuit board potting technology, includes the following steps：
Step A：After the top and bottom of double-sided copper-clad substrate carry out pattern transfer, etching obtains the first conductive coil
101 and second conductive coil 102；
Step B：101 inner end portion of the first conductive coil made from step A and 102 inner end of the second conductive coil divide it
Between drill out realize connection via, the inner wall of the via is then formed into via hole 301 after metalized, wherein
Bottom surface is respectively less than the inner end portion of two conductive coils on the via, and 101 inner end of the first conductive coil removes trepanning
Part form the first pad 201, the part that 102 inner end of the second conductive coil removes trepanning forms the second pad 202；
Step C：Double-sided copper-clad substrate is made to step B and carries out the through-hole 501 that windowing processing forms potting magnetic core 701,
In：The through-hole 501 is located at non-one 601 central part of lying copper region domain that the double-sided copper-clad substrate is formed through overetch conductive coil
Inner insulating layer 401 point between non-2 602 central part of lying copper region domain, and the trepanning size of the through-hole 501 is no more than the
The size of first circle coil of one conductive coil 101 or the second conductive coil 102；
Step D：By the filling of pulpous state magnetic composite vacuum in the through-hole 501,101 surface of the first conductive coil and
In non-lying copper region domain 1,102 surface of the second conductive coil and the second conductive coil 102 in first conductive coil 101 not
Lying copper region domain 2 602；Wait for that the solvent volatilization in pulpous state magnetic composite is complete, processing forms magnetic core 7 by being heating and curing, most
Obtained potting is in the induction structure of printed circuit board eventually.
The following technical solution 4 is the production method of induction structure disclosed in technical solution 2：
A kind of production method of induction structure for printed circuit board potting technology, includes the following steps：
Step A：After the top and bottom of double-sided copper-clad substrate carry out pattern transfer, etching obtains the first conductive coil
101 and second conductive coil 102；
Step B：It is drilled out between the first conductive coil 101 and the second conductive coil 102 made from step A and realizes connection
Then the inner wall of the via is formed via hole 301 by via after metalized；Wherein：Bottom surface on the via
The inner end portion of conductive coil and the inner end portion of respectively less than two conductive coils are respectively positioned on, in first conductive coil 101
The part that end removes trepanning forms the first pad 201, and the part that 102 inner end of the second conductive coil removes trepanning forms second
Pad 202；
Step C：A plurality of insulating medium layers are separately taken to carry out windowing processing, wherein：Windowed regions be described two-sided cover
Conductive coil region on copper base, and windowed regions size is not less than the double-sided copper-clad substrate through overetch conductive coil
It is formed by non-lying copper region domain 1 or the non-lying copper region domain 2 602；
Step D：It is another that surface layer copper foil is taken to be pressed on the obtained double-sided copper-clad substrates of step B with the obtained outer layer insulation medium heats of step C
Top and bottom as increasing layer, and then form multilayer printed circuit board；
Step E：Double-sided copper-clad substrate is made to step D and carries out the through-hole 501 that windowing processing forms potting magnetic core 701,
In：The through-hole 501 is set to the center in the non-lying copper region domain 1 that the double-sided copper-clad substrate is formed through overetch conductive coil
Inner insulating layer 401 between part and the central part in non-lying copper region domain 2 602, and 501 size of the through-hole is no more than first
The size of first circle coil of conductive coil 101 or the second conductive coil 102；
Step F：By the filling of pulpous state magnetic composite vacuum in the through-hole 501,101 surface of the first conductive coil and
In non-lying copper region domain 1,102 surface of the second conductive coil and the second conductive coil 102 in first conductive coil 101 not
Lying copper region domain 2 602；It waits for that the solvent volatilization in pulpous state magnetic composite is complete, by the processing that is heating and curing, forms magnetic core 7；
Step G：Use laser ablation process to form blind hole with realize the conductive coil on the double-sided copper-clad substrate with it is outer
Layer circuit interconnection, ablated area are magnetic core area and the 4th weldering that third pad 203 corresponds to the double-sided copper-clad substrate top surface
Disk 204 correspond to the double-sided copper-clad substrate bottom surface magnetic core area, then gained blind hole is carried out copper plating treatment extremely with it is outer
Insulation layer height is identical to fill out copper blind hole 8 to be formed, and finally obtained potting is in the induction structure of multilayer printed circuit board.
