CN110087407A - A kind of production technology of multilayer circuit board - Google Patents
A kind of production technology of multilayer circuit board Download PDFInfo
- Publication number
- CN110087407A CN110087407A CN201910358469.5A CN201910358469A CN110087407A CN 110087407 A CN110087407 A CN 110087407A CN 201910358469 A CN201910358469 A CN 201910358469A CN 110087407 A CN110087407 A CN 110087407A
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- Prior art keywords
- circuit board
- multilayer circuit
- hole
- copper
- layers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The present invention provides a kind of production technologies of multilayer circuit board, comprising the following steps: S1 material issuance, S2 internal layer, S3 one step press, S4 once drills, S5 is once electroplated, S6 filling holes with resin, S7 belt-sanding, S8 dry film, a S9 are once etched, S10 second pressing, S11 secondary drilling, S12 second time electroplating, bis- dry films of S13, S14 second etch, S15 is anti-welding, S16ization is golden, S17 fishing type.The production technology of multilayer circuit board provided by the invention is suitble to production multilayer circuit board, and step is simple, and high in machining efficiency, product quality is high.
Description
Technical field
The present invention relates to multilayer circuit board manufacture fields, and in particular to a kind of production technology of multilayer circuit board.
Background technique
Circuit board, also known as printed circuit board are the suppliers of electronic component electrical connection.Its development existing more than 100
The history in year, design are mainly layout design, and the major advantage using circuit board is to greatly reduce the difference of wiring and assembly
Mistake improves the gentle productive labor rate of Automated water.Printed circuit board according to the wiring board number of plies can be divided into single sided board, dual platen,
Four laminates, six laminates and other multilayer circuit boards.
For multilayer circuit board, traditional production method are as follows: sawing sheet, pressing, drilling, plating, dry film, etching, is prevented internal layer
Weldering, is cut fishing type.Abscissa is set as X, ordinate Y, the coefficient of standard specification is X=Y=100%, since circuit board passes through
Pressing is crossed, line layer can be shunk, and being contracted to coefficient is X=Y=99.98~99.99%, the route of wiring high for high-precision
Plate has seriously affected it and has been routed precision；In addition, soldermask layer can be generally coated through overetched circuit board surface, usually using tin
Layer, but in traditional process, in order to improve processing efficiency, surface printing paint is carried out at once after the etch is completed, for preventing
Weldering, since paint needs to carry out baking-curing process, buried via hole or blind buried via hole position it is cooling after paint film protrusion, there are a large amount of bubbles,
It is subsequent to use the easy broken and anti-welding failure in hole.
Summary of the invention
In view of the above problems, the present invention provides a kind of production technology of multilayer circuit board, high in machining efficiency, product quality
It is high.
To achieve the above object, the present invention solves by the following technical programs:
A kind of production technology of multilayer circuit board, comprising the following steps:
S1 material issuance: prepare top plate, lower plywood and two inner platings；
S2 internal layer: internal layer circuit production is carried out to two inner platings；
S3 one step press: two inner platings are pressed into inner layer circuit board；
S4 once drills: drilling to inner layer circuit board, forms first through hole；
S5 is once electroplated: inner layer circuit board being electroplated, internal layer circuit plate surface forms the first face layers of copper, first through hole surface
Form the first hole layers of copper；
S6 filling holes with resin: filling holes with resin is carried out to first through hole, forms buried via hole；
S7 belt-sanding: buried via hole both ends of the surface are ground with abrasive band；
Dry film of S8: the processing of dry film pad pasting is carried out to form inner line figure in the upper and lower end faces of inner layer circuit board；
S9 is once etched: the upper and lower end faces non-line section of inner layer circuit board is etched away；
S10 second pressing: top plate, inner layer circuit board, lower plywood are pressed into multilayer circuit board；
S11 secondary drilling: drilling to multilayer circuit board, forms blind buried via hole and blind hole；
S12 second time electroplating: being electroplated multilayer circuit board, and multilayer circuit plate surface forms the second face layers of copper, blind buried via hole and blind
Hole surface is respectively formed the second hole layers of copper, third hole layers of copper；
Bis- dry films of S13: the processing of dry film pad pasting is carried out to form outer-layer circuit figure in the upper and lower end faces of multilayer circuit board；
S14 second etch: the upper and lower end faces non-line section of multilayer circuit board is etched away；
S15 is anti-welding: printing one layer of uniform anti-solder ink layer in the outer-layer circuit of multilayer circuit board upper and lower end faces, prevents from welding
Short circuit caused by when connecing；
S16ization gold: one layer of nickel layer, layer gold are formed in bond pad surface by chemical deposition；
S17 fishing type: go out shape according to the structure gong of finished product, cut, complete the production.
