CN107396550A - A kind of hole-drilling system and method for improving the heavy copper half bore burr of pcb board - Google Patents
A kind of hole-drilling system and method for improving the heavy copper half bore burr of pcb board Download PDFInfo
- Publication number
- CN107396550A CN107396550A CN201710774005.3A CN201710774005A CN107396550A CN 107396550 A CN107396550 A CN 107396550A CN 201710774005 A CN201710774005 A CN 201710774005A CN 107396550 A CN107396550 A CN 107396550A
- Authority
- CN
- China
- Prior art keywords
- gong
- hole
- half bore
- pcb board
- burr
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0214—Back-up or entry material, e.g. for mechanical drilling
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0242—Cutting around hole, e.g. for disconnecting land or Plated Through-Hole [PTH] or for partly removing a PTH
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- ing And Chemical Polishing (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
The present invention relates to a kind of hole-drilling system for improving the heavy copper half bore burr of pcb board, including the drilling equipment, shifting apparatus and etching device set gradually, also include the information processing terminal, described information processing terminal communicates to connect with drilling equipment, shifting apparatus and etching device respectively, and the drilling equipment includes the gong band for being arranged to secondary gong half bore inwall and periphery.Purpose is to ensure that the copper sheet around hole wall and aperture is not destroyed.Ensure hole wall copper integrality.And then ensure production board SMT excellent effects.
Description
Technical field
The present invention relates to PCB manufacture fields, more particularly to it is a kind of improve pcb board sink copper half bore burr hole-drilling system and
Method.
Background technology
For there is the pcb board of PTH half bore, made by normal technological process, half hole site of production board has very serious
Burr burr, influences SMT, can only be sliced off the burr at half bore by manual operation, very waste of manpower and time, and efficiency is low
Under, speed is slow.
The content of the invention
To solve the above problems, the present invention adopts the following technical scheme that：A kind of drilling for improving the heavy copper half bore burr of pcb board
System, including drilling equipment, shifting apparatus and the etching device set gradually, in addition to the information processing terminal, at described information
Manage terminal to communicate to connect with drilling equipment, shifting apparatus and etching device respectively, the drilling equipment, which includes, is arranged to secondary
Gong half bore inwall and the gong band on periphery.
The present invention operation principle be：On the basis of conventional gong pcb board hole technique, set up by drilling equipment, transfer dress
The system formed with etching device is put, by the drilling equipment of the system after the graphic plating process of MI travelers, increases gong
Plate process, the hole sites of PTH half are gone out in this process gong, it is therefore an objective to by the burr burr of the hole sites of PTH half in next etching work
Sequence eating away.The gong band of the hole site of gong half is carried out with personnel by making gong, the parameter of gong band is arranged to：It is 1.0mm's from knife footpath
Gong knife, the hole sites of gong PTH half.1.0mm gong knife gong go out it is better, on the premise of the slow-speed of revolution, 1.0mm gong knife device to hole
The copper sheet mastication forces of wall and orifice edge are smaller, so that it is guaranteed that tin is good on half hole site.
Lower cutter position is arranged at half bore center, and water-filling square of going forward side by side is to reciprocating motion.During gong half bore, from 1.0mm's
Gong knife, the half of rotating speed when the rotating speed of gong machine main shaft is dropped into conventional gong plate.1.0mm gong knife conventional rotating speed is：FD:
6.0X150%, the speed of the hole site of gong half：FD：3.0x150%, using new gong knife, the speed of mainshaft is reduced, and be using knife footpath
1.0mm gong knife, purpose are to ensure that the copper sheet around hole wall and aperture is not destroyed.Ensure hole wall copper integrality.And then
Ensure production board SMT excellent effects.
During transferring ready-made gong band progress gong plate, the state of wear of gong knife is monitored, if gong knife serious wear, need to stand
More renew gong knife gong plate.Etching device is transported to by shifting apparatus behind complete half hole site of gong and performs etching process, is being etched
During, by the burr eating away of half hole site.
The information processing terminal communicates to connect with each device, and the data for managing each device as a whole coordinate.Aperture apparatus to be drilled is complete
During into gong hole process, detected by the information processing terminal, and instruct shifting apparatus that pcb board is transported into etching device and perform etching work
Skill.
Further, the cutter of the drilling equipment is arranged to knife footpath 1.0mm gong knife.
Further, the cutter of the gong band is arranged to knife footpath 1.0mm gong knife.
Further, the rotating speed of the gong band is arranged to FD：3.0x150%.
