CN107995769A - Pcb board with heat radiation structure design and preparation method thereof - Google Patents
Pcb board with heat radiation structure design and preparation method thereof Download PDFInfo
- Publication number
- CN107995769A CN107995769A CN201710988384.6A CN201710988384A CN107995769A CN 107995769 A CN107995769 A CN 107995769A CN 201710988384 A CN201710988384 A CN 201710988384A CN 107995769 A CN107995769 A CN 107995769A
- Authority
- CN
- China
- Prior art keywords
- heat conduction
- heat
- substrate
- copper foil
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000013461 design Methods 0.000 title claims abstract description 20
- 230000005855 radiation Effects 0.000 title claims abstract description 19
- 238000002360 preparation method Methods 0.000 title claims abstract description 9
- 229920005989 resin Polymers 0.000 claims abstract description 65
- 239000011347 resin Substances 0.000 claims abstract description 65
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 60
- 239000000758 substrate Substances 0.000 claims abstract description 60
- 239000011889 copper foil Substances 0.000 claims abstract description 50
- 210000002421 cell wall Anatomy 0.000 claims abstract description 5
- 239000000463 material Substances 0.000 claims description 5
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 238000003825 pressing Methods 0.000 claims description 2
- 238000010301 surface-oxidation reaction Methods 0.000 claims description 2
- 238000003780 insertion Methods 0.000 claims 1
- 230000037431 insertion Effects 0.000 claims 1
- 239000007787 solid Substances 0.000 claims 1
- 230000005540 biological transmission Effects 0.000 abstract description 4
- 230000009286 beneficial effect Effects 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 4
- -1 prepreg Substances 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000013517 stratification Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
Abstract
The invention discloses a kind of pcb board with heat radiation structure design and preparation method thereof.The pcb board with heat radiation structure design includes substrate, the both sides of the substrate are bonded with copper foil by prepreg, the substrate is provided through the through hole of substrate, the through hole both ends are extended to through prepreg and copper foil, heat-conducting resin is filled with the through hole of the substrate, prepreg and copper foil, the copper foil is provided with to be connected and diameter is more than the groove of through hole with through hole, and the heat-conducting resin is provided at both ends with the heat conduction limited block for being connected to groove cell wall.Beneficial effects of the present invention are：The pcb board can fix heat-conducting resin in through-holes, so as to stably carry out the transmission of heat.
Description
Technical field
The present invention relates to pcb board, more particularly to a kind of pcb board with heat radiation structure design and preparation method thereof.
Background technology
With the raising of the rate of information throughput and the increase of transinformation content, electronic product volume is less and less, integrates single
First distribution density is increasing, promotes the direction of PCB to high density, highly integrated, miniaturization and multiple stratification to develop.
The Chinese patent of Publication No. CN103369820A discloses one kind and possesses high density interconnection designs and radiator structure
Pcb board and preparation method thereof.The pcb board in PCB daughter boards, prepreg and copper foil by opening up through hole, through-hole alignment shape
Into after intercommunicating pore, heat-conducting resin or heat-conducting metal column are built into toward intercommunicating pore so that the copper foil conducting of both sides, so as to strengthen PCB
Plate integral heat sink.
But heat-conducting resin is generally fixed in through-holes by the bonding way of prepreg.And using in pcb board
Cheng Zhong, as heat-conducting resin persistently carries out the transmission of heat, prepreg can soften, and cause heat-conducting resin to be sent out in through-holes
Raw displacement, influences the transmission of heat, has much room for improvement.
The content of the invention
The object of the present invention is to provide a kind of pcb board with heat radiation structure design.The pcb board can consolidate heat-conducting resin
Determine in through-holes, so as to stably carry out the transmission of heat.
