CN114678208B - Manufacturing method of all-resin sheet type inductor - Google Patents
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 67
- 239000011347 resin Substances 0.000 title claims abstract description 29
- 229920005989 resin Polymers 0.000 title claims abstract description 29
- 229910052802 copper Inorganic materials 0.000 claims abstract description 62
- 239000010949 copper Substances 0.000 claims abstract description 62
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 56
- 238000000034 method Methods 0.000 claims abstract description 43
- 238000009713 electroplating Methods 0.000 claims abstract description 15
- 239000000758 substrate Substances 0.000 claims description 74
- 238000005530 etching Methods 0.000 claims description 15
- 230000008719 thickening Effects 0.000 claims description 7
- 230000003197 catalytic effect Effects 0.000 claims description 6
- 238000000227 grinding Methods 0.000 claims description 6
- 238000007639 printing Methods 0.000 claims description 6
- 238000007772 electroless plating Methods 0.000 claims description 4
- 238000007641 inkjet printing Methods 0.000 claims description 3
- 238000005507 spraying Methods 0.000 claims description 3
- 229910052718 tin Inorganic materials 0.000 claims description 2
- 238000007731 hot pressing Methods 0.000 claims 1
- 238000000016 photochemical curing Methods 0.000 claims 1
- 230000008569 process Effects 0.000 abstract description 7
- 238000005516 engineering process Methods 0.000 description 4
- 238000004804 winding Methods 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 229910001035 Soft ferrite Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004146 energy storage Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/25—Process efficiency
Abstract
The invention provides a manufacturing method of a full-resin sheet inductor, which comprises the following steps: manufacturing a first coil and a first layer of electrode, and then, sticking a film, exposing, developing and electroplating to manufacture a first copper column and a second layer of electrode; manufacturing a second coil, a third layer electrode, a second copper column and a fourth layer electrode by using the same method as the previous step; the method comprises the steps of taking an alternating structure of a first coil, a first copper column, a second coil and a second copper column as a basic unit, and circularly manufacturing the basic unit upwards to obtain a full-resin sheet type inductor; compared with the traditional chip inductor manufacturing method, the manufacturing process is greatly simplified, and the process difficulty is reduced. Meanwhile, the chip inductor manufactured by the invention realizes the integrated manufacture of the L-shaped terminal electrode and the coil.
Description
Technical Field
The invention belongs to the field of inductors, and particularly relates to a manufacturing method of an all-resin sheet type inductor.
Background
The inductor can convert electric energy into magnetic energy to be stored, and plays roles of energy storage, filtering and resonance in a circuit. With the vigorous development of mobile communication technology, the high integration and the light and thin of the communication equipment enable electronic components to be miniaturized, and the chip-type of the inductance element is a necessary trend of reducing the volume of products and improving the assembly efficiency. Chip inductors are classified into two main types, winding type and laminated type. The wire-wound inductor is formed by winding a thin wire around a soft ferrite core, and the outer layer is generally sealed with a resin. The process has strong inheritance, but has limited volume miniaturization. The chip laminated inductor is formed by alternately printing, laminating and sintering ferrite slurry and conductor slurry without winding to form a closed magnetic circuit; the method adopts advanced thick film multilayer passivation technology and lamination production technology to realize microminiature surface mounting. The traditional manufacturing method has complex manufacturing flow and poor reliability of the inductor, cannot realize integrated manufacturing of the coil and the electrode, and cannot continuously reduce the size of the chip inductor, so that a new process needs to be developed for manufacturing.
The Chinese patent of the invention (CN 201910078314.6) discloses a method for manufacturing a chip inductor by combining a winding process and a multilayer printing technology. The method can manufacture the multi-layer chip inductor without high-temperature sintering, but the reduction of the inductor size is limited. The Chinese patent of the invention, namely a patch type inductor and a manufacturing method thereof (application number is CN 201811209431.3), discloses a manufacturing method for alternately forming an insulating layer and a patterned metal structure, and can realize miniaturization of the chip type inductor and accurate control of the inductor size. The insulating layer in this method requires the fabrication of a via structure to connect the inductor coils of adjacent layers, which makes the fabrication process very complicated and does not guarantee the reliability of the connection of the via metal and the coil.
