CN104333972A - Double-faced thick copper plate, manufacturing method thereof and clamp - Google Patents
Double-faced thick copper plate, manufacturing method thereof and clamp Download PDFInfo
- Publication number
- CN104333972A CN104333972A CN201410555380.5A CN201410555380A CN104333972A CN 104333972 A CN104333972 A CN 104333972A CN 201410555380 A CN201410555380 A CN 201410555380A CN 104333972 A CN104333972 A CN 104333972A
- Authority
- CN
- China
- Prior art keywords
- skid
- double
- copper plate
- thick copper
- proof regions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
The invention discloses a double-faced thick copper plate, a manufacturing method thereof and a clamp. The first face and the second face of the double-faced thick copper plate are both provided with anti-skid areas; the anti-skid areas are located at the side parts of the first face and the second face; the position of the anti-skid area on the first face is corresponding to the position of the anti-skid area on the second face; and multiple concave parts are arranged in the anti-skid area. As the anti-skid areas are arranged on the double-faced thick copper plate, the improved clamp is matched for clamping the anti-skid area positions of the double-faced thick copper plate, the anti-skid areas are provided with concave parts, the clamp is provided with convex points, the convex points are embedded in the concave parts, the clamping force of the clamp is greatly enhanced, and when the clamp is adopted to clamp the double-faced thick copper plate, the double-faced thick copper plate can be prevented from falling during the electrostatic spraying process.
Description
Technical field
The present invention relates to printed wiring board technical field, particularly relate to a kind of double-side thick copper plate and preparation method thereof and fixture.
Background technology
Printed wiring board, the base electronic parts in electron trade, are widely used in automobile, household electrical appliances, communication, medical treatment and the field such as military.In printed wiring board, double-side thick copper plate is as automotive electronics parts, and be particularly applied in engine power supply section, automobile central appliance power supply grades high-power high-voltage part, the market demand increases day by day.For meeting the high request of double-side thick copper plate to anti-welding making aspect, the good double-side thick copper plate of green oil coating thickness uniformity is often adopted to carry out anti-welding coating.
But the plate of two-sided thick copper circuit board is heavy comparatively large, and coordinate electrostatic spraying to draw fixture to carry out in the process of anti-welding coating, double-side thick copper plate is easy to draw fixture from electrostatic spraying fall.Particularly in the process of wiring board rotation, very easily fall phenomenon, cause wiring board to be done over again, wipe to spend and even scrap, and equipment is drawn in the electrostatic spraying damaging costliness, causes larger loss.
Summary of the invention
Based on this, the invention reside in the defect overcoming prior art, provide a kind of and can be convenient to by fixture stable holding to avoid being pulled through in electrostatic spraying the double-side thick copper plate of board falling phenomenon in journey.
Its technical scheme is as follows: a kind of double-side thick copper plate, first surface, second face of described double-side thick copper plate are equipped with skid-proof regions, described skid-proof regions is all positioned at first surface, the sidepiece of second, the skid-proof regions of described first surface is corresponding to the position, skid-proof regions of described second, and described skid-proof regions is furnished with some recesses.
The present invention also provides a kind of manufacture method of double-side thick copper plate, comprises the steps: sawing sheet; Make the film picture being used for double-side thick copper plate Graphic transitions, described film picture comprises the line pattern being positioned at mid portion and the edges of boards skid-proof regions figure being positioned at outside frame; Dry film is pasted the first surface of double-side thick copper plate and second; The contraposition of described film picture is attached on dry film, then carries out exposure imaging, line pattern is transferred to the zone line of circuit board substrate, by edges of boards skid-proof regions Graphic transitions on the edges of boards housing of circuit board substrate; Described double-side thick copper plate is etched, obtained frame has the double-side thick copper plate of skid-proof regions.
The present invention also provides a kind of fixture for clamping double-side thick copper plate, comprises the clamping face be oppositely arranged, and each described clamping face is equipped with some salient points, and the salient point that described clamping face is arranged is corresponding to the recess that described skid-proof regions is arranged.
Below technical scheme is further illustrated:
Preferably, four limits of described first surface are equipped with described skid-proof regions, and four limits of described second are also equipped with described skid-proof regions.
Preferably, the skid-proof regions of described first surface or second every limit setting is two or more, and the skid-proof regions that every limit is arranged is evenly arranged in the sidepiece of described double-side thick copper plate.
Preferably, described skid-proof regions is rectangular, and the recess in described skid-proof regions and recess are connected to form latticed, and described recess assumes diamond in shape.
