CN103311132A - Plating-then-etching technical method for multi-layer circuit substrate with metal frame - Google Patents
Plating-then-etching technical method for multi-layer circuit substrate with metal frame Download PDFInfo
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- CN103311132A CN103311132A CN2013101880485A CN201310188048A CN103311132A CN 103311132 A CN103311132 A CN 103311132A CN 2013101880485 A CN2013101880485 A CN 2013101880485A CN 201310188048 A CN201310188048 A CN 201310188048A CN 103311132 A CN103311132 A CN 103311132A
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Abstract
The invention relates to a plating-then-etching technical method for a multi-layer circuit substrate with a metal frame. The method comprises the following steps: taking a metal substrate; plating a copper foil on the surface of the metal substrate; gluing a photoresist film; removing part of the photoresist film from the back of the metal substrate; electroplating a first metal circuit layer; gluing a photoresist film; removing part of the photoresist film from the back of the metal substrate; electroplating a second metal circuit layer; removing the photoresist films; laminating a non-conductive rubber film; grinding the non-conductive rubber film; carrying out metalizing pretreatment on the non-conductive rubber film; electroplating a third metal circuit layer; gluing a photoresist film; removing part of the photoresist film from the back of the metal substrate; electroplating a fourth metal circuit layer; micro-etching; gluing a photoresist film; removing part of the photoresist film from the back of the metal substrate; electroplating a fifth metal circuit layer; removing the photoresist films; encapsulating by epoxy resin; grinding the surface of the epoxy resin; gluing a photoresist film; removing part of the photoresist film from the back of the metal substrate; etching; removing the photoresist film; and electroplating a metal layer.
Description
Technical field
The present invention relates to a kind of metal frame multilayer wiring board and plate first rear etching technique method.Belong to the semiconductor packaging field.
Background technology
The material of tradition multilayer wiring board adopts expensive organic board as main structure baseplate material, then presses glutinous → coating photoresistance agent → exposure at surperficial single face or the two-sided Copper Foil that carries out of organic substrate, develop, the Copper Foil of Copper Foil etching → divest photoresist → carry out again second layer circuit of windowing → etching (reserved line) → carry out is pressed glutinous → coating photoresistance agent → exposure, develop, Copper Foil boring → the metal material of photoresist → carry out second layer Copper Foil and ground floor of windowing → etching (reserved line) → divest is electroplated filling perforation → grindings → coating green lacquer → exposure of insulating, develop, window → plated with nickel gold or NiPdAu material.
The shortcoming of traditional handicraft method:
1.) adopt organic material substrate:
A.) cost of organic board is than the expensive price that goes out at least 2 ~ 3 times of sheet metal.
B.) organic board belongs to the corrosion resistant material of anti-strong acid-base, so can cause serious pollution to environment.
C.) organic board easily produces irregular warpage under the structure of multilayer line, so accomplish that ultra-thin (0.1mm) is controlled at low warpage size again is difficult, the pollution that has virtually increased again fraction defective, cost and scrapped the environment that produces.
2.) adopt boring to fill out coating technology:
A.) the machine drilling processing method is to adopt bull to hole simultaneously with present technology, but at most namely once bore at present 10 holes, demand in the every template of hole count of high-density base board at least all is to calculate with ten thousand quantity, and the efficient of machine drilling processing mode is low, yield is low, cost is high, equipment is many, the space reaches greatly the people and consumes many so adopt.
B.) drilling depth blind hole (not perforated) especially, getting precision with single head machine drilling processing method in the processing micron order degree of depth is suitable difficulty, in addition be the length of many drill bits of the more difficult control of drill bit of bull and the degree of depth of processing, not that degree of depth deficiency is exactly the control of holes difficult, as shown in figure 30.
C.) degree of depth of machine drilling depth accuracy occurs in the ultra-thin substrate handling ease of high density and differs, so when degree of depth deficiency occurs, will cause Copper Foil fully or not to expose, so that the metal material of follow-up its filling perforation will carry out the filling perforation of the metal material degree of depth time can't gross area and Copper Foil fluid-tight engagement, contact resistance even open circuit have virtually been increased, as shown in figure 30.