Disclosure of Invention
In view of the above, the invention provides a manufacturing method of a full resin chip inductor, which simplifies the manufacturing flow of the chip inductor and simultaneously realizes the integrated manufacturing of the terminal electrode by manufacturing the coil circuit and the electrode pattern by an addition method aiming at the condition that the existing chip inductor has complex process flow and cannot continuously reduce the size. In addition, fine lines can be made using an addition method, enabling further reductions in chip inductor size.
The technical scheme of the invention is as follows:
a manufacturing method of an all-resin sheet inductor comprises the following steps:
step (1): forming a first layer of pattern, wherein the first layer of pattern comprises a first coil and a first layer of electrode, and the pattern is manufactured by one of the following two methods:
method 1: spraying catalytic ink on the first substrate 101 by using an ink-jet printing method, and then performing electroless plating to form a first coil and a first layer electrode in an ink area, thereby obtaining a second substrate 102 with a first coil 304;
method 2: forming a seed layer with the thickness of 2 mu m on the first substrate 101, then carrying out film pasting, exposure and development on the seed layer, exposing the areas where the coils and the electrodes are positioned, thickening the patterns of the areas where the coils and the electrodes are positioned in an electroplating mode, and obtaining a second substrate 102 containing the seed layer and the first coils after film stripping;
step (2): manufacturing a second layer of pattern, wherein the second layer of pattern comprises a first copper column and a second layer of electrode, and the two conditions are as follows:
case 1: after the first coil and the first layer electrode are manufactured by adopting the method 1 in the step (1), film pasting, exposure and development are carried out on the pattern surface of the second substrate 102, the areas of the copper columns and the electrode patterns are exposed, the first copper columns and the second layer electrode are grown by electroplating, and the third substrate 103 is obtained; forming a resin layer on the third substrate 103 pattern, and then grinding to expose the tops of the first copper pillars and the second electrode pattern;
case 2: after a first layer of pattern is manufactured by adopting the method 2 in the step (1), film pasting, exposure and development are carried out on the pattern surface of the second substrate 102, the areas of the copper columns and the electrode patterns are exposed, a first copper column and a second layer of electrode are grown through electroplating, and the second layer of electrode is formed by directly electroplating and growing on the first layer of electrode; performing differential etching after film removal, and etching the seed layer to obtain a third substrate 103; forming a resin layer on the third substrate 103 pattern, and then grinding to expose the tops of the first copper pillars and the second electrode pattern;
step (3) continuing to manufacture a second coil and a third layer electrode on the ground third substrate 103 according to the manufacturing method of the coil and the electrode in the step (1), so as to obtain a third layer pattern of a fourth substrate 104 with a second coil 307;
step (4) continuing to manufacture a second copper pillar and a fourth layer of electrode on the fourth substrate 104 according to the manufacturing method of the copper pillar and the electrode in the step (2), so as to obtain a fourth layer of pattern of the fifth substrate 105 with the second copper pillar 308;
step (5) takes an alternating structure of a first coil, a first copper column, a second coil and a second copper column from bottom to top as a basic unit, and circularly and upwards manufacturing the alternating structure according to the methods in the steps (1) - (4) to obtain a sixth substrate 106 with a multi-layer coil structure with a (2N-1) layer pattern, wherein N is more than or equal to 3;
step (6) continuously thickening the electrode pattern by using the pattern manufacturing method in the step (1), removing the film, and performing differential etching to obtain a seventh substrate 107; and (3) continuously using the pattern manufacturing method in the step (1) to widen the electrode at the outermost layer, removing the film, and performing differential etching to obtain the N-turn coil inductor 108 with the L-shaped end electrode.
Preferably, the seed layer in the step (1) is one of Cu, ti and Cu bilayer structure, ni, sn, and has a thickness of 1 to 3 μm.
Preferably, the method for forming the resin layer in the step (2) selects hot-pressed prepreg or printed photo-cured resin.
Preferably, the coil pattern width in the steps (1) and (3) is 8 to 25 μm.
Preferably, the copper pillars in the steps (2) and (4) are respectively interconnected with the upper and lower adjacent two layers of coils.
Preferably, the bottom coil and the top coil of the inductor 108 manufactured in the step (6) are respectively interconnected with two side end electrodes.
Preferably, in the step (6), the number of turns of the inductance coil is N, wherein the odd layer is a coil, and the even layer is a copper pillar connected with the coil.
