CN115058749A - Electroplating processing method with high thickness-diameter ratio - Google Patents
Electroplating processing method with high thickness-diameter ratio Download PDFInfo
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- CN115058749A CN115058749A CN202111583276.3A CN202111583276A CN115058749A CN 115058749 A CN115058749 A CN 115058749A CN 202111583276 A CN202111583276 A CN 202111583276A CN 115058749 A CN115058749 A CN 115058749A
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- copper
- pcb
- electroplating
- plating
- thickness
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- 238000009713 electroplating Methods 0.000 title claims abstract description 46
- 238000003672 processing method Methods 0.000 title claims abstract description 14
- 229910052802 copper Inorganic materials 0.000 claims abstract description 79
- 239000010949 copper Substances 0.000 claims abstract description 79
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 75
- 238000007747 plating Methods 0.000 claims abstract description 54
- 239000010410 layer Substances 0.000 claims abstract description 30
- 238000000034 method Methods 0.000 claims abstract description 26
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 21
- 238000005553 drilling Methods 0.000 claims abstract description 10
- 230000008569 process Effects 0.000 claims abstract description 10
- 238000004140 cleaning Methods 0.000 claims abstract description 9
- 230000002378 acidificating effect Effects 0.000 claims abstract description 6
- 239000011229 interlayer Substances 0.000 claims abstract description 5
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 48
- 239000002253 acid Substances 0.000 claims description 38
- 239000000654 additive Substances 0.000 claims description 26
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 20
- 238000002386 leaching Methods 0.000 claims description 18
- 238000005237 degreasing agent Methods 0.000 claims description 16
- 239000013527 degreasing agent Substances 0.000 claims description 16
- 238000005554 pickling Methods 0.000 claims description 10
- 239000003112 inhibitor Substances 0.000 claims description 9
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 claims description 8
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims description 8
- 230000000996 additive effect Effects 0.000 claims description 8
- 229910001431 copper ion Inorganic materials 0.000 claims description 8
- 229910000365 copper sulfate Inorganic materials 0.000 claims description 8
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 claims description 8
- 238000002425 crystallisation Methods 0.000 claims description 8
- 230000008025 crystallization Effects 0.000 claims description 8
- LCPVQAHEFVXVKT-UHFFFAOYSA-N 2-(2,4-difluorophenoxy)pyridin-3-amine Chemical compound NC1=CC=CN=C1OC1=CC=C(F)C=C1F LCPVQAHEFVXVKT-UHFFFAOYSA-N 0.000 claims description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical class [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 4
- 230000004913 activation Effects 0.000 claims description 4
- 230000002411 adverse Effects 0.000 claims description 4
- 239000003513 alkali Substances 0.000 claims description 4
- 230000008021 deposition Effects 0.000 claims description 4
- 238000009826 distribution Methods 0.000 claims description 4
- 230000000694 effects Effects 0.000 claims description 4
- 238000005530 etching Methods 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 238000001556 precipitation Methods 0.000 claims description 4
- 230000009467 reduction Effects 0.000 claims description 4
- 238000002791 soaking Methods 0.000 claims description 4
- CHQMHPLRPQMAMX-UHFFFAOYSA-L sodium persulfate Substances [Na+].[Na+].[O-]S(=O)(=O)OOS([O-])(=O)=O CHQMHPLRPQMAMX-UHFFFAOYSA-L 0.000 claims description 4
- 238000005406 washing Methods 0.000 claims description 4
- 230000003647 oxidation Effects 0.000 claims 1
- 238000007254 oxidation reaction Methods 0.000 claims 1
- 230000007547 defect Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
- H05K3/424—Plated through-holes or plated via connections characterised by electroplating method by direct electroplating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
Abstract
The invention discloses an electroplating processing method with high thickness-diameter ratio, which comprises the following steps of S1: drilling holes, namely drilling holes meeting requirements for the PCB through the perforating machine to realize interlayer conduction; s2: cleaning, hanging, clamping a PCB to be processed on a VCP electroplating clamp, clamping the top end of the PCB by the clamp to drive the PCB to move, removing oil, removing oxide on a copper surface of a circuit and residual ink film by using an acidic oil removing agent, ensuring the binding force between primary copper and pattern electroplating copper, and controlling the concentration and processing time of the acidic oil removing agent during processing. The electroplating processing method of the high thickness-diameter ratio optimizes and changes the processing method, adopts a twice electroplating method, firstly adopts normal current plus VCP to clamp the top of the circuit board for processing, secondly overturns the circuit board for adjusting the clamping position, and enables the bottom of the VCP to process, so that the copper thickness of the upper and lower plating layers and the thickness of the plating layer in the hole are uniform, thereby achieving the required copper layer thickness.
