CN108381119A - A kind of PCB buries copper coin copper billet blind slot control depth method - Google Patents
A kind of PCB buries copper coin copper billet blind slot control depth method Download PDFInfo
- Publication number
- CN108381119A CN108381119A CN201810082968.1A CN201810082968A CN108381119A CN 108381119 A CN108381119 A CN 108381119A CN 201810082968 A CN201810082968 A CN 201810082968A CN 108381119 A CN108381119 A CN 108381119A
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- CN
- China
- Prior art keywords
- pcb
- milling
- gong
- copper coin
- blind slot
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23C—MILLING
- B23C3/00—Milling particular work; Special milling operations; Machines therefor
- B23C3/28—Grooving workpieces
- B23C3/34—Milling grooves of other forms, e.g. circumferential
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Milling Processes (AREA)
Abstract
The present invention relates to PCB technology field, discloses a kind of PCB and bury copper coin copper billet blind slot control depth method, include the following steps:A. copper coin drilling is buried to PCB；B. copper coin is buried to PCB and grinds burr；C. copper coin milling blind slot is buried to PCB；D. copper coin is buried to PCB and carries out heavy copper plate electric；Experiment proves that this method, improves the quality of product, the requirement of client has been better met.
Description
Technical field
The present invention relates to PCB manufacture fields, and in particular to a kind of PCB buries copper coin copper billet blind slot control depth method.
Background technology
With the multifunctionality development of electronic product, the application for being embedded into copper billet PCB is more and more extensive, and customer demand is more next
Bigger, the requirement to copper billet is also continuously increased, this technique is by the research to the inside groove control depth of buried copper billet in core plate, constantly
The technological ability for promoting our company, meets the needs of client, to improve enterprise profit and promote company's synthesized competitiveness, captures
And expands occupation rate of market and be determined to win.
The traditional handicraft in combined circuit board field is obtained a set of by the continuous research to the design of gong band, manufacturing parameter etc.
Ripe copper billet control depth technique improves the manufacturing process ability of our company to meet the requirement of client.
Invention content
The purpose of the present invention is to provide a kind of PCB to bury copper coin copper billet blind slot control depth method, solves trench bottom flatness and asks
Topic and slot burr problem, and ensure the tolerance of the deep depth of control under the deep gong machine operation of non-control.
Technical scheme is as follows：
A kind of PCB buries copper coin copper billet blind slot control depth method, includes the following steps:
A. copper coin drilling is buried to PCB；
B. copper coin is buried to PCB and grinds burr；
C. copper coin milling blind slot is buried to PCB；
D. copper coin is buried to PCB and carries out heavy copper plate electric；
Wherein, the milling blind slot includes the following steps：
One, designs gong band：Milling cutter cuts point and is arranged in the blind slot center, and milling cutter feed circuit is rectangular-ambulatory-plane, cutting line
Overlapping widths be knife diameter size 40 ± 5%；It is consistent that rectangular-ambulatory-plane feed can control each circle all directions stress of milling cutter, reduces
The groove milling bottom surface out-of-flatness caused by milling cutter deformation.The blind slot is located at PCB and buries on the copper billet of copper coin.
For two, using backing plate pad on mill table, milling backing plate obtains level table；
Three, by PCB bury copper coin be placed on level table carry out according to the gong band carry out gong blind slot process：Thick gong is used for the first time
The gong plate depth of process, thick puncher sequence is the deep depth of design control（Such as the blind slot depth of customer requirement）Subtract 0.1-0.15mm, thick gong
Milling cutter rotating speed is 29 ± 1KRPM, and it is 0.5 ± 0.1m/min to cut speed, and withdrawing speed is 10 ± 2m/min, and gong plate speed is 18
± 2m/s, for the second time using smart puncher sequence, the gong plate depth of smart puncher sequence is equal to design and controls deep depth, and smart gong milling cutter rotating speed is 29
± 1KRPM, it is 3 ± 0.3m/min to cut speed, and withdrawing speed is 10 ± 2m/min, and gong plate speed is 26 ± 2m/s.Design control
Depth is generally the control depth depth of customer requirement.