In the preferred embodiment of the present invention, the first conductive coil in the step A of the technical solution 3 and the technical solution 4
101 be plane multiturn coil with the second conductive coil 102 and shape is identical, and first conductive coil 101 is described second
The inner end of two conductive coils overlaps and single turn in a conductive coil in the upright projection that 102 place plane of conductive coil is formed
Coil and single-turn circular coil in another conductive coil are sequentially staggered to form close winding structure from the inside to the outside.
In the preferred embodiment of the present invention, magnetic composite is to pass through magnetic in the technical solution 3 and the technical solution 4
Property particle is combined with macromolecule resin.
Compared with prior art, the invention has the advantages that：
Inductance element can be effectively improved provided by the present invention for the induction structure of printed circuit board potting inductive technologies
Inductance value, compared to it is traditional on the upper layer of plane inductive coil or lower layer as shown in Figure 1, or in helically coiling hub of a spool potting
The structure of magnetic core is as shown in Fig. 2, the present invention is by improving the construction of magnetic core, and then inductance element is in vertical direction and in-plane
Obtain the enhancing of inductance value；By improving the circular mode of coil, not only contributes to inductance element and spatially generate uniform point
The magnetic field of cloth, and footprint area of the copper coil in PCB substrate can be reduced, improve inductance element size micromation journey
Degree.The present invention can utilize each major parameter of the accuracy of printing technology, stringent control inductor size, and take into account multilayer
Pcb board prepares, presses technology, meets the requirement of printed circuit low cost manufacturing, industrialization easy to implement.
Description of the drawings
Fig. 1 is in the prior art in plane inductive coil upper layer or the structural schematic diagram of lower layer's potting magnetic core.
Fig. 2 is in the prior art in the structural schematic diagram of helically coiling hub of a spool potting magnetic core.
Fig. 3 is that double-sided copper-clad substrate top surface and the first conductive coil and the second conductor wire of bottom surface are located in the present invention
Circle realizes the space schematic diagram of interconnection by via hole；Wherein, 101 be the first conductive coil, and 102 be the second conductive coil, 201
It is the first pad, 202 be the second pad, and 203 be third pad, and 204 be the 4th pad, and 301 be via hole.
Fig. 4 is the vertical view of through-hole of the present invention；Wherein, 501 be through-hole, and 601 be double-sided copper-clad substrate top surface etching first
The non-lying copper region domain one that conductive coil is formed.
Fig. 5 is the schematic diagram of magnetic core in the present embodiment induction structure；Wherein, 401 be inner insulating layer, and 7 be the entire of inductance
Core portion is made of following three parts：701 be filling in the vertical magnetic core of through-hole, and 702 be top surface magnetic core, and 703 be bottom surface magnetic
Core.
Fig. 6 is that the first conductive coil forms showing for upright projection in plane where the second conductive coil in the embodiment of the present invention
It is intended to；Wherein, 101 be the first conductive coil, and 102 be the second conductive coil, and 501 be through-hole, and 602 be double-sided copper-clad substrate bottom surface
Etch the non-lying copper region domain two of the second conductive coil formation.
Fig. 7 is the cross-sectional view of induction structure in multilayer printed circuit board in the embodiment of the present invention；Wherein, 101 be first to lead
Electric coil, 102 be the second conductive coil, and 201 be the first pad, and 202 be the second pad, and 203 be third pad, and 204 be the 4th
Pad, 301 be via hole, and 401 be inner insulating layer, and 402 be upper insulating medium layer, and 403 be lower insulating medium layer, and 7 be magnetic core, 8
It is to fill out copper blind hole.
