CN111642075A - Manufacturing method of single-sided resistor circuit board and manufacturing method of multilayer PCB - Google Patents
Manufacturing method of single-sided resistor circuit board and manufacturing method of multilayer PCB Download PDFInfo
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- CN111642075A CN111642075A CN202010629569.XA CN202010629569A CN111642075A CN 111642075 A CN111642075 A CN 111642075A CN 202010629569 A CN202010629569 A CN 202010629569A CN 111642075 A CN111642075 A CN 111642075A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
- H05K3/4617—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination characterized by laminating only or mainly similar single-sided circuit boards
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- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The invention relates to a manufacturing method of a single-sided resistance circuit board and a manufacturing method of a multilayer PCB. The manufacturing method of the single-sided resistor circuit board comprises the following steps: providing a resistance substrate, wherein the resistance substrate comprises a first copper foil, a resistance film, a dielectric layer and a second copper foil which are sequentially stacked; cleaning two opposite surfaces of the resistor substrate and respectively attaching dry films; carrying out acid etching after the first exposure and development to manufacture a first circuit pattern overlapped with each other on the first copper foil and the resistive film, completely reserving the second copper foil, and removing a dry film to obtain a semi-finished plate; cleaning two surfaces of the semi-finished plate and respectively sticking dry films; and carrying out alkaline etching after the second exposure and development to manufacture a second circuit pattern on the first circuit pattern of the first copper foil, completely reserving the first circuit pattern of the resistance film, completely reserving the second copper foil, and removing the dry film to obtain the single-sided resistance circuit board. The manufacturing difficulty of the resistance circuit board can be reduced, and the production efficiency is improved.
Description
Technical Field
The invention relates to the technical field of integrated circuit boards, in particular to a manufacturing method of a single-sided resistance circuit board and a manufacturing method of a multilayer PCB.
Background
A Printed Circuit Board (PCB) is a provider of electrical connection of electronic components, and is one of important parts in the electronic industry. Along with the continuous improvement of the integration degree, the number of layers of the PCB board is more and more. When a multilayer PCB is manufactured, an inner layer circuit is generally manufactured on a single copper-clad substrate, then a plurality of substrates are laminated, and a final product is obtained through a series of processes such as drilling, copper deposition electroplating, outer layer circuit manufacturing, tin deposition, routing forming and the like.
For multilayer PCB boards with special structures, resistors are usually required to be manufactured on inner-layer circuits of the multilayer PCB boards, and two sections of circuits are connected through the resistors so as to meet the corresponding resistance value requirements. When the multilayer PCB is manufactured, a single-sided electrical group circuit board is manufactured by using a resistance substrate, and a multilayer structure is formed by a laminating process. However, the resistance of the resistor film is poor, and the traditional process only adopts acid etching to hardly manufacture a single-sided resistor circuit board meeting the requirements, so that the single-sided resistor circuit board is difficult to manufacture and has low production efficiency.
Disclosure of Invention
Accordingly, it is necessary to provide a method for manufacturing a single-sided resistive circuit board and a method for manufacturing a multilayer PCB, which are directed to the problems of difficulty in manufacturing a single-sided resistive circuit board and low production efficiency.
A manufacturing method of a single-sided resistor circuit board comprises the following steps:
providing a resistance substrate, wherein the resistance substrate comprises a first copper foil, a resistance film, a dielectric layer and a second copper foil which are sequentially stacked;
cleaning two opposite surfaces of the resistor substrate and respectively attaching dry films;
carrying out acid etching after first exposure and development to manufacture a first circuit pattern overlapped with each other on the first copper foil and the resistive film, completely reserving the second copper foil, and removing a dry film to obtain a semi-finished plate;
cleaning two surfaces of the semi-finished plate and respectively sticking dry films;
and carrying out alkaline etching after the second exposure and development to manufacture a second circuit pattern on the first circuit pattern of the first copper foil, completely reserving the first circuit pattern of the resistance film, completely reserving the second copper foil, and removing the dry film to obtain the single-sided resistance circuit board.
The manufacturing method of the single-sided resistance circuit board fully utilizes the alkali-proof and acid-proof characteristics of the resistance film, the first line pattern is etched on the first copper foil and the resistance film simultaneously through acid etching after the first exposure and development, the second line pattern is etched on the first copper foil through alkali etching after the second exposure and development, and the first line pattern of the resistance film can be completely reserved, so that the single-sided resistance circuit board meeting the requirements can be easily manufactured. The manufacturing method of the single-sided resistance circuit board can effectively reduce the manufacturing difficulty of the single-sided resistance circuit board and improve the production efficiency.
