CN114449744A - High-heat-dissipation circuit board manufacturing method and high-heat-dissipation circuit board - Google Patents
High-heat-dissipation circuit board manufacturing method and high-heat-dissipation circuit board Download PDFInfo
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- CN114449744A CN114449744A CN202210322872.4A CN202210322872A CN114449744A CN 114449744 A CN114449744 A CN 114449744A CN 202210322872 A CN202210322872 A CN 202210322872A CN 114449744 A CN114449744 A CN 114449744A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 34
- 238000000034 method Methods 0.000 claims abstract description 58
- 230000017525 heat dissipation Effects 0.000 claims abstract description 48
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 41
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 41
- 239000000463 material Substances 0.000 claims abstract description 30
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 24
- 229910052802 copper Inorganic materials 0.000 claims abstract description 24
- 239000010949 copper Substances 0.000 claims abstract description 24
- 238000009713 electroplating Methods 0.000 claims abstract description 22
- 238000012805 post-processing Methods 0.000 claims abstract description 7
- 239000000758 substrate Substances 0.000 claims abstract description 6
- 239000011347 resin Substances 0.000 claims description 14
- 229920005989 resin Polymers 0.000 claims description 14
- 230000001680 brushing effect Effects 0.000 claims description 4
- 239000000919 ceramic Substances 0.000 claims description 4
- 239000004745 nonwoven fabric Substances 0.000 claims description 4
- 230000000694 effects Effects 0.000 abstract description 11
- 238000013461 design Methods 0.000 abstract description 6
- -1 aluminum-silver Chemical compound 0.000 description 7
- 238000012545 processing Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 238000007689 inspection Methods 0.000 description 3
- 239000003292 glue Substances 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- 208000019901 Anxiety disease Diseases 0.000 description 1
- 241001490125 Hot pepper alphaendornavirus Species 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 230000036506 anxiety Effects 0.000 description 1
- 239000012752 auxiliary agent Substances 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000005429 filling process Methods 0.000 description 1
- 239000011344 liquid material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 102000004169 proteins and genes Human genes 0.000 description 1
- 108090000623 proteins and genes Proteins 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
- H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention discloses a high-heat-dissipation circuit board and a manufacturing method thereof. The manufacturing method comprises the following steps: carrying out PCB pre-process treatment on the substrate to obtain a PCB with heat dissipation holes; carrying out hole plugging treatment on the heat dissipation holes of the PCB by using an aluminum paste material; carrying out secondary electroplating treatment on the PCB subjected to hole plugging treatment; and carrying out PCB post-processing on the PCB subjected to the secondary electroplating treatment to obtain the high-heat-dissipation circuit board. According to the method, the hole plugging treatment is carried out by using the aluminum paste material, so that a good heat dissipation effect is achieved, the heat dissipation effect is consistent with that of a copper embedding process, and the heat dissipation requirement of new energy automobile products can be met; the cost of the aluminum paste material is low, and automatic design and production can be realized; the design requirements of different customers are met, and additional equipment is not needed.
Description
Technical Field
The invention relates to the field of printed circuits, in particular to a high-heat-dissipation circuit board and a manufacturing method thereof.
Background
Automobiles are currently evolving from fuel-powered vehicles towards EVs (electric only) and HPEVs (plug-in hybrid). In order to solve the mileage anxiety, the charging time needs to be shortened while the battery capacity is continuously increased. The voltage and current of DC/DC and AC/DC conversion are higher and higher, which results in more and more heat being generated by high power components. The conventional PCB heat dissipation structure cannot meet the future requirements.
The main ways to solve the heat dissipation problem at present are as follows:
1. the heat dissipation efficiency is improved by adopting the copper embedding and embedding technology, but the copper embedding or embedding process has lower efficiency and higher cost for processing the copper block. For example, copper embedding blocks are required in the copper embedding process, but for different PCB boards, the sizes of the copper blocks and the positions of the PCB boards are different, so that the unified and automatic production of the copper embedding process cannot be realized, the copper embedding blocks and the apertures have matching problems, and the precision requirement is high.
