CN114190011B - High-heat-dissipation PCB and manufacturing process thereof - Google Patents
High-heat-dissipation PCB and manufacturing process thereof Download PDFInfo
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- CN114190011B CN114190011B CN202111334428.6A CN202111334428A CN114190011B CN 114190011 B CN114190011 B CN 114190011B CN 202111334428 A CN202111334428 A CN 202111334428A CN 114190011 B CN114190011 B CN 114190011B
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 26
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 206
- 239000011889 copper foil Substances 0.000 claims abstract description 130
- 229920005989 resin Polymers 0.000 claims abstract description 53
- 239000011347 resin Substances 0.000 claims abstract description 53
- 238000005553 drilling Methods 0.000 claims abstract description 44
- 230000017525 heat dissipation Effects 0.000 claims abstract description 31
- 238000003825 pressing Methods 0.000 claims abstract description 24
- 238000000227 grinding Methods 0.000 claims abstract description 23
- 238000009713 electroplating Methods 0.000 claims abstract description 17
- 239000003292 glue Substances 0.000 claims abstract description 13
- 239000000919 ceramic Substances 0.000 claims abstract description 12
- 238000005520 cutting process Methods 0.000 claims abstract description 12
- 239000010410 layer Substances 0.000 claims description 270
- 229910052802 copper Inorganic materials 0.000 claims description 75
- 239000010949 copper Substances 0.000 claims description 75
- 239000007788 liquid Substances 0.000 claims description 33
- 239000000126 substance Substances 0.000 claims description 31
- 238000000034 method Methods 0.000 claims description 28
- 239000000758 substrate Substances 0.000 claims description 27
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 26
- 239000003814 drug Substances 0.000 claims description 24
- 238000005530 etching Methods 0.000 claims description 24
- 238000006243 chemical reaction Methods 0.000 claims description 20
- 238000004140 cleaning Methods 0.000 claims description 20
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 18
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims description 16
- 238000001816 cooling Methods 0.000 claims description 13
- 238000005507 spraying Methods 0.000 claims description 12
- 238000013461 design Methods 0.000 claims description 8
- 238000011161 development Methods 0.000 claims description 7
- 238000007731 hot pressing Methods 0.000 claims description 7
- 238000007747 plating Methods 0.000 claims description 7
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 6
- 239000011229 interlayer Substances 0.000 claims description 6
- 238000003801 milling Methods 0.000 claims description 6
- 230000000379 polymerizing effect Effects 0.000 claims description 6
- 238000007127 saponification reaction Methods 0.000 claims description 6
- 238000003384 imaging method Methods 0.000 claims description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 5
- 239000002253 acid Substances 0.000 claims description 4
- 239000012459 cleaning agent Substances 0.000 claims description 4
- 238000005406 washing Methods 0.000 claims description 4
- 238000000151 deposition Methods 0.000 claims description 3
- 239000004519 grease Substances 0.000 claims description 3
- 230000003301 hydrolyzing effect Effects 0.000 claims description 3
- 239000012535 impurity Substances 0.000 claims description 3
- 239000004745 nonwoven fabric Substances 0.000 claims description 3
- 239000002893 slag Substances 0.000 claims description 3
- 238000002791 soaking Methods 0.000 claims description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- 238000007689 inspection Methods 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
- 229910021529 ammonia Inorganic materials 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 229910001431 copper ion Inorganic materials 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 125000000896 monocarboxylic acid group Chemical group 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- SUKJFIGYRHOWBL-UHFFFAOYSA-N sodium hypochlorite Chemical compound [Na+].Cl[O-] SUKJFIGYRHOWBL-UHFFFAOYSA-N 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 230000026676 system process Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
Abstract
The invention relates to a high heat dissipation PCB and a manufacturing process thereof, wherein the manufacturing process comprises the following steps: cutting and baking, inner layer line, pressing, mechanical drilling, electroplating, first back drilling, first pipe burying, resin plugging, ceramic grinding, removing glue residue, second back drilling, second pipe burying and outer layer line; the high-heat-dissipation PCB prepared by the manufacturing process comprises a first copper foil layer, a first insulating layer, a second copper foil layer, a second insulating layer, a third copper foil layer, a third insulating layer and a fourth copper foil layer which are sequentially arranged, and the PCB is embedded with a heat dissipation tube. According to the invention, the radiating pipe is embedded in the PCB to increase the radiating area, so that when the product works, heat generated in the PCB can be rapidly radiated through the radiating pipe, the radiating speed is improved, and the working temperature of the product is reduced.
Description
Technical Field
The invention relates to PCB manufacture, in particular to a high-heat-dissipation PCB and a manufacturing process thereof.
Background
PCB (Printed Circuit Board) the Chinese name is printed circuit board, which is an important electronic component as a support for electronic components. As the design of PCBs becomes more and more complex, the functions they bear are also more and more components mounted on the surface of PCBs. After the assembly of the existing PCB parts, the PCB and the parts generate a high-temperature state due to high-speed operation, and the quality and reliability are affected due to the fact that the PCB bursts due to untimely heat dissipation of the PCB.
