CN114190011A - High-heat-dissipation PCB and manufacturing process thereof - Google Patents
High-heat-dissipation PCB and manufacturing process thereof Download PDFInfo
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- CN114190011A CN114190011A CN202111334428.6A CN202111334428A CN114190011A CN 114190011 A CN114190011 A CN 114190011A CN 202111334428 A CN202111334428 A CN 202111334428A CN 114190011 A CN114190011 A CN 114190011A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 28
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 206
- 239000011889 copper foil Substances 0.000 claims abstract description 130
- 229920005989 resin Polymers 0.000 claims abstract description 50
- 239000011347 resin Substances 0.000 claims abstract description 50
- 238000005553 drilling Methods 0.000 claims abstract description 47
- 230000017525 heat dissipation Effects 0.000 claims abstract description 25
- 238000003825 pressing Methods 0.000 claims abstract description 19
- 238000009713 electroplating Methods 0.000 claims abstract description 17
- 239000003292 glue Substances 0.000 claims abstract description 14
- 238000000227 grinding Methods 0.000 claims abstract description 14
- 238000005520 cutting process Methods 0.000 claims abstract description 12
- 239000000919 ceramic Substances 0.000 claims abstract description 6
- 239000010410 layer Substances 0.000 claims description 265
- 229910052802 copper Inorganic materials 0.000 claims description 76
- 239000010949 copper Substances 0.000 claims description 76
- 239000007788 liquid Substances 0.000 claims description 33
- 239000000758 substrate Substances 0.000 claims description 29
- 238000005530 etching Methods 0.000 claims description 27
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 26
- 239000003814 drug Substances 0.000 claims description 24
- 238000000034 method Methods 0.000 claims description 22
- 239000000126 substance Substances 0.000 claims description 21
- 238000004140 cleaning Methods 0.000 claims description 20
- 238000006243 chemical reaction Methods 0.000 claims description 19
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 18
- 238000011282 treatment Methods 0.000 claims description 18
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims description 17
- 238000001816 cooling Methods 0.000 claims description 13
- 238000009413 insulation Methods 0.000 claims description 12
- 238000005507 spraying Methods 0.000 claims description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 9
- 238000013461 design Methods 0.000 claims description 8
- 238000012546 transfer Methods 0.000 claims description 8
- 238000011161 development Methods 0.000 claims description 7
- 238000007731 hot pressing Methods 0.000 claims description 7
- 238000006116 polymerization reaction Methods 0.000 claims description 7
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 claims description 6
- 239000011229 interlayer Substances 0.000 claims description 6
- 238000010030 laminating Methods 0.000 claims description 6
- 238000003801 milling Methods 0.000 claims description 6
- 238000007788 roughening Methods 0.000 claims description 6
- 238000007127 saponification reaction Methods 0.000 claims description 6
- 239000002253 acid Substances 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 5
- 238000007747 plating Methods 0.000 claims description 5
- 239000012459 cleaning agent Substances 0.000 claims description 4
- 239000004519 grease Substances 0.000 claims description 4
- 238000003384 imaging method Methods 0.000 claims description 4
- 238000002791 soaking Methods 0.000 claims description 4
- 238000005406 washing Methods 0.000 claims description 4
- 238000000151 deposition Methods 0.000 claims description 3
- 238000007598 dipping method Methods 0.000 claims description 3
- 230000003301 hydrolyzing effect Effects 0.000 claims description 3
- 239000012535 impurity Substances 0.000 claims description 3
- 238000000465 moulding Methods 0.000 claims description 3
- 238000007639 printing Methods 0.000 claims description 3
- 230000005855 radiation Effects 0.000 claims description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
- 229910021529 ammonia Inorganic materials 0.000 description 2
- 229910001431 copper ion Inorganic materials 0.000 description 2
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 2
- 229910000366 copper(II) sulfate Inorganic materials 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
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- 238000012545 processing Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- 230000026676 system process Effects 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
Abstract
The invention relates to a high-heat-dissipation PCB and a manufacturing process thereof, wherein the manufacturing process comprises the following steps: cutting and baking, inner layer circuit, pressing, mechanical drilling, electroplating, primary back drilling, primary pipe burying, resin hole plugging and ceramic grinding, removing glue residues, secondary back drilling, secondary pipe burying and outer layer circuit; the high-heat-dissipation PCB prepared by the manufacturing process comprises a first copper foil layer, a first insulating layer, a second copper foil layer, a second insulating layer, a third copper foil layer, a third insulating layer and a fourth copper foil layer which are sequentially arranged, and the PCB is embedded with a heat dissipation pipe. According to the invention, the radiating pipe is embedded in the PCB to increase the radiating area, so that when a product works, heat generated in the PCB can be rapidly radiated through the radiating pipe, the radiating speed is improved, and the working temperature of the product is reduced.
Description
Technical Field
The invention relates to PCB manufacturing, in particular to a high-heat-dissipation PCB and a manufacturing process thereof.