Preferably, the skid-proof regions that every limit is arranged and corresponding edges of boards are at a distance of 1 ~ 3mm, and the length of described skid-proof regions is 75 ~ 85mm, and the width of described skid-proof regions is 7 ~ 11mm.
Preferably, the edges of boards width of described double-side thick copper plate is greater than 14mm.
Below the principle, effect etc. of preceding solution are described:
1, the present invention by arranging skid-proof regions in double-side thick copper plate, and coordinate the position, skid-proof regions of the holder double-side thick copper plate improved, wherein, skid-proof regions has recess, fixture has salient point, and salient point is embedded in recess, greatly can increase the chucking power of fixture, adopt holder double-side thick copper plate in electrostatic spray process, double-side thick copper plate can be avoided to drop phenomenon.
2, any sidepiece of double-side thick copper plate of the present invention is provided with skid-proof regions, and every limit is provided with two, can easily by fixture stable holding.
3, some recesses of skid-proof regions of the present invention are formed latticed, and recess assumes diamond in shape, recess proper alignment, and coincide with the salient point of fixture, and when adopting holder, stability is better, and greatly can save copper material.
4, the present invention makes skid-proof regions figure while making line pattern, and exposure imaging etches the skid-proof regions outside the line pattern of middle part and line pattern simultaneously, can save operation, operate extremely simple.
Accompanying drawing explanation
Fig. 1 is double-side thick copper plate structural representation described in the embodiment of the present invention;
Fig. 2 is the structural representation of fixture described in the embodiment of the present invention;
Fig. 3 is the manufacture method flow chart of double-side thick copper plate described in the embodiment of the present invention.
Description of reference numerals:
10, double-side thick copper plate, 11, skid-proof regions, 111, recess, 12, line pattern, 20, fixture, 21, clamping face, 211, salient point.
Embodiment
Below in conjunction with accompanying drawing, embodiments of the invention are described in detail:
As shown in Figure 1, a kind of double-side thick copper plate, first surface, second face of described double-side thick copper plate 10 are equipped with skid-proof regions 11, described skid-proof regions 11 is all positioned at first surface, the sidepiece of second, the skid-proof regions 11 of described first surface is corresponding to the position, skid-proof regions 11 of described second, and described skid-proof regions 11 is furnished with some recesses 111.
The present invention by arranging skid-proof regions 11 in double-side thick copper plate 10, and coordinate the fixture 20 improved to clamp the position, skid-proof regions 11 of double-side thick copper plate 10, wherein, skid-proof regions 11 has recess 111, fixture 20 has salient point 211, and salient point 211 is embedded in recess 111, greatly can increase the chucking power of fixture 20, adopt fixture 20 to hold double-side thick copper plate 10 in electrostatic spray process, double-side thick copper plate 10 can be avoided to drop phenomenon.
Four limits of described first surface are equipped with described skid-proof regions 11, and four limits of described second are also equipped with described skid-proof regions 11.The skid-proof regions 11 of described first surface or second every limit setting is two or more, and the skid-proof regions 11 that every limit is arranged is evenly arranged in the sidepiece of described double-side thick copper plate 10.Described skid-proof regions 11 is rectangular, and the recess 111 in described skid-proof regions 11 is connected to form latticed with recess 111, and described recess 111 assumes diamond in shape.When adopting fixture 20 to clamp, stability is better, and greatly can save copper material.
The skid-proof regions 11 that every limit is arranged and corresponding edges of boards are at a distance of 1 ~ 3mm, and the length of described skid-proof regions 11 is 75 ~ 85mm, and the width of described skid-proof regions 11 is 7 ~ 11mm.The edges of boards width of described double-side thick copper plate 10 is greater than 14mm.Guarantee that double-side thick copper plate has enough spaces to arrange skid-proof regions, draw equipment fixture to operate in electrostatic spraying to coordinate electrostatic spraying.
As shown in Figure 2, the present invention also provides a kind of fixture 20 for clamping double-side thick copper plate 10, comprise the clamping face 21 be oppositely arranged, each described clamping face 21 is equipped with some salient points 211, the salient point 211 that described clamping face 21 is arranged is corresponding to the recess 111 that described skid-proof regions 11 is arranged.
As shown in Figure 3, the present invention also provides a kind of manufacture method of double-side thick copper plate, comprises the steps:
Step S31, sawing sheet, make rear fender, boring, plating by double-side thick copper plate inner figure;
Step S32, make and be used for the film picture of double-side thick copper plate Graphic transitions, described film picture comprises the line pattern 12 being positioned at mid portion and edges of boards skid-proof regions 11 figure being positioned at outside frame;
Step S33, all stick dry film the first surface of double-side thick copper plate 10 and second;
Step S34, the contraposition of described film picture is attached on dry film, then carries out exposure imaging, line pattern 12 is transferred to the zone line of circuit board substrate, by edges of boards skid-proof regions 11 Graphic transitions on the edges of boards housing of circuit board substrate;
Step S35, described double-side thick copper plate 10 to be etched, obtained frame has the double-side thick copper plate 10 of skid-proof regions 11.