Specific implementation mode
The present invention is described in detail below in conjunction with Figure of description and embodiment：
In existing PCB pottings inductive technologies, due to the limitation of potting area, most of inductors bury be only capable of coiling a few,
Its inductance value very little, and it is the function value for improving potting inductor, usually the core material of high magnetic permeability is wound in coil,
For the winding method of magnetic core, most-often used is on the upper layer of plane inductive coil or lower layer as shown in Figure 1, or in spiral winding
The structure of hub of a spool potting magnetic core processed on plane inductive coil upper layer or lower layer's potting magnetic core as shown in Fig. 2, improve inductance value
Production method is relatively easy, but, since coil does not have direct wound core, thus has very much to the raising of the function value of inductor
Limit.And for spiral in ductor, coil can completely by magnetic core coiling in its center, this magnetic core potting structure can be larger
Ground improves the function value of inductor, however, due to spiral in ductor complex manufacturing technology, if will simultaneously by magnetic core potting in
Hub of a spool, manufacture difficulty will be very big, and this structure is unsuitable for the micromation of device.
Embodiment 1：
A kind of induction structure for printed circuit board potting technology, including be etched in respectively double-sided copper-clad substrate top surface and
The first conductive coil 101 and the second conductive coil 102 of bottom surface and the magnetic core 7 in two lead loop；Described first leads
The inner end of two conductive coils in the upright projection that second conductive coil, 102 place plane is formed of electric coil 101 overlaps,
The inner end of first conductive coil 101 and the inner end of the second conductive coil 102 are respectively equipped with the first pad 201 and the second pad 202,
First conductive coil 101 and second conductive coil 102 are by being set to first pad 201 and second weldering
Via hole 301 between disk 202 connects, and the inner wall of the via hole 301 is coated with uniform metal layer such as (shown in Fig. 3), described
The non-lying copper region domain 1 and non-lying copper region domain 2 602 that double-sided copper-clad substrate is formed through overetch conductive coil are equipped with by opening
The through-hole 501 that window is handled, the through-hole 501 be set to the non-lying copper region domain 1 and the non-lying copper region domain 2 602 it
Between inner insulating layer 401, the position of opening of the through-hole 501 is located at the central part in the non-lying copper region domain 1 and described
The central part in non-lying copper region domain 2 602, and the trepanning size of the through-hole 501 be no more than the first conductive coil 101 or
The size of first circle coil of the second conductive coil 102, the magnetic core 7 include filling in the vertical magnetic core in the through-hole 501
701, the top surface magnetic core 702 in the non-lying copper region domain 1 in 101 surface of the first conductive coil and the first conductive coil 101,
The bottom surface magnetic core 703 in non-lying copper region domain 2 602 in second conductive coil, 102 surface and the second conductive coil 102.
Wherein, double-sided copper-clad substrate top surface and the first conductive coil 101 and the second conductive coil 102 of bottom surface are located at
The space schematic diagram of interconnection is realized by via hole 301 as shown in figure 3, the inner end of the first conductive coil 101 is (also referred to as first
End) it is connected by straight via hole with the inner end (also referred to as head end) of the second conductive coil 102, it needs in the production process
It is drilled out in the substrate between the inner end portion of the first conductive coil 101 and the inner end portion of the second conductive coil 102
The via for realizing connection, then forms via hole 301, the via hole by the inner wall of the via after metalized
301 inner wall is coated with uniform metal layer；Wherein：Bottom surface is respectively positioned on the inner end portion of conductive coil and small on the via
In the inner end portion of two conductive coils, the part that 101 inner end of the first conductive coil removes trepanning forms the first pad
201, the part that 102 inner end of the second conductive coil removes trepanning forms the second pad 202, therefore, first conductor wire
Circle 101 and second conductive coil 102 are by being set to leading between first pad 201 and second pad 202
Through-hole 301 connects.
