CN108243571A - The manufacturing method of flexible PCB - Google Patents
The manufacturing method of flexible PCB Download PDFInfo
- Publication number
- CN108243571A CN108243571A CN201611208924.6A CN201611208924A CN108243571A CN 108243571 A CN108243571 A CN 108243571A CN 201611208924 A CN201611208924 A CN 201611208924A CN 108243571 A CN108243571 A CN 108243571A
- Authority
- CN
- China
- Prior art keywords
- copper
- clad plate
- photoresist
- manufacturing
- flexible pcb
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/052—Magnetographic patterning
Abstract
The manufacturing method of flexible PCB of the present invention, including：The resist coating in the presumptive area on the surface of copper-clad plate, the thickness of the photoresist are higher than the height of the via hole in copper-clad plate；The photoresist is exposed, development treatment；Region except the presumptive area of the copper-clad plate is etched to form line pattern；And the copper-clad plate is subjected to electroplating processes, make the inner wall of the via hole of the copper-clad plate and the surface covering layers of copper of the line pattern.The present invention can prevent photoresist come off and ensure in electroplating processes copper-clad plate two surfaces between connection conduction property well stablize and reduce resistance.
Description
Technical field
The present invention relates to field of semiconductor fabrication more particularly to a kind of flexible PCB (Flexure Printed
Circuit, FPC) manufacturing method.
Background technology
There is circuit on flexible PCB in semiconductor applications, two sides, in order to realize the connection between the conducting wire of different layers,
Often drill then copper facing on the inner walls of the via in the circuit board, could realize conducting wire intercommunication.Traditional method is only being led
Via holes inner wall surface plating layers of copper since pad is higher than hole, has difference in height without in line pattern overlying copper plate, from
And during making subsequent circuit etching, porose disc and circuit disconnect.So as to influence the quality of flexible PCB.
It would therefore be highly desirable to a kind of manufacturing method of improved flexible PCB is provided, to overcome disadvantages described above.
Invention content
The purpose of the present invention is to provide a kind of manufacturing methods of flexible PCB, can prevent photoresist in electroplating processes
In come off and ensure that the connection conduction property between two surfaces of copper-clad plate is well stablized and reduces resistance.
To achieve the above object, the manufacturing method of flexible PCB of the present invention, including：
The resist coating in the presumptive area on the surface of copper-clad plate, the thickness of the photoresist is higher than the conducting in copper-clad plate
The height in hole；
The photoresist is exposed, development treatment；
Region except the presumptive area of the copper-clad plate is etched to form line pattern；And
The copper-clad plate is subjected to electroplating processes, makes the inner wall of the via hole of the copper-clad plate and the line pattern
Surface covers layers of copper.
Compared with prior art, the thickness of the photoresist of the manufacturing method of flexible PCB of the invention is higher than in copper-clad plate
Via hole height, therefore in electroplating process, photoresist is not easy to fall off, in order to avoid cause subsequent poor plating consequence,
And in electroplating processes, the inner wall of the via hole of copper-clad plate and the surface of line pattern, the surface of via hole are all covered with
Layers of copper, by the inner wall of via hole and the thicker layers of copper of conducting hole surface, the connection between different layers body is stablized, and reduces
Resistance, so as to ensure good connection conduction property.
Preferably, the photoresist is exposed and development treatment before further include：Dry the photoresist, and
Mask plate is covered on the photoresist.
It is specifically included preferably, drying the photoetching Protection glue：It is 50 DEG C~120 DEG C to control drying temperature, drying time
It is 400 seconds~500 seconds.
It is specifically included preferably, carrying out development treatment to the photoetching Protection glue：Controlled at 10 DEG C~30 DEG C, development
Time is 30 seconds~50 seconds.
Preferably,：Copper-clad plate progress electroplating processes are included：Control electroplating current density is 2A/dm2~5A/
Dm2, electroplating time are 1.5 hours~2 hours.
Preferably, the thickness of the photoresist is 20 μm~50 μm.
Preferably, the etching solution used includes：One kind in hydrogen peroxide, ammonium persulfate, amino acid, phosphoric acid, ammonium phosphate
It is or a variety of.
Specific embodiment
The manufacturing method of the flexible PCB of the present invention is described further, but be not so limited with reference to embodiment
The present invention.
It is mainly included the following steps that in the manufacturing method of the flexible PCB of the present invention：Photoresist processing, is shown exposure-processed
Shadow processing, etching process and electroplating processes.The present invention can prevent photoresist from coming off and ensureing in electroplating processes copper-clad plate
Connection conduction property between two surfaces is well stablized and reduces resistance.
