CN109041432A - A kind of method and method for manufacturing circuit board improving wiring board gong plate burr - Google Patents
A kind of method and method for manufacturing circuit board improving wiring board gong plate burr Download PDFInfo
- Publication number
- CN109041432A CN109041432A CN201811042345.8A CN201811042345A CN109041432A CN 109041432 A CN109041432 A CN 109041432A CN 201811042345 A CN201811042345 A CN 201811042345A CN 109041432 A CN109041432 A CN 109041432A
- Authority
- CN
- China
- Prior art keywords
- gong
- gong plate
- burr
- plate
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0346—Deburring, rounding, bevelling or smoothing conductor edges
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
Abstract
The present invention provides a kind of methods and method for manufacturing circuit board for improving wiring board gong plate burr, are related to wiring board technology field.When gong sheet metal forming, gong plate is formed required gong slot in two times, when first time gong plate reserved edge grinding away from 0.08~0.12mm of trim line, second along the normal gong plate of trim line, recontour and first time gong plate when the burr that generates.In the present invention, by gong plate twice, the burr generated when can modify the shape and a gong plate of inside groove, and then reach the smooth no burr of shape, although the more gongs of inside groove are primary at the time of molding, a gong plate need not can be carried out before the etch, it is overall to have promotion in efficiency and in quality.
Description
Technical field
The present invention relates to wiring board technology fields, refer in particular to a kind of method and wiring board for improving wiring board gong plate burr
Production method.
Background technique
In assist side production, designed lines copper is encountered sometimes close to edges of boards or is stretched out outside plate, and does not allow to cut copper, is connect
By dew copper.If will generate shape side according to normal gong plate process has the phenomenon that burr.
To avoid burr problem, the more common way of industry is to add one of gong plate stream before circuit etching in the prior art
Journey elder generation gong goes out this interior groove location, and production procedure is as follows:
1. graphics circuitry -2. 5. hinder by electric tin (protection needs the copper face and route that retain) -3. gong goes out inside groove-and 4. etches -
It weld -6. forms.
Before route is etched, copper sheet and entire big copper face are an entirety in hole, because asking without what is rolled
Topic, gong will appear burr after going out, but such batch of cutting edge of a knife or a sword can be etched liquid medicine in etching process and sting erosion without remaining.But it is such
The shortcomings that way is to have added one of gong plate process, reduces production efficiency.
Summary of the invention
The technical problems to be solved by the present invention are: improving wiring board gong plate burr and guaranteeing production efficiency.
In order to solve the above-mentioned technical problem, the invention discloses it is a kind of improve wiring board gong plate burr method, specifically:
When gong sheet metal forming, gong plate is formed required gong slot in two times, and reserved edge grinding is away from 0.08~0.12mm of trim line when first time gong plate, and the
It is secondary along the normal gong plate of trim line, recontour and first time gong plate when the burr that generates.
Further, the first time gong plate and second of gong plate are successively carried out continuously.
Further, edge grinding 0.1mm is reserved when the first time gong plate.
In addition, also disclosing a kind of method for manufacturing circuit board, specifically include using above-mentioned improvement wiring board gong plate burr
Method wiring board is processed.
Further, in method for manufacturing circuit board, successively include, graphics circuitry → electricity tin → etching → welding resistance → gong plate at
Type process.
In the present invention, by gong plate twice, the burr generated when can modify the shape and a gong plate of inside groove, and then reach
The smooth no burr of shape need not can carry out before the etch a gong plate although the more gongs of inside groove are primary at the time of molding, overall
There is promotion in efficiency and in quality.
Detailed description of the invention
Specific structure of the invention is described in detail with reference to the accompanying drawing
Fig. 1 is a wiring board schematic shapes；
Fig. 2 is Fig. 1 wiring board schematic shapes after first time gong plate；
Fig. 3 is Fig. 2 wiring board schematic shapes after second of gong plate.
Specific embodiment
In order to describe the technical content, the structural feature, the achieved object and the effect of this invention in detail, below in conjunction with embodiment
And attached drawing is cooperated to be explained in detail.