Further, the milling backing plate includes the following steps:
A. milling backing plate milling band is designed:Milling cutter feed circuit is that in a zigzag, milling cutter selects the flat-end cutter of 2.4mm knife diameters, walks cutter track
Line overlap degree is 0.1-0.2mm, and milling plate depth is the 20-55% of plate thickness；
B. backing plate to be milled is fixed on mill table；
C. milling backing plate is carried out.Because controlling the tolerance of deep trouth depth, plain-milling machine table top flatness is inadequate, is difficult to reach in production
To its tolerance, therefore the backing plate of one piece of 2.0mm is first fixed on production platform, the control of 1.0mm depth is first carried out to backing plate
The difference of height of table top is eliminated in deep milling.
Further, the milling cutter is flat-end cutter.
Further, any one in a diameter of 1.6mm, 1.8mm, 2.0mm, 2.4mm of the flat-end cutter.
After adopting the above technical scheme, present invention process passes through flow scheme improvements, using rectangular-ambulatory-plane feed, weight between knife and knife
Folded width is that 40 ± 5% gong band of knife diameter size designs, and is kept away plus backing plate and milling flat bolster on production platform when practical operation
Exempt from lathe table top out-of-flatness, smart puncher sequence is then added using thick puncher sequence, it is ensured that the flatness of trench bottom, while without burr
Residual.
Description of the drawings
Fig. 1 is gong band design drawing.
Fig. 2 is milling horizontal platform facing cut band design drawing.
Specific implementation mode
Below in conjunction with specific embodiments and the drawings, present invention is further described in detail.
In one preferred embodiment, a kind of PCB of the invention buries copper coin copper billet blind slot control depth method, includes the following steps:
A. copper coin drilling is buried to PCB；
B. copper coin is buried to PCB and grinds burr；
C. copper coin milling blind slot is buried to PCB；
D. copper coin is buried to PCB and carries out heavy copper plate electric；
Wherein, controlled depth milling blind slot includes the following steps：
One, designs gong band：Milling cutter knife diameter used is 2.4mm, and milling cutter cuts point and is arranged in blind slot center, and milling cutter feed circuit is
The overlapping widths of rectangular-ambulatory-plane, cutting line are 0.96mm；As shown in Figure 1, reference numeral 1 is to return sword a little, reference numeral 2 is to cut
Point, reference numeral 3 are blind slot masterplate, and reference numeral 4 is cutting line；On blind slot masterplate 3, milling cutter to cutting a little after 2, along
4 milling blind slot of cutting line is until returning sword a little 1, and milling cutter first a little 2 walks out to the right a certain distance from cutting, first gong band of formation,
It then back turns, walks out certain distance to the left, form Article 2 gong band, it is one that two gong bands, which have the part of overlapping, this part,
Stripe region with 0.96mm width, the i.e. overlapping widths of cutting line are 0.96mm, and it is tack milling to design the milling cutter used
Knife.
For two, using backing plate pad on mill table, milling backing plate obtains level table；
Milling backing plate includes the following steps:
A. milling backing plate milling band is designed:Milling cutter feed circuit is that in a zigzag, milling cutter selects the flat-end cutter of 2.4mm knife diameters, walks cutter track
Line overlap degree is 0.2mm, and plate thickness 2.5mm, milling plate depth is 0.5mm；As shown in Fig. 2, reference numeral 5 is to cut a little,
Reference numeral 6 is to return sword a little, and reference numeral 7 is cutting line, and reference numeral 8 is backing plate, milling cutter since cut a little 5 along word
7 feed of shape cutting line is to returning sword a little 6, and degree of overlapping is 0.2mm between cutting line 7, the complete a backing plate 8 of milling；
B. backing plate to be milled is fixed on mill table；
C. milling backing plate is carried out.
Three, gong plate processes：PCB is buried into copper coin and is placed in progress foundation gong band progress gong blind slot process on level table：Design
The deep depth of control is 1.0mm, uses thick puncher sequence for the first time, the gong plate depth of thick puncher sequence is 0.9mm, and thick gong milling cutter rotating speed is
29KRPM, it is 0.5m/min to cut speed, and withdrawing speed is 10m/min, and gong plate speed is 18m/s, and second using smart puncher
Sequence, the gong plate depth of smart puncher sequence is identical as thick puncher sequence, and smart gong milling cutter rotating speed is 30KRPM, and it is 3m/min to cut speed, is moved back
Knife speed is 10m/min, and gong plate speed is 26m/s.
