CN111343796A - Electroplating method of multilayer circuit board - Google Patents
Electroplating method of multilayer circuit board Download PDFInfo
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- CN111343796A CN111343796A CN202010282316.XA CN202010282316A CN111343796A CN 111343796 A CN111343796 A CN 111343796A CN 202010282316 A CN202010282316 A CN 202010282316A CN 111343796 A CN111343796 A CN 111343796A
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- copper
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- circuit board
- plating
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- 238000009713 electroplating Methods 0.000 title claims abstract description 80
- 238000000034 method Methods 0.000 title claims abstract description 23
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 97
- 229910052802 copper Inorganic materials 0.000 claims abstract description 97
- 239000010949 copper Substances 0.000 claims abstract description 97
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 76
- 238000005406 washing Methods 0.000 claims abstract description 51
- 238000007747 plating Methods 0.000 claims abstract description 40
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 38
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 32
- 229910052737 gold Inorganic materials 0.000 claims abstract description 32
- 239000010931 gold Substances 0.000 claims abstract description 32
- 239000002253 acid Substances 0.000 claims abstract description 28
- 238000005554 pickling Methods 0.000 claims abstract description 26
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 12
- 238000005530 etching Methods 0.000 claims abstract description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 10
- 238000004064 recycling Methods 0.000 claims abstract description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 30
- 239000003795 chemical substances by application Substances 0.000 claims description 12
- 238000005238 degreasing Methods 0.000 claims description 11
- 230000002378 acidificating effect Effects 0.000 claims description 9
- 238000002386 leaching Methods 0.000 claims description 8
- LCPVQAHEFVXVKT-UHFFFAOYSA-N 2-(2,4-difluorophenoxy)pyridin-3-amine Chemical group NC1=CC=CN=C1OC1=CC=C(F)C=C1F LCPVQAHEFVXVKT-UHFFFAOYSA-N 0.000 claims description 6
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 claims description 6
- 239000000654 additive Substances 0.000 claims description 6
- 230000000996 additive effect Effects 0.000 claims description 6
- 238000001816 cooling Methods 0.000 claims description 6
- 229910000365 copper sulfate Inorganic materials 0.000 claims description 6
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 claims description 6
- 238000011084 recovery Methods 0.000 claims description 6
- CHQMHPLRPQMAMX-UHFFFAOYSA-L sodium persulfate Substances [Na+].[Na+].[O-]S(=O)(=O)OOS([O-])(=O)=O CHQMHPLRPQMAMX-UHFFFAOYSA-L 0.000 claims description 6
- RCIVOBGSMSSVTR-UHFFFAOYSA-L stannous sulfate Chemical compound [SnH2+2].[O-]S([O-])(=O)=O RCIVOBGSMSSVTR-UHFFFAOYSA-L 0.000 claims description 6
- 229910000375 tin(II) sulfate Inorganic materials 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 238000004140 cleaning Methods 0.000 claims description 3
- 239000013256 coordination polymer Substances 0.000 claims description 3
- 238000005237 degreasing agent Methods 0.000 claims description 3
- 239000013527 degreasing agent Substances 0.000 claims description 3
- 238000001035 drying Methods 0.000 claims description 3
- 230000000694 effects Effects 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- 239000007788 liquid Substances 0.000 claims description 3
- 230000003287 optical effect Effects 0.000 claims description 3
- 239000002994 raw material Substances 0.000 claims description 3
- 238000005303 weighing Methods 0.000 claims description 3
- 230000007797 corrosion Effects 0.000 abstract description 8
- 238000005260 corrosion Methods 0.000 abstract description 8
- 230000003647 oxidation Effects 0.000 abstract description 7
- 238000007254 oxidation reaction Methods 0.000 abstract description 7
- 230000004888 barrier function Effects 0.000 abstract description 5
- 238000009792 diffusion process Methods 0.000 abstract description 3
- 239000002184 metal Substances 0.000 abstract description 3
- 229910052751 metal Inorganic materials 0.000 abstract description 3
- 230000037452 priming Effects 0.000 abstract description 3
- 239000000126 substance Substances 0.000 description 8
- 230000007547 defect Effects 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses a multilayer circuit board electroplating method, which comprises the following steps: primary pickling; electroplating copper on the whole plate; acid oil removal and three-stage countercurrent water washing; micro-etching and three-stage countercurrent water washing; secondary pickling; electroplating tin; pattern copper electroplating and three-stage countercurrent washing; nickel plating and three-stage countercurrent water washing; electroplating gold and recycling water for washing; three-stage countercurrent washing and electroplating post-treatment. In the invention, the copper surface of the roughened circuit is effectively cleaned through micro-etching, and the binding force between the pattern electroplated copper and the whole board electroplated copper is ensured; protecting the circuit etching by electroplating tin as a metal corrosion resistant layer; the nickel plating is used as a barrier layer between the copper layer and the gold layer, so that the mutual diffusion of gold and copper is prevented, the weldability and the service life of the circuit board are influenced, and the mechanical strength of the gold layer is greatly increased by priming with the nickel layer; the circuit board produced by the electroplating method effectively improves the weldability, oxidation resistance, corrosion resistance, wear resistance, ductility and tensile strength of the circuit board.
