CN113271717A - Manufacturing method of printed circuit board applied to 5G communication base station - Google Patents
Manufacturing method of printed circuit board applied to 5G communication base station Download PDFInfo
- Publication number
- CN113271717A CN113271717A CN202110535451.5A CN202110535451A CN113271717A CN 113271717 A CN113271717 A CN 113271717A CN 202110535451 A CN202110535451 A CN 202110535451A CN 113271717 A CN113271717 A CN 113271717A
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- hole
- hole plugging
- back drilling
- holes
- manufacturing
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 35
- 238000004891 communication Methods 0.000 title claims abstract description 17
- 238000000034 method Methods 0.000 claims abstract description 97
- 230000008569 process Effects 0.000 claims abstract description 73
- 238000005553 drilling Methods 0.000 claims abstract description 68
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 52
- 239000010949 copper Substances 0.000 claims abstract description 51
- 229910052802 copper Inorganic materials 0.000 claims abstract description 51
- 239000011347 resin Substances 0.000 claims abstract description 28
- 229920005989 resin Polymers 0.000 claims abstract description 28
- 239000002390 adhesive tape Substances 0.000 claims abstract description 10
- 238000005507 spraying Methods 0.000 claims abstract description 7
- 238000000227 grinding Methods 0.000 claims description 24
- 238000003825 pressing Methods 0.000 claims description 17
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- 238000005336 cracking Methods 0.000 claims description 5
- 239000004745 nonwoven fabric Substances 0.000 claims description 5
- 238000004140 cleaning Methods 0.000 claims description 3
- 239000004744 fabric Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 238000002360 preparation method Methods 0.000 claims description 3
- 238000012546 transfer Methods 0.000 claims description 3
- 229910000906 Bronze Inorganic materials 0.000 claims 1
- 239000010974 bronze Substances 0.000 claims 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 claims 1
- 239000003292 glue Substances 0.000 abstract description 4
- 230000000694 effects Effects 0.000 abstract description 2
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 230000008054 signal transmission Effects 0.000 description 3
- 230000000903 blocking effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000006087 Brown hydroboration reaction Methods 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention discloses a manufacturing method of a printed circuit board applied to a 5G communication base station, wherein a copper block can be fixed by a high-temperature-resistant tin-spraying adhesive tape when passing through a browning line, so that residual glue on the copper block after browning is reduced, and the quality of a product is improved; the pecking type drilling can be adopted for back drilling, so that hole blockage can be effectively avoided; in the hole plugging process, through the first hole plugging process, one surface with the maximum back drilling depth or one surface with the same double-sided maximum back drilling depth is selected, the surface with the large number of back drilling holes is selected to serve as a first hole plugging surface, the other surface serves as a second hole plugging surface through the second hole plugging process, oil is discharged greatly, hole plugging efficiency can be improved, hole plugging resin is uniform, hole plugging cracks do not exist, and the hole plugging effect is better.
Description
Technical Field
The invention belongs to the technical field of circuit board manufacturing, and particularly relates to a manufacturing method of a printed circuit board applied to a 5G communication base station.
Background
Compared with 4G, 5G has the characteristics of high performance, low delay and high capacity. Higher requirements are also put forward for printed circuit boards applied to 5G communication base stations. How to solve the problems of heat dissipation and signal transmission of the circuit board becomes a problem to be solved urgently by those skilled in the art.
Therefore, the prior art proposes a copper block embedding technology to enhance heat dissipation performance and a back drilling technology to improve signal transmission capability. However, due to the disparity in the Coefficients of Thermal Expansion (CTE) of copper and resin, delamination at the interface is very likely if the bond between the two is not strong enough under heat. Therefore, the inner copper layer must be browned prior to lamination.
When the copper block passes through the brown oxidation wire, the copper block needs to be fixed. In the prior art, a common red adhesive tape is usually adopted for fixing, and after a copper block is browned, residual adhesive can be generated on the copper block, so that the product quality is reduced.
Disclosure of Invention
An object of the present invention is to provide a method for manufacturing a printed circuit board applied to a 5G communication base station, which can solve or at least partially solve the above technical problems.
