CN103731997A - PCB containing stepped copper thickness patterns and manufacturing method thereof - Google Patents
PCB containing stepped copper thickness patterns and manufacturing method thereof Download PDFInfo
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- CN103731997A CN103731997A CN201310723917.XA CN201310723917A CN103731997A CN 103731997 A CN103731997 A CN 103731997A CN 201310723917 A CN201310723917 A CN 201310723917A CN 103731997 A CN103731997 A CN 103731997A
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Abstract
The invention discloses a PCB containing stepped copper thickness patterns and a manufacturing method of the PCB. The board face of the PCB comprises a thick copper area and a thin copper area. The manufacturing method includes the following steps of (1) whole board electroplating, (2) pattern transfer for the first time, (3) copper thickening and (4) pattern transfer for the second time, and then the PCB containing the stepped copper thickness patterns is obtained. According to the manufacturing method, the thin copper area is firstly manufactured, then the thick copper area is manufactured, the requirements for accuracy of the thin copper area can be met, and moreover control over the copper thickness is mainly achieved through the step of copper plating, so that the process is simple, and reliability is good.
Description
Technical field
The present invention relates to printed wiring board technical field, particularly relate to a kind of PCB wiring board that comprises the thick figure of ladder copper and preparation method thereof.
Background technology
Part PCB wiring board, in when design, all can have the requirement that copper is thick, such as radio frequency line etc., if all only thick requirements of a kind of copper or only have local figure to have the thick requirement of copper of entire plate outer graphics, can be thick by regulating the parameter of the operations such as attenuate copper, plating control copper.But this method can only be accomplished whole plate, identical copper is thick, if for example, and part requires copper thick thinner (0.5oz), according to whole plate, all by thinner copper is thick, control making, rear operation walks to plate the words of hole technique, very easily when nog plate, produce the risk of revealing base material, scrappage is very high.And to be all controlled at thinner copper thick due to whole plate, reliability can reduce.Therefore need a kind of thick thinner requirement that guarantees to reach of local figure copper of controlling, other figures are normally made the method that guarantees reliability, and while completing, outer graphics is that to have ladder copper thick.
In prior art, there is employing first to do thick copper to do again the way of thin copper, the method adopts the method that subtracts afterwards copper of first electroplating in thin copper part preparation, in the preparation of thin copper part, just passed through like this twice plating and subtracted copper operation for 1 time, the uniformity that copper is thick is difficult to reach designing requirement.
Summary of the invention
Based on this, the object of this invention is to provide a kind of preparation method of the PCB wiring board that comprises the thick figure of ladder copper.
Concrete technical scheme is as follows:
A preparation method for the PCB wiring board that comprises the thick figure of ladder copper, comprises He Baotong region, thick copper region on the plate face of this PCB wiring board, preparation method comprises the steps:
(1) whole plate is electroplated: the outer copper face of PCB wiring board is carried out to whole plate plating, make the thick thick requirement of copper that reaches thin copper region of copper;
(2) figure shifts for the first time: by pasting dry film, etching, moving back membrane process, make the circuit in thin copper region in step (1) on the PCB wiring board obtaining;
(3) thickening copper: paste dry film and cover thin copper region, then carry out electro-coppering operation, make the thick thick requirement of copper that reaches thick copper region of copper, then move back membrane operations;
(4) figure shifts for the second time: by dry film, etching, move back membrane process, make the circuit in thick copper region in step (3) on the PCB wiring board obtaining, comprise the PCB wiring board of the thick figure of ladder copper described in obtaining.
In an embodiment, the copper in described thin copper region is thick is 12-18 μ m therein.
Therein in an embodiment, it is 18 μ m on request that the thick difference of copper in Yu Houtong region, described thin copper region is greater than the thin copper of 18 μ m(region, 1oz(35 μ is m) on request in thick copper region, making due to thick copper region in actual fabrication there is no impact to the circuit in thin copper region, therefore can accomplish greatlyr, the thick difference of for example copper can reach 30 μ m).
Another object of the present invention is to provide a kind of PCB wiring board that comprises the thick figure of ladder copper.
Concrete technical scheme is as follows:
The PCB wiring board that comprises the thick figure of ladder copper that above-mentioned preparation method prepares.
Beneficial effect of the present invention:
Preparation method of the present invention first makes thin copper region, then makes thick copper region, can meet the requirement of thin copper region to precision, and the thick control of copper is mainly to be undertaken by copper facing step, and flow process is simple, and reliability is good.
