CN101631433A - Implementation method of printing thick copper foil in PCB - Google Patents
Implementation method of printing thick copper foil in PCB Download PDFInfo
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- CN101631433A CN101631433A CN200910166037A CN200910166037A CN101631433A CN 101631433 A CN101631433 A CN 101631433A CN 200910166037 A CN200910166037 A CN 200910166037A CN 200910166037 A CN200910166037 A CN 200910166037A CN 101631433 A CN101631433 A CN 101631433A
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- copper foil
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Abstract
The invention discloses an implementation method of printing a thick copper foil in a multilayered PCB, which comprises the following steps: copper foils on the PCB are divided into a thick copper foil and a common copper foil according to the current size of a circuit, the common copper foil is processed according to a conventional method, the thick copper foil is processed according to a new method, a carrier of the thick copper foil is processed into a thick copper foil embedding groove according to the line shape of the thick copper foil; the thick copper foil according with the circuit requirement is processed and molded according to the line shape of the thick copper foil; the processed and molded thick copper foil is placed in the thick copper foil embedding grove on the carrier, a prepreg is respectively arranged on and under the thick copper foil; the common copper foil and the thick copper foil are placed in a laminating way, a prepreg is arranged between every two layers, then the vacuum laminating is performed, and the thick copper foils are electrically connected through metalized through holes, and the common copper foils and the thick copper foils are electrically connected by metalized through holes. The PCB is manufactured by adopting the method, thereby the layer number of the PCBs is reduced, the processing cost and the production period are lowered, the production efficiency is improved, and the quality of the PCBs is effectively ensured.
Description
Technical field
The present invention discloses a kind of printing method of pcb board, particularly a kind of implementation method of printing thick Copper Foil in multi-layer PCB board.
Background technology
The circuit board that produces electronic circuit is called pcb board again, for modal thing in the electronic applications, all can use in each electric equipment products.Along with development of electronic technology, engender some miniaturizations, high power density electronic product, such as modular switch power supply, automotive electronics, lamp rectifier and flat-plate transformer etc., owing to there is partial circuit big electric current to be arranged on this series products by (as: winding that is used for the multi-layer PCB formation of flat-plate transformer), they just require to have on the pcb board, and big electric current passes through that the copper foil circuit of this part can be done thicklyer, so that can bear these big electric currents.Traditional PCB technological method for processing normally adopts chemical corrosion method, owing to be subjected to the restriction of process, most of pcb board factory can only accomplish copper thickness below the 2-4OZ that just copper thickness can not satisfy the requirement of big electric current below 0.14 millimeter.The reason that copper thickness can't further improve mainly is: after copper thickness increased, when PCB produced, the copper foil circuit graphic making was more difficult, and cost increases substantially, and the production cycle is long; Another prior reason is that when each layer line road was pressed together, the resin of prepreg can't fill up the space between the Copper Foil, root and interior corner at Copper Foil produces the cavity easily, such cavity makes pcb board in the thermal shock lower leaf easily, and cracking etc. belong to defective products.Owing to be subjected under the traditional PCB technology, the restriction that copper thickness is not enough is flow through big electric current at product requirement, and plane space is limited the time, the engineer is when the design pcb board, can only just carry out parallel connection toward longitudinal development, satisfy big current requirements with the more number of plies, thereby the complexity when not only having caused circuit design, increase design cost, also cause entire circuit flaggy number to increase, cost increases.For example in communication switch power, the modular power source of the multi-layer plate-type of output LOW voltage, big electric current, its design input on pcb board, output major loop, the former limit of transformer and secondary winding, inductance winding etc. often all are formed in parallel by the multilayer copper foil circuit.
Summary of the invention
In the above-mentioned prior art of mentioning, when producing pcb board, big current segment design and the high shortcoming of production cost, the invention provides a kind of new pcb board printing method, the Copper Foil that flows through as required on the big young pathbreaker PCB of electric current is divided into thick Copper Foil and common Copper Foil, common Copper Foil manufactures and designs according to conventional method, for thick Copper Foil, process carrier earlier, then on carrier, according to the circuit shape, utilize gong plate machine or stamping machine to process the embedding groove of thick Copper Foil, each thick Copper Foil all needs an embedding groove.The Copper Foil that will meet current requirements thickness again is processed into the circuit shape, is positioned in the embedding groove of thick Copper Foil.The carrier layer that has formed the pcb board of common Copper Foil and embedding thick Copper Foil stacked put, utilize vacuum pressing-combining that it is pressed into integral body, common copper foil circuit and thick copper foil circuit are electrically connected by via hole.
