CN110446359A - A kind of critical workflow design and technology controlling and process about the thick copper products in part - Google Patents
A kind of critical workflow design and technology controlling and process about the thick copper products in part Download PDFInfo
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- CN110446359A CN110446359A CN201910697091.1A CN201910697091A CN110446359A CN 110446359 A CN110446359 A CN 110446359A CN 201910697091 A CN201910697091 A CN 201910697091A CN 110446359 A CN110446359 A CN 110446359A
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- copper
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The present invention relates to PCB production technical fields, and disclose a kind of critical workflow design about the thick copper products in part, the following steps are included: 1) drill, 2) heavy copper, 3) electric plating of whole board, 4) ODF1,5) graphic plating, 6) striping, 7) ODF2,8) plating tin-lead, 9) SES.The critical workflow design and technology controlling and process about the thick copper products in part, by in ODF1, it opens a window for needing to thicken copper region, it is protected with dry film in region without thickening copper, convenient for the region for needing to thicken copper region is reserved, by in graphic plating, for copper region need to be thickeied, it is plated to the requirement specification of needs, convenient for carrying out thickening Copper treatment to needing to thicken copper region, by in ODF2, film laminator needs to select vacuum film pressing machine, PE need to be controlled at 40 μm, control development point, emphasis is that the development of high-copper transitional region must be clean, convenient for carrying out precision processing according to the copper thickness of product different zones.
Description
Technical field
The present invention relates to PCB production technical field, specially a kind of critical workflow design about the thick copper products in part and
Technology controlling and process.
Background technique
PCB, Chinese are printed circuit board, also known as printed wiring board, are important electronic component, are electronic components
Supporter, be electronic component electrical connection carrier, due to it using electron printing make, therefore be referred to as " print
Brush " circuit board, after electronic equipment uses printed board, due to the consistency of similar printed board, so as to avoid the difference of artificial wiring
Mistake, and can realize electronic component insert or mount automatically, automatic tin soldering and automatic detection, ensure that the quality of electronic equipment,
It improving labor productivity and reduces costs, and is easy to repair, printed board develops to two-sided, multilayer and flexibility from single layer, and
And respective development trend is still kept, due to constantly developing to high-precision, high density and high reliability direction, constantly contract
Small size reduces cost and improves performance, so that printed board still maintains powerful in the development engineering of future electronic equipment
Vitality, summary both at home and abroad to the following PCB Production manufacturing technology developments discussion it is substantially coincident, i.e., to height
Density, high-precision, fine pore, thin wire, thin space is highly reliable, multiple stratification, high-speed transfer, light weight, and slim direction is developed, In
Cost is reduced to productivity is improved simultaneously in production, reduces pollution, adapts to multi items and the development of small lot production mode reform, printing
The state-of-art of circuit, generally with the line width in printed board, aperture, plate thickness or aperture ratio are representative.
Currently, the application of PCB is universal, there is highly important status in electronic product, however in process of production, it is existing
There is the production procedure of product PCB that can only realize identical copper thickness standard, cannot achieve the copper thickness requirement of product different zones, it can not
The current requirements for meeting different zones do not adapt to the product of local high current, especially 5G product to high current requirement, so
It is proposed that a kind of critical workflow about the thick copper products in part designs and technology controlling and process solves the above problems.
Summary of the invention
(1) the technical issues of solving
In view of the deficiencies of the prior art, the present invention provides a kind of critical workflow designs and work about the thick copper products in part
Skill control has the advantages that copper thickness design for solving different zones, and the production procedure for solving existing product PCB can only realize phase
Same copper thickness standard cannot achieve the copper thickness requirement of product different zones, be unable to satisfy the current requirements of different zones, adapt to not
The problem of product of local high current, especially 5G product require high current.
