CN110798995B - Preparation method of high-reliability photovoltaic inverter printed circuit board - Google Patents
Preparation method of high-reliability photovoltaic inverter printed circuit board Download PDFInfo
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- CN110798995B CN110798995B CN202010003570.1A CN202010003570A CN110798995B CN 110798995 B CN110798995 B CN 110798995B CN 202010003570 A CN202010003570 A CN 202010003570A CN 110798995 B CN110798995 B CN 110798995B
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- layer
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- depth control
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
Abstract
The invention provides a method for preparing a high-reliability photovoltaic inverter printed circuit board, in particular to a method for preparing a multilayer board, which comprises the steps of respectively processing and preparing an L1-L7 layer and an L8-L14 layer, and then carrying out L1-L14 layer lamination treatment, wherein in the process, a differential hole copper manufacturing process, a high multilayer lamination manufacturing process and a depth-controlled drilling depth control process are further designed for processing, controlling and manufacturing, the problems of various defects in the existing multilayer lamination circuit board manufacturing are solved, the manufacturing cost of the circuit board is greatly reduced, and the quality and the manufacturing efficiency of the high-thickness multilayer circuit board are improved.
Description
Technical Field
The invention relates to a manufacturing process of a copper plate, in particular to a method for manufacturing a high-reliability photovoltaic inverter printed circuit board.
Background
A photovoltaic inverter is a power conditioning device composed of semiconductor devices, mainly used for converting dc power into ac power, and generally composed of a boost circuit and an inverter bridge circuit. The boosting circuit boosts the direct-current voltage of the solar battery to the direct-current voltage required by the output control of the inverter; the inverter bridge circuit equivalently converts the boosted direct-current voltage into alternating-current voltage with common frequency.
The photovoltaic inverter Printed Circuit Board (PCB) is used as an important part of the photovoltaic inverter and plays an important role in current transmission, the heat productivity of the PCB is very large in the long-term use process, the current transmission stability is ensured, the signal control is accurate, the surface copper and the hole copper of the PCB are required to be thick, and therefore the resistance heat productivity is small under the condition of long-term electrification. Meanwhile, the photovoltaic inverter is high in layer number and thick in plate thickness, and the thick copper hole can prevent the copper hole from being pulled and cracked by the expanded plate under the condition of long-term electrification. In the existing manufacturing process, the problems of uneven gumming, through hole short circuit, plate surface dent and plate explosion in the lamination process of multilayer plates are often faced, and the problem of hole copper difference control of the multilayer plates in lamination all brings serious problems to the manufacturing of the circuit board.
Therefore, on the basis of the existing printed circuit board manufacturing process, improvement and promotion are urgently needed to solve the various problems, and a printed circuit board manufacturing method for solving the technical difficult problems in the manufacturing and processing procedures of the multilayer PCB is needed to be provided.
Disclosure of Invention
The invention provides a method for preparing a high-reliability photovoltaic inverter printed circuit board, aiming at solving the problems of various defects caused by high layer number and thick plate thickness of the existing photovoltaic inverter.
The technical scheme of the invention is as follows.
A preparation method of a high-reliability photovoltaic inverter printed circuit board comprises the following production procedures: cutting and baking the board, wet film and etching the inner layer, and performing lamination treatment after AOI of the inner layer.
Wherein, cutting, selecting copper foil, P sheet and core plate, and cutting according to the required size.
The plate is solidified by the baking plate, so that the deformation in the processing process is reduced.
The method for preparing the photovoltaic inverter printed circuit board further comprises the following steps,
respectively carrying out pressing on the L1-L7 layer and the L8-L14 layer, then routing board edges, baking the board, carrying out primary drilling, carrying out primary copper plate electroplating, carrying out resin hole plugging, then polishing and leveling, carrying out acid etching and film stripping after an outer layer dry film is formed, and finally carrying out outer layer AOI;
and (4) milling the edges of the pressed boards to remove sundries on the edges of the boards, and preventing the board drying dents.
And carrying out lamination treatment on the L1-L14 layers, wherein the lamination treatment comprises a differential hole copper manufacturing process, a high multi-layer lamination manufacturing process and a depth control drilling depth control process.
Typically, the same printed circuit board includes 0.2mm, 0.25mm, 0.3mm, and the board has a thickness of 1.6mm, and typically has an aspect ratio of at most 8:1 and at least 5: 1. When the aspect ratio is 8:1, the electroplating deep plating capacity is 60 percent; the electroplating deep plating capacity is 90% when the aspect ratio is 5:1, and the problem of overlarge hole copper difference is easily caused when the copper is manufactured by the same parameter, so the problem is solved by adopting the method for manufacturing the different hole copper.
The manufacturing process of the copper with the different holes specifically comprises the following steps: the first drilling, the first copper plate plating, the second drilling and the second copper plate plating.
