CN114678208A - Manufacturing method of full-resin chip inductor - Google Patents
Manufacturing method of full-resin chip inductor Download PDFInfo
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 63
- 239000011347 resin Substances 0.000 title claims abstract description 28
- 229920005989 resin Polymers 0.000 title claims abstract description 28
- 238000000034 method Methods 0.000 claims abstract description 68
- 229910052802 copper Inorganic materials 0.000 claims abstract description 62
- 239000010949 copper Substances 0.000 claims abstract description 62
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 56
- 238000009713 electroplating Methods 0.000 claims abstract description 14
- 239000000758 substrate Substances 0.000 claims description 74
- 238000005530 etching Methods 0.000 claims description 12
- 230000008719 thickening Effects 0.000 claims description 7
- 230000003197 catalytic effect Effects 0.000 claims description 6
- 238000000227 grinding Methods 0.000 claims description 6
- 238000007639 printing Methods 0.000 claims description 6
- 238000007772 electroless plating Methods 0.000 claims description 4
- 238000007731 hot pressing Methods 0.000 claims description 3
- 238000007641 inkjet printing Methods 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 238000005507 spraying Methods 0.000 claims description 3
- 229910052718 tin Inorganic materials 0.000 claims description 3
- 229910052719 titanium Inorganic materials 0.000 claims description 3
- 239000010936 titanium Substances 0.000 claims description 3
- 230000008569 process Effects 0.000 abstract description 7
- 238000004804 winding Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 229910000859 α-Fe Inorganic materials 0.000 description 2
- 239000002313 adhesive film Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004146 energy storage Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/25—Process efficiency
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- Engineering & Computer Science (AREA)
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- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
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Abstract
The invention provides a method for manufacturing a full-resin chip inductor, which comprises the following steps: manufacturing a first coil and a first layer of electrode, and then pasting, exposing, developing and electroplating to manufacture a first copper column and a second layer of electrode; manufacturing a second coil, a third layer of electrode, a second copper column and a fourth layer of electrode by the same method of the previous step; taking an alternating structure of the first coil, the first copper column, the second coil and the second copper column as a basic unit, and circularly upwards manufacturing to obtain a full-resin chip inductor; compared with the traditional chip inductor manufacturing method, the manufacturing method greatly simplifies the manufacturing process and reduces the process difficulty. Meanwhile, the chip inductor manufactured by the invention realizes the integrated manufacture of the L-shaped terminal electrode and the coil.
Description
Technical Field
The invention belongs to the field of inductors, and particularly relates to a manufacturing method of a full-resin chip inductor.
Background
The inductor can convert the electric energy into magnetic energy to be stored, and the magnetic energy storage, filtering and resonance functions are realized in the circuit. With the rapid development of mobile communication technology, electronic components are also miniaturized due to the high integration and light weight of communication equipment, and the chip type inductance component is a necessary trend to reduce the volume of products and improve the assembly efficiency. Chip inductors are classified into two types, namely, wound-type inductors and laminated inductors. The winding type inductor is made by winding a thin wire around a soft magnetic ferrite core, and the outer layer is generally sealed with resin. The process inheritance is strong, but the volume miniaturization is limited. The chip laminated inductor does not need winding, and a closed magnetic circuit is formed by alternately printing, laminating and sintering ferrite slurry and conductor slurry; it adopts advanced thick film multilayer passivation technology and lamination production process to realize subminiature surface mounting. The traditional manufacturing method has the defects of complex manufacturing process, poor reliability of the inductor, incapability of realizing integrated manufacturing of the coil and the electrode and continuously reducing the size of the chip inductor, and thus a new process needs to be developed for manufacturing.
The Chinese invention patent "a method for manufacturing a chip power inductor" (application number is CN201910078314.6) discloses a method for manufacturing a chip inductor by combining a winding process and a multilayer printing technology. The method can manufacture the multilayer chip inductor without high-temperature sintering, but the reduction of the size of the inductor is limited. The chinese invention patent "a chip inductor and a method for manufacturing the same" (application number CN201811209431.3) discloses a method for alternately forming an insulating layer and a patterned metal structure, which can realize the miniaturization of a chip inductor and the precise control of the inductor size. The insulating layer in the method needs to be manufactured with a through hole structure to connect the inductance coils of adjacent layers, so that the manufacturing process is very complicated, and the reliability of the connection between the through hole metal and the coils cannot be ensured.