Background
Pcb (printed Circuit board), which is called printed Circuit board in chinese, is an important electronic component as a support for electronic components. As the design of the PCB is more and more complex, the functions it undertakes are more and more, and the components mounted on the surface of the PCB are more and more. The existing PCB parts are assembled, and then run at high speed, so that the PCB and the parts generate high heat state, and the quality and the reliability are influenced due to the fact that the PCB is cracked when the heat dissipation of the PCB is not in time.
Disclosure of Invention
In order to overcome the defects, the invention provides a manufacturing process of a high-heat-dissipation PCB, in the manufacturing process, a heat dissipation pipe is pre-buried in the PCB, and heat generated in the PCB can be quickly dissipated through the heat dissipation pipe, so that the heat dissipation speed is improved, and the working temperature of a product is reduced.
The technical scheme adopted by the invention for solving the technical problem is as follows:
a manufacturing process of a high-heat-dissipation PCB comprises the following steps:
step 1: cutting and baking: cutting a substrate into a certain size, and baking the substrate in an oven, wherein the substrate is a double-sided copper-clad substrate, and the double-sided copper-clad substrate is provided with a second insulation layer, and a second copper foil layer and a third copper foil layer which are respectively laminated on the front side and the back side of the second insulation layer;
step 2: inner layer circuit: carrying out dry film pressing, exposure, development, etching and film removing treatment on the second copper foil layer and the third copper foil layer on the substrate to obtain an inner layer plate with an inner layer circuit, and detecting the inner layer circuit by utilizing an AOI system;
and step 3: and (3) laminating: after the inner layer board obtained in the step 2 is subjected to pretreatment and browning, the first copper foil layer, the first insulating layer, the inner layer board, the third insulating layer and the fourth copper foil layer are overlapped according to a designed laminated structure, the overlapped first copper foil layer, the first insulating layer, the inner layer board, the third insulating layer and the fourth copper foil layer are pressed by a press to form a multilayer board, and then the multilayer board is subjected to target drilling treatment;
and 4, step 4: mechanical drilling: drilling a through hole for interlayer connection on the multilayer board by using a drilling machine;
and 5: electroplating: carrying out degumming residue, chemical copper and electrolytic copper treatment on the through hole to obtain a multilayer board with interlayer pattern circuits mutually communicated;
step 6: back drilling for the first time: back drilling a preset conducting hole from the first copper foil layer to remove hole copper in the conducting hole and increase the diameter of the conducting hole, wherein part of the back drilled hole is used as a heat radiation hole;
and 7: burying the pipe for the first time: embedding a radiating pipe in a radiating hole on the side of the first copper foil layer, wherein two ends of the radiating pipe are respectively a cooling end and a heat absorption end, the heat absorption end is embedded below the heating element, and the cooling end is exposed outside;
and 8: resin hole plugging and ceramic grinding: filling resin into the through hole to be plugged by using a resin plugging machine, baking the multilayer board after plugging the hole to solidify the resin in the hole, grinding the resin salient points on the baked board surface by using a grinding machine, and leveling the resin in the hole with the board surface after grinding;
and step 9: removing glue residues: cleaning the surfaces of the first copper foil layer and the fourth copper foil layer by a plasma method to remove foreign matters and impurities on the board surface and remove attachments on the board surface;
step 10: and (3) back drilling for the second time: back drilling a preset conducting hole from the fourth copper foil layer, so that hole copper in the conducting hole is removed, the diameter of the conducting hole is increased, and part of the back-drilled hole is used as a heat dissipation hole;
step 11: burying the pipe for the second time: embedding a radiating pipe in a radiating hole of the fourth copper foil layer, wherein two ends of the radiating pipe are respectively a cooling end and a heat absorption end, the heat absorption end is embedded below the heating element, and the cooling end is exposed outside;
step 12: outer layer circuit: and carrying out dry film pressing, exposure, development, etching and film removing treatment on the first copper foil layer and the fourth copper foil layer on the multilayer board to obtain the multilayer board with an outer layer circuit, and detecting the outer layer circuit by utilizing an AOI system.
Preferably, the step 2 inner layer circuit specifically includes the following steps:
(1) pretreatment: cleaning the substrate by using a cleaning solution containing hydrogen peroxide, and roughening the surfaces of the second copper foil layer and the third copper foil layer by using a sulfuric acid solution;
(2) pressing a dry film: attaching the photosensitive dry film to the surfaces of the second copper foil layer and the third copper foil layer in a hot pressing mode;
(3) exposure: carrying out polymerization reaction on the photosensitive substance in the photosensitive dry film by using an LDI exposure machine so as to transfer the designed pattern to the photosensitive dry film;
(4) and (3) developing: removing the unexposed dry film by saponification reaction of the developing solution and the unexposed dry film;
(5) etching: spraying a copper chloride liquid medicine on the copper surface through an etching machine, and etching the copper surface which is not protected by the dry film by utilizing the chemical reaction of the liquid medicine and the copper to form a circuit;
(6) film stripping: spraying NaOH or KOH liquid medicine on the board surface through a film removing machine, removing the dry film by utilizing the chemical reaction of the liquid medicine and the dry film, and finishing the manufacture of the inner layer circuit to obtain an inner layer board with the inner layer circuit;
(7) AOI: the AOI system examines the inner layer lines on the copper surface against the differences between the etched inner layer lines and the original design lines.
