CN106255321A - A kind of gong plate edges of boards are without dust technique - Google Patents
A kind of gong plate edges of boards are without dust technique Download PDFInfo
- Publication number
- CN106255321A CN106255321A CN201610648463.8A CN201610648463A CN106255321A CN 106255321 A CN106255321 A CN 106255321A CN 201610648463 A CN201610648463 A CN 201610648463A CN 106255321 A CN106255321 A CN 106255321A
- Authority
- CN
- China
- Prior art keywords
- gong
- cutter
- plate
- wiring board
- serration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0228—Cutting, sawing, milling or shearing
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Milling Processes (AREA)
Abstract
The present invention provide a kind of gong plate edges of boards without dust technique, including: gong band designs;The lower cutter point of wiring board inside groove is arranged at interior groove center, and the lower cutter point of wiring board housing is arranged at outside wiring board gong plate machining cell, prevents that wiring board gong plate machining cell edge is concavo-convex dust glue slag occurs;Tools selection;Select and grab the beat gong cutter holder head less than 30um after cutter, and select bastard gong cutter and the serration gong cutter of dimension according to the design of gong band；Gong plate is processed;Successively using bastard gong cutter and serration gong cutter to carry out thick gong and essence gong according to the design of gong band, remove part not on wiring board during thick gong, coarse edges of boards during essence gong formed thick gong carry out deburring of polishing；High-pressure washing;Residual dust glue slag on wiring board after gong plate is processed is rinsed well.This technique can be effectively improved product processing quality, and implementation cost is relatively low, and contrast " spraying ink bound edge " mode cost reduces by more than 40%, has the powerful market competitiveness.
Description
Technical field
The present invention relates to wiring board manufacture field, be specifically related to a kind of gong plate edges of boards without dust technique.
Background technology
Along with the technological innovation of electronic product, common gong plate edges of boards quality can not meet the demand in market, many clients
Electronic product develop to high-performance, no pollution, zero dust, the direction of zero soft flocks.Without dust plate on current high electronic market
Ratio is greatly improved, and for guarantee edges of boards without dust, each PCB producer commonly uses the method for spraying ink bound edge, but it becomes
This high efficiency is low.
Summary of the invention
For the problems referred to above, the present invention provide a kind of gong plate edges of boards without dust technique, including:
Gong band designs;The lower cutter point of wiring board inside groove is arranged at interior groove center, and the lower cutter point of wiring board housing is arranged at wiring board
Outside gong plate machining cell, prevent that wiring board gong plate machining cell edge is concavo-convex dust glue slag occurs;
Tools selection;Select and grab the beat gong cutter holder head less than 30um after cutter, and select dimension according to the design of gong band
Bastard gong cutter and serration gong cutter；
Gong plate is processed;Design according to gong band, gong machine successively uses bastard gong cutter and serration gong cutter wiring board is carried out thick gong
With essence gong, removing part not on wiring board during thick gong, coarse edges of boards during essence gong formed thick gong carry out deburring of polishing；
High-pressure washing;Residual dust glue slag on wiring board after gong plate is processed is rinsed well.
Preferably, the bastard gong cutter of selection is consistent with the cutter footpath specification of serration gong cutter, prevents from causing gong plate because R angle is different
The corner's residual dust glue slag formed.
Further, adding man-hour carrying out gong plate, during gong wiring board inside groove, the cutter footpath offset of thick gong and thin gong compares bastard
Little 0.04 ~ the 0.09mm in cutter footpath of gong cutter and serration gong cutter;During gong wiring board housing, the cutter footpath offset of thick gong and thin gong compares bastard
Big 0.06 ~ the 0.12mm in cutter footpath of gong cutter and serration gong cutter.
Further, add man-hour carrying out gong plate, the cutter footpath of thick gong compensate less by 0.01 than the cutter footpath offset of thin gong ~
0.02mm。
Preferably, add man-hour carrying out gong plate, when the cutter footpath of the bastard gong cutter used and serration gong cutter is 0.8 ~ 1.0mm
Time, gong owner's axle speed setting is 38 ~ 40krpm, and lower cutter speed is set to 0.2 ~ 0.7m/min, and withdrawing speed is set to 4 ~ 8m/min, thick gong
Plate speed is set to 2 ~ 6mm/sec, and the bastard gong cutter life-span is set to 5 ~ 10m, and essence gong plate speed is set to 6 ~ 20 mm/sec, serration gong cutter life-span
It is set to 8 ~ 15m.
