CN112616258A - Circuit board negative film and processing method thereof - Google Patents
Circuit board negative film and processing method thereof Download PDFInfo
- Publication number
- CN112616258A CN112616258A CN202110037280.3A CN202110037280A CN112616258A CN 112616258 A CN112616258 A CN 112616258A CN 202110037280 A CN202110037280 A CN 202110037280A CN 112616258 A CN112616258 A CN 112616258A
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- Prior art keywords
- circuit board
- hole
- edge
- slot
- negative
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention discloses a circuit board negative and a processing method thereof, wherein the circuit board negative is provided with a slotted hole, the slotted hole comprises a first part, a second part and a third part, the second part is connected between the first part and the third part, the left side of the first part is an arc curved surface, the upper surface and the lower surface of the first part are parallel surfaces, the upper surface and the lower surface of the second part are arc curved surfaces, the third part and the first part are symmetrical relative to the second part, and a routing knife is used for carrying out rough routing and fine routing on the circuit board negative in a clockwise direction, so that the problems of burr generation and deformation of the slotted hole are effectively solved.
Description
Technical Field
The invention relates to the field of circuit board production, in particular to a circuit board negative film and a processing method thereof.
Background
The circuit board has many large and small holes, and when the circuit board is taken up to look at the lamp on the ceiling, many dense and numb holes are found, which may not be good where to place, and each hole is designed for its purpose. These holes can be roughly classified into two types, namely, PTH (plated Through Hole) and NPTH (Non-plated Through Hole), where the Through Hole is a Hole that actually penetrates from one side of the circuit board to the other side, and there are other holes that do not penetrate the circuit board besides the Through Hole.
In the production process of the PCB, a slotted hole needs to be arranged on a negative film of the circuit board, and the current scheme is as follows: the method comprises the steps of drilling a deburring hole → drilling slotted holes at two ends → drilling a middle round hole, wherein burrs and deformation are caused due to uneven stress caused by the overlapping phenomenon of holes and grooves in the drilling process, and adverse effects are caused on products.
Disclosure of Invention
In order to solve the above problems, an object of the present invention is to provide a circuit board negative and a method for processing the same, which can effectively solve the problem of burr and deformation of a slot.
In order to make up for the defects of the prior art, the embodiment of the invention adopts the following technical scheme:
in one aspect, an embodiment of the present invention provides a circuit board negative, where the circuit board negative is provided with a slot, where the slot includes a first portion, a second portion, and a third portion, the second portion is connected between the first portion and the third portion, a left side of the first portion is an arc curved surface, an upper surface and a lower surface of the first portion are parallel surfaces, both the upper surface and the lower surface of the second portion are arc curved surfaces, and the third portion and the first portion are symmetric with respect to the second portion.
To the circuit board negative, the circuit board negative adopts the dry film lid hole, as long as porose one partially, then has the risk that etching liquid medicine oozes into the hole, forms the bad hole that the test machine can not measure, the circuit board negative, the circular arc curved surface that sets up can alleviate the angle of cutting, avoids the cutting to form the closed angle and produces the burr, has alleviated the risk that etching liquid medicine oozes into the hole and brings to a certain extent.
Further, the radius of the circular arc curved surface of the first part is 0.7-0.8 mm.
Further, the distance between the upper and lower surfaces of the first portion is 2.5 to 2.8 mm.
Further, the radius of the circular arc curved surface of the second part is 1.5 to 1.7 mm.
In another aspect, a method for processing a circuit board negative, the circuit board negative being provided with a slot, the slot including a first portion, a second portion and a third portion, the second portion being connected between the first portion and the third portion, a left side of the first portion being a circular arc curved surface, an upper surface and a lower surface of the first portion being parallel surfaces, an upper surface and a lower surface of the second portion being circular arc curved surfaces, the third portion being symmetrical to the first portion with respect to the second portion, includes the steps of:
firstly, determining the edge position of a slot on the negative sheet of the circuit board;
setting a starting hole at one end part of the edge of the slotted hole;
cutting along the edge of the slotted hole from the inner side of the starting hole by using a milling cutter;
and fourthly, electroplating the slotted hole.
Compared with the traditional punching mode, the method has the advantages that the gong cutter is used for cutting from the inner side of the starting hole along the edge of the slotted hole to form the slotted hole, the blade and the stress direction are transverse and are similar to those of a drill point, but the stress and the cutting direction of the drill point are on the drill point, so that the problem that the slotted hole generates burrs and is deformed can be effectively solved, in addition, the starting hole is arranged at one end part of the edge of the slotted hole before the gong cutter is used for cutting, so that the gong cutter can be conveniently used for cutting, and the damage to the plate can be prevented. Therefore, the cutting device is simple and reasonable in design, can accurately and stably cut a negative film of a circuit board, effectively solves the problem that the slotted hole generates burrs and deformation, and has excellent service performance.
