CN111405759A - Method for preparing high-precision communication optical module printed circuit board - Google Patents
Method for preparing high-precision communication optical module printed circuit board Download PDFInfo
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- CN111405759A CN111405759A CN202010096238.4A CN202010096238A CN111405759A CN 111405759 A CN111405759 A CN 111405759A CN 202010096238 A CN202010096238 A CN 202010096238A CN 111405759 A CN111405759 A CN 111405759A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
- H05K3/424—Plated through-holes or plated via connections characterised by electroplating method by direct electroplating
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Abstract
The invention provides a method for preparing a high-precision communication optical module printed circuit board, which is characterized in that a pressing control method, an electroplating control method, a surface copper control method, a circuit control method, an outer layer size control method and a golden finger appearance control method are arranged in the existing circuit board preparation process to control the preparation flow.
Description
Technical Field
The invention relates to the technical field of circuit board manufacturing, in particular to a method for manufacturing a high-precision communication optical module printed circuit board.
Background
As the demand for download rates increases, wireless communications increasingly rely on fiber optic communications. Current wireless communication networks, except for the "last mile" being the "wireless" modality, the communication links behind the antennas are all fiber optic networks. By the 5G era, the download rate is greatly improved due to the inter-generation upgrading, and brand-new applications such as unmanned driving, everything interconnection and the like are promoted due to the characteristics of low time delay and large-scale machine communication which are not possessed by the 4G era.
Therefore, 5G wireless communication will change lives far beyond 3G and 4G. The inherent advantages of large capacity and long distance of optical fiber communication can well meet the requirement of 5G on a bearing network. In the first 5G era, the terminal driving force for the rapid development of optical fiber communication technology and industry was the popularity and subsequent upgrade of "fiber to home" and "fiber to building" in wired access homes and enterprises, driving the overall coverage and performance upgrade of access networks, metropolitan area networks, and backbone networks. In the 5G era, wireless access mobile phones, automobiles, household appliances, industrial equipment and the like are used as new terminals, and the technical progress and industrial development of optical fiber communication are promoted together with fixed network access terminals.
The deployment of 4G brings a new market segment for the optical module industry, and the demand of 5G will inject new power for the wireless optical module market and further increase the space of the market segment. The characteristics of the 5G network, such as increased site density and improved time synchronization accuracy, place new demands on the function and performance of the optical module.
The printed circuit board of the 5G high-precision communication optical module is used as an important part of the wireless optical module, and the reliability, the uniformity of thickness tolerance, accurate impedance control and dimensional tolerance control of the golden finger are key technical problems, so that the scheme provides a method for preparing the printed circuit board of the high-precision communication optical module, which mainly solves the problems mentioned above, reduces the manufacturing cost of the printed circuit board of the communication optical module, improves the quality of the printed circuit board of the optical module, and meets the requirements of the increasingly improved reliability and accuracy of the printed circuit board of the optical module.
Disclosure of Invention
In order to solve the technical problems, the invention provides a method for preparing a high-precision communication optical module printed circuit board, and particularly provides a pressing control method, an electroplating control method, a surface copper control method, a circuit control method, an outer layer size control method and a gold finger appearance control method in the existing circuit board preparation process. Specifically, the method comprises the following steps.
A method for preparing a printed circuit board of a high-precision communication optical module comprises the following steps: the method comprises the following steps of sequentially cutting a PCB substrate, processing an inner layer plate, carrying out inner layer AOI, pressing, drilling and then carrying out copper plating
Pretreatment before pressing processing: and cleaning the secondary outer layer, performing browning treatment, judging whether the exposed surface of the browned plate exceeds a threshold value, if so, cleaning again, and otherwise, performing a pressing procedure.
And (3) a pressing procedure: selecting and aligning a plate and a PP base material, pressing, detecting whether the pressing tolerance and the expansion and contraction value are consistent, and entering a subsequent pressing process if the pressing tolerance and the expansion and contraction value are consistent; otherwise, the processing is done again.