Preferably, the step 3 of pressing specifically comprises the following steps:
(1) pretreatment: acid washing: removing oxides on the surfaces of the second copper foil layer and the third copper foil layer by using sulfuric acid; cleaning: hydrolyzing the grease into small molecular substances which are easily dissolved in water by using a cleaning agent; pre-dipping: pre-soaking the inner-layer plate by using a browning liquid;
(2) browning: browning treatment is carried out on the surfaces of the second copper foil layer and the third copper foil layer by using a browning liquid, so that the surface of copper is in an uneven surface shape, and the contact area between the copper surface and resin is increased;
(3) and (3) superposition: the first copper foil layer, the first insulating layer, the inner layer plate, the third insulating layer and the fourth copper foil layer are sequentially overlapped together, the first insulating layer is pressed between the first copper foil layer and the second copper foil layer, and the third insulating layer is pressed between the third copper foil layer and the fourth copper foil layer;
(4) and (3) laminating: fusing and bonding the first copper foil layer, the first insulating layer, the inner layer plate, the third insulating layer and the fourth copper foil layer into a multilayer plate under high temperature and high pressure of a press;
(5) and (3) post-treatment: drilling a target: imaging the target of the multilayer board by using X-rays, and drilling a positioning hole and a fool-proof hole required by the subsequent process on the target by using a drill bit; edge milling: and cutting and removing the redundant rim charge by using a milling machine.
Preferably, the step 5 electroplating specifically comprises the following steps:
(1) removing glue residues: removing the glue residue generated in drilling by using a plasma method;
(2) chemical copper: depositing a thin uniform and conductive electroless copper layer in the hole by chemical action;
(3) copper electroplating: and plating a layer of electroplated copper layer on the surface of the electroless copper layer in an electroplating way.
Preferably, in the step 8, the resin plug holes are specifically: the multilayer board is fixed on an air guide base plate of a table top of a resin hole plugging machine, the bottom surface of the multilayer board faces upwards, resin is plugged into the through hole, the resin plumpness in the through hole reaches 100-110%, and the specific technological parameters are as follows: the printing ink viscosity of the resin is 450-550dpa.s, the vacuum degree is 30-60pa, the scraper thickness is 15-30mm, the scraper angle is 2-5 degrees, the scraper speed is 15-30mm/s, the working environment temperature is normal temperature, and the baking conditions are as follows: the temperature is 130-.
Preferably, the specific process parameters of resin plug holes in the step 8 are as follows: the resin has an ink viscosity of 500dpa.s, a vacuum degree of 45pa, a scraper thickness of 25mm, a scraper angle of 3 degrees, a scraper speed of 10mm/s, a working environment temperature of 25 ℃, and baking conditions of: the temperature is 150 deg.C, and the time is 50 min.
Preferably, the step 12 of outer layer circuit specifically includes the following steps:
(1) pretreatment: cleaning the substrate by using a cleaning solution containing hydrogen peroxide, and roughening the surfaces of the first copper foil layer and the fourth copper foil layer by using a sulfuric acid solution;
(2) pressing a dry film: attaching the photosensitive dry film to the surfaces of the first copper foil layer and the fourth copper foil layer in a hot pressing mode;
(3) exposure: carrying out polymerization reaction on the photosensitive substance in the photosensitive dry film by using an LDI exposure machine so as to transfer the designed pattern to the photosensitive dry film;
(4) and (3) developing: removing the unexposed dry film by saponification reaction of the developing solution and the unexposed dry film;
(5) etching: spraying a copper chloride liquid medicine on the copper surface through an etching machine, and etching the copper surface which is not protected by the dry film by utilizing the chemical reaction of the liquid medicine and the copper to form a circuit;
(6) leg molding: spraying NaOH or KOH liquid medicine on the board surface through a film removing machine, removing the dry film by utilizing the chemical reaction of the liquid medicine and the dry film, and finishing the manufacturing of the circuit to obtain the multilayer board with the outer layer circuit;
(7) AOI: the AOI system examines the lines on the copper surface against the differences between the etched lines and the original design lines.
The invention also provides a high-heat-dissipation PCB which is prepared by adopting the manufacturing process.
Preferably, the high heat dissipation PCB includes a first copper foil layer, a first insulation layer, a second copper foil layer, a second insulation layer, a third copper foil layer, a third insulation layer and a fourth copper foil layer which are sequentially disposed, and the PCB is embedded with the heat dissipation tube.
The invention has the beneficial effects that: according to the invention, the PCB with high heat dissipation is manufactured through a series of processes of cutting and baking, inner layer circuit, pressing, mechanical drilling, electroplating, first back drilling, first pipe burying, resin hole plugging, ceramic grinding, glue residue removing, second back drilling, second pipe burying, outer layer circuit and the like.