In order to achieve the purpose, the invention adopts the following technical scheme:
a manufacturing method of a printed circuit board applied to a 5G communication base station comprises an inner layer core board pattern transfer process, a core board, PP groove routing and copper block routing process, a core board and copper block browning process and a pressing process;
in the core plate and copper block browning procedure, a high-temperature-resistant tin-spraying adhesive tape is adopted for fixing when the browned copper block passes through the browning line.
Optionally, the core board, PP gong groove and gong copper block process includes:
routing the periphery for multiple times, and routing the periphery for the last time by using a new routing knife.
Optionally, the pressing process includes:
cleaning the plate surface with wax cloth and dust-sticking roller before the plate arrangement;
and placing the copper block flatly, and pressing and burying the copper block.
Optionally, a resin plate grinding process is further included after the pressing process, and the resin plate grinding process includes:
the non-woven fabric is only opened to prevent the copper block from cracking, and the grinding plate is exposed out of the base material.
Optionally, a back drilling process is further included after the resin board grinding process, and the back drilling process includes:
and carrying out back drilling by adopting pecking drilling.
Optionally, a double-sided vacuum plug hole process is further included after the back drilling process, the double-sided vacuum plug hole process including:
a preparation process, namely arranging a hole plugging screen plate, a PCB production plate, a hole plugging base plate and a hole plugging platform in sequence from top to bottom;
a first hole plugging step of selecting a surface having the maximum back drilling depth as a first hole plugging surface, or selecting a surface having a large number of back drilling holes as the first hole plugging surface under the condition of the same maximum back drilling depth of both surfaces;
a second hole plugging step, namely selecting the other surface of the PCB production board as a second hole plugging surface;
baking, solidifying and grinding the plate.
Optionally, before the preparing step, the method further includes:
a double-sided back drilling process, wherein a plurality of back drilling holes are respectively formed on two sides of the PCB production board, each back drilling hole is correspondingly communicated with a metalized hole, the back drilling holes are divided into deep back drilling holes and shallow back drilling holes, and the metalized holes are divided into large holes and small holes;
a hole plugging base plate manufacturing procedure, wherein a groove corresponding to the large hole and a through hole corresponding to the small hole are formed in the hole plugging base plate; wherein the groove is not drilled through and the through hole is drilled through;
and in the hole plugging aluminum sheet manufacturing procedure, a first hole plugging corresponding to the deep back drilling hole and a second hole plugging corresponding to the shallow back drilling hole are arranged.
Optionally, in the first hole plugging process, plugging resin only for small holes with the diameter less than 0.4mm and back-drilled holes; in the second hole plugging step, resin plugging is performed for all the holes.
Optionally, the jack panel is an aluminum sheet panel or a resin sheet panel.
Optionally, a depth control gong process is further included after the double-sided vacuum hole plugging process, and the depth control gong process includes:
and routing a power amplifier groove on the copper block.
Compared with the prior art, the embodiment of the invention has the following beneficial effects:
according to the manufacturing method of the printed circuit board applied to the 5G communication base station, the heat dissipation capacity of the printed circuit board is improved by embedding the copper blocks in the core board before the pressing process, the signal transmission capacity of the printed circuit board is improved by back drilling and hole plugging processes after the pressing process, and the copper blocks to be embedded can be fixed through the high-temperature-resistant tin-spraying adhesive tape when passing through the browning line, so that the residual adhesive on the browned copper blocks is reduced, and the product quality is improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
The structures, ratios, sizes, and the like shown in the present specification are only used for matching with the contents disclosed in the specification, so that those skilled in the art can understand and read the present invention, and do not limit the conditions for implementing the present invention, so that the present invention has no technical significance, and any structural modifications, changes in the ratio relationship, or adjustments of the sizes, without affecting the functions and purposes of the present invention, should still fall within the scope covered by the contents disclosed in the present invention.
Fig. 1 is a flowchart of a method for manufacturing a printed circuit board applied to a 5G communication base station according to an embodiment of the present invention;
FIG. 2 is a flow chart of a method for double-sided vacuum via filling according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of a deep back-drilled hole plug provided in an embodiment of the present invention;
FIG. 4 is a schematic diagram of a shallow back-drilled hole in accordance with an embodiment of the present invention.