Thin copper district inclusion base copper and electro-coppering, control copper by control electro-coppering parameter thick, can reach the higher thick uniformity of copper and the thick precision of copper.After completing, thin copper region circuit protects this part circuit with dry film, until complete the making of whole line patterns.It is thick that thick copper region reaches requirement copper through electro-coppering equally; and be to make figure by the etched mode of negative film, although compare positive etching difficulty, increase to some extent, during due to positive etching, need first move back film; the dry film that will remove protection thin copper region circuit, therefore cannot adopt positive etching herein.
Preparation method of the present invention is compared with prior art mainly reflected in the making in thin copper region, thin copper part available technology adopting is first electroplated the method that subtracts afterwards copper, than many one of preparation method of the present invention, subtract copper flow process, and thin copper part is due to through twice plating with subtract copper 1 time, than the present invention preparation method, only through 1 plating, make and obtain the desired copper in thin copper region thick, its uniformity is far short of what is expected.
Accompanying drawing explanation
Fig. 1 is the profile that embodiment step (1) is carried out PCB wiring board after whole plate electroplating work procedure;
Fig. 2 is the profile that embodiment step (2) is carried out the rear PCB wiring board of figure transfer for the first time;
Fig. 3 is the profile of PCB wiring board after embodiment step (3) subsides dry film;
Fig. 4 is the profile of PCB wiring board after embodiment step (3) electro-coppering operation;
Fig. 5 is the profile that embodiment step (3) is moved back PCB wiring board after film;
Fig. 6 is the profile of PCB wiring board after embodiment step (4) subsides dry film;
Fig. 7 is the profile of PCB wiring board after embodiment step (4) etching;
Fig. 8 is the profile that embodiment step (4) is moved back PCB wiring board after film.
Description of reference numerals:
101, thin copper region; 102, dry film; 103, thick copper region.
Embodiment
Below in conjunction with drawings and Examples, the present invention is further elaborated.
The preparation method of a kind of PCB wiring board that comprises the thick figure of ladder copper of the present embodiment, comprises thick copper region 103 and thin copper region 101 on the plate face of this PCB wiring board, preparation method comprises the steps:
(1) whole plate is electroplated (with reference to figure 1): the outer copper face of PCB wiring board is carried out to whole plate plating, make the thick thick requirement of copper that reaches thin copper region of copper;
(2) figure shifts (with reference to figure 2) for the first time: by pasting dry film 102, etching, moving back membrane process, make the circuit in thin copper region in step (1) on the PCB wiring board obtaining;
(3) thickening copper (with reference to figure 3-Fig. 5): paste dry film and cover thin copper region, then carry out electro-coppering operation, make the thick thick requirement of copper that reaches thick copper region of copper, then move back membrane operations;
(4) figure shifts (with reference to figure 6-Fig. 8) for the second time: by dry film, etching, move back membrane process, make the circuit in thick copper region in step (3) on the PCB wiring board obtaining, comprise the PCB wiring board of the thick figure of ladder copper described in obtaining.
The copper in described thin copper region is thick is 12-18 μ m.
The thick difference of copper in Yu Houtong region, described thin copper region is 18 μ m.
The performance test data of the PCB wiring board that comprises the thick figure of ladder copper that above-mentioned preparation method prepares is as follows:
Adopt 9 methods to measure the thick data of copper (9 points of each planar survey):
It is as shown in table 1 that preparation method of the present invention prepares the thick data of thin copper region copper of wiring board:
The thick data of the thin copper of table 1 region copper (unit: μ m)
Prior art first make thick copper again reduction process make the wiring board obtaining, the thick data of copper in thick copper region are as shown in table 2, subtract after copper the thick data of copper in thin copper region as shown in table 3:
The thick data of the copper (unit: μ m) of the thick copper of table 2
Table 3 subtracts the thick data of the copper (unit: μ m) after copper
From upper table data, can find out, subtract copper after being electroplated onto 60 μ m again, because electrodeposited coating is thicker, cause the thick extreme difference of copper larger, the later stage subtracts the operation of copper and can't dwindle extreme difference, and due to the thick attenuate of copper, actual table copper uniformity variation is a lot.And employing the application's preparation method, the precision that copper is thick is mainly controlled by electroplating parameter, and it is thick that preparation method only makes and obtain the desired copper in thin copper region through 1 plating, and its uniformity will be got well a lot (as shown in table 1), can meet the requirement of circuit precision.
The above embodiment has only expressed several execution mode of the present invention, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection range of patent of the present invention should be as the criterion with claims.
