CN105472900A - Processing method of circuit board - Google Patents
Processing method of circuit board Download PDFInfo
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- CN105472900A CN105472900A CN201410453366.4A CN201410453366A CN105472900A CN 105472900 A CN105472900 A CN 105472900A CN 201410453366 A CN201410453366 A CN 201410453366A CN 105472900 A CN105472900 A CN 105472900A
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Abstract
The invention discloses a processing method of a circuit board. The method comprises the steps that the step of an external layer graph is performed: the external layer graph is processed on the surface of a laminated board, and the external layer graph comprises a signal bearing line and a current bearing line; the step of electroplating thickening is performed: copper deposition and electroplating are performed, and a metal conductive layer is formed on the whole surface of the laminated board; the metal conductive layer acts as an electroplating lead wire, and the current bearing line is thickened for 1-3OZ through electroplating; and the metal conductive layer is removed through micro-etching; the step of lamination is performed: an insulating layer of which thickness is equivalent to that of the current bearing line is laminated on the region of the surface of the circuit board apart from the current bearing line; and the step of electroplating thickening and the step of lamination are repeated until the current bearing line is thickened to the required thickness.
Description
Technical field
The present invention relates to circuit board technology field, be specifically related to a kind of processing method of circuit board.
Background technology
Along with the development of hybrid power and pure electric automobile, be applied in electric current in automotive control system and the integrated technology of signal is more and more universal, therefore relate to and need to walk big current (such as 30-100A) and the processing problems simultaneously will taking into account away the circuit board of signal.
For the circuit board needing simultaneously loaded current and signal, the many employings of current process program are buried copper technology and are realized, and such as, imbed copper billet at circuit board internal layer, are used for loaded current; Process fine and closely woven circuit on circuit board top layer or other layer, be used for carrying signal; Thus avoid away making and the function of the fine and closely woven circuit of other levels of the some effects of big current.But it is higher to bury the requirement that copper technology makes copper billet, and comprising: require that dimensional accuracy is high, impulse-free robustness, flat smooth and fillet design etc., this just causes cost of manufacture to bury copper circuit board product height 100-300% than non-.
In addition, parcel plating+microetch technique in prior art, can also be adopted, the zones of different of circuit board surface copper foil layer is electroplated respectively thickening and microetch thinning, thus process the different circuit of thickness in zones of different, be respectively used to carrying signal and electric current.But, this technology can form thick copper region, local at circuit board surface, when the thick copper in local and the thickness drop in other region are more than 3 ounces (OZ, 1OZ approximate 35 microns), serious folder film problem can be caused, and then cause processing the circuit board product met the demands; And, the microetch that this kind of technology adopts microetch technique to carry out is thinning, the thickness of circuit board surface copper foil layer can be made to become very uneven, thus easily occur the problem of excessive erosion or deficient corrosion when subsequent etch line pattern, and then be difficult to process the fine and closely woven circuit met the demands.
Summary of the invention
The embodiment of the present invention provides a kind of processing method of circuit board, to provide a kind of cost lower, the processing scheme of better effects if, processes the circuit board needing loaded current and signal simultaneously, solves existing above-mentioned defect of burying copper technology and parcel plating+microetch technique existence.
First aspect present invention provides a kind of processing method of circuit board, comprising:
Outer graphics step: go out outer graphics in the Surface Machining of laminated sheet, described outer graphics comprises signaling bearer circuit and current carrying lines;
Plating thickening step: carry out heavy copper plating, forms metal conducting layer on the surface of described laminated sheet; With described metal conducting layer for electroplate lead wire, described current carrying lines plating is thickened 1-3OZ; Microetch removes metal conducting layer;
Lamination step: the region beyond the current carrying lines of described circuit board surface, the insulating barrier that lamination is suitable with described current carrying lines thickness; And,
Repeat described plating thickening step, or, repeat described plating thickening step and lamination step, until described current carrying lines is thickened required thickness.
Therefore the embodiment of the present invention adopts and electroplates the technology such as the difference plating thickened to current carrying lines several times, achieves following technique effect:
First, this programme first carries out outer graphics processing, and then carry out operations such as the plating of current carrying lines thicken, thus, outer graphics adds man-hour, and the thickness of the metal level of laminate surface is very uniform, occurs the problem of excessive erosion or deficient corrosion hardly, thus, the very high outer graphics of precision can be processed;
Secondly, this programme after plating thickens each time, at other region lamination insulating barrier, thus reduce the thickness drop in current carrying lines and other region, and, electroplate the thickness thickened each time and be not more than 3OZ, thus, folder film problem can be avoided to a certain extent;
Again, this programme, by repeatedly repeating plating thickening step and lamination step, can process the current carrying lines of any thickness, meet the current load demand of various scope, the electric current of such as 30-100A or larger current load demand;
Finally, this programme is relative to burying copper technology, and precision etc. require lower, and thus cost of manufacture is lower.