Description
Technical Field
The invention relates to the technical field of circuit board electroplating, in particular to a multilayer circuit board electroplating method.
Background
With the rapid development of high functionality and miniaturization of electronic equipment, the requirements on production processes are higher and higher, and the technical changes of plate electroplating and pattern electroplating are also great; the circuit board produced by the existing electroplating method cannot give consideration to the weldability, oxidation resistance, corrosion resistance, wear resistance, ductility and tensile strength of the circuit board, so that the produced circuit board always has certain defects, and the service life of the circuit board is greatly reduced.
Disclosure of Invention
In view of the defects of the prior art, the technical problem to be solved by the invention is to provide a multilayer circuit board electroplating method, aiming at improving the weldability, oxidation resistance, corrosion resistance, wear resistance, ductility and tensile strength of the circuit board.
In order to achieve the above object, the present invention provides a method for electroplating a multilayer wiring board, comprising the steps of:
step S1, primary pickling: placing the circuit board in a sulfuric acid solution with the concentration of 6 percent for acid leaching; the 6% sulfuric acid used for acid leaching is CP grade sulfuric acid;
step S2, full-plate copper electroplating: placing the circuit board in a full-board copper electroplating bath solution for full-board copper electroplating; the main components of the whole-plate electrolytic copper plating bath solution comprise copper sulfate and sulfuric acid with the content of 180 g/L-240 g/L; the copper sulfate content is 75 g/L; trace chloride ions and copper optical agents are added into the whole-plate copper electroplating tank liquid; the addition amount of the copper polish is generally 3 ml/L-5 ml/L;
step S3, acid degreasing and three-stage countercurrent washing: placing the circuit board which is electroplated with copper on the whole board in an oil removal solution containing an acidic oil removal agent for acidic oil removal; after the acid degreasing is finished, performing three-stage countercurrent washing on the circuit board; the concentration of the acidic degreasing agent in the degreasing solution is maintained at about 10%; the acid oil removal time is 6 min;
step S4, microetching and three-stage countercurrent washing: placing the circuit board subjected to acid oil removal in a microetching agent for microetching; after the micro-etching is finished, carrying out three-stage countercurrent washing on the circuit board; the micro-etching agent is sodium persulfate solution, and the concentration of the sodium persulfate solution is controlled to be about 60 g/L; the microetching time is 20 s;
step S5, secondary pickling: pickling the raw materials at the same time;
step S6, electrotinning: placing the circuit board subjected to secondary pickling in an electrolytic tinning bath solution for electrolytic tinning; the electrolytic tinning bath solution mainly comprises stannous sulfate, sulfuric acid with the concentration of 10% and a tinning additive; the content of the stannous sulfate is controlled to be about 35 g/L;
step S7, pattern copper electroplating and three-stage countercurrent washing: placing the circuit board subjected to electrotinning in a pattern copper electroplating bath solution for pattern copper electroplating; after the pattern copper electroplating is finished, carrying out three-stage countercurrent washing on the circuit board; the main components of the pattern copper electroplating bath solution are the same as those of the full-board copper electroplating bath solution;
step S8, nickel plating and three-stage countercurrent washing: placing the circuit board subjected to pattern copper electroplating in a nickel cylinder for nickel electroplating; after nickel plating is finished, carrying out three-stage countercurrent washing on the circuit board; the nickel plating additive in the nickel cylinder is supplemented according to the method of kilo ampere hours or according to the actual plate production effect, the adding amount is 200 ml/KAH; the temperature of the nickel cylinder is maintained between 40 ℃ and 55 ℃;