Claims (4)
1. a preparation method who comprises the PCB wiring board of the thick figure of ladder copper, is characterized in that, comprises He Baotong region, thick copper region on the plate face of this PCB wiring board, and preparation method comprises the steps:
(1) whole plate is electroplated: the outer copper face of PCB wiring board is carried out to whole plate plating, make the thick thick requirement of copper that reaches thin copper region of copper;
(2) figure shifts for the first time: by pasting dry film, etching, moving back membrane process, make the circuit in thin copper region in step (1) on the PCB wiring board obtaining;
(3) thickening copper: paste dry film and cover thin copper region, then carry out electro-coppering operation, make the thick thick requirement of copper that reaches thick copper region of copper, then move back membrane operations;
(4) figure shifts for the second time: by dry film, etching, move back membrane process, make the circuit in thick copper region in step (3) on the PCB wiring board obtaining, comprise the PCB wiring board of the thick figure of ladder copper described in obtaining.
2. the preparation method of the PCB wiring board that comprises the thick figure of ladder copper according to claim 1, is characterized in that, the copper in described thin copper region is thick is 12-18 μ m.
3. the preparation method of the PCB wiring board that comprises the thick figure of ladder copper according to claim 1, is characterized in that, the thick difference of copper in Yu Houtong region, described thin copper region is greater than 18 μ m.
4. the PCB wiring board that comprises the thick figure of ladder copper that described in claim 1-3 any one, preparation method prepares.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310723917.XA CN103731997A (en) | 2013-12-24 | 2013-12-24 | PCB containing stepped copper thickness patterns and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310723917.XA CN103731997A (en) | 2013-12-24 | 2013-12-24 | PCB containing stepped copper thickness patterns and manufacturing method thereof |
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| CN103731997A true CN103731997A (en) | 2014-04-16 |
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| CN201310723917.XA Pending CN103731997A (en) | 2013-12-24 | 2013-12-24 | PCB containing stepped copper thickness patterns and manufacturing method thereof |
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Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103987202A (en) * | 2014-05-20 | 2014-08-13 | 深圳市景旺电子股份有限公司 | PCB manufacturing method for controlling local bronze thickness and PCB |
| CN104470234A (en) * | 2014-11-28 | 2015-03-25 | 广东依顿电子科技股份有限公司 | Method for producing step copper-plated PCB |
| CN105228357A (en) * | 2015-09-24 | 2016-01-06 | 广州杰赛科技股份有限公司 | A kind of manufacture method of ladder wiring board |
| CN105472900A (en) * | 2014-09-05 | 2016-04-06 | 深南电路有限公司 | Processing method of circuit board |
| CN105578800A (en) * | 2014-10-08 | 2016-05-11 | 深南电路有限公司 | Method for manufacturing circuit board |
| WO2016082146A1 (en) * | 2014-11-27 | 2016-06-02 | 江门崇达电路技术有限公司 | Method for manufacturing stepped copper column in pcb |
| CN105744735A (en) * | 2016-04-26 | 2016-07-06 | 广东欧珀移动通信有限公司 | Electronic equipment, printed circuit board and preparation method of printed circuit board |
| CN106993377A (en) * | 2017-03-21 | 2017-07-28 | 昆山沪利微电有限公司 | A kind of printed circuit board (PCB) locally thickeies the thick preparation method of copper |
| CN110392488A (en) * | 2019-06-26 | 2019-10-29 | 深圳市景旺电子股份有限公司 | HF link board fabrication method |
| CN110996540A (en) * | 2019-12-31 | 2020-04-10 | 生益电子股份有限公司 | Manufacturing method of PCB |
| CN111954383A (en) * | 2020-09-10 | 2020-11-17 | 星河电路（福建）有限公司 | Manufacturing method of local convex copper circuit board |
| CN112654169A (en) * | 2020-11-09 | 2021-04-13 | 龙南骏亚柔性智能科技有限公司 | Manufacturing method of flexible circuit board with bending requirement |