Illustration of the drawings:
11. plugging a hole screen plate; 12. producing a PCB; 13. plugging a hole base plate; 14. a receptacle platform.
Detailed Description
In order to make the objects, features and advantages of the present invention more obvious and understandable, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the embodiments described below are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example one
The embodiment provides a method for manufacturing a printed circuit board, which can be applied to a 5G communication base station and specifically includes the steps shown in fig. 1.
Specifically, the copper block needs to be browned before the pressing process. Before the pressing procedure, the method is provided with: the method comprises an inner-layer core plate pattern transfer process, a core plate, PP groove routing and copper block routing process and a core plate and copper block browning process. In the browning process of the core plate and the copper block, a high-temperature-resistant tin-spraying adhesive tape is adopted for fixing when the browned copper block passes through the browning line.
Compared with the prior art, the improvement point of the embodiment is that the copper block to be browned is fixed by adopting a high-temperature-resistant tin-spraying adhesive tape when passing through the browned wire. It should be noted that the high temperature resistance here can be understood as: the adhesive tape is not destroyed at the browning temperature, so that a high temperature is also to be understood approximately as the browning temperature or the temperature at which the adhesive tape is located.
Specifically, the browning process needs to be specially controlled, so that the copper block is prevented from colliding, and the glue grinding is not clean after pressing.
The copper blocks are fixed by a high-temperature-resistant tin-spraying adhesive tape, no residual glue is left on the copper blocks after the copper blocks are browned, and the product quality is improved.
Further, the core plate, PP gong groove and gong copper billet process includes: routing the periphery for multiple times, and routing the periphery for the last time by using a new routing knife.
Specifically, the resin glue residue can be avoided by routing the periphery three times and utilizing a new knife for the last time.
Further, the pressing process comprises the following steps:
cleaning the plate surface with wax cloth and dust-sticking roller before the plate arrangement;
and placing the copper block flatly, and pressing and burying the copper block.
When the plate is arranged, a release film with the thickness of 75 mu m can be used, and the copper block can be manually placed. After the copper blocks are placed, whether the problems of abnormal placement, reverse placement and the like of the copper blocks exist needs to be completely detected, and the board surface is cleaned. Finally, pressing the buried copper block according to the high Tg program.
Further, the method also comprises a resin plate grinding process after the pressing process, wherein the resin plate grinding process comprises the following steps:
the non-woven fabric is only opened to prevent the copper block from cracking, and the grinding plate is exposed out of the base material.
Specifically, the non-woven fabric section of the resin plate grinding machine is ground for 2-3 times. Of course, it is also possible to inspect the copper block periphery and the substrate, and if there is adhesive residue in individual locations, it can be manually handled with a surgical blade to ensure that there is no resin residue on the copper block and on the substrate.
Further, the resin board grinding process further comprises a back drilling process, and the back drilling process comprises the following steps:
and carrying out back drilling by adopting pecking drilling.
Specifically, in the prior art, back drilling is performed at one time, but the phenomenon of copper chip hole blocking exists. In the embodiment, the pecking drilling is used, the cutting depth is fixed, such as 0.3mm, all the holes are lifted, the deep drilling is performed for 0.3mm, and the like until the specified depth is reached, so that the hole blocking can be effectively avoided.
Further, the manufacturing method of the printed circuit board further comprises a depth control gong process, wherein the depth control gong process comprises the following steps:
and routing a power amplifier groove on the copper block, namely routing the power amplifier groove on the buried copper block, wherein the depth of the power amplifier groove can be 0.62 +/-0.05 mm.
Example two
Further, see FIGS. 2-4. On the basis of the first embodiment, the method for manufacturing a printed circuit board provided by the present embodiment further includes: and a double-sided vacuum hole filling step after the back drilling step.