And (3) pressing subsequent procedures: drilling the circuit board obtained after pressing, then baking the board before electroplating and polishing the electroplating conductive plate, removing the film after electroplating, etching the circuit board, further welding resistance, milling the board twice by adopting a milling cutter, and finishing the external dimension processing of the circuit board.
Wherein, the ectonexine of PCB board all has wire, hole and PAD to constitute, is carrying out the PCB manufacture in-process, and advanced interior plywood production includes: firstly, pressing a layer of photosensitive dry film on the substrate, then covering the film with a negative film, and then carrying out exposure, wherein the color of the illuminated place is darker than that of the non-illuminated place. And developing after exposure, and optionally, removing the hardened dry film by using an acid solution.
The browning treatment is carried out for coarsening the copper surface, increasing the contact surface between the copper surface and resin, increasing the wettability of the copper surface to flowing resin, passivating the copper surface and avoiding adverse reaction, preferably, the browning treatment liquid medicine is adopted for treatment, the substrate and the PP are tightly combined, the method is the same as the inner layer pretreatment, namely, a strong oxidant is adopted to oxidize the copper on the surface of the inner layer plate to make the surface rough, the color of the copper oxide is black, SO the browning treatment is also called blackening, and optionally, the browning liquid medicine is an acid medium, such as browning liquid of H2SO 4.
The electroplating conductive plate is preferably made of pure copper materials, stainless steel or alloy materials, the electroplating conductive plate is completely disassembled and assembled after polishing is completed, and a rust removal polishing machine is preferably used for polishing to ensure that an oxide layer of the electroplating conductive plate is not damaged.
Compared with the prior art, the invention has the advantages that:
before the pressing, the invention carries out secondary outer layer printed circuit board surface cleaning and browning treatment, and further comprises: adopt 3 sections overflow water washes and ultrasonic wave water washes, wholly will be the piece residue sanitization on time outer printed circuit board surface, with the dust-binding wheel with the clean one side of surperficial positive and negative, put into the brown line and accomplish the brown oxidation after, check whether the surface has not brown the surface, when brown the naked face of face exceeds 5 single faces, carry out overflow water washes, ultrasonic wave water washes, the dust-binding wheel is clean again, cleans the face once again, until qualified.
And (3) entering a pressing stage, adopting a brand new steel plate or a newly polished steel plate, checking that residual resin and copper scraps cannot exist on the surface, and then selecting the plate and the PP according to the principle of concentric synchronization so as to enable the pressing tolerance and the expansion and contraction of the plate surface to be consistent. The inspection surface further comprises: checking whether the surface has residual resin or copper scraps, if not, performing pressing treatment to make the pressing tolerance of the board consistent with the expansion and contraction; otherwise, returning to the cleaning process.
The electroplating control method provided by the invention specifically comprises the following steps: baking before electroplating, wherein baking parameters are as follows: 150 ℃ 2H, because in the existing manufacturing process, when the material is subjected to pickling and rust removal or electroplating, atomic hydrogen can infiltrate, and further the crystal lattice of the metal is twisted outwards, so that a large internal stress is generated, the toughness of a metal coating and a base material is reduced, the metal material becomes brittle, and the performance cannot meet the production requirement, therefore, the invention firstly carries out baking before electroplating, so as to eliminate hydrogen embrittlement, in order to further improve the performance of the metal material, the baking plate is preferably heated at the temperature of 150 ℃ for 2 hours, and if the temperature is too high or the time is too long, the annealing of the metal workpiece is easily caused, and the self hardness and the mechanical strength of the workpiece are reduced. If the temperature is too low or the time is insufficient, it is difficult to eliminate hydrogen imperfection and to ensure complete removal of hydrogen from the metal material.