| CN112739037A (en) * | 2020-11-07 | 2021-04-30 | 龙南骏亚柔性智能科技有限公司 | Manufacturing method of flexible circuit board with three copper thicknesses |
| CN114340231A (en) * | 2022-03-14 | 2022-04-12 | 四川英创力电子科技股份有限公司 | Manufacturing device and method for PCB with thick copper stepped copper guide pillar |
| CN115103522A (en) * | 2022-02-22 | 2022-09-23 | 深圳市八达通电路科技有限公司 | Composite copper thick substrate and manufacturing method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200915513A (en) * | 2007-09-19 | 2009-04-01 | Phoenix Prec Technology Corp | Packaging substrate structure and method for manufacturing the same |
| US20090289030A1 (en) * | 2008-05-22 | 2009-11-26 | Yukihiro Ueno | Method of fabricating printed wiring board |
| CN103338595A (en) * | 2013-07-09 | 2013-10-02 | 皆利士多层线路版(中山)有限公司 | Heavy-copper step circuit board and preparation method thereof |
-
2013
- 2013-12-24 CN CN201310723917.XA patent/CN103731997A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200915513A (en) * | 2007-09-19 | 2009-04-01 | Phoenix Prec Technology Corp | Packaging substrate structure and method for manufacturing the same |
| US20090289030A1 (en) * | 2008-05-22 | 2009-11-26 | Yukihiro Ueno | Method of fabricating printed wiring board |
| CN103338595A (en) * | 2013-07-09 | 2013-10-02 | 皆利士多层线路版(中山)有限公司 | Heavy-copper step circuit board and preparation method thereof |
Cited By (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103987202A (en) * | 2014-05-20 | 2014-08-13 | 深圳市景旺电子股份有限公司 | PCB manufacturing method for controlling local bronze thickness and PCB |
| CN105472900A (en) * | 2014-09-05 | 2016-04-06 | 深南电路有限公司 | Processing method of circuit board |
| CN105578800A (en) * | 2014-10-08 | 2016-05-11 | 深南电路有限公司 | Method for manufacturing circuit board |
| CN105578800B (en) * | 2014-10-08 | 2018-10-26 | 深南电路有限公司 | A kind of production method of circuit board |
| WO2016082146A1 (en) * | 2014-11-27 | 2016-06-02 | 江门崇达电路技术有限公司 | Method for manufacturing stepped copper column in pcb |
| CN105830542A (en) * | 2014-11-27 | 2016-08-03 | 江门崇达电路技术有限公司 | Method for manufacturing stepped copper column in PCB |
| CN105830542B (en) * | 2014-11-27 | 2018-07-06 | 江门崇达电路技术有限公司 | The production method of ladder copper post in a kind of PCB |
| CN104470234A (en) * | 2014-11-28 | 2015-03-25 | 广东依顿电子科技股份有限公司 | Method for producing step copper-plated PCB |
| CN105228357A (en) * | 2015-09-24 | 2016-01-06 | 广州杰赛科技股份有限公司 | A kind of manufacture method of ladder wiring board |
| CN105744735A (en) * | 2016-04-26 | 2016-07-06 | 广东欧珀移动通信有限公司 | Electronic equipment, printed circuit board and preparation method of printed circuit board |
| CN106993377A (en) * | 2017-03-21 | 2017-07-28 | 昆山沪利微电有限公司 | A kind of printed circuit board (PCB) locally thickeies the thick preparation method of copper |
| CN110392488A (en) * | 2019-06-26 | 2019-10-29 | 深圳市景旺电子股份有限公司 | HF link board fabrication method |
| CN110996540A (en) * | 2019-12-31 | 2020-04-10 | 生益电子股份有限公司 | Manufacturing method of PCB |
| CN111954383A (en) * | 2020-09-10 | 2020-11-17 | 星河电路（福建）有限公司 | Manufacturing method of local convex copper circuit board |
| CN112739037A (en) * | 2020-11-07 | 2021-04-30 | 龙南骏亚柔性智能科技有限公司 | Manufacturing method of flexible circuit board with three copper thicknesses |
| CN112739037B (en) * | 2020-11-07 | 2022-08-09 | 龙南骏亚柔性智能科技有限公司 | Manufacturing method of flexible circuit board with three copper thicknesses |
| CN112654169A (en) * | 2020-11-09 | 2021-04-13 | 龙南骏亚柔性智能科技有限公司 | Manufacturing method of flexible circuit board with bending requirement |
| CN115103522A (en) * | 2022-02-22 | 2022-09-23 | 深圳市八达通电路科技有限公司 | Composite copper thick substrate and manufacturing method thereof |
| CN114340231A (en) * | 2022-03-14 | 2022-04-12 | 四川英创力电子科技股份有限公司 | Manufacturing device and method for PCB with thick copper stepped copper guide pillar |
| CN114340231B (en) * | 2022-03-14 | 2022-05-13 | 四川英创力电子科技股份有限公司 | Manufacturing device and method for PCB with thick copper stepped copper guide pillar |
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Application publication date: 20140416 |
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