CN117479452A - New energy automobile, car lamp copper-embedded plate and preparation method thereof - Google Patents
New energy automobile, car lamp copper-embedded plate and preparation method thereof Download PDFInfo
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- CN117479452A CN117479452A CN202311514615.1A CN202311514615A CN117479452A CN 117479452 A CN117479452 A CN 117479452A CN 202311514615 A CN202311514615 A CN 202311514615A CN 117479452 A CN117479452 A CN 117479452A
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- 238000002360 preparation method Methods 0.000 title claims abstract description 28
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 132
- 229910052802 copper Inorganic materials 0.000 claims abstract description 127
- 239000010949 copper Substances 0.000 claims abstract description 127
- 238000004519 manufacturing process Methods 0.000 claims abstract description 43
- 230000001502 supplementing effect Effects 0.000 claims abstract description 19
- 238000003825 pressing Methods 0.000 claims abstract description 18
- 238000012360 testing method Methods 0.000 claims abstract description 18
- 238000012546 transfer Methods 0.000 claims abstract description 16
- 238000002844 melting Methods 0.000 claims abstract description 10
- 229910000679 solder Inorganic materials 0.000 claims abstract description 10
- 230000008018 melting Effects 0.000 claims abstract description 9
- 239000003292 glue Substances 0.000 claims description 35
- 230000008021 deposition Effects 0.000 claims description 34
- 239000000463 material Substances 0.000 claims description 22
- 238000000034 method Methods 0.000 claims description 21
- 238000005553 drilling Methods 0.000 claims description 18
- 238000005530 etching Methods 0.000 claims description 11
- 238000005498 polishing Methods 0.000 claims description 9
- 239000000919 ceramic Substances 0.000 claims description 8
- 239000002893 slag Substances 0.000 claims description 8
- 230000005662 electromechanics Effects 0.000 claims description 7
- 239000011265 semifinished product Substances 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 230000008719 thickening Effects 0.000 claims description 6
- 238000003475 lamination Methods 0.000 claims description 5
- 229920002120 photoresistant polymer Polymers 0.000 claims description 4
- 230000005611 electricity Effects 0.000 claims description 3
- 238000000059 patterning Methods 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract description 8
- 229910052737 gold Inorganic materials 0.000 abstract description 6
- 239000010931 gold Substances 0.000 abstract description 6
- 238000003466 welding Methods 0.000 abstract description 6
- 230000008439 repair process Effects 0.000 abstract description 5
- 239000010410 layer Substances 0.000 description 173
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 33
- 229910052709 silver Inorganic materials 0.000 description 33
- 239000004332 silver Substances 0.000 description 33
- 239000012790 adhesive layer Substances 0.000 description 11
- 239000000047 product Substances 0.000 description 9
- 230000008569 process Effects 0.000 description 6
- 238000005336 cracking Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 230000007704 transition Effects 0.000 description 4
- 238000005422 blasting Methods 0.000 description 3
- 230000001680 brushing effect Effects 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
- 239000002390 adhesive tape Substances 0.000 description 2
- 239000000084 colloidal system Substances 0.000 description 2
- 239000012634 fragment Substances 0.000 description 2
- JVPLOXQKFGYFMN-UHFFFAOYSA-N gold tin Chemical compound [Sn].[Au] JVPLOXQKFGYFMN-UHFFFAOYSA-N 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 241001391944 Commicarpus scandens Species 0.000 description 1
- 241000218202 Coptis Species 0.000 description 1
- 235000002991 Coptis groenlandica Nutrition 0.000 description 1
- 244000137852 Petrea volubilis Species 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 238000009662 stress testing Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The application provides a new energy automobile and car lamp copper-embedded plate and a preparation method thereof. The preparation method of the car light copper-clad plate comprises the following steps: manufacturing a first inner core plate; manufacturing a second inner core plate; carrying out hot melting prestack operation on the first inner core plate, the first PP layer, the second PP layer, the third PP layer and the second inner core plate; sequentially embedding copper blocks into a core board copper embedding groove of the second inner core board, a PP copper embedding groove of the third PP layer and a PP copper embedding groove of the second PP layer to form a piece to be pressed; carrying out pressing operation on the piece to be pressed to form a multilayer board; performing pattern transfer operation on the multilayer board; carrying out AOI test on the etched multi-layer board, and if an open circuit notch appears on the multi-layer board, carrying out wire supplementing operation on the multi-layer board; and performing a solder resist operation on the multilayer board. According to the preparation method, expensive repair welding machines, gold wires/tin copper wires and other tools are not needed, so that the manufacturing cost is reduced, the production efficiency is improved, the quality and the reliability of products are improved, and the rejection rate of the products is reduced.