Further, carrying out sand blasting treatment, setting parameters of 1.0-1.5 m/min of speed, carrying out sand blasting twice (1.5 kg/square centimeter of sand blasting pressure), uniformly adopting transverse direction and inconsistent strict direction, adopting horizontal copper deposition, bulking → removing glue → neutralizing → copper deposition, adopting 2.5m/min of speed, ensuring the same direction of the plate surface, manufacturing a first piece when hole filling electroplating is carried out, checking the appearance of the plate surface, preventing floating frame from scratching, carrying out integral jet flow check, ensuring the consistency of VCP two-side jet flow, adopting 8ASF 90min for manufacturing, ensuring that the ratio of current coefficients of VCP copper cylinders is 0.6/0.6/0.8/0.8/1.0/1.0/1.1/1.1/1.2/1.2, copper sulfate 220 g/L, ensuring that sulfuric acid accounts for 5-7%, adopting a soluble anode in the range of 0.5-1.0 ml/L, leveling agent in the range of 8-16/52, keeping the ratio of copper filling ratio of 260 g/L when hole filling is more than 50%, immediately carrying out integral copper deposition, and adopting a mode of reducing copper deposition, and finishing the whole copper deposition in the mode of finishing the mode of hole filling protection when the copper surfaces is more than 20 mu.
The line width and the line distance of the board surface are usually 2.5/2.5mil, so the board surface belongs to the leading position in China. The line width and line distance have extremely high tolerance requirements on the surface copper, and particularly the whole electroplated line surface copper is extremely poor. The whole line surface copper range difference mainly comprises two aspects: firstly, the surface copper difference value between the whole line board and the board, secondly, the surface copper of different parts in the board is extremely poor, and the surface copper difference value of the whole board surface is ensured to be within the range, so the surface copper control method is adopted.
The invention provides a surface copper control method, wherein the electroplating conductive plate is completely disassembled and assembled after polishing is completed, and the method specifically comprises the following steps: the electroplating conductive plate is completely disassembled before electroplating, the electroplating conductive plate comprises an electroplating conductive plate arm and other metal components, then polishing is carried out, passivation layers on the surfaces of the connecting positions of metal components are completely polished to expose bright metal surfaces, and then the electroplating conductive plate is assembled together to ensure good conductivity among all the components of the electroplating conductive plate. The copper block that electroplating current conducting plate and conductor rail are connected polishes cleanly, smears the one deck again after the conductor rail is inside to clear away the conducting resin, so can guarantee that the face copper median value between board is unanimous. The method for integrally correcting the electroplating conductive plate arms is adopted for controlling the surface copper in the plate, the two electroplating conductive plate arms are integrally placed together, the two electroplating conductive plate arms are parallel to the VCP conductive rail, so that the plate surface is integrally parallel to the conductive rail, when the plate surface is inside the copper cylinder, the distance from any position of the plate surface to the titanium basket can be consistent, and the surface copper uniformity of the front surface and the back surface of the plate surface can be guaranteed.
Further, in order to ensure that the electrogilding process does not have the abnormality such as diffusion plating and the like, the invention controls the electrogilding process by a circuit control method, and specifically adopts the following method for control: 1. the line pretreatment adopts a sand blasting method; 2. the film is removed twice, so that dry film residue is prevented, and short circuit of corrosion resistance is formed; 3. After the line is exposed and developed, the plate surface is stored at the temperature: the temperature is 22 +/-2 ℃, the humidity is less than or equal to 40 percent, and the time for electric gold plating is controlled within 4H.
As another preferred embodiment, the invention preferably adopts CNC equipment for manufacturing, selects a brand-new milling cutter, designs two sets of CNC data, mills the board twice, manufactures set periphery firstly, then relocates, reduces the offset of the position of the PCB board in the continuous forming process, and adopts set as the unit to accurately position and mill the inner groove after the first step is finished, thereby reducing the size error of the optical module product.
Further, because the gold-plated finger is finished before the solder resist, compared with the original gold finger manufacturing process, the gold-plated finger manufacturing process has more pre-processes such as circuit, solder resist and the like, in order to reduce the scratch to the gold finger in the manufacturing process, after the gold plating is finished, two plates are forbidden to be overlapped, an air-insulated inserting plate vehicle and a cleaned film are selected for carrying to control the scratch to the gold finger, and the control key points are as follows: carrying the dry film, electroplating and etching by using a board inserting vehicle to prevent products from being scratched by friction; controlling the one-time yield of solder resist, and prohibiting back washing rework; carrying the middle of each plate after etching and before forming at intervals by using cleaned rubber sheets; cleaning an AOI machine table, a solder resist printing machine table, an exposure machine table and an inspection table before production; the surface is covered by a backing plate during electric milling to prevent a brush of a main shaft of the forming machine from damaging golden fingers; the speed of the finished product cleaning machine is properly slowed down, so that the plate pulling personnel standardizes the plate connecting action and the golden fingers are prevented from being scraped.