D.) laser drill processing mode (being commonly called as the thunder carving) just comes accurately than machine drilling processing mode on the precision of drilling depth, as long as especially the laser of carbon dioxide touches the material of copper, the usefulness of laser will be decomposed, and the halt of laser drill position is the material surface at copper, effect is to process much than machine drilling, but the ground boring of one hole, a hole, efficient is low, cost is high, equipment many (equipment cost is more expensive than machine drilling process equipment), space reach greatly the consumption manpower.
3.) press glutinous Copper Foil in the glutinous not too large problem of the first lamination, but after the ground floor Copper Foil has carried out the metallic circuit etching, the Copper Foil of ground floor will have that the region height of metallic circuit is higher not to have the height of metallic line regions lower, when will will be so that metal copper foil begins to have the phenomenon of wave injustice when pressing glutinous second layer metal Copper Foil, and the number of plies of metal copper foil wave is larger more at most, especially be easy to cause interior void on the substrate of high density and ultra-thin precision, the metallic circuit out-of-flatness, mechanical stress surely disorderly, poor reliability, as shown in figure 31.
Summary of the invention
The object of the invention is to overcome above-mentioned deficiency, provide a kind of metal frame multilayer wiring board to plate first rear etching technique method, substrate adopts metal material, technique is simple, the metallic circuit layer adopts the chemical plating metal material to lay foundation, need not use expensive organic substance substrate, significantly reduce cost of manufacture.
The object of the present invention is achieved like this: a kind of metal frame multilayer wiring board plates first rear etching technique method, and described method comprises the steps:
Step 1, get metal substrate
Step 2, metallic substrate surfaces copper facing paper tinsel
Step 3, the operation of subsides photoresistance film
Finish metal substrate front and the back side of copper facing paper tinsel in step 2 and stick respectively the photoresistance film that can carry out exposure imaging;
Part photoresistance film is removed at step 4, the metal substrate back side
Utilize exposure imaging equipment that step 3 is finished the metal substrate back side of pasting the operation of photoresistance film and carry out graph exposure, develop and remove part figure photoresistance film, carry out the regional graphics that the first metallic circuit layer is electroplated to expose the follow-up needs in the metal substrate back side;
Step 5, plating the first metallic circuit layer
In step 4, electroplate the first metallic circuit layer in the zone of metal substrate back side removal part photoresistance film;
Step 6, the operation of subsides photoresistance film
The photoresistance film that can carry out exposure imaging is sticked at the metal substrate back side of electroplating the first metallic circuit layer in step 5;
Part photoresistance film is removed at step 7, the metal substrate back side
Utilize exposure imaging equipment that step 6 is finished the metal substrate back side of pasting the operation of photoresistance film and carry out graph exposure, develop and remove part figure photoresistance film, carry out the regional graphics that the second metallic circuit layer is electroplated to expose the follow-up needs in the metal substrate back side;
Step 8, plating the second metallic circuit layer
In step 7, electroplate the second metallic circuit layer in order to connect the conductive posts of the first metallic circuit layer and the 3rd metallic circuit layer in the zone of metal substrate back side removal part photoresistance film;
Step 9, removal photoresistance film
Remove the photoresistance film of metallic substrate surfaces;
Step 10, the non-conductive glued membrane operation of pressing
At the non-conductive glued membrane of metal substrate back side pressing one deck;
Step 11, the non-conductive glued membrane of grinding surface
After finishing non-conductive glued membrane pressing, step 10 carries out surface grinding;
Step 12, the preliminary treatment of non-conductive glued membrane surface metalation
To the preliminary treatment of metallizing of non-conductive glued membrane surface;
Step 13, plating the 3rd metallic circuit layer
Finish the pretreated surface of metallization at non-conductive glued membrane and carry out the plating of the 3rd metallic circuit layer;
Step 14, the operation of subsides photoresistance film
Metal substrate front and back in step 13 sticks the photoresistance film that can carry out exposure imaging;
Part photoresistance film is removed at step 15, the metal substrate back side
Utilize exposure imaging equipment that step 14 is finished the metal substrate back side of pasting the operation of photoresistance film and carry out graph exposure, develop and remove part figure photoresistance film, the regional graphics of electroplating to expose the follow-up needs in the metal substrate back side;