The present invention above-mentioned technical purpose technical scheme is that：
A kind of pcb board with heat radiation structure design, including substrate, the both sides of the substrate are bonded with copper by prepreg
Paper tinsel, the substrate are provided through the through hole of substrate, and the through hole both ends are extended to through prepreg and copper foil, the base
Be filled with heat-conducting resin in the through hole of plate, prepreg and copper foil, the copper foil is provided with connect and diameter is more than leading to through hole
The groove in hole, the heat-conducting resin are provided at both ends with the heat conduction limited block for being connected to groove cell wall.
By using above-mentioned technical proposal, because the diameter of groove is more than the diameter of through hole, and heat conduction limited block abuts
Be subject to the stop of groove slot bottom in the heat conduction limited block of groove cell wall, therefore substrate side and can not be another along through hole towards substrate
Move side.And heat conduction limited block is connected to the both ends of heat-conducting resin, therefore heat-conducting resin can not also be moved along through hole.
And heat-conducting resin can be fixed in through-holes, so as to stably carry out heat transfer.
The present invention is further arranged to：The both ends of the heat-conducting resin are connected with heat conduction connecting pole and heat conduction successively
Locating piece, the diameter of the heat conduction locating piece and heat-conducting resin are all higher than the diameter of heat conduction connecting pole, and the heat conduction limited block is set
The card hole being caught in for heat conduction connecting pole is equipped with, the heat conduction limited block is socketed by card hole and heat conduction connecting pole, described
The both sides of heat conduction limited block are abutted with heat-conducting resin and heat conduction locating piece respectively.
By using above-mentioned technical proposal, heat conduction limited block is socketed with heat conduction connecting pole, and the both sides of heat conduction limited block point
Do not abut with heat-conducting resin and heat conduction locating piece, so that heat-conducting resin and heat conduction locating piece can limit heat conduction limited block, avoid
Heat conduction limited block departs from heat-conducting resin.
The present invention is further arranged to：The heat conduction limited block, heat conduction connecting pole, the material of heat conduction locating piece and heat-conducting resin
Matter is epoxy resin.
By using above-mentioned technical proposal, if heat conduction limited block, heat conduction connecting pole, the material of heat conduction locating piece and heat-conducting resin
Matter is different, then the thermal coefficient of expansion for generally resulting in heat conduction limited block, heat conduction connecting pole, heat conduction locating piece and heat-conducting resin is different.
Therefore, when heated, if the heated deformation that bigger can occur of heat conduction limited block, heat conduction limited block can lose heat conduction positioning
Block and heat-conducting resin it is spacing heat-conducting resin is fixed so that heat conduction limited block can depart from heat-conducting resin and lose.And
Heat conduction limited block, heat conduction connecting pole, the material all same of heat conduction locating piece and heat-conducting resin, therefore heat conduction limited block, heat conduction connect
It is identical with the thermal coefficient of expansion of heat-conducting resin to connect column, heat conduction locating piece, so as to avoid heat conduction limited block from departing from heat conduction
Heat-conducting resin is fixed in resin and losing.
The present invention is further arranged to：Diameter of the heat conduction locating piece away from one end of heat conduction limited block is connected with heat conduction
The diameter of column is equal, and the diameter of the heat conduction locating piece is from away from one end of heat conduction limited block to the one end for abutting heat conduction limited block
Become larger.
By using above-mentioned technical proposal, the diameter of heat conduction locating piece is from away from one end of heat conduction limited block to abutting heat conduction
One end of limited block becomes larger, therefore when heat conduction limited block is sleeved on the outside of heat conduction locating piece, heat conduction locating piece can be gradual
Guiding heat conduction limited block gradually deforms upon, consequently facilitating heat conduction locating piece is slowly caught in card hole.
The present invention is further arranged to：The heat conduction limited block is connected with heat conduction and covers block, and the heat conduction covers block
The limit hole for connecting with card hole and being caught in for heat conduction locating piece is provided with, the heat conduction limited block and heat conduction cover the thickness of block
The sum of it is equal with the groove depth of groove.
By using above-mentioned technical proposal, the setting that heat conduction covers block can enable whole groove fill and lead up, so as to
Keep the smooth of PCB surface.