Description
Technical Field
The invention relates to the technical field of PCB (printed circuit board) electroplating, in particular to an electroplating processing method with high thickness-diameter ratio.
Background
The printed circuit board is an important electronic component and also is a support body of an electronic component, and is manufactured by adopting an electronic printing technology, most of the prior art carries out the production of the printed circuit board through a production line, electroplating is an indispensable procedure in the production flow, the thickness of hole copper and surface copper is increased through an electroplating procedure, and the corrosion resistance and the conductivity of the printed circuit board are improved, but the existing electroplating processing method has certain defects, such as the defect;
in the existing electroplating processing, when a PCB with a high thickness-diameter ratio is processed, the existing traditional copper plating mode is difficult to meet the plating thickness of a hole center area, the traditional method generally adopts a small current and a hole plating agent, but the hole center area is difficult to reach the required plating thickness when the aperture is 0.2MM and the plate thickness is 3.0 or more, so certain defects exist.
In order to solve the above problems, innovative design based on the original electroplating processing method is urgently needed.
Disclosure of Invention
The invention aims to provide an electroplating processing method with a high thickness-diameter ratio, which solves the problem that the traditional copper plating method is difficult to meet the coating thickness of a hole central area when a PCB with a high thickness-diameter ratio is processed in the traditional electroplating processing proposed in the background technology, and the traditional copper plating method generally adopts a small current and a hole plating agent, but the hole central area is difficult to reach the required coating thickness when the hole diameter is 0.2MM and the plate thickness is 3.0 or more, so that certain defects exist.
In order to achieve the purpose, the invention provides the following technical scheme: a high thickness-diameter ratio electroplating processing method comprises the following steps:
s1: drilling holes
Drilling holes meeting the requirements for the PCB through the perforating machine to realize interlayer conduction;
s2: cleaning
a. Upper hanger
Clamping a PCB to be processed on a VCP electroplating clamp, wherein the clamp clamps the top end of the PCB to drive the PCB to move;
b. oil removal
The acid degreasing agent is used for removing oxides on the copper surface of the circuit and residual ink of the residual film, so that the binding force between primary copper and pattern copper electroplating is ensured, the concentration and the processing time of the acid degreasing agent are controlled during processing, adverse effects caused by overlong time are avoided, and the pattern circuit can be prevented from being damaged by using the acid degreasing agent because the pattern ink is not alkali-resistant;
c. washing with water
Moving the PCB to a clean water tank for rinsing;
s2: pickling
Performing acid leaching on the PCB, wherein the main purpose is to remove the oxide on the board surface and activate the board surface, the acid leaching time is not too long, and the board surface is prevented from being oxidized;
s3: full plate electro-coppering
The well drilled hole wall has no metal and can not be conducted, in order to realize the conduction between the circuit layers, a layer of compact copper is plated on the hole wall by utilizing the electrochemical principle through a copper plating process, the conduction of the circuit between the layers is completed, the bath solution adopts a high-acid low-copper formula, the uniformity of the thickness distribution of the board surface and the deep plating capacity of the deep hole during electroplating are ensured, and an additive is put into the bath solution;
s4: micro etching
Cleaning the roughened circuit copper surface by using a microetching agent, and increasing the binding force between the pattern electroplated copper and the primary copper;
s5: pickling
Performing acid leaching on the PCB, wherein the main purpose is to remove oxides on the board surface and activate the board surface, 5-10% sulfuric acid solution is adopted as acid solution, so that unstable sulfuric acid content of bath solution caused by water brought in is prevented, the acid leaching time is not too long, and the board surface is prevented from being oxidized;
s6: pattern copper electroplating
In order to meet rated current load of each line, each line and hole copper need to reach a certain thickness, the purpose of copper plating of the line is to thicken the hole copper and the line copper to a certain thickness in time, the clamping position of a PCB is adjusted, the PVB plate is clamped again after being overturned, electroplating is carried out again, the operation method is the same as that in the step 3, the consistency and the uniformity of the thickness of upper and lower plating layers and the thickness of a plating layer in the hole can be ensured, meanwhile, an additive is put into a bath solution, a water quality analyzer is regularly used for detecting the pollution degree of the bath solution, and when the bath solution is seriously polluted, activated carbon powder can be added for treatment.