Step 10 six, plating the 4th metallic circuit layer
The metal material zone that presents after step 15 is finished windowing of photoresistance film plates the 4th metallic circuit layer;
Step 10 seven, removal photoresistance film
Remove the photoresistance film of metallic substrate surfaces;
Step 10 eight, miniature etching
Utilize the microetch technology that the 3rd metallic circuit layer is carried out etching at the metal substrate back side of step 10 seven;
Step 10 nine, the operation of subsides photoresistance film
The photoresistance film that can carry out exposure imaging is sticked with the back side in metal substrate front in step 10 eight;
Part photoresistance film is removed at step 2 ten, the metal substrate back side
Utilize exposure imaging equipment that step 10 nine is finished the metal substrate back side of pasting the operation of photoresistance film and carry out graph exposure, develop and remove part figure photoresistance film, the regional graphics of electroplating to expose the follow-up needs in the metal substrate back side;
Step 2 11, plating five metals belong to line layer
The metal material zone that presents after step 2 ten is finished windowing of photoresistance film plates five metals and belongs to line layer;
Step 2 12, removal photoresistance film
Remove the photoresistance film of metallic substrate surfaces;
Step 2 13, epoxy resin transfer injection mo(u)lding
Carry out epoxy resin transfer injection mo(u)lding at the metal substrate back side of step 2 12;
Step 2 14, grinding epoxy resin surface
After finishing epoxy resin transfer injection mo(u)lding, step 2 13 carries out surface grinding;
Step 2 15, the operation of subsides photoresistance film
Metal substrate front and back after step 2 14 is finished grinding sticks the photoresistance film that can carry out exposure imaging;
Step 2 16, the positive part photoresistance film of removing of metal substrate
Utilize exposure imaging equipment that step 2 15 is finished the metal substrate front of pasting the operation of photoresistance film and carry out graph exposure, develop and remove part figure photoresistance film, carry out etched regional graphics to expose the positive follow-up needs of metal substrate;
Step 2 17, etching operation
The etching operation is carried out in zone after metal substrate front photoresistance film in completing steps 26 is windowed;
Step 2 18, removal photoresistance film
Remove the photoresistance film of metallic substrate surfaces;
Step 2 19, electroplated metal layer
After step 2 18 is finished divesting of photoresistance film, electroplated metal layer is carried out in all metal surfaces.
Step 10 eight is moved to enforcement the 3rd metallic circuit layer microetch operation between step 2 12 and the step 2 13.
Step 6 between described step 5 and step 10 nine can repeat repeatedly to step 10 eight, forms more metallic circuit layers.
Metallic circuit layer material copper in described step 5, step 8, step 13 and the step 2 ten, nickel gold, NiPdAu, silver or the metallics such as golden.
The plating mode that adopts in described step 2, step 5, step 8, step 13, step 10 six and the step 2 ten is chemical deposition or metallide.
Photoresistance film in described step 3, step 6, step 14, step 10 eight and the step 2 14 can be that dry type photoresistance film also can be wet type photoresistance film.
Non-conductive glued membrane in the described step 10 is pressing formula thermosetting epoxy resin.
The method of removing the photoresistance film in described step 9, step 2 11 and the step 2 17 is to adopt chemical medicinal liquid softening and utilize the mode of high pressure water washing to remove the photoresistance film.
The mode of electroplated metal layer can adopt the plating mode of regional area in the described step 2 18, and its material can be copper, nickel gold, NiPdAu, gold, silver, tin etc.
Described step 2 18 is planted ball to the metal surface after finishing the removal of photoresistance film.
The mode of the non-conductive glued membrane of pressing can adopt conventional roll unit in the described step 10, or carries out pressing under the environment of vacuum.
Described step 2 13 is carried out epoxy resin transfer injection mo(u)lding at the metal substrate back side, the epoxy resin transfer injection mo(u)lding that utilizes mould to have softened, its objective is all metallic circuit layers are carried out the plastic packaging protection, can select in the material of epoxy resin does not have filler or Packed kind, the processing of yet can dyeing according to the characteristic of product of the color of epoxide resin material;
Pressing mode in the described step 10 and the transfer injection mo(u)lding of step 2 13 can be replaced mutually, and dual mode is chosen one wantonly.
Compared with prior art, the present invention has following beneficial effect:
1.) its basic material of traditional board structure is to use expensive organic substance substrate, and board structure material of the present invention employed be lower-cost sheet metal.