Specifically, the step S5 be once electroplated in the first face layers of copper with a thickness of 1.7mil, the thickness of the first hole layers of copper
For 0.85mil.
Specifically, egative film coefficient used in dry film of the step S8 are as follows: X=100.05%, Y=100.07%.
Specifically, in the step S12 second time electroplating the second face layers of copper with a thickness of 1.5mil, the second hole layers of copper, third
Hole layers of copper with a thickness of 0.56mil.
Specifically, roasting procedure has also been carried out before the step S15 is anti-welding, by the multilayer Jing Guo step S14 second etch
Circuit board is placed in baking oven, toasts 30min at 60~80 DEG C.
The beneficial effects of the present invention are:
First, the production technology of multilayer circuit board provided by the invention is suitble to production multilayer circuit board, and step is simple, processing effect
Rate is high, and product quality is high；
Second, during a dry film, egative film coefficient is arranged are as follows: X=100.05%, Y=100.07%, comparison with standard specification
The transverse and longitudinal coordinate of egative film all slightly increases, so that the transverse and longitudinal coordinate after internal layer circuit is shunk after one step press, second pressing
Specification is closer to 100%；
Third increases roasting procedure before anti-welding, is preheated before solder-mask printing ink, so that buried via hole or blind buried via hole position
Temperature is consistent with the fixed temperature of subsequent anti-solder ink baking, and buried via hole or the anti-solder ink layer of blind buried via hole position after cooling down is avoided to deposit
In bubble, to avoid hole broken and destroy the structure of anti-solder ink layer.
Specific embodiment
In order to further appreciate that feature of the invention, technological means and specific purposes achieved, function, tie below
Closing specific embodiment, the present invention is described in further detail.
Embodiment 1
A kind of production technology of multilayer circuit board, comprising the following steps:
S1 material issuance: prepare top plate, lower plywood and two inner platings；
S2 internal layer: internal layer circuit production is carried out to two inner platings；
S3 one step press: two inner platings are pressed into inner layer circuit board；
S4 once drills: drilling to inner layer circuit board, forms first through hole；
S5 is once electroplated: inner layer circuit board being electroplated, internal layer circuit plate surface forms the first face layers of copper, first through hole surface
Form the first hole layers of copper；
S6 filling holes with resin: filling holes with resin is carried out to first through hole, forms buried via hole；
S7 belt-sanding: buried via hole both ends of the surface are ground with abrasive band；
Dry film of S8: the processing of dry film pad pasting is carried out to form inner line figure in the upper and lower end faces of inner layer circuit board；
S9 is once etched: the upper and lower end faces non-line section of inner layer circuit board is etched away；
S10 second pressing: top plate, inner layer circuit board, lower plywood are pressed into multilayer circuit board；
S11 secondary drilling: drilling to multilayer circuit board, forms blind buried via hole and blind hole；
S12 second time electroplating: being electroplated multilayer circuit board, and multilayer circuit plate surface forms the second face layers of copper, blind buried via hole and blind
Hole surface is respectively formed the second hole layers of copper, third hole layers of copper；
Bis- dry films of S13: the processing of dry film pad pasting is carried out to form outer-layer circuit figure in the upper and lower end faces of multilayer circuit board；
S14 second etch: the upper and lower end faces non-line section of multilayer circuit board is etched away；
S15 is anti-welding: printing one layer of uniform anti-solder ink layer in the outer-layer circuit of multilayer circuit board upper and lower end faces, prevents from welding
Short circuit caused by when connecing；
S16ization gold: one layer of nickel layer, layer gold are formed in bond pad surface by chemical deposition；
S17 fishing type: go out shape according to the structure gong of finished product, cut, complete the production.
