CN207250269U - Multilager base plate built in coil - Google Patents
Multilager base plate built in coil Download PDFInfo
- Publication number
- CN207250269U CN207250269U CN201690000515.4U CN201690000515U CN207250269U CN 207250269 U CN207250269 U CN 207250269U CN 201690000515 U CN201690000515 U CN 201690000515U CN 207250269 U CN207250269 U CN 207250269U
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- 239000000463 material Substances 0.000 claims abstract description 166
- 239000004020 conductor Substances 0.000 claims description 52
- 239000011229 interlayer Substances 0.000 claims description 34
- 229920005992 thermoplastic resin Polymers 0.000 claims description 25
- 239000011888 foil Substances 0.000 claims description 18
- 239000002184 metal Substances 0.000 claims description 17
- 229910052751 metal Inorganic materials 0.000 claims description 17
- 230000003746 surface roughness Effects 0.000 claims description 8
- 238000004804 winding Methods 0.000 abstract description 3
- 229920005989 resin Polymers 0.000 description 62
- 239000011347 resin Substances 0.000 description 62
- 238000010438 heat treatment Methods 0.000 description 16
- 238000004080 punching Methods 0.000 description 16
- 239000000758 substrate Substances 0.000 description 13
- 238000000034 method Methods 0.000 description 11
- 239000010410 layer Substances 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 10
- 239000000203 mixture Substances 0.000 description 10
- 230000001681 protective effect Effects 0.000 description 10
- 230000002401 inhibitory effect Effects 0.000 description 8
- 230000008569 process Effects 0.000 description 7
- 230000000452 restraining effect Effects 0.000 description 6
- 230000000694 effects Effects 0.000 description 4
- 239000000088 plastic resin Substances 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229920000106 Liquid crystal polymer Polymers 0.000 description 2
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- BGOFCVIGEYGEOF-UJPOAAIJSA-N helicin Chemical compound O[C@@H]1[C@@H](O)[C@H](O)[C@@H](CO)O[C@H]1OC1=CC=CC=C1C=O BGOFCVIGEYGEOF-UJPOAAIJSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2847—Sheets; Strips
- H01F27/2852—Construction of conductive connections, of leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
- H01F41/042—Printed circuit coils by thin film techniques
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/06—Coil winding
- H01F41/071—Winding coils of special form
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F2017/0073—Printed inductances with a special conductive pattern, e.g. flat spiral
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F2017/0086—Printed inductances on semiconductor substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
- H01F2027/2809—Printed windings on stacked layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2847—Sheets; Strips
- H01F2027/2857—Coil formed from wound foil conductor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
Abstract
The utility model provides multilager base plate built in a kind of coil, at least one base material has the coil portion (101) of the conductive pattern of the shape based on winding multi-turn among multiple base materials, prescribed direction in the face of the base material along coil portion (101), outermost conductive pattern (10a, width W4 10c) is than innermost conductive pattern (12) and outermost conductive pattern (10a, the width W2 of conductive pattern between 10c), W3 is big, width W2s of the width W1 of innermost conductive pattern (12) than the conductive pattern between outermost conductive pattern and innermost conductive pattern, W3 is big, the width W1 of innermost conductive pattern (12) is bigger than the interval Wa of innermost conductive pattern (12) and conductive pattern adjacent thereto.
Description
Technical field
The multilager base plate of internal coil is the utility model is related to, especially, is related to and includes the thermoplastic formed with conductive pattern
Multilager base plate built in the coil of the base material of property resin.
Background technology
In the past, it is related to and is provided with resin multilayer substrate in multilager base plate built in the coil of coil, such as patent document 1,
Illustrate and be laminated the base material of the thermoplastic resin formed with conductive pattern, it is more built in coil to manufacture by carrying out heating punching press
The method of laminar substrate.
Citation
Patent document
Patent document 1：JP Tetsukai 2012-195423 publications
Utility model content
- the utility model problem to be solved-
In this way, due to using thermoplastic resin as base material multilager base plate can by carrying out heating punching press to multi-layer substrate,
It is molded in the lump in the case of without using adhesive linkage, therefore manufacturing man-hours is less, can be formed electronic unit, circuit with low cost
Substrate.
On the other hand, with the flowing of resin when thermoplastic resin is the manufacture of the multilager base plate of base material, easily produce
Conductive pattern, which deviates, is exemplified as problem.That is, the base material based on thermoplastic resin is laminated to form layered product, at this
In the heating stamping procedure of layered product, base material carries out resin flowing.Flowed with the resin, be formed at the conductor figure of the base material
Case is easily deformed.In the case where forming coil by conductive pattern, if conductive pattern deforms, the electrical property change of coil.By
In conductive pattern deformation it is diversified in specifications fixed, therefore the electrical characteristics of obtained coil create a difference.
The purpose of this utility model provides the few line of deformation of a kind of base material using thermoplastic resin and conductive pattern
Multilager base plate built in circle.
- the means to solve the problem-
(1) multilager base plate built in the coil of the utility model is to include the heat formed with the conductive pattern being made of metal foil
What multiple base materials of the base material of plastic resin were laminated, there is the coil that is made of the conductive pattern, built in the coil
Multilager base plate is characterized in that,
The coil has coil axis in the stacked direction of multiple base materials,
Have at least one base material among multiple base materials based on having wound multi-turn around the coil axis
Shape the conductive pattern coil portion,
Among the conductive pattern for forming the coil portion, in the arbitrary at least orthogonal of the face along the base material
2 direction of principal axis,
(A) width of outermost conductive pattern is than leading between innermost conductive pattern and outermost conductive pattern
The width of body pattern is big,
(B) width of innermost conductive pattern is than leading between outermost conductive pattern and innermost conductive pattern
The width of body pattern is big,
(C) width of innermost conductive pattern is between the innermost conductive pattern and conductive pattern adjacent thereto
Every the above.
By above-mentioned composition, due to passing through the big innermost conductor of width big outermost conductive pattern and width
Pattern, the resin to be flowed is restrained, therefore is suppressed with the deformation of the conductive pattern of resin flowing.
(2) in above-mentioned (1), preferably in the outermost conductive pattern and the innermost conductive pattern at least
One side is connected with interlayer connection conductor.Thus, resin is constrained by interlayer connection conductor, and the restraining force of stir-in resin further carries
It is high.
(3) multilager base plate built in the coil of the utility model is to include the heat formed with the conductive pattern being made of metal foil
What multiple base materials of the base material of plastic resin were laminated, there is the coil that is made of the conductive pattern, built in the coil
Multilager base plate is characterized in that,
The coil has coil axis in the stacked direction of multiple base materials,
Have at least one base material among multiple base materials based on having wound multi-turn around the coil axis
Shape the conductive pattern coil portion,
In the base material formed with the coil portion, the outside based on the conductive pattern is configured in the outside of the coil portion
Dummy pattern, the inner side dummy pattern based on the conductive pattern is configured in the inner side of the coil portion,
Among the conductive pattern for forming the coil portion, in the arbitrary at least orthogonal of the face along the base material
2 direction of principal axis,
(D) width of the outside dummy pattern is bigger than the width of the conductive pattern of the coil portion,
(E) width of the inner side dummy pattern is bigger than the width of the conductive pattern of the coil portion,
(F) conductive pattern of the outside dummy pattern and the coil portion adjacent thereto at intervals of the coil portion
Conductive pattern between interval below,
(G) between the conductive pattern of the coil portion adjacent with the inner side dummy pattern and the inner side dummy pattern
It is divided into below the width of the inner side dummy pattern.
