CN107613676B - A kind of inclined ameliorative way of multilayer circuit board layer - Google Patents
A kind of inclined ameliorative way of multilayer circuit board layer Download PDFInfo
- Publication number
- CN107613676B CN107613676B CN201710759782.0A CN201710759782A CN107613676B CN 107613676 B CN107613676 B CN 107613676B CN 201710759782 A CN201710759782 A CN 201710759782A CN 107613676 B CN107613676 B CN 107613676B
- Authority
- CN
- China
- Prior art keywords
- plate
- internal layer
- control
- layer
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Abstract
The present invention relates to a kind of inclined ameliorative ways of multilayer circuit board layer, comprising the following steps: S1, graphic making；S2, PE perforating press；It is S3, pre- folded；S4, combination；S5, lamination；S6, hot pressing；S7, X-RAY bore target；Wherein, internal layer control is carried out when graphic making, internal layer control includes: a, the film according to the control of date form, and same date plate need to not distinguished by mark placement the same item number of internal layer dust free room, and etching is according to number differentiation limp；B, the control of internal layer film harmomegathus is ± 1mil, and etched plate is managed according to ± 3mil.The present invention reason inclined by analysis circuit plate layer, it is managed provided with corresponding method, it is main by the control of the internal layer film, the harmomegathus stacking of PE perforating press, pressing to harmomegathus plate form a complete production network and working condition is managed, improve the inclined situation of pcb layer, improve the quality of production.
Description
Technical field
The present invention relates to wiring board manufacture fields, and in particular to a kind of inclined ameliorative way of multilayer circuit board layer.
Background technique
Due to the increase of integrated antenna package closeness, interconnection line high concentration.So that multilayer circuit board is widely used.
Multilayer circuit board is after the high temperature and pressure process pressing of press, then to pass through internal layer circuit plate, prepreg and outer copper foil
It crosses through-hole and is connected to each sandwich circuit, realize electric property.This requires the relative positions between each sandwich circuit copper foil overlapped points and hole
Precision is high, and larger offset, which otherwise occurs, will lead to short circuit or open a way scrap.Therefore, realize the accurate contraposition of interlayer for more
Layer circuit board is vital.
According to analysis, many because being known as of interlayer precision contraposition are influenced, mainly there is internal layer circuit core plate exposure aligning deviation, PE
Punching precision, plate harmomegathus, pressing deviation, borehole accuracy etc..Wherein be pressed together on press high temperature and pressure it is totally enclosed under the conditions of
It carries out, is easier to occur that layer is inclined scraps, and plank pressing and forming, analysis is not just made.Therefore, how for the scarce of pressing
It falls into, provides a kind of inclined ameliorative way of effective layer, be the most important thing.
Summary of the invention
It is an object of the present invention to provide a kind of inclined ameliorative ways of multilayer circuit board layer, it can efficiently solve institute in background technique
There are the problem of.
The technical problems to be solved by the invention are realized using following technical scheme:
A kind of inclined ameliorative way of multilayer circuit board layer, comprising the following steps:
S1, graphic making, internal layer circuit is exposed on plank, then by etching the pattern etch process of needs, shape
At the circuit that can be connected；
S2, PE perforating press, by the movement for punching six layers or more multi-layer boards after striping, in favor of multiple-plate
Process is processed afterwards；And the plank of different harmomegathus ranges is separated into limp；
S3, the pre- core plate folded, will handled by brownification, fold structure requirement by MI and plate, prepreg, copper foil are fixed on one
It rises；
S4, combination, the plate fixed neatly come on smooth steel plate；
The steel plate for sequencing plate is stacked together by S5, lamination by SOP requirement is neat, into press；
S6, hot pressing, by vacuum, high temperature, high pressure condition, core material and PP effectively presss integrally, formation 3
Layer or more multi-layer board；
S7, X-RAY bore target, bore target drone by X-RAY and grab internal layer target, bore gong side location hole, while measuring wad cutter
Distance is compared with MI data criterion distance, is obtained the harmomegathus value of production plate, is distinguished the plate of different harmomegathus, press after stacking
Different drilling coefficients go out lower process gong side；
Wherein, internal layer control is carried out when graphic making, internal layer control includes:
A, the film is managed according to date form, and same date plate need to not distinguished by mark placement the same item number of internal layer dust free room,
Etching distinguishes limp according to number；
B, the control of internal layer film harmomegathus is ± 1mil, and etched plate is managed according to ± 3mil.