Wherein, the vertical view of through-hole of the present invention is as shown in Figure 4；Through-hole 501 is disposed in double-sided copper-clad substrate for holding
Magnetic core composite material of receiving forms magnetic core 701 in turn, and non-lying copper region domain 1 and non-lying copper region domain 2 602 are double-sided copper-clad substrates
The non-lying copper region domain formed through overetch conductive coil is located in conductive coil to ensure to be made magnetic core 7, then in non-lying copper region domain
Central area and size be no more than the first conductive coil 101 or the second conductive coil 102 the first circle coil size area
Domain carries out windowing processing, and then forms through-hole 501.
Wherein, the construction of magnetic core is as shown in Figure 5 in invention induction structure, wherein 7 be magnetic core；The magnetic core of the present embodiment
It makes specific as follows：Vertical magnetic core 701 is to clog pulpous state magnetic composite in through-hole 501；Top surface magnetic core 702 is by pulpous state
Magnetic composite is coated in the non-lying copper region domain 1 in 101 surface of the first conductive coil and the first conductive coil 101,
Bottom surface magnetic core is to be coated on pulpous state magnetic composite in 102 surface of the second conductive coil and the second conductive coil 102 not
In lying copper region domain 2 602, after the solvent volatilization completely in pulpous state magnetic composite, by the processing that is heating and curing, magnetic is completed
The making of core.
Preferably, the winding method of coil can make improvements, as shown in fig. 6, the first conductive coil 101 and the second conductor wire
Circle 102 is plane multiturn coil and shape is identical, wherein：The shape of coil can be multiturn annular, quadrangle or polygon
Shape, further, the first conductive coil 101 conduction in the upright projection that 102 place plane of the second conductive coil is formed
Single-turn circular coil and single-turn circular coil in another conductive coil are sequentially staggered to be formed tightly around knot from the inside to the outside in coil
Structure, and then be conducive to reduce copper coil while inductance element spatially generates equally distributed magnetic field in PCB substrate
On footprint area, improve inductance element size micromation degree.
Embodiment 2：
The production method of a kind of induction structure for printed circuit board potting technology, which is characterized in that including following step
Suddenly：
Step A：After the top and bottom of double-sided copper-clad substrate carry out pattern transfer, etching obtains the first conductive coil
101 and second conductive coil 102, wherein：First conductive coil 101 forms vertical in 102 place plane of the second conductive coil
The inner end of two conductive coils overlaps and single-turn circular coil and single turn line in another conductive coil in a conductive coil in projection
Circle is sequentially staggered to form close winding structure from the inside to the outside；
Step B：Using between digital control drilling machine the first conductive coil 101 and second conductive coil 102 made from step A
The via for realizing connection is drilled out, the inner wall of the via is then formed into via hole 301 after metalized；Wherein：Institute
It states bottom surface on via and is respectively positioned on the inner end portion of conductive coil and the inner end portion of respectively less than two conductive coils, described first
The part that 101 inner end of conductive coil removes trepanning forms the first pad 201, and 102 inner end of the second conductive coil removes trepanning
Part formed the second pad 202；
Step C：Separately two insulating medium layers is taken to carry out windowing processing, wherein：Windowed regions be the double-sided copper-clad
Conductive coil region on substrate, and windowed regions size is not less than the double-sided copper-clad substrate through overetch conductive coil institute
The non-lying copper region domain 1 or non-lying copper region domain 2 602 formed；
Step D：Outer layer insulation medium is made as upper insulating medium layer 402 and lower insulating medium layer 403 in step C
The top and bottom of hot pressing double-sided copper-clad substrate made from step B are distinguished with the surface layer copper foil separately taken as increasing layer, and then shape
At multilayer printed circuit board；
Step E：Double-sided copper-clad substrate is made to step D, windowing processing is carried out on inner insulating layer 401 using milling cutter device