Experiment proves that this optimal copper coin control depth technological parameter and scheme, improve the mach flatness of copper billet and
Precision.
Although description of this invention combination embodiments above carries out, those skilled in the art
Member can carry out many replacements according to above-mentioned content, modifications and variations, be obvious.Therefore, it is all it is such substitute,
It improves and variation is included in the spirit and scope of appended claims.
Claims (4)
1. a kind of PCB buries copper coin copper billet blind slot control depth method, which is characterized in that include the following steps:
A. copper coin drilling is buried to PCB；
B. copper coin is buried to PCB and grinds burr；
C. copper coin milling blind slot is buried to PCB；
D. copper coin is buried to PCB and carries out heavy copper plate electric；
Wherein, the milling blind slot includes the following steps：
One, designs gong band：Milling cutter cuts point and is arranged in the blind slot center, and milling cutter feed circuit is rectangular-ambulatory-plane, cutting line
Overlapping widths be knife diameter size 40 ± 5%；
For two, using backing plate pad on mill table, milling backing plate obtains level table；
Three, by PCB bury copper coin be placed on level table carry out according to the gong band carry out gong blind slot process：Thick gong is used for the first time
The gong plate depth of process, thick puncher sequence is the deep depth minus 0.1-0.15mm of design control, and thick gong milling cutter rotating speed is 29 ± 1KRPM, under
Knife speed is 0.5 ± 0.1m/min, and withdrawing speed is 10 ± 2m/min, and gong plate speed is 18 ± 2m/s, and second using smart gong
Process, the gong plate depth of smart puncher sequence are equal to the deep depth of design control, and smart gong milling cutter rotating speed is 29 ± 1KRPM, cut speed be 3 ±
0.3m/min, withdrawing speed are 10 ± 2m/min, and gong plate speed is 26 ± 2m/s.
2. PCB according to claim 1 buries copper coin copper billet blind slot control depth method, which is characterized in that the milling backing plate packet
Include following steps:
A. milling backing plate milling band is designed:Milling cutter feed circuit is that in a zigzag, milling cutter selects the flat-end cutter of 2.4mm knife diameters, walks cutter track
Line overlap degree is 0.1-0.2mm, and milling plate depth is the 20-55% of plate thickness；
B. backing plate to be milled is fixed on mill table；
C. milling backing plate is carried out.
3. PCB according to claim 1 or 2 buries copper coin copper billet blind slot control depth method, which is characterized in that the milling cutter is
Flat-end cutter.