By above-mentioned composition, since by outside dummy pattern and inner side dummy pattern, the resin to be flowed is restrained,
Therefore it is suppressed with the deformation of the conductive pattern of resin flowing.
(4) in above-mentioned (3), preferably connect at least one party of the outside dummy pattern and the inner side dummy pattern
It is connected to interlayer connection conductor.Thus, resin is constrained by interlayer connection conductor, and the restraining force of stir-in resin further improves.
(5) multilager base plate built in the coil of the utility model is to include the heat formed with the conductive pattern being made of metal foil
What multiple base materials of the base material of plastic resin were laminated, there is the coil that is made of the conductive pattern, built in the coil
Multilager base plate is characterized in that,
The coil has coil axis in the stacked direction of multiple base materials,
At least a base material among multiple base materials, has based on having wound multi-turn around the coil axis
The coil portion of the conductive pattern of shape,
In the base material formed with the coil portion, the outside based on the conductive pattern is configured in the outside of the coil portion
Dummy pattern,
Among the conductive pattern for forming the coil portion, in the arbitrary at least orthogonal of the face along the base material
2 direction of principal axis,
(B) width of innermost conductive pattern is bigger than the width of other conductive patterns of the coil portion,
(C) width of the innermost conductive pattern is the innermost conductive pattern and conductive pattern adjacent thereto
Interval more than,
(D) width of the outside dummy pattern is than the institute between innermost conductive pattern and the outside dummy pattern
It is big to state the width of the conductive pattern of coil portion,
(F) interval of the conductive pattern of the outside dummy pattern and the coil portion adjacent thereto is except described most interior
Beyond the interval of the conductive pattern of side and conductive pattern adjacent thereto, be the coil portion conductive pattern between interval with
Under.
By above-mentioned composition, due to by the big innermost conductive pattern of outside dummy pattern and width, to flow
Resin it is restrained, therefore be suppressed with the deformation of conductive pattern of resin flowing.
(6) in above-mentioned (5), at least one preferably in the outside dummy pattern and the innermost conductive pattern
Side is connected with interlayer connection conductor.Thus, resin is constrained by interlayer connection conductor, and the restraining force of stir-in resin further improves.
(7) multilager base plate built in the coil of the utility model is to include the heat formed with the conductive pattern being made of metal foil
What multiple base materials of the base material of plastic resin were laminated, there is the coil that is made of the conductive pattern, built in the coil
Multilager base plate is characterized in that,
The coil has coil axis in the stacked direction of multiple base materials,
At least one base material among multiple base materials, has based on having wound multi-turn around the coil axis
Shape conductive pattern coil portion,
In the base material formed with the coil portion, the inner side based on the conductive pattern is configured in the inner side of the coil portion
Dummy pattern,
Among the conductive pattern for forming the coil portion, in the arbitrary at least orthogonal of the face along the base material
2 direction of principal axis,
(A) width of outermost conductive pattern is bigger than the width of other conductive patterns of the coil portion,
(E) institute of the width of the inner side dummy pattern between outermost conductive pattern and the inner side dummy pattern
It is more than the width for stating the conductive pattern of coil portion,
(G) between the conductive pattern of the coil portion adjacent with the inner side dummy pattern and the inner side dummy pattern
It is divided into below the width of the inner side dummy pattern.
By above-mentioned composition, due to by the big outermost conductive pattern of width and inner side dummy pattern, to flow
Resin it is restrained, therefore be suppressed with the deformation of conductive pattern of resin flowing.
(8) in above-mentioned (7), at least one preferably in the outermost conductive pattern and the inner side dummy pattern
Side is connected with interlayer connection conductor.Thus, resin is constrained by interlayer connection conductor, and the restraining force of stir-in resin further improves.
(9) in above-mentioned (3) (4) (5) or (6), preferably described outside dummy pattern and the coil adjacent thereto
Below the width at intervals of the outside dummy pattern of the conductive pattern in portion.Thus, the resin stream based on outside dummy pattern
Dynamic inhibitory action effectively improves, and the deformation of the conductive pattern based on resin flowing is suppressed.
(10) multilager base plate built in the coil of the utility model is included formed with the conductive pattern being made of metal foil
What multiple base materials of the base material of thermoplastic resin were laminated, there is the coil that is made of the conductive pattern, in the coil
Multilager base plate is put to be characterized in that,
The coil has coil axis in the stacked direction of multiple base materials,
Have at least one base material among multiple base materials based on having wound multi-turn around the coil axis
Shape the conductive pattern coil portion,
In the base material formed with the coil portion, the outside based on the conductive pattern is configured in the outside of the coil portion
Dummy pattern, the inner side dummy pattern based on the conductive pattern is configured in the inner side of the coil portion,
Among the conductive pattern for forming the coil portion, in the arbitrary at least orthogonal of the face along the base material
2 direction of principal axis,
(D) width of the outside dummy pattern is bigger than the width of the conductive pattern of the coil portion,
(E) width of the inner side dummy pattern is bigger than the width of the conductive pattern of the coil portion,
(F) conductive pattern of the outside dummy pattern and the coil portion adjacent thereto at intervals of the coil portion
Conductive pattern between interval below,
(I) conductive pattern of the inner side dummy pattern and the coil portion adjacent thereto at intervals of the coil portion
Conductive pattern between interval below.
By above-mentioned composition, the inhibitory action of the resin flowing based on inner side dummy pattern effectively improves, with tree
The deformation of the conductive pattern of fat flowing is suppressed.
(11) multilager base plate built in the coil of the utility model is included formed with the conductive pattern being made of metal foil
What multiple base materials of the base material of thermoplastic resin were laminated, there is the coil that is made of the conductive pattern, in the coil
Multilager base plate is put to be characterized in that,
The coil has coil axis in the stacked direction of multiple base materials,
Have at least one base material among multiple base materials based on having wound multi-turn around the coil axis
Shape the conductive pattern coil portion,
In the base material formed with the coil portion, the inner side based on the conductive pattern is configured in the inner side of the coil portion
Dummy pattern,
Among the conductive pattern for forming the coil portion, in the arbitrary at least orthogonal of the face along the base material
2 direction of principal axis,
(A) width of outermost conductive pattern is bigger than the width of other conductive patterns of the coil portion,
(E) width of the inner side dummy pattern is than the institute between outermost conductive pattern and the inner side dummy pattern
It is big to state the width of the conductive pattern of coil portion,
(I) between the conductive pattern of the coil portion adjacent with the inner side dummy pattern and the inner side dummy pattern
It is divided into below the interval between the conductive pattern of the coil portion.
By above-mentioned composition, the inhibitory action of the resin flowing based on inner side dummy pattern effectively improves, with tree
The deformation of the conductive pattern of fat flowing is suppressed.
(12) in above-mentioned (1), (7) or (11), preferably described outermost conductive pattern and adjacent thereto described
Below the width at intervals of the outermost conductive pattern of the conductive pattern of coil portion.Thus, based on outermost conductor
The inhibitory action of the resin flowing of pattern effectively improves, and the deformation of the conductive pattern based on resin flowing is suppressed.
(13) in any one or (10), (11) of above-mentioned (1) to (8), formed among preferably described conductive pattern
In the face contacted with the base material of the conductive pattern on the surface of the base material surface roughness than not contacted with the base material
Face surface roughness it is big.Thus, the restraining force of the stir-in resin based on conductive pattern improves, with leading for resin flowing
The deformation of body pattern is effectively suppressed.In addition, the surface roughness in the face by making not contact with base material is relatively small, can make
The conductor losses (transmission loss) of coil portion etc. does not become larger.