Further, the diameter of the first drilling hole is 0.2mm-0.25mm, then the electroplating parameter is set to be 8ASF 30min, electroplating is carried out, and the flash plating copper thickness is 6 microns.
And the diameter of the second drilling is more than 0.3mm, electroplating is carried out by adopting an electroplating parameter of 10ASF for 60min, and the difference of copper in the large holes and the small holes is controlled to be reduced to be less than or equal to 5 mu m.
Removing burrs of the hole opening of the multi-surface laminate after drilling, cleaning the board surface, and chemically depositing copper on the board to enable the board to generate electric conduction.
The high-multilayer lamination manufacturing process comprises the following steps: the L1 layer is covered by a full dry film, and the circuit is not etched; an auxiliary dummy layer L7 'layer and an L8' layer are respectively arranged, all lines between the auxiliary dummy layer L7 'layer and the L8' layer are completely etched, and two pieces of 106PP are used for laminating between the L7 'layer and the L8'.
Wherein the auxiliary dummy layer L7' is 1oz copper thick.
Preferably, the depth control drilling depth control process includes: the depth control ring is added on the drill cutter, when the drill cutter drills to a specified depth, the depth control ring is pressed on the plate surface to prevent the drill cutter from further penetrating, wherein the depth of the drill cutter is set to be 0.075mm more than the depth of the drill cutter.
The depth control ring is a trapezoidal depth control ring and is made of PVC plastics, the diameter of the lower hole ring is 5mm, the diameter of the upper hole ring is 3mm, and the height of the upper hole ring is 4.5 mm.
As another preferred embodiment, the laminating process for the L1-L14 layer according to the present invention further includes:
after lamination, routing, baking, drilling counter bores, performing first copper plate deposition in a differential hole copper manufacturing process, plugging holes with resin, polishing and leveling, performing outer dry film, electrolytic copper tin, routing half slot holes, stripping and outer etching in sequence after the differential hole copper manufacturing process is executed, removing palladium, stripping tin, outer AOI, baking and resistance welding, post-baking, gold melting, flying probe testing, routing shape, and finally performing final inspection, packaging and shipment.
The method for preparing the high-reliability photovoltaic inverter printed circuit board mainly comprises the step of laminating L1-L14 layers by adopting a differential hole copper manufacturing flow, a high-multilayer laminating manufacturing flow and a depth control drilling depth control process. The invention adopts a method of false layer pressing to ensure the plate thickness, solves the problem that the middle gap is too large, greatly enlarges the glue flowing space compared with the common layer, and further solves the phenomenon of uneven glue flowing in the pressing process. The invention further controls the PP glue flowing uniformity when the L1-7 and the L8-L14 are laminated by the fact that the lines are integrally designed into a uniform net shape under the condition that the through holes are not influenced by the L7 'and the L8'. The invention has the advantages that the depth control drilling depth control is carried out by designing the depth control ring, the drilling depth is ensured, the trapezoidal depth control ring is further adopted, the plate surface is prevented from being crushed, the crushing damage to the plate surface during the depth control drilling is reduced in a large area, and the effect of protecting a drill point is achieved.
Drawings
FIG. 1 is a schematic diagram of a lamination structure of L1-L7 in an embodiment.
FIG. 2 is a schematic diagram of an embodiment of a process using a trapezoidal depth control ring.
Detailed Description
The invention is further illustrated with reference to the following figures and examples.
In order to make the technical solutions of the present invention better understood, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The invention provides a preparation method of a high-reliability photovoltaic inverter printed circuit board, and particularly relates to the process comprising the following steps.
Cutting and baking the board, wet film and etching the inner layer, and performing lamination treatment after AOI of the inner layer.
Cutting, selecting copper foil, P sheet and core plate, and cutting according to the required size.
The plate can be solidified through the baking plate, and the deformation in the processing process is reduced.
Etching the inner layer wet film, using developing solution to shadow the required etching pattern, etching the pattern, and finally removing the un-etched film. Optionally, the specific process includes: developing, washing, acid etching, membrane removal after washing, and finally washing again for drying.
The method for preparing the photovoltaic inverter printed circuit board further comprises the following steps,
respectively carrying out edge milling, plate baking, primary drilling and primary copper plate plating after laminating on the L1-L7 layers (shown in figure 1) and the L8-L14 layers, then carrying out resin hole plugging, then polishing and leveling, carrying out acid etching and film stripping after an outer layer dry film is formed, and finally carrying out outer layer AOI;
and (4) milling the edges of the pressed boards to remove sundries on the edges of the boards, and preventing the board drying dents.
Preferably, the etching process is to use a stripping solution to remove the dry film of the non-circuit, etch the bare copper layer except the printed circuit, if the etching plate is used, remove the anti-corrosion zinc plating layer, and then go through AOI, or manually inspect the plate.