Preferably, add man-hour carrying out gong plate, when the cutter footpath of the bastard gong cutter used and serration gong cutter is 1.2 ~ 1.6mm
Time, gong owner's axle speed setting is 33 ~ 37krpm, and lower cutter speed is set to 0.8 ~ 1.2m/min, and withdrawing speed is set to 9 ~ 11m/min, slightly
Gong plate speed is set to 7 ~ 18mm/sec, and the bastard gong cutter life-span is set to 15 ~ 25m, and essence gong plate speed is set to 15 ~ 40 mm/sec, serration gong cutter
Life-span is set to 20 ~ 30m.
Preferably, add man-hour carrying out gong plate, when the cutter footpath of the bastard gong cutter used and serration gong cutter is 1.8 ~ 2.4mm
Time, gong owner's axle speed setting is 28 ~ 30krpm, and lower cutter speed is set to 0.8 ~ 1.2m/min, and withdrawing speed is set to 9 ~ 11m/min, slightly
Gong plate speed is set to 17 ~ 27mm/sec, and the bastard gong cutter life-span is set to 30 ~ 35m, and essence gong plate speed is set to 25 ~ 45 mm/sec, serration gong
The cutter life-span is set to 35 ~ 40m.
Further, carrying out gong plate and add man-hour, the rotating speed deviation value of gong owner's axle is less than ± 3 krpm.
Preferably, add man-hour at gong plate, polylith wiring board can be gathered into folds and be processed simultaneously；Be 1.2 to thickness of slab ~
When the wiring board of 1.6mm carries out gong plate, lamination quantity is folded less than 3pnl/, in order to cleaning dust glue slag.
The present invention utilizes serration cutter to carry out essence gong, wiring board edges of boards carries out deburring of polishing, makes edges of boards more smooth, and pin
Gong cutter to different size has carried out the optimization of gong plate processing control parameter, and the problem making dust glue slag remain is addressed, and
Being effectively improved product processing quality, and implementation cost is relatively low, contrast " spraying ink bound edge " mode cost reduces by more than 40%,
There is the powerful market competitiveness.
Detailed description of the invention
Below in conjunction with specific embodiment, the present invention is described in further detail.
Embodiment 1, first carries out gong band design;The lower cutter point of wiring board inside groove is arranged at interior groove center, wiring board housing
Lower cutter point be arranged at outside wiring board gong plate machining cell, prevent that wiring board gong plate machining cell edge is concavo-convex dust glue occurs
Slag;Then tools selection is carried out;Select and grab the beat gong cutter holder head less than 30um after cutter, and select corresponding according to the design of gong band
The bastard gong cutter of specification and serration gong cutter；Then carry out gong plate processing, wiring board to be processed is carried out lamination, set according to gong band
Meter, successively uses bastard gong cutter and serration gong cutter that wiring board carries out thick gong and essence gong on gong machine, removes wiring board during thick gong
Upper part not, coarse edges of boards during essence gong formed thick gong carry out deburring of polishing；Last high-pressure washing;To add through gong plate
Residual dust glue slag on wiring board after work is rinsed well.Add man-hour at gong plate, can gather into folds to enter by polylith wiring board simultaneously
Row processing；When the wiring board that thickness of slab is 1.2 ~ 1.6mm is carried out gong plate, lamination quantity is folded less than 3pnl/, in order to cleaning powder
Dirt glue slag.
When the cutter footpath of the bastard gong cutter used and serration gong cutter is 1.0mm, gong owner's axle speed setting is 38 ± 3
Krpm, lower cutter speed is set to 0.7m/min, and withdrawing speed is set to 8m/min, and thick gong plate speed is set to 5mm/sec, and the bastard gong cutter life-span is set to
10m, essence gong plate speed is set to 20 mm/sec, and the serration gong cutter life-span is set to 15m.During gong wiring board inside groove, the cutter footpath offset of thick gong
For 0.94mm, the cutter footpath offset of essence gong is 0.96 mm, and during gong wiring board housing, the cutter footpath offset of thick gong is 1.14mm, essence
The cutter footpath offset of gong is 1.12 mm.