Further, a starting hole is arranged at one end of the edge of the slotted hole, the edge of the starting hole is positioned at the inner side of the edge of the slotted hole, and the shortest distance between the starting hole and the edge of the slotted hole is 0.05 mm.
Further, a starting hole is provided at one end of the edge of the slot hole, and the shape of the starting hole is set to be circular.
Further, cutting along the edge of the slotted hole from the inner side of the starting hole by using a milling cutter, firstly, roughly milling the circuit board negative film in a clockwise direction by using the milling cutter, and reserving a plate with the thickness of 0.05 mm; and then carrying out secondary fine routing on the circuit board negative film according to the clockwise direction by using a routing knife.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
The following description of the preferred embodiments of the present invention will be made in conjunction with the accompanying drawings.
FIG. 1 is a schematic view of a slot according to an embodiment of the present invention;
FIG. 2 is a process flow diagram of a circuit board negative of an embodiment of the invention;
FIG. 3 is a flow chart of further processing of a circuit board negative of an embodiment of the present invention.
Detailed Description
Reference will now be made in detail to the present preferred embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to like elements throughout.
In the description of the present invention, it should be understood that the orientation or positional relationship referred to in the description of the orientation, such as the upper, lower, front, rear, left, right, etc., is based on the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
In the description of the present invention, unless otherwise explicitly limited, terms such as arrangement, installation, connection and the like should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above terms in the present invention in combination with the specific contents of the technical solutions.
The embodiments of the present invention are explained in the following with reference to the drawings.
Referring to fig. 1, an embodiment of the present invention provides a circuit board negative, the circuit board negative is provided with a slot 100, the slot 100 includes a first portion 101, a second portion 102 and a third portion 103, the second portion 102 is connected between the first portion 101 and the third portion 103, a left side of the first portion 101 is an arc curved surface, upper and lower surfaces of the first portion 101 are parallel surfaces, upper and lower surfaces of the second portion 102 are arc curved surfaces, and the third portion 103 is symmetrical to the first portion 101 with respect to the second portion 102, and the curved surfaces can mitigate a cutting angle and prevent burrs from being generated due to sharp corners formed by cutting.
In the present embodiment, the radius of the circular arc curved surface of the first portion 101 is 0.7 to 0.8 mm.
In the present embodiment, the distance between the upper and lower surfaces of the first portion 101 is 2.5 to 2.8 mm.
In the present embodiment, the radius of the circular arc curved surface of the second portion 102 is 1.5 to 1.7 mm.
Referring to fig. 2, further, an embodiment of the present invention further provides a method for processing a circuit board negative, the circuit board negative is provided with a slot 100, the slot 100 includes a first portion 101, a second portion 102 and a third portion 103, the second portion 102 is connected between the first portion 101 and the third portion 103, a left side of the first portion 101 is a circular arc curved surface, upper and lower surfaces of the first portion 101 are parallel surfaces, upper and lower surfaces of the second portion 102 are circular arc curved surfaces, and the third portion 103 and the first portion 101 are symmetrical with respect to the second portion 102, including the steps of:
s100, determining the edge position of a slot on a negative plate of a circuit board;
s200, arranging a starting hole at one end part of the edge of the slot hole;
s300, cutting and digging along the edge of the slotted hole from the inner side of the initial hole;
s400, electroplating the slotted hole.
According to the processing method of the circuit board negative film provided by the embodiment of the invention, the gong cutter is used for cutting from the inner side of the starting hole 110 along the edge of the slotted hole 100 to form the slotted hole 100, the gong cutter is mainly used for cutting, the blade and the stress direction are transverse and are similar to a drill point, but the stress and the cutting direction of the drill point are at the drill point, so that the problem that the slotted hole 100 generates burrs and is deformed can be effectively solved, in addition, the starting hole 110 is arranged at one end part of the edge of the slotted hole 100 before the gong cutter is used for cutting, so that the gong cutter can be conveniently used for cutting, and the plate material is prevented from being damaged. Therefore, the cutting device is simple and reasonable in design, can accurately and stably cut a negative film of the circuit board, effectively solves the problem that the slotted hole 100 generates burrs and deformation, and has excellent service performance.