Drawings
FIG. 1 is a schematic structural diagram of a high heat dissipation PCB according to the present invention;
FIG. 2 is a schematic view of a substrate according to the present invention;
FIG. 3 is a schematic view of the structure of the multi-layer sheet of the present invention;
FIG. 4 is a schematic diagram of the structure of the multi-layer board of the present invention after drilling;
FIG. 5 is a schematic diagram of the structure of the multi-layer board of the present invention after electroplating;
FIG. 6 is a schematic view of the structure of the multi-layer board of the present invention after the first back drilling;
FIG. 7 is a schematic structural view of a multilayer board of the present invention after the first pipe burying;
FIG. 8 is a schematic view of the structure of the multi-layer board of the present invention after plugging the holes;
FIG. 9 is a schematic view of the structure of the multi-layer board of the present invention after the second back drilling;
in the figure: 10-multilayer board, 11-first copper foil layer, 12-second copper foil layer, 13-third copper foil layer, 14-fourth copper foil layer, 21-first insulating layer, 22-second insulating layer, 23-third insulating layer, 31-via hole, 32-heat dissipation hole, 33-resin and 34-heat dissipation pipe.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that the terms "first," "second," and the like in the description and claims of this application and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the application described herein are, for example, capable of operation in sequences other than those illustrated or otherwise described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
Spatially relative terms, such as "above … …," "above … …," "above … …," "above," and the like, may be used herein for ease of description to describe one device or feature's spatial relationship to another device or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if a device in the figures is turned over, devices described as "above" or "on" other devices or configurations would then be oriented "below" or "under" the other devices or configurations. Thus, the exemplary term "above … …" can include both an orientation of "above … …" and "below … …". The device may be otherwise variously oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
Example (b): a manufacturing process of a high-heat-dissipation PCB comprises the following steps:
step 1: cutting and baking: as shown in fig. 2, the substrate is cut into a certain size and is placed in an oven for baking, the substrate is a double-sided copper-clad substrate, and the double-sided copper-clad substrate has a second insulation layer 22, and a second copper foil layer 12 and a third copper foil layer 13 laminated on the front and back sides of the second insulation layer respectively; the purpose of cutting is to facilitate subsequent equipment processing; the baking conditions were: the temperature is 122-148 ℃, and the baking time is 2-4 h; baking the substrate to eliminate the stress of the substrate and prevent the substrate from warping, so that the dimensional stability of the substrate is improved, and the expansion and shrinkage of the substrate are reduced;
step 2: inner layer circuit: carrying out dry film pressing, exposure, development, etching and film removing treatment on the second copper foil layer 12 and the third copper foil layer 13 on the substrate to obtain an inner layer plate with an inner layer circuit, and detecting the inner layer circuit by utilizing an AOI system;
and step 3: and (3) laminating: after the inner layer board obtained in the step 2 is subjected to pretreatment and browning, the first copper foil layer 11, the first insulating layer 21, the inner layer board, the third insulating layer 23 and the fourth copper foil layer 14 are overlapped according to a designed laminated structure, the overlapped first copper foil layer 11, the first insulating layer 21, the inner layer board, the third insulating layer 23 and the fourth copper foil layer 14 are pressed by a press to form a multilayer board 10 (as shown in fig. 3), and then the multilayer board is subjected to target drilling treatment;
and 4, step 4: mechanical drilling: as shown in fig. 4, via holes 31 for interlayer connection are drilled in the multilayer board 10 using a drill;
and 5: electroplating: as shown in fig. 5, desmear, electroless copper and electrolytic copper treatments are performed in the via hole 31, thereby obtaining a multilayer board 10 in which the interlayer pattern lines are mutually conducted;
step 6: back drilling for the first time: as shown in fig. 6, a predetermined via hole 31 is back-drilled from the first copper foil layer 11, so that the hole copper in the via hole is removed and the diameter of the via hole is increased, and a part of the back-drilled hole serves as a heat dissipation hole 32; the back drilling is used for removing redundant hole copper in the via hole to improve the transmission speed of signals, the CAM processes back hole data into working data which can be used by a drilling machine, the drilling machine reads a program and then performs drilling processing on the back drilled hole required by the corresponding coordinate to eliminate the hole copper, and meanwhile, the hole diameter is increased to be used as a heat dissipation hole 32;
and 7: burying the pipe for the first time: as shown in fig. 7, a radiating pipe 34 is embedded in the radiating hole 32 at the first copper foil layer 11 side, and both ends of the radiating pipe are a cooling end and a heat absorbing end, respectively, the heat absorbing end is embedded under the heating element, and the cooling end is exposed to the outside; the embedded radiating pipe 34 can timely radiate heat generated by the PCB during operation so as to ensure the normal operation of the electronic product;
and 8: resin hole plugging and ceramic grinding: as shown in fig. 8, filling resin 33 into the through hole to be plugged by using a resin plugging machine, baking the multilayer board after plugging the through hole to solidify the resin in the through hole, grinding the resin bumps on the surface of the baked board by using a grinder, wherein the resin in the through hole is flush with the surface of the board after grinding;
and step 9: removing glue residues: cleaning the surfaces of the first copper foil layer 11 and the fourth copper foil layer 14 by using a plasma method to remove foreign matters and impurities on the board surface and remove attachments on the board surface;
step 10: and (3) back drilling for the second time: as shown in fig. 9, a predetermined via hole 31 is back-drilled from the fourth copper foil layer 14, so that the hole copper in the via hole is removed and the diameter of the via hole is increased, and a part of the back-drilled hole serves as a heat dissipation hole 32;
step 11: burying the pipe for the second time: as shown in fig. 1, a heat dissipating pipe 34 is embedded in the heat dissipating hole 32 of the fourth copper foil layer 14, and both ends of the heat dissipating pipe are a cooling end and a heat absorbing end, respectively, the heat absorbing end is embedded under the heat generating element, and the cooling end is exposed to the outside;
step 12: outer layer circuit: and carrying out dry film pressing, exposure, development, etching and film removing treatment on the first copper foil layer 11 and the fourth copper foil layer 14 on the multilayer board to obtain the multilayer board with an outer layer circuit, and detecting the outer layer circuit by utilizing an AOI system.