The double-sided vacuum hole plugging process can solve or at least partially solve the cracking problem existing in the resin hole plugging method in the prior art, and specifically comprises the following steps:
s11, preparing a procedure, namely arranging the hole plugging screen plate 11, the PCB production plate 12, the hole plugging base plate 13 and the hole plugging platform 14 in sequence from top to bottom;
s12, a first hole plugging step, namely selecting one surface with the maximum back drilling depth as a first hole plugging surface, or selecting one surface with a large number of back drilling holes as the first hole plugging surface under the condition that the maximum back drilling depths of the two surfaces are the same;
s13, a second hole plugging process, namely selecting the other surface of the PCB production board 12 as a second hole plugging surface;
s14, baking, curing and grinding the board.
Specifically, before the preparation process, the method further includes:
a double-sided back drilling process, wherein a plurality of back drilling holes are respectively formed on two sides of the PCB production board 12, each back drilling hole is correspondingly communicated with a metalized hole, the back drilling holes are divided into deep back drilling holes and shallow back drilling holes, and the metalized holes are divided into large holes and small holes; optionally, the depth of the deep back drilling hole is greater than or equal to 1.5mm, and the depth of the shallow back drilling hole is less than 1.5 mm; the aperture of the large hole is more than or equal to 0.4mm, and the aperture of the small hole is less than 0.4 mm; optionally, during back drilling, performing back drilling in a pecking drilling mode;
a hole plugging base plate 13 manufacturing procedure, wherein a groove corresponding to the large hole and a through hole corresponding to the small hole are formed in the hole plugging base plate 13; wherein the groove is not drilled through, and the through hole is drilled through;
a hole plugging aluminum sheet manufacturing procedure, wherein a first hole plugging corresponding to the deep back drilling hole and a second hole plugging corresponding to the shallow back drilling hole are formed; optionally, the aperture of the first plug hole is equal to 0.4mm and larger than the aperture of the deep back-drilled hole; the aperture of the second plug hole is equal to 0.45mm and larger than that of the shallow back drilling hole.
The structure design of the hole plugging base plate 13 has the advantages that the oil quantity of the large hole is large, so that the groove is designed to be not drilled through, the oil quantity of the small hole is small, the through hole is designed to be drilled through to be breathable, and the oil quantity of the large hole and the oil quantity of the small hole are uniform and balanced.
The above-mentioned jack net plate 11 may be an aluminum sheet net plate or a resin sheet net plate.
Optionally, the baking, curing and grinding process comprises:
baking for precuring, pre-grinding the surface of the plug hole, heating to completely cure the resin ink, and thoroughly grinding the surface of the plug hole; or directly baking to completely cure the resin ink and then grinding the surface of the plug hole.
Specifically, the grinding plate can be mechanically ground twice, wherein the grinding plate line and the ceramic grinding plate line (2 sections) are only passed for the first time, and the whole line (including one section of non-woven fabric) is passed for the second time.
In the manufacturing method of the printed circuit board provided by the embodiment, in the hole plugging process, through the first hole plugging process, one side with the maximum back drilling depth or one side with a large number of back drilling holes is selected to be used as a first hole plugging surface under the condition that the two-sided maximum back drilling depth is the same, and through the second hole plugging process, the other side is used as a second hole plugging surface, so that the oil discharge is large, the hole plugging efficiency can be improved, the hole plugging resin is uniform, no hole plugging crack exists, and the hole plugging effect is better.
EXAMPLE III
On the basis of the second embodiment, in the first hole plugging process, resin is plugged only for small holes with the diameter less than 0.4mm and back drilled holes; in the second hole plugging step, resin plugging is performed for all the holes.
In the embodiment, after the sequence is strictly controlled, in the first hole plugging process, oil appears in the small holes and oil leaks out from the back drilling holes, and in the second hole plugging process, the large holes and the small holes are plugged together and are not stuck with the hole plugging base plate 13, so that the uniformity of hole plugging resin can be ensured, hole plugging cracks can be avoided, and the cracking problem can be avoided.
It should be understood that the specific aperture values, such as 0.4mm and 0.45mm, and the depth values, such as 1.5mm, of the above-listed holes (back-drilled holes, metallized holes, through holes and grooves) can be flexibly adjusted according to the actual process requirements, and the adjustment is within the protection scope of the present invention.