Disclosure of Invention
In order to overcome the defects, the invention provides a manufacturing process of a high-heat-dissipation PCB, in the manufacturing process, a heat dissipation pipe is embedded in the PCB, and heat generated in the PCB can be rapidly dissipated through the heat dissipation pipe, so that the heat dissipation speed is improved, and the working temperature of a product is reduced.
The technical scheme adopted by the invention for solving the technical problems is as follows:
a manufacturing process of a high heat dissipation PCB comprises the following steps:
step 1: cutting and baking: cutting a substrate into a certain size, and baking in an oven, wherein the substrate is a double-sided copper-clad substrate, and the double-sided copper-clad substrate is provided with a second insulation layer, and a second copper foil layer and a third copper foil layer which are respectively pressed on the front side and the back side of the second insulation layer;
step 2: inner layer circuit: performing dry film pressing, exposure, development, etching and film stripping treatment on the second copper foil layer and the third copper foil layer on the substrate to obtain an inner layer plate with an inner layer circuit, and detecting the inner layer circuit by using an AOI system;
step 3: pressing: after the inner layer board obtained in the step 2 is subjected to pretreatment and browning, the first copper foil layer, the first insulating layer, the inner layer board, the third insulating layer and the fourth copper foil layer are overlapped according to a designed laminated structure, the overlapped first copper foil layer, the first insulating layer, the inner layer board, the third insulating layer and the fourth copper foil layer are pressed together by a press to form a multi-layer board, and then the multi-layer board is subjected to target drilling treatment;
step 4: mechanical drilling: drilling via holes for interlayer connection on the multilayer board by using a drilling machine;
step 5: electroplating: removing glue residues, chemical copper and electroplating copper in the through holes, so as to obtain a multi-layer board with inter-layer pattern circuits mutually conducted;
step 6: first back drilling: back drilling a preset via hole from the first copper foil layer to remove hole copper in the via hole and increase the diameter of the via hole, wherein part of the back drilled hole is used as a heat dissipation hole;
step 7: first time pipe burying: a radiating pipe is embedded in the radiating hole at the side of the first copper foil layer, two ends of the radiating pipe are respectively provided with a cooling end and a heat absorbing end, the heat absorbing end is embedded below the heating element, and the cooling end is exposed outside;
step 8: resin plug hole and ceramic grinding: filling the resin into the conduction Kong Nasai to be plugged by using a resin plugging machine, baking the multilayer board after plugging to solidify the resin in the holes, and grinding the resin convex points on the baked board by using a grinder, wherein the resin in the holes is flush with the board after grinding;
step 9: removing glue residues: cleaning the surfaces of the first copper foil layer and the fourth copper foil layer by using a plasma method to remove foreign matters and impurities on the surface of the plate and remove attachments on the surface of the plate;
step 10: and (3) backing drilling for the second time: back drilling a preset via hole from the fourth copper foil layer to remove hole copper in the via hole and increase the diameter of the via hole, wherein part of the back drilled hole is used as a heat dissipation hole;
step 11: and (3) pipe burying for the second time: a radiating pipe is embedded in the radiating hole of the fourth copper foil layer, two ends of the radiating pipe are respectively a cooling end and a heat absorbing end, the heat absorbing end is embedded below the heating element, and the cooling end is exposed outside;
step 12: an outer layer circuit: and performing dry film pressing, exposure, development, etching and film stripping treatment on the first copper foil layer and the fourth copper foil layer on the multilayer board to obtain the multilayer board with the outer layer circuit, and detecting the outer layer circuit by using an AOI system.
Preferably, the step 2 inner layer circuit specifically includes the following steps:
(1) Pretreatment: cleaning the substrate by using a cleaning solution containing hydrogen peroxide, and coarsening the surfaces of the second copper foil layer and the third copper foil layer by using a sulfuric acid solution;
(2) Pressing dry film: adhering a photosensitive dry film to the surfaces of the second copper foil layer and the third copper foil layer in a hot pressing mode;
(3) Exposure: polymerizing the photosensitive substance in the photosensitive dry film by using an LDI exposure machine, so that the designed pattern is transferred to the photosensitive dry film;
(4) Developing: saponification reaction of the developing solution and the unexposed dry film is utilized to remove the film;
(5) Etching: spraying copper chloride liquid medicine on the copper surface through an etching machine, and etching the copper surface which is not protected by the dry film by utilizing chemical reaction of the liquid medicine and copper to form a circuit;
(6) And (3) film removal: spraying NaOH or KOH liquid medicine on the board surface through a film removing machine, removing the dry film by utilizing the chemical reaction of the liquid medicine and the dry film, and completing the manufacture of the inner layer circuit to obtain the inner layer board with the inner layer circuit;
(7) AOI: the AOI system checks the inner layer line on the copper surface against the difference between the etched inner layer line and the original design line.