- utility model effect-
According to the utility model, deforming for the conductive pattern for obtaining flowing with resin is suppressed, the difference of electrical characteristics
Multilager base plate built in few coil.
Brief description of the drawings
Fig. 1 is the stereogram before the protective film of multilager base plate 201 built in coil involved by the 1st embodiment is formed.
Fig. 2 is the top view before the protective film of multilager base plate 201 built in coil involved by the 1st embodiment is formed.
Fig. 3 (A) is comparable to the sectional view in the manufacturing process of multilager base plate built in A-A parts the, coil in Fig. 2,
Fig. 3 (B) is comparable to the sectional view of multilager base plate 201 built in the coil of the A-A parts in Fig. 2.
Fig. 4 is the sectional view before the protective film of multilager base plate 201 built in coil is formed.
Fig. 5 (A) is the sectional view of the base material S1 formed with coil portion 101.Fig. 5 (B) is the oval part in Fig. 5 (A)
Enlarged drawing.
Fig. 6 is the top view of each substrate layer of multilager base plate built in the coil formed involved by the 2nd embodiment.
Fig. 7 (A) is comparable to the sectional view in the manufacturing process of multilager base plate built in A-A parts the, coil in Fig. 6,
Fig. 7 (B) is comparable to the sectional view of multilager base plate 202 built in the coil of the A-A parts in Fig. 6.
Fig. 8 is the top view of each substrate layer of multilager base plate built in the coil formed involved by the 3rd embodiment.
Fig. 9 (A) is comparable to the sectional view in the manufacturing process of multilager base plate built in A-A parts the, coil in Fig. 8,
Fig. 9 (B) is comparable to the sectional view of multilager base plate 203 built in the coil of the A-A parts in Fig. 8.
Figure 10 is the top view of multilager base plate 204 built in coil involved by the 4th embodiment.
Figure 11 is the top view of multilager base plate 205 built in coil involved by the 5th embodiment.
Figure 12 is the top view of multilager base plate 206 built in coil involved by the 6th embodiment.
Figure 13 is the top view of multilager base plate 207 built in coil involved by the 7th embodiment.
Figure 14 is the top view of multilager base plate 208 built in coil involved by the 8th embodiment.
Embodiment
Hereinafter, several specific examples are enumerated referring to the drawings, represent multiple embodiments.To same in each attached drawing
Position assigns same symbol.Consider the explanation of main points or the easiness of understanding, for convenience separately shown embodiment, but
It can carry out the local displacement or combination of the composition shown in different embodiments.After the 2nd embodiment, omission is directed to
The description of the item shared with the 1st embodiment, only illustrates difference.Especially, for the phase based on identical composition
Same-action effect, does not refer to successively in each embodiment.
《1st embodiment》
Fig. 1 is the stereogram before the protective film of multilager base plate 201 built in coil involved by the 1st embodiment is formed.Fig. 2
It is its top view.Fig. 3 (A) is comparable to the section view in the manufacturing process of multilager base plate built in A-A parts the, coil in Fig. 2
Figure, Fig. 3 (B) are comparable to the sectional view of multilager base plate 201 built in the coil of the A-A parts in Fig. 2.
Multilager base plate 201 built in coil is comprising the thermoplasticity being for example made of liquid crystal polymer formed with conductive pattern
What multiple base materials of base material S1, S2 of resin were laminated, there is the coil being made of conductive pattern.The conductive pattern is to paste
The metal foil (such as copper foil) for investing the base material of thermoplastic resin patterns what is formed.
In base material S1, formed comprising conductive pattern 10a, 10b, 10c, 10d, 11a, 11b, 11c, 11d, 11e, 12 square
The spiral helicine coil portion 101 of shape.The coil portion 101 is coil axis towards the stacked direction of base material S1, S2, conductive pattern in base material
The shape of multi-turn is wound in S1 around coil axis.
Among the conductive pattern for forming above-mentioned coil portion, conductive pattern 10a, 10b, 10c, 10d are outermost conductor figures
Case, conductive pattern 12 are innermost conductive patterns, 11a, 11b, 11c, 11d, 11e be in outermost conductive pattern with
Conductive pattern between innermost conductive pattern.
X-direction (the X-X lines in Fig. 2) in the face of the base material S1 along coil portion 101, at the width of each conductive pattern
In following relation.
(A) the width W4 of outermost conductive pattern 10a, 10c are than innermost conductive pattern 12 and outermost conductor
The width W2 of the width W3 and conductive pattern 11e of conductive pattern 11a, 11c between pattern are big (W2 ＜ W4, W3 ＜ W4).Separately
Outside, (such as the width ＜ conductive patterns 11a of conductive pattern 11c in the case of the width localized variation of conductive pattern
Width), also meet W2 ＜ W4, the relation of W3 ＜ W4 always.
(B) the width W1 of innermost conductive pattern 12 is than outermost conductive pattern 10a, 10c and innermost conductor
The width W2 of the width W3 and conductive pattern 11e of conductive pattern, that is, conductive pattern 11a, 11c between pattern it is big (W2 ＜ W1,
W3 ＜ W1).In addition, in the case of the width localized variation of conductive pattern (such as the width ＜ conductors of conductive pattern 11c
The width of pattern 11a), also meet W2 ＜ W1, the relation of W3 ＜ W1 always.
(C) the width W1 of innermost conductive pattern 12 is innermost conductive pattern 12 and the conductive pattern adjacent to it
More than the interval Wa (Wa≤W1) of 11e, 11c.In addition, width W1, the feelings of interval Wa localized variations even in conductive pattern 12
Under condition, also meet the relation of Wa≤W1 always.
(J) outermost conductive pattern 10a, 10b, 10c, 10d and the conductive pattern adjacent to its coil portion 101
Be spaced (Wd) be outermost conductive pattern width (W4) below (Wd≤W4).In addition, even in the width of conductive pattern
(W4), in the case of being spaced Wd localized variations, the relation of Wd≤W4 is also met always.
In the lower surface of base material S2, as shown in Fig. 3 (A), terminal electrode 31,32 is formed.In base material S1, S2, formation is used for
Make terminal electrode 31,32 and conductive pattern 10a, interlayer connection conductor 21a, 21b, 22a, 22b of 12 conductings.
By the way that base material S1, S2 shown in Fig. 3 (A) are heated punching press, the interlayer of base material S1, S2 are engaged, so as to form layer
Stack 100.Then, as shown in Fig. 3 (B), by forming the protective film 110 such as epoxy resin in above-mentioned layered product 100, from
And protect coil portion 101.In addition, the formation of protective film 110 is any.
Fig. 4 is the sectional view before the protective film of multilager base plate 201 built in coil is formed.Profile position is equivalent in Fig. 2
A-A parts.Although in above-mentioned heating punching press as thermoplastic resin base material S1, S2 carry out resin flowing, base material with
The interface of conductive pattern, the flow resistance of resin are higher.Therefore, width big outermost conductive pattern 10a, 10c and width
The resin to be flowed constrains when the big innermost conductive pattern 12 of degree is to heating punching press.
Since the width of each conductive pattern is in above-mentioned relation, by the big outermost conductive pattern 10a of width,
The innermost conductive pattern 12 of 10c and width greatly, the resin to be flowed effectively are constrained.Thus, also comprising in being clipped in
Between conductive pattern 11a, 11c, 11e, be suppressed with the deformation of conductive pattern of resin flowing.