The technical scheme that the present invention solves its technical problem employing is: a kind of implementation method of printing thick Copper Foil in pcb board, Copper Foil on the pcb board is divided into thick Copper Foil and common Copper Foil according to the circuital current size, common Copper Foil according to common process machine-shaping, is processed the embedding groove of thick Copper Foil according to the circuit shape of thick Copper Foil on thick Copper Foil carrier; The thick Copper Foil that coincident circuit is required is according to the circuit shape machine-shaping of thick Copper Foil; The thick Copper Foil of machine-shaping is placed in the embedding groove of thick Copper Foil on the carrier, have prepreg on the thick Copper Foil; The common Copper Foil of machine-shaping and thick copper foil layer stacked put, layer with layer between be provided with prepreg, pcb board is carried out vacuum pressing-combining, common Copper Foil district is electrically connected by metallized via hole with the Copper Foil of thick Copper Foil district floor.
The technical scheme that the present invention solves its technical problem employing further comprises:
Central layer (as epoxy resin board) and prepreg that described thick Copper Foil carrier is used for the PCB field.
The thickness sum of described thick Copper Foil carrier is slightly larger than thick copper thickness before pressing.
Described thick Copper Foil adopts the mode machine-shaping of mechanical stamping, electric spark cutting or laser cutting.
The embedding groove of described thick Copper Foil is on thick Copper Foil carrier, and with gong plate machine or stamping machine machine-shaping, embedding groove is a groove.
The invention has the beneficial effects as follows: adopt method of the present invention to make pcb board, when line design, do not need to design separately the circuit of big galvanic areas, reduce design difficulty, also do not needed to increase in order to satisfy current requirements separately the circuit board number of plies, thereby reduced the number of plies of circuit board, processing cost and production cycle have been reduced, improved production efficiency, but also effectively guaranteed the quality of pcb board, made it can not produce defective productss such as layering, cracking.
The present invention will be further described below in conjunction with the drawings and specific embodiments.
Description of drawings
Fig. 1 is the thick Copper Foil loop construction schematic diagram of production instance of the present invention.
Fig. 2 is the embedding groove structural representation of thick Copper Foil on the carrier of production instance of the present invention.
Fig. 3 is the overall structure schematic diagram of production instance of the present invention.
Among the figure, the 1-first thick Copper Foil coil, the 2-second thick Copper Foil coil, the embedding groove of the 3-first thick Copper Foil, the embedding groove of 4 second thick Copper Foils, 5-prepreg, 6-top layer Copper Foil, 7-bottom Copper Foil, 8-intermediate layer Copper Foil.
Embodiment
Present embodiment is the preferred embodiment for the present invention, and other every its principles are identical with present embodiment or approximate with basic structure, all within protection range of the present invention.
The present invention is when realizing, earlier according to the circuit requirement, Copper Foil on the whole PCB is divided into thick Copper Foil and common Copper Foil, thick Copper Foil is the part that has big electric current to flow through in the circuit, remainder is common Copper Foil, common Copper Foil among the PCB manufactures and designs (as adopting chemical corrosion method) according to the method for routine, and inventive point of the present invention mainly is at the thick Copper Foil among the PCB.Thick Copper Foil is when producing, select a PCB central layer earlier and place the prepreg more than two or two on its two sides as thick Copper Foil carrier, circuit shape and position according to thick Copper Foil, on thick Copper Foil carrier, process and thick Copper Foil planar graph and the on all four break-through groove of size with gong plate machine or stamping machine, be called the embedding groove of thick Copper Foil among the present invention, all corresponding embedding groove of each thick Copper Foil.The central layer that is used as thick Copper Foil carrier in the present embodiment can have copper foil circuit, also can not have copper foil circuit, and its effect is when follow-up pressing, prevents thick Copper Foil sliding transfer in embedding groove; Can provide resin as the prepreg of thick Copper Foil carrier, heat during pressing follow-up, resin can flow, thereby fills up the space around the thick Copper Foil.Adopt modes such as mechanical stamping, electric spark cutting or laser cutting, will satisfy the Copper Foil of thickness requirement according to the machine-shaping of circuit shape.Carry out stacked placement then in the following order: bottom surface Copper Foil (common Copper Foil)-prepreg-thick Copper Foil carrier-thick Copper Foil-prepreg-core material (common Copper Foil)-prepreg---prepreg-end face Copper Foil (common Copper Foil), if a plurality of thick Copper Foils and carrier are arranged, before placing the end face Copper Foil, can repeat the action of front, after placement finishes, these materials are sent into vacuum laminator carry out pressing, after the pressing, the circuit of separating and the internal layer of other circuit and skin just have been combined into an integral body, and thick copper foil circuit is electrically connected by metallized via hole with common copper foil circuit and gets final product.