Description
Technical Field
The application relates to the technical field of circuit boards, in particular to a new energy automobile and automobile lamp copper-embedded plate and a preparation method thereof.
Background
In the preparation process of the car light copper-clad plate, gold wires/tin copper wires are manufactured through a pattern transfer process. Because the gold wire/tin copper wire is poor in ductility of the circuit, the gold wire/tin copper wire is easy to break in the process of carrying and other working procedures such as flying probe manufacture or under the power-on impact of a client, the function of a product is directly lost, and the circuit of the car light copper-embedded plate is open.
To the circuit situation that exists of car light copper-clad plate, traditional circuit mends the line mode and mends the line through the gold thread/tin copper line of mending the welding machine to car light copper-clad plate. However, this way of repairing the open notch is not widely accepted by the market. Therefore, when the car light copper-clad laminate is in an open circuit notch condition, the car light copper-clad laminate is directly scrapped, and especially for a middle-high end circuit board, the cost pressure of the car light copper-clad laminate is increased.
Disclosure of Invention
The utility model aims to overcome the defects in the prior art and provide a new energy automobile and a car lamp copper-embedded plate capable of reducing cost pressure and a preparation method thereof.
The aim of the application is achieved by the following technical scheme:
a preparation method of a car lamp copper-clad plate comprises the following steps:
manufacturing a first inner core plate;
manufacturing a second inner core plate, wherein a core plate copper-embedded groove is formed in the second inner core plate;
carrying out hot melting prestack operation on the first inner core plate, the first PP layer, the second PP layer, the third PP layer and the second inner core plate;
sequentially embedding copper blocks into the core board copper embedding groove of the second inner core board, the PP copper embedding groove of the third PP layer and the PP copper embedding groove of the second PP layer to form a piece to be pressed;
performing pressing operation on the piece to be pressed to form a multi-layer board;
performing pattern transfer operation on the multilayer board to enable the width of the outer layer circuit to be compensated to a preset circuit width, and reducing the distance between the outer layer circuit to a preset circuit distance;
carrying out AOI test on the etched multi-layer board, and if an open-circuit notch appears on the multi-layer board, carrying out line supplementing operation on the multi-layer board;
and performing a solder resist operation on the multilayer board.
In one embodiment, the step of making the second inner core panel includes:
providing a second material plate;
carrying out image electric thickening treatment on the second material plate so as to form a second copper deposition layer on the surface of the second material plate;
developing and etching the second copper deposition layer to obtain a second inner core plate semi-finished product;
and (3) routing the developed and etched second inner core plate semi-finished product to form the core plate copper-embedded groove.
In one embodiment, after the step of performing the pressing operation on the to-be-pressed member and before the step of performing the pattern transfer and the outer layer etching operation on the multi-layer board after the electromechanic operation, the preparation method further includes:
drilling holes and removing glue residues on the multilayer board respectively;
and carrying out outer copper deposition and electricity drawing operation on the multi-layer board after removing the glue slag.
In one embodiment, after the step of performing the outer layer copper deposition and the electromechanic operation on the multi-layer board after the desmear operation and before performing the pattern transfer operation on the multi-layer board after the electromechanic operation, the preparation method includes:
carrying out resin plugging operation on the multi-layer board after the electricity-drawing operation;
performing ceramic polishing operation on the multilayer board after the resin hole plugging operation;
and carrying out secondary outer copper deposition and secondary image electric operation on the ceramic polished multilayer plate.
In one embodiment, the drilling and desmutting the multi-layer board comprises:
drilling the multilayer board respectively;
and performing glue residue removing operation on the drilled multilayer plate.
In one embodiment, the step of removing the glue residue from the drilled multilayer board includes:
carrying out plasma glue residue removing operation on the drilled multilayer board;
and performing PTH photoresist removing operation on the multilayer board after the plasma photoresist residues are removed.
In one embodiment, before the step of sequentially embedding the copper blocks into the copper-embedded core board groove of the second inner core board, the PP copper-embedded core board groove of the third PP layer, and the PP copper-embedded core board groove of the second PP layer, the preparation method further includes:
sleeving the copper block with a plate;
and carrying out browning operation on the copper block after the sheathing.
In one embodiment, the step of performing the pressing operation on the to-be-pressed member specifically includes:
and performing lamination treatment on the to-be-laminated piece by adopting a preset lamination program.
The car light copper-clad plate is prepared by adopting the preparation method of the car light copper-clad plate in any embodiment.
A new energy automobile comprises the car light copper-clad plate.