In one embodiment, before the step of attaching the dry films to the two opposite surfaces of the resistor substrate, the method further includes the following steps:
and carrying out corner cutting treatment on the resistance substrate.
In one embodiment, the specific steps of performing acid etching after the first exposure and development include:
exposing partial areas of the dry film covered on the surface of the first copper foil through an exposure machine, and comprehensively exposing the dry film covered on the surface of the second copper foil;
removing the unexposed region of the dry film by a developing solution;
and etching by using an acidic solution, washing away the areas of the first copper foil and the resistance film which are not covered by the dry film, reserving the areas of the first copper foil and the resistance film which are covered by the dry film to form a first circuit pattern, and completely reserving the second copper foil which is covered by the dry film after full exposure.
In one embodiment, the specific conditions for removing the unexposed region of the dry film by the developing solution are as follows:
the developing temperature is 30-40 ℃, the conveying speed of the resistance substrate is 5-6 m/min, and the upper pressure of the developing solution sprayed on the upper plate surface of the resistance substrate is 1.8Kg/cm2～2Kg/cm2The lower pressure of the developing solution sprayed on the lower plate surface of the resistor substrate is 1.3Kg/cm2～1.5Kg/cm2。
In one embodiment, in the step of performing acid etching after the first exposure and development, a mixed solution of hydrochloric acid and sodium hypochlorite is used for performing acid etching.
In one embodiment, in the step of performing alkaline etching after the second exposure and development, the alkaline etching is performed by using an ammonium chloride solution.
In one embodiment, the specific steps of performing the alkaline etching after the second exposure and the development include:
taking a rivet hole of the resistance substrate as a positioning point;
exposing through an exposure machine, exposing a corresponding graph on the dry film covered on the surface of the first copper foil according to negative film information, and comprehensively exposing the dry film covered on the surface of the second copper foil;
removing the unexposed region of the dry film by a developing solution;
and etching by using an alkaline solution, washing away the area of the first circuit pattern of the first copper foil, which is not covered by the dry film, retaining the area of the first circuit pattern of the first copper foil, which is covered by the dry film, to form the second circuit pattern, and completely retaining the second copper foil, which is covered by the dry film subjected to the full exposure.
In one embodiment, the acid wash is turned off during the dry film removal after the alkaline etch is completed.
In one embodiment, after obtaining the single-sided resistive circuit board, the method further comprises the following steps:
and detecting the resistance value of the single-sided resistor circuit board.
The application also provides a manufacturing method of the multilayer PCB, which comprises the following steps:
manufacturing two single-sided resistance circuit boards, wherein the single-sided resistance circuit boards are obtained by adopting the manufacturing method of the single-sided resistance circuit boards;
laminating, namely laminating the single-sided resistance circuit board, the prepreg and the single-sided resistance circuit board in sequence and laminating to obtain a multilayer board, wherein the second copper foil of each single-sided resistance circuit board is used as the outermost layer;
drilling, namely drilling the multilayer board;
hole trimming, namely processing the multilayer board by a hole trimming agent;
depositing copper, namely depositing a layer of copper on the holes and the plate surface of the multilayer plate by a chemical method;
the board is electrically connected, and the full-board electroplating is carried out on the multilayer board;
manufacturing an outer layer circuit;
depositing tin, namely depositing a layer of tin on the plate surface and the holes of the multilayer plate;
and (4) routing, namely, performing forming cutting on the multilayer board to obtain the multilayer PCB with the preset shape and size.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this application, illustrate embodiments of the invention and, together with the description, serve to explain the invention and not to limit the invention.
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a flowchart of a method for manufacturing a single-sided resistor circuit board according to an embodiment of the invention.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.
In the description of the present invention, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
In one embodiment of the present application, a method for manufacturing a single-sided resistor circuit board includes the following steps:
s1, providing a resistance substrate, wherein the resistance substrate comprises a first copper foil, a resistance film, a dielectric layer and a second copper foil which are sequentially stacked;
s2, cleaning the two opposite surfaces of the resistance substrate and respectively attaching dry films;
s3, carrying out acid etching after first exposure and development to manufacture a first circuit pattern overlapped with each other on the first copper foil and the resistive film, completely reserving the second copper foil, and removing a dry film to obtain a semi-finished board;
s4, cleaning two surfaces of the semi-finished board and respectively attaching dry films;
and S5, carrying out alkaline etching after secondary exposure and development to manufacture a second circuit pattern on the first circuit pattern of the first copper foil, completely reserving the first circuit pattern of the resistance film, completely reserving the second copper foil, and removing a dry film to obtain the single-sided resistance circuit board.