Preferably, the step 3 lamination specifically includes the following steps:
(1) Pretreatment: acid washing: removing oxide on the surfaces of the second copper foil layer and the third copper foil layer by utilizing sulfuric acid; cleaning: hydrolyzing the grease into small molecular substances which are easy to dissolve in water by using a cleaning agent; presoaking: pre-soaking the inner layer plate by using brown liquid;
(2) Brown chemical: the surface of the second copper foil layer and the surface of the third copper foil layer are subjected to brown treatment by using brown liquid, so that the surface of the copper is in an uneven surface shape, and the contact area of the copper surface and resin is increased;
(3) Overlapping: sequentially stacking a first copper foil layer, a first insulating layer, an inner layer plate, a third insulating layer and a fourth copper foil layer together, wherein the first insulating layer is pressed between the first copper foil layer and the second copper foil layer, and the third insulating layer is pressed between the third copper foil layer and the fourth copper foil layer;
(4) Pressing: the first copper foil layer, the first insulating layer, the inner layer plate, the third insulating layer and the fourth copper foil layer are fused and bonded into a multilayer plate under the high temperature and high pressure of a press;
(5) Post-treatment: drilling: imaging the multilayer board target by utilizing X-rays, and drilling a positioning hole and a fool-proof hole required by the subsequent process on the target by using a drill bit; edge milling: and cutting and removing redundant rim charge by using a milling machine.
Preferably, the step 5 plating specifically includes the following steps:
(1) Removing glue residues: removing the gumming slag generated during drilling by using a plasma method;
(2) Chemical copper: depositing a thin uniform chemical copper layer with conductivity in the hole through chemical action;
(3) Electroplating copper: plating a layer of electroplated copper layer on the surface of the chemical copper layer in an electroplating mode.
Preferably, in the step 8, the resin plug hole is specifically: the method comprises the steps of fixing a multilayer board on an air guide base plate of a resin hole plugging machine table surface, plugging resin into a guide hole with the bottom surface of the multilayer board upwards, wherein the resin plumpness in the guide hole reaches 100-110%, and the specific technological parameters are as follows: the ink viscosity of the resin is 450-550dpa.s, the vacuum degree is 30-60pa, the thickness of the scraper is 15-30mm, the angle of the scraper is 2-5 degrees, the speed of the scraper is 15-30mm/s, the working environment temperature is normal temperature, and the baking conditions are as follows: and in the step 8, the ceramic grinding is performed for 40-60min at the temperature of 130-160 ℃, wherein the grinding machine is an eight-shaft grinding machine, and the grinding machine adopts a ceramic brush to wrap the non-woven fabric to grind the resin salient points.
Preferably, the specific process parameters of the resin plugging in the step 8 are as follows: the resin has the ink viscosity of 500dpa.s, the vacuum degree of 45pa, the doctor thickness of 25mm, the doctor angle of 3 degrees, the doctor speed of 10mm/s, the working environment temperature of 25 ℃, and the baking conditions of: the temperature is 150 ℃ and the time is 50min.
Preferably, the step 12 of the outer layer circuit specifically includes the following steps:
(1) Pretreatment: cleaning the substrate by using a cleaning solution containing hydrogen peroxide, and coarsening the surfaces of the first copper foil layer and the fourth copper foil layer by using a sulfuric acid solution;
(2) Pressing dry film: adhering photosensitive dry films to the surfaces of the first copper foil layer and the fourth copper foil layer in a hot pressing mode;
(3) Exposure: polymerizing the photosensitive substance in the photosensitive dry film by using an LDI exposure machine, so that the designed pattern is transferred to the photosensitive dry film;
(4) Developing: saponification reaction of the developing solution and the unexposed dry film is utilized to remove the film;
(5) Etching: spraying copper chloride liquid medicine on the copper surface through an etching machine, and etching the copper surface which is not protected by the dry film by utilizing chemical reaction of the liquid medicine and copper to form a circuit;
(6) Leg mold: spraying NaOH or KOH liquid medicine on the board surface through a film removing machine, removing the dry film by utilizing the chemical reaction of the liquid medicine and the dry film, and completing the manufacture of the circuit to obtain the multilayer board with the outer layer circuit;
(7) AOI: the AOI system checks the lines on the copper surface against the differences between the etched lines and the original design lines.
The invention also provides a high-heat-dissipation PCB which is prepared by adopting the manufacturing process.
Preferably, the high heat dissipation PCB includes a first copper foil layer, a first insulating layer, a second copper foil layer, a second insulating layer, a third copper foil layer, a third insulating layer and a fourth copper foil layer which are sequentially arranged, and the PCB is embedded with a heat dissipation tube.
The beneficial effects of the invention are as follows: according to the invention, the PCB with high heat dissipation type is manufactured through a series of processes of cutting and baking, inner-layer circuit, pressing, mechanical drilling, electroplating, first back drilling, first pipe burying, resin hole plugging, ceramic grinding, glue residue removing, second back drilling, second pipe burying, outer-layer circuit and the like.
Drawings
Fig. 1 is a schematic structural diagram of a high heat dissipation PCB according to the present invention;
FIG. 2 is a schematic view of a substrate according to the present invention;
FIG. 3 is a schematic view of the structure of the multi-layer board according to the present invention;
FIG. 4 is a schematic view of the structure of the multi-layer board of the present invention after drilling;
FIG. 5 is a schematic view of the structure of the electroplated multilayer board of the present invention;
FIG. 6 is a schematic view of the structure of the multi-layer board of the present invention after the first back drilling;
FIG. 7 is a schematic view of the structure of the multi-layer board after first pipe burying in the present invention;
FIG. 8 is a schematic diagram of the structure of the present invention after plugging holes in a multilayer board;
FIG. 9 is a schematic view of the structure of the multi-layer board after the second back drilling in the present invention;
in the figure: 10-multilayer board, 11-first copper foil layer, 12-second copper foil layer, 13-third copper foil layer, 14-fourth copper foil layer, 21-first insulating layer, 22-second insulating layer, 23-third insulating layer, 31-via hole, 32-heat dissipation hole, 33-resin, 34-heat dissipation tube.
