CN107613676A - A kind of inclined ameliorative way of multilayer line flaggy - Google Patents
A kind of inclined ameliorative way of multilayer line flaggy Download PDFInfo
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- CN107613676A CN107613676A CN201710759782.0A CN201710759782A CN107613676A CN 107613676 A CN107613676 A CN 107613676A CN 201710759782 A CN201710759782 A CN 201710759782A CN 107613676 A CN107613676 A CN 107613676A
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Abstract
The present invention relates to a kind of inclined ameliorative way of multilayer line flaggy, comprise the following steps：S1, graphic making；S2, PE perforating press；It is S3, pre- folded；S4, combination；S5, lamination；S6, hot pressing；S7, X RAY bore target；Wherein, internal layer management and control is carried out during graphic making, internal layer management and control includes：A, according to date form management and control, same date plate need to not distinguished by sign placement the same item number of internal layer dust free room the film, etch and distinguish limp according to numbering；B, the management and control of internal layer film harmomegathus is ± 1mil, and etched plate is according to ± 3mil management and control.The present invention by analysis circuit flaggy it is inclined the reason for, there is provided corresponding method to carry out management and control, mainly by the harmomegathus of the management and control of the internal layer film, PE perforating press divide heap, pressing to harmomegathus plate form a complete production network and working condition management and control, improve the inclined situation of pcb layer, improve the quality of production.
Description
Technical field
The present invention relates to wiring board manufacture field, and in particular to a kind of inclined ameliorative way of multilayer line flaggy.
Background technology
Due to the increase of integrated antenna package closeness, interconnection line high concentration.So that multilayer circuit board is widely used.
Multilayer circuit board is by internal layer circuit plate, prepreg and outer copper foil, after the HTHP process pressing of press, then is passed through
Cross through hole and connect each sandwich circuit, realize electric property.This requires the relative position between each sandwich circuit copper foil overlapped points and hole
Precision is high, otherwise occurs that larger skew may result in short circuit or open circuit is scrapped.Therefore, realize the accurate contraposition of interlayer for more
Layer circuit board is vital.
According to analysis, the factor for influenceing the contraposition of interlayer precision has a lot, mainly there is internal layer circuit core plate exposure aligning deviation, PE
Punching precision, sheet material harmomegathus, pressing off normal, borehole accuracy etc..Wherein be pressed together on press HTHP it is totally enclosed under the conditions of
Carry out, be easier to occur that layer is inclined scraps, and plank pressing and forming, analysis is not just made.Therefore, how for the scarce of pressing
Fall into, there is provided go out a kind of inclined ameliorative way of effective layer, be the most important thing.
The content of the invention
It is an object of the present invention to provide a kind of inclined ameliorative way of multilayer line flaggy, and it can efficiently solve institute in background technology
The problem of existing.
The technical problems to be solved by the invention are realized using following technical scheme：
A kind of inclined ameliorative way of multilayer line flaggy, comprises the following steps：
S1, graphic making, internal layer circuit is exposed on plank, then can by the pattern etch process of needs, formation by etching
The circuit of conducting；
S2, PE perforating press, by the action for being punched more than six layers multi-layer sheet after striping, in favor of multiple-plate rear work
Sequence is processed；And the plank of different harmomegathus scopes is separated into limp；
S3, the pre- core plate folded, will handled by brown, fold structure requirement by MI and plate, prepreg, copper foil are fixed together；
S4, combination, the plate fixed are neatly come on smooth steel plate；
S5, lamination, the steel plate for sequencing plate is stacked together by SOP requirements are neat, press to be entered；
S6, hot pressing, by vacuum, high temperature, high pressure condition, core material and PP, effectively pressing is integral, formed 3 layers and
Multi-layer sheet above；
S7, X-RAY bore target, and boring target drone by X-RAY captures internal layer target, bores gong side positioning hole, while measures wad cutter distance,
Contrasted with MI data criterion distances, draw the harmomegathus value of production plate, distinguish the plate of different harmomegathus, divide after heap by different brills
Band coefficient goes out lower process gong side；
Wherein, internal layer management and control is carried out during graphic making, internal layer management and control includes：
A, the film is according to date form management and control, and same date plate need to not distinguished by sign placement, etching the same item number of internal layer dust free room
Limp is distinguished according to numbering；
B, the management and control of internal layer film harmomegathus is ± 1mil, and etched plate is according to ± 3mil management and control.