Specifically, the resistor substrate with a preset size can be cut according to actual requirements. For example, an 18 x 12inch resistive substrate is cut, wherein the resistive substrate comprises a first copper foil of 18um, a resistive film of 0.2um, a dielectric layer of 1.0mm, and a second copper foil of 18 um. After the surface of the resistor substrate is cleaned, a dry film is attached, for example, 40um dry films may be attached to the surfaces of the first copper foil and the second copper foil, respectively. The dry film is a photosensitive film made of photosensitive material, the exposed area of the dry film is crosslinked and cured to protect the copper foil covered by the dry film, and the unexposed area of the dry film can be washed away by developer to expose the copper foil at the bottom of the dry film. And performing acid etching after development, wherein the resistance film is not acid-resistant, so that after the first copper foil on the surface is pickled, the exposed resistance film is also pickled, and the areas of the first copper foil and the resistance film which are still covered by the dry film are remained after development, thereby forming a first circuit pattern. The dry film covering the surface of the second copper foil is fully exposed in the first exposure process, so that the second copper foil can be effectively protected, the second copper foil can be completely reserved, and then the dry film is removed, so that a semi-finished plate can be obtained.
And then, carrying out secondary film pressing after cleaning the surface of the semi-finished plate, namely respectively sticking dry films on two opposite surfaces of the semi-finished plate. And then carrying out secondary exposure through an exposure machine, and washing the unexposed area of the dry film through a developing solution to expose the first copper foil at the bottom of the dry film. And then, the exposed first copper foil is washed away by alkaline etching, and the resistance film is not affected in the alkaline etching process because the resistance film is alkali-resistant and acid-resistant, so that the resistance film at the bottom of the washed-away area of the first copper foil can be completely reserved, and a required resistance circuit is obtained. And the dry film covering the surface of the second copper foil is fully exposed in the second exposure process, so that the second copper foil can be effectively protected, the second copper foil can be completely reserved, and then the dry film is removed, so that the single-sided resistance circuit board can be obtained.
The manufacturing method of the single-sided resistance circuit board fully utilizes the alkali-proof and acid-proof characteristics of the resistance film, the first line pattern is etched on the first copper foil and the resistance film simultaneously through acid etching after the first exposure and development, the second line pattern is etched on the first copper foil through alkali etching after the second exposure and development, and the first line pattern of the resistance film can be completely reserved, so that the single-sided resistance circuit board meeting the requirements can be easily manufactured. The manufacturing method of the single-sided resistance circuit board can effectively reduce the manufacturing difficulty of the single-sided resistance circuit board and improve the production efficiency.
In addition, for the resistor substrate, it is difficult to directly distinguish the first copper foil covered on the surface of the resistor film from the second copper foil covered on the surface of the dielectric layer from the appearance, in order to ensure the accuracy of the subsequent exposure. Further, in this embodiment, before the step of attaching the dry films to the two opposite surfaces of the resistor substrate, the method further includes the following steps: and carrying out corner cutting treatment on the resistance substrate.
For example, after cutting, a resistor substrate with a preset size is obtained, the resistor substrate can be transversely placed, a corner is cut at the upper right corner of the resistor substrate, and the upper layer is the first copper foil covered with the resistor film. Therefore, the first copper foil and the second copper foil can be rapidly and accurately distinguished in the subsequent process.
Further, in step S3, the specific step of performing acid etching after the first exposure and development includes:
s31, exposing partial areas of the dry film covered on the surface of the first copper foil through an exposure machine, and comprehensively exposing the dry film covered on the surface of the second copper foil; the LDI exposure machine can be used for exposure, direct imaging can be achieved through the LDI exposure machine, and exposure precision is higher.
S32, removing the unexposed area of the dry film through a developing solution; specifically, after exposure is completed, the resistor substrate is placed into a developing device, and is conveyed forwards through the developing device, and in the conveying process, the developing device can spray developing liquid on the upper surface and the lower surface of the resistor substrate, so that the unexposed areas of the dry film are washed away.