In one embodiment, resist coating in the presumptive area on surface that photoresist processing is included in copper-clad plate, light
The thickness of photoresist is higher than the height of the via hole in copper-clad plate.The via hole refers to the line on the different layers body by copper clad layers
The trepanning of road conducting, is welded, which is also known as pad in rear extended meeting on via hole.Since the thickness of photoresist is high
In the height of via hole, therefore, in subsequent electroplating processes, photoresist is not easy to fall off.
Preferably, the thickness of photoresist is 20 μm~50 μm.Preferably, the presumptive area is including final by following process
Effective metal cabling, the bridge formation lines being retained in copper-clad plate.Photoresist processing further includes：Control drying temperature for 50 DEG C~
120 DEG C, drying time is 400 seconds~500 seconds.Photoresist after drying is exposed processing.
The exposure-processed includes：Photoresist is covered with mask plate (MASK plates) and does graphics process, then using ultraviolet light
Exposure-processed.The coverage figure of mask plate includes effective metal cabling, bridge formation lines.KrF can be used in the source of ultraviolet light
(248nm), ArF (193nm), F2 (157nm) laser combination irradiation, so as to which material be made to change.Ultraviolet light covers copper
The ultraviolet photosensitive macromolecule membrane on surface makes it that polymerisation occur under the action of light, forms macromolecule, and structure more causes
It is close.It is attached on ultraviolet photosensitive macromolecule membrane with photographic film during exposure, photographic film black portions can be totally reflected ultraviolet light, right
Polymerisation will not be occurred by answering the ultraviolet photosensitive macromolecule membrane in region.
The development treatment includes：Copper-clad plate after overexposure is subjected to immersion development in developer solution.Specifically, this is aobvious
Shadow liquid is alkaline solution, such as sodium hydroxide solution, the temperature for controlling developer solution is 10 DEG C~30 DEG C, and development (immersion) time is
30 seconds~50 seconds.Preferably, after steeping, surface is rinsed with ionized water to remove developer solution, washing time is 100 seconds~120
Second.
The etching process includes：Region except the presumptive area of copper-clad plate is etched to form line pattern.It adopts
Etching solution includes：It is one or more in hydrogen peroxide, ammonium persulfate, amino acid, phosphoric acid, ammonium phosphate.Specifically, it is losing
In carving technology, the part for not being coated with photoetching Protection glue is etched.The acidic etching solution that etching work procedure uses for：Peroxidating
One or more mixed liquors in hydrogen, ammonium persulfate, amino acid, phosphoric acid, ammonium phosphate, the concentration used can be according to simple realities
It tests and is optimized, such as in a preferred embodiment, using hydrogen peroxide 15%, ammonium persulfate 15%, amino acid 20%, phosphorus
The mixed liquor of acid 5%, ammonium phosphate 30%, above-mentioned percentage are represented as concentration, deionized water 2000ml.Etching period is 10
~15 points.Copper-clad plate is contacted with etching solution, and the copper that surface is photo-etched glue protection will not react with etching solution, and not be photo-etched
Then with etching solution redox reaction occurs for the copper of glue protection.The copper ion aoxidized incorporates etching solution, is lost on copper-clad plate surface
Carve line pattern.
The electroplating processes include：By after overetch copper-clad plate carry out electroplating processes, make copper-clad plate via hole it is interior
The surface of wall and line pattern covers layers of copper.Plating conditions are：Control electroplating current density is 2A/dm2~5A/dm2, is electroplated
Time is 1.5 hours~2 hours.Specifically, by copper-clad plate and plating solution contacts, include at the position that does not have photoresist and need to weld
The surface of via hole and line pattern (surface of via hole), edges of boards connector.In this way, due to via hole inner wall, via hole
Surface and line pattern surface with plating solution contacts so as to fulfill plating, therefore, inner wall and conducting by via hole
The thicker layers of copper of hole surface, the connection between different layers body are stablized, and reduce resistance, so as to ensure good connection conducting
Performance.
Above disclosed is only presently preferred embodiments of the present invention, cannot limit the right of the present invention with this certainly
Range, therefore the equivalent variations made according to scope of the present invention patent, are still within the scope of the present invention.
Claims (7)
1. a kind of manufacturing method of flexible PCB, including：
The resist coating in the presumptive area on the surface of copper-clad plate, the thickness of the photoresist is higher than the via hole in copper-clad plate
Highly；
The photoresist is exposed, development treatment；
Region except the presumptive area of the copper-clad plate is etched to form line pattern；And
The copper-clad plate is subjected to electroplating processes, makes the inner wall of the via hole of the copper-clad plate and the surface of the line pattern
Cover layers of copper.
2. the manufacturing method of flexible PCB as described in claim 1, it is characterised in that：It is exposed to the photoresist
And it is further included before development treatment：The photoresist is dried, and mask plate is covered on the photoresist.