The graphic making also carries out internal layer AOI management and control, and internal layer AOI management and control includes：
1）The plate on date is distinguished to internal layer need to separate scanning, punching, limp；
2）Multi-layer sheet all levels has the abnormal plate beyond ± 50um, and harmomegathus value, and value and punching again are finished writing in edges of boards
It is supporting；
3）Divide heap plate beyond ± 50um, it is necessary to which corner cut indicates.
Including pressing management and control, to the AOI flitch that comes, check whether edges of boards have corner cut, brown must be separated if any corner cut plate,
And also to be formed a complete production network during riveted.
It is each core plate of internal layer in HTHP bonding processes that the pressing management and control, which includes that lamination is flexible, and the lamination is flexible,
Caused telescopic variation, corresponding core material harmomegathus is suitably adjusted according to actual conditions and puts value in advance.
The pressing management and control also includes typesetting off normal and pressing off normal, is entered by four concentric circles for being distributed in plate corner
Row confirms that observation multilayer circuit board, towards the situation of equidirectional skew or rotation, confirms with the presence or absence of certain layer or core plate concentric circles
With the presence or absence of typesetting off normal and the situation of pressing off normal.
Also include riveted management and control, the riveted management and control adjusts main shaft pressure size when passing through riveted, adjusts staple height and riveted
Consistency of thickness, improve and bore PP holes quality, to ensure that closing-up quality carries out management and control.
Also include lamination slide plate management and control, the lamination slide plate management and control by adjusting press flatness to meeting production requirement,
For easy slide plate multi-layer sheet in bonding processes, reduce production board size, suitably reduce heating rate, it is appropriate to reduce high pressure pressure
Power simultaneously delays the opportunity of adding high pressure, while also to avoid white point, starved etc. caused by plate face filler deficiency caused by hypotony
Defect is controlled.
The beneficial effects of the invention are as follows：
The present invention by analysis circuit flaggy it is inclined the reason for, there is provided corresponding method carry out management and control, mainly pass through the internal layer film
Management and control, the harmomegathus of PE perforating press divide heap, pressing to harmomegathus plate form a complete production network and working condition management and control, improve pcb layer it is inclined
Situation, improve the quality of production.
Embodiment
In order that the technical means, the inventive features, the objects and the advantages of the present invention are easy to understand, further
Illustrate the present invention.
Embodiment 1
A kind of inclined ameliorative way of multilayer line flaggy, comprises the following steps：
S1, graphic making, internal layer circuit is exposed on plank, then can by the pattern etch process of needs, formation by etching
The circuit of conducting；
S2, PE perforating press, by the action for being punched more than six layers multi-layer sheet after striping, in favor of multiple-plate rear work
Sequence is processed；And the plank of different harmomegathus scopes is separated into limp；
S3, the pre- core plate folded, will handled by brown, fold structure requirement by MI and plate, prepreg, copper foil are fixed together；
S4, combination, the plate fixed are neatly come on smooth steel plate；
S5, lamination, the steel plate for sequencing plate is stacked together by SOP requirements are neat, press to be entered；
S6, hot pressing, by vacuum, high temperature, high pressure condition, core material and PP, effectively pressing is integral, formed 3 layers and
Multi-layer sheet above；
S7, X-RAY bore target, and boring target drone by X-RAY captures internal layer target, bores gong side positioning hole, while measures wad cutter distance,
Contrasted with MI data criterion distances, draw the harmomegathus value of production plate, distinguish the plate of different harmomegathus, divide after heap by different brills
Band coefficient goes out lower process gong side；
Wherein, internal layer management and control is carried out during graphic making, internal layer management and control includes：
A, the film is according to date form management and control, and same date plate need to not distinguished by sign placement, etching the same item number of internal layer dust free room
Limp is distinguished according to numbering；
B, the management and control of internal layer film harmomegathus is ± 1mil, and etched plate is according to ± 3mil management and control.