According to the manufacturing method of the high-precision optical module printed circuit board, provided by the invention, a pressing control method, an electroplating control method, a surface copper control method, a line control method, an outer layer size control method and a golden finger appearance control method are arranged, problems generated in the existing process of manufacturing the high-precision communication optical module printed circuit board are combined, timely and accurate management and control are carried out, the quality and the specification of manufacturing production are ensured, and the gold surface appearance yield is improved and gold infiltration and other scrappage are reduced through the manufacturing method of the high-precision optical module printed circuit board. In industrial production, huge benefits are generated, rework time and labor cost caused by quality problems such as scrapping are greatly reduced, and the yield and the production benefits of the circuit board are also greatly improved.
Detailed Description
The core of the invention is to provide a method for preparing a printed circuit board of a high-precision communication optical module, aiming at the problems in the existing circuit board preparation, and from the perspective of quality control and production source, multiple control technical means are set, including a press fit control method, an electroplating control method, a surface copper control method, a line control method, an outer layer size control method, a golden finger appearance control method and the like, so that the timely control and management of a preparation link are realized, the quality in the whole life cycle of preparation is ensured, and the problems of excessive errors caused by various factors, friction scratch caused in the preparation process, repeated reworking and the like in the prior art are solved.
In order to make the technical solutions of the present invention better understood, the technical solutions in the embodiments of the present invention are clearly and completely described below, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The present invention will be described in further detail with reference to specific examples.
The appearance and the reliability of the golden finger of the high-precision communication optical module printed circuit board are key control points for manufacturing the printed circuit board. The board edge plugs (Connecting fingers) are used as outlets for Connecting with other devices (such as a motherboard, a chassis, etc.), the board edge plugs are formed by plating a nickel-gold-treated surface for board connection, and all signals are transmitted through the gold fingers, and the gold-plated surface is gold-plated, and the PAD arrangement is in the shape of fingers, so the PAD arrangement is also called as a gold Finger.
The manufacturing process of the PCB board with the board edge plug specifically comprises the following steps: inner layer processing → inner layer AOI → pressing → drilling → copper deposition → board electric → outer layer pattern → pattern plating → outer layer etching (alkaline etching) → outer layer AOI → silk screen printing solder resist (normal making surface solder resist) → character → gold deposition → blue glue application → blue glue windowing → nickel plating → molding → hypotenuse → test → FQC. The common gold finger electric gold lead is designed at the front end of the gold finger, and the lead is thoroughly removed by adopting a mode of molding and beveling.
Processing an inner layer: the method comprises the steps of selecting a substrate, preferably selecting a copper-clad substrate, cutting the raw material, namely cutting the raw material according to the required size, removing moisture through a baking plate, and stabilizing the size of the plate, wherein chemical cleaning or mechanical template treatment is further carried out before an inner layer, so that oil stains and other organic dirt on the surface of copper are removed, and the mechanical template is used for roughening the surface of the copper, increasing the contact area of a dry film and the surface of the copper and increasing the adhesiveness. And then, inner layer pattern transfer is performed, that is, a circuit image on the film is transferred onto the base copper foil to form a resist or plating resist film image. The image is transferred followed by an etch of the inner layer, wherein the unetched parts are removed in the leg membrane.
Inner layer AOI: the automatic Optical Inspection (automatic Optical Inspection) is to compare an image of a PCB board, which is scanned optically by using a reflection effect of a copper surface of a circuit of the PCB board and a reflection effect of a base material, with a standard board, wherein the base material is preferably an epoxy resin base material, and the standard board can be selected as a CAM material, so as to detect defects in the circuit pattern of the PCB. The technical effect of performing inner layer AOI is to inspect out defective PCB, improve the quality of PCB circuit, reduce scrappage, thereby improving the manufacturing process and increasing the yield.