Disclosure of Invention
In view of the above, the invention provides a method for manufacturing a full-resin chip inductor, which simplifies the manufacturing process of the chip inductor and simultaneously realizes the integrated manufacturing of a terminal electrode by manufacturing a coil circuit and an electrode pattern by an additive method, aiming at the situation that the conventional chip inductor has a complex process flow and cannot be continuously reduced in size. In addition, a fine circuit can be manufactured using an additive process, enabling further reduction in the size of the chip inductor.
The technical scheme of the invention is as follows:
a method for manufacturing a full-resin chip inductor comprises the following steps:
step (1): forming a first layer of pattern, wherein the first layer of pattern comprises a first coil and a first layer of electrode, and the pattern manufacturing adopts one of the following two methods:
the method comprises the following steps: spraying catalytic ink on the first substrate 101 by using an ink-jet printing method, and then performing electroless plating to form a first coil and a first layer of electrodes in an ink area, so as to obtain a second substrate 102 with a first coil 304;
the method 2 comprises the following steps: forming a seed layer with the thickness of 2 microns on the first substrate 101, then carrying out film pasting, exposure and development on the seed layer, exposing the areas where the coils and the electrodes are located, thickening the patterns of the areas of the coils and the electrodes in an electroplating mode, and removing the film to obtain a second substrate 102 containing the seed layer and the first coils;
step (2): manufacturing a second layer of graph, wherein the second layer of graph comprises a first copper column and a second layer of electrode, and the two conditions are as follows:
case 1: after the first coil and the first layer of electrodes are manufactured by the method 1 in the step (1), film pasting, exposure and development are carried out on the pattern surface of the second substrate 102, areas of the copper columns and the electrode patterns are exposed, and the first copper columns and the second layer of electrodes are grown through electroplating to obtain a third substrate 103; forming a resin layer on the patterned surface of the third substrate 103, and then grinding to expose the tops of the first copper pillar and the second electrode pattern;
case 2: after the first layer of pattern is manufactured by the method 2 in the step (1), film pasting, exposure and development are carried out on the pattern surface of the second substrate 102, the areas of the copper pillar and the electrode pattern are exposed, and a first copper pillar and a second layer of electrode are grown by electroplating, wherein the second layer of electrode is formed by directly electroplating and growing on the first layer of electrode; performing differential etching after film stripping, and obtaining a third substrate 103 after the seed layer is etched; forming a resin layer on the patterned surface of the third substrate 103, and then grinding to expose the tops of the first copper pillar and the second electrode pattern;
step (3) according to the coil and electrode manufacturing method in the step (1), continuously manufacturing a second coil and a third layer of electrodes on the ground third substrate 103 to obtain a third layer of patterns of a fourth substrate 104 with the second coil 307;
step (4) according to the manufacturing method of the copper pillars and the electrodes in the step (2), continuously manufacturing second copper pillars and fourth-layer electrodes on the fourth substrate 104 to obtain a fourth-layer graph of the fifth substrate 105 with the second copper pillars 308;
step (5) taking an alternating structure of a first coil, a first copper column, a second coil and a second copper column from bottom to top as a basic unit, and circularly upwards manufacturing according to the method in the steps (1) to (4) to obtain a sixth substrate 106 of a multilayer coil structure with (2N-1) layers of graphs, wherein N is more than or equal to 3;
step (6) continuously thickening the electrode pattern by using the pattern making method in the step (1), and obtaining a seventh substrate 107 after film stripping and differential etching; and (3) widening the electrode on the outermost layer by using the graph manufacturing method in the step (1), and obtaining the N-turn coil inductor 108 with the L-shaped terminal electrode after film stripping and differential etching.
Preferably, in the step (1), the seed layer is one of a double-layer structure of Cu, Ti and Cu, Ni and Sn, and has a thickness of 1-3 μm.
Preferably, the method for forming the resin layer in step (2) is to select a hot-pressed prepreg or a printed photocurable resin.
Preferably, the width of the coil pattern in the steps (1) and (3) is 8 to 25 μm.
Preferably, the copper columns in the steps (2) and (4) are respectively interconnected with the two layers of coils which are adjacent to each other up and down.
Preferably, the bottom coil and the top coil of the inductor 108 manufactured in step (6) are respectively interconnected with two side terminal electrodes.