The graphic making also carries out internal layer AOI control, and internal layer AOI control includes:
1) plate for distinguishing the date to internal layer need to separate scanning, punching, limp；
2) multi-layer board all levels have the abnormal plate beyond ± 50um, finish writing harmomegathus value in edges of boards, and again value and
Punching is mating；
3) exceed the stacking plate of ± 50um, it is necessary to corner cut mark.
It is managed including pressing, to the flitch that comes of AOI, checks whether edges of boards have corner cut, brownification must be separated if any corner cut plate,
And it also to form a complete production network when riveted.
The pressing control includes that lamination is flexible, and the flexible lamination is each core plate of internal layer in high temperature and pressure bonding processes
Caused telescopic variation, appropriate adjustment corresponds to core material harmomegathus and puts value in advance according to the actual situation.
Pressing control further includes typesetting deviation and pressing deviation, by be distributed in four concentric circles in plate corner into
It goes and confirms, observation multilayer circuit board, towards the case where equidirectional offset or rotation, confirms with the presence or absence of certain layer or core plate concentric circles
The case where with the presence or absence of typesetting deviation and pressing deviation.
It further include riveted control, the riveted control adjusts main shaft pressure size when passing through riveted, adjusts staple height and riveted
Consistency of thickness improves and bores the hole PP quality, to guarantee that closing-up quality is managed.
It further include lamination slide plate control, the lamination slide plate is managed by adjusting press flatness to meeting production requirement,
For easy slide plate multi-layer board during the pressing process, reduce production board size, suitably reduction heating rate, it is appropriate to reduce high pressure pressure
Power simultaneously delays the opportunity of adding high pressure, while white point, starved brought by plate face filler deficiency etc. caused by also avoiding because of hypotony
Defect is controlled.
The beneficial effects of the present invention are:
The present invention reason inclined by analysis circuit plate layer, is managed provided with corresponding method, mainly passes through internal layer
The control of the film, the harmomegathus stacking of PE perforating press, pressing to harmomegathus plate form a complete production network and working condition is managed, improve wiring board
The inclined situation of layer, improves the quality of production.
Specific embodiment
In order to be easy to understand the technical means, the creative features, the aims and the efficiencies achieved by the present invention, further
Illustrate the present invention.
Embodiment 1
A kind of inclined ameliorative way of multilayer circuit board layer, comprising the following steps:
S1, graphic making, internal layer circuit is exposed on plank, then by etching the pattern etch process of needs, shape
At the circuit that can be connected；
S2, PE perforating press, by the movement for punching six layers or more multi-layer boards after striping, in favor of multiple-plate
Process is processed afterwards；And the plank of different harmomegathus ranges is separated into limp；
S3, the pre- core plate folded, will handled by brownification, fold structure requirement by MI and plate, prepreg, copper foil are fixed on one
It rises；
S4, combination, the plate fixed neatly come on smooth steel plate；
The steel plate for sequencing plate is stacked together by S5, lamination by SOP requirement is neat, into press；
S6, hot pressing, by vacuum, high temperature, high pressure condition, core material and PP effectively presss integrally, formation 3
Layer or more multi-layer board；
S7, X-RAY bore target, bore target drone by X-RAY and grab internal layer target, bore gong side location hole, while measuring wad cutter
Distance is compared with MI data criterion distance, is obtained the harmomegathus value of production plate, is distinguished the plate of different harmomegathus, press after stacking
Different drilling coefficients go out lower process gong side；
Wherein, internal layer control is carried out when graphic making, internal layer control includes:
A, the film is managed according to date form, and same date plate need to not distinguished by mark placement the same item number of internal layer dust free room,
Etching distinguishes limp according to number；
B, the control of internal layer film harmomegathus is ± 1mil, and etched plate is managed according to ± 3mil.
The graphic making also carries out internal layer AOI control, and internal layer AOI control includes:
1) plate for distinguishing the date to internal layer need to separate scanning, punching, limp；
2) multi-layer board all levels have the abnormal plate beyond ± 50um, finish writing harmomegathus value in edges of boards, and again value and
Punching is mating；
3) exceed the stacking plate of ± 50um, it is necessary to corner cut mark.