To sum up, tool of the present invention has the following advantages:
1, the present invention by arranging skid-proof regions 11 in double-side thick copper plate 10, and coordinate the fixture 20 improved to clamp the position, skid-proof regions 11 of double-side thick copper plate 10, wherein, skid-proof regions 11 has recess 111, fixture 20 has salient point 211, and salient point 211 is embedded in recess 111, greatly can increase the chucking power of fixture 20, adopt fixture 20 to hold double-side thick copper plate 10 in electrostatic spray process, double-side thick copper plate 10 can be avoided to drop phenomenon.
2, any sidepiece of double-side thick copper plate 10 of the present invention is provided with skid-proof regions 11, and every limit is provided with two, can easily by fixture 20 stable holding.
3, some recesses 111 of skid-proof regions 11 of the present invention are formed latticed, and recess 111 assumes diamond in shape, recess 111 proper alignment, and coincide with the salient point 211 of fixture 20, and when adopting fixture 20 to clamp, stability is better, and greatly can save copper material.
4, the present invention makes skid-proof regions figure while making line pattern 12, and the skid-proof regions 11 simultaneously outside the exposure imaging line pattern 12 that etches middle part and line pattern 12, can operation be saved, operate extremely simple.
The above embodiment only have expressed the specific embodiment of the present invention, and it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.
Claims (8)
1. a double-side thick copper plate, it is characterized in that, first surface, second face of described double-side thick copper plate are equipped with skid-proof regions, described skid-proof regions is all positioned at first surface, the sidepiece of second, the skid-proof regions of described first surface is corresponding to the position, skid-proof regions of described second, and described skid-proof regions is furnished with some recesses.
2. double-side thick copper plate according to claim 1, is characterized in that, four limits of described first surface are equipped with described skid-proof regions, and four limits of described second are also equipped with described skid-proof regions.
3. double-side thick copper plate according to claim 2, is characterized in that, the skid-proof regions of described first surface or second every limit setting is two or more, and the skid-proof regions that every limit is arranged is evenly arranged in the sidepiece of described double-side thick copper plate.
4. double-side thick copper plate according to claim 3, is characterized in that, described skid-proof regions is rectangular, and the recess in described skid-proof regions and recess are connected to form latticed, and described recess assumes diamond in shape.
5. according to the arbitrary described double-side thick copper plate of Claims 1-4, it is characterized in that, the skid-proof regions that every limit is arranged and corresponding edges of boards are at a distance of 1 ~ 3mm, and the length of described skid-proof regions is 75 ~ 85mm, and the width of described skid-proof regions is 7 ~ 11mm.
6. one kind for clamp as arbitrary in claim 1 to 5 as described in the fixture of double-side thick copper plate, it is characterized in that, comprise the clamping face be oppositely arranged, each described clamping face is equipped with some salient points, and the salient point that described clamping face is arranged is corresponding to the recess that described skid-proof regions is arranged.
7. a manufacture method for the double-side thick copper plate as described in as arbitrary in claim 1 to 5, comprises the steps:
Sawing sheet;
Make the film picture being used for double-side thick copper plate Graphic transitions, described film picture comprises the line pattern being positioned at mid portion and the edges of boards skid-proof regions figure being positioned at outside frame;
Dry film is pasted the first surface of double-side thick copper plate and second;
The contraposition of described film picture is attached on dry film, then carries out exposure imaging, line pattern is transferred to the zone line of circuit board substrate, by edges of boards skid-proof regions Graphic transitions on the edges of boards housing of circuit board substrate;
Described double-side thick copper plate is etched, obtained frame has the double-side thick copper plate of skid-proof regions.