The present invention is further arranged to：The side of the copper foil towards substrate is connected with multiple heat conduction convex blocks, multiple
The heat conduction convex block equidistantly distributed, the heat conduction convex block are abutted away from the one side of copper foil with substrate.
By using above-mentioned technical proposal, the setting of heat conduction convex block can strengthen the contact area of copper foil and substrate, so that
Strengthen the heat dissipation to substrate.
The present invention is further arranged to：The heat conduction convex block is prism-frustum-shaped, the side that the heat conduction convex block is abutted with substrate
Area is more than the side area being connected with copper foil.
By using above-mentioned technical proposal, prepreg is filled in the gap between heat conduction convex block, waits prepreg to solidify
Formed afterwards with the trapezoidal shape of heat conduction convex block complementation, be mutually clamped prepreg and heat conduction convex block, so as to strengthen substrate with
The binding ability of copper foil.
Another goal of the invention of the present invention is to provide a kind of preparation method of the above-mentioned pcb board with heat radiation structure design,
Include the following steps：
Step1：Take substrate, prepreg, copper foil, heat-conducting resin and limited block；
Step2：Coaxial isometrical through hole is opened up on substrate, prepreg, copper foil, Surface Oxygen is done to substrate and heat-conducting resin
Change is handled；
Step3：Substrate, prepreg and copper foil are stacked by the order of copper foil, prepreg, substrate, prepreg, copper foil,
The through hole of substrate, prepreg and copper foil connects at this time, and heat-conducting resin is inserted into through hole, makes prepreg soft by pressing
Change, flow into and full of the gap between heat conduction convex block, at this time, heat conduction convex block is bonded to form force fit plate with substrate；
Step4：Limited block is inserted in the end of heat-conducting resin.
By using above-mentioned technical proposal, the pcb board being prepared has heat radiation structure design, has good thermal diffusivity
Energy.
In conclusion the invention has the advantages that：
The diameter of heat conduction locating piece becomes larger from away from one end of heat conduction limited block to the one end for abutting heat conduction limited block, so that
The side of heat conduction locating piece is inclined-plane, on the one hand heat conduction limited block can be guided gradually to deform upon, consequently facilitating heat conduction positions
Block is slowly caught in card hole, while during heat-conducting resin is loaded through hole, is abutted using the side of heat conduction locating piece logical
Hole edge edge, can also guide heat-conducting resin to load through hole.
Brief description of the drawings
Fig. 1 is the structure diagram of substrate, prepreg and copper foil in embodiment；
Fig. 2 is the structure diagram of heat-conducting resin, heat conduction connecting pole and heat conduction locating piece in embodiment；
Fig. 3 is the structure diagram that heat conduction limited block and heat conduction cover block in embodiment；
Fig. 4 is the structure diagram of embodiment.
Reference numeral：1st, substrate；2nd, prepreg；3rd, copper foil；4th, heat conduction convex block；5th, through hole；6th, heat-conducting resin；7th, heat conduction
Connecting pole；8th, heat conduction locating piece；9th, groove；10th, heat conduction limited block；11st, card hole；12nd, heat conduction covers block；13rd, limit hole.
Embodiment
The present invention is described in further detail below in conjunction with attached drawing.
With reference to Fig. 1, a kind of pcb board with heat radiation structure design, including substrate 1.The both sides of substrate 1 pass through prepreg
2 are bonded with copper foil 3.The side of copper foil 3 towards substrate 1 is connected with the heat conduction convex block 4 of multiple equidistantly distributeds.Each heat conduction
Convex block 4 is abutted away from the one side of copper foil 3 with substrate 1.Each heat conduction convex block 4 is in prism-frustum-shaped and the side area being connected with substrate 1
More than the side area being connected with copper foil 3.The setting of heat conduction convex block 4 can strengthen the contact area of copper foil 3 and substrate 1, so that
Strengthen the heat dissipation to substrate 1.Meanwhile prepreg 2 can be filled in the gap between heat conduction convex block 4, prepreg 2 is waited to solidify
The trapezoidal shape complementary with heat conduction convex block 4 is formed afterwards, is mutually clamped prepreg 2 and heat conduction convex block 4, so as to strengthen substrate
1 and the binding ability of copper foil 3.