(2) technical solution
For the copper thickness purpose of design for realizing above-mentioned solution different zones, the invention provides the following technical scheme:
Another technical problem to be solved by the present invention is that providing a kind of critical workflow design about the thick copper products in part, packet
Include following steps:
1) it drills, prepares a numerically controlled drill before holes drilled through, and position to it using pin, turn hole is spare；
2) sink copper, carry out expansion process consequently facilitating MnO4- ion immersion, make Long carbon chain crack and reach the mesh except glue
, it carries out except to generate hole wall epoxy resin surface coarse on microcosmic for glue processing, to improve connecing between hole wall and chemical copper
With joint efforts, and hole wall can be improved to the adsorbance of activating solution, is neutralized and MnO4- is restored, to eliminate its strong oxygen
The property changed, the negative electrical charge that oil removal treatment adjustment hole wall substrate surface adheres to by drilling, carrying out microetch processing makes copper face on microcosmic
Rough rough surface is shown as, the more activation palladium colloids of matrix copper absorption on the one hand can be made, another main function is
The binding force of base copper and chemical copper is improved, pre-preg is carried out, if the plate in production is directly entered work without pre-preg
Change cylinder, active cylinder can be because water accompanying by plate face makes the pH value of activating solution change, and water occurs for the effective ingredient of activating solution
Solution, influences activation effect, is activated and adsorbs one layer of metal with catalytic capability on the matrix of insulation, made through making a living
The matrix surface of change has the ability of catalysis reducing metal, carries out acceleration processing, and processing overlong time is avoided to cause Kong Wutong etc.
Problem carries out electroless copper plating processing, deposits one layer 0.3-0.5 μm of thin copper in matrix surface, produces the hole wall of insulation wall itself
Raw electric conductivity, it is spare；
3) electric plating of whole board carries out electric plating of whole board Copper treatment, protects just deposited very thin chemical copper, prevent chemical copper oxygen
By acidleach eating away after change, acid deoiling processing is carried out, removes the oxide on route copper face, glue more than ink residual film guarantees primary
Binding force between copper and pattern plating copper or nickel, carry out microetch processing, cleaning and roughening route copper face, it is ensured that pattern plating copper with
Binding force between copper carries out pickling processing, removes plate face oxide, activates plate face, carries out graphic plating Copper treatment, is
Meet the specified current loading of each route, need to reach certain thickness after each route and hole copper copper, the copper-plated purpose of route and
When hole copper and route copper are thickeied to certain thickness, carry out electrotinning processing, graphic plating pure tin purpose mainly uses pure tin
It is purely by way of metal resist layer, protection circuit etching carries out Nickel Plating Treatment, nickel coating is mainly as the resistance between layers of copper and layer gold
Interlayer prevents golden copper from diffusing into one another, and influences the solderability and service life of plank, while nickel layer bottoming also considerably increases gold again
Layer mechanical strength, carry out electroplating gold processing gold be used as a kind of noble metal, have good solderability, oxidative resistance, corrosion stability,
Contact resistance is small, and Wear Resistance is good etc. good characteristics, it is spare；
4) ODF1 opens a window for needing to thicken copper region, and the region without thickening copper is protected with dry film, when pad pasting, first
Polyethylene protective film is peeled from dry film, then drops dry film photoresist mucous membrane under an increased pressure on copper coated foil plate；
5) graphic plating, the process flow of graphic plating be upper plate, oil removing, washing, microetch, washing, acid invade, copper facing, water
It washes, acid is invaded, cross tin, washing, strip, washing and upper plate for that need to thicken copper region are plated to the requirement specification of needs；
6) striping moves back chemistry medicine company used in film processing procedure based on NaOH, and the concentration of medical fluid is in 1-3% or so (weight
Than), why poor liquid temperature has the dry film hardened using NaOH as moving back film medical fluid and be primarily due to it at 30-50 DEG C
Preferable solubility property, and it is cheap；
7) ODF2 does positive design for outer-layer circuit；
8) tin-lead is plated, does tin-lead protection for route, solder is that 60% tin and 40% lead-coat there should be dual mesh
, it had both been used as metal resist layer, and the solderability matrix of member and device is welded after being also used as；
9) route is made in SES, etching.
