CN110933860A - Processing method for local electroplating of thick gold product - Google Patents
Processing method for local electroplating of thick gold product Download PDFInfo
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- CN110933860A CN110933860A CN201911116449.3A CN201911116449A CN110933860A CN 110933860 A CN110933860 A CN 110933860A CN 201911116449 A CN201911116449 A CN 201911116449A CN 110933860 A CN110933860 A CN 110933860A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/052—Magnetographic patterning
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/163—Monitoring a manufacturing process
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses a processing method of a local thick gold electroplating product, which combines the thick gold electroplating process of the prior art lead, increases the imaging process of a local gold-plating area after the microwave printed board is electroplated with gold for the first time, carries out secondary gold electroplating on the local area on the basis, and finally removes a surface coating and etches and removes the process lead. Compared with the prior art, the invention has the following positive effects: the invention provides a processing method of a high-frequency microwave printed board for local thick gold plating, which can be suitable for processing high-frequency microwave printed board products with inconsistent thickness of a gold plating layer in a graph.
Description
Technical Field
The invention relates to the technical field of manufacturing of high-frequency microwave printed boards, in particular to a local thick gold electroplating process.
Background
With the increasing development of the communication industry, the application of the high-frequency microwave printed board is gradually developed. And with the increasingly refined electronic products, the gold wire bonding process is used as a novel micro-assembly welding process and is also applied to high-frequency microwave printed boards more and more widely. Compared with the traditional process, the gold wire bonding process directly connects the gold wire with the gold layer on the surface of the printed board in a pressure welding mode instead of adopting soldering tin for welding. Therefore, it is required to plate a gold layer having a certain thickness on the surface of the high-frequency microwave printed board.
The traditional high-frequency microwave printed board thick gold electroplating method is mainly characterized in that a process conducting wire is used for conducting electricity, a gold layer with a certain thickness is electroplated on the surface of a graph in one step, all copper layer surfaces of the surface of the microwave printed board processed by the method are covered with the gold layer, and the thickness of the gold layer is consistent.
Gold is a precious metal, and the gold plating process is more costly than other electroplating processes. In practical application of the high-frequency microwave printed board, the gold layer thickness in other areas is relatively low except for the gold layer bonding area which needs a high gold layer thickness for bonding and welding. Based on the consideration of cost, more and more users put forward the requirement of local thick gold plating, that is, only thick gold plating needs to be performed on the bonding pad, and the rest is thin gold plating, so that the local thick gold plating process of the high-frequency microwave board is carried out.
In order to meet different user requirements, a local thick gold electroplating process needs to be developed on the basis of the traditional high-frequency microwave printed board processing process.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention provides a processing method for locally electroplating a thick gold product.
The technical scheme adopted by the invention is as follows: a processing method for local electroplating of thick gold products comprises the following steps:
engineering document processing:
carrying out graph optimization processing on the original file of the high-frequency microwave printed board, adding a process wire, and simultaneously splicing the board according to the size of a product to generate a circuit graph photo-drawing file; selecting a newly added process wire in the graph from the circuit graph photo-drawing file to manufacture a process wire removal file; selecting a local gold-plating area to prepare a local gold-plating imaging file;
(II) protecting a process wire:
step one, solder resist printing:
grinding and cleaning the printed board with the process lead, the pattern of which is etched, through a horizontal line, and removing a surface oxidation layer; then, printing a layer of photosensitive solder resist ink on one side of the pattern needing to remove the process lead in a silk screen missing printing mode, and baking the surface solder resist ink by using an oven;
secondly, imaging a process wire:
firstly, the printed board after printing and solder resist is sent to an LDI exposure machine for exposure, and then the exposed printed board passes through 1% NaCO3Cleaning in the solution, removing the solder resist ink on the unexposed part of the surface, exposing the gold-plated area pattern, and finally sending the printed board into a drying oven at 145-150 ℃ for baking for 40-60 min;
(III) gold electroplating in the first step:
removing a surface oxide layer and pollutants from the printed board to be plated with gold by using an acidic degreasing and microetching solution, and simultaneously roughening a copper surface to improve the binding force between a plating layer and base copper; then, setting electroplating parameters according to the pattern area and the thickness of the gold-plating layer for carrying out primary gold electroplating;
(IV) local gold plating imaging:
attaching a layer of photosensitive dry film on the surface of the pattern after the first-step gold plating is finished, and performing alignment exposure treatment by using LDI (laser direct immersion) to expose the pattern needing the secondary gold plating;
and (V) second step gold electroplating:
firstly, cleaning the surface of a printed board to be locally plated with gold by acid washing, and then plating the printed board with other products with the same gold plating thickness;
(VI) detecting the thickness/hardness of the gold layer:
after the second step of gold plating is finished, firstly, testing the thickness of the gold layer on the surface of the local gold-plating pattern by using an X-ray fluorescence thickness gauge to ensure that the thickness of the gold layer meets the requirement; then testing the hardness of the gold plating layer by using a digital display microhardness tester to ensure that the hardness of the gold plating layer is controlled below 80Hv so as to meet the gold wire bonding requirement;
and (seventhly) solder resist removing:
soaking the printed board which is plated with gold in NaOH solution, and slightly swinging, wherein the soaking time is controlled to be 40-150 s; after soaking, washing the board surface by using warm water, wiping and removing the residual solder resist ink on the surface of the technical lead, and exposing the copper layer below the lead;
(eighth) etching:
and after the solder resist is removed completely, the process lead with the exposed copper layer is removed by etching with alkaline etching solution, and finally, the redundant process lead on the board surface is completely removed at one time by etching to obtain a local gold-plated product after the process line is removed.
