CN103491726A - Flexible circuit board manufacturing method - Google Patents
Flexible circuit board manufacturing method Download PDFInfo
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- CN103491726A CN103491726A CN201310317857.1A CN201310317857A CN103491726A CN 103491726 A CN103491726 A CN 103491726A CN 201310317857 A CN201310317857 A CN 201310317857A CN 103491726 A CN103491726 A CN 103491726A
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- copper
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Abstract
The invention relates to a flexible circuit board manufacturing method which comprises the following steps: drilling a communicating hole in a substrate, conducting copper flashing on the substrate drilled with the communicating hole, pasting a dry film on the substrate, conducting exposure, conducting developing, conducting graph electroplating on the substrate after developing, conducting dry film removal processing and etching. In the process of manufacturing a flexible circuit board through the method, the in-hole copper plating work process is carried out before dry film removal is carried out, therefore, copper can only be electroplated on the periphery of a hole ring and the hole wall of the communicating hole, the copper thickness of the substrate is not influenced, and the impedance influences caused by non-uniform etched circuit thickness are avoided. In the etching process, only the influences of the circuit width and the circuit distance on the impedance value are required to be controlled. Therefore, the production difficulty of an impedance board is reduced, the risks of the unstable impedance value are reduced, and meanwhile the yield of the flexible circuit board is conveniently improved.
Description
Technical field
The present invention relates to a kind of making process of circuit board, particularly relate to a kind of flexible circuitry board fabrication method.
Background technology
Flexible circuitry double sided board and multi-layer sheet are all generally that whole plate is electroplated electroplating the via link, the one, plate thick layer copper to the via on connection line two sides, and the 2nd, increase layer of copper to whole two-sided base material copper face thick, reach requirement specification copper thick.
In the electro-coppering process, because of electric current distribution inhomogeneous, same the thick degree of the different local copper of plate flexible circuit board has notable difference, this increases many parameters just to the control group impedance values, not only to consider the impact of impedance line live width, line-spacing when circuit etching, also to consider the impact of copper thickness on resistance value, cause the flexible circuit board fraction defective higher.
Summary of the invention
Based on this, be necessary to provide a kind of flexible circuitry board fabrication method that improves yield.
A kind of flexible circuitry board fabrication method, comprise the steps:
Bore via on base material;
The described base material that is drilled with described via is carried out to flash copper;
Paste dry film on described base material;
Exposure;
Develop;
Described base material after developing is carried out to graphic plating and moved back again dry film process;
Etching.
In one of them embodiment, in described development step, the described base material of the afterwards described via of development edge leaks outside.
In one of them embodiment, the hole wall copper facing 0.5um that described flash copper step is described the above via of base material.
By said method, manufacture in the flexible circuit board process, in hole, the copper facing operation was carried out before moving back dry film, make it only around the hole wall of via and orifice ring, be electroplate with copper thick, and it is thick not affect the copper of base material itself, avoids inhomogeneous the brought impedance influences of line thicknesses after etching.Etching process only need be controlled live width, line-spacing gets final product the impact of impedance value.So just reduce the impedance plate production difficulty, reduced the unsettled risk of resistance value, also just improved the yield of flexible circuit board simultaneously.
The accompanying drawing explanation
The flow chart of steps of the flexible circuitry board fabrication method that Fig. 1 is a preferred embodiment of the present invention;
Fig. 2 is the base material cross section structure schematic diagram after developing;
Fig. 3 be graphic plating and move back dry film after the cross section structure schematic diagram of base material.
Embodiment
As shown in Figure 1, the flow chart of steps of the flexible circuitry board fabrication method that it is a preferred embodiment of the present invention, comprise the steps:
Step S101 bores via on base material.
Step S102, carry out flash copper by the described base material that is drilled with described via.
In the present embodiment, 1～2 minute flash copper time, plate about 0.5um copper thick.Now less on the thick impact of whole plate substrate copper, the copper thickness of impact can be ignored.
Step S103 pastes dry film on described base material.
Step S104, exposure.
Step S105, develop, and the described base material of the afterwards described via of development edge leaks outside.
As shown in Figure 2, it,, for the base material 20 cross section structure schematic diagrames after developing, is coated with dry film 21 on two copper faces of base material 20, and the copper layer at via fringe region 23 places leaks outside.The copper layer at this place leaks outside and only need in step of exposure, select the corresponding film to get final product.
Step S106, carry out graphic plating to the described base material after developing and moved back dry film process again.
As shown in Figure 3, it is for graphic plating and the cross section structure schematic diagram of base material 20 after moving back dry film, now on the hole wall of the via of base material 20 and the copper layer region leaked outside electroplate and gone up layer of copper thick 24.