Compared with the prior art, the application has at least the following advantages:
1. the preparation method of the car light copper-embedded plate comprises the steps of firstly, manufacturing a first inner core plate; then manufacturing a second inner core plate, wherein the second inner core plate is provided with a core plate copper-embedded groove; then carrying out hot melting prestack operation on the first inner core plate, the first PP layer, the second inner core plate, the second PP layer, the third PP layer and the second inner core plate; then, the copper blocks are sequentially embedded into a core board copper embedding groove of the second inner core board, a PP copper embedding groove of the third PP layer and a PP copper embedding groove of the second PP layer to form a piece to be pressed; then, the piece to be pressed is pressed, so that the first inner core board is fixedly adhered to the second inner core board through the first PP layer, and simultaneously, the copper block is fixedly connected with the second inner core board through the third PP layer and the second PP layer respectively in an adhering manner, so as to form a multi-layer board; then, carrying out pattern transfer operation on the multilayer board to enable the width of the outer layer circuit to be compensated to the preset circuit width, and reducing the spacing of the outer layer circuit to the preset circuit spacing; then carrying out AOI test on the etched multi-layer board, and if an open circuit notch appears on the multi-layer board, carrying out wire supplementing operation on the multi-layer board; finally, performing solder resist operation on the multilayer board;
2. the preparation method does not need to use expensive repair welding machines, gold wires/tin copper wires and other tools, reduces the manufacturing cost, improves the production efficiency, improves the quality and the reliability of products, and reduces the rejection rate of the products.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered limiting the scope, and that other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a method for manufacturing a copper-clad laminate for a vehicle lamp according to an embodiment;
fig. 2 is a schematic view of image acquisition of the vehicle lamp copper-clad laminate shown in fig. 1.
Detailed Description
In order to facilitate an understanding of the present application, a more complete description of the present application will now be provided with reference to the relevant figures. Preferred embodiments of the present application are shown in the accompanying drawings. This application may, however, be embodied in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "fixed to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like are used herein for illustrative purposes only and are not meant to be the only embodiment.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.
The application provides a preparation method of a car lamp copper-embedded plate, which comprises the following steps: manufacturing a first inner core plate; manufacturing a second inner core plate, wherein a core plate copper-embedded groove is formed in the second inner core plate; carrying out hot melting prestack operation on the first inner core plate, the first PP layer, the second PP layer, the third PP layer and the second inner core plate; sequentially embedding copper blocks into the core board copper embedding groove of the second inner core board, the PP copper embedding groove of the third PP layer and the PP copper embedding groove of the second PP layer to form a piece to be pressed; performing pressing operation on the piece to be pressed to form a multi-layer board; performing pattern transfer operation on the multilayer board to enable the width of the outer layer circuit to be compensated to a preset circuit width, and reducing the distance between the outer layer circuit to a preset circuit distance; carrying out AOI test on the etched multi-layer board, and if an open-circuit notch appears on the multi-layer board, carrying out line supplementing operation on the multi-layer board; and performing a solder resist operation on the multilayer board.
The preparation method of the car light copper-embedded plate comprises the steps of firstly, manufacturing a first inner core plate; then, manufacturing a second inner core plate, wherein the second inner core plate is provided with a core plate copper-embedded groove; then carrying out hot melting pre-stacking operation on the first inner core plate, the first PP layer, the second inner core plate, the second PP layer, the third PP layer and the second inner core plate; sequentially embedding copper blocks into a core board copper embedding groove of the second inner core board, a PP copper embedding groove of the third PP layer and a PP copper embedding groove of the second PP layer to form a piece to be pressed; then, the piece to be pressed is pressed, so that the first inner core board is fixedly adhered to the second inner core board through the first PP layer, and simultaneously, the copper block is fixedly connected with the second inner core board through the third PP layer and the second PP layer respectively in an adhering manner, so as to form a multi-layer board; then, carrying out pattern transfer operation on the multilayer board to enable the width of the outer layer circuit to be compensated to the preset circuit width, and reducing the spacing of the outer layer circuit to the preset circuit spacing; then carrying out AOI test on the etched multi-layer board, and if an open circuit notch appears on the multi-layer board, carrying out wire supplementing operation on the multi-layer board; finally, performing solder resist operation on the multilayer board; the preparation method does not need to use expensive repair welding machines, gold wires/tin copper wires and other tools, reduces the manufacturing cost, improves the production efficiency, improves the quality and the reliability of products, and reduces the rejection rate of the products.
For better understanding of the technical solutions and advantageous effects of the present application, the following details are further described with reference to specific embodiments:
as shown in fig. 1, the method for preparing the car light copper-clad plate according to an embodiment includes the following steps:
s101, manufacturing a first inner core plate.