Also, due to outermost conductive pattern 10a and innermost conductive pattern 12 be connected to interlayer connection conductor 21,
22, therefore stir-in resin is further constrained by these interlayer connection conductors 21,22.
In addition, by the interval of outermost conductive pattern and the conductive pattern of coil portion adjacent thereto (in Fig. 2
Wd) for outermost conductive pattern width (W4 in Fig. 2) below (Wd≤W4), so as to be based on outermost conductive pattern
The inhibitory action of resin flowing effectively improve, the deformation of conductive pattern based on resin flowing is suppressed.
Furthermore it is preferred that the width W4 of outermost conductive pattern 10a, 10c are relative to the innermost conductive pattern 12 of removing
The width W2 of the width W3 and conductive pattern 11e of conductive pattern 11a, 11c of inner side in addition are about 1.3 times.Equally
Ground, the width W1 of preferably innermost conductive pattern 12 is relative to the outside removed beyond outermost conductive pattern 10a, 10c
The width W2 of width W3 and conductive pattern 1le of conductive pattern, that is, conductive pattern 11a, 11c be about 1.3 times.Thus, by
In the conductor that can make the inner side beyond the width W4 of conductive pattern 10a, 10c in outside and the innermost conductive pattern 12 of removing
The width W3 of pattern 11a, 11c are fully big relative to the width W2 of conductive pattern 11e, therefore further can stably suppress
With the deformation of the conductive pattern of resin flowing.In addition, by ensuring the number of turn of every occupied area, and widen leading for outside
The width of body pattern, so as to increase the path length ratio of the wide cut part in the conductive pattern of coil portion, therefore can subtract
Few conductor losses.
According to the present embodiment, compared with dummy pattern, the situation of outside dummy pattern on the inside of setting described later, easily expand
The forming region of big coil, easily increases the number of turn (winding number) of coil.Thus sufficient coil characteristics are readily obtained.
In example illustrated above, illustrate the X direction of principal axis in the face of the base material S1 along coil portion 101 (in Fig. 2
X-X lines), the example that the relation of above-mentioned (A) (B) (C) of the width of each conductive pattern is set up, but the relation is not limited to X
Direction of principal axis, can also be suitable for Y direction.In addition, for example, in fig. 2 relative to X-axis Y direction incline direction etc. along coil
The prescribed direction in the face of the base material S1 in portion 101 is equally applicable.
Fig. 5 (A) is the sectional view of the base material S1 formed with coil portion 101.Fig. 5 (B) is the oval part in Fig. 5 (A)
Enlarged drawing.The surface roughness for forming the face contacted with base material S1 of each conductive pattern of coil portion 101 connects than not with base material S1
The surface roughness in tactile face is big.Thus, the restraining force of the stir-in resin based on conductive pattern improves, with resin flowing
The deformation of conductive pattern is effectively suppressed.In addition, it is not relatively small with the surface roughness in the base material S1 faces contacted by making,
The conductor losses (transmission loss) of coil portion etc. can be made not become larger.
The manufacture method of multilager base plate 201 is as follows built in the coil of present embodiment.
[the 1st process]
As shown in Fig. 3 (A), prepare base material S1, the S2 being for example made of liquid crystal polymer.In base material S1, S2, attach in advance
Metal foil (such as copper foil).The surface roughness of the metal foil is bigger than the face not connected with the face that base material S1, S2 connect respectively.
[the 2nd process]
The metallic foil pattern for the base material for making to be attached at thermoplastic resin by using technologies such as photoetching, so that in base material S1
Form the various conductive patterns of coil portion 101.In addition, perforation is formed from the face for not attaching metal foil of base material S1 by laser etc.
Hole, fills conductive paste, so as to form interlayer connection conductor 21a, 22a to the through hole.In addition, base material S2 also by with base
Method identical material S1, forms the terminal electrode 31,32 being made of metal foil and the interlayer connection conductor being made of conductive paste
21b、22b。
[the 3rd process]
Base material S1, S2 are laminated to form layered product 100.
[the 4th process]
Heating punching press is carried out to layered product 100, makes base material S1, S2 softening, crimping.At this time, it is filled in leading for through hole
Electric cream cures (metallization).
[the 5th process]
The process of above-mentioned 1st process~the 4th is handled under assembly substrate state.By by the base of the assembly substrate state
Material is split, so as to obtain multilager base plate 201 built in each coil.
《2nd embodiment》
In the 2nd embodiment, represent throughout multilayer to form the example of coil portion.
Fig. 6 is the top view of each substrate layer of multilager base plate built in the coil formed involved by the 2nd embodiment.Fig. 7 (A)
The sectional view being comparable in the manufacturing process of multilager base plate built in A-A parts the, coil in Fig. 6, Fig. 7 (B) are comparable to
The sectional view of multilager base plate 202 built in the coil of A-A parts in Fig. 6.
Multilager base plate 202 built in coil is base material S1, S2, the S3 for including the thermoplastic resin formed with conductive pattern
What multiple base materials were laminated, there is the coil being made of conductive pattern.
In base material S1, formed comprising conductive pattern 10a, 10b, 10c, 10d, 11a, 11b, 11c, 11d, 11e, 12 square
The spiral helicine coil portion 101 of shape.In base material S2, formed comprising conductive pattern 13a, 13b, 13c, 13d, 14a, 14b, 14c, 15
Rectangular coil shape coil portion 102.
Among the conductive pattern for forming coil portion 101, conductive pattern 10a, 10b, 10c, 10d are outermost conductor figures
Case, conductive pattern 12 are innermost conductive patterns, 11a, 11b, 11c, 11d, 11e be in outermost conductive pattern with
Conductive pattern between innermost conductive pattern.In addition, among the conductive pattern of composition coil portion 102, conductive pattern 13a,
13b, 13c, 13d are outermost conductive patterns, and conductive pattern 15 is innermost conductive pattern, and 14a, 14b, 14c are places
Conductive pattern between outermost conductive pattern and innermost conductive pattern.
Coil portion 101,102 be coil axis towards the stacked direction of base material S1, S2, conductive pattern in base material S1, S2
The shape of multi-turn has been wound around coil axis.
In the lower surface of base material S3, as shown in Fig. 7 (A), terminal electrode 31,32 is formed.Being formed in base material S1, S2, S3 makes
Interlayer connection conductor 21a, 21b, 21c that terminal electrode 31 is turned on conductive pattern 10a.Being formed in base material S2, S3 makes terminal electric
Interlayer connection conductor 23b, 23c that pole 32 is turned on conductive pattern 13a.In addition, being formed in base material S1 makes conductive pattern 15 with leading
The interlayer connection conductor 22 that body pattern 12 turns on.
In multilager base plate 202 built in the coil involved by the 2nd embodiment, also in a same manner as in the first embodiment, pass through
Heating punching press is carried out to base material S1, S2, S3 shown in Fig. 7 (A) to form layered product 100.As shown in Fig. 7 (B), layered product 100
Protected by protective film 110.
As in this embodiment, in layers, preferably satisfied throughout in the case that multiple layers are formed in coil portion
State the relation of (A) (B) (C).Thus, the interlayer capacity between the coil portion 101,102 with resin flowing can also be suppressed
Change.
《3rd embodiment》
In the 3rd embodiment, multilayer base built in the coil with outside dummy pattern and inner side dummy pattern is represented
The example of plate.
Fig. 8 is the top view of each substrate layer of multilager base plate 203 built in the coil formed involved by the 3rd embodiment.Fig. 9
(A) sectional view being comparable in the manufacturing process of multilager base plate built in A-A parts the, coil in Fig. 8, Fig. 9 (B) is suitable
The sectional view of multilager base plate 203 built in the coil of A-A parts in Fig. 8.