Preferably, in the step (6), the number of turns of the inductance coil is N, wherein the odd-numbered layers are coils, and the even-numbered layers are copper columns connected with the coils.
The principle and the beneficial effects of the invention are as follows:
compared with the traditional chip inductor manufacturing method, the method for manufacturing the full-resin chip inductor by using the addition method greatly simplifies the manufacturing process and reduces the process difficulty. Meanwhile, each layer of the chip inductor manufactured by the method is provided with an electrode pattern, so that the L-shaped terminal electrode and the coil are integrally manufactured. In addition, the width of the coil of the inductance structure prepared by the invention is 8-25 μm, and the volume of the chip inductor can be reduced. Compared with the traditional ceramic inductor, the inductor has low resin loss, and is beneficial to improving the quality factor of the inductor.
Drawings
FIG. 1 is a first substrate 101 after printing a catalytic ink, using method 1, step 1.
Fig. 2 is a second substrate 102 after electroless plating to form a first coil and a first layer of electrodes, using method 1, step 1.
Fig. 3 shows the first substrate 101 after a seed layer is deposited, using method 2 in step 1.
Fig. 4 shows a second substrate 102 obtained by forming a first coil and a first layer electrode by electroplating in step 1 using method 2.
Fig. 5 shows the second substrate 102 after the film is removed in step 1.
Fig. 6 is a schematic view of the exposure and development of the adhesive film in step 2.
Fig. 7 shows a third substrate 103 obtained after the plating in step 2.
Fig. 8 shows the third substrate 103 after the film is removed in step 2.
Fig. 9 is the third substrate 103 after the differential etching in step 2.
Fig. 10 shows the third substrate 103 polished in step 2.
Fig. 11 shows the fourth substrate 104 obtained in step 3.
Fig. 12 shows the fifth substrate 105 obtained in step 4.
Fig. 13 shows the sixth substrate 106 obtained in step 5.
Fig. 14 shows the seventh substrate 107 obtained in step 6.
Fig. 15 shows the inductance 108 obtained in step 6.
Fig. 16 is a flow chart of the coil fabrication of the present invention.
Fig. 17 is a 3D effect diagram of the inductor of the present invention.
101 is a first substrate, 102 is a second substrate, 103 is a third substrate, 104 is a fourth substrate, 105 is a fifth substrate, 106 is a sixth substrate, 107 is a seventh substrate, 108 is an inductor, 202 is a catalytic ink in an electrode region, 203 is a catalytic ink in a coil region, 301 is a seed layer, 302 is a dry film, 303 is an electrode, 304 is a first coil, 305 is a resin, 306 is a first copper pillar, 307 is a second coil, and 308 is a second copper pillar.
Detailed Description
So that those skilled in the art can readily understand the principles and concepts of the invention, a more particular description of the invention, briefly summarized above, may be had by reference to the embodiments thereof that are illustrated in the appended drawings.
Example 1
A method for manufacturing a full-resin chip inductor comprises the following steps:
step (1): forming a first layer of graph, wherein the first layer of graph comprises a first coil and a first layer of electrode, and the graph manufacturing method comprises the following steps:
spraying catalytic ink on the first substrate 101 by using an ink-jet printing method, and then performing electroless plating to form a first coil and a first layer of electrodes in an ink area, so as to obtain a second substrate 102 with a first coil 304;
step (2): manufacturing a second layer of graph, wherein the second layer of graph comprises a first copper column and a second layer of electrode, and the two conditions are as follows:
after the first coil and the first layer of electrodes are manufactured by the method 1 in the step (1), film pasting, exposure and development are carried out on the pattern surface of the second substrate 102, areas of the copper columns and the electrode patterns are exposed, and the first copper columns and the second layer of electrodes are grown through electroplating to obtain a third substrate 103; forming a resin layer on the pattern surface of the third substrate 103, and then grinding to expose the tops of the first copper pillar and the second electrode pattern;
step (3) according to the coil and electrode manufacturing method in the step (1), continuously manufacturing a second coil and a third layer of electrodes on the ground third substrate 103 to obtain a third layer of patterns of a fourth substrate 104 with the second coil 307;
step (4) according to the manufacturing method of the copper pillars and the electrodes in the step (2), continuously manufacturing second copper pillars and fourth-layer electrodes on the fourth substrate 104 to obtain a fourth-layer graph of the fifth substrate 105 with the second copper pillars 308;
step (5) taking an alternating structure of the first coil, the first copper pillar, the second coil and the second copper pillar as a basic unit from bottom to top in sequence, and circularly making upwards according to the method in the steps (1) to (4) to obtain a sixth substrate 106 of a multilayer coil structure with 17 layers of graphs as shown in fig. 12;
step (6) continuously thickening the electrode pattern by using the pattern making method in the step (1), and obtaining a seventh substrate 107 after film stripping and differential etching; and (3) widening the electrode on the outermost layer by using the pattern manufacturing method in the step (1), and obtaining the 9-turn coil inductor 108 with the L-shaped terminal electrode after film stripping and differential etching.