Preferably, in the step 1, the concentration of the acidic degreasing agent is controlled to be about 10%, and the soaking time of the PVB sheet is maintained to be about 6 minutes.
Preferably, 5% -10% of sulfuric acid solution is adopted in the pickling tank liquor in the step 2, so that unstable sulfuric acid content of the tank liquor caused by water brought in is prevented.
Preferably, the bath solution in the step 3 mainly comprises copper sulfate, sulfuric acid, chloride ions and additives, the content of the sulfuric acid is controlled to be 180g/L-240g/L, the main functions of the bath solution are to improve the conductivity of the bath solution and improve the uniformity of through hole electroplating, the content of the copper sulfate is generally 75g/L, the main functions of the bath solution are to provide copper ions required by electroplating and improve the conductivity, and the chloride ions mainly help the anode to dissolve and help to improve the precipitation and crystallization of copper.
Preferably, in the step 3, the additives are mainly a gloss agent and an inhibitor, the additives are used for improving the uniform plating and deep plating performances and improving the crystallization fineness of the plating layer, the concentration of the gloss agent is 1-3mg/L, the additives are used for reducing the activation energy during the reduction of copper ions and increasing the deposition rate of copper, and the concentration of the inhibitor is 20-40mg/L, and the additives are used for improving the uniformity of the plate surface.
Preferably, sodium persulfate is adopted as the microetching agent in the step 4, the coarsening rate is stable and uniform, the concentration is controlled to be 60g/L, and the time is controlled to be about 20 seconds.
Compared with the prior art, the invention has the beneficial effects that:
1. the electroplating processing method of the high thickness-diameter ratio optimizes and changes the processing method, adopts a twice electroplating method, firstly adopts normal current and VCP to clamp the top of the circuit board for processing, and secondly overturns the circuit board for adjusting the clamping position, so that the bottom of the VCP clamp circuit board is processed, the copper thickness of the upper and lower plating layers and the thickness of the plating layer in the hole are uniform, and the required copper layer thickness is achieved.
Detailed Description
The technical solutions in the embodiments of the present invention are clearly and completely described, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The invention provides a technical scheme that: a high thickness-diameter ratio electroplating processing method comprises the following steps:
example one
S1: drilling holes
Drilling holes meeting the requirements for the PCB through the perforating machine to realize interlayer conduction;
s2: cleaning of
a. Upper hanger
Clamping a PCB to be processed on a VCP electroplating clamp, wherein the clamp clamps the top end of the PCB to drive the PCB to move;
b. oil removal
The acid degreasing agent is used for removing oxides on the copper surface of the circuit and residual ink of the residual film, so that the binding force between primary copper and pattern copper electroplating is ensured, the concentration and the processing time of the acid degreasing agent are controlled during processing, adverse effects caused by overlong time are avoided, and the pattern circuit can be prevented from being damaged by using the acid degreasing agent because the pattern ink is not alkali-resistant;
c. washing with water
Moving the PCB to a clean water tank for rinsing;
s2: pickling
Performing acid leaching on the PCB, wherein the main purpose is to remove the oxide on the board surface and activate the board surface, the acid leaching time is not too long, and the board surface is prevented from being oxidized;
