CN206380162U - A kind of multi-layer PCB board - Google Patents
A kind of multi-layer PCB board Download PDFInfo
- Publication number
- CN206380162U CN206380162U CN201720038575.1U CN201720038575U CN206380162U CN 206380162 U CN206380162 U CN 206380162U CN 201720038575 U CN201720038575 U CN 201720038575U CN 206380162 U CN206380162 U CN 206380162U
- Authority
- CN
- China
- Prior art keywords
- substrate
- heat sink
- pcb board
- positioning
- layer pcb
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A kind of multi-layer PCB board, including plate body, the plate body is by the first substrate that sets gradually from top to bottom, second substrate and the 3rd substrate are constituted, the first substrate, second substrate and the 3rd substrate are provided with positioning through hole, the inwall of the positioning through hole is covered with felt pad, first substrate, it is connected between second substrate and the 3rd substrate by the positioning stud inserted in positioning through hole, upper netted heat sink is provided between first substrate and second substrate, netted heat sink is provided with down between second substrate and the 3rd substrate, netted heat sink netted heat sink with is compressing by carbon material on this, first substrate upper surface is provided with groove, bolt has head and bar portion, head is absorbed in the groove and locked, bar portion is downwards in inserting to the 3rd substrate.The utility model assembling is stable, and thermal diffusivity is good.
Description
Technical field
The utility model is related to a kind of pcb board, specifically a kind of multi-layer PCB board.
Background technology
As the height to power supply, signal etc. that the electronic product electrical characteristic in modern times is increasingly sophisticated and thus brings will
Ask, the number of plies of PCB plates is more and more.In the prior art, multi-layer PCB plate is generally fixed using welding or fastener,
But such a fixed form, metallic particles occurs unavoidably into the short circuit for causing PCB plates between circuit board, so that
PCB plates are scrapped, and then influence the yields of PCB plates.Moreover, multi-layer PCB board is due to overlaping, electronic component is in work
As when the heat that produces more concentrate, once heat is distributed not in time, it is unstable to be easily caused product quality, when serious very
Component can extremely be damaged.
The content of the invention
The technical problems to be solved in the utility model is to provide a kind of assembling stabilization, the good multi-layer PCB board of thermal diffusivity.
In order to solve the above-mentioned technical problem, the utility model takes following technical scheme：
A kind of multi-layer PCB board, including plate body, the plate body by the first substrate set gradually from top to bottom, second substrate and
3rd substrate is constituted, and the first substrate, second substrate and the 3rd substrate are provided with positioning through hole, and the inwall of the positioning through hole is pasted
Felt pad is covered with, the felt pad is provided with screw thread, it is logical into positioning by inserting between first substrate, second substrate and the 3rd substrate
Positioning stud in hole is connected, and the positioning stud is to be threadedly coupled with positioning through hole, between first substrate and second substrate
Provided with upper netted heat sink, netted heat sink is provided with down between second substrate and the 3rd substrate, netted heat sink and off line on this
Shape heat sink is compressing by carbon material, and first substrate upper surface is provided with groove, and bolt has head and bar portion, head
It is absorbed in the groove and locks, bar portion is downwards in inserting to the 3rd substrate, and in first substrate and second substrate, second substrate
Side join domain with the 3rd substrate is provided with gap slot position, and upper netted heat sink two side ends extend first substrate and second substrate
Gap slot position in, under netted heat sink two side ends extend in the gap slot position of second substrate and the 3rd substrate.
The groove madial wall of the first substrate is provided with rubber cushion.
Upper netted heat sink surface of netted heat sink with is also covered with graphite flake, is offered on the graphite flake logical
Hole.
The groove floor is provided with plain washer, and the head of bolt is mounted on the plain washer.
Connection pad is provided with the gap slot position, the connection pad thermal coupling has fin.
The heat abstractor is fin, and if the fin is provided with the side of dry plate, the fin and first substrate
Concordantly.
The fin stretches out and bent and the attachment of the side of plate body.
The utility model assembling is stable, it is ensured that short circuit phenomenon is not susceptible between each layer pcb board, and thermal diffusivity is good, really
Guarantor normally uses.
Brief description of the drawings
Accompanying drawing 1 is the utility model cross-sectional view；
Accompanying drawing 2 is enlarged diagram at A in accompanying drawing 1；
Accompanying drawing 3 is another embodiment schematic diagram of fin in the utility model.
Embodiment
For the ease of the understanding of those skilled in the art, the utility model will be further described below in conjunction with the accompanying drawings.