Step S107, etching.
By said method, manufacture in the flexible circuit board process, in hole, the copper facing operation was carried out before moving back dry film, make it only around the hole wall of via and orifice ring, be electroplate with copper thick, and it is thick not affect the copper of base material itself, avoids inhomogeneous the brought impedance influences of line thicknesses after etching.Etching process only need be controlled live width, line-spacing gets final product the impact of impedance value.So just reduce the impedance plate production difficulty, reduced the unsettled risk of resistance value, also just improved the yield of flexible circuit board simultaneously.
The above embodiment has only expressed several execution mode of the present invention, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection range of patent of the present invention should be as the criterion with claims.
Claims (3)
1. a flexible circuitry board fabrication method, is characterized in that, comprises the steps:
Bore via on base material;
The described base material that is drilled with described via is carried out to flash copper;
Paste dry film on described base material;
Exposure;
Develop;
Described base material after developing is carried out to graphic plating and moved back again dry film process;
Etching.
2. flexible circuitry board fabrication method according to claim 1, is characterized in that, in described development step, the described base material of the afterwards described via of development edge leaks outside.
3. flexible circuitry board fabrication method according to claim 1, is characterized in that, the hole wall copper facing 0.5um that described flash copper step is described the above via of base material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310317857.1A CN103491726A (en) | 2013-07-25 | 2013-07-25 | Flexible circuit board manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310317857.1A CN103491726A (en) | 2013-07-25 | 2013-07-25 | Flexible circuit board manufacturing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103491726A true CN103491726A (en) | 2014-01-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310317857.1A Pending CN103491726A (en) | 2013-07-25 | 2013-07-25 | Flexible circuit board manufacturing method |
Country Status (1)
| Country | Link |
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| CN (1) | CN103491726A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105430928A (en) * | 2015-12-29 | 2016-03-23 | 广东欧珀移动通信有限公司 | Electroplating method of flexible circuit board, flexible circuit board and mobile terminal |
| CN106817840A (en) * | 2017-02-08 | 2017-06-09 | 苏州维信电子有限公司 | A kind of FPC and its manufacture method without orifice ring |
| CN108243571A (en) * | 2016-12-23 | 2018-07-03 | 东莞新科技术研究开发有限公司 | The manufacturing method of flexible PCB |
| CN108697002A (en) * | 2018-04-24 | 2018-10-23 | 深圳市斯普莱特激光科技有限公司 | A kind of laser processing formula high-precision circuit board manufacture craft |
| CN110868803A (en) * | 2018-08-28 | 2020-03-06 | 深南电路股份有限公司 | Machining method and system of micro-hole back drill and printed circuit board |
| CN114137383A (en) * | 2022-02-08 | 2022-03-04 | 广东科翔电子科技股份有限公司 | High-precision Mini-LED board electric measurement method |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6495394B1 (en) * | 1999-02-16 | 2002-12-17 | Sumitomo Metal (Smi) Electronics Devices Inc. | Chip package and method for manufacturing the same |
| CN102647862A (en) * | 2012-04-25 | 2012-08-22 | 博敏电子股份有限公司 | Blind via filling plating method using different current parameter combinations |
-
2013
- 2013-07-25 CN CN201310317857.1A patent/CN103491726A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6495394B1 (en) * | 1999-02-16 | 2002-12-17 | Sumitomo Metal (Smi) Electronics Devices Inc. | Chip package and method for manufacturing the same |
| CN102647862A (en) * | 2012-04-25 | 2012-08-22 | 博敏电子股份有限公司 | Blind via filling plating method using different current parameter combinations |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105430928A (en) * | 2015-12-29 | 2016-03-23 | 广东欧珀移动通信有限公司 | Electroplating method of flexible circuit board, flexible circuit board and mobile terminal |
| CN108243571A (en) * | 2016-12-23 | 2018-07-03 | 东莞新科技术研究开发有限公司 | The manufacturing method of flexible PCB |
| CN106817840A (en) * | 2017-02-08 | 2017-06-09 | 苏州维信电子有限公司 | A kind of FPC and its manufacture method without orifice ring |
| CN108697002A (en) * | 2018-04-24 | 2018-10-23 | 深圳市斯普莱特激光科技有限公司 | A kind of laser processing formula high-precision circuit board manufacture craft |
| CN110868803A (en) * | 2018-08-28 | 2020-03-06 | 深南电路股份有限公司 | Machining method and system of micro-hole back drill and printed circuit board |
| CN114137383A (en) * | 2022-02-08 | 2022-03-04 | 广东科翔电子科技股份有限公司 | High-precision Mini-LED board electric measurement method |
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20140101 |
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| RJ01 | Rejection of invention patent application after publication |