Said method is when realizing, after in the embedding groove of thick Copper Foil carrier, placing thick Copper Foil, also, all be provided with prepreg in addition at the upper and lower surface of thick Copper Foil, thick Copper Foil, the common Copper Foil that the carrier of the embedding groove of thick Copper Foil is provided and is positioned at its upper and lower surface can be bonded into one whole closely.Have the epoxy resin central layer of the embedding groove of thick Copper Foil and the gross thickness of prepreg, meet the following conditions: before pressing, gross thickness is slightly thicker than thick copper thickness, and to satisfy after pressing, the carrier thickness that has prepreg is the same substantially with thick copper thickness.
Multi-layer PCB with a switch power module is that example illustrates implementation procedure of the present invention below, in order to simplify the narration process, only a winding in its transformer is handled as thick Copper Foil, and other circuit is all as common Copper Foil.
Suppose that winding is two circles, every circle is a thick Copper Foil, totally two thick Copper Foils.Each copper thickness is 8OZ (promptly 0.28 millimeter).Adopt mechanical means to process two thick Copper Foils respectively, as the first thick Copper Foil coil 1 among Fig. 1 and the second thick Copper Foil coil 2.Select the central layer of two 0.2 millimeter thickness again, with the carrier of corresponding two the 0.07 millimeter prepregs 5 of each central layer as thick Copper Foil, the gross thickness of each central layer and two prepreg additions is 0.34 millimeter, and is thicker slightly than 0.28 millimeter of copper sheet, satisfies the requirement of thickness.Embedding groove of processing is placed on the first thick Copper Foil coil 1 and the second thick Copper Foil coil 2 in the embedding groove of corresponding thick Copper Foil on each carrier.Other circuit part of switch power module is according to conventional method design in 4 layer line roads (be that top layer Copper Foil 6, bottom Copper Foil 7 and Copper Foil 8[intermediate layer, intermediate layer Copper Foil 8 respectively design one deck circuit up and down]).Carry out stacked placement according to following order then: bottom Copper Foil 7-prepreg 5-the second carrier (being placed with the second thick Copper Foil coil 2 in the embedding groove 4 of the second thick Copper Foil on second carrier)-prepreg 5-intermediate layer Copper Foil 8-prepreg 5-the first carrier (being placed with the first thick Copper Foil coil 1 in the embedding groove 3 of the first thick Copper Foil on first carrier)-prepreg 5-top layer Copper Foil 6, then it is carried out pressing in vacuum pressing-combining machine, form an integral body, subsequent technique is produced identical with conventional PCB.Between two thick Copper Foils in embedding groove, and two thick Copper Foils are connected with circuit between the common Copper Foil, in follow-up common process, adopt the metallization via hole to be communicated with.
The first, the present invention adopts mechanical means, cutting method substituted chemistry etching to make thick Copper Foil, can process the Copper Foil of any thickness efficiently.
The second, the present invention opens the break-through groove and places thick Copper Foil on carrier, in the side of thick Copper Foil and up and down, all has resin material to supply with, when pressing, enough flowable resinous materials can be provided, after the assurance pressing, not have space or hole around the thick Copper Foil.
Among the present invention, being used as the material of central layer, can be PCB field material commonly used, as epoxy resin board, phenolic resins plate etc., also can be metallic plate, as aluminium sheet, copper coin etc.For metallic plate, to be located at embedding groove on this central layer around and via hole on this central layer carry out insulation processing in advance.
The present invention is mainly used in the processing of multilayer circuit board, realizes and satisfy the Copper Foil requirement of any thickness, thereby avoids the Multi-layer Parallel under the conventional method, has reduced the PCB number of plies, has reduced processing cost and production cycle, has improved production efficiency.Also be applicable to the multi-layer PCB that independent manufacturing flat surface transformer winding and planar inductor winding are used.