A kind of method for improving wiring board gong plate burr is disclosed in one embodiment, specifically: in the circuit board
When carrying out gong sheet metal forming, required gong slot need in two times gong plate be formed, when first time gong plate reserved edge grinding away from trim line 0.08~
0.12mm, and preferably 0.1mm, second along the normal gong plate of trim line, recontour and first time gong plate when the burr that generates.
It gong plate can be formed in two times in conjunction with Fig. 1, Fig. 2 and Fig. 3 when needing to form inside groove 4 in assist side 1.Through for the first time
After gong plate, the shape of wiring board 1 to get lead-over groove 3 is arrived, is also deposited between lead-over groove 3 and the inside groove 4 of required formation as shown in Figure 2
In a reserved area 2.Through first time gong plate, it will usually the phenomenon that generating burr on lead-over groove inner wall and copper sheet is rolled, to protect
Demonstrate,prove that wiring board own face is bright and clean smooth and performance, the burr formed after these gong plates and the copper sheet rolled must be removed.In
It is that can continue to carry out second of gong plate to wiring board 1, second of gong plate can be normal along the trim line of the inside groove 4 of required formation
The burr generated when gong plate, recontour and first time gong plate, and then reach the smooth no burr of shape, form required wiring board
Inside groove 4, continuous gong plate are easy to operate and high-efficient.
In addition, also disclosing a kind of method for manufacturing circuit board in one embodiment, specifically include:
Graphics circuitry first forms required line pattern on circuit boards；
Electric tin, protection need the copper face and route retained；
Etching is etched wiring board according to default, removes extra logicalnot circuit copper；
Welding resistance carries out welding resistance processing to PCB surface according to default, such as forms solder mask；
Gong sheet metal forming, according in above-described embodiment improve gong plate burr method carry out gong sheet metal forming, i.e., by wiring board according to
Secondary progress first time gong plate, second of gong plate, thus the inside groove without burr and the copper sheet rolled needed for being formed.This scheme is not
Being same as the prior art, gong goes out the scheme of inside groove before the etch, scheme in the prior art, before route is etched, copper sheet in hole
It is an entirety with entire big copper face, the problem of because without rolling, gong goes out inside groove will appear burr, but such batch later
Cutting edge of a knife or a sword can be etched liquid medicine in etching process and sting erosion without remaining.But such method has added one of gong plate stream before the etch
Journey, compared to of the invention directly at the time of molding twice in succession for the scheme of gong plate, prior art significantly reduces production
Efficiency.
In the present invention, by gong plate twice in succession, the burr generated when can modify the shape and a gong plate of inside groove, in turn
Reach the smooth no burr of shape, although the more gongs of inside groove are primary at the time of molding, need not can carry out before the etch a gong plate,
It is overall to have promotion in efficiency and in quality.
Herein, first, second ... only represents the differentiation of its title, does not represent their significance level and position and what has
It is different.Herein, up, down, left, right, before and after only represents its relative position without indicating its absolute position.And the foregoing is merely
The embodiment of the present invention is not intended to limit the scope of the invention, all to utilize description of the invention and accompanying drawing content institute
The equivalent structure or equivalent flow shift of work is applied directly or indirectly in other relevant technical fields, and is similarly included in
In scope of patent protection of the invention.
Claims (5)
1. a kind of method for improving wiring board gong plate burr, it is characterised in that: when gong sheet metal forming, required gong slot gong plate shape in two times
At edge grinding reserved when, first time gong plate away from 0.08~0.12mm of trim line, second along the normal gong plate of trim line, recontour and
The burr generated when first time gong plate.
2. the method as described in claim 1, it is characterised in that: the first time gong plate and second of gong plate successively continuously into
Row.
3. method according to claim 1 or 2, it is characterised in that: reserve edge grinding 0.1mm when the first time gong plate.
4. a kind of method for manufacturing circuit board, it is characterised in that: including using improvement route as described in any one of claims 1-3
The method of plate gong plate burr processes wiring board.