s3: electrolytic copper plating
The well drilled hole wall has no metal and can not be conducted, in order to realize the conduction between the circuit layers, a layer of compact copper is plated on the hole wall by utilizing the electrochemical principle through a copper plating process, the conduction of the circuit between the layers is completed, the bath solution adopts a high-acid low-copper formula, the uniformity of the thickness distribution of the board surface and the deep plating capacity of the deep hole during electroplating are ensured, and an additive is put into the bath solution;
s4: micro etching
Cleaning the roughened circuit copper surface by using a microetching agent, and increasing the binding force between the pattern electroplated copper and the primary copper;
s5: pickling
Performing acid leaching on the PCB, wherein the main purpose is to remove oxides on the board surface and activate the board surface, 5-10% sulfuric acid solution is adopted as acid solution, so that unstable sulfuric acid content of bath solution caused by water brought in is prevented, the acid leaching time is not too long, and the board surface is prevented from being oxidized;
s6: electrolytic copper plating
In order to meet rated current load of each line, each line and hole copper need to reach a certain thickness, the purpose of copper plating of the line is to thicken the hole copper and the line copper to a certain thickness in time, the clamping position of a PCB is adjusted, the PVB plate is clamped again after being overturned, electroplating is carried out again, the operation method is the same as that in the step 3, the consistency and the uniformity of the thickness of upper and lower plating layers and the thickness of a plating layer in the hole can be ensured, meanwhile, an additive is put into a bath solution, a water quality analyzer is regularly used for detecting the pollution degree of the bath solution, and when the bath solution is seriously polluted, activated carbon powder can be added for treatment.
In the step 1, the concentration of the acidic degreasing agent is controlled to be about 10%, and the soaking time of the PVB plate is maintained to be about 6 minutes.
In the step 2, the acid leaching tank liquor adopts a 5% sulfuric acid solution, so that the unstable sulfuric acid content of the tank liquor caused by the introduction of water is prevented.
In the step 3, the bath solution mainly comprises copper sulfate, sulfuric acid, chloride ions and additives, the content of the sulfuric acid is controlled to be 180g/L, the main functions of the bath solution are to improve the conductivity of the bath solution and improve the electroplating uniformity of through holes, the content of the copper sulfate is generally 75g/L, the main functions of the bath solution are to provide copper ions required by electroplating and improve the conductivity, and the chloride ions mainly help the anode to dissolve and help to improve the precipitation and crystallization of copper.
In the step 3, the additives are mainly a gloss agent and an inhibitor, the additives are used for improving the uniform plating and deep plating performances and improving the crystallization compactness of the plating layer, the concentration of the gloss agent is 1, the additives are used for reducing the activation energy during the reduction of copper ions and increasing the deposition rate of copper, and the concentration of the inhibitor is 20, and the additives are used for improving the uniformity of the plate surface.
In the step 4, the microetching agent adopts sodium persulfate, the coarsening rate is stable and uniform, the concentration is controlled to be 60g/L, and the time is controlled to be about 20 seconds.