2. Ceramic materials or other highly thermally conductive materials are used, but are also costly and not fully developed in the art.
Disclosure of Invention
The invention aims to provide a high-heat-dissipation circuit board and a manufacturing method thereof, and aims to solve the problems of high cost, low processing efficiency and the like of a circuit board heat dissipation solution in the prior art.
In a first aspect, the present invention provides a method for manufacturing a high heat dissipation circuit board, including:
carrying out PCB pre-process treatment on the substrate to obtain a PCB with heat dissipation holes;
carrying out hole plugging treatment on the heat dissipation holes of the PCB by using an aluminum paste material;
carrying out secondary electroplating treatment on the PCB subjected to hole plugging treatment;
and carrying out PCB post-processing on the PCB subjected to the secondary electroplating treatment to obtain the high-heat-dissipation circuit board.
In a second aspect, the present invention provides a high heat dissipation circuit board, which is manufactured by the above manufacturing method.
The embodiment of the invention discloses a high-heat-dissipation circuit board and a manufacturing method thereof, wherein the manufacturing method comprises the following steps: carrying out PCB pre-process treatment on the substrate to obtain a PCB with heat dissipation holes; carrying out hole plugging treatment on the heat dissipation holes of the PCB by using an aluminum paste material; carrying out secondary electroplating treatment on the PCB subjected to hole plugging treatment; and carrying out PCB post-processing on the PCB subjected to the secondary electroplating treatment to obtain the high-heat-dissipation circuit board. According to the method, the hole plugging treatment is carried out by using the aluminum paste material, so that a good heat dissipation effect is achieved, the heat dissipation effect is consistent with that of a copper embedding process, and the heat dissipation requirement of new energy automobile products can be met; the cost of the aluminum paste material is low, and automatic design and production can be realized; the design requirements of different customers are met, and additional equipment is not needed.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic flow chart illustrating a method for manufacturing a high-heat-dissipation circuit board according to an embodiment of the present invention;
fig. 2 is a sub-flow diagram of the hole plugging process of aluminum paste in the method for manufacturing a high heat dissipation circuit board according to the embodiment of the invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, not all, embodiments of the present invention. All other embodiments, which can be obtained by a person skilled in the art without making any creative effort based on the embodiments in the present invention, belong to the protection scope of the present invention.
It will be understood that the terms "comprises" and/or "comprising," when used in this specification and the appended claims, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
It is also to be understood that the terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used in the specification of the present invention and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
It should be further understood that the term "and/or" as used in this specification and the appended claims refers to and includes any and all possible combinations of one or more of the associated listed items.
Referring to fig. 1, fig. 1 is a schematic flow chart illustrating a method for manufacturing a high heat dissipation circuit board according to an embodiment of the invention;
as shown in fig. 1, the method includes steps S101 to S104.
S101, carrying out PCB (printed Circuit Board) pre-process treatment on a substrate to obtain a PCB with heat dissipation holes;
s102, plugging the heat dissipation holes of the PCB by using an aluminum paste material;
s103, carrying out secondary electroplating treatment on the PCB subjected to the hole plugging treatment;
and S104, carrying out PCB post-processing on the PCB subjected to the secondary electroplating treatment to obtain the high-heat-dissipation circuit board.
According to the manufacturing method provided by the embodiment of the invention, the hole plugging treatment is carried out on the heat dissipation holes by using the aluminum paste material, the heat dissipation effect is consistent with the copper embedding process, and the heat dissipation requirement of new energy automobile products can be met, for example, the fields of automobile lamps, OBCs, inverters, power supply management and the like of automobiles are met; the cost of the aluminum paste material is low, and automatic design and production can be realized; the design requirements of different customers are met, and additional equipment is not needed.
