CN107580416A - Circuit board size high-accuracy control method - Google Patents
Circuit board size high-accuracy control method Download PDFInfo
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- CN107580416A CN107580416A CN201710759778.4A CN201710759778A CN107580416A CN 107580416 A CN107580416 A CN 107580416A CN 201710759778 A CN201710759778 A CN 201710759778A CN 107580416 A CN107580416 A CN 107580416A
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Abstract
The present invention relates to circuit board size high-accuracy control method, there is provided the monoblock substrate of gong plate to be carried out, the monoblock substrate includes at least two forming units, further comprising the steps of：S1, measurement substrate appearance and size breathing situation；S2, the positioning of gong plate, are positioned to substrate；S3, substrate cut area data limit, and the spacing between forming unit is 10mm 20mm, the substrate width ＞ 15mm of forming unit periphery；S4, parameter setting, input navigation data, input substrate data, machined parameters are set；S5, thick gong fluting, by thick gong knife to carrying out out inside groove on the inside of forming unit；S6, smart cutting are cut, and forming unit inside groove and periphery are cut by smart gong knife；S7, FAA first article assurance, it is ensured that be of the required size and enter batch production；S8, production process carry out QA sampling observations.Present invention reduces problem is scrapped caused by size is undesirable, external form quality is lifted, reduces scrappage, meets client to size requirement with low cost input, high-quality output.
Description
Technical field
The present invention relates to wiring board manufacture field, and in particular to circuit board size high-accuracy control method.
Background technology
With the development of electronic technology, pcb board instead of the connected mode of conditional electronic component, be widely used
In electronic product.
Increasingly polynary with the demand of Downstream Market, PCB product application is more wide, including Aero-Space, military affairs,
The fields such as automobile making, household electrical appliances, computer and mobile phone, Covering domain is more and more wider, technical requirements more and more higher, particularly consumption joy
The electronic equipment and system of happy application aspect exploitation flourish, and show the characteristics of life cycle shortens, and PCB is being expected to draw
Open under the advantage that a new round increases prelude, only accelerate transition and upgrade paces, it is research and innovation type, high-precision, highly difficult
The sudden emergence of application terminal electronic product, also it will provide more growing markets for World PCB industry.Only with regard to domestic
Speech, steady recovery and lasting transition with China's economic, PCB external form high accuracy size management and control techniques will give priority to side
To the development of coming years PCB in China industry will welcome more opportunities；How quickly to solve high-precision dimensional problem into
For the primary study project of industry.
The content of the invention
It is an object of the present invention to provide circuit board size high-accuracy control method, and it can efficiently solve in background technology and be deposited
The problem of.
The technical problems to be solved by the invention are realized using following technical scheme：
Circuit board size high-accuracy control method, there is provided the monoblock substrate of gong plate to be carried out, the monoblock substrate include at least two
Forming unit, it is further comprising the steps of：
S1, measurement substrate appearance and size breathing situation, deviation≤2mil of appearance and size is then by normal production, appearance and size ＞
2mil then lists the data information to strain stretch, is handled by real data during gong plate；
S2, the positioning of gong plate, drill to substrate and backing plate, backing plate are placed in gong machine and is fixed, will by shop bolt
Substrate is fixed with backing plate, and substrate is positioned；
S3, substrate cut area data limit, and the spacing between forming unit be 10mm-20mm, the peripheral substrate of forming unit
Width G T.GT.GT 15mm；
Typesetting is actual to be changed to 10-20mm, the substrate width ＞ 15mm of forming unit periphery by normal 1.6mm-2.0mm designs, with
Retain edges of boards clout auxiliary gong plate stress, appropriate surplus is not only convenient for the cutting of gong knife, prevents the path of gong knife from interfering, it is ensured that to cut
Precision, and the use of effectively save material are cut, saves cost；
S4, parameter setting, input navigation data, input substrate data, machined parameters are set；Production must first test gong machine main shaft
Beat degree, each axle beat ＜ 30um；
S5, thick gong fluting, by thick gong knife to carrying out out inside groove on the inside of forming unit；
S6, smart cutting are cut, and forming unit inside groove and periphery are cut by smart gong knife；
S7, FAA first article assurance, size confirmation is carried out to the initial workpiece forming unit cut out, it is ensured that be of the required size to enter and criticize
Amount production；
S8, production process carry out QA sampling observations.