As shown in figure 1 and 2, the utility model discloses a kind of multi-layer PCB board, including plate body, the plate body from toward
Under the first substrate 3, the substrate 1 of second substrate 2 and the 3rd that set gradually constitute, the first substrate 3, second substrate 2 and the 3rd
Substrate 1 is provided with positioning through hole, and the inwall of the positioning through hole is covered with felt pad 4, and the felt pad 4 is provided with screw thread, the first base
It is connected between plate 3, the substrate 1 of second substrate 2 and the 3rd by the positioning stud 5 inserted in positioning through hole, the positioning spiral shell
Post 5, to be threadedly coupled, is provided with upper netted heat sink 5, the He of second substrate 2 with positioning through hole between first substrate 3 and second substrate 2
Netted heat sink 9 is provided with down between 3rd substrate 1, netted heat sink 8 netted heat sink 9 with is pressed into by carbon material on this
Type, the upper surface of first substrate 3 is provided with groove 6, and bolt has head 51 and bar portion 52, and head 51 is absorbed in the groove 6 simultaneously
Locking, bar portion 52 is downwards in inserting to the 3rd substrate 1, and in first substrate 3 and second substrate 2, the base of second substrate 2 and the 3rd
The side join domain of plate 1 is provided with gap slot position 11, and the upper netted two side ends of heat sink 8 extend lacking for first substrate and second substrate
In mouthful groove position, under netted heat sink two side ends extend in the gap slot position of second substrate and the 3rd substrate.By gap slot position,
Can cause netted heat sink and under netted heat sink preferably contacted with air, it is so as to realize radiating, heat is more preferable
Distribute.
The groove madial wall of first substrate is provided with rubber cushion, it is to avoid damage first substrate by pressure in the head of bolt.
Upper netted heat sink surface of netted heat sink with is also covered with graphite flake 7, is offered on the graphite flake
Through hole.Faster uniformly heat can be transferred out by graphite flake, because both sides breach groove and more air connect
Touch, therefore heat can be transmitted to gap slot position.
The groove floor is provided with plain washer, and the head of bolt is mounted on the plain washer.
Connection pad 10 is provided with the gap slot position 11, the thermal coupling of connection pad 10 has fin 12.Heat abstractor is fin,
And if the fin is provided with dry plate, the fin is concordant with the side of first substrate.Utilize fin.Or such as the institute of accompanying drawing 3
Show, fin stretches out and bent and the attachment of the side of plate body.Using fin, further increase heat-sinking capability.
It should be noted that described above is not the restriction to technical solutions of the utility model, this practicality is not being departed from
On the premise of new creation design, any obvious replacement is within protection domain of the present utility model.
Claims (7)
1. a kind of multi-layer PCB board, including plate body, the plate body is by the first substrate set gradually from top to bottom, second substrate and
Three substrates are constituted, it is characterised in that the first substrate, second substrate and the 3rd substrate are provided with positioning through hole, and the positioning is led to
The inwall in hole is covered with felt pad, and the felt pad is provided with screw thread, by inserting between first substrate, second substrate and the 3rd substrate
The positioning stud being fitted into positioning through hole is connected, and the positioning stud and positioning through hole is are threadedly coupled, first substrate and the
Upper netted heat sink is provided between two substrates, netted heat sink is provided with down between second substrate and the 3rd substrate, it is netted on this to dissipate
Hot plate netted heat sink with is compressing by carbon material, and first substrate upper surface is provided with groove, and bolt has head
And bar portion, head is absorbed in the groove and locked, in the downward inserting of bar portion to the 3rd substrate, and in first substrate and the second base
The side join domain of plate, second substrate and the 3rd substrate extends the first base provided with gap slot position, upper netted heat sink two side ends
In the gap slot position of plate and second substrate, under netted heat sink two side ends extend the gap slot position of second substrate and the 3rd substrate
It is interior.
2. multi-layer PCB board according to claim 1, it is characterised in that the groove madial wall of the first substrate is provided with glue
Pad.
3. multi-layer PCB board according to claim 2, it is characterised in that the upper netted heat sink netted heat sink with
Surface be also covered with graphite flake, offer through hole on the graphite flake.
4. multi-layer PCB board according to claim 3, it is characterised in that the groove floor is provided with plain washer, bolt
Head be mounted on the plain washer.
5. the multi-layer PCB board according to any one of claim 1-4, it is characterised in that be provided with and connect in the gap slot position
Pad, the connection pad thermal coupling has fin.
6. multi-layer PCB board according to claim 5, it is characterised in that the heat abstractor is fin, and the radiating
If piece is provided with dry plate, the fin is concordant with the side of first substrate.
7. multi-layer PCB board according to claim 5, it is characterised in that the fin stretches out and bent and plate
The side attachment of body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720038575.1U CN206380162U (en) | 2017-01-13 | 2017-01-13 | A kind of multi-layer PCB board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720038575.1U CN206380162U (en) | 2017-01-13 | 2017-01-13 | A kind of multi-layer PCB board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206380162U true CN206380162U (en) | 2017-08-04 |
Family
ID=59403672
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720038575.1U Expired - Fee Related CN206380162U (en) | 2017-01-13 | 2017-01-13 | A kind of multi-layer PCB board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206380162U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107995769A (en) * | 2017-10-21 | 2018-05-04 | 温州市正好电子有限公司 | Pcb board with heat radiation structure design and preparation method thereof |
-
2017
- 2017-01-13 CN CN201720038575.1U patent/CN206380162U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107995769A (en) * | 2017-10-21 | 2018-05-04 | 温州市正好电子有限公司 | Pcb board with heat radiation structure design and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170804 Termination date: 20210113 |