And S33, etching by an acid solution, washing away the areas of the first copper foil and the resistance film which are not covered by the dry film, reserving the areas of the first copper foil and the resistance film which are covered by the dry film to form a first circuit pattern, and reserving the second copper foil completely which is covered by the dry film after full exposure.
Further, the specific conditions for removing the unexposed region of the dry film by the developing solution are as follows:
the developing temperature is 30-40 ℃, the conveying speed of the resistance substrate is 5-6 m/min, and the upper pressure of the developing solution sprayed on the upper plate surface of the resistance substrate is 1.8Kg/cm2～2Kg/cm2The lower pressure of the developing solution sprayed on the lower plate surface of the resistor substrate is 1.3Kg/cm2～1.5Kg/cm2. For example, the developing temperature can be set at 30.6 ℃ + -1 DEG, the conveying speed of the resistance substrate is 5m/min, and the pressure of the developing solution sprayed on the upper plate surface of the resistance substrate is 2Kg/cm2The pressure of the developing solution sprayed on the lower plate surface of the resistance substrate is 1.5Kg/cm2. In the developing process, the upper pressure of the developing solution sprayed on the resistance substrate is set to be slightly greater than the lower pressure, so that the unexposed dry film on the upper plate surface of the resistance substrate can be washed clean. And unexposed dry films on the lower plate surface of the resistor substrate can fall down by self gravity in the process of washing.
Alternatively, in step S3, acid etching may be performed using a mixed solution of hydrochloric acid and sodium hypochlorite. Alternatively, in the step S5, the alkali etching may be performed by using an ammonium chloride solution.
Further, in step S5, the step of performing alkaline etching after the second exposure and development includes:
s51, using the rivet hole of the resistance substrate as a positioning point;
s52, exposing through an exposure machine, exposing the dry film covered on the surface of the first copper foil to form a corresponding pattern according to negative film data, and comprehensively exposing the dry film covered on the surface of the second copper foil;
s53, removing the unexposed area of the dry film through a developing solution;
and S54, etching by using an alkaline solution, washing away the area of the first circuit pattern of the first copper foil which is not covered by the dry film, reserving the area of the first circuit pattern of the first copper foil which is covered by the dry film to form the second circuit pattern, and completely reserving the second copper foil which is covered by the dry film after full exposure.
Specifically, the rivet hole on the resistance substrate is used as a positioning point, so that the accuracy of an exposure position is guaranteed, and the exposure precision is guaranteed. And (3) carrying out exposure by adopting an LDI exposure machine, wherein the exposure filling mode is selected from a negative film mode and an outer plate mode. When data are made in engineering, the data are not manufactured according to a conventional positive film electro-copper-tin mode, the positions, rivet holes and layer frames of the inner layer to be etched are exposed, alkaline etching is carried out after all plate edges are covered and developed, copper on the circuit is etched away, a resistance film is left, the film is removed, and a dry film is removed, so that a complete resistance circuit is obtained.
Further, in the above step S5, the acid washing is turned off in the process of removing the dry film after the completion of the alkaline etching. Generally, weak acid solution is used for washing when the film is removed, and the resistive film is not acid-resistant, so that the acid washing is required to be turned off in the dry film removing process to ensure that the resistive film is not corroded.
On the basis of the above embodiment, after obtaining the single-sided resistive circuit board, the method further includes the following steps:
and S6, detecting the resistance value of the single-sided resistor circuit board. The resistance value can be measured through a universal meter, so that the single-sided resistance circuit board with the resistance value meeting the requirement can be obtained.
In an embodiment of the present application, the method for manufacturing a multilayer PCB includes the following steps:
s10, manufacturing two single-sided resistance circuit boards, wherein the single-sided resistance circuit boards are obtained by adopting the manufacturing method of the single-sided resistance circuit board in any embodiment;
s20, pressing, namely stacking and pressing the single-sided resistance circuit board, the prepreg and the single-sided resistance circuit board in sequence to obtain a multilayer board, wherein the second copper foil of each single-sided resistance circuit board is used as the outermost layer;
s30, drilling, namely drilling the multilayer board;
s40, hole trimming, namely processing the multilayer board by a hole trimming agent;
s50, depositing copper, and depositing a layer of copper on the holes and the plate surface of the multilayer plate by a chemical method;
s60, performing plate electroplating on the multilayer board;
s70, manufacturing an outer layer circuit;
s80, depositing tin, namely depositing a layer of tin on the plate surface and the holes of the multilayer plate;
and S90, routing, and performing forming cutting on the multilayer board to obtain the multilayer PCB with the preset shape and size.