The through-hole 501 of potting magnetic core 701 is formed, wherein：The position of opening of the through-hole 501 is located at the double-sided copper-clad substrate warp
The center at the center and non-lying copper region domain 2 602 in the non-lying copper region domain 1 that overetch conductive coil is formed, and the through-hole
501 trepanning size is no more than the size of the first circle coil of the first conductive coil 101 or the second conductive coil 102；
Step F：By the filling of pulpous state magnetic composite vacuum in the through-hole 501,101 surface of the first conductive coil and
In non-lying copper region domain 1,102 surface of the second conductive coil and the second conductive coil 102 in first conductive coil 101 not
Lying copper region domain 2 602；It waits for that the solvent volatilization in pulpous state magnetic composite is complete, by the processing that is heating and curing, forms magnetic core 7；
Step G：Use laser ablation process to form blind hole with realize the conductive coil on the double-sided copper-clad substrate with it is outer
Layer circuit interconnection, ablated area are magnetic core area and the 4th weldering that third pad 203 corresponds to the double-sided copper-clad substrate top surface
Disk 204 correspond to the double-sided copper-clad substrate top surface magnetic core area, then gained blind hole is carried out copper plating treatment extremely with it is outer
Insulation layer height is identical to fill out copper blind hole 8 to be formed, and potting is finally made in the induction structure of multilayer printed circuit board (such as Fig. 7 institutes
It is shown as the cross-sectional view of induction structure in the present embodiment multilayer printed circuit board).
The embodiments of the present invention have been described in detail above, but content is only the preferred embodiment of the present invention,
And without of the invention with limitation.All any modifications made in the application range of the present invention, equivalent replacement and improvement etc. should all
It is included within protection scope of the present invention.
Claims (7)
1. a kind of induction structure for printed circuit board potting technology, which is characterized in that including being etched in double-sided copper-clad respectively
The first conductive coil (101) and the second conductive coil (102) and the magnetic in two lead loop of substrate top surface and bottom surface
Core (7)；
First conductive coil (101) is two in the upright projection that plane where second conductive coil (102) is formed
The inner end of conductive coil overlaps, and the inner end of the first conductive coil (101) and the inner end of the second conductive coil (102) are respectively equipped with the
One pad (201) and the second pad (202), first conductive coil (101) and second conductive coil (102) are by setting
Via hole (301) connection being placed between first pad (201) and second pad (202), the via hole (301)
Inner wall be coated with uniform metal layer；
The non-lying copper region domain one (601) and non-lying copper region domain two that the double-sided copper-clad substrate is formed through overetch conductive coil
(602), through-hole (501) is set to the inner insulating layer between non-lying copper region domain one (601) and the non-lying copper region domain two (602)
(401), the position of opening of the through-hole (501) is located at the central part of the non-lying copper region domain one (601) and described does not cover copper
The central part in region two (602), and the trepanning size of the through-hole (501) be no more than the first conductive coil (101) or
The size of first circle coil of the second conductive coil (102)；The magnetic core (7) includes filling in hanging down in the through-hole (501)
The top surface of non-lying copper region domain one (601) in straight magnetic core (701), the first conductive coil (101) surface and the first conductive coil (101)
The bottom surface of non-lying copper region domain two (602) in magnetic core (702) and the second conductive coil (102) surface and the second conductive coil (102)
Magnetic core (703).
2. a kind of induction structure for printed circuit board potting technology according to claim 1, which is characterized in that described
First conductive coil (101) is plane multiturn coil with second conductive coil (102) and shape is identical, and described first leads
Single turn in a conductive coil in the upright projection that electric coil (101) plane where second conductive coil (102) is formed
Coil and single-turn circular coil in another conductive coil are sequentially staggered to form close winding structure from the inside to the outside.