In this embodiment, a start hole 110 is provided at one end of the edge of the slot 100, the edge of the start hole 110 is located inside the edge of the slot 100, and the start hole 110 is spaced more than 0.05mm from the edge of the slot 100.
In this embodiment, a start hole 110 is provided at one end of the edge of the slot 100, the start hole 110 is formed in a cylindrical shape, and a plate material with a thickness of 0.05mm is reserved, and the circular cutting can relax the cutting angle as much as possible.
Referring to fig. 3, in the present embodiment, a gong cutter is used to cut along the edge of the slot 100 from the inner side of the start hole 110, and cut along the edge of the slot from the inner side of the start hole 110: s301, carrying out primary coarse routing on the negative film of the circuit board in the clockwise direction, and reserving a plate with the thickness of 0.05 mm; and S302, performing secondary fine routing on the negative film of the circuit board in the clockwise direction. The cutting speed of the rough gong can be as fast as possible, and the speed of the fine gong can be slower, so that the processing quality is improved.
While the preferred embodiments and basic principles of the present invention have been described in detail, it will be understood by those skilled in the art that the invention is not limited to the embodiments, but is intended to cover various modifications, equivalents and alternatives falling within the scope of the invention as claimed.
Claims (8)
1. A circuit board negative, characterized in that: the negative film of the circuit board is provided with a slotted hole, the slotted hole comprises a first part, a second part and a third part, the second part is connected between the first part and the third part, the left side of the first part is an arc curved surface, the upper surface and the lower surface of the first part are parallel surfaces, the upper surface and the lower surface of the second part are arc curved surfaces, and the third part and the first part are symmetrical about the second part.
2. The circuit board negative of claim 1, wherein: the radius of the circular arc curved surface of the first part is 0.7-0.8 mm.
3. The circuit board negative of claim 1, wherein: the distance between the upper and lower surfaces of the first portion is 2.5 to 2.8 mm.
4. The circuit board negative of claim 1, wherein: the radius of the circular arc curved surface of the second part is 1.5-1.7 mm.
5. A processing method of a circuit board negative film is characterized in that: the circuit board negative is provided with a slot, the slot comprises a first part, a second part and a third part, the second part is connected between the first part and the third part, the left side of the first part is an arc curved surface, the upper surface and the lower surface of the first part are parallel surfaces, the upper surface and the lower surface of the second part are arc curved surfaces, and the third part and the first part are symmetrical about the second part, the method comprises the following steps:
firstly, determining the edge position of a slot on the negative sheet of the circuit board;
setting a starting hole at one end part of the edge of the slotted hole;
cutting along the edge of the slotted hole from the inner side of the starting hole;
and fourthly, electroplating the slotted hole.
6. The method as claimed in claim 5, wherein a starting hole is provided at one end of the slot edge, the edge of the starting hole is located inside the slot edge, and the distance from the starting hole to the slot edge is greater than 0.05 mm.
7. The method as claimed in claim 5, wherein a starting hole is formed at one end of the edge of the slot hole, and the starting hole is formed in a circular shape.
8. The method of claim 5, wherein the cutting is performed along the edge of the slot hole from the inner side of the starting hole by a gong cutter, and the method comprises:
firstly, carrying out one-time rough routing on the negative film of the circuit board in a clockwise direction, and reserving a plate with the thickness of 0.05 mm;