Further, the inner AOI layer is mechanically drilled and mechanically punched by using a punching machine. The method also comprises the step of optically scanning the image of the PCB by adopting a scanner so as to detect the defects in the circuit diagram of the PCB by adopting a detector. And when the image of the PCB is not consistent with the standard board, repairing the line gap through a line repairing machine, thereby finishing the whole procedure of the memory AOI.
Copper deposition: electroless Copper Plating (Eletcroless Plating Copper) is also commonly called Copper deposition or via (PTH) and is an autocatalytic redox reaction, i.e., PTH is deposited through hole plated through hole after drilling is completed above a double-sided board. The method specifically comprises the following steps: the pretreatment, preferably using metal palladium particles as an activator, makes the surface of the substrate absorb a layer of active particles, so that the copper ions of the substrate are reduced, and the reduced metal copper crystal nuclei themselves serve as a catalytic layer for the copper ions, so that the reduction reaction of copper is continued on the surfaces of the new copper crystal nuclei. The purpose of copper deposition is to metallize the resin and glass bundles on the non-conductor part of the hole wall for the subsequent copper electroplating process. The copper deposition process is preferably: the method comprises the steps of loading a plate, bulking, removing glue after washing, neutralizing after washing, washing and removing oil, washing and micro-etching again, further washing with acid, washing with water, pre-dipping, activating, washing with water and depositing copper, and finally loading the plate.
A board is electrically connected: the main procedures comprise: the lower plate is washed after the upper plate, the oil removal, the water washing, the acid dipping and the copper plating, and the purpose of plate electric plating is to thicken a copper plating layer in a hole to ensure good conduction.
The outer layer pattern is preferably formed by: and (3) preprocessing, namely, brushing, drying, and then pressing a film, namely, pressing and pasting the PCB and the dry film by using a hot-pressing roller to obtain a layer of resist agent with a uniform PCB surface. Then, exposure is performed, and the dry film is changed from a monomer to a polymer by two catalytic factors of light and heat using dry film photosensitivity. Finally, after developing and electrographic processing, film stripping and etching are carried out, and the outer layer graph is manufactured.
Outer layer etching: in the PCB processing process, a layer of lead-tin corrosion resistant layer is pre-plated on a copper foil part needing to be reserved on the outer layer of the board, and then the rest copper foil is corroded, namely etched, in a chemical treatment mode. Wherein the outer layer is etched, i.e. only the outer layer of copper is etched.
The outer AOI is similar to the inner AOI, and detection is carried out, so that the qualification rate and the quality of the PCB are ensured.
Character: i.e. each PCB board is printed with a specific code or logo, preferably by using a printer or inkjet printer for character processing. Thereby ensuring the identification and finishing arrangement of each printed PCB board.
Gold precipitation: namely a process for coating a solderability coating on the bare copper surface of the PCB. The method specifically comprises the steps of hole preparation, oil removal, water washing, micro-etching and activation, and finally nickel deposition, gold deposition and drying to complete the gold deposition process.
Bevel edge: and (4) forming a golden finger part on the circuit board, and obtaining double bevel edges according with the size of the blueprint in a chamfering mode. Preferably, the cutting tool cuts the useless area at an inclined angle, so that the front end of the golden finger forms a double-bevel edge, thereby facilitating the assembly operation of the next process.
In order to improve the quality in the manufacturing process, a plurality of control methods need to be set, and the qualified rate of circuit board preparation is ensured, the invention provides the method for preparing the high-precision communication optical module printed circuit board, wherein in order to ensure that the pressing error is in a reasonable range, the method specifically comprises the step of setting a pressing control method as a control means of the pressing process.
Pretreatment before pressing processing: and cleaning the secondary outer layer, performing browning treatment, judging whether the exposed surface of the browned plate exceeds a threshold value, if so, cleaning again, and otherwise, performing a pressing procedure.