3. a kind of induction structure for printed circuit board potting technology according to claim 1 or 2, which is characterized in that
Further include that upper dielectric of the hot pressing in the top and bottom of the double-sided copper-clad substrate as increasing layer is distinguished after windowing is handled
Layer (402) and lower insulating medium layer (403) and it is respectively arranged on the first conductive coil (101) outer end and the second conductive coil
(102) the third pad (203) and the 4th pad (204) of outer end；
The windowed regions of the upper insulating medium layer (402) and lower insulating medium layer (403) are the double-sided copper-clad substrate warp
Overetch conductive coil forms non-lying copper region domain and conductive coil region；The third pad (203) is in the top surface magnetic
The corresponding region of core (702) and the 4th pad (204) are respectively formed that fill out copper blind in the corresponding region of the bottom surface magnetic core (703)
Hole (8) is to realize that the conductive coil on the double-sided copper-clad substrate is interconnected with outer circuit.
4. a kind of production method of induction structure for printed circuit board potting technology, which is characterized in that include the following steps：
Step A：After the top and bottom of double-sided copper-clad substrate carry out pattern transfer, etching obtains the first conductive coil (101)
With the second conductive coil (102)；
Step B：The first conductive coil (101) inner end portion made from step A and the second conductive coil (102) inner end divide it
Between drill out realize connection via, then the inner wall of the via is formed to via hole (301) after metalized,
In, bottom surface is respectively less than the inner end portion of two conductive coils on the via, and the first conductive coil (101) inner end removes
The part of trepanning forms the first pad (201), and the part that the second conductive coil (102) inner end removes trepanning forms the second weldering
Disk (202)；
Step C：Double-sided copper-clad substrate is made to step B and carries out the through-hole (501) that windowing processing forms potting magnetic core (701),
In：The through-hole (501) is set in the non-lying copper region domain one (601) that the double-sided copper-clad substrate is formed through overetch conductive coil
Inner insulating layer (401) of the center portion point between two (602) central part of non-lying copper region domain, and the trepanning of the through-hole (501) is big
The size of small the first circle coil for being no more than the first conductive coil (101) or the second conductive coil (102)；
Step D：By the filling of pulpous state magnetic composite vacuum in the through-hole (501), the first conductive coil (101) surface and
Non- lying copper region domain one (601), the second conductive coil (102) surface and the second conductive coil in first conductive coil (101)
(102) the non-lying copper region domain two (602) in；Wait for that the solvent volatilization in pulpous state magnetic composite is complete, by the place that is heating and curing
Reason forms magnetic core (7), and finally obtained potting is in the induction structure of printed circuit board.
5. a kind of production method of induction structure for printed circuit board potting technology, which is characterized in that include the following steps：
Step A：After the top and bottom of double-sided copper-clad substrate carry out pattern transfer, etching obtains the first conductive coil (101)
With the second conductive coil (102)；
Step B：It is drilled out between the first conductive coil (101) and the second conductive coil (102) made from step A and realizes connection
Then the inner wall of the via is formed via hole (301) by via after metalized；Wherein：It goes to the bottom on the via
Face is respectively positioned on the inner end portion of conductive coil and the inner end portion of respectively less than two conductive coils, first conductive coil
(101) inner end removes part the first pad of formation (201) of trepanning, and the second conductive coil (102) inner end removes trepanning
Part forms the second pad (202)；
Step C：A plurality of insulating medium layers are separately taken to carry out windowing processing, wherein：Windowed regions be the double-sided copper-clad base
Conductive coil region on plate, and windowed regions size is not less than the double-sided copper-clad substrate through overetch conductive coil institute
The non-lying copper region domain one (601) formed or non-lying copper region domain two (602)；