step S9, gold electroplating and recycling water washing: placing the circuit board plated with nickel in a gold cylinder for gold electroplating; after the gold electroplating is finished, carrying out the recovery washing, wherein the recovery washing is pure washing; the water gold content in the gold cylinder is controlled to be about 1g/L, the PH value is about 4.5, the temperature is 35 ℃, and the current density is about 1 ASD;
step S10, three-stage countercurrent washing and electroplating post-treatment: carrying out three-stage countercurrent washing on the circuit board after the electrogilding is finished; and after the third-stage countercurrent washing is finished, carrying out electroplating post-treatment on the circuit board.
In the technical scheme, through acid leaching, oxides on the surface of the circuit board are effectively removed, and the surface of the circuit board is oxidized; chemical copper is thickened to a certain degree through full-plate copper electroplating, thin chemical copper which is just deposited is effectively protected, and the chemical copper is prevented from being etched by acid after chemical oxidation; through acid degreasing, oxide on the copper surface of the circuit and residual ink film are effectively removed, and the bonding force between the whole-plate electroplated copper and the pattern electroplated copper or the nickel plating is ensured; through the microetching, the copper surface of the roughened circuit is effectively cleaned, and the binding force between the pattern electroplated copper and the whole board electroplated copper is ensured; the surface of the circuit board contains a tin layer as a metal corrosion resistant layer by the electrolytic tinning to protect circuit etching; through the nickel plating, the surface of the circuit board contains a nickel layer which is mainly used as a barrier layer between a copper layer and a gold layer, so that the mutual diffusion of gold and copper is prevented, the weldability and the service life of the circuit board are prevented from being influenced, and the mechanical strength of the gold layer is greatly increased by priming with the nickel layer; the gold layer is contained on the surface of the circuit board through the gold electroplating, so that the solderability, oxidation resistance, corrosion resistance and wear resistance of the circuit board are effectively improved; the circuit board produced by the electroplating method effectively changes the physical properties of the plating layer, such as ductility and tensile strength.
In a specific embodiment, the time for the primary pickling and the secondary pickling is not too long, and the pickling time is 15 min; after a period of use, the acid liquor should be replaced in time when turbidity appears or the copper content is too high.
In a specific embodiment, the copper polish in step S2 and step S7 should be supplemented in time according to ka hr, and added according to 100-150 KAH; the chloride ions are supplemented by a measuring cup or a measuring cylinder which is added after the accurate weighing.
In one embodiment, the temperature of the copper cylinder used for containing the full-board copper electroplating bath in the step S2 and the temperature of the copper cylinder used for containing the pattern copper electroplating bath in the step S7 are both maintained at room temperature, and generally do not exceed 32 ℃; and the copper cylinder is additionally provided with a cooling temperature control system.
In one embodiment, the temperature of the tin cylinder for holding the bath solution in step S6 should be maintained at room temperature, and generally not more than 30 ℃; and the tin cylinder is additionally provided with a cooling temperature control system.
In a specific embodiment, the nickel cylinder in step S7 should be equipped with a heating temperature control system.
In a specific embodiment, the post-plating treatment in step S10 specifically includes pickling, drying, stripping a plating barrier layer, cleaning, stripping an exposed plating layer, and the like.