With reference to Fig. 2 and 4, substrate 1 is provided through the through hole 5 of substrate 1, and the both ends of through hole 5 are extended to through prepreg 2
With copper foil 3.Heat-conducting resin 6 is filled with the through hole 5 of substrate 1, prepreg 2 and copper foil 3.The both ends of heat-conducting resin 6 are successively
It is connected with heat conduction connecting pole 7 and heat conduction locating piece 8.Heat conduction locating piece 8 is round table-like, and heat conduction locating piece 8 connects away from heat conduction
Connect one end of column 7 diameter and heat conduction connecting pole 7 diameter it is equal, heat conduction locating piece 8 is straight close to one end of heat conduction connecting pole 7
The diameter of footpath and heat-conducting resin 6 is equal.And the diameter of heat conduction connecting pole 7 is less than the diameter of heat-conducting resin 6.Therefore, heat conduction positions
The diameter of block 8 becomes larger from away from one end of heat conduction limited block 10 to the one end for abutting heat conduction limited block 10, then when heat conduction limits
When position block 10 is sleeved on the outside of heat conduction locating piece 8, heat conduction locating piece 8 can gradually guide heat conduction limited block 10 that shape gradually occurs
Become, consequently facilitating heat conduction locating piece 8 is slowly caught in card hole 11.
With reference to Fig. 3 and 4, copper foil 3 is provided with to be connected and diameter is more than the groove 9 of through hole 5 with through hole 5.7 He of heat conduction connecting pole
Heat conduction locating piece 8 is located exactly in groove 9.Heat conduction connecting pole 7 is socketed with heat conduction limited block 10, and heat conduction limited block 10 is provided with
The card hole 11 being caught in for heat conduction connecting pole 7.The both sides of heat conduction limited block 10 respectively with heat-conducting resin 6 and heat conduction locating piece 8
Abut, so that heat-conducting resin 6 and heat conduction locating piece 8 can limit heat conduction limited block 10, avoid heat conduction limited block 10 from departing from heat conduction
Resin 6.Heat conduction limited block 10 is connected with heat conduction and covers block 12, and heat conduction covers block 12 and is provided with the limit connected with card hole 11
Position hole 13, and heat conduction locating piece 8 can be caught in limit hole 13.And heat conduction limited block 10 and heat conduction cover block 12 and are socketed in respectively
Behind 8 outside of heat conduction connecting pole 7 and heat conduction locating piece, heat conduction limited block 10 and heat conduction covering block 12 are close with the edge of groove 9
Abut, the sum of thickness of heat conduction limited block 10 and heat conduction covering block 12 is equal with the groove depth of groove 9.Heat conduction covers the setting of block 12
Whole groove 9 can be enable to fill and lead up, so as to keep the smooth of PCB surface.
Because the diameter of groove 9 is more than the diameter of through hole 5, and heat conduction limited block 10 is connected to 9 cell wall of groove, therefore base
The heat conduction limited block 10 of 1 side of plate is subject to the stop of 9 slot bottom of groove and can not be moved along through hole 5 towards 1 opposite side of substrate.And lead
Hot limited block 10 is connected to the both ends of heat-conducting resin 6 again, therefore heat-conducting resin 6 can not also be moved along through hole 5.And heat conduction
Resin 6 can be fixed in through hole 5, so as to stably carry out heat transfer.Heat conduction limited block 10, heat conduction connecting pole 7, lead
The material of hot locating piece 8 and heat-conducting resin 6 is epoxy resin, therefore heat conduction limited block 10, heat conduction connecting pole 7, heat conduction positioning
Block 8 is identical with the thermal coefficient of expansion of heat-conducting resin 6, so as to avoid heat conduction limited block 10 from departing from heat-conducting resin 6 and lose
Go that heat-conducting resin 6 is fixed.