Accompanying drawing explanation
In order to be illustrated more clearly in embodiment of the present invention technical scheme, be briefly described to the accompanying drawing used required in embodiment and description of the prior art below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the schematic flow sheet of the processing method of a kind of circuit board that the embodiment of the present invention provides;
Fig. 2 a-2e is the schematic diagram of employing embodiment of the present invention method processing circuit board in each stage.
Embodiment
The embodiment of the present invention provides a kind of processing method of circuit board, to provide a kind of cost lower, the processing scheme of better effects if, processes the circuit board needing loaded current and signal simultaneously, solves existing above-mentioned defect of burying copper technology and parcel plating+microetch technique existence.
The present invention program is understood better in order to make those skilled in the art person, below in conjunction with the accompanying drawing in the embodiment of the present invention, technical scheme in the embodiment of the present invention is clearly and completely described, obviously, described embodiment is only the embodiment of a part of the present invention, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtained under creative work prerequisite, should belong to the scope of protection of the invention.
Below by specific embodiment, be described in detail respectively.
Embodiment one,
Please refer to Fig. 1, the embodiment of the present invention provides a kind of processing method of circuit board, can comprise:
110, outer graphics step: go out outer graphics in the Surface Machining of laminated sheet, outer graphics comprises signaling bearer circuit and current carrying lines.
In the present embodiment, can conveniently technology blanking or machined layer pressing plate, said laminated sheet can be single-side coated copper plate or double face copper or form multi-layer sheet based on double face copper lamination.Herein for double face copper, the double face copper of corresponding copper foil layer thickness can be had according to the thickness requirement blanking of required outer graphics, as laminated sheet.The thickness of the coating metal layer of laminated sheet can be less than or equal to 1OZ.
In this step, as shown in Figure 2 a, outer graphics processing is carried out to laminated sheet 20: through pad pasting, exposure, developing process step, laminated sheet 20 needs the region overlay etchant resist (such as dry film) forming outer graphics; Then etch, the coating metal layer of laminated sheet 20 processes outer graphics, and outer graphics can comprise: for the signaling bearer circuit 21 of carrying signal, and for the current carrying lines 22 of loaded current; And complete in etching, remove etchant resist.
Wherein, the live width of current carrying lines 22 is determined, usually wider than signaling bearer circuit 21 according to actual current-carrying needs and wiring space designing requirement.After live width is determined, further according to current-carrying needs, determine the thickness required for current carrying lines 22.In this step, the original depth of current carrying lines 22 is assumed to be 1OZ, and as needed to carry the even higher electric current of 30-100A, then required thickness may be even higher more than 6OZ, herein for the thickness required for current carrying lines 22 for 6OZ.
In subsequent step of the present invention, differential electrical coating technology is adopted to thicken current carrying lines 22 plating.
120, electroplate thickening step: carry out heavy copper plating, form metal conducting layer on the surface of laminated sheet; Take metal conducting layer as electroplate lead wire, current carrying lines plating is thickened 1-3OZ; Microetch removes metal conducting layer.
In plating thickening step of the present invention, parcel plating is carried out to current carrying lines 22, can comprise:
A, the plating of heavy copper: as shown in Figure 2 b, carry out heavy copper, and electroplate in heavy layers of copper laminated sheet 20, forming copper thick is the metal conducting layer 23 of 3-4um, as the conductive layer of follow-up plating.
B, inner figure: as shown in Figure 2 b, plating resist film (such as dry film) 24 is pasted on the surface of laminated sheet 20, and carry out exposing and developing, complete inner figure transfer, realize the region overlay plating resist film 24 beyond the current carrying lines 22 of laminated sheet 20, current carrying lines 22 is exposed at a time, so that subsequent etch.
C, plating thicken: with metal conducting layer 23 for electroplate lead wire, electroplate current carrying lines 22, and current carrying lines 22 plating is thickened 1-3OZ.
D, removal plating resist film 24.
E, employing microetch technique remove metal conducting layer 23.
Laminated sheet 20 after this step machines as shown in Figure 2 c.