The graphic making also carries out internal layer AOI management and control, and internal layer AOI management and control includes：
1）The plate on date is distinguished to internal layer need to separate scanning, punching, limp；
2）Multi-layer sheet all levels has the abnormal plate beyond ± 50um, and harmomegathus value, and value and punching again are finished writing in edges of boards
It is supporting；
3）Divide heap plate beyond ± 50um, it is necessary to which corner cut indicates.
For being laminated process, the inclined major influence factors of layer have flexible pressing, typesetting off normal and pressing off normal
The pressing management and control, to the AOI flitch that comes, check whether edges of boards have corner cut, brown must be separated if any corner cut plate, and
Also to be formed a complete production network during riveted.
It is each core plate of internal layer in HTHP bonding processes that the pressing management and control, which includes that lamination is flexible, and the lamination is flexible,
Caused telescopic variation, for similar defect, corresponding core material harmomegathus can be suitably adjusted according to actual conditions and puts value in advance, can be solved
Certainly.
The pressing management and control also includes typesetting off normal and pressing off normal, is entered by four concentric circles for being distributed in plate corner
Row confirms that observation multilayer circuit board, towards the situation of equidirectional skew or rotation, confirms with the presence or absence of certain layer or core plate concentric circles
With the presence or absence of typesetting off normal and the situation of pressing off normal.
The defects of common, also has riveted to break core plate, rivet inclination and slide plate.
During riveted, because rivet driver main shaft pressure is excessive, tune staple height is too small or there is drilling particle in PP apertures,
It can cause thin core plate that holes easily occurs in process of production.And rivet is bloomed, uneven, no marking angle rivet can increase off normal
Risk.For this kind of defect, it can be controlled by by riveted management and control, it is big that the riveted management and control adjusts main shaft pressure when passing through riveted
It is small, staple height and riveted consistency of thickness are adjusted, improves and bores PP holes quality, to ensure that closing-up quality carries out management and control.
Rivet tilts and lamination slide plate is caused by bonding processes；Lamination slide plate occurs more or have light in PP quantity
The interlayer of harden structure.According to analysis, formation and the bonding processes plate face stress and pressing relating to parameters of this defect.
That causes lamination slide plate defect mainly has two factors：Heating rate is too fast and the time that adds high pressure is too early.
Heating rate and closely bound up, the different PP models such as PP pieces model, quantity, heating rate is different, and PP numbers
Amount is more, and heating rate is slower.
In addition, the control for the time that adds high pressure is also crucial, if the time that adds high pressure is too early, extrusion resin, gummosis can be caused too
It is more, it is bad to will also result in slide plate etc..
In order to improve this kind of defect, need to carry out being laminated slide plate management and control, the lamination slide plate management and control is smooth by adjusting press
Degree is to production requirement is met, for the multi-layer sheet of easy slide plate（Multiple PP or tabula rasa）In bonding processes, it can be produced from reducing
Board size, heating rate is suitably reduced, it is appropriate to reduce high-pressure and delay the opportunity of adding high pressure, while also to avoid because of pressure mistake
Low the defects of causing white point, starved caused by plate face filler deficiency.
Scrapping in detail for pressing class is taken charge of from me to learn, this during pressing is scrapped is several with layer partial correlation：
Interior short retirement ratio is 0.85%, wherein pressing accounts for=0.85%*0.35%；
The inclined ratio of riveting is 0.518%；
Harmomegathus ratio is 0.07%；
And the production capacity that I takes charge of pressing class is 50,000/M2/ months, then scraps and amount to：0.85%*0.35%+0.518%+0.07%=
0.886%, so layer scraps area partially is：0.886%*50000=450M2/ months, then it can save every year：450*300*12=160
Ten thousand.
It is the wherein specific implementation of the present invention above, its description is more specific and detailed, but can not therefore manage
Solve as the limitation to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, do not departing from
On the premise of present inventive concept, various modifications and improvements can be made, these obvious alternative forms belong to this hair
Bright protection domain.