Example two
S1: drilling holes
Drilling holes meeting the requirements for the PCB through the perforating machine to realize interlayer conduction;
s2: cleaning of
a. Upper hanger
Clamping a PCB to be processed on a VCP electroplating clamp, wherein the clamp clamps the top end of the PCB to drive the PCB to move;
b. oil removal
The acid degreasing agent is used for removing oxides on the copper surface of the circuit and residual ink of the residual film, so that the binding force between primary copper and pattern copper electroplating is ensured, the concentration and the processing time of the acid degreasing agent are controlled during processing, adverse effects caused by overlong time are avoided, and the pattern circuit can be prevented from being damaged by using the acid degreasing agent because the pattern ink is not alkali-resistant;
c. washing with water
Moving the PCB to a clean water tank for rinsing;
s2: pickling
Performing acid leaching on the PCB, wherein the main purpose is to remove the oxide on the board surface and activate the board surface, the acid leaching time is not too long, and the board surface is prevented from being oxidized;
s3: electrolytic copper plating
The well drilled hole wall has no metal and can not be conducted, in order to realize the conduction between the circuit layers, a layer of compact copper is plated on the hole wall by utilizing the electrochemical principle through a copper plating process, the conduction of the circuit between the layers is completed, the bath solution adopts a high-acid low-copper formula, the uniformity of the thickness distribution of the board surface and the deep plating capacity of the deep hole during electroplating are ensured, and an additive is put into the bath solution;
s4: micro etching
Cleaning the roughened circuit copper surface by using a microetching agent, and increasing the binding force between the pattern electroplated copper and the primary copper;
s5: pickling
Performing acid leaching on the PCB, wherein the main purpose is to remove oxides on the board surface and activate the board surface, 5-10% sulfuric acid solution is adopted as acid solution, so that unstable sulfuric acid content of bath solution caused by water brought in is prevented, the acid leaching time is not too long, and the board surface is prevented from being oxidized;
s6: electrolytic copper plating
In order to meet rated current load of each line, each line and hole copper need to reach a certain thickness, the purpose of copper plating of the line is to thicken the hole copper and the line copper to a certain thickness in time, the clamping position of a PCB is adjusted, the PVB plate is clamped again after being overturned, electroplating is carried out again, the operation method is the same as that in the step 3, the consistency and the uniformity of the thickness of upper and lower plating layers and the thickness of a plating layer in the hole can be ensured, meanwhile, an additive is put into a bath solution, a water quality analyzer is regularly used for detecting the pollution degree of the bath solution, and when the bath solution is seriously polluted, activated carbon powder can be added for treatment.
In the step 1, the concentration of the acidic degreasing agent is controlled to be about 10%, and the soaking time of the PVB plate is maintained to be about 6 minutes.
In the step 2, the pickling bath solution adopts a 10% sulfuric acid solution, so that the unstable sulfuric acid content of the bath solution caused by the introduction of water is prevented.
In the step 3, the bath solution mainly comprises copper sulfate, sulfuric acid, chloride ions and additives, the content of the sulfuric acid is controlled to be 240g/L, the main functions of the bath solution are to improve the conductivity of the bath solution and improve the electroplating uniformity of through holes, the content of the copper sulfate is generally 75g/L, the main functions of the bath solution are to provide copper ions required by electroplating and improve the conductivity, and the chloride ions mainly help the anode to dissolve and help to improve the precipitation and crystallization of copper.
In the step 3, the additives are mainly a gloss agent and an inhibitor, the additives are used for improving the uniform plating and deep plating performances and improving the crystallization compactness of the plating layer, the concentration of the gloss agent is 3mg/L, the concentration of the gloss agent is used for reducing the activation energy during reduction of copper ions and increasing the deposition rate of copper, and the concentration of the inhibitor is 40mg/L, and the concentration of the inhibitor is used for improving the uniformity of the plate surface.
In the step 4, the microetching agent adopts sodium persulfate, the coarsening rate is stable and uniform, the concentration is controlled to be 60g/L, and the time is controlled to be about 20 seconds.
The overall practicability is increased.
