CN104640358A - Half-hole plate manufacturing method - Google Patents
Half-hole plate manufacturing method Download PDFInfo
- Publication number
- CN104640358A CN104640358A CN201410787445.9A CN201410787445A CN104640358A CN 104640358 A CN104640358 A CN 104640358A CN 201410787445 A CN201410787445 A CN 201410787445A CN 104640358 A CN104640358 A CN 104640358A
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- China
- Prior art keywords
- pore plate
- slightly
- cutter
- drag
- refine
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0346—Deburring, rounding, bevelling or smoothing conductor edges
Abstract
The invention provides a half-hole plate manufacturing method. The half-hole plate manufacturing method is characterized in that a one-step forming step comprises coarse fishing of single clockwise cutting and fine trimming of repeated clockwise circular cutting, and after a half hole is etched, copper wires do not remain in the half hole. The half-hole plate manufacturing method has the advantages of easiness in production, convenience in manufacturing, zero copper wire residue, zero deflection of the half hole and high conductivity of a half-hole plate.
Description
Technical field
The present invention relates to a kind of manufacture method of pcb board, especially in regard to a kind of manufacture method of half-pore plate.
Background technology
A problem half-pore plate manufacturing exists always: during in shaping cutting half bore, due to the existence of cutting force, copper in half bore can be broken the thicker copper wire of formation, and the copper wire cut out by traditional handicraft too rough etch carve and cannot remove clean, cause copper wire to remain.And finally will make client have when piece installing half bore card incessantly, bad, the easy short circuit of bad order, conduction etc. problem.
On the other hand, the size tolerance requirements of half-pore plate is very strict, and generally at ± 0.1mm, half-pore plate directly easily causes half bore to cut partially to cause and scrap according to theoretical multiplying power operation to during one-shot forming.Therefore need half-pore plate before one-shot forming, need to carry out once the calibration of actual multiplying power.
Summary of the invention
The object of this invention is to provide a kind of prevent half-pore plate from cannot remove because copper wire in half bore remains and cause its occur card incessantly, the half-pore plate manufacture method of the problem such as bad order, conduction be bad.
For solving the problems of the technologies described above, present invention employs following technical scheme: a kind of half-pore plate manufacture method, include sawing sheet, cut out the steps such as plate, boring, figure, plating, one-shot forming, welding resistance process, described one-shot forming includes following steps:
A. initial workpiece monolithic half-pore plate is slightly dragged for, what adopt high walking speed slow-speed of revolution machete footpath slightly drags for cutter, described slightly drag for cutter along clockwise direction single cut type slightly dragged for cell body, described slightly drag between cell body edge and outline line between be separated with the spacing of at least half pore radius, determine that it slightly drags for parameter;
B. carry out refine to half-pore plate in a, adopt the refine cutter in low walking speed height rotating speed pocket knife footpath, described refine cutter, along described cell body edge clockwise direction circulation cut type of slightly dragging for outline line, obtains final cell body, determines its refined parameters;
C. check the size of initial workpiece half-pore plate and half bore whether off normal, ok then determines slightly to drag for parameter and refined parameters;
D. slightly will drag for parameter in c and refined parameters inserts formula, start volume production monolithic half-pore plate;
E. the monolithic half-pore plate of volume production in d is carried out lamination;
F. the initial workpiece compound half-pore plate after lamination in e is carried out etching, shelling tin, confirm volume production compound half-pore plate after ok through outer inspection.
As a kind of preferred embodiment of half-pore plate manufacture method of the present invention, the wherein said cutter footpath 0.3 ~ 0.6mm less of groove width slightly dragging for cutter, the cutter footpath of described refine cutter is about the half of described groove width.
As a kind of preferred embodiment of half-pore plate manufacture method of the present invention, no more than 3 of the number of laminations of wherein said monolithic half-pore plate.