Compared with the prior art, the invention has the following positive effects:
the invention provides a processing method of a local thick gold electroplating high-frequency microwave printed board, which can be suitable for processing high-frequency microwave printed board products with inconsistent thickness of a gold electroplating layer in a graph. The process method mainly limits the electroplating area by a special means, and carries out secondary gold plating by combining a lead electroplating mode, thereby realizing the purpose of thickening a local gold plating layer.
Drawings
The invention will now be described, by way of example, with reference to the accompanying drawings, in which:
FIG. 1 is a circuit pattern photo-drawing document;
FIG. 2 is a process wire removal file;
FIG. 3 is a partially gold plated imaging document;
FIG. 4 is a schematic view of the product obtained after the first gold plating step;
FIG. 5 is a schematic view of a partially gold plated product after the process line is removed.
Detailed Description
A process method for processing a local thick gold electroplating microwave printed board comprises the following steps:
first, process flow design
Combining the thick gold electroplating process of the prior art wire, increasing the imaging process of a local gold-plating area after the microwave printed board is electroplated with gold for the first time, carrying out secondary gold electroplating on the local area on the basis, finally removing the surface coating, and etching to remove the process wire, wherein the specific process comprises the following steps:
engineering document processing → blanking → … … normal multi-layer board or double-side board flow … … → imaging → electroplating → tin removal by etching → gold surface inspection → solder mask printing → process wire imaging → first step gold electroplating → local gold-plating imaging → second step gold electroplating → gold layer thickness test/hardness test → solder mask removal → etching process wire → gold surface inspection → normal flow
The main process flow of the present invention is described in detail below:
engineering document processing
Compared with the traditional thick gold plating high-frequency microwave printed board, when the engineering file processing of the local thick gold plating high-frequency microwave printed board is carried out, except that negative films such as an outer layer circuit pattern negative film (containing a process lead), a process lead removing negative film and the like are manufactured according to the conventional high-frequency microwave printed board, related files for limiting a local thick gold plating area are manufactured according to local thick gold plating area patterns in the board.
The engineering personnel carry out figure optimization processing on the high-frequency microwave printed board original file provided by the user, add process wires, and simultaneously carry out plate splicing according to the product size to generate a circuit figure optical drawing file (as shown in figure 1). On the basis, selecting a newly added process wire in the graph to manufacture a process wire removal file (as shown in FIG. 2); the local gold-plated area is selected to form a local gold-plated imaging document (as shown in fig. 3). In the process of file processing, special attention needs to be paid to that a process lead removal file and a local gold-plating imaging file are positioned by adding process holes or disks at corresponding positions according to a circuit pattern file, and the requirements of the total area of the local gold-plating imaging file pattern and the thickness of a gold layer need to be remarked on a process card.
(II) Process wire protection
The process wire protection comprises the following two steps:
the first step is as follows: solder mask
And (4) grinding and cleaning the printed board (with the process lead) with the etched pattern through a horizontal line to remove the surface oxide layer. Then, printing a layer of photosensitive solder resist ink (PSR-4000G 23KHP, the ratio of the main agent to the curing agent is 7:3) on one side of the pattern of the process wire to be removed in a screen printing missing mode, and baking the surface solder resist ink by using an oven (the baking temperature is 75-80 ℃, and the baking time is 20-35 min).