Multilager base plate 203 built in coil is base material S1, S2, the S3 for including the thermoplastic resin formed with conductive pattern
What multiple base materials were laminated, there is the coil being made of conductive pattern.
In base material S1, the coil portion 103A of the conductive pattern based on rectangular coil shape is formed, in the outside of coil portion 103A
The outside dummy pattern 41 based on conductive pattern is formed, the inner side dummy pattern 42 based on conductive pattern is formed in inner side.
In base material S2, the coil portion 103B of the conductive pattern based on rectangular coil shape is formed, in the outside of coil portion 103B
The outside dummy pattern 43 based on conductive pattern is formed, the inner side dummy pattern 44 based on conductive pattern is formed in inner side.
In addition, " dummy pattern " in this specification, refer to not be electrically connected and electrically independent with forming the conductive pattern of coil
Pattern.
X-direction (line A-A in Fig. 8) in the face of the base material S1 along coil portion 103A, the width of each conductive pattern
In following relation.
(D) big (the W2 ＜ of width W2, W3 of 41 conductive patterns of the width W4 ' than coil portion 103A of outside dummy pattern
W4 ', W3 ＜ W4 ').In addition, in the case of the width localized variation of conductive pattern, also meet W2 ＜ W4 ', W3 ＜ always
The relation of W4 '.
(E) big (the W2 ＜ of width W2, W3 of conductive patterns of the width W1 ' than coil portion 103A of inner side dummy pattern 42
W1 ', W3 ＜ W1 ').In addition, in the case of the width localized variation of conductive pattern, also meet W2 ＜ W1 ', W3 ＜ always
The relation of W1 '.
(F) interval (Wd) of the conductive pattern of outside dummy pattern and coil portion adjacent thereto is the conductor figure of coil portion
Interval (Wc) between case is below (Wd≤Wc).In addition, in the case of Wd, Wc localized variation is spaced, also meet Wd always
The relation of≤Wc.
(G) interval of the conductive pattern of the coil portion adjacent with inner side dummy pattern and inner side dummy pattern (Wa) is inner side
The width (W1 ') of dummy pattern is below (Wa≤W1 ').In addition, the width W1 ' even in interval Wa, inner side dummy pattern is local
In the case of change, also meet the relation of (Wa≤W1 ') always.
It is preferred that above-mentioned relation is also likewise, but not necessarily meeting whole conditions for coil portion 103B.That is,
As long as there are more than 1 layer of the layer for meeting above-mentioned relation in multilager base plate built in coil for the utility model, it becomes possible to plays effect
Fruit.
In the lower surface of base material S3, as shown in Fig. 9 (A), terminal electrode 31,32 is formed.In base material S1, S2, S3, formation makes
Interlayer connection conductor 21a, 21b, 21c that terminal electrode 31 is turned on the outer circumference end of coil portion 103A.Being formed in base material S2, S3 makes
Interlayer connection conductor 23b, 23c that terminal electrode 32 is turned on the outer circumference end of coil portion 103B.In addition, distinguish shape in base material S1
Into make outside dummy pattern 41,43 turn on each other interlayer connection conductor 24A, 24B, make inner side dummy pattern 42,44 lead each other
Logical interlayer connection conductor 25.In base material S1, formed and be connected at the inner circumferential end of coil portion 103A with the inner circumferential end of coil portion 103B
Interlayer connection conductor 26.
In multilager base plate 203 built in the coil involved by the 3rd embodiment, also in a same manner as in the first embodiment, pass through
Heating punching press is carried out to base material S1, S2, S3 shown in Fig. 9 (A) to form layered product 100.As shown in Fig. 9 (B), layered product 100
Protected by protective film 110.
Although base material S1, S2, S3 in above-mentioned heating punching press as thermoplastic resin carry out resin flowing, in base material
It is higher with the interface of conductive pattern, the flow resistance of resin.Therefore, outside dummy pattern 41,43 and inner side dummy pattern 42,
The resin to be flowed constrains during 44 pairs of heating punching presses.
Since the width of each conductive pattern is in above-mentioned relation, by the big outside dummy pattern 41,43 of width with
And inner side dummy pattern 42,44, the resin to be flowed effectively is constrained.Thus, also comprising be clipped in the middle coil portion 103A,
The conductive pattern of 103B, is suppressed with the deformation of the conductive pattern of resin flowing.
Also, due to outside dummy pattern 41,43 and inner side dummy pattern 42,44 be connected to interlayer connection conductor 24A,
24B, 25, therefore stir-in resin is further by these interlayer connection conductors 24A, 24B, 25 constraints.
Additionally, it is preferred that width W2, the W3 of the width W4 ' of outside dummy pattern 41 relative to the conductive pattern of coil portion 103A
It is about 1.3 times.Similarly, preferably inner side dummy pattern 42 width W1 ' relative to the conductive pattern of coil portion 103A width
It is about 1.3 times to spend W2, W3.Thus, since the outside width W4 ' of dummy pattern 41 and the width of inner side dummy pattern 42 can be made
It is sufficiently large relative to width W2, W3 of the conductive pattern of coil portion 103A to spend the width of W1 ', therefore further can stably press down
The deformation for the conductive pattern that system is flowed with resin.
In example illustrated above, illustrate in the X-axis side in the face of base material S1, S2 along coil portion 103A, 103B
To (line A-A in Fig. 8), the situation of the relation establishment of above-mentioned (D) (E) (F) (G) of the width of each conductive pattern, but the relation
X-direction is not limited to, can also be suitable for Y direction.In addition, for example in fig. 8 relative to X-axis Y direction inclination side
Also can be equally applicable along the prescribed direction in the face of base material S1, S2 of coil portion 103A, 103B to waiting.
As in this embodiment, in the case where coil portion is formed throughout multiple layers, in layers, preferably satisfy
State the relation of (D) (E) (F) (G).
《4th embodiment》
In the 4th embodiment, represent there is no inner side dummy pattern and exist more built in the coil of outside dummy pattern
The example of laminar substrate.
Figure 10 is the top view of multilager base plate 204 built in coil involved by the 4th embodiment.Multilager base plate built in coil
204 have the layered product 100 that the base material of the thermoplastic resin formed with conductive pattern is laminated.
In layered product 100, the coil portion 104 of the conductive pattern based on rectangular coil shape is formed, in the outside of coil portion 104
Form the outside dummy pattern 41 based on conductive pattern.
X-direction (the X-X lines in Figure 10) in the face of the layered product 100 along coil portion 104, the width of each conductive pattern
Degree is in following relation.
(B) the width W1 of innermost conductive pattern 12 is bigger than width W2, W3 of other conductive patterns of coil portion 104
(W2 ＜ W1, W3 ＜ W1).
(C) the width W1 of innermost conductive pattern 12 is innermost conductive pattern 12 and conductive pattern adjacent thereto
More than the interval Wa (Wa≤W1) of 11e, 11c.In addition, in the case of the width localized variation of conductive pattern, also always
Meet the relation of (Wa≤W1).
(D) the width W4 ' of outside dummy pattern 41 is bigger (W2 ＜ than width W2, W3 of the conductive pattern of coil portion 104
W4 ', W3 ＜ W4 ').In addition, in the case of the width localized variation of conductive pattern, also meet W2 ＜ W4 ', W3 ＜ always
The relation of W4 '.