As a kind of preferred embodiment of half-pore plate manufacture method of the present invention, before one-shot forming, be wherein also provided with the step that 3 dimensions measure harmomegathus, this step includes:
A. often criticize extraction 5 half-pore plate to measure, determine the harmomegathus amount of X, Y both direction;
B. ± the distinguishing of 3mil is exceeded according to often criticizing the harmomegathus data that half-pore plate calculates;
C. calculate the multiplying power required for one-shot forming formula according to metric data, export formula with reference to multiplying power.
Compared with prior art, tool of the present invention has the following advantages:
One, produce simple, easily manufactured, adopt Double-blade processing, a cutter slightly drags for, and a cutter refine, can ensure the quality of half bore without the need to extra operation.
Two, remain without copper wire, after slightly dragging for, copper wire is comparatively thick, then after refine, copper wire disappears or attenuates, and then can remain without copper wire after the etching.
Three, half bore zero deflection, is provided with the step that 3 dimensions measure harmomegathus, half bore can not be cut because of the excessive half bore that causes of harmomegathus partially before one-shot forming.
Four, half-pore plate conduction is good, client's piece installing will be caused to have the problems such as short circuit because copper wire in half bore is residual.
Embodiment
For the technique effect explaining the technology used in the present invention means further He reach, be described in detail below in conjunction with specific embodiment.
The invention provides a kind of half-pore plate manufacture method, include sawing sheet, cut out the steps such as plate, boring, figure, plating, one-shot forming, welding resistance process.
In the present embodiment, one-shot forming includes following steps:
A. initial workpiece monolithic half-pore plate is slightly dragged for, wherein groove width 1.5mm, aperture 0.4mm, slightly drag for the cutter footpath 1.2mm of cutter, cutter walking speed 14cm/min, cutter rotating speed 36r/min, slightly drag for cutter and slightly dragged for cell body to half-pore plate single cut type along clockwise direction, described slightly drag between cell body edge and outline line between be separated with 0.3mm, determine that it slightly drags for parameter;
B. refine is carried out to slightly dragging for cell body in a, the cutter footpath of refine cutter is 0.9mm, cutter walking speed 4cm/min, cutter rotating speed 45r/min, the spacing at the edge and cell body outline line that slightly drag for cell body is 0.3mm, be then divided into each 0.15mm in groove width two ends, and the amount of feeding of refine cutter is 0.05mm, namely refine cutter circulation cut type along clockwise direction arrives cell body outline line 3 times, determines its refined parameters;
C. check the size of above-mentioned half-pore plate and half bore whether off normal, ok then determines slightly to drag for parameter and refined parameters;
D. slightly will drag for parameter in c and refined parameters inserts formula, start volume production monolithic half-pore plate;
E. the monolithic half-pore plate of volume production in d is carried out lamination, no more than 3 of the number of laminations of described monolithic half-pore plate;
F. the initial workpiece compound half-pore plate after lamination in e is carried out etching, shelling tin, confirm volume production compound half-pore plate after ok through outer inspection.
Adopt in above-mentioned steps slightly drag for, refine Double-blade, slightly drag for cutter can when not injuring half bore pick up speed as much as possible, reach the object of raising the efficiency.Refine cutter then can extremely can etch away completely by levigate copper wire at leisure in subsequent step.
In another embodiment, be also provided with the step that 3 dimensions measure harmomegathus before one-shot forming step, this step includes:
A. often criticize extraction 5 half-pore plate to measure, determine the harmomegathus amount of X, Y both direction;
B. ± the distinguishing of 3mil is exceeded according to often criticizing the harmomegathus data that half-pore plate calculates;
C. calculate the multiplying power required for one-shot forming formula according to metric data, export formula with reference to multiplying power.
This survey harmomegathus step can effectively solve because the excessive half bore that causes of harmomegathus cuts inclined problem, avoids client's piece installing to have not Card Reader etc. abnormal.