The above-mentioned embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the same; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (10)
1. A manufacturing method of a printed circuit board applied to a 5G communication base station is characterized by comprising an inner core board pattern transfer process, a core board, PP groove routing and copper block routing process, a core board and copper block browning process and a pressing process;
in the core plate and copper block browning procedure, a high-temperature-resistant tin-spraying adhesive tape is adopted for fixing when the browned copper block passes through the browning line.
2. The method for manufacturing the printed circuit board applied to the 5G communication base station according to claim 1, wherein the core board, PP routing and bronze routing process comprises:
routing the periphery for multiple times, and routing the periphery for the last time by using a new routing knife.
3. The method as claimed in claim 2, wherein the pressing process comprises:
cleaning the plate surface with wax cloth and dust-sticking roller before the plate arrangement;
and placing the copper block flatly, and pressing and burying the copper block.
4. The method for manufacturing a printed circuit board applied to a 5G communication base station according to claim 3, further comprising a resin board grinding process after the pressing process, wherein the resin board grinding process comprises:
the non-woven fabric is only opened to prevent the copper block from cracking, and the grinding plate is exposed out of the base material.
5. The method for manufacturing a printed circuit board applied to a 5G communication base station according to claim 4, further comprising a back drilling process after the resin board grinding process, wherein the back drilling process comprises:
and carrying out back drilling by adopting pecking drilling.
6. The method of claim 5, further comprising a double-sided vacuum plug hole process after the back drilling process, wherein the double-sided vacuum plug hole process comprises:
a preparation process, namely arranging a hole plugging screen plate, a PCB production plate, a hole plugging base plate and a hole plugging platform in sequence from top to bottom;
a first hole plugging step of selecting a surface having the maximum back drilling depth as a first hole plugging surface, or selecting a surface having a large number of back drilling holes as the first hole plugging surface under the condition of the same maximum back drilling depth of both surfaces;
a second hole plugging step, namely selecting the other surface of the PCB production board as a second hole plugging surface;
baking, solidifying and grinding the plate.
7. The method for manufacturing a printed circuit board applied to a 5G communication base station according to claim 6, further comprising, before the preparing step:
a double-sided back drilling process, wherein a plurality of back drilling holes are respectively formed on two sides of the PCB production board, each back drilling hole is correspondingly communicated with a metalized hole, the back drilling holes are divided into deep back drilling holes and shallow back drilling holes, and the metalized holes are divided into large holes and small holes;
a hole plugging base plate manufacturing procedure, wherein a groove corresponding to the large hole and a through hole corresponding to the small hole are formed in the hole plugging base plate; wherein the groove is not drilled through and the through hole is drilled through;
and in the hole plugging aluminum sheet manufacturing procedure, a first hole plugging corresponding to the deep back drilling hole and a second hole plugging corresponding to the shallow back drilling hole are arranged.
8. The method for manufacturing a printed circuit board applied to a 5G communication base station according to claim 7, wherein in the first hole plugging process, resin is plugged only for small holes with the diameter of less than 0.4mm and back-drilled holes; in the second hole plugging step, resin plugging is performed for all the holes.
9. The method as claimed in claim 6, wherein the jack panel is an aluminum sheet panel or a resin sheet panel.
10. The method for manufacturing a printed circuit board applied to a 5G communication base station according to claim 6, further comprising a depth control gong process after the double-sided vacuum jack process, wherein the depth control gong process comprises:
and routing a power amplifier groove on the copper block.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110535451.5A CN113271717A (en) | 2021-05-17 | 2021-05-17 | Manufacturing method of printed circuit board applied to 5G communication base station |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110535451.5A CN113271717A (en) | 2021-05-17 | 2021-05-17 | Manufacturing method of printed circuit board applied to 5G communication base station |
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| CN113271717A true CN113271717A (en) | 2021-08-17 |
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| CN114364140A (en) * | 2022-03-11 | 2022-04-15 | 四川英创力电子科技股份有限公司 | Resin hole plugging device and method for double-sided back-drilling printed circuit board |
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