Preferably, step S5 be once electroplated in the first face layers of copper with a thickness of 1.7mil, the first hole layers of copper with a thickness of
0.85mil。
Preferably, egative film coefficient used in dry film of step S8 are as follows: X=100.05%, Y=100.07% are compared
The transverse and longitudinal coordinate of standard specification egative film all slightly increases, so that after internal layer circuit is shunk after one step press, second pressing
Transverse and longitudinal coordinate specification is closer to 100%.
Preferably, in step S12 second time electroplating the second face layers of copper with a thickness of 1.5mil, the second hole layers of copper, third hole copper
Layer with a thickness of 0.56mil.
Preferably, roasting procedure has also been carried out before step S15 is anti-welding, by the multilayer circuit Jing Guo step S14 second etch
Plate is placed in baking oven, toasts 30min at 60~80 DEG C, and roasting procedure is increased before anti-welding, is carried out before solder-mask printing ink
Preheating is buried after avoiding cooling so that the temperature of buried via hole or blind buried via hole position is consistent with the fixed temperature of subsequent anti-solder ink baking
There are bubbles for the anti-solder ink layer of hole or blind buried via hole position, to avoid hole broken and destroy the structure of anti-solder ink layer.
Above embodiments only express a kind of embodiment of the invention, and the description thereof is more specific and detailed, but can not be because
This and be interpreted as limitations on the scope of the patent of the present invention.It should be pointed out that for those of ordinary skill in the art,
Under the premise of not departing from present inventive concept, various modifications and improvements can be made, and these are all within the scope of protection of the present invention.
Therefore, the scope of protection of the patent of the invention shall be subject to the appended claims.
Claims (5)
1. a kind of production technology of multilayer circuit board, which comprises the following steps:
S1 material issuance: prepare top plate, lower plywood and two inner platings；
S2 internal layer: internal layer circuit production is carried out to two inner platings；
S3 one step press: two inner platings are pressed into inner layer circuit board；
S4 once drills: drilling to inner layer circuit board, forms first through hole；
S5 is once electroplated: inner layer circuit board being electroplated, internal layer circuit plate surface forms the first face layers of copper, first through hole surface
Form the first hole layers of copper；
S6 filling holes with resin: filling holes with resin is carried out to first through hole, forms buried via hole；
S7 belt-sanding: buried via hole both ends of the surface are ground with abrasive band；
Dry film of S8: the processing of dry film pad pasting is carried out to form inner line figure in the upper and lower end faces of inner layer circuit board；
S9 is once etched: the upper and lower end faces non-line section of inner layer circuit board is etched away；
S10 second pressing: top plate, inner layer circuit board, lower plywood are pressed into multilayer circuit board；
S11 secondary drilling: drilling to multilayer circuit board, forms blind buried via hole and blind hole；
S12 second time electroplating: being electroplated multilayer circuit board, and multilayer circuit plate surface forms the second face layers of copper, blind buried via hole and blind
Hole surface is respectively formed the second hole layers of copper, third hole layers of copper；
Bis- dry films of S13: the processing of dry film pad pasting is carried out to form outer-layer circuit figure in the upper and lower end faces of multilayer circuit board；
S14 second etch: the upper and lower end faces non-line section of multilayer circuit board is etched away；
S15 is anti-welding: printing one layer of uniform anti-solder ink layer in the outer-layer circuit of multilayer circuit board upper and lower end faces, prevents from welding
Short circuit caused by when connecing；
S16ization gold: one layer of nickel layer, layer gold are formed in bond pad surface by chemical deposition；
S17 fishing type: go out shape according to the structure gong of finished product, cut, complete the production.