Claims (7)
1. a kind of inclined ameliorative way of multilayer line flaggy, it is characterised in that comprise the following steps：
S1, graphic making, internal layer circuit is exposed on plank, then can by the pattern etch process of needs, formation by etching
The circuit of conducting；
S2, PE perforating press, by the action for being punched more than six layers multi-layer sheet after striping, in favor of multiple-plate rear work
Sequence is processed；And the plank of different harmomegathus scopes is separated into limp；
S3, the pre- core plate folded, will handled by brown, fold structure requirement by MI and plate, prepreg, copper foil are fixed together；
S4, combination, the plate fixed are neatly come on smooth steel plate；
S5, lamination, the steel plate for sequencing plate is stacked together by SOP requirements are neat, press to be entered；
S6, hot pressing, by vacuum, high temperature, high pressure condition, core material and PP, effectively pressing is integral, formed 3 layers and
Multi-layer sheet above；
S7, X-RAY bore target, and boring target drone by X-RAY captures internal layer target, bores gong side positioning hole, while measures wad cutter distance,
Contrasted with MI data criterion distances, draw the harmomegathus value of production plate, distinguish the plate of different harmomegathus, divide after heap by different brills
Band coefficient goes out lower process gong side；
Wherein, internal layer management and control is carried out during graphic making, internal layer management and control includes：
A, the film is according to date form management and control, and same date plate need to not distinguished by sign placement, etching the same item number of internal layer dust free room
Limp is distinguished according to numbering；
B, the management and control of internal layer film harmomegathus is ± 1mil, and etched plate is according to ± 3mil management and control.
2. a kind of inclined ameliorative way of multilayer line flaggy according to claim 1, it is characterised in that the graphic making is also
Internal layer AOI management and control is carried out, internal layer AOI management and control includes：
1）The plate on date is distinguished to internal layer need to separate scanning, punching, limp；
2）Multi-layer sheet all levels has the abnormal plate beyond ± 50um, and harmomegathus value, and value and punching again are finished writing in edges of boards
It is supporting；
3）Divide heap plate beyond ± 50um, it is necessary to which corner cut indicates.
A kind of 3. inclined ameliorative way of multilayer line flaggy according to claim 2, it is characterised in that including pressing management and control,
To the AOI flitch that comes, check whether edges of boards have corner cut, brown must be separated if any corner cut plate, and supporting life is also wanted during riveted
Production.
A kind of 4. inclined ameliorative way of multilayer line flaggy according to claim 3, it is characterised in that the pressing management and control bag
It is flexible to include lamination, the flexible lamination is each core plate of internal layer caused telescopic variation in HTHP bonding processes, according to reality
Border situation suitably adjusts corresponding core material harmomegathus and puts value in advance.
5. a kind of inclined ameliorative way of multilayer line flaggy according to claim 3, it is characterised in that the pressing management and control is also
Including typesetting off normal and pressing off normal, confirmed by four concentric circles for being distributed in plate corner, observe multilayer circuit board
With the presence or absence of certain layer or core plate concentric circles is towards the situation of equidirectional skew or rotation, is confirmed whether typesetting off normal and pressing be present
The situation of off normal.
6. a kind of inclined ameliorative way of multilayer line flaggy according to claim 1, it is characterised in that also including riveted pipe
Control, the riveted management and control adjust main shaft pressure size when passing through riveted, adjust staple height and riveted consistency of thickness, improve and bore PP holes matter
Amount, to ensure that closing-up quality carries out management and control.