and secondly, performing secondary fine routing on the negative film of the circuit board in a clockwise direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110037280.3A CN112616258B (en) | 2021-01-12 | 2021-01-12 | Circuit board negative film and processing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110037280.3A CN112616258B (en) | 2021-01-12 | 2021-01-12 | Circuit board negative film and processing method thereof |
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| CN112616258A true CN112616258A (en) | 2021-04-06 |
| CN112616258B CN112616258B (en) | 2022-06-17 |
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Citations (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102045948A (en) * | 2010-12-30 | 2011-05-04 | 东莞生益电子有限公司 | Method for manufacturing PCB by laminating metal substrate with non-flow prepreg |
| CN103369846A (en) * | 2013-06-28 | 2013-10-23 | 昆山元茂电子科技有限公司 | Special-shaped hole deburring method |
| CN104259502A (en) * | 2014-08-06 | 2015-01-07 | 奥士康科技（益阳）有限公司 | Machining method of short slotted hole of PCB (printed circuit board) |
| CN104354084A (en) * | 2014-11-07 | 2015-02-18 | 梅州市志浩电子科技有限公司 | De-burring method for high-frequency printed circuit board |
| CN104582274A (en) * | 2013-10-11 | 2015-04-29 | 深圳崇达多层线路板有限公司 | Machine method of PTFE copper-clad plate |
| CN105228347A (en) * | 2015-08-14 | 2016-01-06 | 景旺电子科技(龙川)有限公司 | A kind of PCB jigsaw gong plate method |
| CN105430917A (en) * | 2015-11-30 | 2016-03-23 | 江门崇达电路技术有限公司 | Method for fabricating connected slot in PCB |
| CN105611733A (en) * | 2016-02-23 | 2016-05-25 | 江苏博敏电子有限公司 | Control method for forming size of printed circuit board (PCB) |
| CN106255321A (en) * | 2016-08-10 | 2016-12-21 | 奥士康精密电路（惠州）有限公司 | A kind of gong plate edges of boards are without dust technique |
| CN106255320A (en) * | 2016-08-10 | 2016-12-21 | 奥士康精密电路（惠州）有限公司 | A kind of gong PTH half bore method |
| CN106341947A (en) * | 2016-03-31 | 2017-01-18 | 东莞生益电子有限公司 | Circuit board manufacturing method |
| CN107072049A (en) * | 2017-03-28 | 2017-08-18 | 江门市高智电子科技有限公司 | Gong groove technique for BT plates |
| CN107645840A (en) * | 2017-10-24 | 2018-01-30 | 高德（江苏）电子科技有限公司 | A kind of method for improving the intersecting hole bur of groove circle |
| US20180054892A1 (en) * | 2016-08-19 | 2018-02-22 | Nextgin Technology Bv | Method for producing a printed circuit board |
| CN207283918U (en) * | 2017-10-13 | 2018-04-27 | 深圳鼎智通讯股份有限公司 | A kind of negative film module board for being used to make half bore pad |
| CN108174513A (en) * | 2017-12-28 | 2018-06-15 | 广州兴森快捷电路科技有限公司 | Wiring board and its processing method, the processing method of power amplifier slot |
| CN108200726A (en) * | 2018-02-08 | 2018-06-22 | 深圳市昶东鑫线路板有限公司 | Wiring board 0.3mm metallized semi-pore processing technologys |
| CN108377612A (en) * | 2018-01-29 | 2018-08-07 | 奥士康精密电路（惠州）有限公司 | A kind of PCB blind slots bottom circuit processing technology |
| CN108381119A (en) * | 2018-01-29 | 2018-08-10 | 奥士康精密电路（惠州）有限公司 | A kind of PCB buries copper coin copper billet blind slot control depth method |
| CN108556045A (en) * | 2018-03-07 | 2018-09-21 | 大连崇达电子有限公司 | A kind of method in drill straight chamfered groove hole |
| CN109041432A (en) * | 2018-09-07 | 2018-12-18 | 江门市奔力达电路有限公司 | A kind of method and method for manufacturing circuit board improving wiring board gong plate burr |
| CN109348637A (en) * | 2018-10-24 | 2019-02-15 | 江门崇达电路技术有限公司 | A kind of film aligning method for preventing negative film plate circuit etching not clean |
| CN109600922A (en) * | 2018-12-17 | 2019-04-09 | 惠州市大亚湾科翔科技电路板有限公司 | A kind of special size PCB forming method |
| CN109757041A (en) * | 2017-11-07 | 2019-05-14 | 北大方正集团有限公司 | The process implementation method of the vertical cabling of hole wall selectivity |
| CN110465689A (en) * | 2019-08-31 | 2019-11-19 | 重庆房地产职业学院 | Printed board mills the processing method of inside groove twice |
| CN110557885A (en) * | 2019-08-13 | 2019-12-10 | 胜宏科技（惠州）股份有限公司 | manufacturing process of copper substrate with double-sided sandwich thermoelectric separation structure |