Claims (6)
1, a kind of implementation method of in pcb board, printing thick Copper Foil, Copper Foil on the pcb board is divided into thick Copper Foil and common Copper Foil according to the size of current of circuit, common Copper Foil is processed according to conventional method, be it is characterized in that: on the carrier of thick Copper Foil, process the embedding groove of thick Copper Foil according to the circuit shape of thick Copper Foil; The thick Copper Foil that coincident circuit is required is according to the circuit shape machine-shaping of thick Copper Foil; The thick Copper Foil of machine-shaping is placed in the embedding groove of thick Copper Foil on the carrier, have prepreg on the thick Copper Foil; Common Copper Foil and thick copper foil layer stacked put, layer with layer between be provided with prepreg, carry out vacuum pressing-combining then, be electrically connected by metallized via hole between the thick Copper Foil and between common Copper Foil and the thick Copper Foil.
2, the implementation method of printing thick Copper Foil in pcb board according to claim 1 is characterized in that: described thick Copper Foil adopts the mode machine-shaping of mechanical stamping, electric spark cutting or laser cutting.
3, the implementation method of printing thick Copper Foil in pcb board according to claim 1 is characterized in that: described thick Copper Foil carrier comprises central layer and is positioned at the prepreg of central layer upper and lower surface.
4, the implementation method of printing thick Copper Foil in pcb board according to claim 3, it is characterized in that: the gross thickness of described carrier is slightly larger than thick copper thickness.
5, the implementation method of printing thick Copper Foil in pcb board according to claim 1, it is characterized in that: the embedding groove of described thick Copper Foil is by gong plate machine or stamping machine machine-shaping.
6, according to any described implementation method of printing thick Copper Foil in pcb board in the claim 1 to 5, it is characterized in that: the embedding groove of described thick Copper Foil is a groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910166037A CN101631433A (en) | 2009-07-31 | 2009-07-31 | Implementation method of printing thick copper foil in PCB |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910166037A CN101631433A (en) | 2009-07-31 | 2009-07-31 | Implementation method of printing thick copper foil in PCB |
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| CN101631433A true CN101631433A (en) | 2010-01-20 |
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Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012031522A1 (en) * | 2010-09-08 | 2012-03-15 | Tian Xianping | Method for manufacturing thick copper foil pcb |
| CN103813649A (en) * | 2012-11-15 | 2014-05-21 | 深南电路有限公司 | Circuit board capable of bearing large currents and processing method thereof |
| CN104427773A (en) * | 2013-09-11 | 2015-03-18 | 珠海方正科技多层电路板有限公司 | Manufacturing method of printed circuit board and corresponding printed circuit board |
| CN104717839A (en) * | 2013-12-13 | 2015-06-17 | 深南电路有限公司 | Thick copper circuit board and manufacturing method thereof |
| CN104754869A (en) * | 2013-12-30 | 2015-07-01 | 深南电路有限公司 | Local thick copper circuit board and manufacturing method thereof |
| CN104812174A (en) * | 2015-03-27 | 2015-07-29 | 深圳市五株科技股份有限公司 | Prepreg blind hole and slot forming method |
| CN104955277A (en) * | 2014-03-24 | 2015-09-30 | 深南电路有限公司 | Production method for thick-copper circuit board |
| US9247649B2 (en) | 2013-05-06 | 2016-01-26 | Globalfoundries Inc. | Printed circuit boards fabricated using congruent molds |
| CN105472900A (en) * | 2014-09-05 | 2016-04-06 | 深南电路有限公司 | Processing method of circuit board |
| CN106961787A (en) * | 2017-04-17 | 2017-07-18 | 四川深北电路科技有限公司 | A kind of preparation technology of the thick copper foil circuit plate of high heat conduction |
| CN107809841A (en) * | 2017-09-28 | 2018-03-16 | 优尔特电子（深圳）有限公司 | A kind of preparation method and its circuit board of product substrate |