2. a kind of production technology of multilayer circuit board according to claim 1, which is characterized in that the step S5 is once electric
In plating the first face layers of copper with a thickness of 1.7mil, the first hole layers of copper with a thickness of 0.85mil.
3. a kind of production technology of multilayer circuit board according to claim 1, which is characterized in that the step S8 is once done
Egative film coefficient used in film are as follows: X=100.05%, Y=100.07%.
4. a kind of production technology of multilayer circuit board according to claim 1, which is characterized in that the step S12 bis- times
In plating the second face layers of copper with a thickness of 1.5mil, the second hole layers of copper, third hole layers of copper with a thickness of 0.56mil.
5. a kind of production technology of multilayer circuit board according to claim 1, which is characterized in that the step S15 is anti-welding
It is preceding also to have carried out roasting procedure, the multilayer circuit board Jing Guo step S14 second etch is placed in baking oven, is dried at 60~80 DEG C
Roasting 30min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910358469.5A CN110087407A (en) | 2019-04-30 | 2019-04-30 | A kind of production technology of multilayer circuit board |
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|---|---|---|---|
| CN201910358469.5A CN110087407A (en) | 2019-04-30 | 2019-04-30 | A kind of production technology of multilayer circuit board |
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| CN110087407A true CN110087407A (en) | 2019-08-02 |
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| CN201910358469.5A Pending CN110087407A (en) | 2019-04-30 | 2019-04-30 | A kind of production technology of multilayer circuit board |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110719694A (en) * | 2019-09-17 | 2020-01-21 | 沪士电子股份有限公司 | Chemical nickel gold surface treatment method for polyphenylene ether-containing printed circuit board |
| CN110798995B (en) * | 2020-01-03 | 2020-07-07 | 惠州市大亚湾科翔科技电路板有限公司 | Preparation method of high-reliability photovoltaic inverter printed circuit board |
| CN111770633A (en) * | 2020-05-22 | 2020-10-13 | 东莞联桥电子有限公司 | Circuit board processing method for preventing growth of copper nodules in hole |
| CN113966102A (en) * | 2021-09-22 | 2022-01-21 | 胜宏科技（惠州）股份有限公司 | Manufacturing method of stepped gold finger circuit board |
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| DE102005063272A1 (en) * | 2005-12-30 | 2007-07-05 | Robert Bosch Gmbh | Flexible circuit board used in integrated electronic components, switches and display elements comprises a flexible substrate, a re-wiring unit arranged on the substrate and an electrically insulating protective layer |
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| CN102159040A (en) * | 2011-03-28 | 2011-08-17 | 冠锋电子科技(梅州)有限公司 | Method for drilling hole on four-layered circuit board |
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| CN105916302A (en) * | 2016-05-09 | 2016-08-31 | 东莞美维电路有限公司 | PCB manufacturing method capable of preventing green oil hole plugging |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110719694A (en) * | 2019-09-17 | 2020-01-21 | 沪士电子股份有限公司 | Chemical nickel gold surface treatment method for polyphenylene ether-containing printed circuit board |
| CN110798995B (en) * | 2020-01-03 | 2020-07-07 | 惠州市大亚湾科翔科技电路板有限公司 | Preparation method of high-reliability photovoltaic inverter printed circuit board |
| CN111770633A (en) * | 2020-05-22 | 2020-10-13 | 东莞联桥电子有限公司 | Circuit board processing method for preventing growth of copper nodules in hole |
| CN113966102A (en) * | 2021-09-22 | 2022-01-21 | 胜宏科技（惠州）股份有限公司 | Manufacturing method of stepped gold finger circuit board |
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Application publication date: 20190802 |