Detailed Description
The technical solutions of the embodiments of the present invention will be clearly and completely described below in conjunction with the embodiments of the present invention, and it is apparent that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
It should be noted that the terms "first," "second," and the like in the description and claims of the present application and the above figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate such that embodiments of the present application described herein may be capable of being practiced otherwise than as specifically illustrated and described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
Spatially relative terms, such as "above … …," "above … …," "upper surface at … …," "above," and the like, may be used herein for ease of description to describe one device or feature's spatial location relative to another device or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "above" or "over" other devices or structures would then be oriented "below" or "beneath" the other devices or structures. Thus, the exemplary term "above … …" may include both orientations of "above … …" and "below … …". The device may also be positioned in other different ways (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
Examples: a manufacturing process of a high heat dissipation PCB comprises the following steps:
step 1: cutting and baking: as shown in fig. 2, the substrate is cut into a certain size, and is baked in an oven, wherein the substrate is a double-sided copper-clad substrate, and the double-sided copper-clad substrate is provided with a second insulation 22, and a second copper foil layer 12 and a third copper foil layer 13 respectively pressed on the front side and the back side of the second insulation layer; the purpose of cutting is to facilitate the subsequent equipment processing; the baking conditions are as follows: the temperature is 122-148 ℃, and the baking time is 2-4 hours; baking the substrate to eliminate the stress of the substrate, prevent the substrate from warping, improve the dimensional stability of the substrate and reduce the swelling and shrinking of the substrate;
step 2: inner layer circuit: performing dry film pressing, exposure, development, etching and film stripping treatment on the second copper foil layer 12 and the third copper foil layer 13 on the substrate to obtain an inner layer plate with an inner layer circuit, and detecting the inner layer circuit by using an AOI system;
step 3: pressing: after the inner layer board obtained in the step 2 is subjected to pretreatment and browning, the first copper foil layer 11, the first insulating layer 21, the inner layer board, the third insulating layer 23 and the fourth copper foil layer 14 are laminated according to a designed laminated structure, the laminated first copper foil layer 11, the laminated first insulating layer 21, the laminated inner layer board, the laminated third insulating layer 23 and the laminated fourth copper foil layer 14 are pressed together by a press to form a multilayer board 10 (shown in fig. 3), and then the multilayer board is subjected to target drilling treatment;
step 4: mechanical drilling: as shown in fig. 4, via holes 31 for interlayer connection are drilled on the multilayer board 10 using a drilling machine;
step 5: electroplating: as shown in fig. 5, desmear, chemical copper and electrolytic copper plating are performed in the via hole 31, thereby obtaining a multilayer board 10 in which interlayer pattern lines are conducted to each other;
step 6: first back drilling: as shown in fig. 6, a preset via hole 31 is back-drilled from the first copper foil layer 11, so that the hole copper in the via hole is removed and the diameter of the via hole is increased, and a part of the back-drilled hole is used as a heat dissipation hole 32; the back drill is used for removing redundant hole copper in the via hole so as to improve the transmission speed of signals, the CAM processes the back hole data into working data for a drilling machine, the drilling machine reads a program and then drills the back drill hole required by the corresponding coordinate so as to eliminate the hole copper, and meanwhile, the hole diameter is increased so as to be used as a heat dissipation hole 32;
step 7: first time pipe burying: as shown in fig. 7, a heat radiating pipe 34 is embedded in the heat radiating hole 32 on the first copper foil layer 11 side, two ends of the heat radiating pipe are respectively a cooling end and a heat absorbing end, the heat absorbing end is embedded below the heating element, and the cooling end is exposed to the outside; the embedded radiating pipe 34 can radiate heat generated during the operation of the PCB in time so as to ensure the normal operation of the electronic product;
step 8: resin plug hole and ceramic grinding: as shown in fig. 8, the resin hole plugging machine is used for filling the resin 33 into the conduction Kong Nasai to be plugged, the multilayer board is baked after the plugging, so that the resin in the holes is solidified, the resin salient points on the baked board are ground by the grinder, and the resin in the holes is flush with the board after the grinding;
step 9: removing glue residues: cleaning the surfaces of the first copper foil layer 11 and the fourth copper foil layer 14 by a plasma method to remove foreign matters and impurities on the surface of the plate and remove attachments on the surface of the plate;
step 10: and (3) backing drilling for the second time: as shown in fig. 9, a preset via hole 31 is back-drilled from the fourth copper foil layer 14, so that the hole copper in the via hole is removed and the diameter of the via hole is increased, and a part of the back-drilled hole is used as a heat dissipation hole 32;
step 11: and (3) pipe burying for the second time: as shown in fig. 1, a heat radiating pipe 34 is embedded in the heat radiating hole 32 of the fourth copper foil layer 14, two ends of the heat radiating pipe are respectively a cooling end and a heat absorbing end, the heat absorbing end is embedded below the heating element, and the cooling end is exposed to the outside;
step 12: an outer layer circuit: the first copper foil layer 11 and the fourth copper foil layer 14 on the multilayer board are subjected to dry film pressing, exposure, development, etching and film stripping treatment to obtain the multilayer board with the outer layer circuit, and the outer layer circuit is detected by an AOI system.