S103, manufacturing a second inner core plate, wherein a core plate copper-embedded groove is formed in the second inner core plate.
In this embodiment, the second inner core plate is formed with a core plate copper-embedding groove for subsequent copper block embedding press-fit assembly.
S105, performing hot melting pre-stacking operation on the first inner core plate, the first PP layer, the second PP layer, the third PP layer and the second inner core plate.
In this embodiment, the first inner core board, the first PP layer, the second PP layer, the third PP layer, and the second inner core board are subjected to a hot-melting pre-stacking operation, so as to be reliably pressed in the following steps.
And S107, sequentially embedding copper blocks into the copper-embedded groove of the core plate of the second inner core plate, the copper-embedded groove of the PP of the third PP layer and the copper-embedded groove of the PP of the second PP layer to form a piece to be pressed.
And S109, performing pressing operation on the to-be-pressed piece to form a multi-layer board.
In this embodiment, the to-be-pressed member is pressed, so that the first inner core board is adhered and fixed to the second inner core board through the first PP layer, and meanwhile, the copper block is adhered and fixedly connected with the second inner core board through the third PP layer and the second PP layer, respectively, to form the multi-layer board.
And S111, performing pattern transfer operation on the multilayer board to enable the width of the outer layer circuit to be compensated to a preset circuit width, and reducing the interval of the outer layer circuit to a preset circuit interval.
In this embodiment, the graphics transferring operation is performed on the multi-layer board, so that the width of the outer layer circuit is compensated to the preset circuit width, and the distance between the outer layer circuits is reduced to the preset circuit distance, so that the outer layer circuit formed on the multi-layer board can better meet the requirement of the wire supplementing operation when the open notch appears subsequently.
Further, the preset line width is 1.5mil to 2.5mil. In this embodiment, the preset line width is 2.2 mils. Compared with the traditional preset line width of 0.8mil, the method greatly improves the follow-up requirement of the line filling when the open-circuit notch appears.
Further, the preset line spacing is 2.3mil to 2.9mil. In this embodiment, the predetermined line spacing is 2.6 mils. Compared with the traditional preset line spacing of 3.9mil, the method greatly improves the follow-up requirement of the line filling when the open-circuit notch appears.
S113, AOI (Automated Optical Inspection ) test is performed on the etched multilayer board. And if the multilayer board has an open-circuit notch, carrying out wire supplementing operation on the multilayer board.
In this example, the multilayer board after etching was subjected to AOI test. If the multilayer board has an open circuit notch, the line supplementing operation is carried out on the multilayer board, so that the situation that the outer layer line of the multilayer board is open circuit is avoided. In contrast, if the multi-layer board has no open circuit notch, the wire supplementing operation of the multi-layer board is not needed.
S115, performing a solder resist operation on the multilayer board.
In this embodiment, the multilayer board is subjected to a solder resist operation to form an ink layer on the surface of the multilayer board.
The preparation method of the car light copper-embedded plate comprises the steps of firstly, manufacturing a first inner core plate; then, manufacturing a second inner core plate, wherein the second inner core plate is provided with a core plate copper-embedded groove; then carrying out hot melting pre-stacking operation on the first inner core plate, the first PP layer, the second inner core plate, the second PP layer, the third PP layer and the second inner core plate; sequentially embedding copper blocks into a core board copper embedding groove of the second inner core board, a PP copper embedding groove of the third PP layer and a PP copper embedding groove of the second PP layer to form a piece to be pressed; then, the piece to be pressed is pressed, so that the first inner core board is fixedly adhered to the second inner core board through the first PP layer, and simultaneously, the copper block is fixedly connected with the second inner core board through the third PP layer and the second PP layer respectively in an adhering manner, so as to form a multi-layer board; then, carrying out pattern transfer operation on the multilayer board to enable the width of the outer layer circuit to be compensated to the preset circuit width, and reducing the spacing of the outer layer circuit to the preset circuit spacing; then carrying out AOI test on the etched multi-layer board, and if an open circuit notch appears on the multi-layer board, carrying out wire supplementing operation on the multi-layer board; finally, performing solder resist operation on the multilayer board; the preparation method does not need to use expensive repair welding machines, gold wires/tin copper wires and other tools, reduces the manufacturing cost, improves the production efficiency, improves the quality and the reliability of products, and reduces the rejection rate of the products.