The etching process equipment optionally comprises a bulking cylinder, a film removing machine, an etching machine and a zinc removing machine, wherein the bulking cylinder and the film removing machine are mainly used for removing a dry film of a non-circuit by using a film removing liquid, the etching machine is used for etching a bare copper layer except the printed circuit, and finally, the corrosion-resistant zinc coating is removed by the zinc removing machine.
And carrying out lamination treatment on the L1-L14 layers, wherein the lamination treatment comprises a differential hole copper manufacturing process, a high multi-layer lamination manufacturing process and a depth control drilling depth control process.
In the prior art, the same printed circuit board generally comprises 0.2mm, 0.25mm and 0.3mm, and the thickness of the board is 1.6mm, and the aspect ratio is usually 8:1 at maximum and 5:1 at minimum. When the aspect ratio is 8:1, the electroplating deep plating capacity is 60 percent; the electroplating deep plating capacity is 90% when the aspect ratio is 5:1, and the problem of overlarge hole copper difference is easily caused when the copper is manufactured by the same parameter, so the problem is solved by adopting the method for manufacturing the different hole copper.
The manufacturing process of the copper with the different holes specifically comprises the following steps: the first drilling, the first copper plate plating, the second drilling and the second copper plate plating.
Wherein, the copper deposition process further optionally comprises: the deburring is carried out firstly, so as to be beneficial to the production of the post-processing procedure, and then the copper is deposited and thickened.
And removing glue from the drilled and deburred multilayer board by copper deposition, and then performing chemical copper deposition to enable the board to generate electric conduction so as to facilitate the subsequent production process.
And (3) thickening copper, namely carrying out whole-board electroplating on the multilayer circuit board with the plated through hole to ensure that the thickness of copper on the board surface and the hole wall reaches a certain thickness, thereby meeting the corresponding quality requirement.
Further, the diameter of the first drilling hole is 0.2mm-0.25mm, then the electroplating parameter is set to be 8ASF 30min, electroplating is carried out, and the flash plating copper thickness is 6 microns.
And the diameter of the second drilling is more than 0.3mm, electroplating is carried out by adopting an electroplating parameter of 10ASF for 60min, and the difference of copper in the large holes and the small holes is controlled to be reduced to be less than or equal to 5 mu m.
The high-multilayer lamination manufacturing process comprises the following steps: the L1 layer is covered by a full dry film, and the circuit is not etched; an auxiliary dummy layer L7 'layer and an L8' layer are respectively arranged, all lines between the auxiliary dummy layer L7 'layer and the L8' layer are completely etched, and two pieces of 106PP are used for laminating between the L7 'layer and the L8'.
The full dry film is covered with an optional photosensitive alkaline development type dry film, and a negative phase plating resist or positive phase resist protection pattern is formed by exposure and development to perform plating or etching, thereby completing pattern transfer.
Preferably, the outer dry film covering process comprises: and (3) carrying out a film pasting process after the pumice powder pretreatment, further comprising the steps of preparing a black film, carrying out diazo sheet exposure and diazo sheet development after checking that the quality requirements are met, and finally carrying out counterpoint exposure and development.
The pattern electroplating is to protect the part without need of copper electroplating with dry film after image transfer, and the exposed part needing copper electroplating is plated with copper to a sufficient thickness as required, and then is plated with tin as a corrosion-resistant protective layer.
Wherein the auxiliary dummy layer L7' is 1oz copper thick.
Preferably, the depth control drilling depth control process (as shown in fig. 2) comprises: the depth control ring is added on the drill cutter, when the drill cutter drills to a specified depth, the depth control ring is pressed on the plate surface to prevent the drill cutter from further penetrating, wherein the depth of the drill cutter is set to be 0.075mm more than the depth of the drill cutter.
The depth control ring is a trapezoidal depth control ring and is made of PVC plastics, the diameter of the lower hole ring is 5mm, the diameter of the upper hole ring is 3mm, and the height of the upper hole ring is 4.5 mm.
As another preferred embodiment, the laminating process for the L1-L14 layer according to the present invention further includes:
after lamination, routing, baking, drilling counter bores, performing first copper plate deposition in a differential hole copper manufacturing process, plugging holes with resin, polishing and leveling, performing outer dry film, electrolytic copper tin, routing half slot holes, stripping and outer etching in sequence after the differential hole copper manufacturing process is executed, removing palladium, stripping tin, outer AOI, baking and resistance welding, post-baking, gold melting, flying probe testing, routing shape, and finally performing final inspection, packaging and shipment.
The shape of the routing machine is to cut the prepared and formed circuit board into specific shapes by milling.