2.) traditional substrate metal line layer is to adopt Copper Foil to press glutinous mode, easily in pressing glutinous process, form interior void, metallic circuit layer of the present invention then adopts the method for chemical plating metal material to lay foundation (can disposablely directly be plated to the thickness that needs if necessary, be that speed is slow and the compactness meeting is poor), carry out again the compactness of metallide increase metal level, in order to reduce resistance value and to reach fast the metal layer thickness that needs.
3.) traditional organic substance substrate has adopted boring and has filled out electroplating method with the way that is connected of metallic circuit layer at the metallic circuit layer, easily causes loose contact even open circuit.And the present invention takes Direct Electroplating in the middle of the metallic circuit layer of up and down and the method for the conductive posts of growing (all adopts the word representative of metallic circuit layer in the following step explanation, such as step 8 and shown in Figure 8), make the upper/lower layer metallic line layer and between conductive posts good combination is arranged.
4.) traditional organic substance substrate produces the metallic circuit layer of concavo-concave convexo-convex through etching in lower floor, and it is glutinous directly to carry out the pressure of Copper Foil at the metallic circuit layer of concavo-concave convexo-convex, the metallic circuit layer that so easily causes the upper strata also can concavo-concave convexo-convex out-of-flatness, and metallic circuit layer more at most planarization will be poorer.The present invention then is through grinding so that metal guide pillar and non-conductive glued membrane maintain (such as step 11 and shown in Figure 11) on the same plane on non-conductive glued membrane surface, carry out again electroless copper plating method and carry out the plated metal copper material, can on the basis of chemical copper, carry out again in case of necessity once electrolytic and electroplate to increase the compactness of metal ion (shown in step 12 ~ 13 and Figure 12 ~ 13), can on the basis of chemical copper, carry out again the compactness that once electrolytic electroplates to increase metal ion in case of necessity.
Description of drawings
Fig. 1 ~ Figure 29 is each operation schematic diagram that metal frame multilayer wiring board of the present invention plates first rear etching technique method.
The schematic diagram that machinery drilling depth precision differed when Figure 30 filled out coating technology in the past employing boring.
Figure 31 is the schematic diagram that in the past adopted metal copper foil wave injustice when pressing glutinous Copper Foil technology.
Embodiment
The present invention relates to a kind of metal frame multilayer wiring board and plate first rear etching technique method, described method comprises the steps:
Step 1, get metal substrate
Referring to Fig. 1, get the suitable metal substrate of a slice thickness, the purpose that this sheet material uses is just made with follow-up encapsulation as circuit and is supported the employed transitional material of line layer structure, the material of this sheet material mainly is take metal material as main, and the material of metal material can be the zinc-plated Cai ﹑ of Tong Cai ﹑ Tie Cai ﹑ Bu rust Gang Cai ﹑ aluminium etc.
Step 2, metallic substrate surfaces copper facing paper tinsel
Referring to Fig. 2, at metallic substrate surfaces plating one deck Copper Foil, mainly be to make when making for follow-up circuit line layer and the metal substrate can fluid-tight engagement, the mode of plating can adopt chemical deposition or metallide.
Step 3, the operation of subsides photoresistance film
Referring to Fig. 3, in the metal substrate front of finishing the copper facing paper tinsel and the back side stick respectively the photoresistance film that can carry out exposure imaging, to protect follow-up electroplated metal layer process operation, the photoresistance film can be that dry type photoresistance film also can be wet type photoresistance film.
Part photoresistance film is removed at step 4, the metal substrate back side
Referring to Fig. 4, utilize exposure imaging equipment that step 3 is finished the metal substrate back side of pasting the operation of photoresistance film and carry out graph exposure, develop and remove part figure photoresistance film, carry out the regional graphics that the first metallic circuit layer is electroplated to expose the follow-up needs in the metal substrate back side.
Step 5, plating the first metallic circuit layer
Referring to Fig. 5, in step 4, electroplate the first metallic circuit layer in the zone of metal substrate back side removal part photoresistance film, the material of metallic circuit layer can adopt copper, nickel gold, NiPdAu, silver, gold or tin metal, and plating mode can make chemical deposition or metallide mode.
Step 6, the operation of subsides photoresistance film
Referring to Fig. 6, the photoresistance film that can carry out exposure imaging is sticked at the metal substrate back side in step 5, and to protect the electroplating technology operation of the second follow-up metallic circuit layer, the photoresistance film can be that dry type photoresistance film also can be wet type photoresistance film.