In the field of heat dissipation, the metal with the best heat dissipation effect is silver; the second is copper and aluminum. In terms of cost, the price of metal aluminum is far lower than that of metal copper, so that the heat sink in the conventional technology widely uses aluminum instead of copper, and the heat dissipation effect and the service life are not much different from those of copper not only because the price of aluminum is low, but also because aluminum is easier to process.
Therefore, in the embodiment of the present invention, the via-filling process is performed by using an aluminum paste material, which is mainly in the form of a white paste; the aluminum-silver alloy contains, by mass, more than 75-80% of aluminum, more than 10-15% of silver, and other components including partial resin, solvent and auxiliary agent. The aluminum paste material in the embodiment of the invention can be directly the existing aluminum paste material on the market.
Specifically, the thermal conductivity of each material is as follows:
metallic silver: 429W/mK
Metallic copper: 401W/mK
Metal aluminum: 237W/mK
Aluminum paste: 372-390W/mK
Therefore, the embodiment of the invention has the characteristic of heat dissipation effect close to that of silver, and the cost is shared by aluminum, so that the advantages of both heat dissipation effect and low cost are taken into consideration.
The manufacturing process of the embodiment of the present invention is further described below.
In step S101, a pre-PCB process is performed on the substrate, wherein the pre-PCB process mainly includes: cutting, manufacturing an inner layer, pressing, drilling and electroplating in sequence.
In an embodiment, as shown in fig. 2, the plugging process of the thermal via of the PCB with an aluminum paste material includes steps S201 to S203:
s201, plugging an aluminum paste material into heat dissipation holes of the PCB by using a vacuum hole plugging machine;
s202, baking the plugged PCB;
s203, grinding the baked PCB.
Specifically, in step S201, a hole plugging tool is prepared first, and a vacuum hole plugging machine is used to perform automatic hole plugging, wherein the vacuum degree in the hole plugging process is less than or equal to 100Pa, and the hole plugging saturation is greater than or equal to 100%. The viscosity of the aluminum paste material used is 400-500 dpa.s.
When plugging the hole, a scraper is used for plugging the hole, and after plugging the hole, a return ink knife is used for reverse supplement so as to ensure that the saturation of the plugging hole meets the requirement.
The speed of the scraper at the time of hole plugging is (80 +/-20) mm/sec, and the angle of the scraper is (5 +/-5) °. The blade air pressure may be: 5-9kgf/cm2。
The speed of the ink returning blade is (300 +/-50) mm/sec and the angle of the ink returning blade is (30 +/-5) °.
It is bigger to see back black sword angle than the scraper, and its purpose is in order to let when reverse replenishing more easily to fill in the louvre with aluminium paste material.
In step S202, after the stuffing operation is completed, the baking process is performed.
The baking is to cure the aluminum paste material plugged into the heat dissipation holes, and the embodiment of the invention limits the baking process for better curing. Specifically, in an embodiment, the baking process performed on the plugged PCB includes:
and baking the PCB in sections, wherein the temperature of each section of baking is gradually increased.
In the embodiment of the invention, a sectional baking mode is adopted, and baking is carried out in a mode of gradually increasing the temperature, so that hole plugging bubbles can be prevented, and the aluminum paste material in the plug holes is more full and full.
In one embodiment, the temperature of each section is raised by 0-10 ℃, the time of each section is 15 + -5 min, and the total baking time is 100-.
The more specific range of temperature rise of having injectd of this embodiment is at 0 ~ 10 ℃, and the stoving time of each section is 15 +/-5 min to inject total stoving time, so both can guarantee not to produce the consent bubble, can improve again and toast efficiency, avoid aluminium silver thick liquid material excessively to toast simultaneously, influence the problem of radiating efficiency.
For example, in a specific application scenario, the following are sequentially segmented: 65 ℃, 75 ℃, 85 ℃, 95 ℃, 100 ℃, 150 ℃ and 150 ℃, wherein the time of each section is 15 minutes; and the total time of the 8 sections is 120 minutes, so that the aluminum paste material in the plug hole can be gradually solidified to form aluminum-silver paste, no bubbles are generated, and the heat dissipation effect is better.