And cleaning the secondary outer layer for browning treatment, and further comprising.
Adopting 3 sections of overflow water washing before the secondary outer layer browning, wherein the length is as follows: 1 m; ultrasonic water washing 3 sections, length: 1m at a speed of 3m/min, cleaning the debris residues on the surface of the secondary outer layer printed circuit board, cleaning the front and back of the surface by using a dust adhering wheel, then putting a browning line, observing whether the surface has a non-browned surface after browning, when the browned exposed surface exceeds 5 single surfaces, performing overflow water washing, ultrasonic water washing and dust adhering wheel cleaning again, and cleaning the board surface again until the board surface is qualified.
And (4) entering a pressing process, adopting a brand new steel plate or a newly polished steel plate, checking that residual resin and copper scraps cannot exist on the surface, aligning the plate and the PP, and pressing to ensure that the pressing tolerance and the expansion and contraction of the plate surface are consistent.
And (3) pressing subsequent procedures: drilling the circuit board obtained after pressing, then baking the board before electroplating and polishing the electroplating conductive plate, removing the film after electroplating, etching the circuit board, further welding resistance, milling the board twice by adopting a milling cutter, and finishing the external dimension processing of the circuit board.
Optionally, the invention further designs an electroplating control method, so as to effectively reduce rework rate, which specifically comprises:
before electroplating, optionally performing a baking plate process, wherein the baking plate parameter is set to be at 150 ℃, the baking plate time is 2 hours, preferably, the baking plate is processed by adopting a sand blasting method, wherein the manufacturing speed is preferably 1.0-1.5 m/min, sand blasting is performed twice, the sand blasting pressure is 1.5 kg/square centimeter, the direction is uniformly horizontal, or the direction is uniformly vertical, the strictly forbidden directions are inconsistent, or scraping is caused.
Optionally, the copper is deposited horizontally, and the process is as follows: bulking → degumming → neutralizing → copper deposition, the manufacturing parameters are set to adopt a speed of 2.5m/min, and the consistency of the plate surface direction is strictly ensured.
Furthermore, when hole filling electroplating is carried out, a first piece is manufactured, the appearance of a board surface is checked, floating frame scratching is prevented, integral jet flow inspection is carried out, VCP two-side jet flow is consistent, the hole filling electroplating is manufactured by adopting 8ASF for 90min, the ratio of current coefficients of VCP copper cylinders is 0.6/0.6/0.8/1.0/1.0/1.1/1.1/1.2/1.2, preferably, other manufacturing parameters are copper sulfate 220-260 g/L, sulfuric acid accounts for 5-7%, a soluble anode is adopted, wherein the range of a light agent is 0.5-1.0 ml/L, the range of a leveling agent is 8-16 ml/L, the approximate ratio is 1:16, the hole filling protection current is kept above 50%, a person specially follows a hole filling line, and once abnormity occurs, the problem is immediately checked, the problem is timely controlled at the source, and larger loss is avoided.
And further, carrying out full surface copper measurement on the plate surface after hole filling is finished, distributing the whole surface copper within 20-30 mu m, and strictly forbidding adopting a plate grinding mode to reduce the copper when the surface copper is larger than the range.
The line width and the line distance of the board surface are usually 2.5/2.5mil, so the board surface belongs to the leading position in China. The line width and line distance have extremely high tolerance requirements on the surface copper, and particularly the whole electroplated line surface copper is extremely poor. The whole line surface copper range difference mainly comprises two aspects: firstly, the surface copper difference value between the whole line board and the board, and secondly, the surface copper of different parts in the board is extremely poor, and in order to ensure that the surface copper difference value of the whole board surface is within the range, the invention sets the surface copper control method.