Part photoresistance film is removed at step 7, the metal substrate back side
Referring to Fig. 7, utilize exposure imaging equipment that step 6 is finished the metal substrate back side of pasting the operation of photoresistance film and carry out graph exposure, develop and remove part figure photoresistance film, purpose is to need interconnected metallic region to expose on the first metallic circuit layer and the second metallic circuit layer, is beneficial to the electroplating activity of follow-up needs.
Step 8, plating the second metallic circuit layer
Referring to Fig. 8, in step 7, electroplate the conduct of the second metallic circuit layer in order to connect the conductive posts of the first metallic circuit layer and the 3rd metallic circuit layer in the zone of metal substrate back side removal part photoresistance film, the material of metallic circuit layer can adopt copper, nickel gold, NiPdAu, silver, gold or tin metal, and plating mode can make chemical deposition or metallide mode.
Step 9, removal photoresistance film
Referring to Fig. 9, remove the photoresistance film of metallic substrate surfaces, purpose is to carry out non-conductive glued membrane operation for follow-up, the method for removing the photoresistance film can adopt chemical medicinal liquid softening and adopt the mode of high pressure water washing to remove the photoresistance film.
Step 10, the non-conductive glued membrane operation of pressing
Referring to Figure 10, the non-conductive glued membrane of (zone that line layer is arranged) pressing one deck at the metal substrate back side, purpose is to insulate for the first metallic circuit layer and the 3rd metallic circuit layer, the mode of the non-conductive glued membrane of pressing can adopt conventional roll unit, or under the environment of vacuum, carry out pressing, to prevent that the pressing process from producing the residual of air, non-conductive glued membrane mainly is pressing formula thermosetting epoxy resin, and epoxy resin can adopt according to product performance and not have filler or Packed non-conductive glued membrane, and the color of epoxy resin can be according to the product performance processing of dyeing.
Step 11, the non-conductive glued membrane of grinding surface
Referring to Figure 11, behind completing steps ten, carry out non-conductive glued membrane surface grinding, purpose is to expose the second metallic circuit layer, keeps the evenness of non-conductive glued membrane and the second metallic circuit layer and the thickness of controlling non-conductive glued membrane.
Step 12, the preliminary treatment of non-conductive glued membrane surface metalation
Referring to Figure 12, to the preliminary treatment of metallizing of non-conductive glued membrane surface, make its surface attachment last layer metallization macromolecular material or surface roughening, purpose is the catalyst conversion that can plate as subsequent metal material, and the adhesion metal macromolecular material can adopt spraying, plasma concussion, surface coarsening etc. to go to dry again and get final product;
Step 13, plating the 3rd metallic circuit layer
Referring to Figure 13, finish the pretreated surface of metallization at non-conductive glued membrane and carry out the plating work of the 3rd metallic circuit layer, its objective is as follow-up and carry out the metal level that the metallic circuit layer is done, the material of the 3rd metallic circuit layer can be copper, nickel gold, NiPdAu, silver, gold or tin metal, and plating mode can be that chemical deposition adds metallide or all uses the chemical deposition mode to plate out the thickness of needs.
Step 14, the operation of subsides photoresistance film
Referring to Figure 14, stick the photoresistance film that can carry out exposure imaging at the metal substrate front and back of step 13, purpose is the making for follow-up metallic circuit layer, the photoresistance film can be that dry type photoresistance film also can be wet type photoresistance film.
Part photoresistance film is removed at step 15, the metal substrate back side
Referring to Figure 15, utilize exposure imaging equipment that step 14 is finished the metal substrate back side of pasting the operation of photoresistance film and carry out graph exposure, develop and remove part figure photoresistance film, the regional graphics of electroplating to expose the follow-up needs in the metal substrate back side.
Step 10 six, plating the 4th metallic circuit layer
Referring to Figure 16, the metal material zone that presents after step 15 is finished windowing of photoresistance film plates the 4th metallic circuit layer, the material of metallic circuit layer can be copper, nickel gold, NiPdAu, silver, gold or tin metal, and the method for plating circuit layer can be that metallide also can be chemical deposition.
Step 10 seven, removal photoresistance film
Referring to Figure 17, remove the photoresistance film of metallic substrate surfaces, purpose is to prepare for follow-up plastic packaging epoxy resin, the method for removing the photoresistance film can adopt chemical medicinal liquid mode softening and the employing high pressure water washing to remove the photoresistance film.