According to the invention, the PCB with high heat dissipation type is manufactured through a series of processes of cutting and baking, inner-layer circuit, pressing, mechanical drilling, electroplating, first back drilling, first pipe burying, resin hole plugging, ceramic grinding, glue residue removing, second back drilling, second pipe burying, outer-layer circuit and the like.
The step 2 inner layer circuit specifically comprises the following steps:
(1) Pretreatment: cleaning the substrate by using a cleaning solution containing hydrogen peroxide, and coarsening the surfaces of the second copper foil layer 12 and the third copper foil layer 13 by using a sulfuric acid solution; cleaning the plate surface to remove attachments such as stains, oxides and the like; the copper surface can be roughened by microetching with sulfuric acid solution, the adhesive force with the dry film is increased, and the main chemical reaction is as follows: cu+H 2 O 2 →CuO+H 2 O；CuO+H 2 SO 4 →CuSO 4 +H 2 O；
(2) Pressing dry film: attaching photosensitive dry films to the surfaces of the second copper foil layer 12 and the third copper foil layer 13 in a hot pressing mode; a photosensitive dry film is pressed on the second copper foil layer 12 and the third copper foil layer 13 for subsequent image transfer, and after the dry film is heated, the dry film has fluidity and a certain filling property, and is attached to a board surface in a hot pressing mode by utilizing the characteristic;
(3) Exposure: polymerizing the photosensitive substance in the photosensitive dry film by using an LDI exposure machine, so that the designed pattern is transferred to the photosensitive dry film; an LDI exposure machine (Laser Direcl Imaging laser direct imaging) utilizes Ultraviolet (UV) energy to complete pattern transfer;
(4) Developing: saponification reaction of the developing solution and the unexposed dry film is utilized to remove the film; the exposed dry film does not react with the developer, and the development main chemical reaction: R-COOH+Na 2 CO 3 →R-COO-Na + +2NaHCO 3 ；
(5) Etching: spraying copper chloride liquid medicine on the copper surface through an etching machine, and etching the copper surface which is not protected by the dry film by utilizing chemical reaction of the liquid medicine and copper to form a circuit; the main chemical reaction: 3Cu+NaClO 3 +6HCl→3CuCl 2 +3H 2 O+NaCl；
(6) And (3) film removal: spraying NaOH or KOH liquid medicine on the board surface through a film removing machine, removing the dry film by utilizing the chemical reaction of the liquid medicine and the dry film, and completing the manufacture of the inner layer circuit to obtain the inner layer board with the inner layer circuit;
(7) AOI: the AOI system checks the inner layer line on the copper surface against the difference between the etched inner layer line and the original design line. AOI is Automatic Optical Inspection automated optical inspection), the Genesis system processes the CAM data of the original design line into reference data for inspection and outputs to the AOI system. The AOI system uses the optical principle to judge defects such as short circuit, circuit break, notch and the like by comparing the difference between the etched circuit and the designed circuit.
The step 3 of pressing specifically comprises the following steps:
(1) Pretreatment: acid washing: removing oxide on the surfaces of the second copper foil layer 12 and the third copper foil layer 13 by using sulfuric acid; cleaning: hydrolyzing the grease into small molecular substances which are easy to dissolve in water by using a cleaning agent; presoaking: pre-soaking the inner layer plate by using brown liquid; the pretreatment is for preparing the browning process; acid washing: the chemical reaction of sulfuric acid and CuO is utilized to remove oxides on the copper surface, and the main chemical reaction is as follows: cuO+H 2 SO 4 →CuSO 4 +H 2 O; cleaning by reaction of cleaning agent with oil and fat, and main chemical reaction is KOH+R 1 COOH→RNHCOR 1 +H 2 O; the presoaking makes the board have similar components to the browning liquid to prevent water from damaging the browning liquid;
(2) Brown chemical: the surface of the second copper foil layer 12 and the surface of the third copper foil layer 13 are subjected to brown treatment by brown treatment liquid, so that the surface of the copper is in an uneven surface shape, and the contact area of the copper surface and resin is increased; the brown oxide liquid is sulfuric acid and hydrogen peroxide, the sulfuric acid and the hydrogen peroxide are utilized to microetch the copper surface, and a layer of extremely thin, uniform and consistent organic metal conversion film is generated at the same time of microetching, and the main purpose of brown oxide is as follows: coarsening copper surface, increasing surface area contacted with PP sheet (pre preg prepreg is sheet material impregnated with resin and solidified to intermediate degree), improving adhesion with PP sheet, preventing delamination; the wettability of the copper surface and the flowing resin is increased; passivating the copper surface, and blocking the action of ammonia substances generated by polymerization and hardening of epoxy resin on the copper surface in the pressing plate process, wherein the ammonia substances attack the copper surface to generate water vapor, so that the explosion plate is caused; wherein the first insulating layer, the second insulating layer and the third insulating layer are all PP sheets;
(3) Overlapping: sequentially stacking the first copper foil layer 11, the first insulating layer 21, the inner layer board, the third insulating layer 23 and the fourth copper foil layer 14 together, wherein the first insulating layer 21 is pressed between the first copper foil layer and the second copper foil layer, and the third insulating layer 23 is pressed between the third copper foil layer and the fourth copper foil layer;
(4) Pressing: the first copper foil layer 11, the first insulating layer 21, the inner layer plate, the third insulating layer 23 and the fourth copper foil layer 14 are fused and bonded into a multi-layer plate under the high temperature and high pressure of a press;
(5) Post-treatment: drilling: imaging the multilayer board target by utilizing X-rays, and drilling a positioning hole and a fool-proof hole required by the subsequent process on the target by using a drill bit; edge milling: and cutting and removing redundant rim charge by using a milling machine.