According to the invention, the PCB with high heat dissipation is manufactured through a series of processes of cutting and baking, inner layer circuit, pressing, mechanical drilling, electroplating, first back drilling, first pipe burying, resin hole plugging, ceramic grinding, glue residue removing, second back drilling, second pipe burying, outer layer circuit and the like.
The step 2 of the inner layer circuit specifically comprises the following steps:
(1) pretreatment: cleaning the substrate by using a cleaning solution containing hydrogen peroxide, and roughening the surfaces of the second copper foil layer 12 and the third copper foil layer 13 by using a sulfuric acid solution; cleaning the board surface to remove attachments such as stains, oxides and the like on the board surface; the copper surface can be coarsened by using sulfuric acid solution micro-etching, the adhesive force with a dry film is increased, and the main chemical reaction is as follows: cu + H2O2→CuO+H2O；CuO+H2SO4→CuSO4+H2O；
(2) Pressing a dry film: attaching the photosensitive dry film to the surfaces of the second copper foil layer 12 and the third copper foil layer 13 by using a hot pressing mode; a layer of photosensitive dry film is laminated on the second copper foil layer 12 and the third copper foil layer 13 and is used for subsequent image transfer, and when the dry film is heated, the dry film has fluidity and certain filling property, and is attached to the plate surface in a hot pressing mode by utilizing the characteristic;
(3) exposure: carrying out polymerization reaction on the photosensitive substance in the photosensitive dry film by using an LDI exposure machine so as to transfer the designed pattern to the photosensitive dry film; an LDI exposure machine (Laser direct Imaging) completes pattern transfer by using the energy of Ultraviolet (UV);
(4) and (3) developing: removing the unexposed dry film by saponification reaction of the developing solution and the unexposed dry film; the exposed dry film does not react with the developer, and the development mainly has a chemical reaction: R-COOH + Na2CO3→R-COO-Na++2NaHCO3；
(5) Etching: spraying a copper chloride liquid medicine on the copper surface through an etching machine, and etching the copper surface which is not protected by the dry film by utilizing the chemical reaction of the liquid medicine and the copper to form a circuit; the main chemical reactions are as follows: 3Cu + NaClO3+6HCl→3CuCl2+3H2O+NaCl；
(6) Film stripping: spraying NaOH or KOH liquid medicine on the board surface through a film removing machine, removing the dry film by utilizing the chemical reaction of the liquid medicine and the dry film, and finishing the manufacture of the inner layer circuit to obtain an inner layer board with the inner layer circuit;
(7) AOI: the AOI system examines the inner layer lines on the copper surface against the differences between the etched inner layer lines and the original design lines. AOI is Automatic Optical Inspection), the Genesis system processes CAM data of an original design line into reference data for detection, and outputs the reference data to the AOI system. The AOI system uses the optical principle to judge the defects of short circuit, open circuit, gap and the like by contrasting the difference between the etched circuit and the designed circuit.