In step S203, after the baking process is performed, a polishing process is performed.
In this embodiment, the grinding process of the baked PCB board, which combines the abrasive belt, the ceramic brush and the non-woven fabric brush to grind simultaneously, includes:
the abrasive belt, the ceramic brush and the non-woven fabric brush are adopted for brushing and grinding treatment.
The purpose of combining the three brushing modes is to enable overflowing aluminum paste materials to be thoroughly removed, so that the circuit board is smoother and has more stable performance.
The mesh number of the abrasive belt can be 320 meshes, the mesh number of the ceramic brush can be 600 meshes, and the mesh number of the non-woven fabric brush can be 600 meshes. Other process parameters may be line speed: (2.0 +/-1.0) m/min; brushing and grinding current: (1.5. + -. 0.5) A.
In one embodiment, the secondary electroplating process for the PCB board subjected to the via-hole treatment includes:
and electroplating a copper layer of 8-12 μm on the surface of the aluminum paste layer of the PCB.
In this embodiment, the purpose of the secondary electroplating is to perform the function of connecting the aluminum silver paste, and also to continue the subsequent process line manufacturing. In the embodiment of the invention, the material of the secondary electroplating is copper, and the thickness of the copper layer obtained by the secondary electroplating is 8-12 mu m, so that the circuit connection is more stable and the whole thickness of the layer is not influenced.
In an embodiment, after the hole plugging processing is performed on the thermal via of the PCB by using an aluminum paste material and before the secondary electroplating processing is performed on the PCB subjected to the hole plugging processing, the method includes:
and carrying out resin hole plugging treatment on the PCB by using a vacuum hole plugging machine.
For part of circuit boards, after the hole plugging treatment of aluminum silver paste, resin hole plugging treatment is also needed, wherein the resin hole plugging means that resin is filled into a hole to be plugged, and the hole to be plugged is different from the heat dissipation hole, so that the buried hole in the inner layer is plugged by the resin, and the problem of air blowing in the hole is avoided.
In the embodiment of the invention, the resin hole plugging treatment can adopt the same flow and process as the aluminum silver paste hole plugging treatment, but the raw materials are different, so that the process switching flow can be checked, the manufacturing efficiency is improved, and simultaneously, the filled resin is more saturated and is not easy to generate bubbles. In view of the difference between the resin and the aluminum paste material in the embodiment of the present invention, and the viscosity of the resin is 440-540dpa.s, for example, in order to achieve a better resin hole plugging effect, the process parameters of resin hole plugging can be slightly adjusted: scraper air pressure: 5-9kgf/cm2。
In step S104, performing PCB post-processing on the PCB after the secondary electroplating, where the PCB post-processing includes sequentially performing outer layer manufacturing, solder mask, character printing, board routing, hole inspection, electric brush, first inspection of FQC, second inspection of FQC, FQA, surface treatment, FQA, packaging, and warehousing.
The traditional technology adopts a copper embedding process, and the subsequent process needs HSP (Heat protein family) process to plug a gap; in the embodiment of the invention, the hole plugging treatment is carried out by adopting the aluminum paste, so that the problem of gaps is not involved, and the flow of the heat-conducting glue can be omitted, thereby improving the flow efficiency. Of course, if a heat conducting glue flow is designed for part of the high heat dissipation plate; the HSP flowsheet may be added after the FQC second test as designed. And if the traditional technology adopts a copper embedding process, a manual copper embedding or automatic copper embedding machine is needed, the original process with the same resin hole plugging can be directly adopted in the application, the hole plugging process of the aluminum silver paste is realized, the efficiency is higher, and the cost is lower.
The embodiment of the invention also provides a high-heat-dissipation circuit board which is manufactured by adopting the manufacturing method.