5. method as claimed in claim 4, it is characterised in that: successively include, graphics circuitry → electricity tin → etching → welding resistance →
Gong sheet metal forming process.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811042345.8A CN109041432A (en) | 2018-09-07 | 2018-09-07 | A kind of method and method for manufacturing circuit board improving wiring board gong plate burr |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811042345.8A CN109041432A (en) | 2018-09-07 | 2018-09-07 | A kind of method and method for manufacturing circuit board improving wiring board gong plate burr |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109041432A true CN109041432A (en) | 2018-12-18 |
Family
ID=64624400
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811042345.8A Pending CN109041432A (en) | 2018-09-07 | 2018-09-07 | A kind of method and method for manufacturing circuit board improving wiring board gong plate burr |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109041432A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111465202A (en) * | 2020-03-05 | 2020-07-28 | 珠海崇达电路技术有限公司 | Drilling machining method for improving precision of gong platform |
| CN112616258A (en) * | 2021-01-12 | 2021-04-06 | 广东世运电路科技股份有限公司 | Circuit board negative film and processing method thereof |
| CN112752437A (en) * | 2020-12-11 | 2021-05-04 | 深圳市景旺电子股份有限公司 | Forming method of metallized half hole and PCB (printed circuit board) |
| CN114900968A (en) * | 2022-05-25 | 2022-08-12 | 奥士康科技股份有限公司 | Method for improving gong and flash burrs of TRX power amplifier groove of base station |
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| CN108024461A (en) * | 2018-01-11 | 2018-05-11 | 广合科技（广州）有限公司 | Remove the processing unit (plant) and its processing technology of PTH half bore hole inner burr |
| CN108289376A (en) * | 2018-01-22 | 2018-07-17 | 奥士康精密电路（惠州）有限公司 | Bury copper coin copper billet control depth method |
| CN108377612A (en) * | 2018-01-29 | 2018-08-07 | 奥士康精密电路（惠州）有限公司 | A kind of PCB blind slots bottom circuit processing technology |
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2018
- 2018-09-07 CN CN201811042345.8A patent/CN109041432A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN201860514U (en) * | 2010-10-22 | 2011-06-08 | 春焱电子科技（苏州）有限公司 | PCB (printed circuit board) with PTH (plated through hole) semicircular hole |
| CN104540335A (en) * | 2014-12-25 | 2015-04-22 | 胜宏科技（惠州）股份有限公司 | Method for routing golden finger area in circuit board |
| CN105163508A (en) * | 2015-08-13 | 2015-12-16 | 恩达电路(深圳)有限公司 | Production method of long-life anti-friction carbon oil circuit board |
| CN105228347A (en) * | 2015-08-14 | 2016-01-06 | 景旺电子科技(龙川)有限公司 | A kind of PCB jigsaw gong plate method |
| CN106255320A (en) * | 2016-08-10 | 2016-12-21 | 奥士康精密电路（惠州）有限公司 | A kind of gong PTH half bore method |
| CN107396550A (en) * | 2017-08-31 | 2017-11-24 | 惠东县建祥电子科技有限公司 | A kind of hole-drilling system and method for improving the heavy copper half bore burr of pcb board |
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| CN108289376A (en) * | 2018-01-22 | 2018-07-17 | 奥士康精密电路（惠州）有限公司 | Bury copper coin copper billet control depth method |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111465202A (en) * | 2020-03-05 | 2020-07-28 | 珠海崇达电路技术有限公司 | Drilling machining method for improving precision of gong platform |
| CN112752437A (en) * | 2020-12-11 | 2021-05-04 | 深圳市景旺电子股份有限公司 | Forming method of metallized half hole and PCB (printed circuit board) |
| CN112752437B (en) * | 2020-12-11 | 2022-07-12 | 深圳市景旺电子股份有限公司 | Forming method of metallized semi-hole and PCB |
| CN112616258A (en) * | 2021-01-12 | 2021-04-06 | 广东世运电路科技股份有限公司 | Circuit board negative film and processing method thereof |
| CN114900968A (en) * | 2022-05-25 | 2022-08-12 | 奥士康科技股份有限公司 | Method for improving gong and flash burrs of TRX power amplifier groove of base station |
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| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20181218 |