A kind of preparation method of the PCB with heat radiation structure design, includes the following steps：
Step1：Take substrate 1, prepreg 2, copper foil 3, heat-conducting resin 6 and limited block；
Step2：Coaxial isometrical through hole 5 is opened up on substrate 1, prepreg 2, copper foil 3, substrate 1 and heat-conducting resin 6 are done
Surface oxidation treatment；
Step3：By substrate 1, prepreg 2 and copper foil 3 according to copper foil 3, prepreg 2, substrate 1, prepreg 2 copper foil 3
Order stacks, and the through hole 5 of substrate 1, prepreg 2 and copper foil 3 connects at this time, heat-conducting resin 6 is inserted into through hole 5, through overvoltage
The gap for making prepreg 2 soften, flow into and be full of between heat conduction convex block 4 is closed, at this time, heat conduction convex block 4 is bonded with substrate 1
Form force fit plate；
Step4：Limited block is inserted in the end of heat-conducting resin 6.
This specific embodiment is only explanation of the invention, it is not limitation of the present invention, people in the art
Member as needed can make the present embodiment the modification of no creative contribution after this specification is read, but as long as at this
All protected in the right of invention be subject to Patent Law.
Claims (8)
1. a kind of pcb board with heat radiation structure design, including substrate (1), the both sides of the substrate (1) pass through prepreg
(2) copper foil (3) is bonded with, the substrate (1) is provided through the through hole (5) of substrate (1), and through hole (5) both ends extend to
It is filled with and leads through prepreg (2) and copper foil (3), in the through hole (5) of the substrate (1), prepreg (2) and copper foil (3)
Hot resin (6), it is characterized in that：The copper foil (3) be provided with connected with through hole (5) and diameter be more than through hole (5) groove (9),
The heat-conducting resin (6) is provided at both ends with the heat conduction limited block (10) for being connected to groove (9) cell wall.
2. the pcb board according to claim 1 with heat radiation structure design, it is characterized in that：The two of the heat-conducting resin (6)
End is connected with heat conduction connecting pole (7) and heat conduction locating piece (8), the heat conduction locating piece (8) and heat-conducting resin (6) successively
Diameter be all higher than the diameters of heat conduction connecting pole (7), the heat conduction limited block (10) is provided with to be caught in for heat conduction connecting pole (7)
Card hole (11), the heat conduction limited block (10) is socketed by card hole (11) and heat conduction connecting pole (7), and the heat conduction is spacing
The both sides of block (10) are abutted with heat-conducting resin (6) and heat conduction locating piece (8) respectively.
3. the pcb board according to claim 2 with heat radiation structure design, it is characterized in that：The heat conduction limited block (10),
The material of heat conduction connecting pole (7), heat conduction locating piece (8) and heat-conducting resin (6) is epoxy resin.
4. the pcb board according to claim 3 with heat radiation structure design, it is characterized in that：Heat conduction locating piece (8) back of the body
It is equal from the diameter of one end of heat conduction limited block (10) and the diameter of heat conduction connecting pole (7), the diameter of the heat conduction locating piece (8)
Become larger from away from one end of heat conduction limited block (10) to the one end for abutting heat conduction limited block (10).
5. the pcb board according to claim 4 with heat radiation structure design, it is characterized in that：The heat conduction limited block (10)
It is connected with heat conduction and covers block (12), the heat conduction, which covers block (12) and is provided with to connect with card hole (11), is used for heat conduction positioning
The limit hole (13) that block (8) is caught in, the heat conduction limited block (10) and heat conduction cover the sum of thickness of block (12) and groove (9)
Groove depth is equal.
6. the pcb board according to claim 5 with heat radiation structure design, it is characterized in that：The copper foil (3) is towards substrate
(1) side is connected with multiple heat conduction convex blocks (4), multiple heat conduction convex block (4) equidistantly distributeds, the heat conduction convex block
(4) one side away from copper foil (3) is abutted with substrate (1).