The step 3 of pressing specifically comprises the following steps:
(1) pretreatment: acid washing: by using sulfurRemoving oxides on the surfaces of the second copper foil layer 12 and the third copper foil layer 13 by acid; cleaning: hydrolyzing the grease into small molecular substances which are easily dissolved in water by using a cleaning agent; pre-dipping: pre-soaking the inner-layer plate by using a browning liquid; the pretreatment is to prepare for a browning process; acid washing: the chemical reaction of sulfuric acid and CuO is utilized to remove the oxide on the copper surface, and the main chemical reaction is as follows: CuO + H2SO4→CuSO4+H2O; cleaning, namely, the cleaning agent reacts with grease, and the main chemical reaction is KOH + R1COOH→RNHCOR1+H2O; the pre-soaking enables the plate surface to have components similar to those of the browning liquid, and prevents water from damaging the browning liquid;
(2) browning: browning treatment is carried out on the surfaces of the second copper foil layer 12 and the third copper foil layer 13 by using a browning liquid, so that the copper surface forms an uneven surface shape, and the contact area between the copper surface and resin is increased; the browning liquid is sulfuric acid and hydrogen peroxide, the sulfuric acid and the hydrogen peroxide are utilized to carry out micro-etching on the copper surface, an extremely thin and uniform organic metal conversion film is generated while the micro-etching is carried out, and the main purpose of the browning is as follows: coarsening the copper surface, increasing the surface area in contact with the PP sheet (the prepreg is a sheet material which is impregnated with resin and cured to a middle degree), improving the adhesion with the PP sheet, and preventing delamination; the wettability of the copper surface and the flowing resin is increased; the copper surface is passivated, the action of ammonia substances generated by polymerization and hardening of epoxy resin on the copper surface in the pressing process is blocked, and the ammonia substances attack the copper surface to generate water vapor, so that the plate is exploded; the first insulating layer, the second insulating layer and the third insulating layer are all PP sheets;
(3) and (3) superposition: sequentially overlapping a first copper foil layer 11, a first insulating layer 21, an inner layer plate, a third insulating layer 23 and a fourth copper foil layer 14, wherein the first insulating layer 21 is pressed between the first copper foil layer and the second copper foil layer, and the third insulating layer 23 is pressed between the third copper foil layer and the fourth copper foil layer;
(4) and (3) laminating: fusing and bonding the first copper foil layer 11, the first insulating layer 21, the inner layer plate, the third insulating layer 23 and the fourth copper foil layer 14 into a multilayer plate under high temperature and high pressure of a press;
(5) and (3) post-treatment: drilling a target: imaging the target of the multilayer board by using X-rays, and drilling a positioning hole and a fool-proof hole required by the subsequent process on the target by using a drill bit; edge milling: and cutting and removing the redundant rim charge by using a milling machine.
The step 5 of electroplating specifically comprises the following steps:
(1) removing glue residues: removing the glue residue generated in drilling by using a plasma method; the multilayer board generates high temperature when the drilling needle of the drilling hole runs at high speed, when the temperature exceeds the Tg point of the resin, the resin is in a softened or even gasified state, the hole wall can be coated with the formed fluid, and glue residue paste (smear) is formed after cooling, so that a gap is formed between copper walls manufactured subsequently by an inner layer copper hole ring, and therefore the formed glue residue is required to be removed before chemical copper (PTH) so as to be beneficial to the smooth adhesion of the chemical copper in the hole in the subsequent manufacturing process;
(2) chemical copper: depositing a thin uniform and conductive electroless copper layer in the hole by chemical action; namely, the original non-metallized hole wall is metallized, so as to be beneficial to the smooth plating of subsequent electrochemical copper;
(3) copper electroplating: and plating a layer of electroplated copper layer on the surface of the electroless copper layer in an electroplating way. In the electroplating bath, the copper ion components in the solution are uniformly reduced on the copper surface and in the holes by applying alternating current (the cathode is used for plating copper, and the anode is used for dissolving copper), so that the copper ion components reach the copper layer thickness required by the specification.
In the step 8, the resin hole plugging specifically comprises the following steps: fixing the multilayer board on an air guide cushion plate on the table top of a resin hole plugging machine, enabling the bottom surface of the multilayer board to face upwards, plugging resin into the guide through hole 31, enabling the resin plumpness in the guide through hole to reach 100-110%, and adopting the following specific technological parameters: the printing ink viscosity of the resin is 450-550dpa.s, the vacuum degree is 30-60pa, the scraper thickness is 15-30mm, the scraper angle is 2-5 degrees, the scraper speed is 15-30mm/s, the working environment temperature is normal temperature, and the baking conditions are as follows: the temperature is 130-.
The concrete process parameters of resin hole plugging in the step 8 are as follows: the resin has an ink viscosity of 500dpa.s, a vacuum degree of 45pa, a scraper thickness of 25mm, a scraper angle of 3 degrees, a scraper speed of 10mm/s, a working environment temperature of 25 ℃, and baking conditions of: the temperature is 150 deg.C, and the time is 50 min.
The step 12 of the outer layer circuit specifically comprises the following steps:
(1) pretreatment: cleaning the substrate by using a cleaning solution containing hydrogen peroxide, and roughening the surfaces of the first copper foil layer 11 and the fourth copper foil layer 14 by using a sulfuric acid solution;
(2) pressing a dry film: attaching the photosensitive dry film to the surfaces of the first copper foil layer 11 and the fourth copper foil layer 14 by using a hot pressing mode;
(3) exposure: carrying out polymerization reaction on the photosensitive substance in the photosensitive dry film by using an LDI exposure machine so as to transfer the designed pattern to the photosensitive dry film;
(4) and (3) developing: removing the unexposed dry film by saponification reaction of the developing solution and the unexposed dry film;
(5) etching: spraying a copper chloride liquid medicine on the copper surface through an etching machine, and etching the copper surface which is not protected by the dry film by utilizing the chemical reaction of the liquid medicine and the copper to form a circuit;
(6) leg molding: spraying NaOH or KOH liquid medicine on the board surface through a film removing machine, removing the dry film by utilizing the chemical reaction of the liquid medicine and the dry film, and finishing the manufacturing of the circuit to obtain the multilayer board with the outer layer circuit;
(7) AOI: the AOI system examines the lines on the copper surface against the differences between the etched lines and the original design lines.