The principle and the beneficial effects of the invention are as follows:
compared with the traditional chip inductor manufacturing method, the method provided by the invention has the advantages that the manufacturing flow is greatly simplified, and the process difficulty is reduced. Meanwhile, each layer of the chip inductor manufactured by the invention is provided with an electrode pattern, so that the L-shaped terminal electrode and the coil are integrally manufactured. In addition, the coil width of the inductance structure manufactured by the invention is 8-25 mu m, and the volume of the chip inductance can be reduced. Compared with the traditional ceramic inductor, the resin used by the inductor has low loss, and is beneficial to improving the quality factor of the inductor.
Drawings
Fig. 1 shows a first substrate 101 after printing catalytic ink when method 1 is used in step 1.
Fig. 2 shows the second substrate 102 after the first coil and the first layer electrode are formed by electroless plating when the method 1 is used in step 1.
Fig. 3 is a first substrate 101 after deposition of a seed layer using method 2 in step 1.
Fig. 4 shows a second substrate 102 obtained by electroplating the first coil and the first layer electrode when the method 2 is used in step 1.
Fig. 5 shows the second substrate 102 after the film is removed in step 1.
Fig. 6 is a schematic diagram of the film exposure development in step 2.
Fig. 7 shows the third substrate 103 obtained after the electroplating in step 2.
Fig. 8 shows the third substrate 103 after the film is removed in step 2.
Fig. 9 shows the third substrate 103 after the differential etching in step 2.
Fig. 10 shows the third substrate 103 after polishing in step 2.
Fig. 11 shows the fourth substrate 104 obtained in step 3.
Fig. 12 shows the fifth substrate 105 obtained in step 4.
Fig. 13 shows a sixth substrate 106 obtained in step 5.
Fig. 14 shows a seventh substrate 107 obtained in step 6.
Fig. 15 shows the inductance 108 obtained in step 6.
Fig. 16 is a flow chart of the coil fabrication of the present invention.
Fig. 17 is a 3D effect diagram of the inductor of the present invention.
101 is a first substrate, 102 is a second substrate, 103 is a third substrate, 104 is a fourth substrate, 105 is a fifth substrate, 106 is a sixth substrate, 107 is a seventh substrate, 108 is an inductor, 202 is catalytic ink in an electrode region, 203 is catalytic ink in a coil region, 301 is a seed layer, 302 is a dry film, 303 is an electrode, 304 is a first coil, 305 is a resin, 306 is a first copper pillar, 307 is a second coil, and 308 is a second copper pillar.
Detailed Description
In order that the aspects and principles of the present invention may be apparent to those skilled in the art, reference will now be made in detail to the present embodiments.
Example 1
A manufacturing method of an all-resin sheet inductor comprises the following steps:
step (1): forming a first layer of pattern, wherein the first layer of pattern comprises a first coil and a first layer of electrode, and the pattern manufacturing method comprises the following steps:
spraying catalytic ink on the first substrate 101 by using an ink-jet printing method, and then performing electroless plating to form a first coil and a first layer electrode in an ink area, thereby obtaining a second substrate 102 with a first coil 304;
step (2): manufacturing a second layer of pattern, wherein the second layer of pattern comprises a first copper column and a second layer of electrode, and the two conditions are as follows:
after the first coil and the first layer electrode are manufactured by adopting the method 1 in the step (1), film pasting, exposure and development are carried out on the pattern surface of the second substrate 102, the areas of the copper columns and the electrode patterns are exposed, the first copper columns and the second layer electrode are grown by electroplating, and the third substrate 103 is obtained; forming a resin layer on the third substrate 103 pattern, and then grinding to expose the tops of the first copper pillars and the second electrode pattern;
step (3) continuing to manufacture a second coil and a third layer electrode on the ground third substrate 103 according to the manufacturing method of the coil and the electrode in the step (1), so as to obtain a third layer pattern of a fourth substrate 104 with a second coil 307;
step (4) continuing to manufacture a second copper pillar and a fourth layer of electrode on the fourth substrate 104 according to the manufacturing method of the copper pillar and the electrode in the step (2), so as to obtain a fourth layer of pattern of the fifth substrate 105 with the second copper pillar 308;
step (5) taking an alternating structure of a first coil, a first copper column, a second coil and a second copper column from bottom to top as a basic unit, and circularly and upwards manufacturing according to the methods in the steps (1) - (4), so as to obtain a sixth substrate 106 with a 17-layer graph multi-layer coil structure shown in fig. 12;
step (6) continuously thickening the electrode pattern by using the pattern manufacturing method in the step (1), removing the film, and performing differential etching to obtain a seventh substrate 107; and (3) widening the electrode on the outermost layer by continuously using the pattern manufacturing method in the step (1), removing the film, and performing differential etching to obtain the 9-turn coil inductor 108 with the L-shaped end electrode.