(F) the interval Wd of the conductive pattern of outside dummy pattern 41 and coil portion adjacent thereto is leading for above-mentioned coil portion
Below interval Wc (Wd≤Wc) between body pattern.In addition, in the case of Wd, Wc localized variation is spaced, also meet always
The relation of Wd≤Wc.
In multilager base plate 204 built in the coil involved by the 4th embodiment, also in a same manner as in the first embodiment, pass through
Multiple base materials are carried out with heating punching press to form layered product.Although the base material tree during heating punching press as thermoplastic resin
Fat flows, but the resin to be flowed carries out about when outside dummy pattern 41 and innermost conductive pattern 12 are to heating punching press
Beam.
Since the width of each conductive pattern is in above-mentioned relation, pass through the big outside dummy pattern 41 of width and width
The big innermost conductive pattern 12 of degree, the resin to be flowed effectively are constrained.Thus, also comprising the conductor figure being clipped in the middle
Case 11a, 11b, 11c, 11d, 11e, are suppressed with the deformation of the conductive pattern of resin flowing.
According to the present embodiment, by possessing outside dummy pattern 41, with only passing through the conductive pattern of coil portion 104
Width etc. is to determine the width of conductive pattern, the situation at interval is compared, and shape, the free degree of configuration of conductive pattern are higher.
《5th embodiment》
In the 5th embodiment, represent there is no outside dummy pattern and exist more built in the coil of inner side dummy pattern
The example of laminar substrate.
Figure 11 is the top view of multilager base plate 205 built in coil involved by the 5th embodiment.Multilager base plate built in coil
205 have the layered product 100 that the base material of the thermoplastic resin formed with conductive pattern is laminated.
In layered product 100, the coil portion 105 of the conductive pattern based on rectangular coil shape is formed, in the inner side of coil portion 105
Form the inner side dummy pattern 42 based on conductive pattern.
X-direction (the X-X lines in Figure 11) in the face of the layered product 100 along coil portion 105, the width of each conductive pattern
Degree is in following relation.
(A) the width W4 of outermost conductive pattern is bigger (W2 than width W2, W3 of other conductive patterns of coil portion 105
＜ W4, W3 ＜ W4).
(E) the width W1 ' of inner side dummy pattern 42 is bigger (W2 ＜ than width W2, W3 of the conductive pattern of coil portion 105
W1 ', W3 ＜ W1 ').
(G) interval of the conductive pattern of the coil portion 105 adjacent with inner side dummy pattern 42 and inner side dummy pattern 42
(Wa) for inner side dummy pattern 42 width (W1 ') below (Wa≤W1 ').
(I) interval (Wa) of the conductive pattern of inner side dummy pattern 42 and coil portion 105 adjacent thereto is coil portion
Interval (Wb) between 105 conductive pattern is below (Wa≤Wb).
Layered product is formed by the way that multiple base materials are carried out with heating punching press.Although as thermoplastic resin during the heating punching press
Base material carry out resin flowing, but inner side dummy pattern 42 and outermost conductive pattern 10a, 10b, 10c, 10d are to heating
The resin to be flowed during punching press is constrained.
Since the width of each conductive pattern is in above-mentioned relation, pass through the big inner side dummy pattern 42 of width and width
Degree big outermost conductive pattern 10a, 10b, 10c, 10d, the resin to be flowed effectively are constrained.Thus, also comprising folder
In middle conductive pattern 11a, 11b, 11c, 11d, 11e, it is suppressed with the deformation of the conductive pattern of resin flowing.It is special
Not, in the present embodiment, due to inner side dummy pattern 42 and the interval of the conductive pattern of coil portion 105 adjacent thereto
(Wa) interval (Wb) between the conductive pattern of coil portion 105 below (Wa≤Wb), therefore based on the tree of inner side dummy pattern 42
The inhibitory action of fat flowing effectively improves.Therefore, the deformation of part adjacent with inner side dummy pattern 42 among coil portion 105
It is effectively suppressed.
According to the present embodiment, by possessing inner side dummy pattern 42, with only passing through the conductive pattern of coil portion 105
Width etc. is to determine the width of conductive pattern, the situation at interval is compared, and shape, the free degree of configuration of conductive pattern are higher.
《6th embodiment》
In the 6th embodiment, multilayer base built in the coil with outside dummy pattern and inner side dummy pattern is represented
The example of plate.
Figure 12 is the top view of multilager base plate 206 built in coil involved by the 6th embodiment.
Multilager base plate 206 built in coil has the stacking that the base material of the thermoplastic resin formed with conductive pattern is laminated
Body 100.
In layered product 100, the coil portion 106 of the conductive pattern based on rectangular coil shape is formed, in the outside of coil portion 106
The outside dummy pattern 41 based on conductive pattern is formed, the inner side dummy pattern 42 based on conductive pattern is formed in inner side.
X-direction (the X-X lines in Figure 12) in the face of the layered product 100 along coil portion 106, the width of each conductive pattern
Degree is in following relation.
(D) 41 width W4 ' of outside dummy pattern is bigger (W2 ＜ than width W2, W3 of the conductive pattern of coil portion 106
W4 ', W3 ＜ W4 ').
(E) the width W1 ' of inner side dummy pattern 42 is bigger (W2 ＜ than width W2, W3 of the conductive pattern of coil portion 106
W1 ', W3 ＜ W1 ').
(F) interval (Wd) of the conductive pattern of outside dummy pattern and coil portion adjacent thereto is the conductor figure of coil portion
Interval (Wc) between case is below (Wd≤Wc).
(G) interval of the conductive pattern of the coil portion adjacent with inner side dummy pattern and inner side dummy pattern (Wa) is inner side
The width (W1 ') of dummy pattern is below (Wa≤W1 ').
In addition, the width of each conductive pattern is also following relation.
(H) interval (Wd) of the outside dummy pattern 41 also conductive pattern of coil portion 106 adjacent thereto is illusory for outside
The width (W4 ') of pattern 41 is below (Wd≤W4 ').
Since the width of each conductive pattern is in above-mentioned relation, by with the 3rd embodiment, the 5th embodiment phase
Same effect, is suppressed with the deformation of the conductive pattern of resin flowing.Especially, in the present embodiment, outside is passed through
The interval (Wd) of the conductive pattern of dummy pattern 41 and coil portion 106 adjacent thereto is the width of outside dummy pattern 41
(W4 ') below so that based on outside dummy pattern 41 resin flowing inhibitory action effectively improve.Therefore, coil portion 106
Among the deformation of the part adjacent with outside dummy pattern 41 be effectively suppressed.
《7th embodiment》
In the 7th embodiment, multilayer base built in the coil with outside dummy pattern and inner side dummy pattern is represented
The example of plate.
Figure 13 is the top view of multilager base plate 207 built in coil involved by the 7th embodiment.
Multilager base plate 207 built in coil has the stacking that the base material of the thermoplastic resin formed with conductive pattern is laminated
Body 100.
In layered product 100, the coil portion 107 of the conductive pattern based on rectangular coil shape is formed, in the outside of coil portion 107
The outside dummy pattern 41 based on conductive pattern is formed, the inner side dummy pattern 42 based on conductive pattern is formed in inner side.
X-direction (the X-X lines in Figure 13) in the face of the layered product 100 along coil portion 107, the width of each conductive pattern
Degree is in following relation.
(D) 41 width W4 ' of outside dummy pattern is bigger (W2 ＜ than width W2, W3 of the conductive pattern of coil portion 107
W4 ', W3 ＜ W4 ').
(E) the width W1 ' of inner side dummy pattern 42 is bigger (W2 ＜ than width W2, W3 of the conductive pattern of coil portion 107
W1 ', W3 ＜ W1 ').