The step 5 of electroplating specifically comprises the following steps:
(1) Removing glue residues: removing the gumming slag generated during drilling by using a plasma method; the multilayer plate runs at a high speed to generate high temperature, when the temperature exceeds the Tg point of the resin, the resin is softened or even gasified, the formed fluid can be smeared on the wall of the hole, and after cooling, glue residue paste (smear) is formed, so that a gap is formed between copper walls of an inner copper hole ring which is subsequently made, and therefore, before chemical copper (PTH), the formed glue residue is required to be removed, so that smooth adhesion of the chemical copper which is subsequently made Cheng Kongna is facilitated;
(2) Chemical copper: depositing a thin uniform chemical copper layer with conductivity in the hole through chemical action; namely, the original non-metallized hole wall is metallized, so that the subsequent smooth plating of electrochemical copper is facilitated;
(3) Electroplating copper: plating a layer of electroplated copper layer on the surface of the chemical copper layer in an electroplating mode. In the electroplating bath, the copper ion components in the solution are uniformly reduced on the copper surface and in the holes by using a mode of applying alternating current (cathode to obtain electronic copper plating and anode to lose electronic dissolved copper), so that the thickness of the copper layer is required by specifications.
The resin plug hole in the step 8 is specifically: the multilayer board is fixed on an air guide pad of a resin hole plugging machine table surface, the bottom surface of the multilayer board faces upwards, resin is plugged into the through holes 31, the resin plumpness in the through holes reaches 100-110%, and the specific technological parameters are as follows: the ink viscosity of the resin is 450-550dpa.s, the vacuum degree is 30-60pa, the thickness of the scraper is 15-30mm, the angle of the scraper is 2-5 degrees, the speed of the scraper is 15-30mm/s, the working environment temperature is normal temperature, and the baking conditions are as follows: and in the step 8, the ceramic grinding is performed for 40-60min at the temperature of 130-160 ℃, wherein the grinding machine is an eight-shaft grinding machine, and the grinding machine adopts a ceramic brush to wrap the non-woven fabric to grind the resin salient points.
The specific process parameters of the resin plug hole in the step 8 are as follows: the resin has the ink viscosity of 500dpa.s, the vacuum degree of 45pa, the doctor thickness of 25mm, the doctor angle of 3 degrees, the doctor speed of 10mm/s, the working environment temperature of 25 ℃, and the baking conditions of: the temperature is 150 ℃ and the time is 50min.
The step 12 of outer layer circuit specifically comprises the following steps:
(1) Pretreatment: cleaning the substrate by using a cleaning solution containing hydrogen peroxide, and coarsening the surfaces of the first copper foil layer 11 and the fourth copper foil layer 14 by using a sulfuric acid solution;
(2) Pressing dry film: attaching photosensitive dry films to the surfaces of the first copper foil layer 11 and the fourth copper foil layer 14 by using a hot pressing mode;
(3) Exposure: polymerizing the photosensitive substance in the photosensitive dry film by using an LDI exposure machine, so that the designed pattern is transferred to the photosensitive dry film;
(4) Developing: saponification reaction of the developing solution and the unexposed dry film is utilized to remove the film;
(5) Etching: spraying copper chloride liquid medicine on the copper surface through an etching machine, and etching the copper surface which is not protected by the dry film by utilizing chemical reaction of the liquid medicine and copper to form a circuit;
(6) Leg mold: spraying NaOH or KOH liquid medicine on the board surface through a film removing machine, removing the dry film by utilizing the chemical reaction of the liquid medicine and the dry film, and completing the manufacture of the circuit to obtain the multilayer board with the outer layer circuit;
(7) AOI: the AOI system checks the lines on the copper surface against the differences between the etched lines and the original design lines.
As shown in fig. 1, a high heat dissipation PCB is manufactured by the above manufacturing process, and includes a first copper foil layer 11, a first insulating layer 21, a second copper foil layer 12, a second insulating layer 22, a third copper foil layer 13, a third insulating layer 23 and a fourth copper foil layer 14, which are sequentially disposed, and a heat dissipation pipe 34 is embedded in the PCB.