For laminating process, the inclined major influence factors of layer have flexible pressing, typesetting deviation and pressing deviation
The pressing control checks whether edges of boards have corner cut to the flitch that comes of AOI, and must separate brownification if any corner cut plate,
And it also to form a complete production network when riveted.
The pressing control includes that lamination is flexible, and the flexible lamination is each core plate of internal layer in high temperature and pressure bonding processes
Caused telescopic variation appropriate adjustment can correspond to core material harmomegathus and put value in advance, can solve for similar defect according to the actual situation
Certainly.
Pressing control further includes typesetting deviation and pressing deviation, by be distributed in four concentric circles in plate corner into
It goes and confirms, observation multilayer circuit board, towards the case where equidirectional offset or rotation, confirms with the presence or absence of certain layer or core plate concentric circles
The case where with the presence or absence of typesetting deviation and pressing deviation.
There are also riveteds to break core plate, rivet inclination and slide plate for common defect.
During riveted, since rivet driver main shaft pressure is excessive, tune staple height is too small or there is drilling particle in the aperture PP,
It will lead to thin core plate and holes easily occur in process of production.And rivet uneven, no marking angle rivet of blooming will increase deviation
Risk.For this kind of defect, it can be managed and be controlled by riveted, adjustment main shaft pressure is big when the riveted control passes through riveted
It is small, staple height and riveted consistency of thickness are adjusted, improves and bores the hole PP quality, to guarantee that closing-up quality is managed.
Rivet inclination and lamination slide plate are generated in bonding processes；Lamination slide plate occurs more or have light in PP quantity
The interlayer of hardened structure.According to analysis, formation and the bonding processes plate face stress and pressing relating to parameters of this defect.
Causing lamination slide plate defect main, there are two factors: heating rate is too fast and the time that adds high pressure is too early.
Heating rate and PP piece model, quantity etc. are closely bound up, different PP models, and heating rate is different, and PP number
Amount is more, and heating rate is slower.
In addition, the control for the time that adds high pressure is also key, if the time that adds high pressure is too early, extrusion resin, gummosis will lead to too
It is more, it is bad to will also result in slide plate etc..
In order to improve this kind of defect, lamination slide plate control need to be carried out, the lamination slide plate control is smooth by adjusting press
Degree to meeting production requirement, for easy slide plate multi-layer board (multiple PP or tabula rasa) during the pressing process, can be produced from reducing
Board size, suitably reduction heating rate, it is appropriate to reduce high-pressure and delay the opportunity of adding high pressure, while also to avoid because of pressure mistake
Low the defects of causing white point, starved brought by plate face filler deficiency.
It is learnt from scrapping in detail for our company pressing class, middle these types and layer partial correlation are scrapped in pressing:
Interior short retirement ratio is 0.85%, wherein pressing accounts for=0.85%*0.35%；
The inclined ratio of riveting is 0.518%；
Harmomegathus ratio is 0.07%；
And the production capacity of our company pressing class is 50,000/M2/ month, then scraps total are as follows: 0.85%*0.35%+0.518%+0.07%=
0.886%, so the inclined scrap area of layer are as follows: can then save every year: 450*300*12=160 0.886%*50000=450M2/ month
Ten thousand.
The above are wherein specific implementations of the invention, and the description thereof is more specific and detailed, but can not therefore manage
Solution is limitations on the scope of the patent of the present invention.It should be pointed out that for those of ordinary skill in the art, not departing from
Under the premise of present inventive concept, various modifications and improvements can be made, these obvious alternative forms belong to this hair
Bright protection scope.