While the invention has been described with reference to specific embodiments, the invention is not limited thereto, and various equivalent modifications and substitutions can be easily made by those skilled in the art within the technical scope of the invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (10)
1. A manufacturing method of a high-heat-dissipation circuit board is characterized by comprising the following steps:
carrying out PCB pre-process treatment on the substrate to obtain a PCB with heat dissipation holes;
carrying out hole plugging treatment on the heat dissipation holes of the PCB by using an aluminum paste material;
carrying out secondary electroplating treatment on the PCB subjected to hole plugging treatment;
and carrying out PCB post-processing on the PCB subjected to the secondary electroplating treatment to obtain the high-heat-dissipation circuit board.
2. The method for manufacturing a high heat dissipation circuit board according to claim 1, wherein the plugging process of the heat dissipation holes of the PCB board using an aluminum paste material comprises:
plugging an aluminum paste material into the heat dissipation holes of the PCB by using a vacuum plugging machine;
baking the plugged PCB;
and grinding the baked PCB.
3. The method for manufacturing a high heat dissipation circuit board as claimed in claim 2, wherein the viscosity of the aluminum paste material is 400-500dpa.s, the hole plugging saturation is not less than 100%, and the vacuum degree during hole plugging is not more than 100 Pa.
4. The method for manufacturing a circuit board with high heat dissipation according to claim 2, wherein the speed of the squeegee used for plugging the hole is (80 ± 20) mm/sec, and the angle of the squeegee is (5 ± 5) °; the speed of the ink returning blade used in the hole plugging is (300 +/-50) mm/sec, and the angle of the ink returning blade is (30 +/-5) °.
5. The method for manufacturing a high heat dissipation circuit board according to claim 1, wherein the baking process of the plugged PCB board includes:
and baking the PCB in sections, wherein the temperature of each section of baking is gradually increased.
6. The method for manufacturing a high heat dissipation circuit board as defined in claim 5, wherein the temperature of each segment is raised by 0-10 ℃, the time of each segment is 15 ± 5min, and the total baking time is 100-150 min.
7. The method for manufacturing a high heat dissipation circuit board according to claim 2, wherein the grinding process for the baked PCB board comprises:
the abrasive belt, the ceramic brush and the non-woven fabric brush are adopted for brushing and grinding treatment.
8. The method for manufacturing a high heat dissipation circuit board according to claim 1, wherein after the hole plugging process is performed on the heat dissipation holes of the PCB by using an aluminum paste material and before the secondary electroplating process is performed on the plugged PCB, the method comprises:
and carrying out resin hole plugging treatment on the PCB by using a vacuum hole plugging machine.
9. The method for manufacturing a high heat dissipation circuit board according to claim 1, wherein the second electroplating process is performed on the plugged PCB board, and the second electroplating process includes:
and electroplating a copper layer of 8-12 μm on the surface of the aluminum paste layer of the PCB.
10. A high-heat-dissipation circuit board is characterized by being manufactured by the manufacturing method of any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210322872.4A CN114449744B (en) | 2022-03-29 | 2022-03-29 | Manufacturing method of high-heat-dissipation circuit board and high-heat-dissipation circuit board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210322872.4A CN114449744B (en) | 2022-03-29 | 2022-03-29 | Manufacturing method of high-heat-dissipation circuit board and high-heat-dissipation circuit board |
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| CN114449744A true CN114449744A (en) | 2022-05-06 |
| CN114449744B CN114449744B (en) | 2024-03-22 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116669283A (en) * | 2023-05-29 | 2023-08-29 | 清远市富盈电子有限公司 | PCB heat dissipation processing method and PCB manufactured by same |
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| CN1627489A (en) * | 2003-12-10 | 2005-06-15 | 玄基光电半导体股份有限公司 | Load supporting base plate for semiconductor chip and fabricating method |
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| CN116669283A (en) * | 2023-05-29 | 2023-08-29 | 清远市富盈电子有限公司 | PCB heat dissipation processing method and PCB manufactured by same |
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| CN114449744B (en) | 2024-03-22 |
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