Another technical problem to be solved by the present invention is that providing a kind of technology controlling and process about the thick copper products in part, the number
Drilling machine is controlled, correct machined parameters are set before the use, lower drilling speed is prevented or time knife speed is too fast, presser feet is checked
Or prevent from shaking during turn hole, and check the fixing seat of lathe, prevent lathe from going out during the work time with changing
It now tilts, nozzle will be bored and replaced to required type, prevent from boring nozzle beyond hole limit, and check and bore whether nozzle has defect, then
It is put on numerically controlled drill after plank is cleaned out, sinks before copper, first roughly ground to the plank that aperture finishes, remove plate face oxygen
Change and the impurity such as greasy dirt, removes the sundries such as the resin dust in aperture burr and hole, before electric plating of whole board, plate that heavy copper is finished
Son carries out pickling processing, removes plate face oxide, activates plate face, and film laminator needs to select vacuum film pressing machine, and exposure machine needs to select
Full-automatic exposure machine or LED exposure machine are selected, PE need to be controlled at 40 μm, control development point, and emphasis is the aobvious of high-copper transitional region
Shadow must be clean.
(3) beneficial effect
Compared with prior art, the present invention provides a kind of critical workflow designs and technique control about the thick copper products in part
System, have it is following the utility model has the advantages that
The critical workflow design and technology controlling and process about the thick copper products in part, by ODF1, for needing to thicken copper
Region opens a window, and the region without thickening copper is protected with dry film, convenient convenient for reserving the region for needing to thicken copper region
Followed by copper region is thickeied, by for copper region need to be thickeied, being plated to the requirement specification of needs in graphic plating, convenient for pair
It needs to thicken copper region and carries out thickening Copper treatment, to realize the copper thickness requirement of product different zones, by ODF2, film laminator
It needs to select vacuum film pressing machine, exposure machine needs to select Full-automatic exposure machine or LED exposure machine, and PE need to be controlled at 40 μm, control
Develop well a little, emphasis is that the development of high-copper transitional region must be clean, convenient for carrying out precision according to the copper thickness of product different zones
Processing, avoids product and quality problems occurs, to achieve the purpose that the copper thickness design for understanding different zones of determining.
Specific embodiment
Below in conjunction with the embodiment of the present invention, technical solution in the embodiment of the present invention is clearly and completely retouched
It states, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.Based on the present invention
In embodiment, every other implementation obtained by those of ordinary skill in the art without making creative efforts
Example, shall fall within the protection scope of the present invention.
A kind of critical workflow design about the thick copper products in part, comprising the following steps:
1) it drills, prepares a numerically controlled drill before holes drilled through, and position to it using pin, turn hole is spare；
2) sink copper, carry out expansion process consequently facilitating MnO4- ion immersion, make Long carbon chain crack and reach the mesh except glue
, it carries out except to generate hole wall epoxy resin surface coarse on microcosmic for glue processing, to improve connecing between hole wall and chemical copper
With joint efforts, and hole wall can be improved to the adsorbance of activating solution, is neutralized and MnO4- is restored, to eliminate its strong oxygen
The property changed, the negative electrical charge that oil removal treatment adjustment hole wall substrate surface adheres to by drilling, carrying out microetch processing makes copper face on microcosmic
Rough rough surface is shown as, the more activation palladium colloids of matrix copper absorption on the one hand can be made, another main function is
The binding force of base copper and chemical copper is improved, pre-preg is carried out, if the plate in production is directly entered work without pre-preg
Change cylinder, active cylinder can be because water accompanying by plate face makes the pH value of activating solution change, and water occurs for the effective ingredient of activating solution
Solution, influences activation effect, is activated and adsorbs one layer of metal with catalytic capability on the matrix of insulation, made through making a living
The matrix surface of change has the ability of catalysis reducing metal, carries out acceleration processing, and processing overlong time is avoided to cause Kong Wutong etc.