As shown in fig. 1, a high heat dissipation PCB is prepared by the above manufacturing process, and includes a first copper foil layer 11, a first insulation layer 21, a second copper foil layer 12, a second insulation layer 22, a third copper foil layer 13, a third insulation layer 23, and a fourth copper foil layer 14, which are sequentially disposed, and a heat dissipation tube 34 is embedded in the PCB.
It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (9)
1. A manufacturing process of a high-heat-dissipation PCB is characterized by comprising the following steps: the method comprises the following steps:
step 1: cutting and baking: cutting a substrate into a certain size, and baking the substrate in an oven, wherein the substrate is a double-sided copper-clad substrate, and the double-sided copper-clad substrate is provided with a second insulation layer (22) and a second copper foil layer (12) and a third copper foil layer (13) which are respectively laminated on the front surface and the back surface of the second insulation layer;
step 2: inner layer circuit: carrying out dry film pressing, exposure, development, etching and film removing treatment on a second copper foil layer (12) and a third copper foil layer (13) on the substrate to obtain an inner layer plate with an inner layer circuit, and detecting the inner layer circuit by utilizing an AOI system;
and step 3: and (3) laminating: after the inner layer board obtained in the step 2 is subjected to pretreatment and browning, a first copper foil layer (11), a first insulating layer (21), the inner layer board, a third insulating layer (23) and a fourth copper foil layer (14) are overlapped according to a designed laminated structure, the overlapped first copper foil layer (11), the first insulating layer (21), the inner layer board, the third insulating layer (23) and the fourth copper foil layer (14) are pressed by a press to form a multilayer board (10), and then the multilayer board is subjected to target drilling treatment;
and 4, step 4: mechanical drilling: drilling a through hole (31) for interlayer connection on the multilayer board (0)1 by using a drilling machine;
and 5: electroplating: carrying out degumming residue, chemical copper and electrolytic copper treatment in the via hole (31) so as to obtain a multilayer board (10) with mutually-communicated interlayer pattern circuits;
step 6: back drilling for the first time: back drilling a preset through hole (31) from the first copper foil layer (11), so that hole copper in the through hole is removed, the diameter of the through hole is increased, and part of the back drilled hole is used as a heat radiation hole (32);
and 7: burying the pipe for the first time: embedding a radiating pipe (34) in a radiating hole (32) at the side of the first copper foil layer (11), wherein two ends of the radiating pipe are respectively a cooling end and a heat absorbing end, the heat absorbing end is embedded below the heating element, and the cooling end is exposed to the outside;
and 8: resin hole plugging and ceramic grinding: filling resin (33) in the through hole needing hole plugging by using a resin hole plugging machine, baking the multilayer board after hole plugging to solidify the resin in the hole, grinding the resin salient points on the baked board surface by using a grinding machine, and leveling the resin in the hole with the board surface after grinding;
and step 9: removing glue residues: cleaning the surfaces of the first copper foil layer (11) and the fourth copper foil layer (14) by a plasma method to remove foreign matters and impurities on the board surface and remove attachments on the board surface;
step 10: and (3) back drilling for the second time: back drilling a preset through hole (31) from the fourth copper foil layer (14) to remove hole copper in the through hole and increase the diameter of the through hole, wherein part of the back drilled hole is used as a heat radiation hole (32);
step 11: burying the pipe for the second time: embedding a radiating pipe (34) in a radiating hole (32) of a fourth copper foil layer (14), wherein two ends of the radiating pipe are a cooling end and a heat absorbing end respectively, the heat absorbing end is embedded below the heating element, and the cooling end is exposed to the outside;
step 12: outer layer circuit: and carrying out dry film pressing, exposure, development, etching and film removing treatment on the first copper foil layer (11) and the fourth copper foil layer (14) on the multilayer board to obtain the multilayer board with an outer layer circuit, and detecting the outer layer circuit by utilizing an AOI system.
2. The manufacturing process of the high heat dissipation PCB of claim 1, wherein: the step 2 of the inner layer circuit specifically comprises the following steps:
(1) pretreatment: cleaning the substrate by using a cleaning solution containing hydrogen peroxide, and roughening the surfaces of the second copper foil layer (12) and the third copper foil layer (13) by using a sulfuric acid solution;
(2) pressing a dry film: attaching the photosensitive dry film to the surfaces of the second copper foil layer (12) and the third copper foil layer (13) in a hot pressing mode;
(3) exposure: carrying out polymerization reaction on the photosensitive substance in the photosensitive dry film by using an LDI exposure machine so as to transfer the designed pattern to the photosensitive dry film;
(4) and (3) developing: removing the unexposed dry film by saponification reaction of the developing solution and the unexposed dry film;
(5) etching: spraying a copper chloride liquid medicine on the copper surface through an etching machine, and etching the copper surface which is not protected by the dry film by utilizing the chemical reaction of the liquid medicine and the copper to form a circuit;
(6) film stripping: spraying NaOH or KOH liquid medicine on the board surface through a film removing machine, removing the dry film by utilizing the chemical reaction of the liquid medicine and the dry film, and finishing the manufacture of the inner layer circuit to obtain an inner layer board with the inner layer circuit;
(7) AOI: the AOI system examines the inner layer lines on the copper surface against the differences between the etched inner layer lines and the original design lines.