The invention has the beneficial effects that: in the invention, through acid leaching, oxide on the surface of the circuit board is effectively removed, and the surface of the circuit board is oxidized; chemical copper is thickened to a certain degree through full-plate copper electroplating, thin chemical copper which is just deposited is effectively protected, and the chemical copper is prevented from being etched by acid after chemical oxidation; through acid degreasing, oxide on the copper surface of the circuit and residual ink film are effectively removed, and the bonding force between the whole-plate electroplated copper and the pattern electroplated copper or the nickel plating is ensured; through the microetching, the copper surface of the roughened circuit is effectively cleaned, and the binding force between the pattern electroplated copper and the whole board electroplated copper is ensured; the surface of the circuit board contains a tin layer as a metal corrosion resistant layer by the electrolytic tinning to protect circuit etching; through the nickel plating, the surface of the circuit board contains a nickel layer which is mainly used as a barrier layer between a copper layer and a gold layer, so that the mutual diffusion of gold and copper is prevented, the weldability and the service life of the circuit board are prevented from being influenced, and the mechanical strength of the gold layer is greatly increased by priming with the nickel layer; the gold layer is contained on the surface of the circuit board through the gold electroplating, so that the solderability, oxidation resistance, corrosion resistance and wear resistance of the circuit board are effectively improved; the circuit board produced by the electroplating method effectively changes the physical properties of the plating layer, such as ductility and tensile strength.
Drawings
FIG. 1 is a block diagram of a process for electroplating a multilayer circuit board according to an embodiment of the present invention.
Detailed Description
The invention is further illustrated by the following examples in conjunction with the accompanying drawings:
in an embodiment of the present invention, as shown in fig. 1, there is provided a method for plating a multilayer wiring board, the method comprising the steps of:
step S1, primary pickling: placing the circuit board in a sulfuric acid solution with the concentration of 6 percent for acid leaching; the 6% sulfuric acid used for acid leaching is CP grade sulfuric acid;
step S2, full-plate copper electroplating: placing the circuit board in a full-board copper electroplating bath solution for full-board copper electroplating; the main components of the whole-plate electrolytic copper plating bath solution comprise copper sulfate and sulfuric acid with the content of 180 g/L-240 g/L; the copper sulfate content is 75 g/L; trace chloride ions and copper optical agents are added into the whole-plate copper electroplating tank liquid; the addition amount of the copper polish is generally 3 ml/L-5 ml/L;
step S3, acid degreasing and three-stage countercurrent washing: placing the circuit board which is electroplated with copper on the whole board in an oil removal solution containing an acidic oil removal agent for acidic oil removal; after the acid degreasing is finished, performing three-stage countercurrent washing on the circuit board; the concentration of the acidic degreasing agent in the degreasing solution is maintained at about 10%; the acid oil removal time is 6 min;
step S4, microetching and three-stage countercurrent washing: placing the circuit board subjected to acid oil removal in a microetching agent for microetching; after the micro-etching is finished, carrying out three-stage countercurrent washing on the circuit board; the micro-etching agent is sodium persulfate solution, and the concentration of the sodium persulfate solution is controlled to be about 60 g/L; the microetching time is 20 s;
step S5, secondary pickling: pickling the raw materials at the same time;
step S6, electrotinning: placing the circuit board subjected to secondary pickling in an electrolytic tinning bath solution for electrolytic tinning; the electrolytic tinning bath solution mainly comprises stannous sulfate, sulfuric acid with the concentration of 10% and a tinning additive; the content of the stannous sulfate is controlled to be about 35 g/L;
step S7, pattern copper electroplating and three-stage countercurrent washing: placing the circuit board subjected to electrotinning in a pattern copper electroplating bath solution for pattern copper electroplating; after the pattern copper electroplating is finished, carrying out three-stage countercurrent washing on the circuit board; the main components of the pattern copper electroplating bath solution are the same as those of the full-board copper electroplating bath solution;
step S8, nickel plating and three-stage countercurrent washing: placing the circuit board subjected to pattern copper electroplating in a nickel cylinder for nickel electroplating; after nickel plating is finished, carrying out three-stage countercurrent washing on the circuit board; the nickel plating additive in the nickel cylinder is supplemented according to the method of kilo ampere hours or according to the actual plate production effect, the adding amount is 200 ml/KAH; the temperature of the nickel cylinder is maintained between 40 ℃ and 55 ℃;
step S9, gold electroplating and recycling water washing: placing the circuit board plated with nickel in a gold cylinder for gold electroplating; after the gold electroplating is finished, carrying out the recovery washing, wherein the recovery washing is pure washing; the water gold content in the gold cylinder is controlled to be about 1g/L, the PH value is about 4.5, the temperature is 35 ℃, and the current density is about 1 ASD;
step S10, three-stage countercurrent washing and electroplating post-treatment: carrying out three-stage countercurrent washing on the circuit board after the electrogilding is finished; and after the third-stage countercurrent washing is finished, carrying out electroplating post-treatment on the circuit board.