Wherein, the diameter range of the thick gong knife is 1.5mm~2.4mm.The thick gong knife of this diameter range carries out gong plate
Tolerance in ± 0.03mm.
Wherein, the diameter range of the smart gong knife is 0.8mm~1.2mm.This diameter range essence gong knife carries out gong plate
Tolerance in ± 0.02mm.
Wherein, when being slotted using thick gong knife, gong swivel speed is 32krpm~33krpm, feed velocity is 1.5~
1.6m/min, it is 10m/min to return knife speed, and gait of march is 12~14mm/s, the long 8.5mm~10.5mm of sword, lamination gross thickness
Less than or equal to 4mm, lamination block number is less than or equal to 2 pieces.
Wherein, when being slotted using smart gong knife, gong swivel speed is 38krpm~39krpm, feed velocity is 0.8~
1.0m/min, it is 10m/min to return knife speed, and gait of march is 2~4mm/s, the long 5.0mm~6.0mm of sword, and lamination gross thickness is less than
Equal to 4mm, lamination block number is less than or equal to 2 pieces.
Wherein, during gong plate, allowance control is in ± 0.05mm, to prevent bulk overall dimensions problem；Per gong substrate twice
The three-D of a substrate is measured, each substrate uses kind of calliper hole to side size, Outside Dimensions.
Wherein, the shop bolt diameter ＜ 1.5mm, external form tolerance+2mil.Institute can not have bending using pin, get rusty
Phenomenon, and measure pin diameter.
The beneficial effects of the invention are as follows：
Present invention reduces problem is scrapped caused by size is undesirable, lift external form quality, reduce scrappage, with it is low into
This input, high-quality output meet client to size requirement.
Embodiment
In order that the technical means, the inventive features, the objects and the advantages of the present invention are easy to understand, further
Illustrate the present invention.
Embodiment 1
Circuit board size high-accuracy control method, there is provided the monoblock substrate of gong plate to be carried out, the monoblock substrate include at least two
Forming unit, it is further comprising the steps of：
S1, measurement substrate appearance and size breathing situation, deviation≤2mil of appearance and size is then by normal production, appearance and size ＞
2mil then lists the data information to strain stretch, is handled by real data during gong plate；
S2, the positioning of gong plate, drill to substrate and backing plate, backing plate are placed in gong machine and is fixed, will by shop bolt
Substrate is fixed with backing plate, and substrate is positioned；The shop bolt diameter ＜ 1.5mm；
S3, substrate cut area data limit, and the spacing between forming unit is 10mm, the substrate width ＞ of forming unit periphery
15mm；
S4, parameter setting, input navigation data, input substrate data, machined parameters are set；
S5, thick gong fluting, by thick gong knife to carrying out out inside groove on the inside of forming unit；The diameter range of the thick gong knife is
1.5mm；
S6, smart cutting are cut, and forming unit inside groove and periphery are cut by smart gong knife；The diameter range of the smart gong knife is
0.8mm；
S7, FAA first article assurance, size confirmation is carried out to the initial workpiece forming unit cut out, it is ensured that be of the required size to enter and criticize
Amount production；
S8, production process carry out QA sampling observations, and per gong, substrate measures the three-D of a substrate twice, and each substrate is surveyed using slide calliper rule
Metering-orifice is to side size, Outside Dimensions.
Wherein, when being slotted using thick gong knife, gong swivel speed is 32krpm, feed velocity 1.5/min, returns knife speed
For 10m/min, gait of march 12mm/s, the long 8.5mm of sword, lamination gross thickness is less than or equal to 4mm, and lamination block number is less than or equal to 2
Block.
Wherein, when being slotted using smart gong knife, gong swivel speed is 38krpm, and feed velocity 0.8, returning knife speed is
10m/min, gait of march 2mm/s, the long 5.0mm of sword, lamination gross thickness are less than or equal to 4mm, and lamination block number is less than or equal to 2 pieces.