Step D：It is another to take surface layer copper foil that the top that outer layer insulation medium heat is pressed on the obtained double-sided copper-clad substrates of step B is made with step C
Face and bottom surface form multilayer printed circuit board as increasing layer；
Step E：Double-sided copper-clad substrate is made to step D and carries out the through-hole (501) that windowing processing forms potting magnetic core (7), wherein：
The through-hole (501) is set in the non-lying copper region domain one (601) that the double-sided copper-clad substrate is formed through overetch conductive coil
Inner insulating layer (401) of the center portion point between the central part in non-lying copper region domain two (602), and the trepanning of the through-hole (501)
Size is no more than the size of the first circle coil of the first conductive coil (101) or the second conductive coil (102)；
Step F：By the filling of pulpous state magnetic composite vacuum in the through-hole (501), the first conductive coil (101) surface and
Non- lying copper region domain one (601), the second conductive coil (102) surface and the second conductive coil in first conductive coil (101)
(102) the non-lying copper region domain two (602) in；Wait for that the solvent volatilization in pulpous state magnetic composite is complete, by the place that is heating and curing
Reason forms magnetic core (7)；
Step G：Laser ablation process is used to form blind hole to realize the conductive coil on the double-sided copper-clad substrate and outer layer electricity
Road interconnects, and ablated area is magnetic core area and the 4th pad that third pad (203) corresponds to the double-sided copper-clad substrate top surface
(204) correspond to the double-sided copper-clad substrate bottom surface magnetic core area, then gained blind hole is carried out copper plating treatment extremely with it is outer
Insulation layer height is identical to fill out copper blind hole (8) to be formed, and finally obtained potting is in the induction structure of multilayer printed circuit board.
6. a kind of production method of induction structure for printed circuit board potting technology according to claim 4 or 5,
It is characterized in that, the first conductive coil (101) and the second conductive coil (102) are plane multiturn coil and shape in the step A
Shape is identical, and first conductive coil (101) is two in the upright projection that plane where second conductive coil (102) is formed
The inner end of a conductive coil overlap and in a conductive coil single-turn circular coil and single-turn circular coil in another conductive coil by it is interior extremely
It is outer sequentially staggered to form close winding structure.
7. a kind of production method of induction structure for printed circuit board potting technology according to claim 4 or 5,
It is characterized in that, the magnetic composite includes magnetic-particle and macromolecule resin.
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| CN108364765B (en) * | 2018-02-09 | 2019-07-12 | 电子科技大学 | A kind of potting core inductance and preparation method thereof |
| CN108401368A (en) * | 2018-04-26 | 2018-08-14 | 维沃移动通信有限公司 | A kind of circuit board and electronic equipment |
| FR3083365B1 (en) * | 2018-06-27 | 2020-07-17 | Safran Electronics & Defense | TRANSFORMER HAVING A PRINTED CIRCUIT |
| CN111145996A (en) | 2018-11-02 | 2020-05-12 | 台达电子企业管理（上海）有限公司 | Method for manufacturing magnetic element and magnetic element |
| CN211045436U (en) * | 2019-07-07 | 2020-07-17 | 深南电路股份有限公司 | Circuit board |
| CN113539650B (en) * | 2020-04-17 | 2024-01-05 | 深南电路股份有限公司 | Method for processing inductance device in printed circuit board and printed circuit board |
| CN112382574B (en) * | 2020-10-29 | 2021-10-29 | 珠海越亚半导体股份有限公司 | Packaging substrate with buried magnetic inductor structure and manufacturing method thereof |
| CN117059600A (en) * | 2022-05-06 | 2023-11-14 | 华为技术有限公司 | Substrate, packaging structure and electronic equipment |
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| JP2002185099A (en) * | 2000-12-18 | 2002-06-28 | Multi:Kk | Printed circuit board and its manufacturing method |
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| JP2002185099A (en) * | 2000-12-18 | 2002-06-28 | Multi:Kk | Printed circuit board and its manufacturing method |
| CN101593612A (en) * | 2009-04-03 | 2009-12-02 | 江苏苏美达机电有限公司 | A kind of planar micro-strip inductance coil and preparation method thereof |
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