The method for forming the resin layer in the step (2) selects hot-pressing prepreg or printing light-cured resin.
The width of the coil patterns in the steps (1) and (3) is 8-25 mu m.
And (4) respectively interconnecting the copper columns in the steps (2) and (4) with the two layers of coils which are adjacent up and down.
And (4) respectively interconnecting the bottom coil and the top coil of the inductor 108 manufactured in the step (6) with the two side end electrodes.
And (4) in the step (6), the number of turns of the inductance coil is N, wherein the odd layers are coils, and the even layers are copper columns connected with the coils.
Example 2
The embodiment provides a method for manufacturing a full-resin chip inductor, which comprises the following steps:
step (1): forming a first layer of graph, wherein the first layer of graph comprises a first coil and a first layer of electrode, and the graph manufacturing method comprises the following steps:
forming a seed layer with the thickness of 2 microns on the first substrate 101, then carrying out film pasting, exposure and development on the seed layer, exposing the areas where the coils and the electrodes are located, thickening the patterns of the areas of the coils and the electrodes in an electroplating mode, and removing the film to obtain a second substrate 102 containing the seed layer and the first coils;
step (2): making a second layer of pattern, wherein the second layer of pattern comprises a first copper pillar and a second layer of electrode,
after the first layer of pattern is manufactured by the method 2 in the step (1), film pasting, exposure and development are carried out on the pattern surface of the second substrate 102, the areas of the copper pillar and the electrode pattern are exposed, and a first copper pillar and a second layer of electrode are grown by electroplating, wherein the second layer of electrode is formed by directly electroplating and growing on the first layer of electrode; performing differential etching after film stripping, and obtaining a third substrate 103 after the seed layer is etched; forming a resin layer on the patterned surface of the third substrate 103, and then grinding to expose the tops of the first copper pillar and the second electrode pattern;
step (3) according to the coil and electrode manufacturing method in the step (1), continuously manufacturing a second coil and a third layer of electrodes on the ground third substrate 103 to obtain a third layer of graph of the fourth substrate 104 with the second coil 307;
step (4) according to the manufacturing method of the copper pillars and the electrodes in the step (2), continuously manufacturing second copper pillars and fourth-layer electrodes on the fourth substrate 104 to obtain a fourth-layer graph of the fifth substrate 105 with the second copper pillars 308;
step (5) taking an alternating structure of a first coil, a first copper column, a second coil and a second copper column as a basic unit from bottom to top in sequence, and circularly making upwards according to the method in the steps (1) to (4) to obtain a sixth substrate 106 of a multilayer coil structure with (2N-1) layers of graphs, wherein N is more than or equal to 3;
step (6) continuously thickening the electrode pattern by using the pattern making method in the step (1), and obtaining a seventh substrate 107 after film stripping and differential etching; and (3) widening the electrode on the outermost layer by using the graph manufacturing method in the step (1), and obtaining the N-turn coil inductor 108 with the L-shaped terminal electrode after film stripping and differential etching.
The seed layer in the step (1) is one of a Cu, Ti and Cu double-layer structure, Ni and Sn, and the thickness of the seed layer is 1-3 mu m.
The method for forming the resin layer in the step (2) selects hot-pressing prepreg or printing light-cured resin.
The width of the coil patterns in the steps (1) and (3) is 8-25 mu m.
And (4) respectively interconnecting the copper columns in the steps (2) and (4) with the two layers of coils which are adjacent up and down.
And (4) respectively interconnecting the bottom coil and the top coil of the inductor 108 manufactured in the step (6) with the electrodes at the two sides.
And (4) in the step (6), the number of turns of the inductance coil is N, wherein the odd layers are coils, and the even layers are copper columns connected with the coils.