| CN108235600A (en) * | 2017-12-28 | 2018-06-29 | 广州兴森快捷电路科技有限公司 | The preparation method of printed wiring board |
| CN108990297A (en) * | 2018-08-23 | 2018-12-11 | 鹤山市中富兴业电路有限公司 | It is a kind of thickness copper base on formed route technique |
| CN109475051A (en) * | 2018-09-26 | 2019-03-15 | 江门崇达电路技术有限公司 | A kind of production method of the thick copper printed circuit board in part |
| US10418337B2 (en) | 2017-06-21 | 2019-09-17 | Delta Electronics (Shanghai) Co., Ltd. | Inductor structure mounted on PCB board and voltage regulator module having the same |
| CN110248480A (en) * | 2019-06-26 | 2019-09-17 | 苏州市华扬电子股份有限公司 | A kind of production method of flexible circuit board |
| CN111295040A (en) * | 2020-02-29 | 2020-06-16 | 苏州浪潮智能科技有限公司 | PCB (printed circuit board), layout method and device thereof and storage medium |
-
2009
- 2009-07-31 CN CN200910166037A patent/CN101631433A/en active Pending
Cited By (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102404942A (en) * | 2010-09-08 | 2012-04-04 | 田先平 | Method of manufacturing thick copper foil PCB (Printed Circuit Board) |
| WO2012031522A1 (en) * | 2010-09-08 | 2012-03-15 | Tian Xianping | Method for manufacturing thick copper foil pcb |
| CN103813649A (en) * | 2012-11-15 | 2014-05-21 | 深南电路有限公司 | Circuit board capable of bearing large currents and processing method thereof |
| US9247649B2 (en) | 2013-05-06 | 2016-01-26 | Globalfoundries Inc. | Printed circuit boards fabricated using congruent molds |
| CN104427773A (en) * | 2013-09-11 | 2015-03-18 | 珠海方正科技多层电路板有限公司 | Manufacturing method of printed circuit board and corresponding printed circuit board |
| CN104717839A (en) * | 2013-12-13 | 2015-06-17 | 深南电路有限公司 | Thick copper circuit board and manufacturing method thereof |
| CN104717839B (en) * | 2013-12-13 | 2018-08-03 | 深南电路有限公司 | Heavy copper circuit board and preparation method thereof |
| CN104754869A (en) * | 2013-12-30 | 2015-07-01 | 深南电路有限公司 | Local thick copper circuit board and manufacturing method thereof |
| CN104754869B (en) * | 2013-12-30 | 2019-01-15 | 深南电路有限公司 | Local heavy copper circuit board and preparation method thereof |
| CN104955277B (en) * | 2014-03-24 | 2018-02-23 | 深南电路有限公司 | A kind of heavy copper circuit board preparation method |
| CN104955277A (en) * | 2014-03-24 | 2015-09-30 | 深南电路有限公司 | Production method for thick-copper circuit board |
| CN105472900A (en) * | 2014-09-05 | 2016-04-06 | 深南电路有限公司 | Processing method of circuit board |
| CN104812174A (en) * | 2015-03-27 | 2015-07-29 | 深圳市五株科技股份有限公司 | Prepreg blind hole and slot forming method |
| CN106961787A (en) * | 2017-04-17 | 2017-07-18 | 四川深北电路科技有限公司 | A kind of preparation technology of the thick copper foil circuit plate of high heat conduction |
| US10418337B2 (en) | 2017-06-21 | 2019-09-17 | Delta Electronics (Shanghai) Co., Ltd. | Inductor structure mounted on PCB board and voltage regulator module having the same |
| CN107809841A (en) * | 2017-09-28 | 2018-03-16 | 优尔特电子（深圳）有限公司 | A kind of preparation method and its circuit board of product substrate |
| CN108235600A (en) * | 2017-12-28 | 2018-06-29 | 广州兴森快捷电路科技有限公司 | The preparation method of printed wiring board |
| CN108235600B (en) * | 2017-12-28 | 2019-07-12 | 广州兴森快捷电路科技有限公司 | The preparation method of printed wiring board |
| CN108990297A (en) * | 2018-08-23 | 2018-12-11 | 鹤山市中富兴业电路有限公司 | It is a kind of thickness copper base on formed route technique |
| CN109475051A (en) * | 2018-09-26 | 2019-03-15 | 江门崇达电路技术有限公司 | A kind of production method of the thick copper printed circuit board in part |
| CN110248480A (en) * | 2019-06-26 | 2019-09-17 | 苏州市华扬电子股份有限公司 | A kind of production method of flexible circuit board |
| CN111295040A (en) * | 2020-02-29 | 2020-06-16 | 苏州浪潮智能科技有限公司 | PCB (printed circuit board), layout method and device thereof and storage medium |
| CN111295040B (en) * | 2020-02-29 | 2022-06-14 | 苏州浪潮智能科技有限公司 | PCB (printed circuit board), layout method and device thereof and storage medium |
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