In one embodiment, the step S101 of manufacturing the first inner core board includes: firstly, providing a first material plate; secondly, drilling the first material plate to process a through hole; then, performing gumming slag removal operation on the first material plate after the drilling treatment to remove drilling scraps generated by the drilling treatment so as to facilitate subsequent better copper deposition; then, carrying out outer copper deposition and picture electric thickening operation on the first material plate except for the glue slag, so that a first copper deposition layer is formed on the surfaces of the first material plate and the through holes; then, carrying out pattern transfer operation on the first material plate with the electrically thickened pattern; finally, an outer layer etching operation is performed on the first material plate of the pattern transferring operation, so that an outer layer circuit is formed on the surface of the first copper deposition layer.
Further, the step of performing outer copper deposition and electro-graphic thickening operation on the first material plate except for the glue slag comprises the following steps: firstly, carrying out outer layer copper deposition operation on a first material plate for removing glue residues; then carrying out full-plate electroplating operation on the first material plate with the copper deposited on the outer layer; and then carrying out image electric thickening treatment on the first material plate electroplated on the whole plate, so that a first copper deposition layer is formed on the surfaces of the first material plate and the through holes.
In one embodiment, the step S103 of manufacturing the second inner core includes: firstly, providing a second material plate; secondly, carrying out image electric thickening treatment on the second material plate so as to form a second copper deposition layer on the surface of the second material plate; secondly, developing and etching the second copper deposition layer to obtain a second inner core plate semi-finished product, and forming an inner layer circuit on the surface of the second inner core plate semi-finished product; and finally, milling the developed and etched second inner core plate semi-finished product to form the core plate copper-embedded groove.
Further, the step of developing and etching the second copper deposition layer comprises the following steps: firstly forming an inner layer on the second copper deposition layer for exposure and development; and then carrying out inner layer etching on the developed second copper deposition layer to manufacture an inner layer circuit pattern on the second copper deposition layer.
In one embodiment, after the step S109 of performing the pressing operation on the to-be-pressed member and before the step S111 of performing the pattern transfer and the outer layer etching operation on the multi-layer board after the patterning operation, the preparation method further includes:
S110A, drilling and removing glue residues on the multilayer board respectively to remove fragments and board surface glue residues generated by drilling so as to carry out ceramic polishing operation subsequently. In this embodiment, the steps of drilling and removing the glue residue from the multilayer board respectively include: firstly, drilling the multilayer board; and then, the glue residue removing operation is carried out on the drilled multilayer board so as to remove fragments and board surface residual glue generated by drilling, and the neatness of the multilayer board before copper deposition is improved.
And S110B, carrying out outer copper deposition and picture electric operation on the multi-layer board after removing the glue slag so as to better form a copper layer with preset thickness on the surface of the multi-layer board. In this embodiment, the step of performing the outer layer copper deposition and the electromechanic operation on the multi-layer board after removing the glue residue includes: carrying out primary outer layer copper deposition on the multi-layer board after removing the glue slag, and forming a second copper deposition layer on the multi-layer board better due to the fact that the glue slag is removed firstly; then carrying out full-plate electroplating on the multilayer plate with the outer layer subjected to copper deposition so as to thicken the second copper deposition layer; and then carrying out one-time image electric operation on the multi-layer board after the full-board electroplating so as to carry out first copper adding treatment on the copper deposition layer of the multi-layer board.
In one embodiment, after the step of performing the outer layer copper deposition and the electromechanic operation on the multi-layer board after the desmear operation and before performing the pattern transfer operation on the multi-layer board after the electromechanic operation, the preparation method includes: firstly, carrying out resin hole plugging operation on the multi-layer board after the electricity-drawing operation so as to prevent chips generated by subsequent ceramic polishing from affecting the through holes; then ceramic polishing operation is carried out on the multilayer board after the resin hole plugging operation, so that the surface of the multilayer board is more uniform, and the problem of uneven copper thickness after polishing is better avoided; and then carrying out secondary outer copper deposition and secondary image electric operation on the ceramic polished multilayer board so as to carry out secondary copper adding treatment on the copper deposition layer of the multilayer board.
In one embodiment, the drilling and desmutting the multi-layer board comprises: firstly, drilling holes on the multi-layer plates respectively so that the inner core plates of the multi-layer plates can conduct electricity; and then, performing glue residue removing operation on the drilled multilayer board so as to remove residual glue on the surface of the multilayer board, residual foreign matters such as drilling scraps and the like.