The surface copper control method mainly aims to ensure the consistency of the distance from any position of the plate surface to the titanium basket and further ensure the surface copper uniformity of the front surface and the back surface of the plate surface, and specifically comprises the following steps: the electroplating conductive plate is completely disassembled before electroplating, the electroplating conductive plate comprises an electroplating conductive plate arm and other metal components, then polishing is carried out, passivation layers on the surfaces of the connecting positions of metal components are completely polished to expose bright metal surfaces, and then the electroplating conductive plate is assembled together to ensure good conductivity among all the components of the electroplating conductive plate. The copper block that electroplating current conducting plate and conductor rail are connected polishes cleanly, smears the one deck again after the conductor rail is inside to clear away the conducting resin, so can guarantee that the face copper median value between board is unanimous. The method for integrally correcting the electroplating conductive plate arms is adopted for controlling the surface copper in the plate, the two electroplating conductive plate arms are integrally placed together, the two electroplating conductive plate arms are parallel to the VCP conductive rail, so that the plate surface is integrally parallel to the conductive rail, when the plate surface is inside the copper cylinder, the distance from any position of the plate surface to the titanium basket can be consistent, and the surface copper uniformity of the front surface and the back surface of the plate surface can be guaranteed.
Further, in order to ensure that the electric gold plating process does not have the abnormality such as diffusion plating and the like, the invention adopts a circuit control method, which specifically comprises the following steps: 1. the line pretreatment adopts a sand blasting method; 2. the film is removed twice, so that dry film residue is prevented, and short circuit of corrosion resistance is formed; 3. After the line is exposed and developed, the plate surface is stored at the temperature: the temperature is 22 +/-2 ℃, the humidity is less than or equal to 40 percent, and the time for electric gold plating is controlled within 4H.
As the dimensional accuracy of the module PCB product requires +/-0.1 mm, the dimensional requirements of the conventional PCB product generally require +/-0.13 mm and +/-0.15 mm.
In order to meet the strict requirement, as another preferred embodiment of the invention, the invention adopts a strict forming tolerance control technology, selects CNC equipment with higher precision, selects a brand-new milling cutter, designs two sets of CNC data, mills boards twice, firstly manufactures set peripheries, then relocates, reduces the offset of the position of a PCB board in the continuous forming process, and adopts an accurate positioning milling inner groove with the set as a unit after the first step is finished so that the size of an optical module product meets the requirement.
Furthermore, considering that the gold-plated finger is finished before the solder mask, compared with the original gold finger manufacturing process, the method has more pre-processes such as circuit and solder mask, and in order to reduce the scratch to the gold finger in the manufacturing process, after the gold-plating is finished, two plates are forbidden to be overlapped, an air-spaced board inserting vehicle and a cleaned film are selected for carrying to control the scratch to the gold finger, and the control key points are as follows: carrying the dry film, electroplating and etching by using a board inserting vehicle to prevent products from being scratched by friction; controlling the one-time yield of solder resist, and prohibiting back washing rework; carrying the middle of each plate after etching and before forming at intervals by using cleaned rubber sheets; cleaning an AOI machine table, a solder resist printing machine table, an exposure machine table and an inspection table before production; the surface is covered by a backing plate during electric milling to prevent a brush of a main shaft of the forming machine from damaging golden fingers; the speed of the finished product cleaning machine is properly slowed down, so that the plate pulling personnel standardizes the plate connecting action and the golden fingers are prevented from being scraped.
In conclusion, according to the manufacturing method of the high-precision optical module printed circuit board, by combining with a specific manufacturing process of the PCB board with the board edge plug, the management and control method is correspondingly arranged in the aspects of a pressing link, an electroplating link, polishing treatment of an electroplating conductive plate before electroplating, line control, golden finger appearance and the like, so that the high-precision requirement of the optical module printed circuit board is ensured, the appearance yield of the golden surface is improved, and the scrappage of gold penetration and the like is reduced.
While the invention has been described in conjunction with the specific embodiments set forth above, it is evident that many alternatives, modifications, and variations will be apparent to those skilled in the art in light of the foregoing description. Accordingly, it is intended to embrace all such alternatives, modifications, and variations that fall within the spirit and scope of the appended claims.