Step 10 eight, miniature etching
Referring to Figure 18, utilize the microetch technology that the 3rd metallic circuit layer is carried out etching at the metal substrate back side of step 10 seven, the 3rd metallic circuit layer region that corrosion and metallic circuit are irrelevant, etched mode can be used the processes such as iron chloride or copper chloride.
Step 10 nine, the operation of subsides photoresistance film
Referring to Figure 19, stick the photoresistance film that can carry out exposure imaging at the metal substrate back side of step 10 eight, purpose is the making for follow-up metallic circuit layer, the photoresistance film can be that dry type photoresistance film also can be wet type photoresistance film.
Part photoresistance film is removed at step 2 ten, the metal substrate back side
Referring to Figure 20, utilize exposure imaging equipment that step 10 eight is finished the metal substrate back side of pasting the operation of photoresistance film and carry out graph exposure, develop and remove part figure photoresistance film, the regional graphics of electroplating to expose the follow-up needs in the metal substrate back side.
Step 2 11, plating five metals belong to line layer
Referring to Figure 21, the metal material zone that presents after step 2 ten is finished windowing of photoresistance film plates five metals and belongs to line layer, the material of metallic circuit layer can be copper, nickel gold, NiPdAu, silver, gold or tin metal, and the method for plated metal line layer can be that metallide also can be chemical deposition.
Step 2 12, removal photoresistance film
Referring to Figure 22, remove the photoresistance film of metallic substrate surfaces, purpose is to prepare for follow-up plastic packaging epoxy resin, the method for removing the photoresistance film can adopt chemical medicinal liquid mode softening and the employing high pressure water washing to remove the photoresistance film.
Step 2 13, epoxy resin transfer injection mo(u)lding
Referring to Figure 23; carry out an epoxy resin transfer injection mo(u)lding job at the metal substrate back side of step 2 12; the epoxy resin transfer injection mo(u)lding that utilizes mould to have softened; its objective is and all metallic circuit layers will be carried out the plastic packaging protection; the material of epoxy resin can be selected does not have filler or Packed kind, and the color of epoxide resin material can be according to the product performance processing of dyeing.
Step 2 14, grinding epoxy resin surface
Referring to Figure 24, after finishing epoxy resin transfer injection mo(u)lding, step 2 13 carries out surface grinding, and purpose is to expose the 4th metallic circuit layer, the thickness of keeping the evenness of epoxy resin surface and the 4th metallic circuit layer and controlling total metallic circuit layer.
Step 2 15, the operation of subsides photoresistance film
Referring to Figure 25, after step 2 14 is finished grinding the metal substrate front and back stick the photoresistance film that can carry out exposure imaging, purpose is the etching for follow-up sheet metal, the photoresistance film can be that dry type photoresistance film also can be wet type photoresistance film.
Step 2 16, the positive part photoresistance film of removing of metal substrate
Referring to Figure 26, utilize exposure imaging equipment that step 2 15 is finished the metal substrate front of pasting the operation of photoresistance film and carry out graph exposure, develop and remove part figure photoresistance film, carry out etched regional graphics to expose the positive follow-up needs of metal substrate.
Step 2 17, etching operation
Referring to Figure 27, the etching operation is carried out in zone after metal substrate front photoresistance film in completing steps 26 is windowed, its objective is and utilize corrosion technology corroding metal sheet material to expose the first layer metal line layer of follow-up needs encapsulation usefulness, etching method can be copper chloride or the technology mode of iron chloride.
Step 2 18, removal photoresistance film
Referring to Figure 28, remove the photoresistance film of metallic substrate surfaces, purpose is to prepare for follow-up encapsulation, the method for removing the photoresistance film can adopt chemical medicinal liquid mode softening and the employing water under high pressure to remove the photoresistance film.
Step 2 19, electroplated metal layer
Referring to Figure 29; after the divesting of completing steps 28 photoresistance films; the mode that electroplated metal layer also can adopt the plating in localized metallic circuit zone is carried out in all metal surfaces; its objective is and will form needed medium for load and the wire bonds of follow-up encapsulation, the material of coating can Shi Yin ﹑ Tong ﹑ Jin ﹑ Nie Jin ﹑ NiPdAu, tin and metal protective film (OSP) etc.