Problem carries out electroless copper plating processing, deposits one layer 0.3-0.5 μm of thin copper in matrix surface, produces the hole wall of insulation wall itself
Raw electric conductivity, it is spare；
3) electric plating of whole board carries out electric plating of whole board Copper treatment, protects just deposited very thin chemical copper, prevent chemical copper oxygen
By acidleach eating away after change, acid deoiling processing is carried out, removes the oxide on route copper face, glue more than ink residual film guarantees primary
Binding force between copper and pattern plating copper or nickel, carry out microetch processing, cleaning and roughening route copper face, it is ensured that pattern plating copper with
Binding force between copper carries out pickling processing, removes plate face oxide, activates plate face, carries out graphic plating Copper treatment, is
Meet the specified current loading of each route, need to reach certain thickness after each route and hole copper copper, the copper-plated purpose of route and
When hole copper and route copper are thickeied to certain thickness, carry out electrotinning processing, graphic plating pure tin purpose mainly uses pure tin
It is purely by way of metal resist layer, protection circuit etching carries out Nickel Plating Treatment, nickel coating is mainly as the resistance between layers of copper and layer gold
Interlayer prevents golden copper from diffusing into one another, and influences the solderability and service life of plank, while nickel layer bottoming also considerably increases gold again
Layer mechanical strength, carry out electroplating gold processing gold be used as a kind of noble metal, have good solderability, oxidative resistance, corrosion stability,
Contact resistance is small, and Wear Resistance is good etc. good characteristics, it is spare；
4) ODF1 opens a window for needing to thicken copper region, and the region without thickening copper is protected with dry film, when pad pasting, first
Polyethylene protective film is peeled from dry film, then drops dry film photoresist mucous membrane under an increased pressure on copper coated foil plate；
5) graphic plating, the process flow of graphic plating be upper plate, oil removing, washing, microetch, washing, acid invade, copper facing, water
It washes, acid is invaded, cross tin, washing, strip, washing and upper plate for that need to thicken copper region are plated to the requirement specification of needs；
6) striping moves back chemistry medicine company used in film processing procedure based on NaOH, and the concentration of medical fluid is in 1-3% or so (weight
Than), why poor liquid temperature has the dry film hardened using NaOH as moving back film medical fluid and be primarily due to it at 30-50 DEG C
Preferable solubility property, and it is cheap；
7) ODF2 does positive design for outer-layer circuit；
8) tin-lead is plated, does tin-lead protection for route, solder is that 60% tin and 40% lead-coat there should be dual mesh
, it had both been used as metal resist layer, and the solderability matrix of member and device is welded after being also used as；
9) route is made in SES, etching.
Correct machined parameters are arranged in a kind of technology controlling and process about the thick copper products in part, numerically controlled drill before the use,
It prevents lower drilling speed or to return knife speed too fast, presser feet is checked or is carried out to prevent from shaking during turn hole with changing,
And check the fixing seat of lathe, it prevents lathe from tilting during the work time, nozzle will be bored and replaced to required type, prevented
It bores nozzle to limit beyond hole, and checks and bore whether nozzle has defect, be put on numerically controlled drill after then cleaning out plank, heavy copper
Before, it is first roughly ground to the plank that aperture finishes, removes the impurity such as plate face oxidation and greasy dirt, remove in aperture burr and hole
The sundries such as resin dust carry out pickling processing to the plank that heavy copper finishes, remove plate face oxide, activation before electric plating of whole board
Plate face, film laminator need to select vacuum film pressing machine, and exposure machine needs to select Full-automatic exposure machine or LED exposure machine, and PE needs to control
At 40 μm, development point is controlled, emphasis is that the development of high-copper transitional region must be clean.
The beneficial effects of the present invention are: should pass through about the critical workflow design and technology controlling and process of the thick copper products in part
It in ODF1, opens a window for needing to thicken copper region, the region without thickening copper is protected with dry film, convenient for that will need to thicken copper area
The region in domain, which reserves, to be come, convenient followed by copper region is thickeied, by for that need to thicken copper region, being plated in graphic plating
The requirement specification needed, convenient for carrying out thickening Copper treatment to needing to thicken copper region, to realize that the copper of product different zones is thick
It is required that film laminator needs to select vacuum film pressing machine, and exposure machine needs to select Full-automatic exposure machine or LED exposure by ODF2
Machine, PE need to be controlled at 40 μm, control development point, and emphasis is that the development of high-copper transitional region must be clean, convenient for according to product
The copper thickness of different zones carries out precision processing, avoids product and quality problems occurs, to reach the copper for understanding different zones of determining
The purpose of thickness design, the production procedure for solving existing product PCB can only realize identical copper thickness standard, cannot achieve product not
With the copper thickness requirement in region, the current requirements of different zones are unable to satisfy, the product of local high current, especially 5G are not adapted to
The problem of product requires high current.