The foregoing embodiments are merely illustrative of the principles and utilities of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or change the above-mentioned embodiments without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.
Claims (7)
1. A method for manufacturing a full-resin chip inductor is characterized by comprising the following steps:
step (1): forming a first layer of pattern, wherein the first layer of pattern comprises a first coil and a first layer of electrode, and the pattern manufacturing adopts one of the following two methods:
the method comprises the following steps: spraying catalytic ink on the first substrate (101) by using an ink-jet printing method, and then performing electroless plating to form a first coil and a first layer of electrodes in an ink area to obtain a second substrate (102) with a first coil (304);
the method 2 comprises the following steps: forming a seed layer with the thickness of 2 mu m on the first substrate (101), then carrying out film pasting, exposure and development on the seed layer, exposing the areas where the coils and the electrodes are located, thickening the patterns of the coil and the electrode areas in an electroplating mode, and removing the film to obtain a second substrate (102) containing the seed layer and the first coil;
step (2): manufacturing a second layer of graph, wherein the second layer of graph comprises a first copper column and a second layer of electrode, and the two conditions are as follows:
case 1: after the first coil and the first layer of electrodes are manufactured by the method 1 in the step (1), film pasting, exposure and development are carried out on the pattern surface of the second substrate (102), areas of the copper columns and the electrode patterns are exposed, and the first copper columns and the second layer of electrodes are grown through electroplating to obtain a third substrate (103); forming a resin layer on the pattern surface of the third substrate (103), and then grinding to expose the tops of the first copper pillar and the second electrode pattern;
case 2: after the first layer of pattern is manufactured by the method 2 in the step (1), film pasting, exposure and development are carried out on the pattern surface of the second substrate (102), areas of the copper pillar and the electrode pattern are exposed, a first copper pillar and a second layer of electrode are grown through electroplating, and the second layer of electrode is directly grown on the first layer of electrode through electroplating; after the film is removed, differential etching is carried out, and a third substrate (103) is obtained after the seed layer is etched; forming a resin layer on the pattern surface of the third substrate (103), and then grinding to expose the tops of the first copper pillar and the second electrode pattern;
step (3) according to the coil and electrode manufacturing method in the step (1), continuously manufacturing a second coil and a third layer of electrodes on the ground third substrate (103) to obtain a third layer of patterns of a fourth substrate (104) with the second coil (307);
step (4) according to the manufacturing method of the copper columns and the electrodes in the step (2), continuously manufacturing second copper columns and fourth layers of electrodes on a fourth substrate (104) to obtain a fourth layer of graphs of a fifth substrate (105) with the second copper columns (308);
step (5) taking an alternating structure of a first coil, a first copper column, a second coil and a second copper column as a basic unit from bottom to top in sequence, and circularly upwards manufacturing according to the method in the steps (1) to (4) to obtain a sixth substrate (106) of a multilayer coil structure with (2N-1) layers of graphs, wherein N is more than or equal to 3;
step (6) continuously thickening the electrode pattern by using the pattern making method in the step (1), and obtaining a seventh substrate (107) after film stripping and differential etching; and (2) widening the electrode on the outermost layer by using the pattern manufacturing method in the step (1), and obtaining the N-turn coil inductor (108) with the L-shaped terminal electrode after film stripping and differential etching.
2. The method of claim 1, wherein the method comprises: the seed layer in the step (1) is one of a Cu, Ti and Cu double-layer structure, Ni and Sn, and the thickness of the seed layer is 1-3 mu m.
3. The method of claim 1, wherein the method comprises the steps of: the method for forming the resin layer in the step (2) selects hot-pressing prepreg or printing light-cured resin.
4. The method of claim 1, wherein the method comprises: the width of the coil patterns in the steps (1) and (3) is 8-25 mu m.
5. The method of claim 1, wherein the method comprises: and (4) respectively interconnecting the copper columns in the steps (2) and (4) with the two layers of coils which are adjacent up and down.
6. The method of claim 1, wherein the method comprises: and (4) respectively interconnecting the bottom coil and the top coil of the inductor (108) prepared in the step (6) with the end electrodes at two sides.
7. The method of claim 1, wherein the method comprises: and (4) in the step (6), the number of turns of the inductance coil is N, wherein the odd layers are coils, and the even layers are copper columns connected with the coils.
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