To sum up, because the thick drop of copper is when more than 3OZ, serious folder film problem can be caused, therefore, in the embodiment of the present invention, limit and electroplate the thickness thickened at every turn and be no more than 3OZ., suppose that first time plating is when thickening, and thickens to 3OZ by the thickness of current carrying lines 22 from initial 1OZ herein, the thickness that lacks will upper once electroplate and thicken time complete.
130, lamination step: the region beyond the current carrying lines of circuit board surface, the insulating barrier that lamination is suitable with current carrying lines thickness.
As shown in Figure 2 d, in this step, carry out lamination, the region beyond the current carrying lines 22 on laminated sheet 20 surface, the insulating barrier 25 that lamination is suitable with current carrying lines 22 thickness.Saidly quite refer to equal or close to equal, such as thickness error controls within positive and negative 0.2OZ.In some embodiments of the invention, this laminated sheet step can comprise: the region beyond the current carrying lines 22 on laminated sheet 20 surface, the stacked insulating barrier 25 suitable with current carrying lines 22 thickness, and carries out pressing.
Preferably, insulating barrier 25 can comprise prepreg (PP) layer and polyimides (PI) film.Due to herein, when supposing that first time, plating thickened, the thickness of current carrying lines 22 is thickened to 3OZ from initial 1OZ, therefore, in this step, supposes that the thickness of the insulating barrier of lamination is 2OZ.
In addition, in order to make current carrying lines 22 can reveal after pressing, the position corresponding to current carrying lines 22 of insulating barrier 25 can offer in advance runs through groove.Preferably, the One-sided Widths running through groove should be larger than current carrying lines 22 more than 0.1 millimeter.
On the laminated sheet 20 obtained after pressing, current carrying lines 22 is concordant with insulating barrier 25 surface, and that is, current carrying lines 22 region and signaling bearer circuit 21 region no longer include thickness drop.
140, repeat to electroplate thickening step, or, repeat plating thickening step and lamination step, until current carrying lines is thickened required thickness.
Herein, due to when hypothesis first time, plating thickened, the thickness of current carrying lines 22 is thickened to 3OZ from initial 1OZ, therefore, in this step, above-mentioned plating thickening step 120 can be repeated, comprise: on laminated sheet 20, carry out the plating of heavy copper form metal conducting layer, carry out inner figure to complete current carrying lines 22 and cover with the plating resist film of exterior domain, carry out electroplating thickening and realize the thickness of current carrying lines 22 to thicken to 6OZ from 3OZ, and remove plating resist film and metal conducting layer etc., the laminated sheet 20 finally obtained is as shown in Figure 2 e.So far, realized the thickness of current carrying lines 22 to be increased to required thickness, so that the electric current of the required size of carrying.
Then, can select whether to continue repetition lamination step 130.Thicken if current carrying lines 22 does not need to continue plating, last lamination step 130 also can be selected not perform, and such as, can select directly matching board lamination on laminated sheet 20, carry out increasing layer to laminated sheet 20.Thicken if current carrying lines 22 also needs to continue plating, then can repeat above-mentioned lamination step 130, insulating barrier after making lamination is concordant with the surface of current carrying lines 22, then, continue to repeat to electroplate thickening step 120, continue plating to current carrying lines 22 to thicken, such as, thicken 9OZ.
To sum up, the embodiment of the invention discloses a kind of processing method of circuit board, adopt and several times the technology such as the difference plating thickened are electroplated to current carrying lines, achieve following technique effect:
First, this programme first carries out outer graphics processing, and then carry out operations such as the plating of current carrying lines thicken, thus, outer graphics adds man-hour, and the thickness of the metal level of laminate surface is very uniform, occurs the problem of excessive erosion or deficient corrosion hardly, thus, the very high outer graphics of precision can be processed;
Secondly, this programme after plating thickens each time, at other region lamination insulating barrier, thus reduce the thickness drop in current carrying lines and other region, and, electroplate the thickness thickened each time and be not more than 3OZ, thus, folder film problem can be avoided to a certain extent;
Again, this programme, by repeatedly repeating plating thickening step and lamination step, can process the current carrying lines of any thickness, meet the current load demand of various scope, the electric current of such as 30-100A or larger current load demand;
Finally, this programme is relative to burying copper technology, and precision etc. require lower, and thus cost of manufacture is lower.
In the above-described embodiments, the description of each embodiment is all emphasized particularly on different fields, in certain embodiment, there is no the part described in detail, can see the associated description of other embodiment.