In this embodiment, the time for the primary pickling and the secondary pickling is not too long, and the pickling time is 15 min; after a period of use, the acid liquor should be replaced in time when turbidity appears or the copper content is too high.
In this embodiment, the replenishment of the copper polish in the steps S2 and S7 should be performed in time according to the kilo ampere hour, and the replenishment is performed according to 100 to 150 KAH; the chloride ions are supplemented by a measuring cup or a measuring cylinder which is added after the accurate weighing.
In the present embodiment, the temperature of the copper cylinder for containing the full-board copper electroplating bath in the step S2 and the temperature of the copper cylinder for containing the pattern copper electroplating bath in the step S7 should be maintained at room temperature, generally not exceeding 32 ℃; and the copper cylinder is additionally provided with a cooling temperature control system.
In this embodiment, the temperature of the tin cylinder for containing the electrolytic tin plating bath in the step S6 should be maintained at room temperature, and generally not more than 30 ℃; and the tin cylinder is additionally provided with a cooling temperature control system.
In this embodiment, the nickel cylinder in step S7 should be equipped with a heating temperature control system.
In this embodiment, the post-plating treatment in step S10 specifically includes pickling, drying, stripping a plating barrier layer, cleaning, stripping an exposed plating layer, and the like.
Specific embodiments of the present invention have been described above in detail. It is to be understood that the specific embodiments of the present invention are not exclusive and that modifications and variations may be made by one of ordinary skill in the art in light of the spirit of the present invention, within the scope of the appended claims. Therefore, technical solutions that can be obtained by a person skilled in the art through logic analysis, reasoning or limited experiments based on the prior art according to the embodiments of the present invention should be within the scope of protection defined by the claims.
Claims (7)
1. A method for electroplating a multilayer circuit board, comprising the steps of:
step S1, primary pickling: placing the circuit board in a sulfuric acid solution with the concentration of 6 percent for acid leaching; the 6% sulfuric acid used for acid leaching is CP grade sulfuric acid;
step S2, full-plate copper electroplating: placing the circuit board in a full-board copper electroplating bath solution for full-board copper electroplating; the main components of the whole-plate electrolytic copper plating bath solution comprise copper sulfate and sulfuric acid with the content of 180 g/L-240 g/L; the copper sulfate content is 75 g/L; trace chloride ions and copper optical agents are added into the whole-plate copper electroplating tank liquid; the addition amount of the copper polish is generally 3 ml/L-5 ml/L;
step S3, acid degreasing and three-stage countercurrent washing: placing the circuit board which is electroplated with copper on the whole board in an oil removal solution containing an acidic oil removal agent for acidic oil removal; after the acid degreasing is finished, performing three-stage countercurrent washing on the circuit board; the concentration of the acidic degreasing agent in the degreasing solution is maintained at about 10%; the acid oil removal time is 6 min;
step S4, microetching and three-stage countercurrent washing: placing the circuit board subjected to acid oil removal in a microetching agent for microetching; after the micro-etching is finished, carrying out three-stage countercurrent washing on the circuit board; the micro-etching agent is sodium persulfate solution, and the concentration of the sodium persulfate solution is controlled to be about 60 g/L; the microetching time is 20 s;
step S5, secondary pickling: pickling the raw materials at the same time;
step S6, electrotinning: placing the circuit board subjected to secondary pickling in an electrolytic tinning bath solution for electrolytic tinning; the electrolytic tinning bath solution mainly comprises stannous sulfate, sulfuric acid with the concentration of 10% and a tinning additive; the content of the stannous sulfate is controlled to be about 35 g/L;