7. the pcb board according to claim 6 with heat radiation structure design, it is characterized in that：The heat conduction convex block (4) is rib
Mesa-shaped, the heat conduction convex block (4) are more than the side area being connected with copper foil (3) with the side area that substrate (1) abuts.
8. a kind of preparation method of the pcb board as claimed in claim 7 with heat radiation structure design, it is characterized in that：Including such as
Lower step：
Step1：Take substrate (1), prepreg (2), copper foil (3), heat-conducting resin (6) and limited block；
Step2：Coaxial isometrical through hole (5) is opened up on substrate (1), prepreg (2), copper foil (3), to substrate (1) and
Heat-conducting resin (6) does surface oxidation treatment；
Step3：By substrate (1), prepreg (2) and copper foil (3) by copper foil (3), prepreg (2), substrate (1), semi-solid preparation
Piece (2), the order of copper foil (3) stack, and the through hole (5) of substrate (1), prepreg (2) and copper foil (3) connects at this time, toward through hole
(5) insertion heat-conducting resin (6) in, makes prepreg (2) softening by pressing, flows into and full of between heat conduction convex block (4)
Gap, at this time, heat conduction convex block (4) is bonded to form force fit plate with substrate (1)；
Step4：Limited block is inserted in the end of heat-conducting resin (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710988384.6A CN107995769B (en) | 2017-10-21 | 2017-10-21 | Pcb board and preparation method thereof with heat radiation structure design |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710988384.6A CN107995769B (en) | 2017-10-21 | 2017-10-21 | Pcb board and preparation method thereof with heat radiation structure design |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107995769A true CN107995769A (en) | 2018-05-04 |
| CN107995769B CN107995769B (en) | 2019-08-09 |
Family
ID=62029894
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710988384.6A Active CN107995769B (en) | 2017-10-21 | 2017-10-21 | Pcb board and preparation method thereof with heat radiation structure design |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107995769B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113473719A (en) * | 2021-07-06 | 2021-10-01 | 皆利士多层线路版(中山)有限公司 | Heat dissipation aluminum substrate and preparation method thereof |
| CN114190011A (en) * | 2021-11-11 | 2022-03-15 | 江苏普诺威电子股份有限公司 | High-heat-dissipation PCB and manufacturing process thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101848626A (en) * | 2009-03-27 | 2010-09-29 | 富准精密工业(深圳)有限公司 | Radiator and manufacturing method thereof |
| CN103369820A (en) * | 2013-07-25 | 2013-10-23 | 东莞生益电子有限公司 | PCB (printed circuit board) with high-density interconnection design and heat dissipation structure and manufacturing method thereof |
| CN206380162U (en) * | 2017-01-13 | 2017-08-04 | 东莞塘厦裕华电路板有限公司 | A kind of multi-layer PCB board |
-
2017
- 2017-10-21 CN CN201710988384.6A patent/CN107995769B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101848626A (en) * | 2009-03-27 | 2010-09-29 | 富准精密工业(深圳)有限公司 | Radiator and manufacturing method thereof |
| CN103369820A (en) * | 2013-07-25 | 2013-10-23 | 东莞生益电子有限公司 | PCB (printed circuit board) with high-density interconnection design and heat dissipation structure and manufacturing method thereof |
| CN206380162U (en) * | 2017-01-13 | 2017-08-04 | 东莞塘厦裕华电路板有限公司 | A kind of multi-layer PCB board |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113473719A (en) * | 2021-07-06 | 2021-10-01 | 皆利士多层线路版(中山)有限公司 | Heat dissipation aluminum substrate and preparation method thereof |
| CN114190011A (en) * | 2021-11-11 | 2022-03-15 | 江苏普诺威电子股份有限公司 | High-heat-dissipation PCB and manufacturing process thereof |
| CN114190011B (en) * | 2021-11-11 | 2024-02-23 | 江苏普诺威电子股份有限公司 | High-heat-dissipation PCB and manufacturing process thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107995769B (en) | 2019-08-09 |
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