The following will explain in detail by taking the manufacturing method of the four-layer PCB as an example:
cutting to obtain an 18-by-12-inch resistor substrate, transversely placing the resistor substrate, and performing corner cutting treatment on the upper right corner of the resistor substrate to obtain a first copper foil (namely, a copper foil covering the resistor film) of the resistor substrate.
And respectively sticking dry films to the two opposite surfaces of the resistor substrate after the two opposite surfaces of the resistor substrate are cleaned.
And carrying out acid etching after the first exposure and development to manufacture a first circuit pattern overlapped with each other on the first copper foil and the resistive film, completely reserving the second copper foil, and removing a dry film to obtain a semi-finished plate.
And (4) respectively sticking dry films to the two surfaces of the semi-finished plate after the two surfaces of the semi-finished plate are cleaned.
And carrying out alkaline etching after the second exposure and development to manufacture a second circuit pattern on the first circuit pattern of the first copper foil, completely reserving the first circuit pattern of the resistance film, completely reserving the second copper foil, and removing the dry film to obtain the single-sided resistance circuit board. The resistance of the single-sided resistance circuit board can be detected through a universal meter.
The method comprises the steps of sequentially laminating a single-sided resistance circuit board, a prepreg and a single-sided resistance circuit board, wherein a second copper foil of the single-sided resistance circuit board positioned on an upper layer is used as an L1 layer, a resistance circuit layer of the single-sided resistance circuit board positioned on the upper layer is used as an L2 layer, a resistance circuit layer of the single-sided resistance circuit board positioned on a lower layer is used as an L3 layer, a second copper foil of the single-sided resistance circuit board positioned on the lower layer is used as an L4 layer, and a plate curing sheet is positioned between the L2 layer and the L3 layer, wherein brown oxidation treatment is not needed before pressing, and pressing is directly carried out to ensure the bonding force. Specifically, a prepreg having a thickness of 4mil may be used as the prepreg.
And placing the multilayer board between a cover plate and a base plate of drilling equipment, and setting parameters of the high-frequency board for drilling by adopting a new drill bit. Wherein, the cover plate and the bottom plate can be phenolic aldehyde plates.
And after the high-frequency plate is subjected to hole trimming, the copper deposition and the plate electric conduction are carried out twice. Wherein, the board electricity appoints to walk VCP electricity plating line, and the hole copper requires 26um ~ 35um, face copper 35 um.
And (3) pasting a dry film on the outer copper foil of the multilayer board, and then carrying out a series of procedures such as exposure, development, etching, film stripping and the like to manufacture an outer circuit.
And after the outer layer is detected, tin deposition and routing are carried out to obtain the multilayer PCB with the preset shape and size.
And detecting the multilayer PCB, and packaging and delivering the qualified PCB.
When the manufacturing method of the multilayer PCB is used for manufacturing the single-sided resistance circuit board, the characteristic that the resistance film is alkali-resistant and acid-resistant is fully utilized, after the first exposure and the development, the first circuit pattern is etched on the first copper foil and the resistance film simultaneously through acid etching, then the second exposure and the development are carried out, the second circuit pattern is etched on the first copper foil through alkali etching, and the first circuit pattern of the resistance film can be completely reserved, so that the single-sided resistance circuit board meeting the requirements can be easily manufactured. And then can effectively reduce the preparation degree of difficulty of single face resistance circuit board and multilayer PCB board, improve production efficiency.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A manufacturing method of a single-sided resistor circuit board is characterized by comprising the following steps:
providing a resistance substrate, wherein the resistance substrate comprises a first copper foil, a resistance film, a dielectric layer and a second copper foil which are sequentially stacked;
cleaning two opposite surfaces of the resistor substrate and respectively attaching dry films;
carrying out acid etching after first exposure and development to manufacture a first circuit pattern overlapped with each other on the first copper foil and the resistive film, completely reserving the second copper foil, and removing a dry film to obtain a semi-finished plate;
cleaning two surfaces of the semi-finished plate and respectively sticking dry films;
and carrying out alkaline etching after the second exposure and development to manufacture a second circuit pattern on the first circuit pattern of the first copper foil, completely reserving the first circuit pattern of the resistance film, completely reserving the second copper foil, and removing the dry film to obtain the single-sided resistance circuit board.