The second step is that: process wire imaging
And (4) conveying the printed board subjected to printing, pasting and solder mask to an LDI exposure machine for exposure. During exposure, selecting positioning holes in the plate and positioning patterns at corresponding positions in the file to carry out CCD alignment, and setting exposure energy to be 150mj/cm2～300mj/cm2。
The exposed printed board was passed through 1% NaCO3And cleaning in the solution to remove the solder resist ink on the unexposed part of the surface, exposing the gold-plated area pattern, and covering and protecting the process lead part by the solder resist ink. And then the printed board is sent into an oven with the temperature of 145-150 ℃ and baked for 40-60 min.
(III) first step gold electroplating
Removing the surface oxide layer and pollutants of the printed board to be plated with gold by using an acidic degreasing and microetching solution, and simultaneously roughening the copper surface to improve the binding force between the plating layer and the base copper. And (3) setting the electroplating parameters of the gold plating current according to the area of the graph: current-current density (0.1A/dm)2-0.3A/dm2) Graph area, and gold plating time were adjusted according to the thickness of the gold plating layer. The product obtained after the first gold plating step is shown in fig. 4.
(IV) local gold plating imaging
In order to limit the gold plating area in the second gold plating step, after the first gold plating step is finished, a layer of photosensitive dry film is directly attached to the surface of the pattern, and the pattern to be subjected to secondary gold plating is exposed by using LDI (laser direct immersion) exposure treatment.
(V) second step gold electroplating
And cleaning the surface of the printed board to be locally plated with gold by acid washing. Because the area of the pattern to be electroplated of the local gold-plated printed board is small, the total gold-plating area of each large piece is often less than 0.1dm2Not satisfying gold wire platingAnd setting requirements for small current. Therefore, the gold plating current cannot be accounted for in the conventional manner by the plating area and current density formula. In order to ensure that the products can be processed normally, the plating is accompanied with other products with the same plating thickness during local gold plating, and the gold plating current is calculated according to the area of the accompanied plating products.
(VI) gold layer thickness/hardness detection
And after the second step of gold plating is finished, testing the thickness of the gold layer on the surface of the local gold-plating pattern by using an X-ray fluorescence thickness gauge to ensure that the thickness of the gold layer meets the design requirements of a user.
Aiming at a local gold plating product, after the thickness of the product is tested, a digital display microhardness tester is used for testing the hardness of the gold plating layer, and the hardness of the gold plating layer is controlled below 80Hv so as to meet the requirement of gold wire bonding.
(VII) solder resist removal
Preparing concentrated NaOH solution of 70g/L-100g/L, and heating to 90-100 ℃. And soaking the printed board which is plated with gold in NaOH solution, and slightly swinging, wherein the soaking time is controlled to be 40-150 s. And after soaking, washing the board surface by using warm water, wiping and removing the solder resist ink remained on the surface of the process lead, and exposing the copper layer below the lead.
(eighth) etching
And after the solder resist is removed completely, the process lead with the exposed copper layer is etched and removed by adopting alkaline etching solution, and finally, the redundant process lead on the board surface is completely removed at one time by adopting an etching mode. The partially gold plated product after the process line is removed is shown in fig. 5.
Second, the working principle of the invention
2.1 Process wire removal mode determination
The lead material to be removed on the surface of the printed board is actually a copper layer, and a gold plating layer is covered on the surface of the copper layer of the lead after the thick gold plating. Considering that the material of the wire part needing to be removed is metal copper and gold, the chemical corrosion method is adopted to remove the interface more smoothly than the mechanical method, and the base material part is not damaged. The copper layer is directly corroded by the alkaline etching solution in the printed board etching process (the alkaline etching solution only corrodes the copper layer and does not corrode the gold layer), but the gold layer is more difficult to corrode due to the fact that the gold layer is relatively stable. Therefore, it is relatively more difficult to remove the gold and copper plating on the surface of the conductive wire by etching directly.
Because the gold plating layer is electroplated on the surface of the circuit pattern after the pattern is manufactured, only the gold layer on the surface of the effective pattern can be electroplated in the process, the process lead is protected by adopting the protective coating, the gold plating is avoided, the protective coating is removed after the gold plating, the process lead is removed by etching, and the lead can be removed.
The protective coating is adopted to protect the process lead before gold electroplating, so that gold layers are prevented from being electroplated on the surface of the lead, and copper layers on the process can be removed more easily through subsequent etching. Therefore, the process wire removing method is determined by protecting the process wire with a coating and removing the process wire with etching after gold plating.