A kind of method for improving the heavy copper half bore burr of pcb board, comprises the following steps：
S1：Sawing sheet, choose substrate and be cut into appropriate size；
S2：Internal layer circuit makes, and carrying out internal layer circuit to substrate makes to obtain wiring board；
S3：Pressing, wiring board upper and lower surface overlap prepreg and copper foil, are laminated to obtain multilayer circuit board respectively；
S4：Bore circular hole, assist side surface programming plate hole locations preboring circular hole；
S5：Gong plate hole, by circular hole gong into half bore；
S6：Copper facing, plating is carried out to the half bore on pcb board and fills out copper；
S7：The burr pretreatment of gong hole, secondary gong quarter is carried out to half bore inside and periphery using gong knife；
S8：Outer layer photoetching and etching, photoetching and etching operation are carried out to the upper and lower surface of pcb board.
Beneficial effects of the present invention are：Purpose is to ensure that the copper sheet around hole wall and aperture is not destroyed.Ensure hole
Wall copper integrality.And then ensure production board SMT excellent effects.
Brief description of the drawings
The invention will be further described for accompanying drawing, but the embodiment in accompanying drawing does not form any limitation of the invention.
Fig. 1 is a kind of hole-drilling system structural representation for the heavy copper half bore burr of improvement pcb board that one embodiment of the invention provides
Figure.
Embodiment
As shown in fig. 1, a kind of hole-drilling system for the heavy copper half bore burr of improvement pcb board that one embodiment of the invention provides,
Including the drilling equipment 1, shifting apparatus 2 and etching device 3 set gradually, in addition to the information processing terminal, described information processing
Terminal communicates to connect with drilling equipment 1, shifting apparatus 2 and etching device 3 respectively, and the drilling equipment 1, which includes, is arranged to two
Secondary gong half bore inwall and the gong band on periphery.
The present invention operation principle be：On the basis of conventional gong pcb board hole technique, set up by drilling equipment 1, transfer dress
The system for putting 2 and the composition of etching device 3, by the drilling equipment 1 of the system after the graphic plating process of MI travelers, increase
Gong plate process, the hole sites of PTH half are gone out in this process gong, it is therefore an objective to by the burr burr of the hole sites of PTH half in next etching
Process eating away.The gong band of the hole site of gong half is carried out with personnel by making gong, the parameter of gong band is arranged to：It is 1.0mm from knife footpath
Gong knife, the hole sites of gong PTH half.1.0mm gong knife gong go out it is better, on the premise of the slow-speed of revolution, 1.0mm gong knife pair
The copper sheet mastication forces of hole wall and orifice edge are smaller, so that it is guaranteed that tin is good on half hole site.
Lower cutter position is arranged at half bore center, and water-filling square of going forward side by side is to reciprocating motion.During gong half bore, from 1.0mm's
Gong knife, the half of rotating speed when the rotating speed of gong machine main shaft is dropped into conventional gong plate.1.0mm gong knife conventional rotating speed is：FD:
6.0X150%, the speed of the hole site of gong half：FD：3.0x150%, using new gong knife, the speed of mainshaft is reduced, and be using knife footpath
1.0mm gong knife, purpose are to ensure that the copper sheet around hole wall and aperture is not destroyed.Ensure hole wall copper integrality.And then
Ensure production board SMT excellent effects.
During transferring ready-made gong band progress gong plate, the state of wear of gong knife is monitored, if gong knife serious wear, need to stand
More renew gong knife gong plate.Etching device 3 is transported to by shifting apparatus 2 behind complete half hole site of gong and performs etching process, is being carved
During erosion, by the burr eating away of half hole site.
The information processing terminal communicates to connect with each device, and the data for managing each device as a whole coordinate.Aperture apparatus 1 to be drilled is complete
During into gong hole process, detected by the information processing terminal, and instruct shifting apparatus 2 that pcb board is transported into etching device 3 and perform etching
Technique.
Further, the cutter of the drilling equipment 1 is arranged to knife footpath 1.0mm gong knife.
Further, the cutter of the gong band is arranged to knife footpath 1.0mm gong knife.
Further, the rotating speed of the gong band is arranged to FD：3.0x150%.
A kind of method for improving the heavy copper half bore burr of pcb board, comprises the following steps：
S1：Sawing sheet, choose substrate and be cut into appropriate size；
S2：Internal layer circuit makes, and carrying out internal layer circuit to substrate makes to obtain wiring board；
S3：Pressing, wiring board upper and lower surface overlap prepreg and copper foil, are laminated to obtain multilayer circuit board respectively；
S4：Bore circular hole, assist side surface programming plate hole locations preboring circular hole；
S5：Gong plate hole, by circular hole gong into half bore；
S6：Copper facing, plating is carried out to the half bore on pcb board and fills out copper；
S7：The burr pretreatment of gong hole, secondary gong quarter is carried out to half bore inside and periphery using gong knife；
S8：Outer layer photoetching and etching, photoetching and etching operation are carried out to the upper and lower surface of pcb board.