(F) interval (Wd) the leading for coil portion of the conductive pattern of outside dummy pattern 41 and coil portion adjacent thereto
Interval (Wc) between body pattern is below (Wd≤Wc).In addition, in the present embodiment, interval Wb is same position with being spaced Wc
Interval.
(I) interval (Wa) of the conductive pattern of inner side dummy pattern 42 and coil portion 107 adjacent thereto is coil portion
Interval (Wb) between 107 conductive pattern is below (Wa≤Wb).
It is adjoint by effect in a same manner as in the third embodiment since the width of each conductive pattern is in above-mentioned relation
The deformation for the conductive pattern of resin flowing is suppressed.Especially, in the present embodiment, due to inner side dummy pattern 42 and with
Interval (Wb) of the interval (Wa) of the conductive pattern of its adjacent coil portion 107 between the conductive pattern of coil portion 107 is below
(Wa≤Wb), therefore the inhibitory action of the flowing of the resin based on inner side dummy pattern 42 effectively improves.Therefore, coil portion 107
Among the deformation of the part adjacent with inner side dummy pattern 42 be effectively suppressed.
《8th embodiment》
In the 8th embodiment, multilayer base built in the coil with outside dummy pattern and inner side dummy pattern is represented
The example of plate.
Figure 14 is the top view of multilager base plate 208 built in coil involved by the 8th embodiment.Inner side dummy pattern 42
Shape is different from multilager base plate 207 built in the coil in the 7th embodiment shown in Figure 13.In the present embodiment, inner side is illusory
Pattern 42 is rectangular ring.In this way, even if inner side dummy pattern 42 expands to a planar, become larger i.e. as long as line width W1 " is opposite
Can.The width of each conductive pattern is in following relation.
(D) 41 width W4 ' of outside dummy pattern is bigger (W2 ＜ than width W2, W3 of the conductive pattern of coil portion 108
W4 ', W3 ＜ W4 ').
(E) the width W1 " of inner side dummy pattern 42 is bigger (W2 ＜ than width W2, W3 of the conductive pattern of coil portion 108
W1 ", W3 ＜ W1 ").
(F) interval (Wd) the leading for coil portion of the conductive pattern of outside dummy pattern 41 and coil portion adjacent thereto
Interval (Wc) between body pattern is below (Wd≤Wc).In addition, in the present embodiment, interval Wb and interval Wc are same position
Interval.
(I) interval (Wa) of the conductive pattern of inner side dummy pattern 42 and coil portion 108 adjacent thereto is coil portion
Interval (Wb) between 108 conductive pattern is below (Wa≤Wb).
Since the width of each conductive pattern is in above-mentioned relation, with the deformation quilt of the conductive pattern of resin flowing
Suppress.Especially, in the present embodiment, due to the interior side opening of inner side dummy pattern, by multilayer built in this coil
In the case that substrate is used for high frequency band, it is difficult to be hindered by inner side dummy pattern 42 by the magnetic flux of the coil aperture of coil portion 108
Hinder.Therefore, the reduction of inductance is suppressed.
Finally, the explanation of above-mentioned embodiment is example in terms of whole, is not restricted.For this area
Technical staff, suitably can be deformed and be changed.For example, the office of the composition shown in different embodiments can be carried out
Portion replaces or combination.The scope of the utility model is not represented by above-mentioned embodiment, and is represented by claims.Into
One step, in the scope of the utility model, it is intended to encompass whole changes in the meaning and scope being equal with claims
More.
For example, other inscapes can also be contained in inside multilager base plate by multilager base plate built in coil.For example, also may be used
To include earth conductor, capacitor conductor etc..
In addition, multilager base plate built in coil can be in surface mounted electronic parts, can also be in internal built-in electronic component.
In addition, as long as the winding number for forming the conductive pattern of coil meets the important document described in the utility model, just do not have
Limitation.
- symbol description-
S1, S2, S3 ... base material
10a, 10b, 10c, 10d, 11a, 11b, 11c, 11d, 11e, 12 ... conductive patterns
13a, 13b, 13c, 13d, 14a, 14b, 14c, 15 ... conductive patterns
21st, 22 ... interlayer connection conductors
21a, 21b, 21c ... interlayer connection conductor
22a, 22b ... interlayer connection conductor
23b, 23c ... interlayer connection conductor
The interlayer connection conductor of 24A, 24B, 25,26 ...
31st, 32 ... terminal electrodes
41st, 43 ... outside dummy patterns
42nd, 44 ... inner side dummy patterns
100 ... layered products
101st, 102 ... coil portions
103A, 103B ... coil portion
104th, 105 ... coil portions
110 ... protective films
Multilager base plate built in 201~205 ... coils.
Claims (13)
1. multilager base plate built in a kind of coil, it is to include the thermoplastic resin formed with the conductive pattern being made of metal foil
What multiple base materials of base material were laminated, there is the coil being made of the conductive pattern, multilager base plate built in the coil
It is characterized in that,
The coil has coil axis in the stacked direction of multiple base materials,
Have at least one base material among multiple base materials based on the shape that multi-turn has been wound around the coil axis
The coil portion of the conductive pattern of shape,
Among the conductive pattern for forming the coil portion, arbitrarily at least orthogonal 2 in the face along the base material
Direction of principal axis,
The width of outermost conductive pattern is than the conductive pattern between innermost conductive pattern and outermost conductive pattern
Width it is big,
The width of innermost conductive pattern is than the conductive pattern between outermost conductive pattern and innermost conductive pattern
Width it is big,
The width of innermost conductive pattern is more than the interval of the innermost conductive pattern and conductive pattern adjacent thereto.
2. multilager base plate built in coil according to claim 1, wherein,
Interlayer connection conductor is connected with least one party of the outermost conductive pattern and the innermost conductive pattern.
3. multilager base plate built in a kind of coil, it is to include the thermoplastic resin formed with the conductive pattern being made of metal foil
What multiple base materials of base material were laminated, there is the coil being made of the conductive pattern, multilager base plate built in the coil
It is characterized in that,
The coil has coil axis in the stacked direction of multiple base materials,
Have at least one base material among multiple base materials based on the shape that multi-turn has been wound around the coil axis
The coil portion of the conductive pattern of shape,
It is illusory in the outside of coil portion outside of the configuration based on the conductive pattern in the base material formed with the coil portion
Pattern, the inner side dummy pattern based on the conductive pattern is configured in the inner side of the coil portion,
Among the conductive pattern for forming the coil portion, arbitrarily at least orthogonal 2 in the face along the base material
Direction of principal axis,
The width of the outside dummy pattern is bigger than the width of the conductive pattern of the coil portion,
The width of the inner side dummy pattern is bigger than the width of the conductive pattern of the coil portion,
The conductor at intervals of the coil portion of the conductive pattern of the outside dummy pattern and the coil portion adjacent thereto
Below interval between pattern,
The conductive pattern of the coil portion adjacent with the inner side dummy pattern and the inner side dummy pattern at intervals of institute
Below the width for stating inner side dummy pattern.
4. multilager base plate built in coil according to claim 3, wherein,
Interlayer connection conductor is connected with least one party of the outside dummy pattern and the inner side dummy pattern.