Claims (7)
1. a kind of inclined ameliorative way of multilayer circuit board layer, which comprises the following steps:
S1, graphic making, internal layer circuit is exposed on plank, then by etching by the pattern etch process of needs, formation can
The circuit of conducting；
S2, PE perforating press, by the movement for punching six layers or more multi-layer boards after striping, in favor of multiple-plate rear work
Sequence processing；And the plank of different harmomegathus ranges is separated into limp；
S3, the pre- core plate folded, will handled by brownification, fold structure requirement by MI and plate, prepreg, copper foil will be fixed together；
S4, combination, the plate fixed neatly come on smooth steel plate；
The steel plate for sequencing plate is stacked together by S5, lamination by SOP requirement is neat, into press；
S6, hot pressing, by vacuum, high temperature, high pressure condition, core material and PP effectively presss integrally, 3 layers of formation with
On multi-layer board；
S7, X-RAY bore target, bore target drone by X-RAY and grab internal layer target, bore gong side location hole, while measuring wad cutter distance,
It is compared with MI data criterion distance, obtains the harmomegathus value of production plate, distinguished the plate of different harmomegathus, press different brills after stacking
Band coefficient goes out lower process gong side；
Wherein, internal layer control is carried out when graphic making, internal layer control includes:
A, the film is managed according to date form, and same date plate need to not distinguished by mark placement, etching the same item number of internal layer dust free room
Limp is distinguished according to number；
B, the control of internal layer film harmomegathus is ± 1mil, and etched plate is managed according to ± 3mil.
2. a kind of inclined ameliorative way of multilayer circuit board layer according to claim 1, which is characterized in that the graphic making is also
Internal layer AOI control is carried out, internal layer AOI control includes: that the plate for 1) distinguishing the date to internal layer need to separate scanning, punching, limp；2) more
Laminate all levels have the abnormal plate beyond ± 50 μm, finish writing harmomegathus value in edges of boards, and value and punching is mating again；3) surpass
± 50 μm of stacking plate out, it is necessary to corner cut mark.
3. a kind of inclined ameliorative way of multilayer circuit board layer according to claim 2, which is characterized in that it is managed including pressing,
It to the flitch that comes of AOI, checks whether edges of boards have corner cut, brownification must be separated if any corner cut plate, and also want mating life when riveted
It produces.
4. a kind of inclined ameliorative way of multilayer circuit board layer according to claim 3, which is characterized in that the pressing control packet
It is flexible to include lamination, the flexible lamination is each core plate of internal layer caused telescopic variation in high temperature and pressure bonding processes, according to reality
Border situation appropriate adjustment corresponds to core material harmomegathus and puts value in advance.
5. a kind of inclined ameliorative way of multilayer circuit board layer according to claim 3, which is characterized in that the pressing control is also
Including typesetting deviation and pressing deviation, four concentric circles by being distributed in plate corner are confirmed, observe multilayer circuit board
With the presence or absence of certain layer or core plate concentric circles towards the case where equidirectional offset or rotation, it is confirmed whether that there are typesetting deviation and pressings
The case where deviation.
6. a kind of inclined ameliorative way of multilayer circuit board layer according to claim 1, which is characterized in that further include riveted pipe
Control, the riveted control adjust main shaft pressure size when passing through riveted, adjust height of rivet and riveted consistency of thickness, improve and bore PP
Hole quality, to guarantee that closing-up quality is managed.
7. a kind of inclined ameliorative way of multilayer circuit board layer according to claim 1, which is characterized in that further include lamination slide plate
Control, the lamination slide plate control, to production requirement is met, are pressing the multi-layer board of easy slide plate by adjusting press flatness
During conjunction, reduce production board size, suitably reduction heating rate, it is appropriate to reduce high-pressure and delay the opportunity of adding high pressure, together
When also to avoid because of hypotony caused by white point, starved defect brought by plate face filler deficiency controlled.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710759782.0A CN107613676B (en) | 2017-08-30 | 2017-08-30 | A kind of inclined ameliorative way of multilayer circuit board layer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710759782.0A CN107613676B (en) | 2017-08-30 | 2017-08-30 | A kind of inclined ameliorative way of multilayer circuit board layer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107613676A CN107613676A (en) | 2018-01-19 |