It although an embodiment of the present invention has been shown and described, for the ordinary skill in the art, can be with
A variety of variations, modification, replacement can be carried out to these embodiments without departing from the principles and spirit of the present invention by understanding
And modification, the scope of the present invention is defined by the appended.
Claims (2)
1. a kind of critical workflow design about the thick copper products in part, which comprises the following steps:
1) it drills, prepares a numerically controlled drill before holes drilled through, and position to it using pin, turn hole is spare；
2) sink copper, carry out expansion process consequently facilitating MnO4- ion immersion, make Long carbon chain crack and achieve the purpose that except glue,
It carries out except to generate hole wall epoxy resin surface coarse on microcosmic for glue processing, to improve the engagement between hole wall and chemical copper
Power, and hole wall can be improved to the adsorbance of activating solution, is neutralized and restores to MnO4-, to eliminate its Strong oxdiative
Property, the negative electrical charge that oil removal treatment adjustment hole wall substrate surface adheres to by drilling, carrying out microetch processing makes copper face in microcosmic upper table
Now it is rough rough surface, on the one hand can makes the more activation palladium colloids of matrix copper absorption, another main function is to mention
The binding force of Gao Jitong and chemical copper carry out pre-preg, if the plate in production is directly entered activation without pre-preg
Cylinder, active cylinder can be because water accompanying by plate face make the pH value of activating solution change, and the effective ingredient of activating solution hydrolyzes,
Activation effect is influenced, is activated and adsorbs one layer of metal with catalytic capability on the matrix of insulation, made through overactivation
Matrix surface have catalysis reducing metal ability, carry out acceleration processing, avoid processing overlong time cause Kong Wutong etc. to ask
Topic carries out electroless copper plating processing, deposits one layer 0.3-0.5 μm of thin copper in matrix surface, generates the hole wall of insulation wall itself
Electric conductivity, it is spare；
3) electric plating of whole board carries out electric plating of whole board Copper treatment, protects just deposited very thin chemical copper, after preventing chemical copper from aoxidizing
By acidleach eating away, carry out acid deoiling processing, remove the oxide on route copper face, glue more than ink residual film, guarantee a copper with
Binding force between pattern plating copper or nickel carries out microetch processing, cleaning and roughening route copper face, it is ensured that pattern plating copper and primary
Binding force between copper carries out pickling processing, removes plate face oxide, activates plate face, carries out graphic plating Copper treatment, to meet
Need to reach certain thickness after the specified current loading of each route, each route and hole copper copper, the copper-plated purpose of route in time will
Hole copper and route copper are thickeied to certain thickness, carry out electrotinning processing, and graphic plating pure tin purpose mainly uses pure tin simple
As metal resist layer, protection circuit etching carries out Nickel Plating Treatment, nickel coating is mainly as the barrier between layers of copper and layer gold
Layer, prevents golden copper from diffusing into one another, influences the solderability and service life of plank, while nickel layer bottoming also considerably increases layer gold again
Mechanical strength, carry out electroplating gold processing gold and be used as a kind of noble metal, there is good solderability, oxidative resistance, corrosion stability connects
Electric shock resistance is small, and Wear Resistance is good etc. good characteristics, it is spare；
4) ODF1 opens a window for needing to thicken copper region, and the region without thickening copper is protected with dry film, when pad pasting, first from dry
Polyethylene protective film is peeled on film, then drops dry film photoresist mucous membrane under an increased pressure on copper coated foil plate；
5) graphic plating, the process flow of graphic plating be upper plate, oil removing, washing, microetch, washing, acid invade, copper facing, washing, acid
It invades, cross tin, washing, strip, washing and upper plate, for copper region need to be thickeied, be plated to the requirement specification of needs；
6) striping moves back chemistry medicine company used in film processing procedure based on NaOH, the concentration of medical fluid in 1-3% or so (weight ratio),
Why poor liquid temperature has preferably the dry film hardened using NaOH as moving back film medical fluid and be primarily due to it at 30-50 DEG C
Solubility property, and it is cheap；
7) ODF2 does positive design for outer-layer circuit；
8) tin-lead is plated, does tin-lead protection for route, solder is that 60% tin and 40% lead-coat should have dual purpose, it
Both it had been used as metal resist layer, the solderability matrix of member and device is welded after being also used as；
9) route is made in SES, etching.