It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the invention, which are all within the scope of the invention. Accordingly, the scope of protection of the present invention is to be determined by the appended claims.
Claims (8)
1. A manufacturing process of a high heat dissipation PCB is characterized in that: the method comprises the following steps:
step 1: cutting and baking: cutting a substrate into a certain size, and baking in an oven, wherein the substrate is a double-sided copper-clad substrate, the double-sided copper-clad substrate is provided with a second insulating layer (22), and a second copper foil layer (12) and a third copper foil layer (13) respectively pressed on the front side and the back side of the second insulating layer, and the baking conditions are as follows: the temperature is 122-148 ℃, and the baking time is 2-4 hours;
step 2: inner layer circuit: performing dry film pressing, exposure, development, etching and film stripping treatment on the second copper foil layer (12) and the third copper foil layer (13) on the substrate to obtain an inner layer plate with an inner layer circuit, and detecting the inner layer circuit by using an AOI system;
step 3: pressing: after the inner layer board obtained in the step 2 is subjected to pretreatment and browning, a first copper foil layer (11), a first insulating layer (21), the inner layer board, a third insulating layer (23) and a fourth copper foil layer (14) are laminated according to a designed laminated structure, the laminated first copper foil layer (11), the laminated first insulating layer (21), the laminated inner layer board, the laminated third insulating layer (23) and the laminated fourth copper foil layer (14) are pressed by a press machine to form a multi-layer board (10), and then the multi-layer board is subjected to target drilling treatment;
step 4: mechanical drilling: drilling via holes (31) for interlayer connection on the multilayer board (10) by using a drilling machine;
step 5: electroplating: removing glue residues, chemical copper and electroplating copper from the inside of the through hole (31) to obtain a multi-layer board (10) with inter-layer pattern circuits conducted with each other;
step 6: first back drilling: back drilling a preset via hole (31) from the first copper foil layer (11) to remove hole copper in the via hole and increase the diameter of the via hole, wherein part of the back drilled hole is used as a heat dissipation hole (32);
step 7: first time pipe burying: a radiating pipe (34) is embedded in a radiating hole (32) at the side of the first copper foil layer (11), two ends of the radiating pipe are respectively provided with a cooling end and a heat absorbing end, the heat absorbing end is embedded below the heating element, and the cooling end is exposed outside;
step 8: resin plug hole and ceramic grinding: filling the resin (33) into the conduction Kong Nasai to be plugged by using a resin plugging machine, baking the multilayer board after plugging to solidify the resin in the holes, and grinding the resin convex points on the baked board surface by using a grinder, wherein the resin in the holes is flush with the board surface after grinding;
step 9: removing glue residues: cleaning the surfaces of the first copper foil layer (11) and the fourth copper foil layer (14) by a plasma method to remove foreign matters and impurities on the plate surface and remove attachments on the plate surface;
step 10: and (3) backing drilling for the second time: back drilling a preset via hole (31) from a fourth copper foil layer (14) to remove hole copper in the via hole and increase the diameter of the via hole, wherein part of the back drilled hole is used as a heat dissipation hole (32);
step 11: and (3) pipe burying for the second time: a radiating pipe (34) is embedded in a radiating hole (32) of the fourth copper foil layer (14), two ends of the radiating pipe are respectively provided with a cooling end and a heat absorbing end, the heat absorbing end is embedded below the heating element, and the cooling end is exposed outside;
step 12: an outer layer circuit: performing dry film pressing, exposure, development, etching and film stripping treatment on the first copper foil layer (11) and the fourth copper foil layer (14) on the multilayer board to obtain a multilayer board with an outer layer circuit, and detecting the outer layer circuit by using an AOI system;
in the step 8, the resin plug holes specifically comprise: the multilayer board is fixed on an air guide base plate of a resin hole plugging machine table surface, the bottom surface of the multilayer board faces upwards, resin is plugged into a guide through hole (31), the resin plumpness in the guide through hole reaches 100-110%, and the specific technological parameters are as follows: the ink viscosity of the resin is 450-550dpa.s, the vacuum degree is 30-60pa, the thickness of the scraper is 15-30mm, the angle of the scraper is 2-5 degrees, the speed of the scraper is 15-30mm/s, the working environment temperature is normal temperature, and the baking conditions are as follows: and in the step 8, the ceramic grinding is performed for 40-60min at the temperature of 130-160 ℃, wherein the grinding machine is an eight-shaft grinding machine, and the grinding machine adopts a ceramic brush to wrap the non-woven fabric to grind the resin salient points.
2. The process for manufacturing a high heat dissipation PCB of claim 1, wherein: the step 2 inner layer circuit specifically comprises the following steps:
(1) Pretreatment: cleaning the substrate by using a cleaning solution containing hydrogen peroxide, and coarsening the surfaces of the second copper foil layer (12) and the third copper foil layer (13) by using a sulfuric acid solution;
(2) Pressing dry film: adhering a photosensitive dry film to the surfaces of the second copper foil layer (12) and the third copper foil layer (13) in a hot pressing mode;
(3) Exposure: polymerizing the photosensitive substance in the photosensitive dry film by using an LDI exposure machine, so that the designed pattern is transferred to the photosensitive dry film;
(4) Developing: saponification reaction of the developing solution and the unexposed dry film is utilized to remove the film;
(5) Etching: spraying copper chloride liquid medicine on the copper surface through an etching machine, and etching the copper surface which is not protected by the dry film by utilizing chemical reaction of the liquid medicine and copper to form a circuit; (6) film removal: spraying NaOH or KOH liquid medicine on the board surface through a film removing machine, removing the dry film by utilizing the chemical reaction of the liquid medicine and the dry film, and completing the manufacture of the inner layer circuit to obtain the inner layer board with the inner layer circuit;
(7) AOI: the AOI system checks the inner layer line on the copper surface against the difference between the etched inner layer line and the original design line.