Adopt the coating of solder resist on printed circuit board need not welded circuit and base plate, produce the bridging short circuit between the circuit when preventing to weld to reduce non-welding area and go up soldering tin consumption, simultaneously, provide permanent electrical environment and anti chemical protection layer, prevent that the face from weing and external damage. Alternatively, the solder resist may be a liquid or wet film, but is not limited thereto.
In conclusion, the method for preparing the photovoltaic inverter printed circuit board with high reliability provided by the invention specifically comprises the steps of adopting differential hole copper control in the pressing process, and respectively controlling the manufacturing quality from a hole copper differential precision level, a high multilayer pressing level and a drilling precision level by adopting a high multilayer pressing manufacturing process and a depth-controlled drilling depth control, in addition, the invention also respectively improves from the processing processes of an L1-L7 layer and an L8-L14 layer, and improves and promotes the L1-L14 layer pressing manufacturing process on the basis of the existing manufacturing process, so that the manufacturing cost and the manufacturing efficiency are greatly improved, various defects of the existing manufacturing of a high-high multilayer pressing problem, a depth-controlled mechanical blind hole process problem, a high aspect ratio electroplating problem, a high copper thick circuit problem and the like are particularly solved, and the high reliability of the preparation of the photovoltaic inverter printed circuit board is generally improved, high-quality and low-cost manufacture of the circuit board is realized.
While the invention has been described in conjunction with the specific embodiments set forth above, it is evident that many alternatives, modifications, and variations will be apparent to those skilled in the art in light of the foregoing description. Accordingly, it is intended to embrace all such alternatives, modifications, and variations that fall within the spirit and scope of the appended claims.
Claims (5)
1. A preparation method of a high-reliability photovoltaic inverter printed circuit board sequentially executes the following production procedures: cutting and baking the board, wet film etching the inner layer, performing the lamination treatment after AOI of the inner layer, and is characterized by also comprising,
respectively carrying out pressing on the L1-L7 layer and the L8-L14 layer, then routing board edges, baking the board, carrying out primary drilling, carrying out primary copper plate electroplating, carrying out resin hole plugging, then polishing and leveling, carrying out acid etching and film stripping after an outer layer dry film is formed, and finally carrying out outer layer AOI;
carrying out lamination treatment on the L1-L14 layer, wherein the lamination treatment comprises a differential hole copper manufacturing process, a high multi-layer lamination manufacturing process and a depth control drilling depth control process, and the method comprises the following steps:
the manufacturing process of the copper with the different holes comprises the following steps: the method comprises the following steps: drilling for the first time, plating copper plate for the first time, drilling for the second time and plating copper plate for the second time;
the high-multilayer pressing manufacturing process comprises the following steps: the layer comprising L1 is covered by a full dry film, and the circuit is not etched; respectively arranging an auxiliary dummy layer L7 'layer and an L8' layer, completely etching lines between the auxiliary dummy layer L7 'layer and the L8' layer, and laminating two pieces of 106PP between the L7 'layer and the L8';
the depth control drilling depth control process comprises the following steps: the method comprises the steps that a depth control ring is added on a drill cutter, when the drill cutter drills to a specified depth, the depth control ring is pressed on a plate surface to prevent the drill cutter from continuously penetrating, wherein the depth of the drill cutter is set to be 0.075mm more than the depth of the drill cutter; the depth control ring is a trapezoidal depth control ring and is made of PVC plastics, the diameter of the lower hole ring is 5mm, the diameter of the upper hole ring is 3mm, the height of the upper hole ring is 4.5mm, and when the drill cutter works, the friction force between the drill cutter and the depth control ring is increased, so that tripping is prevented;
further comprising:
after lamination, routing, baking, drilling copper holes, performing first copper plate deposition in a differential hole copper manufacturing process, plugging holes with resin, polishing and leveling, performing outer dry film, electrolytic copper tin, routing half slotted holes, stripping and outer etching in sequence after the differential hole copper manufacturing process is executed, removing palladium, stripping tin, outer AOI, baking and resistance welding, post-baking, gold melting, flying probe testing, routing shape, and finally performing final inspection, packaging and shipment.
2. The method of claim 1, wherein the first drilling is 0.2mm to 0.25mm in diameter, and the first drilling is followed by two times of desmearing and copper deposition, setting the electroplating parameters to 8ASF 30min, and electroplating, wherein the flash-plated copper thickness is 6 μm.
3. The method of claim 1, wherein the second hole is 0.3mm to 0.5mm in diameter, and the plating is performed with a plating parameter of 10ASF 60min, wherein the difference between the hole copper of the second hole and the hole copper of the first hole is controlled to be reduced to not more than 5 μm.
4. The method of claim 1, wherein the auxiliary dummy layer L7' is 1oz copper thick.
5. The method of claim 1, wherein the drill is a helical structure.
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