Embodiment 2
Circuit board size high-accuracy control method, there is provided the monoblock substrate of gong plate to be carried out, the monoblock substrate include at least two
Forming unit, it is further comprising the steps of：
S1, measurement substrate appearance and size breathing situation, deviation≤2mil of appearance and size is then by normal production, appearance and size ＞
2mil then lists the data information to strain stretch, is handled by real data during gong plate；
S2, the positioning of gong plate, drill to substrate and backing plate, backing plate are placed in gong machine and is fixed, will by shop bolt
Substrate is fixed with backing plate, and substrate is positioned；The shop bolt diameter ＜ 1.5mm；
S3, substrate cut area data limit, and the spacing between forming unit is 20mm, the substrate width ＞ of forming unit periphery
15mm；
S4, parameter setting, input navigation data, input substrate data, machined parameters are set；
S5, thick gong fluting, by thick gong knife to carrying out out inside groove on the inside of forming unit；The diameter range of the thick gong knife is
2.4mm；
S6, smart cutting are cut, and forming unit inside groove and periphery are cut by smart gong knife；The diameter range of the smart gong knife is
1.2mm；
S7, FAA first article assurance, size confirmation is carried out to the initial workpiece forming unit cut out, it is ensured that be of the required size to enter and criticize
Amount production；
S8, production process carry out QA sampling observations, and per gong, substrate measures the three-D of a substrate twice, and each substrate is surveyed using slide calliper rule
Metering-orifice is to side size, Outside Dimensions.
Wherein, when being slotted using thick gong knife, gong swivel speed is 33krpm, feed velocity 1.6m/min, returns knife speed
Spend for 10m/min, gait of march 14mm/s, the long 10.5mm of sword, lamination gross thickness is less than or equal to 4mm, and lamination block number is less than etc.
In 2 pieces.
Wherein, when being slotted using smart gong knife, gong swivel speed is 39krpm, feed velocity 1.0m/min, returns knife speed
Spend and be less than or equal to 4mm for 10m/min, gait of march 4mm/s, the long 6.0mm of sword, lamination gross thickness, lamination block number is less than or equal to 2
Block.
Embodiment 3
Circuit board size high-accuracy control method, there is provided the monoblock substrate of gong plate to be carried out, the monoblock substrate include at least two
Forming unit, it is further comprising the steps of：
S1, measurement substrate appearance and size breathing situation, deviation≤2mil of appearance and size is then by normal production, appearance and size ＞
2mil then lists the data information to strain stretch, is handled by real data during gong plate；
S2, the positioning of gong plate, drill to substrate and backing plate, backing plate are placed in gong machine and is fixed, will by shop bolt
Substrate is fixed with backing plate, and substrate is positioned；The shop bolt diameter ＜ 1.5mm；
S3, substrate cut area data limit, and the spacing between forming unit is 15mm, the substrate width ＞ of forming unit periphery
15mm；
S4, parameter setting, input navigation data, input substrate data, machined parameters are set；
S5, thick gong fluting, by thick gong knife to carrying out out inside groove on the inside of forming unit；The diameter range of the thick gong knife is
1.9mm；
S6, smart cutting are cut, and forming unit inside groove and periphery are cut by smart gong knife；The diameter range of the smart gong knife is
1.1mm；
S7, FAA first article assurance, size confirmation is carried out to the initial workpiece forming unit cut out, it is ensured that be of the required size to enter and criticize
Amount production；
S8, production process carry out QA sampling observations, and per gong, substrate measures the three-D of a substrate twice, and each substrate is surveyed using slide calliper rule
Metering-orifice is to side size, Outside Dimensions.
Wherein, when being slotted using thick gong knife, gong swivel speed is 33krpm, feed velocity 1.6m/min, returns knife speed
Spend and be less than or equal to 4mm for 10m/min, gait of march 13mm/s, the long 9mm of sword, lamination gross thickness, lamination block number is less than or equal to 2
Block.
Wherein, when being slotted using smart gong knife, gong swivel speed is 39krpm, feed velocity 0.9m/min, returns knife speed
Spend and be less than or equal to 4mm for 10m/min, gait of march 3mm/s, the long 5.5mm of sword, lamination gross thickness, lamination block number is less than or equal to 2
Block.