In one embodiment, the step of removing the glue residue from the drilled multilayer board includes: firstly, performing plasma glue residue removal operation on the drilled multilayer board so as to perform a plasma cleaning function on the drilled multilayer board; and secondly, the PTH glue removing operation is carried out on the multilayer board after the glue residues are removed by the plasma, so that the neatness of the multilayer board is improved, and the problem that glue overflows from a gap of a buried copper block is difficult to remove is solved. Further, after the step of performing PTH desmutting operation on the multilayer board after plasma desmutting, the step of performing desmutting operation on the drilled multilayer board further includes: and (3) carrying out image acquisition on the multilayer board after the PTH glue removing operation, and polishing the multilayer board if the PTH glue removing operation is unqualified so as to better clean the residual glue on the surface of the multilayer board.
In one embodiment, the copper block is sequentially embedded into the core copper-embedded groove of the fourth inner core board, the core copper-embedded groove of the third inner core board, the PP copper-embedded groove of the third PP layer, and the PP copper-embedded groove of the second PP layer, so that before the step S107 of forming the to-be-pressed piece, the preparation method further includes: firstly, sheathing the copper block, and pre-fixing the copper block on the sheathing so as to facilitate subsequent browning treatment; and then, the copper block after the sleeve plate is subjected to browning operation, so that the binding force of the copper block and the PP layer is improved. Further, before the step of sleeving the copper block, the preparation method further comprises the following steps: and carrying out sand paper polishing treatment on the copper block to increase the coarsening effect of the surface of the copper block, so as to well deposit copper on the surface of the copper block and reduce the cracking situation of the deposited copper between the copper block area and the non-copper block area.
In one embodiment, the step of performing the pressing operation on the to-be-pressed member specifically includes: and adopting a preset pressing program to perform pressing treatment on the workpiece to be pressed so as to better press the workpiece to be pressed. In this embodiment, the preset pressing program includes a non-constant heating temperature stage for performing a pressing process on the workpiece to be pressed. Specifically, the non-constant heating temperature stage includes a temperature raising stage, a constant temperature stage, and a temperature lowering stage. The initial temperature of the heating stage is 130-150 ℃, and the final temperature of the heating stage is 220-230 ℃. The temperature of the constant temperature stage is 220-230 ℃. The initial temperature of the cooling stage is 220-230 ℃, and the final temperature of the cooling stage is 130-150 ℃, so that the pressing treatment is better carried out on the workpiece to be pressed, the situation that the plate warps due to overhigh temperature in the initial stage of pressing is avoided, and the situation that the PP layer curing process is slowed down and even overflows seriously due to continuous high temperature in the later stage of pressing is avoided.
Further, the time in the temperature rising stage is 16 min-20 min. The time in the constant temperature stage is 60 min-65 min. The time in the cooling stage is 90 min-120 min, so as to better press the workpiece to be pressed. In this embodiment, the pressure in the temperature increasing stage is 100pa to 200pa, and the pressure in the constant temperature stage and the temperature decreasing stage is 200pa to 380pa.
Further, the step of performing the pressing process on the to-be-pressed member by using a preset pressing program includes: carrying out lamination physical property test on the piece to be laminated, and checking whether cracking exists between the copper block and the PP of the test board; and then, carrying out batch lamination treatment on the to-be-laminated pieces, thereby improving the quality of the multilayer board. In this embodiment, the temperature for performing the lamination physical property test on the to-be-laminated member is 288 ℃, the number of times of the test is 3, and the duration of each test is 10s. As shown in fig. 2, further, the step of checking whether the copper block and PP have cracking is specifically: firstly, carrying out image acquisition on a test board to obtain image data of the test board; then, carrying out data processing on the image data; then calculating and obtaining a gap value between the copper block and the PP transition zone; if the numerical value of the gap between the copper block and the PP transition zone is larger than 8 mu m, judging that the copper block and the PP have cracking conditions, namely the glue filling part at the edge of the copper block groove is cracked or uneven. Further, after the step of determining that the copper block and the PP have cracking, the step of performing the pressing treatment on the to-be-pressed member by using the preset pressing program further includes: polishing the copper block and PP transition zone, and adding a sleeve plate to normally over-brown the copper block, so that the smoothness of the copper block and PP transition zone is good.
Further, the step of performing the line repairing operation on the multilayer board includes: firstly, silver adhesive supplementing operation is carried out at an open-circuit notch, so that a silver adhesive layer belt is formed at the open-circuit notch, and two ends of the silver adhesive layer belt are connected to the inner wall of the open-circuit notch; then baking the multi-layer board after silver glue supplementing to cure the silver glue layer; then brushing copper plating treatment is carried out on the silver adhesive layer belt, so that a copper plating layer is formed on the surface of the silver adhesive layer belt, the problem that open circuit gaps appear on a multilayer board is solved, meanwhile, a circuit has good high-voltage testing performance and thermal stress testing performance, the efficiency and the material cost of the traditional wire supplementing are kept, and the binding force between silver and copper and the original copper wire is increased; meanwhile, a layer of copper is coated on the silver, copper and the original copper wire, so that the ductility of the silver and copper wires is greatly improved, the toughness of the silver and copper wires is not smaller than that of the original pure copper wires, and the wire breakage phenomenon is avoided. The multilayer board increases the toughness and the binding force of the copper wires and improves the peeling strength, so that the circuit is not easy to damage, and the service life of the car lamp set is prolonged.