Beneficial effects of the present invention are：Purpose is to ensure that the copper sheet around hole wall and aperture is not destroyed.Ensure hole
Wall copper integrality.And then ensure production board SMT excellent effects.
Embodiment described above only expresses the several embodiments of the present invention, and its description is more specific and detailed, but simultaneously
Can not therefore it be construed as limiting the scope of the patent.It should be pointed out that come for one of ordinary skill in the art
Say, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the protection of the present invention
Scope.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (5)
- A kind of 1. hole-drilling system for improving the heavy copper half bore burr of pcb board, it is characterised in that：Including set gradually drilling equipment, Shifting apparatus and etching device, in addition to the information processing terminal, described information processing terminal respectively with drilling equipment, shifting apparatus Communicated to connect with etching device, the drilling equipment includes the gong band for being arranged to secondary gong half bore inwall and periphery.
- 2. improve the hole-drilling system of the heavy copper half bore burr of pcb board according to claim 1, it is characterised in that：The drilling dress The cutter put is arranged to knife footpath 1.0mm gong knife.
- 3. improve the hole-drilling system of the heavy copper half bore burr of pcb board according to claim 1, it is characterised in that：The gong band Cutter is arranged to knife footpath 1.0mm gong knife.
- 4. improve the hole-drilling system of the heavy copper half bore burr of pcb board according to claim 1, it is characterised in that：The gong band Rotating speed is arranged to FD：3.0x150%.
- 5. a kind of method for improving the heavy copper half bore burr of pcb board, including the heavy copper half bore burr of improvement pcb board described in the 1-4 Hole-drilling system, it is characterised in that comprise the following steps：S1：Sawing sheet, choose substrate and be cut into appropriate size；S2：Internal layer circuit makes, and carrying out internal layer circuit to substrate makes to obtain wiring board；S3：Pressing, wiring board upper and lower surface overlap prepreg and copper foil, are laminated to obtain multi-layer PCB board respectively；S4：Circular hole is bored, plate hole locations preboring circular hole is preset in PCB surface；S5：Gong plate hole, by circular hole gong into half bore；S6：Copper facing, plating is carried out to the half bore on pcb board and fills out copper；S7：The burr pretreatment of gong hole, secondary gong quarter is carried out to half bore inside and periphery using gong knife；S8：Outer layer photoetching and etching, photoetching and etching operation are carried out to the upper and lower surface of pcb board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710774005.3A CN107396550A (en) | 2017-08-31 | 2017-08-31 | A kind of hole-drilling system and method for improving the heavy copper half bore burr of pcb board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710774005.3A CN107396550A (en) | 2017-08-31 | 2017-08-31 | A kind of hole-drilling system and method for improving the heavy copper half bore burr of pcb board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107396550A true CN107396550A (en) | 2017-11-24 |
Family
ID=60347390
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710774005.3A Pending CN107396550A (en) | 2017-08-31 | 2017-08-31 | A kind of hole-drilling system and method for improving the heavy copper half bore burr of pcb board |
Country Status (1)
| Country | Link |
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| CN (1) | CN107396550A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108882559A (en) * | 2018-07-06 | 2018-11-23 | 江苏本川智能电路科技股份有限公司 | A kind of manufacture craft of metallized semi-pore |
| CN109041432A (en) * | 2018-09-07 | 2018-12-18 | 江门市奔力达电路有限公司 | A kind of method and method for manufacturing circuit board improving wiring board gong plate burr |
| CN110072341A (en) * | 2019-04-18 | 2019-07-30 | 奥士康精密电路（惠州）有限公司 | A kind of acid etching method of two-sided weld-ring without copper U-type groove hole without burr |
| CN111148354A (en) * | 2019-12-30 | 2020-05-12 | 惠州市永隆电路有限公司 | Batch cutting processing method for metallized semi-hole PCB |
| CN111906847A (en) * | 2020-07-24 | 2020-11-10 | 广州市合成电子制品有限公司 | Method for preventing copper rolling in drilling process |