3. the manufacturing method of flexible PCB as claimed in claim 2, it is characterised in that：It is specific to dry the photoetching Protection glue
Including：It is 50 DEG C~120 DEG C to control drying temperature, and drying time is 400 seconds~500 seconds.
4. the manufacturing method of flexible PCB as described in claim 1, it is characterised in that：The photoetching Protection glue is shown
Shadow processing specifically includes：Controlled at 10 DEG C~30 DEG C, developing time is 30 seconds~50 seconds.
5. the manufacturing method of flexible PCB as described in claim 1, it is characterised in that：The copper-clad plate is carried out at plating
Reason includes：Control electroplating current density is 2A/dm2~5A/dm2, and electroplating time is 1.5 hours~2 hours.
6. the manufacturing method of flexible PCB as described in claim 1, it is characterised in that：The thickness of the photoresist is 20 μm
~50 μm.
7. the manufacturing method of flexible PCB as described in claim 1, it is characterised in that：The etching solution of use includes：Peroxide
Change one or more in hydrogen, ammonium persulfate, amino acid, phosphoric acid, ammonium phosphate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611208924.6A CN108243571A (en) | 2016-12-23 | 2016-12-23 | The manufacturing method of flexible PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611208924.6A CN108243571A (en) | 2016-12-23 | 2016-12-23 | The manufacturing method of flexible PCB |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108243571A true CN108243571A (en) | 2018-07-03 |
Family
ID=62704280
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611208924.6A Pending CN108243571A (en) | 2016-12-23 | 2016-12-23 | The manufacturing method of flexible PCB |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108243571A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111669894A (en) * | 2020-06-18 | 2020-09-15 | 江西沃格光电股份有限公司 | Microstrip circuit and manufacturing method thereof |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6195883B1 (en) * | 1998-03-25 | 2001-03-06 | International Business Machines Corporation | Full additive process with filled plated through holes |
| CN1319323A (en) * | 1998-09-18 | 2001-10-24 | 范蒂科股份公司 | Method for producing etched circuit |
| CN1494120A (en) * | 2002-10-28 | 2004-05-05 | 华泰电子股份有限公司 | Metal electroplating method of integrated circuit packaging substrate |
| CN101119614A (en) * | 2006-07-31 | 2008-02-06 | 比亚迪股份有限公司 | Pattern electroplating method for two-sided and multi-layer flexible printed circuit board |
| CN102316677A (en) * | 2010-06-30 | 2012-01-11 | 比亚迪股份有限公司 | Electroplating method for double-side and multilayer flexible printed circuit board |
| CN103311132A (en) * | 2013-05-20 | 2013-09-18 | 江苏长电科技股份有限公司 | Plating-then-etching technical method for multi-layer circuit substrate with metal frame |
| CN103491726A (en) * | 2013-07-25 | 2014-01-01 | 博罗县精汇电子科技有限公司 | Flexible circuit board manufacturing method |
-
2016
- 2016-12-23 CN CN201611208924.6A patent/CN108243571A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6195883B1 (en) * | 1998-03-25 | 2001-03-06 | International Business Machines Corporation | Full additive process with filled plated through holes |
| CN1319323A (en) * | 1998-09-18 | 2001-10-24 | 范蒂科股份公司 | Method for producing etched circuit |
| JP2002525880A (en) * | 1998-09-18 | 2002-08-13 | バンティコ アクチエンゲゼルシャフト | Manufacturing method of etched circuit |
| CN1494120A (en) * | 2002-10-28 | 2004-05-05 | 华泰电子股份有限公司 | Metal electroplating method of integrated circuit packaging substrate |
| CN101119614A (en) * | 2006-07-31 | 2008-02-06 | 比亚迪股份有限公司 | Pattern electroplating method for two-sided and multi-layer flexible printed circuit board |
| CN102316677A (en) * | 2010-06-30 | 2012-01-11 | 比亚迪股份有限公司 | Electroplating method for double-side and multilayer flexible printed circuit board |
| CN103311132A (en) * | 2013-05-20 | 2013-09-18 | 江苏长电科技股份有限公司 | Plating-then-etching technical method for multi-layer circuit substrate with metal frame |
| CN103491726A (en) * | 2013-07-25 | 2014-01-01 | 博罗县精汇电子科技有限公司 | Flexible circuit board manufacturing method |
Non-Patent Citations (1)
| Title |
|---|
| 樊慧庆: "《电子信息材料》", 30 September 2012 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111669894A (en) * | 2020-06-18 | 2020-09-15 | 江西沃格光电股份有限公司 | Microstrip circuit and manufacturing method thereof |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180703 |
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| RJ01 | Rejection of invention patent application after publication |