I, which takes charge of, monthly produces estimated 30000 ㎡ of dimensional tolerance 0.05mm-0.1mm, and pin accounts for 10% i.e. less than 1.5mm's
3000 ㎡, off-dimension rate is 50% before research is summarized, and according to every 500 yuan of calculating of square meter price, monthly size is bad loses gold
Volume is：3000 500 yuan of ㎡ 50%/fraction defectives of * */Mei ㎡ unit prices=750,000 yuan, through using high-precision size production controlling party after optimizing
After case, monthly scrappage reduces and can ensure that size meets the requirements of the customers with 100% such production plate；Per square meter average selling price
For 500 yuan, the unit price of 3,000 500 yuan of ㎡ 50%/fraction defectives of * */per ㎡=750,000 yuan, a Spring Festival holidays save 750,000 yuan of scrap cost * December=
9000000 yuan.
It is the wherein specific implementation of the present invention above, its description is more specific and detailed, but can not therefore manage
Solve as the limitation to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, do not departing from
On the premise of present inventive concept, various modifications and improvements can be made, these obvious alternative forms belong to this hair
Bright protection domain.
Claims (7)
1. circuit board size high-accuracy control method, it is characterised in that the monoblock substrate of gong plate to be carried out, the monoblock substrate are provided
It is further comprising the steps of including at least two forming units：
S1, measurement substrate appearance and size breathing situation, deviation≤2mil of appearance and size is then by normal production, appearance and size ＞
2mil then lists the data information to strain stretch, is handled by real data during gong plate；
S2, the positioning of gong plate, drill to substrate and backing plate, backing plate are placed in gong machine and is fixed, will by shop bolt
Substrate is fixed with backing plate, and substrate is positioned；
S3, substrate cut area data limit, and the spacing between forming unit be 10mm-20mm, the peripheral substrate of forming unit
Width G T.GT.GT 15mm.
S4, parameter setting, input navigation data, input substrate data, machined parameters are set；
S5, thick gong fluting, by thick gong knife to carrying out out inside groove on the inside of forming unit；
S6, smart cutting are cut, and forming unit inside groove and periphery are cut by smart gong knife；
S7, FAA first article assurance, size confirmation is carried out to the initial workpiece forming unit cut out, it is ensured that be of the required size to enter and criticize
Amount production；
S8, production process carry out QA sampling observations.
2. circuit board size high-accuracy control method according to claim 1, it is characterised in that：The diameter of the thick gong knife
Scope is 1.5mm~2.4mm.
3. circuit board size high-accuracy control method according to claim 1, it is characterised in that：The diameter of the smart gong knife
Scope is 0.8mm~1.2mm.
4. circuit board size high-accuracy control method according to claim 2, it is characterised in that：Opened using thick gong knife
During groove, gong swivel speed is 32krpm~33krpm, and feed velocity is 1.5~1.6m/min, and it is 10m/min to return knife speed, is advanced
Speed is 12~14mm/s, the long 8.5mm~10.5mm of sword, and lamination gross thickness is less than or equal to 4mm, and lamination block number is less than or equal to 2
Block.
5. circuit board size high-accuracy control method according to claim 3, it is characterised in that：Opened using smart gong knife
During groove, gong swivel speed is 38krpm~39krpm, and feed velocity is 0.8~1.0m/min, and it is 10m/min to return knife speed, is advanced
Speed is 2~4mm/s, the long 5.0mm~6.0mm of sword, and lamination gross thickness is less than or equal to 4mm, and lamination block number is less than or equal to 2 pieces.
6. circuit board size high-accuracy control method according to claim 1, it is characterised in that：Per gong, substrate measures twice
The three-D of substrate, each substrate use kind of calliper hole to side size, Outside Dimensions.