It should be noted that, above embodiment is only in order to illustrate technical scheme of the present invention and unrestricted, although with reference to preferred embodiment to invention has been detailed description, those of ordinary skill in the art is to be understood that, can modify to technical scheme of the present invention or equivalent replacement, and not departing from the spirit and scope of technical solution of the present invention, it all should be encompassed in the middle of right of the present invention.
Claims (4)
1. a half-pore plate manufacture method, include sawing sheet, cut out the steps such as plate, boring, figure, plating, one-shot forming, welding resistance process, it is characterized in that, described one-shot forming includes following steps:
A. initial workpiece monolithic half-pore plate is slightly dragged for, what adopt high walking speed slow-speed of revolution machete footpath slightly drags for cutter, described slightly drag for cutter along clockwise direction single cut type slightly dragged for cell body, described slightly drag between cell body edge and outline line between be separated with the spacing of at least half pore radius, determine that it slightly drags for parameter;
B. carry out refine to half-pore plate in a, adopt the refine cutter in low walking speed height rotating speed pocket knife footpath, described refine cutter, along described cell body edge clockwise direction circulation cut type of slightly dragging for outline line, obtains final cell body, determines its refined parameters;
C. check the size of initial workpiece half-pore plate and half bore whether off normal, ok then determines slightly to drag for parameter and refined parameters;
D. slightly will drag for parameter in c and refined parameters inserts formula, start volume production monolithic half-pore plate;
E. the monolithic half-pore plate of volume production in d is carried out lamination;
F. the initial workpiece compound half-pore plate after lamination in e is carried out etching, shelling tin, confirm volume production compound half-pore plate after ok through outer inspection.
2. half-pore plate manufacture method according to claim 1, is characterized in that: the described cutter footpath 0.3 ~ 0.6mm less of groove width slightly dragging for cutter, the cutter footpath of described refine cutter is about the half of described groove width.
3. half-pore plate manufacture method according to claim 1, is characterized in that: no more than 3 of the number of laminations of described monolithic half-pore plate.
4. half-pore plate manufacture method according to claim 1, is characterized in that, before one-shot forming, be also provided with the step that 3 dimensions measure harmomegathus, this step includes:
A. often criticize extraction 5 half-pore plate to measure, determine the harmomegathus amount of X, Y both direction;
B. ± the distinguishing of 3mil is exceeded according to often criticizing the harmomegathus data that half-pore plate calculates;
C. calculate the multiplying power required for one-shot forming formula according to metric data, export formula with reference to multiplying power.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410787445.9A CN104640358A (en) | 2014-12-17 | 2014-12-17 | Half-hole plate manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410787445.9A CN104640358A (en) | 2014-12-17 | 2014-12-17 | Half-hole plate manufacturing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104640358A true CN104640358A (en) | 2015-05-20 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410787445.9A Pending CN104640358A (en) | 2014-12-17 | 2014-12-17 | Half-hole plate manufacturing method |
Country Status (1)
| Country | Link |
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| CN (1) | CN104640358A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105611733A (en) * | 2016-02-23 | 2016-05-25 | 江苏博敏电子有限公司 | Control method for forming size of printed circuit board (PCB) |