Embodiment 2, adds man-hour carrying out gong plate, when the cutter footpath of the bastard gong cutter used and serration gong cutter is 1.5mm, and gong
Owner's axle speed setting is 34 ± 3 krpm, and lower cutter speed is set to 1m/min, and withdrawing speed is set to 10m/min, and thick gong plate speed is set to
17mm/sec, the bastard gong cutter life-span is set to 25m, and essence gong plate speed is set to 35 mm/sec, and the serration gong cutter life-span is set to 30m, bastard gong
Cutter and serration gong cutter life-span allow ± the deviation value of 2m.During gong wiring board inside groove, the cutter footpath offset of thick gong is 1.44mm, essence
The cutter footpath offset of gong is 1.46 mm, and during gong wiring board housing, the cutter footpath offset of thick gong is 1.60mm, and the cutter footpath of essence gong is mended
Repaying value is 1.62 mm.
Embodiment 2, adds man-hour carrying out gong plate, when the cutter footpath of the bastard gong cutter used and serration gong cutter is 1.5mm, and gong
Owner's axle speed setting is 34 ± 3 krpm, and lower cutter speed is set to 1m/min, and withdrawing speed is set to 10m/min, and thick gong plate speed is set to
17mm/sec, the bastard gong cutter life-span is set to 25m, and essence gong plate speed is set to 35 mm/sec, and the serration gong cutter life-span is set to 30m, bastard gong
The cutter life-span allows ± the deviation value of 5m, and the serration gong cutter life-span allows ± the deviation value of 10m.During gong wiring board inside groove, thick gong
Cutter footpath offset be 1.44mm, the cutter footpath offset of essence gong is 1.46 mm, and during gong wiring board housing, the cutter footpath of thick gong compensates
Value is 1.60mm, and the cutter footpath offset of essence gong is 1.62 mm.
Embodiment 3, adds man-hour carrying out gong plate, when the cutter footpath of the bastard gong cutter used and serration gong cutter is 2.0mm, and gong
Owner's axle speed setting is 30 ± 3 krpm, and lower cutter speed is set to 1m/min, and withdrawing speed is set to 10m/min, and thick gong plate speed is set to
24mm/sec, the bastard gong cutter life-span is set to 30m, and essence gong plate speed is set to 45 mm/sec, and the serration gong cutter life-span is set to 40m, bastard gong
Cutter and serration gong cutter life-span allow ± the deviation value of 10m.During gong wiring board inside groove, the cutter footpath offset of thick gong is 1.94mm,
The cutter footpath offset of essence gong is 1.96 mm, and during gong wiring board housing, the cutter footpath offset of thick gong is 2.10mm, the cutter footpath of essence gong
Offset is 2.12 mm.
In the above-described embodiments, carried out the optimization of gong plate processing control parameter for the gong cutter of different size, made dust
The problem of glue slag residual is addressed, and is effectively improved product processing quality.
Carry out although the description of this invention combines embodiments above, but, those skilled in the art
Member can carry out many replacement, modifications and variations according to above-mentioned content, be apparent from.Therefore, all such replacements,
Improve and change is included in the spirit and scope of appended claims.
Claims (9)
1. gong plate edges of boards are without a dust technique, including:
Gong band designs;The lower cutter point of wiring board inside groove is arranged at interior groove center, and the lower cutter point of wiring board housing is arranged at wiring board
Outside gong plate machining cell, prevent that wiring board gong plate machining cell edge is concavo-convex dust glue slag occurs;
Tools selection;Select and grab the beat gong cutter holder head less than 30um after cutter, and select dimension according to the design of gong band
Bastard gong cutter and serration gong cutter；
Gong plate is processed;Design according to gong band, gong machine successively uses bastard gong cutter and serration gong cutter wiring board is carried out thick gong
With essence gong, removing part not on wiring board during thick gong, coarse edges of boards during essence gong formed thick gong carry out deburring of polishing；
High-pressure washing;Residual dust glue slag on wiring board after gong plate is processed is rinsed well.