Claims (9)
1. A method for preparing a printed circuit board of a high-precision communication optical module comprises the following steps: the method comprises the following steps of sequentially cutting a PCB substrate, processing an inner layer plate, carrying out inner layer AOI, pressing, drilling and then carrying out copper plating
Pretreatment before pressing processing: cleaning the secondary outer layer, performing browning treatment, judging whether the exposed surface of the browned plate exceeds a threshold value, if so, cleaning again, otherwise, performing a pressing procedure;
and (3) a pressing procedure: selecting and aligning a plate and a PP base material, pressing, detecting whether the pressing tolerance and the expansion and contraction value are consistent, and entering a subsequent pressing process if the pressing tolerance and the expansion and contraction value are consistent; otherwise, carrying out rework treatment;
and (3) pressing subsequent procedures: drilling the circuit board obtained after pressing, then baking the board before electroplating and polishing the electroplating conductive plate, removing the film after electroplating, etching the circuit board, further welding resistance, milling the board twice by adopting a milling cutter, and finishing the external dimension processing of the circuit board.
2. The method of claim 1, wherein the cleaning the second outer layer to perform a browning process further comprises:
adopt 3 sections overflow water washes and ultrasonic wave water washes, wholly will be the piece residue sanitization on time outer printed circuit board surface, with the dust-binding wheel with the clean one side of surperficial positive and negative, put into the brown line and accomplish the brown oxidation after, check whether the surface has not brown the surface, when brown the naked face of face exceeds 5 single faces, carry out overflow water washes, ultrasonic wave water washes, the dust-binding wheel is clean again, cleans the face once again, until qualified.
3. The method of claim 1, wherein the bonding process further comprises, prior to: checking whether the surface has residual resin or copper scraps, and if not, performing pressing treatment; otherwise, returning to the pretreatment procedure before pressing processing.
4. The method according to claim 1, wherein the electroplating is further performed by sand blasting, the sand blasting speed is set to be 1.0m-1.5m/min, and the sand blasting is performed twice, wherein the sand blasting direction is transverse or vertical.
5. The method of claim 1, further comprising, before the electroplating, a copper deposition step, wherein the steps of bulking, removing glue, neutralizing, and depositing copper are performed in sequence.
6. The method of claim 1, further comprising: the electroplating comprises the steps of manufacturing a sample, checking whether the appearance of the surface of the sample is qualified, preventing a floating frame from being scratched, and checking whether the VCP two-side jet flow of the whole jet flow is consistent; if the two are consistent, the hole is filled, and then the surface copper control procedure is executed.
7. The method according to claim 6, wherein the surface copper control process comprises the steps of disassembling the electroplating conductive plate completely, polishing until the passivation layer on the surface of the connecting position of the metal part of the electroplating conductive plate is polished clean to expose a bright metal surface, assembling, and re-coating the inside of the conductive rail to realize that the whole electroplating conductive plate is parallel to the conductive rail.
8. The method as claimed in any one of claims 1 to 7, wherein the method is implemented by using CNC equipment, selecting a new milling cutter, designing two sets of CNC data, milling the PCB twice, manufacturing set periphery, then repositioning, reducing the offset of the PCB position during continuous molding, and after the first step is completed, precisely positioning the milling inner groove by taking set as a unit to reduce the dimension error of the optical module product.
9. The method of claim 8, further comprising: carrying the dry film, electroplating and etching by using a board inserting vehicle to prevent products from being scratched by friction; carrying the middle of each plate after etching and before forming at intervals by using cleaned rubber sheets; cleaning an AOI machine table, a solder resist printing machine table, an exposure machine table and an inspection table before production; the surface is covered by a backing plate during electric milling to prevent a brush of a main shaft of the forming machine from damaging golden fingers.
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| CN202010096238.4A CN111405759B (en) | 2020-02-17 | 2020-02-17 | Method for preparing high-precision communication optical module printed circuit board |
| PCT/CN2020/105748 WO2021164203A1 (en) | 2020-02-17 | 2020-07-30 | Preparation method for high-precision communication optical module printed circuit board |
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| CN202010096238.4A CN111405759B (en) | 2020-02-17 | 2020-02-17 | Method for preparing high-precision communication optical module printed circuit board |
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| WO2021164203A1 (en) | 2021-08-26 |
| CN111405759B (en) | 2021-10-19 |
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