The method for forming the resin layer in the step (2) selects hot-pressed prepregs or printing photo-cured resins.
The coil pattern width in the steps (1) and (3) is 8-25 μm.
And (3) interconnecting the copper columns in the steps (2) and (4) with the upper and lower adjacent two layers of coils respectively.
The bottom coil and the top coil of the inductor 108 manufactured in the step (6) are respectively interconnected with two side end electrodes.
And (3) the number of turns of the inductance coil in the step (6) is N, wherein an odd layer is a coil, and an even layer is a copper column connected with the coil.
Example 2
The embodiment provides a manufacturing method of a full-resin sheet inductor, which comprises the following steps:
step (1): forming a first layer of pattern, wherein the first layer of pattern comprises a first coil and a first layer of electrode, and the pattern manufacturing method comprises the following steps:
forming a seed layer with the thickness of 2 mu m on the first substrate 101, then carrying out film pasting, exposure and development on the seed layer, exposing the areas where the coils and the electrodes are positioned, thickening the patterns of the areas where the coils and the electrodes are positioned in an electroplating mode, and obtaining a second substrate 102 containing the seed layer and the first coils after film stripping;
step (2): manufacturing a second layer of pattern comprising a first copper column and a second layer of electrode,
after a first layer of pattern is manufactured by adopting the method 2 in the step (1), film pasting, exposure and development are carried out on the pattern surface of the second substrate 102, the areas of the copper columns and the electrode patterns are exposed, a first copper column and a second layer of electrode are grown through electroplating, and the second layer of electrode is formed by directly electroplating and growing on the first layer of electrode; performing differential etching after film removal, and etching the seed layer to obtain a third substrate 103; forming a resin layer on the third substrate 103 pattern, and then grinding to expose the tops of the first copper pillars and the second electrode pattern;
step (3) continuing to manufacture a second coil and a third layer electrode on the ground third substrate 103 according to the manufacturing method of the coil and the electrode in the step (1), so as to obtain a third layer pattern of a fourth substrate 104 with a second coil 307;
step (4) continuing to manufacture a second copper pillar and a fourth layer of electrode on the fourth substrate 104 according to the manufacturing method of the copper pillar and the electrode in the step (2), so as to obtain a fourth layer of pattern of the fifth substrate 105 with the second copper pillar 308;
step (5) takes an alternating structure of a first coil, a first copper column, a second coil and a second copper column from bottom to top as a basic unit, and circularly and upwards manufacturing the alternating structure according to the methods in the steps (1) - (4) to obtain a sixth substrate 106 with a multi-layer coil structure with a (2N-1) layer pattern, wherein N is more than or equal to 3;
step (6) continuously thickening the electrode pattern by using the pattern manufacturing method in the step (1), removing the film, and performing differential etching to obtain a seventh substrate 107; and (3) continuously using the pattern manufacturing method in the step (1) to widen the electrode at the outermost layer, removing the film, and performing differential etching to obtain the N-turn coil inductor 108 with the L-shaped end electrode.
The seed layer in the step (1) is one of Cu, ti and Cu double-layer structure, ni and Sn, and the thickness is 1-3 mu m.
The method for forming the resin layer in the step (2) selects hot-pressed prepregs or printing photo-cured resins.
The coil pattern width in the steps (1) and (3) is 8-25 μm.
And (3) interconnecting the copper columns in the steps (2) and (4) with the upper and lower adjacent two layers of coils respectively.
The bottom coil and the top coil of the inductor 108 manufactured in the step (6) are respectively interconnected with two side end electrodes.
And (3) the number of turns of the inductance coil in the step (6) is N, wherein an odd layer is a coil, and an even layer is a copper column connected with the coil.