Claims (13)
1. a metal frame multilayer wiring board plates first rear etching technique method, it is characterized in that described method comprises the steps:
Step 1, get metal substrate
Step 2, metallic substrate surfaces copper facing paper tinsel
Step 3, the operation of subsides photoresistance film
Finish metal substrate front and the back side of copper facing paper tinsel in step 2 and stick respectively the photoresistance film that can carry out exposure imaging;
Part photoresistance film is removed at step 4, the metal substrate back side
Utilize exposure imaging equipment that step 3 is finished the metal substrate back side of pasting the operation of photoresistance film and carry out graph exposure, develop and remove part figure photoresistance film, carry out the regional graphics that the first metallic circuit layer is electroplated to expose the follow-up needs in the metal substrate back side;
Step 5, plating the first metallic circuit layer
In step 4, electroplate the first metallic circuit layer in the zone of metal substrate back side removal part photoresistance film;
Step 6, the operation of subsides photoresistance film
The photoresistance film that can carry out exposure imaging is sticked at the metal substrate back side in step 5;
Part photoresistance film is removed at step 7, the metal substrate back side
Utilize exposure imaging equipment that step 6 is finished the metal substrate back side of pasting the operation of photoresistance film and carry out graph exposure, develop and remove part figure photoresistance film, carry out the regional graphics that the second metallic circuit layer is electroplated to expose the follow-up needs in the metal substrate back side;
Step 8, plating the second metallic circuit layer
In step 7, electroplate the second metallic circuit layer in order to connect the conductive posts of the first metallic circuit layer and the 3rd metallic circuit layer in the zone of metal substrate back side removal part photoresistance film;
Step 9, removal photoresistance film
Remove the photoresistance film of metallic substrate surfaces;
Step 10, the non-conductive glued membrane operation of pressing
At the non-conductive glued membrane of metal substrate back side pressing one deck;
Step 11, grind non-conductive glued membrane
After completing steps ten non-conductive glued membrane pressings, carry out the surface grinding surface;
Step 12, the preliminary treatment of non-conductive glued membrane surface metalation
To the preliminary treatment of metallizing of non-conductive glued membrane surface;
Step 13, plating the 3rd metallic circuit layer
Carry out the plating of the 3rd metallic circuit layer on the pretreated non-conductive glued membrane of metallization surface;
Step 14, the operation of subsides photoresistance film
Metal substrate front and back in step 13 sticks the photoresistance film that can carry out exposure imaging;
Part photoresistance film is removed at step 15, the metal substrate back side
Utilize exposure imaging equipment that step 14 is finished the metal substrate back side of pasting the operation of photoresistance film and carry out graph exposure, develop and remove part figure photoresistance film, the regional graphics of electroplating to expose the follow-up needs in the metal substrate back side;
Step 10 six, plating the 4th metallic circuit layer
The metal material zone that presents after step 15 is finished windowing of photoresistance film plates the 4th metallic circuit layer;
Step 10 seven, removal photoresistance film
Remove the photoresistance film of metallic substrate surfaces;
Step 10 eight, miniature etching
Utilize the microetch technology that the 3rd metallic circuit layer is carried out etching at the metal substrate back side of step 10 seven;
Step 10 nine, the operation of subsides photoresistance film
The photoresistance film that can carry out exposure imaging is sticked respectively at metal substrate front and the back side in step 10 eight;
Part photoresistance film is removed at step 2 ten, the metal substrate back side
Utilize exposure imaging equipment that step 10 nine is finished the metal substrate back side of pasting the operation of photoresistance film and carry out graph exposure, develop and remove part figure photoresistance film, the regional graphics of electroplating to expose the follow-up needs in the metal substrate back side;
Step 2 11, plating five metals belong to line layer
The metal material zone that presents after step 2 ten is finished windowing of photoresistance film plates five metals and belongs to line layer;
Step 2 12, removal photoresistance film
Remove the photoresistance film of metallic substrate surfaces;
Step 2 13, epoxy resin transfer injection mo(u)lding
Carry out epoxy resin transfer injection mo(u)lding work at the metal substrate back side of step 2 12;
Step 2 14, grinding epoxy resin surface
After finishing epoxy resin transfer injection mo(u)lding, step 2 13 carries out surface grinding;
Step 2 15, the operation of subsides photoresistance film
Metal substrate front and back in step 2 14 sticks the photoresistance film that can carry out exposure imaging;
Step 2 16, the positive part photoresistance film of removing of metal substrate
Utilize exposure imaging equipment that step 2 15 is finished the metal substrate front of pasting the operation of photoresistance film and carry out graph exposure, develop and remove part figure photoresistance film, carry out etched regional graphics to expose the positive follow-up needs of metal substrate;
Step 2 17, etching operation
Carry out the etching operation in the zone of finishing after the photoresistance film is windowed;
Step 2 18, removal photoresistance film
Remove the photoresistance film of metallic substrate surfaces;
Step 2 19, electroplated metal layer
After finishing the divesting of photoresistance film, electroplated metal layer is carried out in all metal surfaces.