2. according to gong plate edges of boards a kind of described in claim 1 without dust technique, it is characterised in that: the bastard gong cutter of selection and serration
The cutter footpath specification of gong cutter is consistent, prevents the corner's residual dust glue slag causing gong plate to be formed because R angle is different.
3. according to gong plate edges of boards a kind of described in claim 2 without dust technique, it is characterised in that: add man-hour, gong carrying out gong plate
During wiring board inside groove, the cutter footpath offset of thick gong and thin gong is than the little 0.04 ~ 0.09mm in cutter footpath of bastard gong cutter and serration gong cutter;Gong
During wiring board housing, the cutter footpath offset of thick gong and thin gong is than the big 0.06 ~ 0.12mm in cutter footpath of bastard gong cutter and serration gong cutter.
4. according to gong plate edges of boards a kind of described in claim 3 without dust technique, it is characterised in that: add man-hour, slightly carrying out gong plate
The cutter footpath of gong compensates the cutter footpath little 0.01 ~ 0.02mm of offset than thin gong.
5. according to gong plate edges of boards a kind of described in claim 4 without dust technique, it is characterised in that: add man-hour carrying out gong plate, when
When the bastard gong cutter used and the cutter footpath of serration gong cutter are 0.8 ~ 1.0mm, gong owner's axle speed setting is 38 ~ 40krpm, lower cutter
Speed is set to 0.2 ~ 0.7m/min, and withdrawing speed is set to 4 ~ 8m/min, and thick gong plate speed is set to 2 ~ 6mm/sec, and the bastard gong cutter life-span is set to 5
~ 10m, essence gong plate speed is set to 6 ~ 20 mm/sec, and the serration gong cutter life-span is set to 8 ~ 15m.
6. according to gong plate edges of boards a kind of described in claim 4 without dust technique, it is characterised in that: add man-hour carrying out gong plate, when
When the bastard gong cutter used and the cutter footpath of serration gong cutter are 1.2 ~ 1.6mm, gong owner's axle speed setting is 33 ~ 37krpm, lower cutter
Speed is set to 0.8 ~ 1.2m/min, and withdrawing speed is set to 9 ~ 11m/min, and thick gong plate speed is set to 7 ~ 18mm/sec, and the bastard gong cutter life-span sets
Being 15 ~ 25m, essence gong plate speed is set to 15 ~ 40 mm/sec, and the serration gong cutter life-span is set to 20 ~ 30m.
7. according to gong plate edges of boards a kind of described in claim 4 without dust technique, it is characterised in that: add man-hour carrying out gong plate, when
When the bastard gong cutter used and the cutter footpath of serration gong cutter are 1.8 ~ 2.4mm, gong owner's axle speed setting is 28 ~ 30krpm, lower cutter
Speed is set to 0.8 ~ 1.2m/min, and withdrawing speed is set to 9 ~ 11m/min, and thick gong plate speed is set to 17 ~ 27mm/sec, and the bastard gong cutter life-span sets
Being 30 ~ 35m, essence gong plate speed is set to 25 ~ 45 mm/sec, and the serration gong cutter life-span is set to 35 ~ 40m.
8. according to gong plate edges of boards a kind of described in claim 5 or 6 or 7 without dust technique, it is characterised in that: carry out gong plate processing
Time, the rotating speed deviation value of gong owner's axle is less than ± 3 krpm.