It should be noted that, for aforesaid each embodiment of the method, in order to simple description, therefore it is all expressed as a series of combination of actions, but those skilled in the art should know, the present invention is not by the restriction of described sequence of movement, because according to the present invention, some step can adopt other order or carry out simultaneously.Secondly, those skilled in the art also should know, the embodiment described in specification all belongs to preferred embodiment, and involved action and module might not be that the present invention is necessary.
Above the processing method of the circuit board that the embodiment of the present invention provides is described in detail, but the explanation of above embodiment just understands method of the present invention and core concept thereof for helping, and should not be construed as limitation of the present invention.Those skilled in the art, according to thought of the present invention, in the technical scope that the present invention discloses, the change that can expect easily or replacement, all should be encompassed within protection scope of the present invention.
Claims (7)
1. a processing method for circuit board, is characterized in that, comprising:
Outer graphics step: go out outer graphics in the Surface Machining of laminated sheet, described outer graphics comprises signaling bearer circuit and current carrying lines;
Plating thickening step: carry out heavy copper plating, forms metal conducting layer on the surface of described laminated sheet; With described metal conducting layer for electroplate lead wire, described current carrying lines plating is thickened 1-3OZ; Microetch removes described metal conducting layer;
Lamination step: the region beyond the current carrying lines of described circuit board surface, the insulating barrier that lamination is suitable with described current carrying lines thickness; And,
Repeat described plating thickening step, or, repeat described plating thickening step and lamination step, until described current carrying lines is thickened required thickness.
2. method according to claim 1, is characterized in that, described outer graphics step specifically comprises:
Providing layer pressing plate, described laminated sheet has the coating metal layer that thickness is less than or equal to 1OZ;
Described coating metal layer needs the region overlay etchant resist forming outer graphics;
Etch described laminated sheet, described coating metal layer forms outer graphics, and described outer graphics comprises signaling bearer circuit and current carrying lines;
Remove described etchant resist.
3. method according to claim 1, is characterized in that, described in carry out heavy copper plating, the surface of described laminated sheet formed metal conducting layer comprise:
Carry out heavy copper plating, form on the full surface of described laminated sheet the metal conducting layer that thickness is 3-4 micron.
4. method according to claim 1, is characterized in that, described with described metal conducting layer for electroplate lead wire, the plating of described current carrying lines is thickened 1-3OZ and comprises:
Region overlay plating resist film beyond the current carrying lines of described circuit board surface; With described metal conducting layer for electroplate lead wire, described current carrying lines is electroplated, described current carrying lines plating is thickened 1-3OZ; Remove described plating resist film.
5. method according to claim 1, is characterized in that, described lamination step specifically comprises:
Region beyond the current carrying lines of described laminate surface, the insulating barrier that stacked and described current carrying lines thickness is suitable, and carry out pressing; The position corresponding to described current carrying lines of described insulating barrier offers in advance runs through groove.
6. method according to claim 5, is characterized in that,
Described insulating barrier comprises prepreg PP layer and polyimides PI film.
7. method according to claim 5, is characterized in that,
Described larger than the width of described current carrying lines more than 0.1 millimeter of the One-sided Widths running through groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410453366.4A CN105472900A (en) | 2014-09-05 | 2014-09-05 | Processing method of circuit board |
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| CN201410453366.4A CN105472900A (en) | 2014-09-05 | 2014-09-05 | Processing method of circuit board |
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| CN108401361A (en) * | 2017-02-04 | 2018-08-14 | 欣兴电子股份有限公司 | Circuit board and its production method |
| JP2020011440A (en) * | 2018-07-18 | 2020-01-23 | 住友金属鉱山株式会社 | Copper-clad laminate |
| CN111836458A (en) * | 2020-07-17 | 2020-10-27 | 苏州浪潮智能科技有限公司 | PCB high-flow power supply structure and PCB through-flow heightening process |
| US10856421B2 (en) | 2017-03-23 | 2020-12-01 | Unimicron Technology Corp. | Circuit board |
| CN112739037A (en) * | 2020-11-07 | 2021-04-30 | 龙南骏亚柔性智能科技有限公司 | Manufacturing method of flexible circuit board with three copper thicknesses |
| CN114554746A (en) * | 2021-12-16 | 2022-05-27 | 杭叉集团股份有限公司 | Wire harness lead-in type waterproof electrical appliance control box for forklift |
| CN117979542A (en) * | 2024-03-29 | 2024-05-03 | 苏州元脑智能科技有限公司 | Circuit board power supply structure and manufacturing method |
| CN117979542B (en) * | 2024-03-29 | 2024-05-31 | 苏州元脑智能科技有限公司 | Circuit board power supply structure and manufacturing method |
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