4. PCB according to claim 3 buries copper coin copper billet blind slot control depth method, which is characterized in that the flat-end cutter
A diameter of 1.6mm, 1.8mm, 2.0mm, 2.4mm in any one.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810082968.1A CN108381119A (en) | 2018-01-29 | 2018-01-29 | A kind of PCB buries copper coin copper billet blind slot control depth method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810082968.1A CN108381119A (en) | 2018-01-29 | 2018-01-29 | A kind of PCB buries copper coin copper billet blind slot control depth method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108381119A true CN108381119A (en) | 2018-08-10 |
Family
ID=63074209
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810082968.1A Pending CN108381119A (en) | 2018-01-29 | 2018-01-29 | A kind of PCB buries copper coin copper billet blind slot control depth method |
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| CN (1) | CN108381119A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112616258A (en) * | 2021-01-12 | 2021-04-06 | 广东世运电路科技股份有限公司 | Circuit board negative film and processing method thereof |
| CN113000915A (en) * | 2021-03-04 | 2021-06-22 | 白荣益 | Device for automatically adjusting milling groove depth of circuit board by utilizing electromagnetic strength |
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| EP1445999A1 (en) * | 2003-02-07 | 2004-08-11 | Sony Ericsson Mobile Communications AB | A method of providing a PWB with a shield can and a PWB therefor |
| CN101594742A (en) * | 2008-05-29 | 2009-12-02 | 华为技术有限公司 | The equipment of the manufacture method of circuit board step trough and circuit board manufacturing step trough |
| CN103561543A (en) * | 2013-11-13 | 2014-02-05 | 惠州中京电子科技股份有限公司 | PCB countersunk groove processing method |
| CN104661433A (en) * | 2013-11-20 | 2015-05-27 | 江苏苏杭电子有限公司 | Processing technology of PCB stepped slot |
| CN106255321A (en) * | 2016-08-10 | 2016-12-21 | 奥士康精密电路（惠州）有限公司 | A kind of gong plate edges of boards are without dust technique |
| CN106332475A (en) * | 2016-08-30 | 2017-01-11 | 江西景旺精密电路有限公司 | Manufacturing method for depth-control stepped metalized blind groove PCB |
| CN206118166U (en) * | 2016-10-28 | 2017-04-19 | 惠州美锐电子科技有限公司 | Bury copper billet PCB board |
| CN106961795A (en) * | 2017-03-24 | 2017-07-18 | 江门崇达电路技术有限公司 | A kind of PCB forming methods |
| CN107484342A (en) * | 2017-08-22 | 2017-12-15 | 长沙牧泰莱电路技术有限公司 | A kind of ceramic PCB support plates preparation method of the materials of FR 4 |
| CN107580417A (en) * | 2017-08-30 | 2018-01-12 | 奥士康精密电路（惠州）有限公司 | Copper-based plate hole prints mechanical lapping minimizing technology |
-
2018
- 2018-01-29 CN CN201810082968.1A patent/CN108381119A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1445999A1 (en) * | 2003-02-07 | 2004-08-11 | Sony Ericsson Mobile Communications AB | A method of providing a PWB with a shield can and a PWB therefor |
| CN101594742A (en) * | 2008-05-29 | 2009-12-02 | 华为技术有限公司 | The equipment of the manufacture method of circuit board step trough and circuit board manufacturing step trough |
| CN103561543A (en) * | 2013-11-13 | 2014-02-05 | 惠州中京电子科技股份有限公司 | PCB countersunk groove processing method |
| CN104661433A (en) * | 2013-11-20 | 2015-05-27 | 江苏苏杭电子有限公司 | Processing technology of PCB stepped slot |
| CN106255321A (en) * | 2016-08-10 | 2016-12-21 | 奥士康精密电路（惠州）有限公司 | A kind of gong plate edges of boards are without dust technique |
| CN106332475A (en) * | 2016-08-30 | 2017-01-11 | 江西景旺精密电路有限公司 | Manufacturing method for depth-control stepped metalized blind groove PCB |
| CN206118166U (en) * | 2016-10-28 | 2017-04-19 | 惠州美锐电子科技有限公司 | Bury copper billet PCB board |
| CN106961795A (en) * | 2017-03-24 | 2017-07-18 | 江门崇达电路技术有限公司 | A kind of PCB forming methods |
| CN107484342A (en) * | 2017-08-22 | 2017-12-15 | 长沙牧泰莱电路技术有限公司 | A kind of ceramic PCB support plates preparation method of the materials of FR 4 |
| CN107580417A (en) * | 2017-08-30 | 2018-01-12 | 奥士康精密电路（惠州）有限公司 | Copper-based plate hole prints mechanical lapping minimizing technology |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112616258A (en) * | 2021-01-12 | 2021-04-06 | 广东世运电路科技股份有限公司 | Circuit board negative film and processing method thereof |
| CN113000915A (en) * | 2021-03-04 | 2021-06-22 | 白荣益 | Device for automatically adjusting milling groove depth of circuit board by utilizing electromagnetic strength |
| CN113000915B (en) * | 2021-03-04 | 2022-07-15 | 恩达电路(深圳)有限公司 | Device for automatically adjusting milling groove depth of circuit board by using electromagnetic strength |
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Application publication date: 20180810 |