| CN107613676B true CN107613676B (en) | 2019-11-15 |
Family
ID=61056742
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710759782.0A Active CN107613676B (en) | 2017-08-30 | 2017-08-30 | A kind of inclined ameliorative way of multilayer circuit board layer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107613676B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108966498A (en) * | 2018-08-03 | 2018-12-07 | 诚亿电子（嘉兴）有限公司 | The direct compression method of core material |
| CN110864653A (en) * | 2019-11-29 | 2020-03-06 | 浪潮商用机器有限公司 | Multilayer PCB (printed Circuit Board) and interlayer deviation monitoring method, device, equipment and medium thereof |
| CN111642075A (en) * | 2020-07-03 | 2020-09-08 | 广东兴达鸿业电子有限公司 | Manufacturing method of single-sided resistor circuit board and manufacturing method of multilayer PCB |
| CN114390783A (en) * | 2020-10-20 | 2022-04-22 | 深南电路股份有限公司 | Circuit board manufacturing method and circuit board |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103561548A (en) * | 2013-11-20 | 2014-02-05 | 广东生益科技股份有限公司 | Method for relieving plate pressing winkles at rivet positions of multi-layer plate |
| CN103619127A (en) * | 2013-11-04 | 2014-03-05 | 深圳市鑫岸科技有限公司 | Method for realizing high-precision screen printing through direct solidification |
| CN103997852A (en) * | 2014-04-23 | 2014-08-20 | 奥士康精密电路（惠州）有限公司 | Expandable-shrinkable plate pile-dividing method |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008078464A (en) * | 2006-09-22 | 2008-04-03 | Nec Toppan Circuit Solutions Inc | Manufacturing method of printed wiring board and drilling apparatus |
-
2017
- 2017-08-30 CN CN201710759782.0A patent/CN107613676B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103619127A (en) * | 2013-11-04 | 2014-03-05 | 深圳市鑫岸科技有限公司 | Method for realizing high-precision screen printing through direct solidification |
| CN103561548A (en) * | 2013-11-20 | 2014-02-05 | 广东生益科技股份有限公司 | Method for relieving plate pressing winkles at rivet positions of multi-layer plate |
| CN103997852A (en) * | 2014-04-23 | 2014-08-20 | 奥士康精密电路（惠州）有限公司 | Expandable-shrinkable plate pile-dividing method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107613676A (en) | 2018-01-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107613676B (en) | A kind of inclined ameliorative way of multilayer circuit board layer | |
| CN105228371B (en) | A kind of method for making ladder golden finger circuit board | |
| CN103987194A (en) | Method for controlling expansion and shrinkage of lamination of multiple layers of boards | |
| CN106793575A (en) | A kind of manufacture craft of half bore pcb board | |
| CN104244612B (en) | A kind of method that plated through-hole is made on PTFE circuit boards | |
| CN109451683B (en) | Method for solving poor warping of asymmetric multilayer board after lamination and lamination method | |
| CN201957347U (en) | Die for laminating rigid and flexible combined multilayer printed circuit board | |
| CN103327756A (en) | Multilayer circuit board with partial mixed structure and manufacturing method thereof | |
| CN108495486A (en) | A kind of production method and High speed rear panel of High speed rear panel | |
| CN109168265A (en) | A kind of high-frequency microwave plate high density interconnection board manufacturing method | |
| CN105430944B (en) | The production method and multilayer board of multilayer board | |
| CN104427762B (en) | Bury resistance printed board and preparation method thereof | |
| CN110557905A (en) | Circuit board manufacturing method based on no-flow PP structure | |
| CN109121327B (en) | Multilayer PP combination manufacturing method with glue overflow reducing effect | |
| CN103517574B (en) | Bearing fixture and the manufacture method of Rigid Flex | |
| CN106714456A (en) | Method of high-precision numerical control V-CUT de-capping on metal copper substrate | |
| CN206713175U (en) | The composing structure of circuit board | |
| WO2020220680A1 (en) | High-precision forming method for rigid-flex printed circuit board | |
| CN104159394B (en) | A kind of PCB sections and preparation method thereof | |
| CN109548292B (en) | Super-long high multilayer PCB drilling production process | |
| CN106535509A (en) | Single-sided stagnant PP laminating structure and method of circuit board for aerospace purpose | |
| CN109152223B (en) | Manufacturing method of rigid-flex board | |
| CN105188283A (en) | Manufacturing technique of stepped-design-based PCB | |
| CN108323000A (en) | A kind of high-level circuit plate and preparation method thereof | |
| CN111182746B (en) | Circuit board layer deviation judging method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20230705 Address after: 526070 Floor 1, Building 1, Xizhen Science Park, No. 11, Kechuang Avenue, Zhaoqing New District, Dinghu District, Zhaoqing City, Guangdong Province Patentee after: Guangdong Xizhen Circuit Technology Co.,Ltd. Address before: 516000 Changbu village, Xinwei Town, Huiyang District, Huizhou City, Guangdong Province Patentee before: AOSHIKONG PRECISION CIRCUIT (HUIZHOU) Co.,Ltd. |