5. multilager base plate built in a kind of coil, it is to include the thermoplastic resin formed with the conductive pattern being made of metal foil
What multiple base materials of base material were laminated, there is the coil being made of the conductive pattern, multilager base plate built in the coil
It is characterized in that,
The coil has coil axis in the stacked direction of multiple base materials,
At least one base material among multiple base materials, has based on the shape that multi-turn has been wound around the coil axis
The coil portion of the conductive pattern of shape,
It is illusory in the outside of coil portion outside of the configuration based on the conductive pattern in the base material formed with the coil portion
Pattern,
Among the conductive pattern for forming the coil portion, arbitrarily at least orthogonal 2 in the face along the base material
Direction of principal axis,
The width of innermost conductive pattern is bigger than the width of other conductive patterns of the coil portion,
The width of the innermost conductive pattern is the interval of the innermost conductive pattern and conductive pattern adjacent thereto
More than,
The width of the outside dummy pattern is than the coil between innermost conductive pattern and the outside dummy pattern
The width of the conductive pattern in portion is big,
The interval of the conductive pattern of the outside dummy pattern and the coil portion adjacent thereto, innermost leads except described
Beyond the interval of body pattern and conductive pattern adjacent thereto, below the interval between the conductive pattern of the coil portion.
6. multilager base plate built in coil according to claim 5, wherein,
Interlayer connection conductor is connected with least one party of the outside dummy pattern and the innermost conductive pattern.
7. multilager base plate built in a kind of coil, it is to include the thermoplastic resin formed with the conductive pattern being made of metal foil
What multiple base materials of base material were laminated, there is the coil being made of the conductive pattern, multilager base plate built in the coil
It is characterized in that,
The coil has coil axis in the stacked direction of multiple base materials,
At least one base material among multiple base materials, has based on the shape that multi-turn has been wound around the coil axis
The coil portion of the conductive pattern of shape,
It is illusory in the inner side of coil portion inner side of the configuration based on the conductive pattern in the base material formed with the coil portion
Pattern,
Among the conductive pattern for forming the coil portion, arbitrarily at least orthogonal 2 in the face along the base material
Direction of principal axis,
The width of outermost conductive pattern is bigger than the width of other conductive patterns of the coil portion,
The coil of the width of the inner side dummy pattern between outermost conductive pattern and the inner side dummy pattern
It is more than the width of the conductive pattern in portion,
The conductive pattern of the coil portion adjacent with the inner side dummy pattern and the inner side dummy pattern at intervals of institute
Below the width for stating inner side dummy pattern.
8. multilager base plate built in coil according to claim 7, wherein,
Interlayer connection conductor is connected with least one party of the outermost conductive pattern and the inner side dummy pattern.
9. multilager base plate built in the coil according to claim 3,4,5 or 6, wherein,
The conductive pattern of the outside dummy pattern and the coil portion adjacent thereto at intervals of the outside dummy pattern
Width below.
10. multilager base plate built in a kind of coil, it is to include the thermoplastic resin formed with the conductive pattern being made of metal foil
Multiple base materials of base material be laminated, there is the coil being made of the conductive pattern, multilager base plate built in the coil
It is characterized in that,
The coil has coil axis in the stacked direction of multiple base materials,
Have at least one base material among multiple base materials based on the shape that multi-turn has been wound around the coil axis
The coil portion of the conductive pattern of shape,
It is illusory in the outside of coil portion outside of the configuration based on the conductive pattern in the base material formed with the coil portion
Pattern, the inner side dummy pattern based on the conductive pattern is configured in the inner side of the coil portion,
Among the conductive pattern for forming the coil portion, arbitrarily at least orthogonal 2 in the face along the base material
Direction of principal axis,
The width of the outside dummy pattern is bigger than the width of the conductive pattern of the coil portion,
The width of the inner side dummy pattern is bigger than the width of the conductive pattern of the coil portion,
The conductor at intervals of the coil portion of the conductive pattern of the outside dummy pattern and the coil portion adjacent thereto
Below interval between pattern,
The conductor at intervals of the coil portion of the conductive pattern of the inner side dummy pattern and the coil portion adjacent thereto
Below interval between pattern.
11. multilager base plate built in a kind of coil, it is to include the thermoplastic resin formed with the conductive pattern being made of metal foil
Multiple base materials of base material be laminated, there is the coil being made of the conductive pattern, multilager base plate built in the coil
It is characterized in that,
The coil has coil axis in the stacked direction of multiple base materials,
Have at least one base material among multiple base materials based on the shape that multi-turn has been wound around the coil axis
The coil portion of the conductive pattern of shape,
In the base material formed with the coil portion, the inner side based on the conductive pattern is respectively configured on the inside of the coil portion
Dummy pattern,
Among the conductive pattern for forming the coil portion, along arbitrary 2 at least orthogonal axis in the face of the base material
Direction,
The width of outermost conductive pattern is bigger than the width of other conductive patterns of the coil portion,
The width of the inner side dummy pattern is than the coil between outermost conductive pattern and the inner side dummy pattern
The width of the conductive pattern in portion is big,
The conductive pattern of the coil portion adjacent with the inner side dummy pattern and the inner side dummy pattern at intervals of institute
State below the interval between the conductive pattern of coil portion.
12. multilager base plate built in the coil according to claim 1,7 or 11, wherein,
The conductive pattern of the outermost conductive pattern and the coil portion adjacent thereto at intervals of described outermost
Below the width of conductive pattern.
13. according to multilager base plate built in claim 1 to 8 or 10,11 any one of them coil, wherein,
The surface in the face contacted with the base material of the conductive pattern on the surface of the base material is formed among the conductive pattern
The surface roughness in the face that roughness ratio does not contact with the base material is big.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015-118157 | 2015-06-11 | ||
| JP2015118157 | 2015-06-11 | ||
| PCT/JP2016/063137 WO2016199516A1 (en) | 2015-06-11 | 2016-04-27 | Coil-incorporating multilayer substrate and method for manufacturing same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207250269U true CN207250269U (en) | 2018-04-17 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201690000515.4U Active CN207250269U (en) | 2015-06-11 | 2016-04-27 | Multilager base plate built in coil |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US11581117B2 (en) |
| JP (1) | JP6213698B2 (en) |
| CN (1) | CN207250269U (en) |
| WO (1) | WO2016199516A1 (en) |
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| CN110828138A (en) * | 2018-08-09 | 2020-02-21 | 矢崎总业株式会社 | Power transmission unit |
| CN113053635A (en) * | 2019-12-26 | 2021-06-29 | 瑞昱半导体股份有限公司 | Integrated transformer |
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| JP6512383B2 (en) * | 2017-04-27 | 2019-05-15 | 株式会社村田製作所 | Actuator |
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| US10498139B2 (en) * | 2017-09-01 | 2019-12-03 | Qualcomm Incorporated | T-coil design with optimized magnetic coupling coefficient for improving bandwidth extension |
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2017
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| CN110828138A (en) * | 2018-08-09 | 2020-02-21 | 矢崎总业株式会社 | Power transmission unit |
| CN110828138B (en) * | 2018-08-09 | 2022-09-30 | 矢崎总业株式会社 | Power transmission unit |
| CN113053635A (en) * | 2019-12-26 | 2021-06-29 | 瑞昱半导体股份有限公司 | Integrated transformer |
| CN113053635B (en) * | 2019-12-26 | 2022-06-03 | 瑞昱半导体股份有限公司 | Integrated transformer |
Also Published As
| Publication number | Publication date |
|---|---|
| US20170365389A1 (en) | 2017-12-21 |
| JP6213698B2 (en) | 2017-10-18 |
| WO2016199516A1 (en) | 2016-12-15 |
| JPWO2016199516A1 (en) | 2017-10-12 |
| US11581117B2 (en) | 2023-02-14 |
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