7. circuit board size high-accuracy control method according to claim 1, it is characterised in that：The shop bolt diameter
＜ 1.5mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710759778.4A CN107580416B (en) | 2017-08-30 | 2017-08-30 | High-precision control method for circuit board size |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710759778.4A CN107580416B (en) | 2017-08-30 | 2017-08-30 | High-precision control method for circuit board size |
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| Publication Number | Publication Date |
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| CN107580416A true CN107580416A (en) | 2018-01-12 |
| CN107580416B CN107580416B (en) | 2020-05-19 |
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ID=61030603
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109807964A (en) * | 2019-02-01 | 2019-05-28 | 奥士康精密电路（惠州）有限公司 | A method of improving external form processing efficiency |
| CN110465689A (en) * | 2019-08-31 | 2019-11-19 | 重庆房地产职业学院 | Printed board mills the processing method of inside groove twice |
| CN111405759A (en) * | 2020-02-17 | 2020-07-10 | 广东科翔电子科技股份有限公司 | Method for preparing high-precision communication optical module printed circuit board |
| CN112888173A (en) * | 2021-01-19 | 2021-06-01 | 珠海杰赛科技有限公司 | Processing and forming process of PCB |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102615318A (en) * | 2012-04-11 | 2012-08-01 | 景旺电子（深圳）有限公司 | Routing method for PCB (printed circuit board) |
| CN104640358A (en) * | 2014-12-17 | 2015-05-20 | 江苏博敏电子有限公司 | Half-hole plate manufacturing method |
| CN105228347A (en) * | 2015-08-14 | 2016-01-06 | 景旺电子科技(龙川)有限公司 | A kind of PCB jigsaw gong plate method |
| CN105792518A (en) * | 2016-03-18 | 2016-07-20 | 奥士康科技股份有限公司 | Method for controlling size of high-precision finished product |
| CN106900139A (en) * | 2017-04-20 | 2017-06-27 | 胜宏科技（惠州）股份有限公司 | It is a kind of high-accuracy without technique edges LED circuit board moulding process |
-
2017
- 2017-08-30 CN CN201710759778.4A patent/CN107580416B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102615318A (en) * | 2012-04-11 | 2012-08-01 | 景旺电子（深圳）有限公司 | Routing method for PCB (printed circuit board) |
| CN104640358A (en) * | 2014-12-17 | 2015-05-20 | 江苏博敏电子有限公司 | Half-hole plate manufacturing method |
| CN105228347A (en) * | 2015-08-14 | 2016-01-06 | 景旺电子科技(龙川)有限公司 | A kind of PCB jigsaw gong plate method |
| CN105792518A (en) * | 2016-03-18 | 2016-07-20 | 奥士康科技股份有限公司 | Method for controlling size of high-precision finished product |
| CN106900139A (en) * | 2017-04-20 | 2017-06-27 | 胜宏科技（惠州）股份有限公司 | It is a kind of high-accuracy without technique edges LED circuit board moulding process |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109807964A (en) * | 2019-02-01 | 2019-05-28 | 奥士康精密电路（惠州）有限公司 | A method of improving external form processing efficiency |
| CN110465689A (en) * | 2019-08-31 | 2019-11-19 | 重庆房地产职业学院 | Printed board mills the processing method of inside groove twice |
| CN111405759A (en) * | 2020-02-17 | 2020-07-10 | 广东科翔电子科技股份有限公司 | Method for preparing high-precision communication optical module printed circuit board |
| CN111405759B (en) * | 2020-02-17 | 2021-10-19 | 广东科翔电子科技股份有限公司 | Method for preparing high-precision communication optical module printed circuit board |
| CN112888173A (en) * | 2021-01-19 | 2021-06-01 | 珠海杰赛科技有限公司 | Processing and forming process of PCB |
| CN112888173B (en) * | 2021-01-19 | 2023-10-31 | 珠海杰赛科技有限公司 | Processing and forming process of PCB |
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| CN107580416B (en) | 2020-05-19 |
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Effective date of registration: 20230620 Address after: 526070 Floor 1, Building 1, Xizhen Science Park, No. 11, Kechuang Avenue, Zhaoqing New District, Dinghu District, Zhaoqing City, Guangdong Province Patentee after: Guangdong Xizhen Circuit Technology Co.,Ltd. Address before: 516000 Changbu village, Xinwei Town, Huiyang District, Huizhou City, Guangdong Province Patentee before: AOSHIKONG PRECISION CIRCUIT (HUIZHOU) Co.,Ltd. |