2. a kind of technology controlling and process about the thick copper products in part according to claim 1, which is characterized in that the numerical control drilling
Correct machined parameters are arranged in machine before the use, prevent lower drilling speed or return knife speed it is too fast, to presser feet carry out check or into
Row prevents from shaking during turn hole, and check the fixing seat of lathe, prevents lathe from inclining during the work time with changing
Tiltedly, nozzle will be bored to replace to required type, and will prevent from boring nozzle beyond hole limit, and check and bore whether nozzle has defect, then by plate
Son is put on numerically controlled drill after cleaning out, sink copper before, first roughly ground to the plank that aperture finishes, remove plate face oxidation and
The impurity such as greasy dirt remove the sundries such as the resin dust in aperture burr and hole, before electric plating of whole board, plank that heavy copper is finished into
Row pickling processing, removes plate face oxide, activates plate face, and film laminator needs to select vacuum film pressing machine, and exposure machine needs to select complete
Automatic exposure machine or LED exposure machine, PE need to be controlled at 40 μm, control development point, and emphasis is that the development of high-copper transitional region must
It must be clean.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910697091.1A CN110446359A (en) | 2019-07-30 | 2019-07-30 | A kind of critical workflow design and technology controlling and process about the thick copper products in part |
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| CN201910697091.1A CN110446359A (en) | 2019-07-30 | 2019-07-30 | A kind of critical workflow design and technology controlling and process about the thick copper products in part |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111343796A (en) * | 2020-04-11 | 2020-06-26 | 福建省金普达电子科技有限公司 | Electroplating method of multilayer circuit board |
| CN113784528A (en) * | 2021-09-13 | 2021-12-10 | 万安裕维电子有限公司 | Local thick copper plating of PCB and preparation method thereof |
| CN113795080A (en) * | 2021-08-18 | 2021-12-14 | 景旺电子科技(珠海)有限公司 | Surface treatment method of printed circuit board and printed circuit board |
| CN114760768A (en) * | 2022-06-10 | 2022-07-15 | 四川英创力电子科技股份有限公司 | Inner-layer cathode-anode copper printed circuit board processing method and printed circuit board |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101286454A (en) * | 2007-04-10 | 2008-10-15 | 上海美维科技有限公司 | Printed circuit board and producing method of encapsulation base of integrated circuit |
| CN103167730A (en) * | 2011-12-14 | 2013-06-19 | 深南电路有限公司 | Thick-copper circuit board and manufacturing method thereof |
-
2019
- 2019-07-30 CN CN201910697091.1A patent/CN110446359A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101286454A (en) * | 2007-04-10 | 2008-10-15 | 上海美维科技有限公司 | Printed circuit board and producing method of encapsulation base of integrated circuit |
| CN103167730A (en) * | 2011-12-14 | 2013-06-19 | 深南电路有限公司 | Thick-copper circuit board and manufacturing method thereof |
Non-Patent Citations (2)
| Title |
|---|
| NIU7PAI: "沉铜讲义", 《道客巴巴》 * |
| TITI0404: "PCB电镀工艺流程", 《百度文库》 * |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111343796A (en) * | 2020-04-11 | 2020-06-26 | 福建省金普达电子科技有限公司 | Electroplating method of multilayer circuit board |
| CN113795080A (en) * | 2021-08-18 | 2021-12-14 | 景旺电子科技(珠海)有限公司 | Surface treatment method of printed circuit board and printed circuit board |
| CN113784528A (en) * | 2021-09-13 | 2021-12-10 | 万安裕维电子有限公司 | Local thick copper plating of PCB and preparation method thereof |
| CN114760768A (en) * | 2022-06-10 | 2022-07-15 | 四川英创力电子科技股份有限公司 | Inner-layer cathode-anode copper printed circuit board processing method and printed circuit board |
| CN114760768B (en) * | 2022-06-10 | 2022-08-30 | 四川英创力电子科技股份有限公司 | Inner-layer cathode-anode copper printed circuit board processing method and printed circuit board |
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Application publication date: 20191112 |