Further, the step of baking the multi-layer board after the silver supplementing glue comprises the following steps: firstly, carrying out primary baking operation on the multi-layer board after silver adhesive supplementing so as to pre-cure the silver adhesive layer tape; and secondly, carrying out secondary baking operation on the multilayer board after primary baking through an oven, so that the silver adhesive layer tape is reliably solidified at the open circuit notch. Furthermore, the temperature of the first baking operation is 98-105 ℃ and the baking time is 4-10 min, so that the silver adhesive tape has a better pre-curing effect. Furthermore, the temperature of the secondary baking operation is 140-160 ℃ and the baking time is 35-48 min, so that the silver adhesive tape has a better curing effect.
Furthermore, the first baking operation is carried out on the multi-layer board after the silver paste is added by a hot air baking mode, so that the pre-curing baking is carried out on the multi-layer board after the silver paste is added well. Specifically, the hot air gun is adopted to carry out primary baking operation on the multilayer board after silver adhesive supplementing in a hot air baking mode, so that the silver adhesive layer has a good pre-curing effect, and meanwhile, the steps of the pre-curing baking operation are simpler.
Further, after the step of baking the multi-layer board after the silver paste is added, and before the step of brushing copper plating the silver paste layer, the step of baking the multi-layer board after the silver paste is added further includes: and the multilayer board after the silver adhesive is supplemented is trimmed to remove the redundant silver adhesive layer, so that the silver adhesive layer is smoother and more attractive, and the operation is simple. For example, a pencil knife or a maintenance pencil is used for trimming the multi-layer board after silver paste compensation.
Further, after the step of brushing copper plating treatment on the silver colloid layer, the step of baking the multi-layer board after silver colloid supplementing further comprises the following steps: the silver adhesive layer belt is brushed and sandblasted, so that the binding force of silver, copper and the original copper wire is increased. In this example, the speed of the brush blasting treatment was 1.5m/min to 3m/min. Specifically, the speed of the brush-and-sand blasting treatment was 2m/min. Further, the blasting pressure of the brush blasting treatment was 1.2kg/cm 2～ 2.2kg/cm 2 The silver adhesive layer belt has better binding force after being brushed and sandblasted.
The application also provides a car light copper-clad plate, which is prepared by adopting the preparation method of the car light copper-clad plate in any embodiment.
The application also provides a new energy automobile, including foretell car light copper-clad plate.
Compared with the prior art, the application has at least the following advantages:
1. the preparation method of the car light copper-embedded plate comprises the steps of firstly, manufacturing a first inner core plate; then, manufacturing a second inner core plate, wherein the second inner core plate is provided with a core plate copper-embedded groove; then carrying out hot melting pre-stacking operation on the first inner core plate, the first PP layer, the second inner core plate, the second PP layer, the third PP layer and the second inner core plate; sequentially embedding copper blocks into a core board copper embedding groove of the second inner core board, a PP copper embedding groove of the third PP layer and a PP copper embedding groove of the second PP layer to form a piece to be pressed; then, the piece to be pressed is pressed, so that the first inner core board is fixedly adhered to the second inner core board through the first PP layer, and simultaneously, the copper block is fixedly connected with the second inner core board through the third PP layer and the second PP layer respectively in an adhering manner, so as to form a multi-layer board; then, carrying out pattern transfer operation on the multilayer board to enable the width of the outer layer circuit to be compensated to the preset circuit width, and reducing the spacing of the outer layer circuit to the preset circuit spacing; then carrying out AOI test on the etched multi-layer board, and if an open circuit notch appears on the multi-layer board, carrying out wire supplementing operation on the multi-layer board; finally, performing solder resist operation on the multilayer board;
2. the preparation method does not need to use expensive repair welding machines, gold wires/tin copper wires and other tools, reduces the manufacturing cost, improves the production efficiency, improves the quality and the reliability of products, and reduces the rejection rate of the products.
The above examples merely represent a few embodiments of the present application, which are described in more detail and are not to be construed as limiting the scope of the invention. It should be noted that it would be apparent to those skilled in the art that various modifications and improvements could be made without departing from the spirit of the present application, which would be within the scope of the present application. Accordingly, the scope of protection of the present application is to be determined by the claims appended hereto.