2.2 Process wire protective coating selection
The protective coating for the process conductor is selected taking into account the ability of the coating itself to transfer patterns, resist plating, and to be compatible with existing production equipment. In the process of processing the printed board, the used protective coating mainly comprises three materials such as a photosensitive dry film, a wet film, solder resist ink and the like. Because the three materials are all photosensitive materials, the pattern transfer can be carried out in a film negative exposure mode, the pattern transfer capability is good, and the local pattern for covering the process lead can be manufactured on the surface of the printed board. Tests show that the photosensitive dry film has a good adhesion effect on a smooth surface due to the fact that the photosensitive dry film is attached to the surface of the printed board in a hot pressing mode, and for the printed board after pattern etching, due to the fact that the surface is uneven, the dry film is poor in attachment effect, the dry film is poor in plating resistance, the phenomenon of diffusion plating possibly occurs at the junction of the dry film and the pattern after gold plating, and process wires cannot be removed through etching. The wet film is in a liquid state similar to solder resist ink, can be printed on a board surface in a screen printing missing mode, can be well attached to the surface when a surface pattern has certain unevenness, but has poor gold plating resistance compared with the solder resist ink, and is easy to generate a plating penetration phenomenon for products with large gold plating thickness.
Therefore, solder resist ink is finally selected as the protective coating of the process lead, and the solder resist ink adopted in the solder resist manufacturing process are the same type of ink and can be matched with the solder resist printing process.
2.3 Process wire protective coating Forming
After the pattern is electroplated, after the pattern on the surface of the printed board and the process lead connected with the pattern are manufactured, a protective layer is selectively coated on the surface of the process lead to prevent the surface of the process lead from being electroplated with a gold layer in the gold plating process. In the process, a silk screen printing method is mainly adopted to print a solder mask on the surface of the graph, the LDI or a film negative film is utilized to remove the graph by using a special process lead for exposure treatment, and only the solder mask on the surface of the lead is reserved after development.
When the film negative is used for carrying out alignment of a process lead removing pattern, the alignment accuracy is relatively low because the alignment mode is carried out manually, when the film negative exposure mode is adopted for manufacturing a process lead surface coating, a lead part on the film negative and a formal board pattern need to be compensated to a certain extent, otherwise, the process lead protective coating extends into the pattern, so that a notch is formed on the board pattern. And (4) verifying that a compensation value of 0-0.0254 mm is reserved at the junction of the conducting wire pattern on the film negative film and the pattern in the board.
In order to further improve the alignment precision, the invention uses LDI automatic imaging equipment to verify the solder mask exposure capability. Through experiments, when the solder resist is exposed by using the LDI equipment, although the glossiness of the solder resist is reduced, the requirement of gold plating can be met.
2.4 quality control of gold plating layer
In order to ensure that the local gold-plated printed board meets the gold wire bonding requirement of a user, the following points are controlled in the gold-plating process: firstly, controlling the thickness of a gold layer, wherein the thickness of the gold layer at a local gold-plating part is not less than 0.8um (the local gold-plating part is executed according to the requirements of a user when the user has the requirements); secondly, controlling the hardness of the gold plating layer, verifying the influence relation of the hardness of the gold plating layer on gold wire bonding through tests, and providing a control requirement that the hardness of the gold layer should be controlled below 80 Hv; thirdly, for the local gold-plating printed board, the gold surface is strictly treated in a physical polishing and brushing mode so as to ensure that the surface of the gold layer has certain roughness.
Claims (8)
1. A processing method for local electroplating of thick gold products is characterized by comprising the following steps: the method comprises the following steps:
engineering document processing:
carrying out graph optimization processing on the original file of the high-frequency microwave printed board, adding a process wire, and simultaneously splicing the board according to the size of a product to generate a circuit graph photo-drawing file; selecting a newly added process wire in the graph from the circuit graph photo-drawing file to manufacture a process wire removal file; selecting a local gold-plating area to prepare a local gold-plating imaging file;
(II) protecting a process wire:
step one, solder resist printing:
grinding and cleaning the printed board with the process lead, the pattern of which is etched, through a horizontal line, and removing a surface oxidation layer; then, printing a layer of photosensitive solder resist ink on one side of the pattern needing to remove the process lead in a silk screen missing printing mode, and baking the surface solder resist ink by using an oven;
secondly, imaging a process wire:
firstly, the printed board after printing and solder resist is sent to an LDI exposure machine for exposure, and then the exposed printed board passes through 1% NaCO3Cleaning in the solution, removing the solder resist ink on the unexposed part of the surface, exposing the gold-plated area pattern, and finally sending the printed board into a drying oven at 145-150 ℃ for baking for 40-60 min;
(III) gold electroplating in the first step:
removing a surface oxide layer and pollutants from the printed board to be plated with gold by using an acidic degreasing and microetching solution, and simultaneously roughening a copper surface to improve the binding force between a plating layer and base copper; then, setting electroplating parameters according to the pattern area and the thickness of the gold-plating layer for carrying out primary gold electroplating;
(IV) local gold plating imaging:
attaching a layer of photosensitive dry film on the surface of the pattern after the first-step gold plating is finished, and performing alignment exposure treatment by using LDI (laser direct immersion) to expose the pattern needing the secondary gold plating;
and (V) second step gold electroplating:
firstly, cleaning the surface of a printed board to be locally plated with gold by acid washing, and then plating the printed board with other products with the same gold plating thickness;
(VI) detecting the thickness/hardness of the gold layer:
after the second step of gold plating is finished, firstly, testing the thickness of the gold layer on the surface of the local gold-plating pattern by using an X-ray fluorescence thickness gauge to ensure that the thickness of the gold layer meets the requirement; then testing the hardness of the gold plating layer by using a digital display microhardness tester to ensure that the hardness of the gold plating layer is controlled below 80Hv so as to meet the gold wire bonding requirement;
and (seventhly) solder resist removing:
soaking the printed board which is plated with gold in NaOH solution, and slightly swinging, wherein the soaking time is controlled to be 40-150 s; after soaking, washing the board surface by using warm water, wiping and removing the residual solder resist ink on the surface of the technical lead, and exposing the copper layer below the lead;
(eighth) etching:
and after the solder resist is removed completely, the process lead with the exposed copper layer is removed by etching with alkaline etching solution, and finally, the redundant process lead on the board surface is completely removed at one time by etching to obtain a local gold-plated product after the process line is removed.
2. The method for processing a local electroplated thick gold product as claimed in claim 1, wherein: the process lead removing file and the local gold-plating imaging file are provided with process holes or disks for positioning, and the total graphic area and gold layer thickness requirements of the local gold-plating imaging file are noted on the process card.
3. The method for processing a local electroplated thick gold product as claimed in claim 1, wherein: the photosensitive solder resist ink is PSR-4000G23KHP, and the ratio of the main agent to the curing agent is 7: 3.
4. The method for processing a local electroplated thick gold product as claimed in claim 1, wherein: and baking the surface solder resist ink by using an oven at the temperature of 75-80 ℃ for 20-35 min when solder resist is printed and pasted.
5. The method for processing a local electroplated thick gold product as claimed in claim 1, wherein: when the printed board after printing and solder resist is exposed during process wire imaging, the positioning holes in the board and the positioning patterns at the corresponding positions in the file are selected for CCD alignment, and the exposure energy is set to be 150mj/cm2～300mj/cm2。
6. The method for processing a local electroplated thick gold product as claimed in claim 1, wherein: the gold plating current in the first step of gold plating is calculated according to the following formula: the gold plating current is the current density pattern area, wherein the current density is 0.1A/dm2-0.3A/dm2。
7. The method for processing a local electroplated thick gold product as claimed in claim 1, wherein: and in the second step of gold electroplating, the gold plating current is calculated according to the area of the plating accompanying product.
8. The method for processing a local electroplated thick gold product as claimed in claim 1, wherein: the NaOH solution is 70g/L-100g/L NaOH solution heated to 90-100 ℃.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111885844A (en) * | 2020-08-20 | 2020-11-03 | 深圳市明正宏电子有限公司 | Gold plating process for PCB secondary circuit |
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| CN104470233A (en) * | 2014-11-21 | 2015-03-25 | 广州杰赛科技股份有限公司 | Printed wiring board containing gold at different thicknesses and manufacturing method thereof |
| CN109688719A (en) * | 2019-01-29 | 2019-04-26 | 深圳市迅捷兴科技股份有限公司 | The production method that thick golden plate is plated in part |
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2019
- 2019-11-15 CN CN201911116449.3A patent/CN110933860A/en active Pending
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102821553A (en) * | 2012-08-06 | 2012-12-12 | 深圳崇达多层线路板有限公司 | Method for manufacturing key position partial electro-gold-plated PCB (printed circuit board) |
| CN103298267A (en) * | 2013-03-05 | 2013-09-11 | 深圳市迅捷兴电路技术有限公司 | Manufacturing method for circuit board with surface to be partially processed in thick plate electroplating mode |
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| CN109688719A (en) * | 2019-01-29 | 2019-04-26 | 深圳市迅捷兴科技股份有限公司 | The production method that thick golden plate is plated in part |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111885844A (en) * | 2020-08-20 | 2020-11-03 | 深圳市明正宏电子有限公司 | Gold plating process for PCB secondary circuit |
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