2. The method for manufacturing the single-sided resistor circuit board according to claim 1, further comprising the following steps before the step of attaching dry films to the two opposite sides of the resistor substrate respectively:
and carrying out corner cutting treatment on the resistance substrate.
3. The method for manufacturing the single-sided resistive circuit board according to claim 1, wherein the specific steps of performing acid etching after the first exposure and development comprise:
exposing partial areas of the dry film covered on the surface of the first copper foil through an exposure machine, and comprehensively exposing the dry film covered on the surface of the second copper foil;
removing the unexposed region of the dry film by a developing solution;
and etching by using an acidic solution, washing away the areas of the first copper foil and the resistance film which are not covered by the dry film, reserving the areas of the first copper foil and the resistance film which are covered by the dry film to form a first circuit pattern, and completely reserving the second copper foil which is covered by the dry film after full exposure.
4. The method for manufacturing the single-sided resistive circuit board according to claim 3, wherein the specific conditions for removing the unexposed region of the dry film by the developing solution are as follows:
the developing temperature is 30-40 ℃, the conveying speed of the resistance substrate is 5-6 m/min, and the upper pressure of the developing solution sprayed on the upper plate surface of the resistance substrate is 1.8Kg/cm2～2Kg/cm2The lower pressure of the developing solution sprayed on the lower plate surface of the resistor substrate is 1.3Kg/cm2～1.5Kg/cm2。
5. The method of manufacturing a single-sided resistive circuit board according to claim 1, wherein in the step of performing acid etching after the first exposure and development, a mixed solution of hydrochloric acid and sodium hypochlorite is used for performing acid etching.
6. The method for manufacturing a single-sided resistive circuit board according to claim 1, wherein in the step of performing alkaline etching after the second exposure and development, an ammonium chloride solution is used for performing alkaline etching.
7. The method for manufacturing the single-sided resistive circuit board according to claim 1, wherein the step of performing the alkaline etching after the second exposure and the development comprises:
taking a rivet hole of the resistance substrate as a positioning point;
exposing through an exposure machine, exposing a corresponding graph on the dry film covered on the surface of the first copper foil according to negative film information, and comprehensively exposing the dry film covered on the surface of the second copper foil;
removing the unexposed region of the dry film by a developing solution;
and etching by using an alkaline solution, washing away the area of the first circuit pattern of the first copper foil, which is not covered by the dry film, retaining the area of the first circuit pattern of the first copper foil, which is covered by the dry film, to form the second circuit pattern, and completely retaining the second copper foil, which is covered by the dry film subjected to the full exposure.
8. The method of manufacturing a single-sided resistive circuit board of claim 1, wherein the acid cleaning is turned off during the dry film removal process after the completion of the alkaline etching.
9. The method for manufacturing the single-sided resistive circuit board according to any one of claims 1 to 8, further comprising the following steps after obtaining the single-sided resistive circuit board:
and detecting the resistance value of the single-sided resistor circuit board.
10. A manufacturing method of a multilayer PCB board is characterized by comprising the following steps:
manufacturing two single-sided resistive circuit boards, wherein the single-sided resistive circuit boards are obtained by adopting the manufacturing method of the single-sided resistive circuit board according to any one of claims 1 to 9;
laminating, namely laminating the single-sided resistance circuit board, the prepreg and the single-sided resistance circuit board in sequence and laminating to obtain a multilayer board, wherein the second copper foil of each single-sided resistance circuit board is used as the outermost layer;
drilling, namely drilling the multilayer board;
hole trimming, namely processing the multilayer board by a hole trimming agent;
depositing copper, namely depositing a layer of copper on the holes and the plate surface of the multilayer plate by a chemical method;
the board is electrically connected, and the full-board electroplating is carried out on the multilayer board;
manufacturing an outer layer circuit;
depositing tin, namely depositing a layer of tin on the plate surface and the holes of the multilayer plate;
and (4) routing, namely, performing forming cutting on the multilayer board to obtain the multilayer PCB with the preset shape and size.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010629569.XA CN111642075A (en) | 2020-07-03 | 2020-07-03 | Manufacturing method of single-sided resistor circuit board and manufacturing method of multilayer PCB |
Applications Claiming Priority (1)
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