8. the manufacture method of double-side thick copper plate according to claim 7, is characterized in that, the edges of boards width of described double-side thick copper plate is greater than 14mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410555380.5A CN104333972A (en) | 2014-10-17 | 2014-10-17 | Double-faced thick copper plate, manufacturing method thereof and clamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410555380.5A CN104333972A (en) | 2014-10-17 | 2014-10-17 | Double-faced thick copper plate, manufacturing method thereof and clamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104333972A true CN104333972A (en) | 2015-02-04 |
Family
ID=52408591
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410555380.5A Pending CN104333972A (en) | 2014-10-17 | 2014-10-17 | Double-faced thick copper plate, manufacturing method thereof and clamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104333972A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107084855A (en) * | 2017-05-09 | 2017-08-22 | 安徽江淮汽车集团股份有限公司 | A kind of belt clamping device |
| CN110351952A (en) * | 2019-07-23 | 2019-10-18 | 信泰电子（西安）有限公司 | Reduce the design of PCB slight crack rate taken a little |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102821548A (en) * | 2012-08-06 | 2012-12-12 | 深圳崇达多层线路板有限公司 | Board edge graphical tool manufacturing method preventing electrostatic spraying board from falling off |
| CN202958052U (en) * | 2012-11-29 | 2013-05-29 | 深圳市迈瑞特电路科技有限公司 | Board falling prevention device for electrostatic spraying |
-
2014
- 2014-10-17 CN CN201410555380.5A patent/CN104333972A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102821548A (en) * | 2012-08-06 | 2012-12-12 | 深圳崇达多层线路板有限公司 | Board edge graphical tool manufacturing method preventing electrostatic spraying board from falling off |
| CN202958052U (en) * | 2012-11-29 | 2013-05-29 | 深圳市迈瑞特电路科技有限公司 | Board falling prevention device for electrostatic spraying |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107084855A (en) * | 2017-05-09 | 2017-08-22 | 安徽江淮汽车集团股份有限公司 | A kind of belt clamping device |
| CN110351952A (en) * | 2019-07-23 | 2019-10-18 | 信泰电子（西安）有限公司 | Reduce the design of PCB slight crack rate taken a little |
| CN110351952B (en) * | 2019-07-23 | 2021-01-29 | 信泰电子（西安）有限公司 | PCB with pick-up points for reducing PCB crack rate |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP2781987B1 (en) | Casing of electronic device and method of manufacturing the same | |
| CN103226414B (en) | Touch screen and preparation method thereof | |
| CN107248618A (en) | Shell production method after decorative membrance, rear shell, terminal and terminal | |
| WO2008140007A1 (en) | Conductive board, electromagnetic shielding board for plasma display and method for manufacturing conductive board | |
| CN104333972A (en) | Double-faced thick copper plate, manufacturing method thereof and clamp | |
| CN204145900U (en) | The anti-paint jet printing protecting device of a kind of circuit board three | |
| CN104425876A (en) | Antenna manufacturing method and antenna | |
| CN102821548B (en) | Board edge graphical tool manufacturing method preventing electrostatic spraying board from falling off | |
| CN102625591B (en) | Method for manufacturing solder mask of unit plate by using electrostatic spray coating machine | |
| CN107155262A (en) | A kind of its Meta Materials processing method of copper foil base material preparation method and application | |
| CN114449744A (en) | High-heat-dissipation circuit board manufacturing method and high-heat-dissipation circuit board | |
| CN204905259U (en) | Soft display subassembly | |
| CN106550544A (en) | A kind of manufacture method of small size ceramics pcb board | |
| CN103203972B (en) | A kind of three-dimensional metal mask plate and mixing preparation method thereof | |
| US20180299721A1 (en) | Support structure, wall holder with support structure, and ultra-thin television having wall holder | |
| CN105979712B (en) | A kind of opposite sex tower base formula double-sided key board manufacturing method | |
| Qi et al. | 59‐4: A New Method of Side‐wiring Bonding and Patterning for Micro‐LED Display on Glass Substrate | |
| CN205378401U (en) | Framework module and electronic equipment | |
| CN104869762A (en) | Preparation method and structure of PCB and electronic equipment | |
| CN103943935B (en) | A kind of radio-frequency filter printing fixture | |
| CN102638948B (en) | Manufacturing method of printed circuit board | |
| CN204466041U (en) | A kind of printed wiring board | |
| CN202310308U (en) | Thin sandwich plate clamp | |
| CN208111730U (en) | A kind of flexible flat cable and liquid crystal module | |
| CN206851142U (en) | A kind of electroplate lead wire structure of length printed-circuit connector wiring board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20170302 Address after: 528415 Zhongshan Xiaolan Town, Guangdong Province Applicant after: Jielishi Multi-layer Circuit Board (zhongshan) Co., Ltd. Address before: 528415 Guangdong Province, Zhongshan City Xiaolan Town, Yongning Guangfu Road No. 51 Applicant before: ZHONGSHAN HUIYA LINE VERSION CO., LTD. |
|
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150204 |
|
| RJ01 | Rejection of invention patent application after publication |