The above embodiments are merely illustrative of the principles of the present invention and its effectiveness, and are not intended to limit the invention. Modifications and variations may be made to the above-described embodiments by those skilled in the art without departing from the spirit and scope of the invention. Accordingly, it is intended that all equivalent modifications and variations of the invention be covered by the claims of this invention, which are within the skill of those skilled in the art, can be made without departing from the spirit and scope of the invention disclosed herein.
Claims (1)
1. The manufacturing method of the all-resin sheet inductor is characterized by comprising the following steps of:
step (1): forming a first layer of pattern, wherein the first layer of pattern comprises a first coil and a first layer of electrode, and the pattern is manufactured by one of the following two methods:
method 1: spraying catalytic ink on the first substrate (101) by using an ink-jet printing method, then performing electroless plating, and forming a first coil and a first layer electrode in an ink area to obtain a second substrate (102) with a first coil (304);
method 2: forming a seed layer with the thickness of 2 mu m on a first substrate (101), then carrying out film pasting, exposure and development on the seed layer, exposing the area where the coil and the electrode are positioned, thickening the patterns of the coil and the electrode area in an electroplating mode, and removing the film to obtain a second substrate (102) containing the seed layer and the first coil;
step (2): manufacturing a second layer of pattern, wherein the second layer of pattern comprises a first copper column and a second layer of electrode, and the two conditions are as follows:
case 1: after a first coil and a first layer of electrode are manufactured by adopting the method 1 in the step (1), film pasting, exposure and development are carried out on the pattern surface of the second substrate (102), the areas of the copper columns and the electrode patterns are exposed, and the first copper columns and the second layer of electrode are grown by electroplating, so that a third substrate (103) is obtained; forming a resin layer on the pattern surface of the third substrate (103), and then grinding the resin layer so that the tops of the first copper columns and the second electrode patterns are exposed;
case 2: after a first layer of pattern is manufactured by adopting the method 2 in the step (1), film pasting, exposure and development are carried out on the pattern surface of the second substrate (102), the areas of the copper columns and the electrode patterns are exposed, a first copper column and a second layer of electrode are grown through electroplating, and the second layer of electrode is formed by directly electroplating and growing on the first layer of electrode; performing differential etching after film removal, and obtaining a third substrate (103) after etching the seed layer; forming a resin layer on the pattern surface of the third substrate (103), and then grinding the resin layer so that the tops of the first copper columns and the second electrode patterns are exposed;
step (3) continuing to manufacture a second coil and a third layer electrode on the ground third substrate (103) according to the manufacturing method of the coil and the electrode in the step (1) to obtain a third layer pattern of a fourth substrate (104) with the second coil (307);
step (4) continuing to manufacture a second copper column and a fourth layer electrode on the fourth substrate (104) according to the manufacturing method of the copper column and the electrode in the step (2) to obtain a fourth layer pattern of a fifth substrate (105) with a second copper column (308);
step (5) takes an alternating structure of a first coil, a first copper column, a second coil and a second copper column from bottom to top as a basic unit, and circularly and upwards manufacturing the alternating structure according to the methods in the steps (1) - (4) to obtain a sixth substrate (106) with a multi-layer coil structure with a (2N-1) layer pattern, wherein N is more than or equal to 3;
step (6), continuously thickening the electrode pattern by using the pattern manufacturing method in the step (1), removing the film, and performing differential etching to obtain a seventh substrate (107); continuously using the pattern manufacturing method in the step (1) to widen the electrode at the outermost layer, removing the film, and performing differential etching to obtain an N-turn coil inductor (108) with an L-shaped end electrode;
the seed layer in the step (1) is one of Cu, ti and Cu double-layer structure, ni and Sn, and the thickness is 1-3 mu m;
the method for forming the resin layer in the step (2) selects hot-pressing prepreg or printing photo-curing resin;
the width of the coil pattern in the steps (1) and (3) is 8-25 mu m;
the copper columns in the steps (2) and (4) are respectively interconnected with the upper layer of coils and the lower layer of coils;
the bottom coil and the top coil of the inductor (108) manufactured in the step (6) are respectively interconnected with two side end electrodes;
and (3) the number of turns of the inductance coil in the step (6) is N, wherein an odd layer is a coil, and an even layer is a copper column connected with the coil.
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