| CN106231817A (en) * | 2016-07-27 | 2016-12-14 | 江苏博敏电子有限公司 | A kind of manufacture method of HDI plate |
| CN106255321A (en) * | 2016-08-10 | 2016-12-21 | 奥士康精密电路（惠州）有限公司 | A kind of gong plate edges of boards are without dust technique |
| CN106255320A (en) * | 2016-08-10 | 2016-12-21 | 奥士康精密电路（惠州）有限公司 | A kind of gong PTH half bore method |
| CN107580416A (en) * | 2017-08-30 | 2018-01-12 | 奥士康精密电路（惠州）有限公司 | Circuit board size high-accuracy control method |
| CN107708305A (en) * | 2017-08-30 | 2018-02-16 | 奥士康精密电路（惠州）有限公司 | Gong plate technique for accurate control base board external form |
| CN112074095A (en) * | 2020-10-10 | 2020-12-11 | 黄石星河电路有限公司 | Thin plate processing method with 0.4MM metal half-holes designed around |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0631598A (en) * | 1992-07-20 | 1994-02-08 | Toshiba Chem Corp | Automatic standard hole drilling machine ror printer circuit board |
| CN102387668A (en) * | 2011-10-26 | 2012-03-21 | 高德（无锡）电子有限公司 | Cutting machining technology for semi-hole plate provided with copper plating holes at plate edges |
| CN102427667A (en) * | 2011-11-09 | 2012-04-25 | 金悦通电子（翁源）有限公司 | Machining process of half-pore plate |
| CN103987194A (en) * | 2014-05-04 | 2014-08-13 | 奥士康精密电路（惠州）有限公司 | Method for controlling expansion and shrinkage of lamination of multiple layers of boards |
-
2014
- 2014-12-17 CN CN201410787445.9A patent/CN104640358A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0631598A (en) * | 1992-07-20 | 1994-02-08 | Toshiba Chem Corp | Automatic standard hole drilling machine ror printer circuit board |
| CN102387668A (en) * | 2011-10-26 | 2012-03-21 | 高德（无锡）电子有限公司 | Cutting machining technology for semi-hole plate provided with copper plating holes at plate edges |
| CN102427667A (en) * | 2011-11-09 | 2012-04-25 | 金悦通电子（翁源）有限公司 | Machining process of half-pore plate |
| CN103987194A (en) * | 2014-05-04 | 2014-08-13 | 奥士康精密电路（惠州）有限公司 | Method for controlling expansion and shrinkage of lamination of multiple layers of boards |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105611733A (en) * | 2016-02-23 | 2016-05-25 | 江苏博敏电子有限公司 | Control method for forming size of printed circuit board (PCB) |
| CN106231817A (en) * | 2016-07-27 | 2016-12-14 | 江苏博敏电子有限公司 | A kind of manufacture method of HDI plate |
| CN106255321A (en) * | 2016-08-10 | 2016-12-21 | 奥士康精密电路（惠州）有限公司 | A kind of gong plate edges of boards are without dust technique |
| CN106255320A (en) * | 2016-08-10 | 2016-12-21 | 奥士康精密电路（惠州）有限公司 | A kind of gong PTH half bore method |
| CN106255321B (en) * | 2016-08-10 | 2018-11-13 | 奥士康精密电路（惠州）有限公司 | A kind of gong plate edges of boards are without dust technique |
| CN107580416A (en) * | 2017-08-30 | 2018-01-12 | 奥士康精密电路（惠州）有限公司 | Circuit board size high-accuracy control method |
| CN107708305A (en) * | 2017-08-30 | 2018-02-16 | 奥士康精密电路（惠州）有限公司 | Gong plate technique for accurate control base board external form |
| CN107580416B (en) * | 2017-08-30 | 2020-05-19 | 奥士康精密电路（惠州）有限公司 | High-precision control method for circuit board size |
| CN107708305B (en) * | 2017-08-30 | 2020-05-19 | 奥士康精密电路（惠州）有限公司 | Routing process for precisely controlling appearance of substrate |
| CN112074095A (en) * | 2020-10-10 | 2020-12-11 | 黄石星河电路有限公司 | Thin plate processing method with 0.4MM metal half-holes designed around |
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Address after: 224100 No. 9, Yong Sheng Road, Dafeng Development Zone, Yancheng City, Jiangsu. Applicant after: JIANGSU BOMIN ELECTRONICS CO., LTD. Address before: 224100 Yongsheng Road Electronic Information Industrial Park, Dafeng City, Yancheng City, Jiangsu Applicant before: JIANGSU BOMIN ELECTRONICS CO., LTD. |
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| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150520 |