3. The manufacturing process of the high heat dissipation PCB of claim 1, wherein: the step 3 of pressing specifically comprises the following steps:
(1) pretreatment: acid washing: removing oxides on the surfaces of the second copper foil layer (12) and the third copper foil layer (13) by using sulfuric acid; cleaning: hydrolyzing the grease into small molecular substances which are easily dissolved in water by using a cleaning agent; pre-dipping: pre-soaking the inner-layer plate by using a browning liquid;
(2) browning: browning treatment is carried out on the surfaces of the second copper foil layer (12) and the third copper foil layer (13) by using browning liquid, so that the copper surface forms an uneven surface shape, and the contact area between the copper surface and resin is increased;
(3) and (3) superposition: sequentially overlapping a first copper foil layer (11), a first insulating layer (21), an inner layer plate, a third insulating layer (23) and a fourth copper foil layer (14), wherein the first insulating layer (21) is pressed between the first copper foil layer and the second copper foil layer, and the third insulating layer (23) is pressed between the third copper foil layer and the fourth copper foil layer;
(4) and (3) laminating: fusing and bonding the first copper foil layer (11), the first insulating layer (21), the inner layer plate, the third insulating layer (23) and the fourth copper foil layer (14) into a multilayer plate under high temperature and high pressure of a press;
(5) and (3) post-treatment: drilling a target: imaging the target of the multilayer board by using X-rays, and drilling a positioning hole and a fool-proof hole required by the subsequent process on the target by using a drill bit; edge milling: and cutting and removing the redundant rim charge by using a milling machine.
4. The manufacturing process of the high heat dissipation PCB of claim 1, wherein: the step 5 of electroplating specifically comprises the following steps:
(1) removing glue residues: removing the glue residue generated in drilling by using a plasma method;
(2) chemical copper: depositing a thin uniform and conductive electroless copper layer in the hole by chemical action;
(3) copper electroplating: and plating a layer of electroplated copper layer on the surface of the electroless copper layer in an electroplating way.
5. The manufacturing process of the high heat dissipation PCB of claim 1, wherein: in the step 8, the resin hole plugging specifically comprises the following steps: the multilayer board is fixed on an air guide base plate of a table top of a resin hole plugging machine, the bottom surface of the multilayer board faces upwards, resin is plugged into the air guide through hole (31), the resin plumpness in the through hole reaches 100-110%, and the specific technological parameters are as follows: the printing ink viscosity of the resin is 450-550dpa.s, the vacuum degree is 30-60pa, the scraper thickness is 15-30mm, the scraper angle is 2-5 degrees, the scraper speed is 15-30mm/s, the working environment temperature is normal temperature, and the baking conditions are as follows: the temperature is 130-.
6. The manufacturing process of the high heat dissipation PCB of claim 5, wherein: the concrete process parameters of resin hole plugging in the step 8 are as follows: the resin has an ink viscosity of 500dpa.s, a vacuum degree of 45pa, a scraper thickness of 25mm, a scraper angle of 3 degrees, a scraper speed of 10mm/s, a working environment temperature of 25 ℃, and baking conditions of: the temperature is 150 deg.C, and the time is 50 min.
7. The manufacturing process of the high heat dissipation PCB of claim 1, wherein: the step 12 of the outer layer circuit specifically comprises the following steps:
(1) pretreatment: cleaning the substrate by using a cleaning solution containing hydrogen peroxide, and roughening the surfaces of the first copper foil layer (11) and the fourth copper foil layer (14) by using a sulfuric acid solution;
(2) pressing a dry film: adhering the photosensitive dry film to the surfaces of the first copper foil layer (11) and the fourth copper foil layer (14) in a hot pressing mode;
(3) exposure: carrying out polymerization reaction on the photosensitive substance in the photosensitive dry film by using an LDI exposure machine so as to transfer the designed pattern to the photosensitive dry film;
(4) and (3) developing: removing the unexposed dry film by saponification reaction of the developing solution and the unexposed dry film;
(5) etching: spraying a copper chloride liquid medicine on the copper surface through an etching machine, and etching the copper surface which is not protected by the dry film by utilizing the chemical reaction of the liquid medicine and the copper to form a circuit;
(6) leg molding: spraying NaOH or KOH liquid medicine on the board surface through a film removing machine, removing the dry film by utilizing the chemical reaction of the liquid medicine and the dry film, and finishing the manufacturing of the circuit to obtain the multilayer board with the outer layer circuit;
(7) AOI: the AOI system examines the lines on the copper surface against the differences between the etched lines and the original design lines.
8. The utility model provides a high heat dissipation PCB which characterized in that: the high heat dissipation PCB is manufactured through the manufacturing process of any one of claims 1 to 7.
9. The high heat dissipation PCB of claim 8, wherein: the radiating tube comprises a first copper foil layer (11), a first insulating layer (21), a second copper foil layer (12), a second insulating layer (22), a third copper foil layer (13), a third insulating layer (23) and a fourth copper foil layer (14) which are sequentially arranged, and the radiating tube (34) is embedded in the PCB.
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