2. a kind of metallic multilayer circuit base plate according to claim 1 plates first rear etching technique method, it is characterized in that step 10 eight is moved to enforcement between step 2 12 and the step 2 13.
3. a kind of metal frame multilayer wiring board according to claim 1 plates first rear etching technique method, it is characterized in that the step 6 ~ step 8 between described step 5 ~ step 9 can repeat repeatedly, forms more metallic circuit layers.
4. a kind of metal frame multilayer wiring board according to claim 1 and 2 plates first rear etching technique method, it is characterized in that metallic circuit layer material Wei Tong ﹑ Nie Jin ﹑ NiPdAu, silver, gold or tin metal in described step 5, step 8, step 13 and the step 2 ten.
5. a kind of metal frame multilayer wiring board according to claim 1 and 2 plates first rear etching technique method, it is characterized in that the plating mode that adopts in described step 2, step 5, step 8, step 13, step 10 six and the step 2 ten is chemical deposition or metallide.
6. a kind of metal frame multilayer wiring board according to claim 1 and 2 plates first rear etching technique method, it is characterized in that the photoresistance film in described step 3, step 6, step 14, step 10 eight and the step 2 14 can be that dry type photoresistance film also can be wet type photoresistance film.
7. a kind of metal frame multilayer wiring board according to claim 1 and 2 plates first rear etching technique method, it is characterized in that the non-conductive glued membrane in the described step 10 is pressing formula thermosetting epoxy resin.
8. a kind of metal frame multilayer wiring board according to claim 1 and 2 plates first rear etching technique method, and the method that it is characterized in that in described step 9, step 2 11 and the step 2 17 removing the photoresistance film is to adopt chemical medicinal liquid softening and utilize the mode of high pressure water washing to remove the photoresistance film.
9. a kind of metal frame multilayer wiring board according to claim 1 and 2 plates first rear etching technique method, and the mode that it is characterized in that electroplated metal layer in the described step 2 18 can adopt the plating mode of regional area.
10. a kind of metal frame multilayer wiring board according to claim 1 and 2 plates first rear etching technique method, it is characterized in that described step 2 18 plants ball to the metal surface after removing finishing the photoresistance film.
11. a kind of metal frame multilayer wiring board according to claim 1 and 2 plates first rear etching technique method, it is characterized in that the mode of the non-conductive glued membrane of pressing in the described step 10 can adopt conventional roll unit, or carry out pressing under the environment of vacuum.
12. a kind of metal frame multilayer wiring board according to claim 1 and 2 plates first rear etching technique method; it is characterized in that: described step 2 13 is carried out epoxy resin transfer injection mo(u)lding at the metal substrate back side; the epoxy resin transfer injection mo(u)lding that utilizes mould to have softened; its objective is all metallic circuit layers are carried out the plastic packaging protection; can select in the material of epoxy resin does not have filler or Packed kind, the processing of yet can dyeing according to the characteristic of product of the color of epoxide resin material.
13. a kind of metal frame multilayer wiring board according to claim 1 and 2 plates first rear etching technique method, it is characterized in that: the transfer injection mo(u)lding dual mode of the pressing mode in the described step 10 and step 2 13 is chosen one wantonly.
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Effective date of registration: 20160429 Address after: 214434 Jiangyin, Jiangsu, Chengjiang city street, Long Hill Road, No. 78 Patentee after: Jiangsu Changjiang Electronics Technology Co., Ltd. Address before: 214434 Jiangyin, Jiangsu Province, the development of mountain road, No. 78, No. Patentee before: Jiangsu Changjiang Electronics Technology Co., Ltd. |