Those not described in detail in this specification are within the skill of the art to which the invention pertains.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The electroplating processing method with high thickness-diameter ratio is characterized by comprising the following steps:
s1: drilling holes
Drilling holes meeting the requirements for the PCB through the perforating machine to realize interlayer conduction;
s2: cleaning of
a. Upper hanger
Clamping a PCB to be processed on a VCP electroplating clamp, wherein the clamp clamps the top end of the PCB to drive the PCB to move;
b. oil removal
The acid degreasing agent is used for removing oxides on the copper surface of the circuit and residual ink of the residual film, so that the binding force between primary copper and pattern copper electroplating is ensured, the concentration and the processing time of the acid degreasing agent are controlled during processing, adverse effects caused by overlong time are avoided, and the pattern circuit can be prevented from being damaged by using the acid degreasing agent because the pattern ink is not alkali-resistant;
c. washing with water
Moving the PCB to a clean water tank for rinsing;
s2: pickling
Performing acid leaching on the PCB, wherein the main purpose is to remove the oxide on the board surface and activate the board surface, the acid leaching time is not too long, and the board surface is prevented from being oxidized;
s3: electrolytic copper plating
The drilled hole wall is not provided with metal and can not be conducted, in order to realize the conduction between the circuit layers, a layer of compact copper is plated on the hole wall by using an electrochemical principle through a copper plating process, the conduction of the circuit between the layers is completed, the bath solution adopts a high-acid low-copper formula, the uniformity of the thickness distribution of the board surface and the deep plating capability of the deep hole during electroplating are ensured, and an additive is put into the bath solution;
s4: micro etching
Cleaning the roughened circuit copper surface by using a microetching agent, and increasing the binding force between the pattern electroplated copper and the primary copper;
s5: pickling
Performing acid leaching on the PCB, wherein the main purpose is to remove oxides on the PCB and activate the PCB, 5-10% sulfuric acid solution is adopted as acid solution to prevent water from being brought into a tank liquor to cause unstable sulfuric acid content, the acid leaching time is not long enough, and the oxidation of the PCB is prevented;
s6: electrolytic copper plating
In order to meet rated current load of each line, each line and hole copper need to reach a certain thickness, the purpose of copper plating of the line is to thicken the hole copper and the line copper to a certain thickness in time, the clamping position of a PCB is adjusted, the PVB plate is clamped again after being overturned, electroplating is carried out again, the operation method is the same as that in the step 3, the consistency and the uniformity of the thickness of upper and lower plating layers and the thickness of a plating layer in the hole can be ensured, meanwhile, an additive is put into a bath solution, a water quality analyzer is regularly used for detecting the pollution degree of the bath solution, and when the bath solution is seriously polluted, activated carbon powder can be added for treatment.
2. A plating process method with a high aspect ratio according to claim 1, characterized in that: in the step 1, the concentration of the acidic degreasing agent is controlled to be about 10%, and the soaking time of the PVB plate is maintained to be about 6 minutes.
3. A plating process method with a high aspect ratio according to claim 1, characterized in that: in the step 2, the acid leaching tank liquor adopts 5-10% of sulfuric acid solution, so that the unstable sulfuric acid content of the tank liquor caused by water brought in is prevented.
4. A plating process method with a high aspect ratio according to claim 1, characterized in that: the bath solution in the step 3 mainly comprises copper sulfate, sulfuric acid, chloride ions and additives, wherein the sulfuric acid content is controlled to be 180-240 g/L, the main function of the bath solution is to improve the conductivity of the bath solution and improve the uniformity of through hole electroplating, the copper sulfate content is generally 75g/L, the main function of the bath solution is to provide copper ions required by electroplating and improve the conductivity, and the chloride ions mainly help the anode to dissolve and help to improve the precipitation and crystallization of copper.
5. A plating process method with a high aspect ratio according to claim 1, wherein: and in the step 3, the additives are mainly a gloss agent and an inhibitor, the additives are used for improving the uniform plating and deep plating performances and improving the crystallization fineness of the plating layer, the concentration of the gloss agent is 1-3mg/L, the additives are used for reducing the activation energy during copper ion reduction and increasing the deposition rate of copper, and the concentration of the inhibitor is 20-40mg/L, and the additives are used for improving the uniformity of the plate surface.
6. A plating process method with a high aspect ratio according to claim 1, characterized in that: in the step 4, the microetching agent adopts sodium persulfate, the coarsening rate is stable and uniform, the concentration is controlled to be 60g/L, and the time is controlled to be about 20 seconds.
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| CN103228112A (en) * | 2013-04-03 | 2013-07-31 | 深圳崇达多层线路板有限公司 | Electroless copper plating method for PCBs (printed circuit boards) with high aspect ratios |
| KR20150078927A (en) * | 2013-12-31 | 2015-07-08 | 주식회사 디에이피 | Method for copper-platting of PCB pannel |
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| WO2021164203A1 (en) * | 2020-02-17 | 2021-08-26 | 广东科翔电子科技股份有限公司 | Preparation method for high-precision communication optical module printed circuit board |
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| CN103228112A (en) * | 2013-04-03 | 2013-07-31 | 深圳崇达多层线路板有限公司 | Electroless copper plating method for PCBs (printed circuit boards) with high aspect ratios |
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