9. according to gong plate edges of boards a kind of described in claim 1 without dust technique, it is characterised in that: add man-hour at gong plate, can be by many
Block wiring board gathers into folds and is processed simultaneously；When the wiring board that thickness of slab is 1.2 ~ 1.6mm is carried out gong plate, lamination quantity is less than
3pnl/ folds, in order to cleaning dust glue slag.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610648463.8A CN106255321B (en) | 2016-08-10 | 2016-08-10 | A kind of gong plate edges of boards are without dust technique |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610648463.8A CN106255321B (en) | 2016-08-10 | 2016-08-10 | A kind of gong plate edges of boards are without dust technique |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106255321A true CN106255321A (en) | 2016-12-21 |
| CN106255321B CN106255321B (en) | 2018-11-13 |
Family
ID=58079129
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610648463.8A Expired - Fee Related CN106255321B (en) | 2016-08-10 | 2016-08-10 | A kind of gong plate edges of boards are without dust technique |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106900139A (en) * | 2017-04-20 | 2017-06-27 | 胜宏科技（惠州）股份有限公司 | It is a kind of high-accuracy without technique edges LED circuit board moulding process |
| CN106984999A (en) * | 2017-05-05 | 2017-07-28 | 昆山弗莱吉电子科技有限公司 | A kind of pcb board method for processing forming compensated based on milling cutter knife footpath |
| CN107708307A (en) * | 2017-08-30 | 2018-02-16 | 奥士康精密电路（惠州）有限公司 | Gong plate method based on automatic identification parameter |
| CN108377612A (en) * | 2018-01-29 | 2018-08-07 | 奥士康精密电路（惠州）有限公司 | A kind of PCB blind slots bottom circuit processing technology |
| CN108381119A (en) * | 2018-01-29 | 2018-08-10 | 奥士康精密电路（惠州）有限公司 | A kind of PCB buries copper coin copper billet blind slot control depth method |
| CN110557885A (en) * | 2019-08-13 | 2019-12-10 | 胜宏科技（惠州）股份有限公司 | manufacturing process of copper substrate with double-sided sandwich thermoelectric separation structure |
| CN111556659A (en) * | 2020-06-19 | 2020-08-18 | 奥士康精密电路（惠州）有限公司 | Processing method for solving problem of routing white edges |
| CN112616258A (en) * | 2021-01-12 | 2021-04-06 | 广东世运电路科技股份有限公司 | Circuit board negative film and processing method thereof |
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| CN104640358A (en) * | 2014-12-17 | 2015-05-20 | 江苏博敏电子有限公司 | Half-hole plate manufacturing method |
| CN105228347A (en) * | 2015-08-14 | 2016-01-06 | 景旺电子科技(龙川)有限公司 | A kind of PCB jigsaw gong plate method |
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| US20080184556A1 (en) * | 2003-07-22 | 2008-08-07 | Samsung Electronics Co., Ltd. | Connection structure of circuit substrate |
| CN103052260A (en) * | 2011-10-14 | 2013-04-17 | 北大方正集团有限公司 | Golden finger processing method, printed circuit board manufacturing method, golden finger and printed circuit board |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106900139A (en) * | 2017-04-20 | 2017-06-27 | 胜宏科技（惠州）股份有限公司 | It is a kind of high-accuracy without technique edges LED circuit board moulding process |
| CN106900139B (en) * | 2017-04-20 | 2019-05-14 | 胜宏科技（惠州）股份有限公司 | A kind of high-accuracy no technique edges LED circuit board moulding process |
| CN106984999A (en) * | 2017-05-05 | 2017-07-28 | 昆山弗莱吉电子科技有限公司 | A kind of pcb board method for processing forming compensated based on milling cutter knife footpath |
| CN107708307A (en) * | 2017-08-30 | 2018-02-16 | 奥士康精密电路（惠州）有限公司 | Gong plate method based on automatic identification parameter |
| CN107708307B (en) * | 2017-08-30 | 2019-10-29 | 奥士康精密电路（惠州）有限公司 | Gong plate method based on automatic identification parameter |
| CN108377612A (en) * | 2018-01-29 | 2018-08-07 | 奥士康精密电路（惠州）有限公司 | A kind of PCB blind slots bottom circuit processing technology |
| CN108381119A (en) * | 2018-01-29 | 2018-08-10 | 奥士康精密电路（惠州）有限公司 | A kind of PCB buries copper coin copper billet blind slot control depth method |
| CN110557885A (en) * | 2019-08-13 | 2019-12-10 | 胜宏科技（惠州）股份有限公司 | manufacturing process of copper substrate with double-sided sandwich thermoelectric separation structure |
| CN111556659A (en) * | 2020-06-19 | 2020-08-18 | 奥士康精密电路（惠州）有限公司 | Processing method for solving problem of routing white edges |
| CN112616258A (en) * | 2021-01-12 | 2021-04-06 | 广东世运电路科技股份有限公司 | Circuit board negative film and processing method thereof |
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| Publication number | Publication date |
|---|---|
| CN106255321B (en) | 2018-11-13 |
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