| CN113271717A (en) * | 2021-05-17 | 2021-08-17 | 东莞市五株电子科技有限公司 | Manufacturing method of printed circuit board applied to 5G communication base station |
| CN113382562A (en) * | 2021-07-23 | 2021-09-10 | 全成信电子（深圳）股份有限公司 | Manufacturing method for eliminating burrs of PTH (plated through hole) semi-hole plate and rolling copper sheet |
| CN113784521A (en) * | 2021-09-06 | 2021-12-10 | 大连崇达电路有限公司 | Manufacturing method for improving copper pulling during routing of counter bore or platform on PTH through hole |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104768338A (en) * | 2015-04-28 | 2015-07-08 | 清远市富盈电子有限公司 | PCB edge semi-hole metallization manufacturing process |
| CN204836836U (en) * | 2015-03-01 | 2015-12-02 | 开平依利安达电子第五有限公司 | Multilayer circuit PCB board production line with electroplate half hole |
| CN106255320A (en) * | 2016-08-10 | 2016-12-21 | 奥士康精密电路（惠州）有限公司 | A kind of gong PTH half bore method |
| CN106488665A (en) * | 2016-12-08 | 2017-03-08 | 宜兴硅谷电子科技有限公司 | The manufacture method of gold-plated half-pore plate |
| CN106535478A (en) * | 2016-11-12 | 2017-03-22 | 广东科翔电子科技有限公司 | Method of improving milling groove burrs before electroless plating copper operation of PCB |
| CN106793575A (en) * | 2016-12-16 | 2017-05-31 | 江苏博敏电子有限公司 | A kind of manufacture craft of half bore pcb board |
| CN207135365U (en) * | 2017-08-31 | 2018-03-23 | 惠东县建祥电子科技有限公司 | A kind of hole-drilling system for improving the heavy copper half bore burr of pcb board |
-
2017
- 2017-08-31 CN CN201710774005.3A patent/CN107396550A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN204836836U (en) * | 2015-03-01 | 2015-12-02 | 开平依利安达电子第五有限公司 | Multilayer circuit PCB board production line with electroplate half hole |
| CN104768338A (en) * | 2015-04-28 | 2015-07-08 | 清远市富盈电子有限公司 | PCB edge semi-hole metallization manufacturing process |
| CN106255320A (en) * | 2016-08-10 | 2016-12-21 | 奥士康精密电路（惠州）有限公司 | A kind of gong PTH half bore method |
| CN106535478A (en) * | 2016-11-12 | 2017-03-22 | 广东科翔电子科技有限公司 | Method of improving milling groove burrs before electroless plating copper operation of PCB |
| CN106488665A (en) * | 2016-12-08 | 2017-03-08 | 宜兴硅谷电子科技有限公司 | The manufacture method of gold-plated half-pore plate |
| CN106793575A (en) * | 2016-12-16 | 2017-05-31 | 江苏博敏电子有限公司 | A kind of manufacture craft of half bore pcb board |
| CN207135365U (en) * | 2017-08-31 | 2018-03-23 | 惠东县建祥电子科技有限公司 | A kind of hole-drilling system for improving the heavy copper half bore burr of pcb board |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108882559A (en) * | 2018-07-06 | 2018-11-23 | 江苏本川智能电路科技股份有限公司 | A kind of manufacture craft of metallized semi-pore |
| CN108882559B (en) * | 2018-07-06 | 2023-06-02 | 江苏本川智能电路科技股份有限公司 | Manufacturing process of metallized half hole |
| CN109041432A (en) * | 2018-09-07 | 2018-12-18 | 江门市奔力达电路有限公司 | A kind of method and method for manufacturing circuit board improving wiring board gong plate burr |
| CN110072341A (en) * | 2019-04-18 | 2019-07-30 | 奥士康精密电路（惠州）有限公司 | A kind of acid etching method of two-sided weld-ring without copper U-type groove hole without burr |
| CN111148354A (en) * | 2019-12-30 | 2020-05-12 | 惠州市永隆电路有限公司 | Batch cutting processing method for metallized semi-hole PCB |
| CN111906847A (en) * | 2020-07-24 | 2020-11-10 | 广州市合成电子制品有限公司 | Method for preventing copper rolling in drilling process |
| CN111906847B (en) * | 2020-07-24 | 2022-01-07 | 广州市合成电子制品有限公司 | Method for preventing copper rolling in drilling process |
| CN113271717A (en) * | 2021-05-17 | 2021-08-17 | 东莞市五株电子科技有限公司 | Manufacturing method of printed circuit board applied to 5G communication base station |
| CN113271717B (en) * | 2021-05-17 | 2024-07-12 | 东莞市五株电子科技有限公司 | Manufacturing method of printed circuit board applied to 5G communication base station |
| CN113382562A (en) * | 2021-07-23 | 2021-09-10 | 全成信电子（深圳）股份有限公司 | Manufacturing method for eliminating burrs of PTH (plated through hole) semi-hole plate and rolling copper sheet |
| CN113382562B (en) * | 2021-07-23 | 2023-02-28 | 全成信电子（深圳）股份有限公司 | Manufacturing method for eliminating burrs of PTH (plated through hole) semi-hole plate and rolling copper sheet |
| CN113784521A (en) * | 2021-09-06 | 2021-12-10 | 大连崇达电路有限公司 | Manufacturing method for improving copper pulling during routing of counter bore or platform on PTH through hole |
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Application publication date: 20171124 |