Claims (10)
1. The preparation method of the car light copper-clad plate is characterized by comprising the following steps of:
manufacturing a first inner core plate;
manufacturing a second inner core plate, wherein a core plate copper-embedded groove is formed in the second inner core plate;
carrying out hot melting prestack operation on the first inner core plate, the first PP layer, the second PP layer, the third PP layer and the second inner core plate;
sequentially embedding copper blocks into the core board copper embedding groove of the second inner core board, the PP copper embedding groove of the third PP layer and the PP copper embedding groove of the second PP layer to form a piece to be pressed;
performing pressing operation on the piece to be pressed to form a multi-layer board;
performing pattern transfer and outer layer etching operation on the multilayer board to compensate the width of outer layer lines to a preset line width, wherein the distance between the outer layer lines is reduced to a preset line distance;
carrying out AOI test on the etched multi-layer board, and if an open-circuit notch appears on the multi-layer board, carrying out line supplementing operation on the multi-layer board;
and performing a solder resist operation on the multilayer board.
2. The method of manufacturing a copper-clad laminate for automotive lamps according to claim 1, wherein said step of manufacturing a second inner core plate comprises:
providing a second material plate;
carrying out image electric thickening treatment on the second material plate so as to form a second copper deposition layer on the surface of the second material plate;
developing and etching the second copper deposition layer to obtain a second inner core plate semi-finished product;
and (3) routing the developed and etched second inner core plate semi-finished product to form the core plate copper-embedded groove.
3. The method for manufacturing a copper-clad laminate for automotive lamp according to claim 1, characterized in that after the step of pressing the member to be pressed and before the step of pattern transferring and outer layer etching the multilayered board after the electromechanic operation, the method further comprises:
drilling holes and removing glue residues on the multilayer board respectively;
and carrying out outer copper deposition and electricity drawing operation on the multi-layer board after removing the glue slag.
4. The method for manufacturing a copper-clad laminate for a vehicle lamp according to claim 3, wherein after the step of performing the outer layer copper deposition and patterning operation on the multilayer board after the desmutting and before performing the pattern transfer operation on the multilayer board after the patterning operation, the method for manufacturing a copper-clad laminate for a vehicle lamp comprises:
carrying out resin plugging operation on the multi-layer board after the electricity-drawing operation;
performing ceramic polishing operation on the multilayer board after the resin hole plugging operation;
and carrying out secondary outer copper deposition and secondary image electric operation on the ceramic polished multilayer plate.
5. The method for manufacturing a copper-clad laminate for a vehicle lamp according to claim 3, wherein the drilling and desmutting operations for the multilayer board respectively comprise:
drilling the multilayer board respectively;
and performing glue residue removing operation on the drilled multilayer plate.
6. The method for manufacturing a copper-clad laminate for automotive lamp according to claim 5, wherein the step of removing the desmear operation of the drilled multilayer board comprises:
carrying out plasma glue residue removing operation on the drilled multilayer board;
and performing PTH photoresist removing operation on the multilayer board after the plasma photoresist residues are removed.
7. The method for manufacturing a copper-clad laminate for automotive lamp according to claim 1, wherein, before the step of sequentially inserting copper blocks into the core copper-clad groove of the second inner core, the PP copper-clad groove of the third PP layer, and the PP copper-clad groove of the second PP layer, the method for manufacturing a copper-clad laminate for automotive lamp further comprises:
sleeving the copper block with a plate;
and carrying out browning operation on the copper block after the sheathing.
8. The method for manufacturing a copper-clad laminate for automotive lamp according to claim 1, wherein the step of pressing the member to be pressed comprises:
and performing lamination treatment on the to-be-laminated piece by adopting a preset lamination program.
9. A car light copper-clad laminate characterized by being prepared by the method for preparing a car light copper-clad laminate according to any one of claims 1 to 8.
10. A new energy automobile, characterized by comprising the car light copper-clad plate according to claim 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311514615.1A CN117479452A (en) | 2023-11-14 | 2023-11-14 | New energy automobile, car lamp copper-embedded plate and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311514615.1A CN117479452A (en) | 2023-11-14 | 2023-11-14 | New energy automobile, car lamp copper-embedded plate and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117479452A true CN117479452A (en) | 2024-01-30 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311514615.1A Pending CN117479452A (en) | 2023-11-14 | 2023-11-14 | New energy automobile, car lamp copper-embedded plate and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117479452A (en) |
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2023
- 2023-11-14 CN CN202311514615.1A patent/CN117479452A/en active Pending
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