| CN111148351A (en) * | 2019-12-18 | 2020-05-12 | 惠州市金百泽电路科技有限公司 | Processing method of 5G small-sized base station power amplifier module PCB with step groove |
| CN111787698A (en) * | 2020-07-13 | 2020-10-16 | 黄石星河电路有限公司 | Z-shaped slot hole machining method |
-
2021
- 2021-01-12 CN CN202110037280.3A patent/CN112616258B/en active Active
Patent Citations (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102045948A (en) * | 2010-12-30 | 2011-05-04 | 东莞生益电子有限公司 | Method for manufacturing PCB by laminating metal substrate with non-flow prepreg |
| CN103369846A (en) * | 2013-06-28 | 2013-10-23 | 昆山元茂电子科技有限公司 | Special-shaped hole deburring method |
| CN104582274A (en) * | 2013-10-11 | 2015-04-29 | 深圳崇达多层线路板有限公司 | Machine method of PTFE copper-clad plate |
| CN104259502A (en) * | 2014-08-06 | 2015-01-07 | 奥士康科技（益阳）有限公司 | Machining method of short slotted hole of PCB (printed circuit board) |
| CN104354084A (en) * | 2014-11-07 | 2015-02-18 | 梅州市志浩电子科技有限公司 | De-burring method for high-frequency printed circuit board |
| CN105228347A (en) * | 2015-08-14 | 2016-01-06 | 景旺电子科技(龙川)有限公司 | A kind of PCB jigsaw gong plate method |
| CN105430917A (en) * | 2015-11-30 | 2016-03-23 | 江门崇达电路技术有限公司 | Method for fabricating connected slot in PCB |
| CN105611733A (en) * | 2016-02-23 | 2016-05-25 | 江苏博敏电子有限公司 | Control method for forming size of printed circuit board (PCB) |
| CN106341947A (en) * | 2016-03-31 | 2017-01-18 | 东莞生益电子有限公司 | Circuit board manufacturing method |
| CN106255321A (en) * | 2016-08-10 | 2016-12-21 | 奥士康精密电路（惠州）有限公司 | A kind of gong plate edges of boards are without dust technique |
| CN106255320A (en) * | 2016-08-10 | 2016-12-21 | 奥士康精密电路（惠州）有限公司 | A kind of gong PTH half bore method |
| US20180054892A1 (en) * | 2016-08-19 | 2018-02-22 | Nextgin Technology Bv | Method for producing a printed circuit board |
| CN107072049A (en) * | 2017-03-28 | 2017-08-18 | 江门市高智电子科技有限公司 | Gong groove technique for BT plates |
| CN207283918U (en) * | 2017-10-13 | 2018-04-27 | 深圳鼎智通讯股份有限公司 | A kind of negative film module board for being used to make half bore pad |
| CN107645840A (en) * | 2017-10-24 | 2018-01-30 | 高德（江苏）电子科技有限公司 | A kind of method for improving the intersecting hole bur of groove circle |
| CN109757041A (en) * | 2017-11-07 | 2019-05-14 | 北大方正集团有限公司 | The process implementation method of the vertical cabling of hole wall selectivity |
| CN108174513A (en) * | 2017-12-28 | 2018-06-15 | 广州兴森快捷电路科技有限公司 | Wiring board and its processing method, the processing method of power amplifier slot |
| CN108377612A (en) * | 2018-01-29 | 2018-08-07 | 奥士康精密电路（惠州）有限公司 | A kind of PCB blind slots bottom circuit processing technology |
| CN108381119A (en) * | 2018-01-29 | 2018-08-10 | 奥士康精密电路（惠州）有限公司 | A kind of PCB buries copper coin copper billet blind slot control depth method |
| CN108200726A (en) * | 2018-02-08 | 2018-06-22 | 深圳市昶东鑫线路板有限公司 | Wiring board 0.3mm metallized semi-pore processing technologys |
| CN108556045A (en) * | 2018-03-07 | 2018-09-21 | 大连崇达电子有限公司 | A kind of method in drill straight chamfered groove hole |
| CN109041432A (en) * | 2018-09-07 | 2018-12-18 | 江门市奔力达电路有限公司 | A kind of method and method for manufacturing circuit board improving wiring board gong plate burr |
| CN109348637A (en) * | 2018-10-24 | 2019-02-15 | 江门崇达电路技术有限公司 | A kind of film aligning method for preventing negative film plate circuit etching not clean |
| CN109600922A (en) * | 2018-12-17 | 2019-04-09 | 惠州市大亚湾科翔科技电路板有限公司 | A kind of special size PCB forming method |
| CN110557885A (en) * | 2019-08-13 | 2019-12-10 | 胜宏科技（惠州）股份有限公司 | manufacturing process of copper substrate with double-sided sandwich thermoelectric separation structure |
| CN110465689A (en) * | 2019-08-31 | 2019-11-19 | 重庆房地产职业学院 | Printed board mills the processing method of inside groove twice |
| CN111148351A (en) * | 2019-12-18 | 2020-05-12 | 惠州市金百泽电路科技有限公司 | Processing method of 5G small-sized base station power amplifier module PCB with step groove |
| CN111787698A (en) * | 2020-07-13 | 2020-10-16 | 黄石星河电路有限公司 | Z-shaped slot hole machining method |
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| CN112616258B (en) | 2022-06-17 |
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