step S7, pattern copper electroplating and three-stage countercurrent washing: placing the circuit board subjected to electrotinning in a pattern copper electroplating bath solution for pattern copper electroplating; after the pattern copper electroplating is finished, carrying out three-stage countercurrent washing on the circuit board; the main components of the pattern copper electroplating bath solution are the same as those of the full-board copper electroplating bath solution;
step S8, nickel plating and three-stage countercurrent washing: placing the circuit board subjected to pattern copper electroplating in a nickel cylinder for nickel electroplating; after nickel plating is finished, carrying out three-stage countercurrent washing on the circuit board; the nickel plating additive in the nickel cylinder is supplemented according to the method of kilo ampere hours or according to the actual plate production effect, the adding amount is 200 ml/KAH; the temperature of the nickel cylinder is maintained between 40 ℃ and 55 ℃;
step S9, gold electroplating and recycling water washing: placing the circuit board plated with nickel in a gold cylinder for gold electroplating; after the gold electroplating is finished, carrying out the recovery washing, wherein the recovery washing is pure washing; the water gold content in the gold cylinder is controlled to be about 1g/L, the PH value is about 4.5, the temperature is 35 ℃, and the current density is about 1 ASD;
step S10, three-stage countercurrent washing and electroplating post-treatment: carrying out three-stage countercurrent washing on the circuit board after the electrogilding is finished; and after the third-stage countercurrent washing is finished, carrying out electroplating post-treatment on the circuit board.
2. A method of plating a multilayer wiring board according to claim 1, wherein: the time of the primary pickling and the secondary pickling is not too long, and the pickling time is 15 min; after a period of use, the acid liquor should be replaced in time when turbidity appears or the copper content is too high.
3. A method of plating a multilayer wiring board according to claim 1, wherein: the replenishment of the copper polish in the step S2 and the step S7 is performed according to the kilo ampere hour, and the replenishment is performed according to the replenishment of 100 to 150 KAH; the chloride ions are supplemented by a measuring cup or a measuring cylinder which is added after the accurate weighing.
4. A method of plating a multilayer wiring board according to claim 1, wherein: the temperature of the copper cylinder for containing the full-board electrolytic copper plating bath solution in the step S2 and the temperature of the copper cylinder for containing the pattern electrolytic copper plating bath solution in the step S7 are both maintained at room temperature, and generally do not exceed 32 ℃; and the copper cylinder is additionally provided with a cooling temperature control system.
5. A method of plating a multilayer wiring board according to claim 1, wherein: the temperature of the tin cylinder for containing the electrolytic tin plating bath solution in the step S6 is maintained at room temperature, and the temperature is generally not more than 30 ℃; and the tin cylinder is additionally provided with a cooling temperature control system.
6. A method of plating a multilayer wiring board according to claim 1, wherein: the nickel cylinder in the step S7 should be additionally provided with a heating temperature control system.
7. A method of plating a multilayer wiring board according to claim 1, wherein: the post-plating treatment in step S10 specifically includes pickling, drying, stripping a plating resist layer, cleaning, and stripping an exposed plating layer.
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| CN113008888A (en) * | 2021-02-23 | 2021-06-22 | 苏州维信电子有限公司 | Pre-detection method for FPC (flexible printed circuit) electroplating pure tin reflow soldering |
| CN113502519A (en) * | 2021-06-16 | 2021-10-15 | 厦门大学 | Method for stabilizing copper-clad plate electroplated copper expansion and shrinkage |
| CN113502519B (en) * | 2021-06-16 | 2022-04-19 | 厦门大学 | Method for stabilizing copper-clad plate electroplated copper expansion and shrinkage |
| CN114134505A (en) * | 2021-12-02 | 2022-03-04 | 上海贝尼塔实业有限公司 | Alkaline microetching coarsening liquid and circuit board lead coarsening method |
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