7. a kind of inclined ameliorative way of multilayer line flaggy according to claim 1, it is characterised in that also include lamination slide plate
Management and control, the lamination slide plate management and control are being pressed by adjusting press flatness to production requirement is met for the multi-layer sheet of easy slide plate
During conjunction, reduce production board size, suitably reduce heating rate, it is appropriate to reduce high-pressure and delay the opportunity of adding high pressure, together
When also to avoid being controlled because of the defects of white point, starved caused by plate face filler deficiency caused by hypotony.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710759782.0A CN107613676B (en) | 2017-08-30 | 2017-08-30 | A kind of inclined ameliorative way of multilayer circuit board layer |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710759782.0A CN107613676B (en) | 2017-08-30 | 2017-08-30 | A kind of inclined ameliorative way of multilayer circuit board layer |
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| CN107613676B CN107613676B (en) | 2019-11-15 |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108966498A (en) * | 2018-08-03 | 2018-12-07 | 诚亿电子（嘉兴）有限公司 | The direct compression method of core material |
| CN110864653A (en) * | 2019-11-29 | 2020-03-06 | 浪潮商用机器有限公司 | Multilayer PCB (printed Circuit Board) and interlayer deviation monitoring method, device, equipment and medium thereof |
| CN111642075A (en) * | 2020-07-03 | 2020-09-08 | 广东兴达鸿业电子有限公司 | Manufacturing method of single-sided resistor circuit board and manufacturing method of multilayer PCB |
| CN112312684A (en) * | 2020-09-28 | 2021-02-02 | 惠州市金百泽电路科技有限公司 | Method for controlling deviation of laminated layers of multilayer FPC board |
| CN114390783A (en) * | 2020-10-20 | 2022-04-22 | 深南电路股份有限公司 | Circuit board manufacturing method and circuit board |
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| JP2008078464A (en) * | 2006-09-22 | 2008-04-03 | Nec Toppan Circuit Solutions Inc | Manufacturing method of printed wiring board and drilling apparatus |
| CN103561548A (en) * | 2013-11-20 | 2014-02-05 | 广东生益科技股份有限公司 | Method for relieving plate pressing winkles at rivet positions of multi-layer plate |
| CN103619127A (en) * | 2013-11-04 | 2014-03-05 | 深圳市鑫岸科技有限公司 | Method for realizing high-precision screen printing through direct solidification |
| CN103997852A (en) * | 2014-04-23 | 2014-08-20 | 奥士康精密电路（惠州）有限公司 | Expandable-shrinkable plate pile-dividing method |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2008078464A (en) * | 2006-09-22 | 2008-04-03 | Nec Toppan Circuit Solutions Inc | Manufacturing method of printed wiring board and drilling apparatus |
| CN103619127A (en) * | 2013-11-04 | 2014-03-05 | 深圳市鑫岸科技有限公司 | Method for realizing high-precision screen printing through direct solidification |
| CN103561548A (en) * | 2013-11-20 | 2014-02-05 | 广东生益科技股份有限公司 | Method for relieving plate pressing winkles at rivet positions of multi-layer plate |
| CN103997852A (en) * | 2014-04-23 | 2014-08-20 | 奥士康精密电路（惠州）有限公司 | Expandable-shrinkable plate pile-dividing method |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108966498A (en) * | 2018-08-03 | 2018-12-07 | 诚亿电子（嘉兴）有限公司 | The direct compression method of core material |
| CN110864653A (en) * | 2019-11-29 | 2020-03-06 | 浪潮商用机器有限公司 | Multilayer PCB (printed Circuit Board) and interlayer deviation monitoring method, device, equipment and medium thereof |
| CN111642075A (en) * | 2020-07-03 | 2020-09-08 | 广东兴达鸿业电子有限公司 | Manufacturing method of single-sided resistor circuit board and manufacturing method of multilayer PCB |
| CN112312684A (en) * | 2020-09-28 | 2021-02-02 | 惠州市金百泽电路科技有限公司 | Method for controlling deviation of laminated layers of multilayer FPC board |
| CN114390783A (en) * | 2020-10-20 | 2022-04-22 | 深南电路股份有限公司 | Circuit board manufacturing method and circuit board |
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| Publication number | Publication date |
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| CN107613676B (en) | 2019-11-15 |
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Effective date of registration: 20230705 Address after: 526070 Floor 1, Building 1, Xizhen Science Park, No. 11, Kechuang Avenue, Zhaoqing New District, Dinghu District, Zhaoqing City, Guangdong Province Patentee after: Guangdong Xizhen Circuit Technology Co.,Ltd. Address before: 516000 Changbu village, Xinwei Town, Huiyang District, Huizhou City, Guangdong Province Patentee before: AOSHIKONG PRECISION CIRCUIT (HUIZHOU) Co.,Ltd. |