3. The process for manufacturing a high heat dissipation PCB of claim 1, wherein: the step 3 of pressing specifically comprises the following steps:
(1) Pretreatment: acid washing: removing oxide on the surfaces of the second copper foil layer (12) and the third copper foil layer (13) by utilizing sulfuric acid; cleaning: hydrolyzing the grease into small molecular substances which are easy to dissolve in water by using a cleaning agent; presoaking: pre-soaking the inner layer plate by using brown liquid;
(2) Brown chemical: the surface of the second copper foil layer (12) and the surface of the third copper foil layer (13) are subjected to brown treatment by brown treatment liquid, so that the surface of copper forms an uneven surface shape, and the contact area of the copper surface and resin is increased;
(3) Overlapping: sequentially stacking a first copper foil layer (11), a first insulating layer (21), an inner layer plate, a third insulating layer (23) and a fourth copper foil layer (14), wherein the first insulating layer (21) is pressed between the first copper foil layer and the second copper foil layer, and the third insulating layer (23) is pressed between the third copper foil layer and the fourth copper foil layer;
(4) Pressing: the first copper foil layer (11), the first insulating layer (21), the inner layer board, the third insulating layer (23) and the fourth copper foil layer (14) are fused and bonded into a multi-layer board under the high temperature and the high pressure of a press;
(5) Post-treatment: drilling: imaging the multilayer board target by utilizing X-rays, and drilling a positioning hole and a fool-proof hole required by the subsequent process on the target by using a drill bit; edge milling: and cutting and removing redundant rim charge by using a milling machine.
4. The process for manufacturing a high heat dissipation PCB of claim 1, wherein: the step 5 of electroplating specifically comprises the following steps:
(1) Removing glue residues: removing the gumming slag generated during drilling by using a plasma method;
(2) Chemical copper: depositing a thin uniform chemical copper layer with conductivity in the hole through chemical action;
(3) Electroplating copper: plating a layer of electroplated copper layer on the surface of the chemical copper layer in an electroplating mode.
5. The process for manufacturing a high heat dissipation PCB of claim 1, wherein: the specific process parameters of the resin plug hole in the step 8 are as follows: the resin has the ink viscosity of 500dpa.s, the vacuum degree of 45pa, the doctor thickness of 25mm, the doctor angle of 3 degrees, the doctor speed of 10mm/s, the working environment temperature of 25 ℃, and the baking conditions of: the temperature is 150 ℃ and the time is 50min.
6. The process for manufacturing a high heat dissipation PCB of claim 1, wherein: the step 12 of outer layer circuit specifically comprises the following steps:
(1) Pretreatment: cleaning the substrate by using a cleaning solution containing hydrogen peroxide, and coarsening the surfaces of the first copper foil layer (11) and the fourth copper foil layer (14) by using a sulfuric acid solution;
(2) Pressing dry film: adhering photosensitive dry films to the surfaces of the first copper foil layer (11) and the fourth copper foil layer (14) in a hot pressing mode;
(3) Exposure: polymerizing the photosensitive substance in the photosensitive dry film by using an LDI exposure machine, so that the designed pattern is transferred to the photosensitive dry film;
(4) Developing: saponification reaction of the developing solution and the unexposed dry film is utilized to remove the film;
(5) Etching: spraying copper chloride liquid medicine on the copper surface through an etching machine, and etching the copper surface which is not protected by the dry film by utilizing chemical reaction of the liquid medicine and copper to form a circuit;
(6) Leg mold: spraying NaOH or KOH liquid medicine on the board surface through a film removing machine, removing the dry film by utilizing the chemical reaction of the liquid medicine and the dry film, and completing the manufacture of the circuit to obtain the multilayer board with the outer layer circuit;
(7) AOI: the AOI system checks the lines on the copper surface against the differences between the etched lines and the original design lines.
7. The utility model provides a high heat dissipation PCB which characterized in that: the high heat dissipation PCB is prepared by the manufacturing process as claimed in any one of claims 1 to 6.
8. The high heat dissipation PCB of claim 7, wherein: the PCB comprises a first copper foil layer (11), a first insulating layer (21), a second copper foil layer (12), a second insulating layer (22), a third copper foil layer (13), a third insulating layer (23) and a fourth copper foil layer (14) which are sequentially arranged, and a radiating pipe (34) is buried in the PCB.
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| CN115066112B (en) * | 2022-06-08 | 2023-09-12 | 深圳市星河电路股份有限公司 | Manufacturing method of PCB of high-voltage-resistant planar transformer |
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